Claims (1)
1336033 十、申請專利範@ 1、一種記憶體模組，包括： 複數§己憶體，每一記憶體各具有至少一個熱源；及 一散熱裝置，係包括一散熱片、複數導熱部及至少一 風扇，該散熱片包括一座片及一侧片，該座片係位在該些 纪憶體上方，該側片係自該座片的一侧邊垂直地延伸，且 面向該些記憶體，每一導熱部具有一基片及分別延伸自該 基片的，相對側邊的兩連接片，該基片係貼靠於該座片的 頂面，每一連接片係貫穿該散熱片的座片且接觸相對應的 記憶體的熱源，該風扇係設於該散熱片的側片上，且^以 降低該些記憶體的溫度。 Λ 2、如申請專利範圍第1項所述之記憶體模組，其中該 散熱片的側片係具有至少一散熱孔，該風扇產生之氣流‘ 經S亥散熱孔吹向該些記憶體。1336033 X. Patent application model: 1. A memory module comprising: a plurality of § memories, each memory having at least one heat source; and a heat sink comprising a heat sink, a plurality of heat conducting portions and at least one a fan, the heat sink comprises a piece and a side piece, the piece piece is fastened above the memory piece, the side piece extends perpendicularly from one side of the piece piece, and faces the memory body, each A heat conducting portion has a substrate and two connecting pieces extending from opposite sides of the substrate, the substrate is abutted against a top surface of the seat piece, and each connecting piece is passed through the seat piece of the heat sink And contacting the corresponding heat source of the memory, the fan is disposed on the side panels of the heat sink, and to reduce the temperature of the memory. The memory module of claim 1, wherein the side panel of the heat sink has at least one heat dissipation hole, and the air flow generated by the fan is blown toward the memory through the S Hai heat dissipation hole.
、〃 3、如申請專利範圍第i項所述之記憶體模組，更包 有硬數個固定螺絲，該散熱片更具有複數個固定孔，該 扇具有複數穿孔’該些JU定螺絲可分別穿過該風扇的 而螺鎖於該固定孔。 4、如申請專利範圍第1項所述之記憶體模組， 2數_定螺絲’該散熱片更具有複數個固定柱，每 二柱具# m疋孔’該風扇具有複數穿孔可供容納爲 二：該些固定螺絲係分別穿過該風扇的穿孔而螺鎖於 5、一種散熱裝置，包括： 12 UJ0U33 :熱片，包括一座月及一側片，該側^ 的一側邊垂直地延伸； 座片 每4ί:;Γ=”熱片與複數記憶體的熱源， 2 υ具有一基片及分別延伸自該基片的 的兩連接片，該基片係貼靠於該座片的頂面 = 係貫穿該散熱片的座片且接觸相對應的記憶體的熱; 至少一風扇，係設於該散熱片的側片上 該些記憶體的溫度。 且用以降低 1 6、如申請專利範圍第5項所述之散熱裝置，复中兮今 ;、：：：：係具有至少一散熱孔’該風扇產生之氣流可： 該政熱孔吹向該些記憶體。 、， 7、 如申請專利範圍第5項所述之散熱裝置 稷數個固定螺絲’該散埶月 更已括有 具有複數穿孔，該4定=t: ;個固定孔’該風扇 螺鎖於該固定孔。絲可分別穿過該風扇的穿孔而 8、 如—申請專利範圍第5項所述之散熱裝置，更包括有 =固固定螺絲’該散熱片更具有複數個固定柱，每一固 定孔，該風扇具有複數穿孔可供容納該固定 螺絲可分別穿過該風扇的穿孔而螺鎖於該固 疋孑匕0 9、 一種記憶體模組，包括： 複數記憶體’每一記憶體各具有至少一個熱源；及 -散熱裝置，係包括_散熱片、複數導熱部及至少一 羽’該散熱片包括複數個插槽及一座片，該些插槽係貫 13 1336033 ,ί月/¾修(¾正替換頁i 穿該座片的頂、底兩面’該座片的底面係些記憶體，、 每-導熱部具有—基片及分別延伸自該基片的兩相對側邊 的兩連接片’該基片係貼靠於該座片的頂面，每一連接片 係穿過該散熱片的其中一插槽且接觸相對應的記憶體的熱 源，該風扇係設於該散熱片上，且用以降低該些記憶體的 溫度。 10如申明專利範圍第9項所述之記憶體模組，其中〃 3. The memory module described in claim i of the patent scope further includes a plurality of fixing screws, the heat sink further has a plurality of fixing holes, and the fan has a plurality of perforations. The fan is screwed through the fixing hole. 4. The memory module according to claim 1, wherein the heat sink has a plurality of fixed columns, and each of the two columns has a #m疋 hole. The fan has a plurality of perforations for receiving For two: the fixing screws are respectively threaded through the perforation of the fan and are screwed to 5. A heat dissipating device comprises: 12 UJ0U33: a hot piece, including one month and one side piece, one side of the side ^ is vertically Extending; a heat source for each of the 4 :: Γ = "hot sheets and a plurality of memories, 2 υ having a substrate and two connecting sheets extending from the substrate, the substrate being attached to the seat sheet The top surface is a heat that passes through the seat piece of the heat sink and contacts the corresponding memory; at least one fan is disposed on the side piece of the heat sink, and is used to reduce the temperature of the memory. The heat dissipating device described in the fifth item of the patent scope, Fuzhong Zhongjin;, :::: has at least one heat dissipation hole. The airflow generated by the fan may: the political heat hole is blown toward the memory. Such as the heat sink described in item 5 of the patent application, a plurality of fixing screws The divergent month has been included with a plurality of perforations, the 4 fixed = t: ; a fixed hole 'the fan is screwed to the fixing hole. The wire can pass through the perforation of the fan respectively, 8 as in the patent scope 5 The heat dissipating device further includes a fixing screw. The heat sink further has a plurality of fixing posts, each fixing hole, the fan has a plurality of perforations for receiving the fixing screws to pass through the perforations of the fan respectively. a memory module, comprising: a plurality of memories each having at least one heat source; and a heat sink comprising a heat sink, a plurality of heat conducting portions, and at least one The plume's heat sink includes a plurality of slots and a piece, the slots are 13 1336033, ί月/3⁄4 repair (3⁄4 positive replacement page i is worn on the top and bottom sides of the seat piece' The memory, each of the heat conducting portions has a substrate and two connecting pieces respectively extending from opposite sides of the substrate. The substrate is attached to the top surface of the seat, and each connecting piece is worn. Passing through one of the slots of the heat sink and contacting the corresponding one Recalling heat source body, the fan is disposed on the heat sink, and to reduce the temperature of the plurality of memory. The memory 10 of the second body 9 patentable scope affirmed module, wherein
該散熱片的座片具有複數個散熱孔，該風扇所產生的氣流 可經該些散熱孔吹向該些記憶體。 11、 如中請專利範圍第9項所述之記憶體模組，更包 括一散熱鰭片設於該散熱片的座片與該風扇之間。 12、 如申請專職圍第u項所叙記憶聽組，其中 該風扇係設於該散熱鰭片頂部。 匕如申請專利範㈣U項所述之記憶體模組，其中 該風扇係设於該散熱鰭片側邊。 =、如中請專利範圍第9項所述之記憶體模組，其^ 更具有-側片’該側片係自該座片的—側邊垂』 =伸，且面向該些記憶體，並具有至少—散熱孔，該届 ::设：該側片h使其所產生之氣流可經該散熱孔心 该些記憶體。 專利範圍第9項所述之記憶體模組，更包 個岐螺絲，該散熱片更具有複數個固定孔，該 3^複數穿孔，該些固定螺絲可分別穿過該風扇的穿 札而螺鎖於該固定孔。 月広日修(更)正替沒頁 1336033 螓 ] 16、如申請專利範圍第9項所述之記憶體模組，更包 • 括有複數個固定螺絲，該散熱片更具有複數個固定柱，每 一固定柱具有一固定孔，該風扇具有複數穿孔可供容納該 固定柱，該些固定螺絲係分別穿過該風扇的穿孔而螺鎖於 該固定孔。The seat piece of the heat sink has a plurality of heat dissipation holes, and the airflow generated by the fan can be blown to the memory through the heat dissipation holes. 11. The memory module of claim 9, further comprising a heat dissipating fin disposed between the seat piece of the heat sink and the fan. 12. If you apply for the memory group described in item u of the full-time section, the fan is placed on the top of the heat sink fin. For example, the memory module described in U.S. Patent Application Serial No. 4, wherein the fan is disposed on the side of the heat dissipation fin. The memory module of claim 9, wherein the memory module has a side panel that is extended from the side of the spacer and faces the memory. And having at least a heat dissipation hole, the session:: setting: the side piece h such that the generated airflow can pass through the heat dissipation hole of the memory. The memory module of claim 9 further includes a 岐 screw, the heat sink further has a plurality of fixing holes, and the plurality of fixing holes can pass through the fan and snails respectively. Locked in the fixing hole.広 広 修 修 修 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 Each of the fixing posts has a fixing hole, and the fan has a plurality of perforations for receiving the fixing post, and the fixing screws are respectively screwed through the through holes of the fan to be screwed to the fixing holes.
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