1297906 玖、發明說明： 【發明所屬之技術領域】 本發明大致涉及電子設備的製造，尤其是涉及用於減 少電子元件製造工具的覆蓋區域的方法和設備。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to the manufacture of electronic devices, and more particularly to a method and apparatus for reducing the coverage area of an electronic component manufacturing tool. [Prior Art]
第1圖示出了一種傳統的電子元件製造工具（或者系 統）1 ο 1。參照第1圖，電子元件製造工具1 〇 1包括多個元 件，例如連接在一個主機1 〇 7上的主機動力源（例如，一 個主機動力箱）103以及一個主機控制器1〇5。主機1〇7 包括一個或者多個處理室1 〇 9，所述每個處理室分別連接 在一個處理室動力箱1 1 〇和處理室控制器111上，以及〆 個連接在真空負載室113上的轉移室112。電子元件製造 工具101的覆蓋區域是電子元件製造工具101佔據的佔地 面積11 5 (例如，在一個清潔室中）。主機動力箱1 〇 3和主 機控制器1 05連接在一個與主機1 07分開的搁架1 1 7上（例 如，一個封閉的支架）。因此，主機動力箱1 0 3和控制器 1 05佔據一個與電子元件製造工具1 〇 1的主機分開的底面 積118’因此，增大了電子元件製造工具的覆蓋區域。 此外，主機動力箱1 0 3和控制器1 〇 5通過配線11 9連 接在主機1 〇 7上，所述線從分離擱架11 7延伸到主機丨〇 7。 因此，分離搁架i i 7離開主機1 07越遠，電子元件製造工 具1 01需要越多的配線11 9，因而降低系統的集成度。如 下所述，減少電子元件製造工具的覆蓋區域會提高工具（或 者系統）的集成度。 因此，需要用於減少電子元件製造工具的覆蓋區域的 方法和設備。 5 1297906 【發明内容】 在本發明的第一態樣，提供用於減少電子元件製造工 具的覆蓋區域的第一種方法。第一種方法包括下述步驟： (1)定位電子元件製造工具的真空負載室，藉以使真空負 載室佔據第一佔地面積；以及（2 )把主機動力源定位在第 二佔地面積中，其中第二佔地面積的大部分區域在所述第 一佔地面積中，因此減少了電子元件製造工具的覆蓋區域。Fig. 1 shows a conventional electronic component manufacturing tool (or system) 1 ο 1 . Referring to Fig. 1, the electronic component manufacturing tool 1 〇 1 includes a plurality of components such as a host power source (e.g., a host power box) 103 connected to a host 1 〇 7 and a host controller 〇5. The main unit 1〇7 includes one or more processing chambers 1 〇9, each of which is connected to a processing chamber power box 1 1 〇 and a processing chamber controller 111, and one of the processing chambers is connected to the vacuum load chamber 113. Transfer chamber 112. The coverage area of the electronic component manufacturing tool 101 is the footprint occupied by the electronic component manufacturing tool 101 (e.g., in a clean room). The main engine power box 1 〇 3 and the host controller 105 are connected to a shelf 1 17 (which is, for example, a closed bracket) separate from the main engine 1 07. Therefore, the main power box 1 0 3 and the controller 105 occupy a bottom surface 118' separate from the main body of the electronic component manufacturing tool 1 因此 1 , thus increasing the coverage area of the electronic component manufacturing tool. Further, the main engine power box 1 0 3 and the controller 1 〇 5 are connected to the main unit 1 〇 7 through a wiring 11 9 which extends from the separation shelf 11 7 to the main unit 丨〇 7. Therefore, the further the separation shelf i i 7 leaves the host computer 107, the more wiring 11 11 is required for the electronic component manufacturing tool 101, thereby reducing the integration of the system. As described below, reducing the coverage area of an electronic component manufacturing tool increases the integration of the tool (or system). Accordingly, there is a need for a method and apparatus for reducing the footprint of an electronic component manufacturing tool. 5 1297906 SUMMARY OF THE INVENTION In a first aspect of the present invention, a first method for reducing a coverage area of an electronic component manufacturing tool is provided. The first method comprises the steps of: (1) positioning a vacuum load chamber of the electronic component manufacturing tool such that the vacuum load chamber occupies a first footprint; and (2) positioning the host power source in the second footprint Where a majority of the area of the second footprint is in the first footprint, thus reducing the footprint of the electronic component manufacturing tool.
在本發明的第二態樣，提供用於減少電子元件製造工 具的覆蓋區域的第二種方法。第二種方法包括下述步驟： (1 )定位電子元件製造工具的真空負載室，藉以使真空負 載室佔據第一佔地面積；以及（2 )把主機控制器定位在第 二佔地面積中，其中第二佔地面積的大部分區域在所述第 一佔地面積中，因此減少了電子元件製造工具的覆蓋區域。 在本發明的第三態樣，提供用於降低電子元件製造工 具的航運成本的第三種方法。第三種方法包括下述步驟： (1 )把電子元件製造工具的真空負載室和主機動力源放入 一個容器中；以及（2)航運該容器。 在本發明的第四態樣，提供用於降低電子元件製造工 具的航運成本的第四種方法。第四種方法包括下述步驟： (1 )把電子元件製造工具的真空負載室和主機控制器放入 一個容器中；以及（2)航運該容器。 在本發明的第五態樣，提供用於減.少電子元件製造工 具的覆蓋區域的第一種設備。第一種設備包括（1 )真空負 載室支架；（2)連接在真空負載室支架上的電子元件製造 工具的真空負載室，藉以使真空負載室佔據第一佔地面 積；以及（3)連接在真空負載室支架上的主機動力源，藉 以使主機動力源佔據第二佔地面積。第二佔地面積的大部 6 1297906 分位於第一佔地面積中，因此減少了電子元件製造工具的 覆蓋區域。In a second aspect of the invention, a second method for reducing the footprint of an electronic component manufacturing tool is provided. The second method includes the steps of: (1) positioning a vacuum load chamber of the electronic component manufacturing tool such that the vacuum load chamber occupies a first footprint; and (2) positioning the host controller in the second footprint Where a majority of the area of the second footprint is in the first footprint, thus reducing the footprint of the electronic component manufacturing tool. In a third aspect of the invention, a third method for reducing the shipping cost of an electronic component manufacturing tool is provided. The third method comprises the steps of: (1) placing the vacuum load chamber of the electronic component manufacturing tool and the host power source in a container; and (2) shipping the container. In a fourth aspect of the invention, a fourth method for reducing the shipping cost of an electronic component manufacturing tool is provided. The fourth method includes the steps of: (1) placing the vacuum load chamber of the electronic component manufacturing tool and the host controller into a container; and (2) shipping the container. In a fifth aspect of the invention, a first apparatus for reducing the coverage area of an electronic component manufacturing tool is provided. The first apparatus includes (1) a vacuum load chamber bracket; (2) a vacuum load chamber of the electronic component manufacturing tool attached to the vacuum load chamber bracket, whereby the vacuum load chamber occupies the first footprint; and (3) the connection The main power source on the vacuum load chamber bracket, so that the host power source occupies the second footprint. The majority of the second footprint, 6 1297,906, is located in the first footprint, thus reducing the footprint of the electronics manufacturing tool.
在本發明的第六態樣，提供用於減少電子元件製造工 具的覆蓋區域的第二種設備。第二種設備包括（1 )真空負 載室支架；（2)連接在真空負載室支架上的電子元件製造 工具的真空負載室，藉以使真空負載室佔據第一佔地面 積；以及（3 )連接在真空負載室支架上的主機控制器，藉 以使主機控制器佔據第二佔地面積。第二佔地面積的大部 分位於第一佔地面積中，因此減少了電子元件製造工具的 覆蓋區域。 在本發明的第七態樣，提供用於減少電子元件製造工 具的覆蓋區域的第三種設備。第三種設備包括（1)具有主 機的電子元件製造工具，該主機佔據第一覆蓋區域；以及 (2 )佔據第二覆蓋區域的主機動力源，所述第二覆蓋區域 基本上與第一覆蓋區域重疊。 在本發明的第八態樣，提供用於減少電子元件製造工 具的覆蓋區域的第四種設備。第四種設備包括（1 )具有主 機的電子元件製造工具，該主機佔據第一覆蓋區域；以及 (2 )佔據第二覆蓋區域的主機控制器，所述第二覆蓋區域 基本上與第一覆蓋區域重疊。根據本發明的這些和其他態 樣的系統和設備亦提供本發明的多個其他態樣。 通過下面詳細的描述、附屬的申請專利範圍以及附 圖，本發明的其他特徵和態樣將變得更加清楚。 【實施方式】 本發明涉及提高集成度和減少電子元件製造工具（或 者系統）的覆蓋區域。第2圖示出了根據本發明一個實施 例的示例性電子元件製造工具（或者系統）2 0 1。電子元件 7 1297906 製造工具201可以用於生産和/或處理基材，例如用於製造 平板顯示器的玻璃或者聚合物基材、半導體晶片等。參照 第2圖，示例性電子元件製造工具201的構造與第1圖所 示的傳統電子元件製造工具1 0 1相似。尤其是，示例性電 子元件製造工具201包括一個主機203。主機203包括一 個或者多個處理室205，所述每個處理室205分別連接在 一個處理室動力箱2 0 6和處理室控制器2 〇 7上，以及一個 轉移室208和一個真空負載室209。真空負載室209由一 個真空負載室擱架（rack) 211支撐。In a sixth aspect of the invention, a second apparatus for reducing the coverage area of an electronic component manufacturing tool is provided. The second apparatus includes (1) a vacuum load chamber bracket; (2) a vacuum load chamber of the electronic component manufacturing tool attached to the vacuum load chamber bracket, whereby the vacuum load chamber occupies the first footprint; and (3) the connection The host controller on the vacuum load chamber bracket allows the host controller to occupy the second footprint. Most of the second footprint is located in the first footprint, thus reducing the footprint of the electronic component manufacturing tool. In a seventh aspect of the invention, a third apparatus for reducing the coverage area of an electronic component manufacturing tool is provided. A third device includes (1) an electronic component manufacturing tool having a host that occupies a first coverage area; and (2) a host power source occupying a second coverage area, the second coverage area being substantially identical to the first coverage The areas overlap. In an eighth aspect of the invention, a fourth apparatus for reducing the coverage area of an electronic component manufacturing tool is provided. The fourth device includes (1) an electronic component manufacturing tool having a host occupying a first coverage area; and (2) a host controller occupying a second coverage area, the second coverage area being substantially identical to the first coverage The areas overlap. These and other aspects of the system and apparatus in accordance with the present invention also provide various other aspects of the present invention. Other features and aspects of the present invention will become apparent from the Detailed Description, the appended claims and the appended claims. [Embodiment] The present invention relates to an increase in integration and a reduction in coverage area of an electronic component manufacturing tool (or system). Fig. 2 shows an exemplary electronic component manufacturing tool (or system) 201 in accordance with one embodiment of the present invention. Electronic Components 7 1297906 Manufacturing tool 201 can be used to produce and/or process substrates, such as glass or polymeric substrates, semiconductor wafers, and the like, used in the manufacture of flat panel displays. Referring to Fig. 2, the construction of the exemplary electronic component manufacturing tool 201 is similar to the conventional electronic component manufacturing tool 101 shown in Fig. 1. In particular, the exemplary electronic component manufacturing tool 201 includes a host 203. The main unit 203 includes one or more processing chambers 205 connected to a processing chamber power box 206 and a processing chamber controller 2, respectively, and a transfer chamber 208 and a vacuum load chamber 209. . The vacuum load chamber 209 is supported by a vacuum load chamber rack 211.
示例性電子元件製造工具20 1的主機動力箱（例如， 動力源）213與傳統電子元件製造工具1〇1的主機動力箱 103的位置不同，所述主機動力箱爲主機203和每個處理 室動力箱2 06提供動力。尤其是，真空負載室2 09這樣定 位（例如，位於真空負载室擱架2 11上），藉以使真空負載 室2 09佔據第一佔地面積2 1 5，主機動力箱2 1 3定位成佔 據第二佔地面積217，所述第二佔地面積的大部分包括在 第一佔地面積21 5中。例如，第一佔地面積21 5可以包括 整個第二佔地面積217。主機動力箱213適於連接在真空 負載室擱架2 1 1上。例如，主機動力箱2 1 3可以連接和支 撐在真空負載室擱架211上，和/或與真空負載室209爲一 整體。例如，主機動力箱21 3定位在真空負載室209的下 部。然而，主機動力箱2 1 3可以位於其他的位置上，例如 在真空負載室209的上方。因此，根據示例性電子元件製 造工具201的構造，真空負載室209和主機動力箱213至 少佔據大部分重疊佔地面積。通過這種方式，減少了電子 元件製造工具201的覆蓋區域。減少電子元件製造工具的 覆蓋區域可以減少所需的清潔室的尺寸，藉以降低工具的 操作成本。 8 1297906The host power box (eg, power source) 213 of the exemplary electronic component manufacturing tool 20 1 is different from the position of the host power box 103 of the conventional electronic component manufacturing tool 101, which is the host 203 and each processing chamber. The power box 2 06 provides power. In particular, the vacuum load chamber 209 is positioned (e.g., on the vacuum load chamber shelf 2 11) such that the vacuum load chamber 2 09 occupies a first footprint of 2 1 5 and the main power box 2 1 3 is positioned to occupy The second footprint 217, the majority of the second footprint is included in the first footprint 21 5 . For example, the first footprint 215 may include the entire second footprint 217. The main engine power box 213 is adapted to be coupled to the vacuum load compartment shelf 21. For example, the main power box 2 13 can be coupled and supported on the vacuum load chamber shelf 211 and/or integral with the vacuum load chamber 209. For example, the main power box 213 is positioned below the vacuum load chamber 209. However, the main power box 2 13 may be located at other locations, such as above the vacuum load chamber 209. Thus, in accordance with the construction of the exemplary electronic component manufacturing tool 201, the vacuum load chamber 209 and the main power box 213 occupy at least a majority of the overlap footprint. In this way, the coverage area of the electronic component manufacturing tool 201 is reduced. Reducing the footprint of the electronic component manufacturing tool can reduce the size of the cleaning chamber required, thereby reducing the operating cost of the tool. 8 1297906
可選擇地或者附加地’以一種與上述相似的方式，示 例性電子元件製造工具201的主機控制器218可以與傳統 電子元件製造工具1 〇 1的主機控制器1 〇 5的位置不同。例 如’在其中主機動力箱213和主機控制器218都被定位成 減少製造工具1 0 1的覆蓋區域的實施例中，主機控制器2 i 8 定位成佔據一個佔地面積（例如，第三佔地面積）2 1 9，所 述佔地面積的大部分包括在第一佔地面積2 1 5中。例如， 第一佔地面積215可以包括第三佔地面積219的至少5〇 %，或者優選地包括整個第三佔地面積2 1 9。主機控制器 218適於連接或者支撐在真空負載室搁架211上。例如， 主機控制器2 1 8連接在真空負載室2 11的一側，該側與主 機動力箱2 1 3連接在真空負載室擱架2 1 1上的一側相對 置。可選擇地，主機控制器2 1 8可以連接在真空負載室摘 架2 11的其他部分或者其他側上。此外，主機控制器2 1 § 可以定位在真空負載室209的上部或者下部。因此，根據 第2圖所示的構造，真空負載室209和主機控制器218佔 據重疊的佔地面積。通過這種方式，減少了電子元件製造 工具201的覆蓋區域。 本發明的電子元件製造工具20 1的主機動力箱2丨3和/ 或主機控制器2 1 8的定位，允許減少電子元件製造工具2 〇 i 的主機動力箱2 1 3和/或主機控制器2 1 8與其他部件之間的 配線220。尤其是’由於主機動力箱213和/或主機控制哭 2 1 8的定位，電子元件製造工具20 1不需要配線從一個獨 立的殼體連接到主機203，藉以把主機動力箱213和/或主 機控制器218連接在主機203上。在主機203與主機動力 箱2 1 3和/或主機控制器2 1 8之間的配線22 0可以緊凑地裝 配在主機的覆蓋區域中。因此，有利於減少電子元件製造 工具的覆蓋區域，本發明的方法和設備可以提高系統集成 9 1297906 度並且降低系統的複雜性。Alternatively or additionally, in a manner similar to the above, the host controller 218 of the exemplary electronic component manufacturing tool 201 may be different from the position of the host controller 1 〇 5 of the conventional electronic component manufacturing tool 1 〇 1. For example, in an embodiment in which both the host power box 213 and the host controller 218 are positioned to reduce the coverage area of the manufacturing tool 110, the host controller 2i8 is positioned to occupy one footprint (eg, the third occupancy) Ground area) 2 1 9, most of the floor space is included in the first floor area of 2 15 . For example, the first footprint 215 can include at least 5% of the third footprint 219, or preferably the entire third footprint 219. The host controller 218 is adapted to be coupled or supported on the vacuum load compartment shelf 211. For example, the main controller 2 1 8 is connected to one side of the vacuum load chamber 2 11 which is opposed to the side of the main engine power box 2 1 3 which is connected to the vacuum load chamber shelf 2 1 1 . Alternatively, the host controller 218 can be attached to other portions of the vacuum load chamber ejector 2 11 or to other sides. Further, the host controller 2 1 § can be positioned at the upper or lower portion of the vacuum load chamber 209. Therefore, according to the configuration shown in Fig. 2, the vacuum load chamber 209 and the main controller 218 occupy an overlapping floor space. In this way, the coverage area of the electronic component manufacturing tool 201 is reduced. The positioning of the host power box 2丨3 and/or the host controller 2 18 of the electronic component manufacturing tool 20 1 of the present invention allows the reduction of the host power box 2 1 3 and/or the host controller of the electronic component manufacturing tool 2 〇i 2 1 8 Wiring 220 with other components. In particular, the electronic component manufacturing tool 20 1 does not require wiring to be connected from a separate housing to the host 203 due to the positioning of the host power box 213 and/or the host control crying 218, thereby placing the host power box 213 and/or the host. Controller 218 is coupled to host 203. The wiring 22 0 between the host 203 and the host power box 2 1 3 and/or the host controller 2 1 8 can be compactly mounted in the coverage area of the host. Therefore, it is advantageous to reduce the coverage area of the electronic component manufacturing tool, and the method and apparatus of the present invention can improve system integration and reduce the complexity of the system.
根據本發明的一個實施例，示例性的電子元件製造工 具201可以比傳統的電子元件製造工具ι〇1更有效地進行 輸送（例如，航運）。尤其是，通常傳統電子元件製造工具 101的主機動力箱1〇3和主機控制器1〇5與真空負載室U3 分開航運。然而不同的是，本發明電子元件製造工具2 〇 1 的主機動力箱213可以與真空負載室209 —起航運。如上 所述’主機動力箱213適於連接在真空負載室擱架211上 並且與真空負載室209佔據一個重疊的覆蓋區域。因此， 本發明的電子元件製造工具201的真空負載室209和主機 動力箱2 1 3 (例如，它們都可以組裝在真空負載室擱架2 0 9 上）可以在同一個容器中航運。通過在同一個容器中航運 真空負載室209和主機動力箱213，可以減少用於裝運示 例性電子元件製造工具201的所需容器總數。因此，電子 元件製造工具的航運成本降低。可選擇地或者附加地，通 過相似的方式，主機控制器2丨8可以與真空負載室209在 同一個容器中航運。 釗述的描述僅僅公開了本發明的一個示例性實施例。 在本發明的範圍内對上述公開的設備和方法進行的修改對 於本領域的技術人員來說是顯而易見的。在一個或者多個 實施例中，主機動力箱2 1 3和/或主機控制器2 1 8佔據的佔 地面積（例如，分別爲第二和/或第三佔地面積）的大部分 (例如，至少50%，優選地爲100% )落入真空負載室2〇9 佔據的佔地面積中（例如，第一佔地面積2 1 5 )。然而，在 其他的實施例中，主機動力箱21 3和/或主機控制器218佔 據的佔地面積可以大部分落入電子元件製造工具2 〇 1的其 /元件所佔據的佔地面積中。例如，主機動力箱2 1 3和/ 或主機控制器218可以連接在電子元件製造工具201的其 10 1297906 他元件上或者連接在所述元件的支撐擱架上。 因此，儘管已經結合其示例性實施例揭示本發明，但 是應可理解的是，其他實施例將落入如申請專利範圍所限 定的本發明的精神和範圍内。 【圖式簡單說明】 第1圖示出了一種傳統的電子元件製造工具。 第2圖示出了根據本發明的一個實施例的一個示例性 電子元件製造工具。According to one embodiment of the present invention, the exemplary electronic component manufacturing tool 201 can be transported (e.g., shipped) more efficiently than the conventional electronic component manufacturing tool ι〇1. In particular, the main power box 1〇3 of the conventional electronic component manufacturing tool 101 and the main controller 1〇5 are separately shipped from the vacuum load chamber U3. However, the difference is that the main power box 213 of the electronic component manufacturing tool 2 〇 1 of the present invention can be shipped with the vacuum load chamber 209. As described above, the main engine power box 213 is adapted to be coupled to the vacuum load chamber shelf 211 and occupy an overlapping coverage area with the vacuum load chamber 209. Therefore, the vacuum load chamber 209 of the electronic component manufacturing tool 201 of the present invention and the main engine power box 2 1 3 (for example, they can all be assembled on the vacuum load chamber shelf 209) can be shipped in the same container. By shipping the vacuum load chamber 209 and the main power box 213 in the same container, the total number of containers required for shipping the exemplary electronic component manufacturing tool 201 can be reduced. Therefore, the shipping cost of the electronic component manufacturing tool is lowered. Alternatively or additionally, in a similar manner, the host controller 2丨8 can be shipped in the same container as the vacuum load chamber 209. The description of the description merely discloses an exemplary embodiment of the invention. Modifications to the above-disclosed apparatus and methods within the scope of the present invention will be apparent to those skilled in the art. In one or more embodiments, the host power box 2 1 3 and/or the host controller 2 1 8 occupy a majority of the footprint (eg, the second and/or third footprint, respectively) (eg, At least 50%, preferably 100%, falls within the footprint occupied by the vacuum load chamber 2〇9 (eg, the first footprint is 2 15). However, in other embodiments, the footprint of the host power box 213 and/or the host controller 218 may fall largely into the footprint of the components/components of the electronic component manufacturing tool 2 〇 1 . For example, the host power box 2 1 3 and/or the host controller 218 can be coupled to or connected to the support member of the electronic component manufacturing tool 201. Therefore, while the invention has been described in connection with the exemplary embodiments thereof, it should be understood that [Simple Description of the Drawing] Fig. 1 shows a conventional electronic component manufacturing tool. Fig. 2 shows an exemplary electronic component manufacturing tool in accordance with one embodiment of the present invention.
【主要元件符號說明】 201 電子元件製造工具 205 處理室 206 處理室 動 力 箱 207 處理室控制器 208 轉移室 209 真空負載室 211 擱架 213 主機動力箱 215 第一佔 地 面 積 217 第二佔地面積 203 主機 219 第三佔地面積 11[Main component symbol description] 201 Electronic component manufacturing tool 205 Processing room 206 Processing room power box 207 Process room controller 208 Transfer room 209 Vacuum load chamber 211 Shelf 213 Main engine power box 215 First floor area 217 Second floor area 203 host 219 third floor area 11