TWI295725B - Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device - Google Patents

Description

1295725 V. INSTRUCTIONS INSTRUCTIONS (1) RELATED APPLICATIONS This application is hereby incorporated herein by reference in PCT/PCT/PCT/PCT/PCT///////////////////////////////////// A method and apparatus for cooling a flexible liquid of an ideal hot spot, which is incorporated herein by reference. 0 09,2 0 0 2,11,1, entitled "Microchannel Heatsink for Flexible Liquid Delivery and Hot Spot Cooling Method", incorporated herein by reference, and US Provisional Patent Application Serial No.

6 0/442,383,2 0 0 3,, 2 4, entitled "The best flat finned heat exchanger π for CPU cooling," which is incorporated herein by reference, commonly assigned U.S. Provisional Patent Application Serial No. 60/ 455, 729, 2003, 3, 17, entitled "Microchannel heat exchanger apparatus having a porous configuration and method of making the same", which is hereby incorporated by reference. This patent application claims priority under U.S. Provisional Patent Application Serial No. 60/423,009, 2002 '11', entitled "Microchannel Heat Absorber Cooling and Transport Flexibility" under US Patent Application Serial No. 60/423,009, The method of liquid ", the application is incorporated herein by reference, and U.S. Provisional Patent Application Serial No. 60/442, 383,2003,

1 '2 4, entitled "N CPU Cooling for a Plate Fin Heat Exchanger", the patent application is hereby incorporated by reference, and the U.S. Provisional Patent Application Serial No. 60/455, 729, 2003 3'17 , entitled "Microchannel Heat Exchanger Device with Porous Construction and Method of Making Same", which is hereby incorporated by reference.

1295725 V. DESCRIPTION OF THE INVENTION (2) The present invention relates to a method and apparatus for cooling a heat generating device, and more particularly to an effective vertical liquid transport and a minimum pressure drop of a heat exchanger for cooling an electronic device. BACKGROUND OF THE INVENTION The application of early cooling applications since the 1970s includes conventional parallel channel load heating devices. area. The hotter area is "temperature point π. Figure 1 Α and 1 Β explanatory diagram, heat exchanger 10 coupling heat interface material 9 8 surface inflow and out along parallel channel outlet 埠16. Although 埠1 2 to outlet 埠In fact, no more liquid is supplied to the domain in a uniform manner. In addition, the port 16 is increased by % when flowing from the inlet face 1 1 , so no warm liquid or two-phase liquid is supplied across the heat exchanger 1 1 .

After the introduction, heat exchangers have been shown to be used in high heat flow potential and in industry. However, the existing microchannel arrangement is not suitable for cooling the heat with spatial variation. This heat generating device has a surface called a π hot spot n which generates more heat, and does not generate much heat. The surface top view and the top viewper are via A single inlet 埠1 2 is shown, through 99, from the inlet, the liquid 1 1 flows, while the surface of the surface of the exchanger is on the surface of the exchanger or near the travel heating, the liquid is transferred to the outlet. The side of the heat exchanger 10 is coupled to an electronic device 99, such as a micro. As shown in Figs. 1A and 1B, the liquid flows from the bottom surface 11 of the 14th, and if the heat exchanger 10 cools the electronic device, the liquid system flows in a uniform manner. The entire bottom surface of the heat exchanger 10 is replaced by the temperature of the liquid flowing through the bottom surface of the hot spot in the device 99 as it follows the heat. Therefore, the area of the heat source 9 9 is a subcooled liquid, but the actual supply is already on. In fact, the actual bottom surface of the heated liquid and the heat source 9 9 are therefore close

Page 10 1295725 V. INSTRUCTIONS (3) Not too hot, so the fluid is unstable, along the area of the most heat. Switch 10 forces the full length of the exchanger 10 to drop. The heat exchanger is very difficult and the addition of Figure 1 C illustrates the entry into the multi-position quasi-thermal interaction to the bottom surface 27 and the non-uniform downward flow between the requirements and the above-mentioned discussion. The type of the device can be configured to be insufficient to effectively cool the liquid surface of the cold bottom surface. The increase in heat causes the boiling of the two phases to force the liquid to leave. In addition, only one inlet 埠1 2 and one outlet 埠16 of the hot liquid along the bottom surface degree, thereby causing large pressure instability in the apparatus 10. Knowledge transfer hot swap converter 2 0, through the middle to the exit 埠 24. To the bottom surface 2 7. Figure 1 A and 1 B of the heat exchanger, when the temperature of the heat source is effectively cooled to the heat source 11 of the parallel channel 14 is transferred to the heat liquid must be transported by the length of the force caused by the pressure to cause the liquid to be pumped to Heat exchange

Side view of the device 20. The liquid flows downward through the plurality of nozzles 28 in the interlayer 2, and the liquid transported along the nozzles 28. In addition, the heat exchanger of Fig. 1C exhibits the same problem. The configuration achieves a low pressure drop to the inlet source. The required one is a microchannel thermal uniformity. The desired temperature uniformity is required for a heat exchange point. SUMMARY OF THE INVENTION In one feature of the invention, the heat exchanger includes an interfacial layer to cool the heat source. The interfacial layer is in contact with a heat source and is configured to pass a liquid. The heat exchanger further includes a branch layer coupled to the interface layer. The manifold layer also includes a first set of individualized holes to pass the liquid to the interface layer, and a second set of individualized holes to transport the liquid from the interface layer. The manifold layer also includes a first weir that provides liquid to the first set of individualized holes, and a second weir that removes liquid transported from the second set of individualized holes. First

1295725 V. INSTRUCTIONS (4) - The group hole and the second group of holes are separated, and the liquid of the second group is disposed at one or more circulation levels of the liquid of the device, and the layer is arranged. The first and second cooling heat sources can be provided. Preferably, the first adjacent hole is closest to the optimum distance phase flow state or a combination thereof. The interface and the interface are in communication, and the layer further includes a quasi-configuration coupled to the second and second quasi-transfer coupling to the first arrangement. The second and second sets of holes are in a uniform layer. The first one of each cylinder is the first liquid to be transported, and the first one of the two sets of holes is the same as the first one. The first set and the second pass are at least one of the seal points. Or one interface heat One hole has a first size. In another embodiment

. Preferably, the closest one or the group has the first and second holes, the liquid type can be formed and shaped, and the body is in the second part, and the two parts are separated in the middle to prevent the implementation of the group hole direction, and the first point area is actually To each of the second group of holes, each of the outlets and the circulation level are extended through the first group including the first group. Through the branch layer. Circulation and a second cylindrical extension. The minimum liquid per hole heat exchange still includes the positional quasi-coupling group. The hole is self-protruding and the branch tube is vertically aligned to the flow level and to the first pass. The first place is between the first hole and the first hole. Dijon. The second collimating configuration transports the liquid to maintain the liquid containing the first slit through the first. The first first group of two-position quasi-position quasi-passage quasi-passage and the first narrow-length pass are densely entangled, and the second long passage is included in the non-uniform manner in another narrow passage to the first The two coupling seals are arranged to move. The first to the first group and the less one-dimensional embodiment group holes are arranged. The configuration of the first group and the second hole may be cold, the first group and the 0 in the second group embodiment, the first group is equal to one of the first group holes in the second group. Having a second level in the first and second passages, the sealable jaws, the group and the second group of directions are in the middle of each other but at least the second dimension of the heat source

Page 12 1295725 V. INSTRUCTIONS (5) Unlike the second dimension of at least one hole in the second set of holes. Preferably, it has a thermal conductivity of at least 1 〇〇 W/mk. Preferably, the interface layer 'the interface layer has a plurality of pillars' configured to have a predetermined pattern along the interface layer. Or ^匕3. The column of the replica is disposed along a predetermined area of the interface layer. Alternatively, the column f is coated thereon, wherein the coating has a suitable thermal conductivity = less or the interface layer still contains the porous microstructure disposed thereon. Or, the surface layer has a rough surface. Alternatively, the plurality of microchannel configurations are in an appropriate configuration of the interface sound.曰

In another feature of the invention, the heat exchanger can be configured to be coupled to a heat source. The heat exchanger includes an interface layer coupled to the heat source and configured to allow liquid to pass. Therefore, the heat generated by the liquid and the heat source is exchanged by heat. The heat exchanger further includes a branch layer to couple to the interface layer ', the layer having at least one liquid

Entrance 璋. The liquid inlet port is lightly coupled to a substantially vertical inlet liquid passage which delivers liquid to the interface layer. The heat exchanger further includes at least one liquid outlet port' shank coupled to the vertical outlet liquid passage to remove the liquid from the interfacial layer. The inlet and outlet liquid passages are arranged to be separated from each other by an optimum minimum T-body transmission distance. The branch layer also includes a flow-level coupling to the interface layer. The flow level has a plurality of inlet apertures that extend vertically to allow liquid 1 to be transported along the outlet liquid path. The branch layer includes an inlet level that is coupled to the flow level and the inlet port. The exit level configuration can transport liquid from the outlet orifice to the outlet helium. The liquid transported through the inlet liquid flows separately from the liquid transported through the outlet level. The liquid path in the inlet level still contains a liquid elongated channel' which transports liquid from the inlet port horizontally to the inlet aperture. The liquid passage in the outlet level contains a liquid elongated passage to transfer the liquid from the outlet orifice

Page 13 1295725 — V. Description of invention (6)

Body to export 埠. The inlet and outlet liquid pores are individually arranged in a uniform manner along at least one of the flow levels in one embodiment. The inlet and the orifice are non-uniformly arranged in at least one dimension in the flow level of another embodiment. The inlet and outlet fluid passages are preferably sealed from each other. The inlet and outlet apertures are alternately arranged to cool at least one of the interface hot spot cooling zones. In one embodiment, at least one of the inlet apertures has an inlet dimension equal to the outlet dimension of the at least one outlet aperture. In another embodiment, at least one of the inlet apertures has an inlet dimension that is different from the outlet aperture of the at least one outlet aperture. The interface layer preferably has a thermal conductivity of at least 1 〇〇W/mk. The interface layer further includes a plurality of cylinders disposed thereon in a suitable pattern, wherein 'the appropriate number of pillars are disposed along the interface layer in a predetermined area. Or the 'interlayer layer has a thick wheel surface. The plurality of cylinders include a coating thereon having a coating having at least a suitable thermal conductivity of 10 W/mk. The interface layer can have a porous microstructure disposed thereon. The heat exchanger preferably includes a plurality of cylindrical projections extending from the flow level by an appropriate degree, each projection being in communication with the first and second sets of apertures. Preferably, the shape of the dome is thermally insulated to prevent heat transfer therebetween.

In another feature of the invention, a tube layer is adapted to couple the interface layer to form a microchannel heat exchanger comprising an inlet port to provide a first temperature liquid L branch layer and an outlet port to communicate with the liquid path. The second temperature liquid level 铋 exit 埠 exits the branch pipe layer. Each inlet passage provides a direct inlet fluid passage from the first weir to a =, and each outlet passage provides a direct fluid passage from the interfacial layer. The entrance and exit arrangements allow for the shortest flow distance between them. The inlet and outlet passages are arranged in a uniform manner along at least one foot of the third layer, M. Or, the inlet and outlet pathways are along the third floor.

1295725 V. INSTRUCTIONS (7) One less size is separated by a non-uniform seal. At least one of the inlet sources is actually different from at least one of the inlet channels. The branch level is extended. The circular inlet path is the exit path. The configuration of the converter is such that it passes through to cool the actual path. The best minimum distance layer. The path includes a heat source that is coupled to the tube layer and is extended to each other, and each of the barrel-shaped protruding passages is transparent to the other type of cooling surface layer. The method of vertically entering and exiting the transfer liquid is still included. The liquid is discharged through one outlet, the outlet liquid is discharged, and the heat is discharged. The flow level is the surface layer.

The way out of the hot spot exit entrance contains complex protrusions as a sudden arrangement of the object. The inlet and port pathways interact with each other. An outlet of at least one of the channels is sized to be insulated from the inlet and the at least one of the plurality of cylindrical projections to prevent coupling to the seal as a seal coupling. The outlet passage is of equal size to the third inlet passage. The outlets of the outlet passages are heated to each other with appropriate passages. The liquid enters the narrowing to the liquid to provide a heat source for each other. Type Coupling Method Still Liquid Liquid Liquid Flow Flow Containing Handle Liquid From the inlet liquid > body 埠 exchanger There are complex transmissions into the converter including the hot junction manufacturing to the heat source. The inclusion includes the formation of a tube passage, passage. The party has at least one liquid 埠 to the outlet. Forming an inlet liquid and a plurality of arrangements for the method to still include the inlet liquid into the pores of the heat exchange liquid passage branch layer, and the inlet layer is formed into an interface layer through the inlet, and the vertical surface is joined to the surface to the inlet Device. , where the steps are still straight through the liquid pass or to the outlet size and the self-flow individual phase shift. The long channel, the slit is long, and the step of the heat stratification through the liquid includes a plurality of layers of the outlet liquid layer to the interface liquid passage method, the liquid is contained to form a passage to the medium. The flow

II

Page 15 1295725 V. INSTRUCTIONS (8) The pass level also has a multi-port liquid passage to form an in-position eight-port level. The outlet layer outlet has a coupling channel that is the source of the liquid to the minimum. Included with the inclusion of the method is also included in the interface is also included in the coating method such as the etching phase type technique of the wearer L method from the machine gap. The step of the long channel exit point sealing coupler keeps less one interface channel interface layer electricity money interface layer layer interface layer on the interface layer in the complex number > stupid turn off or soft micro formation. The method divides the number of outlet pores through the outlet liquid passage. The step of passing the inlet pipe into the branch layer is still the entry aperture and the inlet narrowly forming an outlet to transport the liquid to the outlet to the circulation level. Separated by the entrance level. Entrance and exit Hot spots. Preferably, the side and the liquid outlet passage have a thermal conductivity. A heat conductive coating is applied to form a multi-layered configuration in a predetermined pattern such that a thick shape forms a cylinder, and a plasma pattern is formed in the branch. The porous structure is provided with a plurality of micro-passes. A combination of multiple etching, photochemical, and other methods of interaction may also be performed by a soft microtubule layer or by a vertically extending support liquid containing a coupling channel level. The liquid liquid is formed in the process of forming the liquid, and the surface of the chain is placed on at least a plurality of interfaces. The square column is systematically etched. Interacting photographic technology The process of projecting through the guiding layer is narrow. The horse seal is coupled to the outlet of the branch pipe. The pores and the body and the path are arranged with insulation to make the step of the l〇〇W/mkc layer. Or . On the manufacturing side. The law still consists of electricity formation and chemical etching. The branch pipe is formed. The branching method, the electrical surface layer and the sub-channel still contain long-channel to quasi-flow-through. The formation of pores through a step is still included in the exit of the narrow mouth. The heat transfer method in the cooling heat pipe layer is still available. The method still requires the manufacturing method to include the heating method, the residual engraving and the laser and the hot pressing layer to the laser tube layer.

Page 16 1295725_·' ... V. Invention Description (9) (EDM), stamping, metal injection molding (MIM), cross-cutting and sawing. Other advantages and features of the present invention will become more apparent from the following detailed description of the preferred and other embodiments. In general, the heat source is generated by the liquid being zoned to build a small pressure drop to a plurality of pore conduits to guide the person, and the heat exchange is transmitted to the heat exchanger. In the application, instead of FIG. 2A, the present invention is described. FIG. 2B illustrates the heat transfer of the heat exchanger to the thermal energy source of the heat exchanger. For example, in the channel, and the flow-through liquid includes a few liquids and bodies. This artist can understand and discuss the use of micro-channel heat. Limited to here. Closed back. Interactive softness. Closed back. Microchannel heat.

To capture through a selected area of liquid and interface layers, the layer is preferably coupled to a heat exchanger. The special zone of the special layer is used to cool the hot spot and the temperature uniformity around the hot spot, and to maintain the heat exchanger utilization and/or finger in the branch pipe layer and the intermediate layer as discussed in the different embodiments below the heat exchanger. Select a hotspot area from the interface layer. Or 埠, which is specifically configured in a predetermined position to conduct and remove liquid to effectively cool the heat source. It is quite obvious that although the microchannel heat of the present invention relates to the location of the hot spot in a device, the location of the cold spot in the device. It should be noted that although the exchanger is described, the invention can be used with other discussions. A schematic of the road seal cooling system 30, which incorporates a liquid delivery microchannel heat exchanger 100. An outline of the cooling system 30, which includes another soft exchanger 100 having the present invention

111 I mu IHHi I I n ISilSS 11 l_lll I 11 I Page 17 1295725 V. Invention description (ίο) Multiple 埠1 0 8,1 0 9. It should be noted that the system may also incorporate other heat exchanger embodiments and is not limited to another heat exchanger 1 〇 〇. As shown in Fig. 2A, liquid 埠1,8,109 is lightly coupled to liquid line 38, which is coupled to a pump 3 2 and a thermal agglomerator 30. The pump 3 2 is in the closed loop 30 to pump liquid and flow liquid. In another embodiment, a liquid 埠 1 〇 8 is used to supply liquid to the heat exchanger 100. In addition, the liquid 移除l〇g is removed from the heat exchanger 100. In one embodiment, a uniform constant amount of liquid flow enters and exits heat exchanger 1 〇 through each of liquids 〇1,1,09. Alternatively, different amounts of liquid flow through the inlet and outlet 埠1 〇 8,1 〇 9 at regular intervals to enter and exit. Alternatively, as shown in Fig. 2B, a pump provides liquid to a number of designated inlet ports 108. Alternatively, a plurality of pumps (not shown) provide liquid to their individual inlets and outlets 〇1,8,1〇9. In addition, the dynamic sense and control module 34 can be used in the system to change and dynamically control the amount and flow rate of fluid entering and exiting the preferred or another heat exchanger in response to changes in hot spots or changes in heat and hot spots in the hot spot location. The position of the position changes. Figure 3B illustrates a three layer germanium exchanger diagram of the present invention having an alternating branch layer. Another embodiment shown in 3B is a three-position quasi-heat exchanger 100, which includes an interface layer 102, at least one of which is 1 Λ Λ . , , , , , , , , , , , , , , , , , , , , , , , 及 及 及 及 及0 6. Alternatively, as discussed below, the Burgundy Heater Replacer 100 is a two-position device comprising an interface layer 10 2 and a layer of η ^ & 嘈 1 〇 6. Figure 2 As shown in FIG. 2, the 埶 exchanger 100 is coupled to the heat source 99, such as a Leigong 堪 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^

...,; 丨 枓 枓 98 is preferably disposed between the heat source 99 heat exchanger 100. Alternatively, 埶 拖 w ι Λ * & 隹 T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T It is obvious to those skilled in the art that the heat exchanger is 10 〇

1295725 V. INSTRUCTIONS (Η) The integration is formed in the heat source 9 9 and the heat exchanger 丨〇 and the heat source 9 9 form one. Therefore, the interface layer 1〇2 can be integrated with the heat source 99 and have one element. Preferably, the microchannel heat exchanger of the present invention is configured to be in contact with a heat source Θ 9, which is rectangular as shown. Or the skilled person is very obvious, the heat exchanger! 〇 〇 can be used for any shape ~ pair fine, source 9 9 shape. For example, the heat exchanger of the present invention can be configured to be large and semi-circular' which can cause a heat exchanger (not shown) to be in direct or indirect contact with a corresponding semi-circular heat source, f not shown. Further, the heat exchanger preferably has a larger size than the donor, and the range thereof is and includes 〇. 5-5β 0 mm. Fig. 3A illustrates a top view of another tube layer 1〇6 of the present invention. As shown in (10), the branch layer 106 includes four sides and a top surface 130 and a bottom surface 133. However, the top surface 1 3 〇 is removed in Figure 3A to properly illustrate the operation of the branch layer i 〇 6 . As shown in Fig. 3A, the branch layer 106 has a series of channels or passages 1 1 6,1 1 8 , 1 2 0, 1 2 2 and 埠1 0 8,1 0 9 formed therebetween. The finger portion 1 0 8, 1 2 0 extends in the Z direction as shown in Fig. 3B, and extends completely through the body of the branch pipe layer 1 〇 6. Alternatively, the finger portions 1 18 and 1 2 0 partially extend through the branch layer 106 in the Z direction and have pores as shown in FIG. 3A. In addition, the channels 11 6 and 1 2 2 extend through the branch layer 106. The remaining areas between the inlet and outlet passages 116, 120 are represented by 107, extending from the top surface 130 to the bottom surface 133 and forming the body of the manifold layer 106. ^ As shown in FIG. 3A, liquid enters the branch layer 106 via the inlet port 108 and flows along the inlet channel 116 to a plurality of finger portions 11 8 which distribute the liquid from the channel 1 16 to the X and/or Y direction. The choice of applying liquid to the interface layer 102

Page 19 1295725 ‘ . V. Description of invention (12)

region. The finger portions 1 18 are arranged in different predetermined directions to transport liquid to respective positions in the interface layer 102, which corresponds to an area of the heat source at or near the hot spot. These locations in the interface layer 102 are hereinafter referred to as interface hotspot regions. The configuration of the finger portion cools the static and time-changing interface hotspot regions. As shown in FIG. 3A, the channels 1 1 6 , 1 1 2 and the finger portions 11 8 , 1 2 0 0 are disposed in the branch pipe layer 106 in the X and/or Y directions. Thus, the different directions of the channels 11 6, 1 1 2 and the fingers 11 8 , 1 2 0 can transport liquid to cool the hot spots in the heat source 9 9 and/or minimize the pressure drop in the heat exchanger 1000 . Alternatively, the channels 116, 122 and the finger portions 118, 120 are periodically disposed in the branch layer 1 〇 6 and exhibit a pattern as shown in the examples of Figs. The arrangement and size of the fingers 11 8 , 1 2 0 are determined by the hot spots in the heat source 9 9 to be cooled. The position of the hot spot and the amount of heat generated at or near each hot spot are used to configure the branch layer 1 〇6, and the finger portion 11 8 , 1 2 0 0 is placed at or near the interface hot spot area in the interface layer 102 . The branch layer 1 〇 6 preferably allows a single phase and/or two phase liquid to circulate to the surface layer 102 without causing a pressure drop in the heat exchanger 1 〇 and the system 30 (Fig. 2A). The liquid delivered to the interface hot spot establishes a uniform temperature in the interface hot spot and near interface hot spot.

The size and number of the I channel 11 6 and the finger portion 11 8 are related to the number factor. In one embodiment, the inlet and outlet fingers 11 8 , 1 20 have the same width dimension. Alternatively, the inlet and outlet finger portions 118, 120 have different width dimensions. The width of the finger portions 118, 120 is in the range of 0.25-5.0 mm. In another embodiment, the fingers 11 8 , 1 20 have the same length and width. Or the inlet and outlet fingers 118, 120 have different widths and lengths. In another embodiment, the inlet and outlet fingers 1 1 8, 1 2 0

Page 20 1295725

The length of 3 has a varying width. In addition, the length of the inlet and outlet fingers 1 丨 8, 2 is and includes 0.5 mm to three times the length of the heat source. In addition, the gossip 118, 120 has a height or depth of 25 5 · 〇 mm. In addition, fingers of less than 10 or more than 30 per 可 can be interactively configured in the interface layer 〇6. ^, it is obvious to those skilled in the art that it is also feasible to be at the branch level between every centimeter and 3 hands. The present invention is intended to be a non-periodic to cross-heat source 9 9 spatial distribution plus time 'temperature increase and liquid from a large expansion layer to liquid heat transfer liquid transfer profile 1 2 0 and channel 丨! 8, for example, can ask for the heat of the father. In addition, a larger vapor composition of 116' 122. Although not shown, the beginning is to cause the liquid to be in the design of the fluid at the downstream outlet and the channel. The liquid is converted into the finger part 1 1 8 , 1 2 〇 and channel 1 1 6! 2 2 geometry is arranged to increase the optimal hot spot cooling of the heat source. To achieve a uniform temperature, the heat is transferred to the spatial distribution of the liquid to match the heat. As the liquid flows through the microchannels 沿i 沿 along the interface layer, it begins to convert to vapor under two-phase conditions. Therefore, the expansion causes a large increase in speed. In general, self-transfer efficiency is improved by high-speed traffic. Thus, the size and removal of the fingers 118, 122 in the heat exchanger 1 can be adjusted to accommodate the efficiency of heat transfer to the liquid. The heat source is designed with a special finger part, which is close to the entrance. Designing a larger finger part i丨8, j 2 〇 and the channel sectional area is also an advantage. The liquid may be generated at this place and the finger part may be designed to be at the entrance. The small section area opens at high speed. The special finger or channel can be configured to have a large cross-sectional area to create a lower flow rate. The finger can minimize the pressure drop of the heat exchanger, and the amount of liquid due to the two phases being vapor, the speed and acceleration increase.

1295725_... · Employment V. Description of the invention (14) Optimization of hot spot cooling. In addition, the fingers 1 18, 10 and the channels 1 1 6, 1 2 2 can be designed to be wide and narrow along their length to increase the velocity of the liquid at different locations in the microchannel heat exchanger 100. Alternatively, it is also possible to design and change the finger portion and the passage from large to small and then from small to large to match the heat transfer efficiency to the heat consumption distribution expected from the heat source. It should be noted that the above discussion of changing the finger portion and the passage can also be applied to other embodiments' without being limited to the embodiment.

Alternatively, as shown in Fig. 3A, the branch layer 106 includes one or more apertures 1 1 9 in the finger portion 1 18 . In the three-layer heat exchanger 100, the liquid flows down the finger 1 1 8 through the pores 1 1 9 to the intermediate layer 104. Alternatively, in the three-layer heat exchanger 100, the liquid flows down the finger portion 1 18 to the aperture 1 1 9 directly into the interface layer 102. Further, as shown in Fig. 3A, the branch pipe layer 106 includes the apertures 1 2 1 in the outlet finger portion 120. In the three-layer heat exchanger 100, liquid flows upward from the intermediate layer 104 into the pores 1 2 1 into the outlet finger portion 120. Alternatively, in the two-layer heat exchanger 100, liquid flows from the intermediate layer 110 to the pores 1 2 1 into the outlet finger portion 120. In another embodiment, the inlet and outlet fingers 11 8 , 1 20 are open channels without voids. The bottom surface 110 of the manifold layer 106 is adjacent to the surface of the intermediate layer 104 in the three-layer heat exchanger 100 or adjacent to the dielectric layer 102 in the two-layer heat exchanger. Therefore, in the three-layer heat exchanger 100, the liquid flows freely to the intermediate layer 104 and the branch layer 106. The liquid is directed from the conduit 10S in the intermediate layer 104 to the appropriate interface hot spot. As will be appreciated by those skilled in the art, the conduit 105 is directly aligned with the finger portion below or throughout the three-layer system. Figure 3B shows only the three-layer heat exchanger with a branch layer, the heat exchange

Page 22 1295725 V. INSTRUCTIONS (15) The device may also have a two-layer structure including a branch layer 1〇6 and an interface layer 1〇2, and the liquid passes through the layers directly between the interface layers 1〇2 of the branch layer 1〇6. Does not pass through the interface layer 104. It will be apparent to those skilled in the art that the display of the manifold, intermediate layer and interface layer is for illustrative purposes only and is not limited to the configuration shown.

As shown in Fig. 3B, the intermediate layer 1 〇 4 includes a plurality of conduits 1 〇 5 extending therethrough. The inflow conduit 1 〇 5 directs the liquid from the branch layer 1 〇 6 into the designated interface hot spot in the interface layer 1 〇 2 . Similarly, the pores 1 〇 5 also transport liquid from the interface layer 1 0 2 to the outlet liquid 埠 1 〇 9. Therefore, the intermediate layer 1 〇 4 also provides liquid transport from the interface layer 102 to the outlet liquid 埠i〇g, and the outlet liquid 埠8 communicates with the branch layer 106.

The guide 10 5 is disposed in the interface layer 予 in a predetermined pattern according to a factor of factors including, but not limited to, the location of the interface hot spot, the amount of liquid required in the interface hot spot to cool the heat source 9 9 and the liquid temperature. The width of the catheter is 100 microns, and other sizes to a few millimeters are also possible. In addition, the conduit 1 〇 5 can be other sizes depending on at least the above factors. For those skilled in the art, each of the conduits 5 in the intermediate layer 104 has the same shape and size but is not required. For example, as with the finger portions described above, the catheter can also have variable length and/or width dimensions. In addition, the catheter! The crucible 5 has a constant depth or dimension through the intermediate layer 104. Alternatively, the conduit 1〇5 has a variable depth gauge 1 ★, such as a trapezoidal or nozzle shape, through the intermediate layer 1〇4. Although the horizontal shape of the tube 105 shown in Fig. 2C is rectangular, the duct i 〇 5 may have other shapes including a circular shape (Fig. 3A), a curved shape, and an elliptical shape. Alternatively, one or more of the catheters ι〇5 may be in shape and equivalent to some or all of the fingers. The intermediate layer 104 is horizontally disposed in the heat exchanger i 〇 ,, and the conduit is vertically aligned

$烈页 1295725 V. INSTRUCTION DESCRIPTION (16) ^ In addition: the intermediate layer 104 can be disposed in the heat exchanger u, but not limited to diagonal and curved. Alternatively, the catheter can be oriented, flat, diagonal, curved or in any direction with = water φ pe S , n ^ _ 牧 interlayer 1, 〇 4. Or, Ningjian 04 04 along the full length of the hot parent exchanger has interface 厝1 η 9 詉士技 & η...X ® this * + ^ layer 1 0 4 will force the liquid through the conduit

The interface layer 102 is completely separated from the branch layer 1 〇6," η is transferred. Or, the heat exchanger 10. The portion τ 〇 6 is the intermediate layer 104 between the surface layers 102, so that the liquid can flow freely. In addition, the intermediate layer 104 may extend vertically between the branch layer 1〇6 and the interface layer 1〇2 to form a separate, distinct intermediate layer region. Alternatively, the intermediate layer 1〇4 does not extend completely from the branch layer 1〇6 to the interface. Layer 1 〇 2. Figure 1 透视 Α illustrates a perspective view of a preferred embodiment of the interface layer of the present invention. As shown in Figure 1, Ο A, the interface layer 306 includes a series of pillars 3 0 3 self-interposer 3 The bottom surface of 2 extends upward. Further, Fig. 1A illustrates the microporous structure 3 配置 disposed on the bottom surface of the interface layer 3〇2. It is apparent that the interface layer 3 〇 2 may include only the microporous structure 301 and Combined with the porous structure of any other interface layer properties (ie, microchannels, cylinders, etc.). The preferred interface layer 3 0 2 includes the cylinders 3 0 3 instead of the microchannels.

The liquid in the inlet pores flows to the outlet pores around the preferred branch layer 3 0 2 (Fig. 12A). As discussed in more detail below, the liquid is transported downward through a series of inlet apertures to the interface layer 3 〇 2, whereupon the liquid exits through the intervening layer 3 2 2 through a series of exit pores which are spatially separated by the optimum distance into the pores. In other words, liquid is transported from each inlet aperture to the nearest exit aperture. Preferably, each inlet aperture is surrounded by a plurality of outlet apertures. Therefore, the liquid entering the interface layer 3 0 2 will flow in the direction around the exit aperture.

Page 24 1295725 V. Description of invention (17) Movement. Accordingly, the column 3 0 3 is preferably in the interface layer 302 to accommodate sufficient heat transfer to the liquid and to cause the liquid to undergo a minimum amount of liquid pressure drop as it flows from the inlet aperture to the outlet aperture. The interface layer 302 preferably includes a dense, narrow array of cylinders 3 〇 3 extending perpendicularly from the bottom surface 301 to contact the bottom surface of the manifold layer. Alternatively, the post 30 3 extends at an angle to the bottom surface 301 of the interface layer 30 2 . The cylinders 303 are also preferably spaced apart from one another along the interface layer 320 and the thermal transfer capability of the tantalum interface layer 3 〇 2 can be evenly across the bottom surface 301. Alternatively, the cylinders 30 3 may also be separated non-equidistantly, as shown in FIG. 10B, wherein the cylinders in the middle of the interface layer 3 〇 2 are 3 0 3

The cylinders 3 0 3 are separated at the edges by a greater distance. The space of the cylinder 3 〇 3 is separated from the size of the heat source 9 9 , and the fluid impedance and the size and location of the hot spot of the liquid are related to the magnitude and position of the heat flux density of the self-heat source 9 9 . For example, the lower density of the cylinder 310 has a lower impedance to the fluid, but also provides less surface area for thermal transfer from the interface layer 320 to the liquid. It should be understood that the non-intermittent separation configuration of the column 3 0 of the embodiment of Fig. 1 〇β is not limited, and can be configured as any arrangement for the arrangement of the heat source and the cooling system 3 (Fig. 2A). Depending on the conditions. Further, the column 3 0 3 is preferably a cylindrical shape as shown in Fig. 0A, so that the liquid sputum exits the port pores with minimum resistance. However, the shape of the body Λ 3 0 3 may include, but is not limited to, a square 3〇3Β (Fig. 1〇Β), a diamond shape, an ellipse (Ρ3 3 3C (Fig. 10C), a hexagonal 3〇3D (Fig. 1〇D) In addition, the interface layer 302 may have a combination of differently shaped cylinders along the bottom surface 3. For example, as shown in FIG. 10E, the interface layer 3〇2 includes a set of spaced-shaped fins 3 0 3 E, which is arranged radially to each other in each group. In addition, the interface layer 3 〇 2 package

Page 25 1295725 V. INSTRUCTIONS (18) The number of cylinders 3 0 3B is arranged in the case of the group of 303E of the group, and the open path in the radial arrangement of the tabs 3 0 3 E A circular zone is placed under each inlet aperture, and the vanes 3 Ο 3E assist in guiding the fluid to the Q-holes and gaps, so that the radially distributed fins 3Ο3E assist in minimizing pressure drop and providing closeness A uniformly distributed cooling liquid is in the interface layer 302. Depending on the size and relative configuration of the inlet and outlet apertures, there may be many possible configurations of the cylinders and 7 or fins. The optimal arrangement of the interface layer 30 2 depends on whether the liquid is subjected to a single phase or two phase flow condition. It will be apparent to those skilled in the art that the different configurations of the 3 3 3 can also be incorporated into any embodiment and variations. FIG. 3B illustrates a perspective view of another embodiment of the interface layer 1〇2 of the present invention. As shown in FIG. 3B, the interface layer 1〇2 includes a bottom surface 1〇3 and a plurality of microchannels 1 1 〇, and a microchannel wall 11 The area can be guided or transported along the _two path. The bottom surface 103 is flat and has a high thermal conductivity to - :, the source 9 has sufficient heat transfer. Alternatively, the bottom surface work 3 includes grooves or ridges designed to be collected or ejected from a particular location. The microchannel wall is configured in a configuration as shown in Fig. 3B, thereby allowing liquid to flow between the walls of the crucible along the liquid path. The ten fines are very obvious to those skilled in the art, and the microchannel niche can be configured in a configuration depending on the above factors. For example, the interface layer 102 may have grooves between the micro gamma wall portions as shown in Figure 8C. In addition, the microchannel wall H has a size that minimizes the pressure drop or pressure differential in the interface layer 1〇2. In addition to the microchannel walls, other configurations are also contemplated, including but not limited to rough = face and porous structures such as sintered metal or tantalum foam, which is quite clear. For the purposes of the example, the microchannel wall in Fig. 3B is used to illustrate the interface layer 1 〇 2 of the invention of the invention. Still letting the microchannel wall 1 1 0 allow the liquid to be exchanged along the hot spot of the interface. The heat exchange is performed to cool the heat source 9 at this position. The microchannel double 滹9 9 width is 2 0 - 300 μm and height 1 〇〇 micron to 1 mm fan garden, depending on the power of the two-point. The length of the micro-channel niche is between 1 μm and several degrees, depending on the size of the heat source. The size of the hot spot and the heat flux to the heat source are determined. Alternatively, any other microchannel wall size can be considered. The microchannels, 1 1 0 are separated from each other, the separation range is 50-500 microns, and the heat source 99 power is 疋'Although other separation distances may also be considered. Referring to the assembly in Fig. 3B, the top surface of the branch layer 1 〇6 is cut to say that the channel 1 66, n 2 and the finger portion 11 in the body of the branch pipe layer 8,1 2 0. The position in the heat source 9 9 generates more heat, so it is called a hot spot, and the position of the heat source 9 9 which generates a small amount of heat is called a temperature point. As shown in FIG. 3B, the heat source 99 has a hot spot. At position A, and at the temperature point in position b. The area of the interface layer 接近2 close to the hot spot and the temperature point is called the interface hot spot area. As shown in FIG. 3B, the interface layer 102 includes an interface hotspot area a, which is disposed on the location a and the interface hotspot area. The hotspot area B is disposed above the position β. As shown in FIGS. 3A and 3B, The liquid initially enters heat exchanger 100 via inlet port 8. The liquid then flows to an inlet passage 116. Alternatively, heat exchanger 100 includes one or more inlet passages U6. As shown in Figures 3A and 3B, the liquid follows The mouth passage 116 flows from the inlet port 108 to the branch portion to the finger portion H8D. Further, the liquid flowing along the other portions of the inlet port 丨丨6 flows to the respective finger portions 1 18 B and 1 18 C, and so on. In Figure B, 'liquid to finger 丨丨 8 A is supplied to the interface hot spot a,

Page 27 1295725 ... 4 * -----------______________ V. INSTRUCTIONS (20) The wave body flows down the finger 1 1 8 A to the middle layer 1 0 4 . The liquid then flows through the inlet conduit 5A, which is below the finger U8A and then flows into the interface layer 1〇2 where it is subjected to heat exchange with the heat source 99. As mentioned above, the microchannels in interface layer 1 〇 2 can be configured in any orientation. Therefore, the microchannels 111 in the interface region A are arranged to be perpendicular to the remaining microchannels in the interface layer 1〇2. Therefore, the liquid from the conduit 1 0 5 A is transported along the microchannel 1丨丨, as shown in Fig. 3, although the other areas of the liquid/internal interface layer 1 〇 2 are transported. The heated body is then transported upwards through the conduit 1 0 5 B to the outlet finger} 2 〇 A.

Similarly, the liquid flows downward in the Z direction through the fingers 1丨8 £ and 丨丨8? to the intermediate layer 104. The liquid then flows down through the inlet conduit 丨〇 5 c in the z direction into the interface layer 102. The liquid then flows upwards in the direction from the interface layer i 〇 2 through the outlet conduit 105D to the outlet finger portions 12〇 and 12〇F. The heat exchanger 1 移除 removes the heated liquid in the branch layer 1 〇 6 via the outlet hand 邛 120, which is in communication with the outlet passage 122. The outlet passage 122 allows the liquid to flow out of the heat exchanger via an outlet 埠 1 0 9 . Preferably, the inlet fluid and the outflow fluid conduit are directly disposed or attached to the appropriate interface hot spot to directly supply the liquid to the ^^", and the configuration of the female-outlet finger 120 can be configured at most Close to the special interface robbery ^ WJ- x ... point ^ each finger finger 1 1 8 to minimize the pressure drop between them. Therefore, the liquid gift a 1πο ^, the body & enters the interface from the entrance finger 1 18Α: + The person transmits a distance from the bottom surface of the I y Y fit # layer / 〇 2 1 〇 3 a distance before the discharge interface layer 102 to the outlet finger portion 1 20A. It is quite obvious that the amount of liquid transported along the bottom surface 103 is The heat generated by the heat source 99 can be appropriately removed without generating unnecessary pressure & Further, as shown in FIGS. 3A and 3B,

Page 28 1295725 V. INSTRUCTIONS (21) The corners of the finger portion 1 18, 1 2 0 are curved to reduce the pressure drop of the liquid flowing along the finger portion n 8 .

It is obvious to those skilled in the art that the configuration of the branch layer 106 shown in Figure 3, Level 3B is for illustrative purposes only. The configuration of the path n 6 and the finger portion 1 18 in the branch layer 6 includes, but is not limited to, the location of the interface hot spot, the flow from the interface to the hot spot, and the heat generated by the heat source in the interface hot spot. The amount depends. For example, the possible configuration of the manifold layer 1 〇 6 includes the intersection of the parallel inlet and outlet fingers, which are alternately arranged along the width of the branch layer as shown in Figures 4-7A, as discussed below. Nevertheless, other configurations of the channel n 6 and the finger portion 1 18 can also be considered. Figure 4 illustrates a perspective view of another tube layer 4 〇 6 of the heat exchanger of the present invention. The panel 406 of Figure 4 includes a plurality of parallel liquid conduits 4 1 1 ' 4 1 2 ' of interlaced or crossed fingers which circulate single or two phase liquids to the interface layer 4 〇 2 without pressure drop to the heat exchanger 40 0 and system 30 (Fig. 2A). As shown in Fig. 8, the entrance finger portion 41 1 and the outlet finger portion 4 1 2 are arranged alternately. However, those skilled in the art will recognize that a certain number of inlet or outlet fingers can be arranged adjacent to one another' and thus are not limited to the configuration of Figure 4. In addition, the fingers can be designed to branch or interlace a parallel finger portion with another parallel finger portion. Therefore, there may be more than the entrance finger of the outlet finger and vice versa. The inlet finger or channel 4 1 1 supplies liquid into the heat exchanger to the interface layer 402, and the outlet finger or channel 412 removes liquid from the interface layer 40 2 and exits the heat exchanger 4000. The illustrated manifold layer 406 configuration allows liquid to flow into the interface layer 40 2 and transport a very short distance in the interface layer 420 before flowing to the outlet channel 41 2 . The decrease in the length of liquid transport along the interface layer 40 2 actually

Page 29 1295725 V. INSTRUCTIONS (22) The drop in heat exchanger 40 0 and system 30 can be reduced (Fig. 2A). As shown in Figure 4-5, another manifold layer 406 includes a channel 414 that communicates with the two inlet channels 411 and provides liquid thereto. The manifold layer 406 of Figures 8-9 includes two outlet passages 412 that communicate with the passages 41 8 . The channel 41 4 in the manifold layer 406 has a flat bottom surface for transporting liquid to the finger portion 411.

412. Alternatively, the inlet passage 41 4 has a small slope to assist in the transfer of liquid to the selected liquid passage 4 1 1 . Alternatively, the inlet channel 412 includes one or more apertures on its bottom surface 'which allows a portion of the liquid to flow down to the interface layer 4〇2. The channel 41 8 in the manifold section has a flat bottom surface containing liquid and transporting liquid to the crucible 40 8 . Alternatively, channel 41 8 has a slope to assist in the transfer of liquid to selected outlet port 408. In addition, the channels 414, 41 8 have a width of about 2 mm, and other widths are also contemplated.

Channels 414, 41 8 are in communication with turns 408, 409 which are coupled to four liquid lines 38 in system 3 (Fig. 2A). The manifold layer 406 includes a horizontal configuration liquid 408 408' 409. Alternatively, the manifold layer 40 6 includes a liquid 璋 408' 409' in a vertical or diagonal configuration as discussed below, but not shown in Figures 4-7. Or 'the branch layer 40 6 does not contain the channel 414. Therefore, the liquid is supplied directly from the crucible 4 to the finger portion 4 11 . In addition, the branch layer 4 1 1 does not include the passage 4 1 8 , and the liquid in the finger portion 4 1 2 flows directly into the parent exchanger 400 via the crucible 4 1 8 . Although the second 408 display is connected to the channel 4 1 4, 4 1 8 , other numbers can be utilized. The size of the inlet passage 411 allows liquid to be transferred to the interface, layer without pressure drop in the channel 411 and the system 30 (Fig. 2A). The width of the inlet passage 411 is and includes 0.25-5·00 πιιπ' although other dimensions are also contemplated. Further, the inlet channel 411 has a length dimension and includes 〇·5 mm to three times the heat source.

Page 30 1295725,. V. The length of the invention says ^ -. Alternatively, other lengths may also be considered. As described above, the inlet passage 4 11 extends downward to a height higher than the microchannel 41 , and the helium liquid is directly transferred to the microchannel 410. The inlet passage 411 has a height and includes 〇.25-5.0 mm. For those skilled in the art, although the inlet channels are of the same size, other different sizes are also possible. Alternatively, channel 411 has a variable width 'area size and a distance between adjacent fingers. In particular, channel 4 1 1 has regions of greater width or depth along its length, and regions of narrower width and depth. This variation allows more liquid to be transported over a wider area to a predetermined interface hot spot area of the interface layer 4 〇 2, while limiting the narrower portion to the warm spot area. In addition, the exit channel 4 1 2 has a size that allows liquid to be transported to the interface layer without creating a large pressure drop along the exit channel 41 2 and system 30 (Fig. 2A). The outlet passage 41 2 has a width dimension of and including 〇·25-5. 00 mm, and other dimensions are also possible. In addition, the outlet channel 4 1 2 has a length dimension and includes 0. 5mm to three times the length of the heat source. Further, the outlet passage 4 1 2 extends downward to the height of the microchannel 410, and the helium liquid tends to flow upward in the outlet passage 412 after flowing horizontally along the microchannel 410. The inlet passage 411 has a height in and including the range of 0.25-5.00 mm, and other height dimensions are also contemplated. It will be apparent to those skilled in the art that although the outlet passages 41 2 have the same size, the outlet passages 41 2 may have different sizes as may be considered. In addition, the outlet passages 41 can have different widths, cross-sectional dimensions, and/or different distances between adjacent fingers. The inlet and outlet passages 411, 41 2 are segmented and different from each other as shown in Figures 4 and 5, and the liquids are not mixed with each other in the passage. In particular, as shown in Figure 8,

Page 31 1295725 V. Description of invention (24)

The second outlet passage is located at the outer side edge of the branch pipe layer 406, and an outlet passage 4! 2 is located at the center of the branch pipe layer 4 〇 6. In addition, the two inlet passages 4 1 1 are configured to be adjacent sides of the central outlet passage. This particular configuration causes the liquid entering the interface layer 420 to transport a short smear in the interface layer 4 〇 2 before exiting the interface layer 4 〇 2 via the outlet channel 4 1 2 . However, it will be apparent to those skilled in the art that the inlet and outlet channels can be configured in any other suitable configuration and are therefore not limited to the configurations described herein. The number of inlet and outlet passages 4 11, 4 1 2 is more than three in the branch pipe layer 40 6 , but less than one centimeter per cross pipe branch layer 40 6 . It will be apparent to those skilled in the art that other numbers of inlet and outlet passages may be used without limitation to the number shown and described herein.

The manifold layer 406 is coupled to an intermediate layer (not shown) that is coupled to the interface layer 40 2 to form a three-layer heat exchanger 400. The intermediate layer discussed herein refers to the above in the embodiment shown in Figure 3B. The branch layer 40 6 may also be coupled to the interface layer 420 and disposed over the interface layer 420 to form a two-layer heat exchanger 4000 as shown in Figure 7A. Figures 6A-6C illustrate cross-sectional views of another tube layer 406 coupled to the interface layer 420 in a two-layer heat exchanger. Fig. 6A particularly illustrates a cross-sectional view of the heat exchange line 40 0 along the line A-A in Fig. 5. Further, Fig. 6B illustrates a cross-sectional view of the heat exchanger 400 along line B-B, and Fig. 6C illustrates a cross-sectional view of the heat exchanger 40 0 along line C-C of Fig. 5. As noted above, the inlet and outlet passages 411, 412 extend from the top surface to the bottom surface of the manifold layer 406. When the branch layer 068 and the interface layer 402 are coupled to each other, the inlet and outlet channels 411, 41 2 are slightly higher than the height of the microchannels 々I q in the interface layer 402. This configuration allows liquid from the inlet channel 4 11 to readily flow through the microchannel 4 1 0 from the channel 41 1 . In addition, in this configuration, the liquid flowing through the microchannel easily flows upward through the outlet after flowing through the micro-pass 遒 4 1 0

1295725 V. INSTRUCTIONS (25) Channel 4 1 2

In another embodiment, the intermediate layer 104 (Fig. 3B) is disposed between the manifold layer 406 and the interface layer 402, but is not shown in the figures. The intermediate layer 1 〇 4 (Fig. 3B) transports the liquid to the designated interface hot spot in the interface layer 420. In addition, the intermediate layer 104 (Fig. 3B) can be used to provide uniform flow of liquid into the interface layer 4 〇 2 . In addition, the intermediate layer 104 can be used to provide a liquid to the interface layer 40 2 interposer hot spot to properly cool the hot spot and cause a uniform temperature in the heat source 99. The configuration of the inlet and outlet channels 411' 41 2 is close to or above the hot spot in the heat source 99 to properly cool the hot spot, but is not required. Figure 7A illustrates a perspective view of another tube layer 406 of the present invention having another interface layer 1〇2. The interface layer 102 includes successively arranged microchannel walls no as shown in Figure 3B. In operation, similar to the preferred manifold layer 1 〇6 shown in Figure 3B, the liquid enters the manifold layer 406 in the liquid helium 40 8 and passes through the channel 4 1 4 and to the liquid finger or channel 4 11 . The liquid enters the opening of the entrance finger portion 4 11 and the length of the finger portion 4 11 flowing in the X direction as indicated by the arrow. Further, the liquid flows downward in the Z direction to the interface layer 402, which is disposed below the branch pipe layer 406. As shown in FIG. 7A, the liquid in the interface layer 40 2 flows laterally along the bottom surface in the X and Y directions of the interface layer 40 2 and exchanges heat with the heat source 9 9 . The heated liquid flows upward in the Z direction through the outlet finger portion 4 1 2 to discharge the interface layer 410, and the outlet finger portion 4 1 2 transports the heated liquid in the X direction to the channel 4 18 in the branch pipe layer 406. The liquid then 'flows along channel 4 1 8 and exits through 埠 4 0 9 and exits the heat exchanger. The interface layer shown in FIG. 7A includes a series of trenches 4 1 6 disposed between each set of microchannels 410, which can assist in transporting liquids to and from the channels 411.

苐 Page 33 1295725, 'Five' invention description (26) 4 1 2. The groove 4 1 6 A is located particularly directly below the inlet passage 4 1 1 of the branch pipe layer 406. The liquid entering the interface layer 1 经 2 via the inlet passage 411 is directed to the microchannel adjacent the groove 4 1 6 A. Thus, the grooves 416 A allow liquid to be transported directly from the inlet passage 411 to a specially designated flow path as shown in FIG. Similarly, the interface layer 40 2 includes a trench 416B that is located directly below the Z-direction exit channel 41 2 . Therefore, the liquid horizontally transferred to the outlet passage along the microchannel 410 is horizontally transferred to the groove 416B and vertically to the outlet passage 412 above the groove 416B.

FIG. 6A illustrates a cross-sectional view of a heat exchanger 400 having a manifold layer 406 and an interface layer 402. Fig. 6A particularly shows that the inlet passage 4 11 and the outlet passage 41 2 are interwoven, so that the liquid of the inlet passage 411 flows downward and the liquid of the outlet passage 41 2 flows upward. Further, as shown in Fig. 6A, the liquid flows horizontally through the microchannel 410, which is disposed between the inlet passage and the outlet passage, and is separated by the grooves 416A, 416B. Alternatively, the walls of the microchannels are continuous (Fig. 3B) and are not separated by microchannels 410. As shown in Fig. 6, the inlet and outlet channels 411, 412 have curved surfaces 420 at their ends and near the slots 41. The curved surface 42 0 directs the liquid to flow down to the channel 411 and to the microchannel 41 0, which is located adjacent the channel 411. Therefore, the liquid entering the interface layer 102 is easily guided to the microchannels 4 1 〇 instead of directly to the trenches 4 1 6 A. Similarly, the curved surface 4 2 0 in the outlet channel 4 1 2 assists the flow of liquid from the microchannel 410 to the outlet channel 412. In another embodiment, as shown in FIG. 7B, the interface layer 4 0 2 ' includes an inlet channel. 411, and the outlet passage 41 2, as discussed with the manifold layer 40 6 (Figs. 8-9). In another embodiment, the liquid is supplied directly from the 埠4 0 8 ' to the interface layer

1295725 V. Description of invention (27) 4 0 2’. The liquid is directed along the set of micro-passes and the flow-through outlet is 4 1 8 ', and the liquid is in the 4 0 9' configuration at 7A). For the exchanger, the water is displayed in a vertical position on the adjacent outlet through-layer. And any other layer of the natural layer

Channel 414 is transmitted to the track 41' and the track 412'. At this point, the liquid passes through the 埠400, the flow layer of the layer 4, and is also operated by the skilled person. When the heat exchange is performed, the heat exchanger is above the heat exchanger. Therefore, the transfer to the exit channel configuration can be used, the inlet channel 411. The liquid then crosses $, (not shown) for heat exchange, which flows along the outlet passage 4 1 2 to the passage outlet interface layer 402. The crucible 408, can be configured in the manifold layer 40 6 (although all of the heaters in the present invention can also be operated in a vertical position. When configured to allow each inlet channel to pass liquid through the inlet channel) It is very obvious that the branch layer and interface are used to make the heat exchanger operate in a vertical position.

圃图θ图 illustrates a top view of another embodiment of the tube layer 205 of another embodiment of the heat exchanger of the present invention, using another tube layer, such as a flat and vertical line, or an effective plurality of liquids. Figure]: Top view of 204 and interface layer 2〇2. Further, Fig. 9 illustrates a three-layer heat exchanger of the layer = 0.6, wherein Fig. 9 illustrates the use of a two-layer heat exchanger of 206. =8 and 9 do not, the branch layer 2 〇 6 includes a plurality of liquid 埠 2 〇 8 into water configuration. Alternatively, the liquid 埠2 〇 8 is located diagonally to the branch layer 2 〇 6 . The liquid 埠 2 0 8 times the selected position of the branch layer 20 6 and the liquid is transferred to a predetermined interface hot spot in the heat exchanger 200. Bee 2 0 8 provides a sufficient advantage because liquid can be transported from one liquid to a special interface hot spot without significantly increasing the pressure drop.

1295725 V. INSTRUCTIONS (28) Heat exchanger 2000. In addition, the liquid 埠2 0 8 is also disposed in the branch layer 206 to allow the liquid in the interface hot spot to be transported for a shortest distance to the outlet 02 0 8, the liquid reaches temperature uniformity, and the inlet and outlet 埠2 can be maintained. The minimum pressure drop between 0 and 8. In addition, the use of the manifold layer 206 assists in stabilizing the two-phase liquid flow in the heat exchanger 200 and the uniform liquid flow distributed across the interface layer 20 2 . It should be noted that more than one branch layer 20 6 may be included in the heat exchanger 200, so that one tube layer 206 may route liquid into and out of the heat exchanger 200, another tube layer (not shown) Control the flow rate of the liquid to the heat exchanger 2000. Alternatively, all of the plurality of branch layers 206 are circulated through the liquid to the selected hot spot in the interface layer 202. The other tube layer 20 6 has a lateral dimension that closely matches the size of the interface layer 20 2 , and the branch layer 206 has the same dimensions as the heat source 9 9 . Alternatively, the manifold layer 206 is larger than the heat source 99. 1-1 0毫米范围内。 The vertical dimension of the branch layer 2 0 6 is 0. 1-1 0mm range. Further, the size of the pores in the branch layer 206 of the liquid 埠20 is 1 mm and the full width or length of the heat source 909. Figure 11 illustrates a perspective view of a three-layer heat exchanger of the present invention having another manifold layer 206. As shown in Fig. 11, the heat exchanger 200 is divided into separate zones depending on the amount of heat generated along the body of the heat source 99. Each zone is separated by a vertical intermediate layer 20 4 and/or by a microchannel wall 2 1 0 of the interface layer 2 0 2 . It is obvious to those skilled in the art that the assembly of Fig. 11 is not limited to the illustrated configuration and is for illustrative purposes only. Heat exchanger 200 is joined to one or more pumps, one pump is coupled to inlet 208A and the other pump is coupled to inlet 208B. As shown in FIG. 3, the heat source 9 9 has a hot spot at the position A, and the position B has a temperature.

Page 36 1295725 V. INSTRUCTIONS (29) Point 'The hot spot in position A produces more heat than the temperature point in position b. It is obvious that the heat source 9 9 can have more than one hot spot and temperature point at any position and at a fixed time. In this example, because the position A is a hot spot, the heat of the position A is more transferred to the interface layer 2 〇 2 above the position A (designated as the interface hot spot area A in the figure), which is more liquid and/or higher. The flow rate of liquid is supplied to the interface hot spot area A in the heat exchanger 2 to properly cool the position a. It will be apparent that although the interface hotspot B shows a larger interface hot spot a, the interface hotspot level B and other interface hotspots in the heat exchanger 200 may be of any size and/or configuration.

Alternatively, as shown in Fig. 11, the liquid enters through the liquid helium 202A and flows along the intermediate layer 220 to be directed to the interface hot spot A and then to the incoming fluid conduit 205A. The liquid then flows in the direction of the conduit 2〇5Αα z into the interface hot spot area A in the interface layer 2〇2. The liquid flows between the microchannels 2 1 〇 a, so the heat from the position A is transferred to the liquid via the conduction of the interface layer 220. The heated liquid interface layer in the hot spot area A 2 0 2 flows to the exit 埠 2〇9A, the liquid is in ^

The heat exchanger 200 is discharged. It will be apparent to those skilled in the art that any number of ports 208 and 埠 20 9 may be used for a particular interface hotspot or a set of interface hotspots. In addition, although the outlet 埠20 9_ is shown to be close to the interface layer 2 Α 2 Α, the outlet 槔 209 Α can also be located in any other vertical position, including to the branch layer 2 0 9 Β. In one example, the heat source 99 has a temperature point at the location, and the position of the source of the sputum is... heat. The liquid entering through 埠208 is guided by the flow of the :: 204Β to the interface hot spot β and flows to the human body guide 2 0 5Β. The liquid then enters the fluid conduit 2〇5 like a ζ direction

Page 37 1295725 '4 i V. Description of the invention (30) % interface layer 2 0 2 interface hotspot area Β. The liquid flows between the microchannels 201 in the X and gamma directions, so that the heat is generated in the position enthalpy and the transfer wheel enters the liquid. The heated liquid flows along the entire surface layer of the interface hot spot 22 0 2Β and flows out to the outlet 埠2 0 9Β through the outflow conduit 2 0 5Β in the intermediate layer 2 0 2 , where the liquid The heat exchanger 200 is discharged. Alternatively, as shown in Figure 9A, the heat exchanger 200 may include a permeable vapor barrier 214 disposed above the interface layer 220. The permeable vapor membrane 214 is in sealing contact with the inner wall of the heat exchanger 200. The configuration of the membrane has a plurality of small pores such that vapor generated along the interface layer 2 〇 2 can pass through to 埠 209. The diaphragm 2 14 can also be configured to be watertight to prevent liquid fluid from passing through the pores of the membrane layer 2 〇 2 through the membrane 2 14 . The details of the permeable vapor membrane 11 4 are discussed in the commonly-owned U.S. Patent Application Serial No. 10/36,162, filed in the "Vapor Removal Microchannel Heat Exchanger" This patent application is incorporated herein by reference. FIG. 12A illustrates a perspective view of a preferred heat exchanger 3 of the present invention. Figure 2a shows another heat exchanger 300 of the present invention, a perspective view of which is shown in Figures 12A and 12B. Heat exchangers 300, 300' include an interface layer 302, 322, and branch layers 306, 306' are coupled thereto. The heat exchangers 3, 3, as described above, are coupled to a heat source (not shown) or integrated with the heat source within the heat source (dissipated into the microprocessor). It is apparent to those skilled in the art that the interface layer 3〇2, 302 is actually closed, as shown in Figure 12A. For illustrative purposes only. The interface layer 3 0 2, 302' preferably includes a plurality of columns 3〇3 disposed along the bottom surface 3〇丨. In addition, the cylinders 3 0 3 can be any shape as discussed in Figure 1 {^ - 1〇£ and/or radially distributed fins 3 0 3E. Interface layer 3 0 2 can have any characteristics as discussed above

Page 38

1295725 ----~- V. Description of invention (31) f (ie microchannel, rough surface). The characteristics of the interface layer 302 and the layer 203 are preferably of the same thermal conductivity characteristics as discussed above and will be discussed again in the preferred embodiment. Although the interface layer 320 shows a smaller size than the manifold layer 306, it will be apparent to those skilled in the art that the interface layer 3 〇 2 and the branch layer 3 〇 6 and the heat source 99 can be of any size. The other layers of the interface layer 3〇2, 3〇2 have the same characteristics, as described in the interface layer, and will not be described in detail. The L-hanger is preferably a hot father-changing 30 0 that can utilize the transmission channel 3 2 2 of the branch pipe layer 3 2 to minimize the pressure in the heat exchanger. The pass channel 3 2 2 is vertically disposed in the branch pipe layer 30 6 and vertically supplies liquid to the interface layer 3〇 2 to reduce the pressure drop in the hot parent exchanger 300. As described above, the pressure drop is established or increased in the heat exchanger 300 because the liquid flows in the X and γ directions along the interface layer for a substantial period of time and/or a distance. The manifold layer 3 〇 6 enters the interface layer 3 0 2 by a plurality of transfer channels 3 2 2 in a vertical forced liquid to minimize liquid flow in the X and γ directions. In other words, a plurality of liquid nozzles are directly applied to the interface layer 203 from above. The transfer channels 3 2 2 are disposed at an optimum distance from each other such that the liquid flows in the X and Y directions minimally and vertically upwards out of the interface layer 3 〇 2 . Thus, the individual liquid path forces from the optimally configured channel 32 2 naturally cause the liquid to flow out of the interface layer 320 in the upward liquid path. In addition, the individual channels 3 2 2 maximize the distribution of the liquid flow in the plurality of channels 3 2 2 of the interface layer 302, thereby reducing the pressure drop in the heat exchanger and effectively cooling the heat source 99. In addition, the preferred configuration of the heat exchanger 300 allows the heat exchanger to be smaller than other heat exchangers' because the liquid does not need to travel a large distance in the X and gamma directions, so that the heat source 9 9 can be properly cooled. The preferred manifold layer 306 shown in Figure 12A includes two individual levels. Branch pipe

Page 39 1295725 V. Description of invention (32) = level 3°8 and level 312. Level 3_ is connected to the interface layer. It is fine for this artist to configure the position 312 above the level 3 0 8 . For those skilled in the art, they can also be deployed on the second day.宂 is very obvious, any number according to the invention #麻, 2β does not have another official layer 3 0 6, including three individual levels. The official level 3〇6 special interest includes a circulation level of 3〇F:-:: level 3〇8, and a fork=“slavery pass level 304, fit to interface layer 302, and level 3 08 ,. Bit ^

The standard is 3〇4, and the level is 312. Although the figure-month position is placed on the level 308, it is reasonable for the skilled person to consider the level to be configurable above the level 31 2'. It will be apparent to those skilled in the art that any number of levels in accordance with the present invention can be implemented. Figure 12C shows a perspective view of the flow level 3〇4 of the present invention. The flow level 3〇4Π includes a top surface 304A and a bottom surface 304B. As shown in Figures 12B and 12C, the flow level 3 0 4 'Includes a plurality of pores 3 2 2 extending throughout. In one embodiment, the open bottom surface of the 'pores 3 2 2 ' is flush, or the pores 3 2 2' extend beyond the bottom surface 3〇4Β, To supply liquid close to the interface layer 3〇2.

In addition, the flow level 304 includes a plurality of apertures 324 extending from the top surface 304Α to the bottom surface 3 0 4 Β and vertically projecting as a cylindrical protrusion at a predetermined distance in the Ζ direction. It is obvious to those skilled in the art that the apertures 322, 3 2 4 ' can also extend through the flow level at an angle and need not be completely vertical. As described above, in one embodiment, the interface layer 3 0 2, (Fig. 12A) is coupled to the flow level 34, the bottom surface of the frame 04. Therefore, the liquid flows through the pores 3 22' only in the direction of the weir into the interface layer 3 0 2, and flows through the pores 324 in the weir direction, while the liquid

4 (Γ 12 1295725 - *, V, invention description (33) ^ an interface layer 3 0 2 '. As discussed below, through the pores 32 2, the liquid entering the interface layer 3 0 2' and via the aperture 324, The liquid exiting the interface layer is separated by the flow level 3 0 4 '. As shown in Fig. 12C, 'the aperture 324, preferably a cylindrical member extending from the top surface 3Q4A of the flow level 34' in the z direction, The liquid flowing through the pores 324 flows directly to the level 312, the narrow channel 326 (Figs. 12 and 12G). The cylindrical protrusions are preferably circular as shown in Fig. 12C, but other shapes are also possible. The interface layer 3 0 2, the liquid flows from each of the pores 32 2 to the adjacent pores 324 in a lateral direction and a vertical direction. The pores 32 2, and 324 are preferably thermally insulated from each other 'the vial layer 306 The heat present in the interface layer 302' to heat the liquid is not transferred to the cooled liquid flowing through the manifold layer 306, to the interface layer 302. Figure 1 2D illustrates the preferred implementation of the present invention. For example, the level 30 8 includes a top surface 308 A and a bottom surface 308B. The bottom surface 308 B of the level 30 8 is preferably directly surfaced to the interface. Layer 302, as depicted in Figure 12 A. Level 30 8 includes a concave elongated channel 320 that includes a plurality of liquid transport channels 322 for transporting liquid to interface layer 302. The concave elongated channel 32 0 is in sealing contact with interface layer 302 Wherein the liquid present in the interface layer 30 2 surrounds and flows between the channels 3 2 2 in the elongated channel 3 20 and exits through the 埠 3 1 4#. It should be noted that the liquid present in the interface layer 30 2 does not enter. Transmission channel 322. 丨/" Figure 1 2 E illustrates a perspective view of the underside of another embodiment of the present invention. The level 308' includes a top surface 308 A, and a bottom table animal 308B, The bottom surface of the quasi-308B' is directly coupled to the flow level 3〇4, (Fig. 12C). The level 3 0 8 ' preferably includes a 埠 3 1 4 ', a narrow channel 3 2 0 , and a plurality of apertures 322 ' 324' in the bottom surface 308B'. It is very clear to those skilled in the art.

T295725

_, level 308, may include a number of enthalpy and narrow apertures 322', 324 configured to face the flow channel of Fig. 12, and the aperture 322, as shown in Fig. 12E, is directed into the elongated pass 304. In particular, ^ ^ ^ 312- 324^ 324^ ^ ^ ^ Road 320,. Pores 324, individually and separated, narrow and long in 俾308’

It does not flow with the relevant pores 324, the cylindrical liquid: the liquid of the gap 324 Q9H plus α丨, the round opening / the liquid is combined and contacted. The pores 3 4 ί := two enter each pore to 4, and the liquid flows through the liquid path along the pores 3 24 k. The apertures 324 are preferably of a vertical configuration. Therefore, the liquid is vertically transported through the main portion of the branch layer 3〇6. Same as this

The defect A is used for the aperture 322', especially where the level is placed between the interface layer and the level.

Although the pores or holes 32 2 are shown to have the same size, the pores 32 2 may have different diameters or vary along a length. For example, the hole 322 near the crucible 314 can have a smaller diameter to limit liquid flow. The smaller hole 322 can therefore force the liquid to flow downward from the aperture 322, which is further from the bore 314. The change in diameter of the hole 322 allows a more even distribution of the liquid into the interface layer 3〇2. It is obvious to those skilled in the art that the diameter of the hole 322 can be varied to address the cooling of the known interface hot spot in the interface layer 3〇2, which is apparent to those skilled in the art, and the above discussion can also be applied to the aperture 324. The apertures 324 are sized or varied to accommodate a uniform outward flow of the self-intermediate layer 320. In a preferred embodiment, crucible 31 4 provides liquid to level 3 〇 8 and to interface layer 203. Preferably, the crucible 314 of Figure 1 extends from the top surface 3 08A through a portion of the body of the level 308 to the elongate channel 3 2 0. Alternatively, 埠 314 extends from the bottom or side of the level 3 0 8 to the narrow channel 3 2 〇. Preferably 埠3 〇 4

Page 42 1295725 V. INSTRUCTIONS (35) η is coupled to 埠315 in the level 31 2 (Fig. 12Α-12Β). The crucible 31 4 is guided to the elongated channel 320' which is closed as shown in Fig. 12C, or the recess is as shown in Fig. 12D. The elongated channel 32 0 preferably transports the liquid self-intermediate layer 30 2 to the crucible 314. The narrow channel 3 2 0 can also transport liquid from 埠 3 1 4 to interface layer 3 0 2 . As shown in Fig. 1 2 F and 1 2 G, 埠 3 1 5 of the level 3 1 2 is preferably aligned with and communicated with 埠 3 1 4 . As shown in Fig. 12, the liquid preferably enters the heat exchanger 300 through the crucible 3 16 and flows downward through the narrow passage 3 2 8 from the transport passage 32 2 , and gradually flows to the interface layer 302. As shown in Fig. 12A, the liquid can enter the heat exchange 5|300' preferably via 315' to enter and flow through the level 314' of the crucible 314', and gradually flow to the interface layer 302. The crucible 315 in Figure 12F preferably extends from the top surface 31 2A u through the body of the level 3 1 2 . Alternatively, 埠3 1 5 extends from one side of the level 3 1 2 > side. Alternatively, level 312 does not include crucible 315 and liquid enters heat exchanger 300 via crucible 314 (Figs. 1 2 D and 1 2 E ). In addition, level 3 1 2 includes 玮 316, which preferably transports liquid to the elongated channel 328. It is obvious to those skilled in the art. The level can include any number of squats and narrow passages. The elongated channel 3 28 preferably transports liquid to the transfer channel 322 and gradually to the interface layer 302. Figure 1 2 G illustrates a perspective view of another embodiment of the present invention. Level 312 is preferably coupled to level 3 〇 8 in Figure 12E. As shown in Fig. 12F, the level 312' includes a concave elongated channel region 328 which is exposed along the bottom surface & 312B in the body. The concave elongated channel 328 is in communication with the crucible 316 so that liquid can be transferred directly from the concave elongated channel 328' to the crucible 316. A concave elongated channel 328 is located above the top surface 3 0 8A of the level 3 0 8 to allow liquid to be freely transported upwardly from the aperture 324 to the elongated channel 328. Concave narrow channel 32〇, and bottom

Page 43 1295725 V. Description of the Invention (36) The periphery of the surface 312B is sealed to abut against the level 312, the top surface 3 0 8A', and all of the liquid from the aperture 324 can flow through the elongated channel 328 to埠 316. Each of the apertures 330 of the bottom surface 312B' is aligned with and communicated with the corresponding aperture 321 of the level 330, the level 3 0 8 ', (Fig. 12E), the aperture 33 〇, and the level 3 0 8 ' (Fig. 12E) The top surface is 3 0 8A, flush. Alternatively, the apertures 3 30 have a diameter slightly larger than the corresponding apertures 3 2 4 ', extending through the apertures 3 3 〇 into the elongated channels 3 2 8 '.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 2 is a cross-sectional view showing a preferred heat exchanger of the present invention taken along line Η-Η of Figure 12A. As shown in Fig. 1, the interface layer 310 is bonded to the heat source 9 9 . As described above, the heat exchanger 300 can be integrated with the heat source 9 as an element. The interface layer 3 2 is brought to the bottom surface 308 of the level 308. In addition, the level 31 2 is preferably coupled to the level 3 0 8 such that the top surface 3 0 8 位 of the level 3 0 8 is the bottom surface 31 2B sealed against the level 3丨2. The narrow channel 320 of the quasi-300 is in communication with the interface layer 302. In addition, the elongated channel 328 in the level 31 2 communicates with the aperture 322 in the level 308. The bottom surface 31 2B of the level 3 12 and the top surface 3 0 8A of the level 3 08 are sealed, and the liquid does not leak between the two positions 3 0 8, 3 1 2 .

Figure 121 is a cross-sectional view showing another heat exchanger of the present invention taken along line I-I of Figure 12B. As shown in FIG. 1 2 I, the interface layer 302 is coupled to a heat source 909. The interface layer 3 0 2' is coupled to the bottom surface 3 04B of the flow level 3 04'. The flow level 3〇4 is also coupled to level 3 0 8', the flow level 304, the top surface 304A, and the bottom surface 308B' of the level 308' are sealed. In addition, level 312 is preferably consuming to level 308' such that top surface 308A of level 3 08' is sealed from level 312, bottom surface 312B'. The narrow channel 32 位 at the level of 3 0 8' is connected to the pores in the top surface 3 04A' of the flow level 3 0 4'.

Page 44 1295725 V. Description of invention (37) Leakage at the level. In addition, the level 3 1 2, the narrow channel 3 2 8 ' communicates with the pores in the top surface 3 08A' of the flow level 3 0 8', so that the liquid does not leak between the two positions.

In a preferred operation, as indicated by the arrows in Figures 12A and 12H, the cooled liquid enters heat exchanger 300 via 埠31 6 in level 312'. The cooled liquid is transported downwardly from the crucible 31 6 to the elongated channel 328 and down through the transport channel 322 to the interface layer 320. The cooling liquid in the narrow channel 32 0 is not mixed and contacted with the heating liquid in the heat exchanger 30 0 . The liquid entering the interface layer 30 2 is heat exchanged with the heat source 9 9 and absorbs heat generated by the heat source. The pores 3 2 2 are optimally arranged, and the helium liquid flows a minimum distance in the X and Y directions of the interface layer 320 to minimize the pressure drop in the heat exchanger 300 and to effectively cool the heat source 9 9 . The heated liquid then flows upward in the Z direction at the interface layer 320 to the elongated channel 320 in the level 3 0 8 . The heating liquid present in the branch layer 30 6 is not mixed and contacted with the cooling liquid entering the branch layer 306. The heated liquid enters the narrow channel 3 2 0 and is then transferred to the crucible 3 1 4, 3 4 5 and then discharged to the heat exchanger 300. It will be apparent to those skilled in the art that the liquid can flow in the opposite direction as shown in Figures 12A and 12H without departing from the scope of the invention.

In another operation, as shown in Figs. 1 2 B and 1 2 I, the cooled liquid passes through the level 312, the middle 316, and enters the heat exchanger 300'. The cooled liquid is transferred from the crucible 3 1 5 to the crucible 314' in the level 30 8'. The liquid then flows into the narrow channel 3 2 0 ', and flows through the pores 3 2 2 ' in the flow level 3 0 4 ' to the interface layer 3 0 2 '. However, the liquid cooled in the narrow channel 3 2 0 ' is not mixed or contacted with any liquid heated in the heat exchanger 300'. The liquid entering the interface layer 3 0 2 ' performs heat exchange with heat generated in the heat source 9 9 and absorbs the heat. As discussed below

Page 45

1295725 _—,... ^ _ V. OBJECT DESCRIPTION (38) The arrangement of pores 3 2 2 'and pores 3 2 4 ' allows liquid to be transported from each pore 3 2 2 ' along the interface layer 3 0 2 ' It is better to approach the distance to an adjacent aperture 3 2 4 ' to reduce the pressure drop during the period and effectively cool the heat source 9 9 . The heated liquid then self-intermediate layer 3 0 2 is transported upward through the plurality of apertures 3 2 4 ' in the Z direction through the level 3 0 8 ' and to the level 3 1 2, the narrow channel 3 2 8 '. The heated liquid does not mix or contact with the cooling liquid entering the manifold layer 306, as it travels through the apertures 324. The heated liquid enters the narrow passage 328' in the level 3 1 2 ', flows to the crucible 31 6' and exits the heat exchanger 30 0'. It will be apparent to those skilled in the art that the liquid may also flow in the opposite direction to that of Figures 1 2 B and 1 2 I without departing from the scope of the invention. In the preferred manifold layer 306, the arrangement of the apertures 32 2 minimizes the flow of liquid in the interface layer 302 and the heat source 9 9 can be suitably cooled. In another tube layer 3 0 6', the aperture 322, and the aperture 324, are arranged to minimize the flow of liquid at the interface layer 3 0 2' and to properly cool the heat source 9 9 . The pores 3 2 2 '' 3 2 4 in particular provide a vertical liquid path for the liquid stream to be minimal in the X and Y transverse directions of the heat exchanger 3 0 0 '. Therefore, the heat exchanger 3 0 〇, 300 0 'can reduce the distance that the liquid must flow and can properly cool the heat source 9 9 while 'significantly reducing the heat exchanger 3 〇〇, 3 〇〇, and the system 3 〇 , 30' (Fig. 2A - 2B) pressure drop. The particular arrangement and cross-sectional dimensions of the pores 3 2 2 and/or the pores 3 2 4 are related to factors including, but not limited to, fluid conditions, temperature, heat, heat generated by the source, and liquid flow rate. It should be noted that although the following discussion relates to apertures 322, 324, this discussion can only be applied to aperture 32 2 or aperture 3 24 . The pores 3 2 2 ′ 3 2 4 are spatially separated from each other by an optimal distance, so when the heat source

Page 46 1295725_ • ‘ ... —— V. INSTRUCTIONS (39) 9 9 When properly cooled to the desired temperature, the pressure drop is minimized. The arrangement and maximum distance of the apertures 3 22 and/or apertures 324 of the preferred embodiment optimize the independent separation of the pores 3 2 2, 3 24 and the liquid path through the dielectric layer 3, typically 0. This is achieved by changing the size and location of individual pores. Moreover, the arrangement of the apertures in the preferred embodiment also substantially increases the total flow rate = distribution of the incoming interface layer, and the area of the area cooled by the liquid entering each of the apertures 322. The knife in one embodiment, the aperture 3 22,324 is configured in the manifold layer 3〇6 as an interactive configuration or a checkerboard pattern, as shown in Figures 13 and 14. Each aperture μ/, 324 is separated by a small distance and the liquid must be transported in the checkerboard pattern. The apertures 322' 324 must be separated from each other by a sufficient distance to provide a cooling liquid to the interface layer 320 - sufficient time. As shown in Figures 13, 14, preferably a plurality of apertures 32 2 are adjacent to the corresponding number of apertures. With w5, and likewise, the liquid entering the interface layer 30 2 is transported a shortest distance along the interface layer 302 before exiting the interface layer 3〇2. Therefore, as shown, preferably 324 is radially distributed to each other. To assist the liquid from the aperture 322 to pass the wheel + the shortest distance to the nearest aperture 324. Example #, 如目13*, the liquid entering the interface layer 322 through 322 is subjected to the minimum resistance + the operation / the aperture hole 324 In addition, the apertures 322, 324 are preferably rounded to an adjacent shape. Circular, but also other, in addition, as described above, although the apertures 324 are in the dry 3, the level 3G8, 31 2 protrudes into the cylindrical member, and any position in the self-support layer 30 6 protrudes. Preferably =... has a rounded surface to assist in reducing the heat branch V

1295725

The optimum distance configuration and size of the pores 3 2 2, 324 is related to the amount of temperature of the liquid along the interface; The cross-sectional dimension of the liquid path in the pores 3 2 2, 3 2 4 must be large enough to reduce the pressure drop in the heat exchanger 3 〇 , which is very heavy. When the liquid is only subjected to single-phase liquid flow along the interface layer 3 ’ 2, each of the pores 32 2 is preferably surrounded by a plurality of adjacent pores 3 2 4 in a symmetrical hexagonal arrangement, as shown in FIG. Moreover, the number of pores in the flow level 300 in terms of a single phase liquid stream is preferably about equal. Moreover, in the case of a single phase liquid stream, the apertures 322, 324 preferably have the same diameter. It is obvious to those skilled in the art that other arrangements and any ratio of pores 3 2 2, 3 2 4 can be considered.

In the case where the liquid is subjected to a two-phase liquid flow along the interface layer 302, the pores 3 2 2, 3 2 4 are preferably asymmetrically arranged to accommodate the acceleration of the two-phase liquid. However, the symmetrical arrangement of the pores 3 2 2, 324 is also considered for the two-phase liquid flow. For example, the apertures 3 22, 324 may be symmetrically arranged in the flow level 304 such that the apertures 3 24 have a larger opening than the aperture 32 2 . Alternatively, the hexagonal symmetrical arrangement shown in Figure 13 is used for the flow level 3 0 4 for the flow of the two-phase liquid, because, more than the pores 32 2 2, the pores 3 2 4 appear in the flow level 3 0 4 in.

It should be noted that the apertures 3 2 2, 3 2 4 in the flow level can be alternately arranged to cool the hot spots of the heat source 99. For example, the two pores 3 2 2 are alternately arranged with each other as a neighbor 7 in the flow level 3 0 4 , and therefore, the two pores 32 2 are disposed near or above the _ interface hot spot. It is apparent that a suitable number of apertures 3 2 4 are disposed adjacent to the two apertures 3 2 2 to reduce the pressure drop in the interface layer 302. Thus, the two apertures 3 2 2 supply cooling liquid to the interface hot spot to force the interface hot spot to be _ uniform, actually equal temperature.

1295725 V. Description of invention (41)

The preferred heat exchanger 30 0 has important advantages over other heat exchangers as described above. The preferred configuration of the heat exchanger 3 is because the pressure drop of the vertical liquid path is reduced, and a pump of moderate performance can be utilized. In addition, the preferred heat exchanger 300 configuration optimizes the inlet and the liquid path along the interface layer 3 〇 2 independently. In addition, independent levels can be used to achieve a custom design basis to reduce the transfer pressure drop and optimize the size of each component. The preferred configuration of the heat exchanger 300 also reduces the pressure drop in the system where the liquid is subjected to two phases = body flow and can therefore be used in both single and two phase systems. As discussed below, the Che-Jia heat exchanger can be fitted with many different manufacturing methods and the geometry of the components can be adjusted for tolerance purposes. 1 to = discuss how the various layers in the heat exchanger 100 and heat exchanger 100 are made. The preferred and further heat exchangers suitable for use in the present invention are discussed below. Although the heat exchanger and layers of Figure 3B are shown separately, they are shown separately. "It is very obvious to those skilled in the art, although the construction/manufacturing method is relevant to the present invention. The details of the manufacturing method are also applicable to other heat exchangers and the use of one/night body inlets and one liquid layer of two and three layers of heat. The switch, as shown in Figures 1A-1C. A S is good - equal to the thermal expansion coefficient of the thermal expansion coefficient (CTE) of the heat source 99. Therefore, the interface layer preferably expands and contracts with the heat source 909. Or the CTE of the material of the interface layer 320 is different from the CTE of the heat source material. The interface layer 3 0 2 is made of Shi Xi as a material, and its CTE can be combined with the heat source 99i, CTE, and has sufficient thermal conductivity to properly transfer heat to the liquid from the heat source 9 9 . However, other materials = can be used for the interface layer 3〇2, which has a CTE that can be combined with the heat source 99. The interface layer preferably has a high thermal conductivity so that there is sufficient conduction to pass

Page 49 1295Ί21 V Description of invention (42) Heat is caused by

Between the source 99 and the liquid flowing along the interface layer 302, the heat source 99 does not. The interface layer is preferably made of a material having a high thermal conductivity of 1 〇〇 w/mk. However, it is apparent to those skilled in the art that the thermal conductivity of the interface layer 3 〇 2 is less than or equal to 100 W/mk and is limited by this value. "A system is preferably a high thermal conductivity interface layer. Preferably, the semiconductor substrate such as a germanium layer can be made of any other material, including but not limited to a single I genus, in Lu's and copper, Kovar, Shi · ink, iron, Mixed = when alloy. Other materials of interface layer 302 are patterns or modes

The interface shows that the tantalum layer is preferably coated with a coating 112 to protect the heat exchange characteristics of the interface layer. The coating 112 =, 1 β is chemically protected to eliminate the chemical interface between the liquid and the interface layer 302. The interface layer 302 is etched when it contacts the liquid, and thus will deteriorate in time/time. The coating 112 is a thin layer of nickel having a thickness of about im to be plated on the surface of the interface layer 302 to chemically purify any other material and does not substantially change the thermal characteristics of the interface layer 3〇2. Any coating having a suitable layer thickness may also be considered. The interface layer 302 is formed, ά: ί 2 is made of a copper material by a thin nickel coating etching method to form a plastic or a ruthenium 3 0 2 . Alternatively, the interface layer 302 is composed of an inscription, a stone substrate, and it. The interface layer 30 2 is coated with a coating material of a poor thermal conductivity material, such as a coating material, to improve the thermal layer of the interface layer 3〇2, and to form a layer of the interface layer 302 along the bottom of the interface layer 302. Apply a suitable metal seed layer to the surface and apply an appropriate voltage to the seed layer

Page 50 1295725

The electrical connection is made. The electrical connections thus form a thermal conduction layer on top of the interface layer 30 2 . The electrical formation method also constitutes the S material 112 - the characteristic size of the micron. The interface layer 322 can be electroplated by electroforming in the case of 10 - 100. Further, the interface layer may be processed by other methods such as light A as shown in the figure, or in combination with the electric forming method. The chemical or chemical lithography group is used to treat the characteristics of the interface layer 302. This ice pre-grinding can be improved by laser assisted chemical grinding. Long #左

The cylinders discussed above are manufactured in different ways. However, it stands tall, and the body 3 3 3 has a high thermal conductivity after manufacture. The cylinder 3〇3 is preferably made of a high conductivity material such as copper. However, other materials such as 矽 can also be considered by those skilled in the art. The cylinders 3 0 3 are manufactured by various methods including, but not limited to, electrical formation =, EDM wire manufacturing, stamping, MIM, and machine manufacturing. In addition, interactive cutting with a saw and/or abrasive tool can also result in an ideal configuration of the interface layer 3〇2. In the case of the interface layer made of Shi Xi 3 0 2, the column 3 〇 3 will be fabricated by plasma etching, sawing, lithography and different wet etching, and the interface layer 3 〇 2 of the cylinder 3 〇: The ideal aspect ratio depends on. The radially distributed rectangular fins 3〇3E (Fig. 1A) can be fabricated by a lithographic patterning process using plasma etching or electroplating in a lithographically defined mold.

In one embodiment, the microchannel walls 11 for the interface layer i 〇 2 are made of germanium. The microchannel walls 110 can also be fabricated from other materials, including but not limited to pattern glass, polymers, and mold and polymer grids. Although the microchannel wall 1 is made of the same material as the bottom surface 1 〇 3 of the interface layer 112, the microchannel wall 1 j 亦可 can also be made of a different material than the other components of the interface layer 102. In another embodiment, the microchannel wall 11 has a thermal conductivity characteristic of at least

Page 51

1295725 , --------- , V. Description of invention (44) ~ ^ -— is 10W/mk. It is very obvious to those skilled in this art, micro channel wall I〗. It is also possible to have a thermal conductivity characteristic of less than 1 OW/mk, in which case a coating material is applied to the microchannel wall 110, as shown in Fig. 15, to increase the thermal conductivity of the microchannel niche. If the microchannel wall 110 is made of a material having a good thermal conductivity, the thickness of the coating 112 is at least 25 microns, which protects the surface of the microchannel wall 11 。. When the microchannel wall 11 is made of a poor thermal conductivity material, the thermal conductivity of the coating 112 is at least 50 W/ink and can be higher than 25 micrometers. It is obvious to those skilled in the art, other types of coatings. Materials and thickness dimensions are also considered.

In order to configure a microchannel wall 11 having a suitable thermal conductivity of at least 10 W / mk, the microchannel wall 11 must be electrically formed with a coating material 11 2 (Fig. 15), such as nickel or metal. Said. When the microchannel wall 11 has a thermal conductivity of at least 50 W/mk, the microchannel wall no is electroplated on the thin metal film seed layer by copper. Alternatively, the microchannel niches are not coated with a coating material. ·

The microchannel wall 110 can utilize hot press forming techniques to achieve a high aspect ratio along the channel wall 11 of the bottom surface 103 of the interface layer i 〇 2 . The microchannel wall 〇 can also be constructed such that the ruthenium structure is deposited on the glass surface, and the structure is engraved on the glass in a desired configuration. The microchannel walls 11 can also be constructed by standard lithography techniques, embossing or casting methods, or other suitable methods. The microchannel wall n 〇 can also be made separately from the interface layer 102 and bonded to the interface layer 1 〇 2 by an anode or a resin. Or the 'microchannel wall 1 1 ' is coupled to the interface by conventional electrical forming techniques such as electroplating;曰 There are several ways to construct the intermediate layer 1 〇 4. Middle layer

1295725 V. Inventions (45). It will be apparent to those skilled in the art that any suitable material includes, but is not limited to, laser-patterned glass, polymers, metals, glass, plastics, molded organic materials, and any combination. Alternatively, the intermediate layer 104 can be fabricated using plasma etching techniques or the intermediate layer 1 〇 4 can be formed using chemical etching techniques. Other methods include machine method, etching, extrusion, and/or casting of the metal as an ideal fracture. The intermediate layer 104 can also be injection molded into a desired configuration. Or the intermediate layer 104 can be made into a desired configuration using a laser perforated glass plate. in

~ The branch layer 3 0 6 can be manufactured in different ways. Preferably, the branch layer 3 〇 6 is made into one complete piece. Alternatively, the preferred manifold layer 30 6 can be fabricated as individual components as shown in Figure 12 and then coupled together. The branch layer 3 〇 6 can be formed by injection molding using a plastic, metal polymer mixture or other suitable material, and the second layer is made of the same material. Or as described above, each layer is formed by a different material plant. The branch layer 306 can also be utilized by machine and etched metal techniques. It is obvious to those skilled in the art that the branch layer 3〇6 can be lightly bonded to the interface layer 102 and the branch layer 106 by any suitable method. Different ^ structure s into a hot parent converter 1 〇〇. The interface layer 102, the intermediate layer 1〇4 and the branch screen are covered by an anode, and the adhesive and fusible bonding agent are in contact with each other.曰

It is coupled to the interface layer 1〇2 by chemical bonding. The intermediate layer 1〇4 can also be formed by thermal convex and soft lithography techniques, in which case the line EDM or the 矽 main part is used to press, the middle door::::: Γ;°: then (4) or, the middle layer 1〇 4 by the injection molding method and the micro-pass in the interface layer 1〇2

Page 53 1295725____ ...^ - V. INSTRUCTIONS (46) The manufacture of the wall 110 is formed in common. Alternatively, the intermediate layer 104 may be formed by other suitable methods and fabrication of the microchannel walls 110. Other methods of manufacturing heat exchangers include, but are not limited to, welding, fusion bonding, fusible bonding, intermetallic bonding, and any suitable technique, depending on the type of material used in the layer.

Another method of manufacturing the heat exchanger of the present invention is illustrated in Figure 16. As shown in Fig. 16, another method of fabricating a heat exchanger includes establishing a hard mask formed by a tantalum substrate as an interface layer (step 50). The hard mask is made of silica dioxide or spin on the glass. After the formation of the dura mater, a plurality of lower channels are formed in the hard mask, and the lower channel forms a path of the liquid between the microchannels 1 1 ( (step 502). The lower channel is formed by a suitable method including, but not limited to, jji's engraving technique 'chemical grinding soft lithography or iSL de-sequence. In addition, the market must be rough; g between the roads; 1 small space m microchannels do not become bridges between each other; afterwards, the glass spin method is applied to the hard mask surface in a conventional way to form the middle and the tube Layer (step 5 0 4). Subsequently, the intermediate layer and the branch layer are hardened by coagulation (step 506). After the intermediate layer and the branch layer are formed and hardened, a plurality of liquid helium are formed in the hardened layer (step 5 〇 8 ). The liquid is lanthanized or drilled into the branch layer. Although other methods can be used to fabricate the interface layer 1 〇 2, the intermediate layer 104 and the branch layer 1 0 6 ' other methods of manufacturing the heat exchanger 1 can also be considered.

Figure 17 illustrates another embodiment of the heat exchanger of the present invention. As shown in Figure 6, the two heat exchangers 200, 200' are coupled to a heat source 99. The heat source 99, such as an electronic device, is brought into the circuit board 96 and disposed in an upright position, so that each side of the heat source 9 9 is exposed. The heat exchanger of the present invention is coupled to one of the exposed sides of the heat source 99, so that the two heat exchangers 200, 2000 can provide maximum cooling of the heat source 99. Or hot

1295725_____: _ V. DESCRIPTION OF THE INVENTION (47) The source level is coupled to the circuit board such that more than one heat exchanger is stacked on top of the heat source 9 9 (not shown) such that each heat exchanger is coupled to a heat source 9 9 . The details of this embodiment are disclosed in U.S. Patent Application Serial No. 1 0 / 0 7 2,1, 3, 7, 2, 2, 7, the entire disclosure of which is incorporated herein by reference. here.

As shown in Figure 17, a two-layer heat exchanger 20 0 is coupled to the left side of the heat source 99, and the heat exchanger 2000 is coupled to the right side of the heat source 9 9 . It is apparent to those skilled in the art that it can be coupled to each side of the heat source 9 9 . It will be apparent to those skilled in the art that another embodiment of the heat exchanger 200 can also be coupled to the side of the heat source 9 9 . Another embodiment, illustrated in Figure 17, can cool the more precise hot spot of the heat source 9 9 as it applies a liquid to cool the hot spot present at the thickness of the heat source 919. Thus, the embodiment of Fig. 17 is heated by the heat exchange on both sides of the heat source 9 9 and applied to the center of the heat source 9 9 . It is obvious to those skilled in the art that the embodiment of Fig. 17 is used for the cooling system 3〇 in Fig. 2Α-2Β, although other closed systems may also be considered. As mentioned above, the heat source 9 9 has other characteristics in which the position of one or more hot spots may change because of the different tasks that the heat source 9 9 needs to perform. To properly cool the heat source 99, the system 30 can include a sensing and control module 34 (Fig.

2Α-2Β), which dynamically changes the flow rate and/or the liquid flow rate into the heat exchanger 1 in response to changes in the hot spot position. Specifically, as shown in FIG. 17, '- or a plurality of (four) Ss 124 are disposed in the mother-interface hotspot area of the chirp converter 200, and/or are disposed at each possible hotspot position of the heat source 99, or a plurality of functions, Shop 〇炎双1U cooked 岣 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置 配置Control film set 38 (Fig. 2A__

1295725 V. INSTRUCTION DESCRIPTION (48) 2 B) A plurality of flaps also coupled to the loop 30 for controlling the flow of liquid to the heat exchanger 100. One or more flaps are disposed in the liquid line but may also be equipped with S at other locations. A plurality of detectors are integrally connected to the control module 34. The control module 34 is preferably disposed upstream of the heat exchanger 100, as shown in FIG. Alternatively, the control module 34 is configured at any position in the closed loop system 30.

The detector 1 2 4 provides information to the control module 34, including but not limited to the flow rate of the liquid flowing in the interface hot spot, the temperature of the interface hotspot area 1 〇 2 and/or the heat source 9 9 and the temperature of the liquid . For example, referring to FIG. 17, the detector 丨24 disposed in the interface provides information to the control module 34, indicating that the temperature of a special interface hot spot in the hot junction device is increasing, and the heat exchange is 2 0 〇. The temperature of the medium-specific interface hot spot is decreasing. In response to this, the control module 34 increases the flow rate to the heat exchanger 200 and reduces the flow to the converter 2 0 0'. Alternatively, control module 34 may change the flow of liquid to one or more of the one or more interface hotspots in response to information received from detectors. Although the detector 11 8 is in contact with the second in Fig. 17. The change test: the fresh display 'is very obvious, the cross detector 118 can also be replaced with only one heat: for the specific embodiment, wherein The structure and working principle of the present invention are carefully understood. Correct

And the details are not limited to the scope of the patent application scope. I = 士 is very obvious, and the examples can be modified to provide a clear understanding of the spirit and scope of the present invention. Explain without

1295725 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 A illustrates a side view of a conventional heat exchanger. Figure 1 B illustrates a top view of a conventional heat exchanger. Figure 1C illustrates a side view of a conventional art multi-level heat exchanger. Figure 2A illustrates a schematic of a closed loop cooling system incorporating another embodiment of the flexible liquid transport microchannel heat exchanger of the present invention. Figure 2B illustrates a schematic of another embodiment of a closed loop cooling system incorporating a flexible liquid transport microchannel heat exchanger of the present invention. Figure 3 illustrates a top view of another tube layer of the heat exchanger of the present invention. Figure 3B illustrates a schematic view of another heat exchanger having another manifold layer of the present invention. Figure 4 illustrates a perspective view of the interwoven branch layer of the present invention. Figure 5 illustrates a top view of an interwoven branch layer of the present invention having an interfacial layer. Figure 6A illustrates a cross-sectional view of the interleaved branch layer along the interface layer A-A. Figure 63 is a cross-sectional view showing the interleaved branch pipe layer along the interface line B-B. Figure 6C illustrates a cross-sectional view of the interleaved branch layer along the interface layer of line C-C. Figure 7A illustrates a perspective view of the present invention having an interfacial layer interleaved branch layer. Figure 7B illustrates a perspective view of another embodiment of the interface layer of the present invention. Figure 8A illustrates a top view of another tube layer of the present invention. Figure 8B illustrates a top view of the interface layer of the present invention. Figure 8C illustrates a top view of the interface layer of the present invention. Figure 9A illustrates a side view of another embodiment of a three-layer heat exchanger of the present invention. Figure 9B illustrates a side view of another embodiment of the two-layer heat exchanger of the present invention. Figure 10 A-1 ΟE illustrates a perspective view of the present invention having different micropin array interface layers. Figure 11 illustrates a perspective view of another heat exchanger of the present invention. Figure 1 2A illustrates a preferred heat exchanger elevation of the present invention. Figure 1 2B illustrates a perspective view of another heat exchanger of the present invention.

Page 57 1295725 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 2 C illustrates another flow-through perspective view of the present invention. Figure 1 2D illustrates a lower perspective view of the preferred entry level of the present invention. Figure 1 2 E illustrates a lower perspective view of another inlet level of the present invention. Figure 1 2 F illustrates a lower perspective view of the preferred exit level of the present invention. Figure 1 2 G illustrates a lower perspective view of another exit level of the present invention. Figure 1 2H illustrates a cross-sectional view of a preferred heat exchanger of the present invention. Figure 1 2I illustrates a cross-sectional view of another heat exchanger of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 13 is a top plan view of a preferred embodiment of the preferred embodiment of the present invention with preferred arrangement of inlet and outlet apertures for single phase liquid flow.

Figure 14 illustrates a top view of a flow-through position of a preferred embodiment of the present invention with preferred arrangement of inlet and outlet apertures for two-phase liquid flow. Figure 15 illustrates a side view of a heat exchanger interface layer of the present invention having a coating material applied thereto. Figure 16 is a flow chart showing another manufacturing method of the heat exchanger of the present invention. Fig. 1 7 illustrates a schematic view of another embodiment of the invention having two heat exchangers coupled to a heat source. Component symbol description: 10, 20 heat exchanger 1 4 parallel channel 24 outlet %埠 2 7 bottom surface 3 2 pump 3 8 liquid line 11 bottom surface 12 inlet 埠

16 exit 埠 22埠 26 middle layer 28 multi-nozzle 3 0 closed loop sealed cooling system 3 4 dynamic sense and control module 9 6 circuit board 9 8 thermal interface material

Page 58 1295725 Schematic description 99, 9 9 'Heat source 1 0 0 heat exchanger 104, 204 intermediate layer 102, 20 2, 2 0 2A, 3 0 2, 3 0 2', 402, 40 2' interface layer 103, 132, 3 04B, , 3 0 8B , 3 0 8B', 312B' bottom surface 105, 105A, 105B, 105C, 105D, 205A, 2 0 5B conduit 106, 2 0 6, 3 0 6, 3 0 6 4 0 6 pipe layer 1 2 4 detector 1 0 7 zone 1 0 8,1 0 9 liquid 埠110, 111, 210A〇410, 410' microchannel 112, 116, 414, 414, 418, 418' channel 108, 116, 118, 118A, 118B, 118C, 118D, 118E, 1 18F , 120, 120A , 120F , 122 finger 119, 1 2 1 finger aperture 1 30,304A,,308A, 3 0 8 A top surface 2 0 0, 20 0,, 3 0 0, 3 0 0,, 4 0 0 heat exchanger 2 0 8, 208A, 2 0 8B inlet 2 0 9,2 0 9A, 2 0 9B exit 埠 2 1 0 micro Channel wall 214 permeable vapor membrane 3 0 1 microporous structure 3 0 3 series cylinder · 3 0 3B square 3 0 3C diamond, oval 3 0 3D hexagon 3 0 3E distance wing 304,, 3 0 8, 3 0 8', 312, 312' level 314, 314, , 315, 315, 316, 316,, 345, 408, 40 9 bees 32 0' 3 2 0', 3 2 6', 328, 3 28' narrow channel 3 2 2 transmission channel '

321', 322, 322, 324, 324', 33 0' aperture 411, 411', 412, 412' parallel liquid conduit 416' 416A, 416B groove 42 0 curved surface

Claims (1)

1295725 VI. Patent application scope 1. A heat exchange a. - inter-layer layer to cool the heat b. - a branch pipe layer path for a transfer path configuration, wherein the interface is in a predetermined pattern; wherein the complex number is 10 W / mk Suitably 2. a kind of cooling a. - interface layer b. - branch layer i · first position for transporting liquid to optimal liquid transport ii · a second layer of removing liquid; wherein the interface is a plurality of columns Appropriate for 1 0 W/mk 3. If the patent application is along the interface layer 4. The patent application comprises: contacting and configuring a heat source to pass liquid through its source; and coupling to the interface layer, the branch The layer further comprises a first set of liquids to the interface layer, wherein the individual liquids in the first group minimize the pressure drop in the heat exchanger; the layer further comprises a plurality of columns disposed along the interface layer The cylinder includes a coating thereon that has at least thermal conductivity. The heat source heat exchanger comprises: a contact with a heat source and configured to allow liquid to pass through the enthalpy to the interface layer, the branch layer further comprising: a plurality of substantially vertical inlet paths, the interface a layer, wherein the inlet paths are arranged at a distance from each other; and an L-level having at least one outlet path for the interface layer to have a plurality of columns disposed in a suitable pattern thereon; comprising a coating thereon The coating has at least thermal conductivity. The heat exchanger of the second item also contains a porous microjunction configuration. The heat exchanger of the third aspect, wherein the porous microstructure Page 60 1295725__ ...... ^ , VI. The scope of the patent application includes at least one microhole having a variable size along a predetermined direction. 5. The heat exchanger of claim 3, wherein the porous microstructure has an average pore size in the range of 30 micrometers and 300 micrometers. 6. The heat exchanger of claim 3, wherein at least one region of the porous microstructure has a porosity in the range of 0 and 3 and 0.8. Page 61 1295725 Chinese ^ month summary (Invention name: Method and apparatus for efficiency of DC body transport for cooling heating devices) A heat exchanger and its source of manufacture. The interface layer is coupled to the heat source and the constitutive member includes a tube layer coupling first 埠 coupled to the first group of individualized groups. The branch layer includes at least one first hole transporting liquid through the second set to provide a heat source between the first and second turns. Preferably, the closest optimal distance for each of the first groups. The method 'contains an interface layer to cool the heat profile so that liquid can pass through. This heat is applied to the interface layer. The interface layer includes at least one hole' that transports liquid through the first two turns to the second set of individualized holes. The first group of holes and the second group of holes are arranged with a minimum liquid path distance to properly cool a hole and are arranged adjacent to the second group of holes. 5. (1), the representative figure of the case is · ________________________ ), the representative symbol of the representative figure in this case is a brief description: Liquid conduit 412, 412' for Efficient Vertical Fluid 珲 408, 40 9 Parallel six, English invention summary (Invention name: Method and Apparatus Delivery for Cooling a Heat Producing Device) A heat The heat exchanger further comprising a manifold layer that is coupled to the interface layer. The interface is is to the heat source and is configured to pass fluid therethrough. Manifold layer includes at 1 east one first port that is coupled to a first set of 1295725 IV. Summary of Chinese Invention (Invention Name: Method and Apparatus for Efficient Lead-DC Body Transport for Cooling Heating Devices) Channels 414, 414', 418, 418, Grooves 4 1 4, 4 1 6A, 4 1 6B Curved Surface 420 6. English Abstract (Invention Name: Me1: hod and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat Producing Device) The first layer of at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holds are arranged to provide a Minimized fluid path distance between the first and second ports to adequate 1 y cool the heat source. Page 6