TWI253088B - Manufacture method and structure of the metal strip resistor - Google Patents

Abstract

This invention relates to a manufacture method and structure of the metal plate resistor. Form the electrodes by thick-film electro-casting way to the substrate (namely, electric resistance alloy board), and coat the painting layer upon the substrate surface layer for heat-radiation, and further paste a metal radiator piece upon the painting layer. The manufacture process subsequently comprises forming board by rolling, punching, electroplating, cutting-up, cutting the ditch, coating the painting layer, and fixing the heat sink sheet, the strip resistor manufacturing is completed after the coating painting layer dries, the product manufactured by the said production method is the strip resistor structure of the present invention. The abovementioned method of forming electrodes by electroplating can increase the contact area between the electrode and the substrate current passing through increases with a lower resistance value to 0.0001 Omega. Moreover, the design of heat dissipation plate on the substrate has a better heat-dissipation effect, which will not affect resistance accuracy, and increases the power.

Description

1253088 _—Case No. 90132345 _Year Month b______ V. INSTRUCTION DESCRIPTION (1) Field of the Invention The present invention provides a method and structure for forming a metal plate type resistor, and uses an thick film electroforming technique to form electrodes at both ends of the substrate. The plate type resistor provides a larger and stable contact area for a larger amount of current to pass through, so that a lower resistance value can be produced, and the heat dissipation effect is good, and the resistance precision distortion is not easily generated and an error occurs. [Background of the Invention] The use of high-resistance devices and the type of electricity 1 2 is like layer 9, block of electricity, electricity 2 2 a metal plate type resistor (Metal Strip Resist〇rs) mainly on the surface of the PC board (SMD) resistors, often used in high current power environments, so they are generally referred to as Current Sensing Resistors, while conventional SMD resistors have large base ends that are electrode-bonded. The construction can be understood from the following illustrations. Please refer to the first A figure for the stereoscopic exploded view of the conventional resistor. The formula =f 1 is formed by the high temperature electric welding of the base 9 1 1 and the block electrodes 9 provided on both sides (usually about 2〇〇〇〇c). Above), the combination is shown in the first B-figure; after the combination, the surface of the substrate 9 χ i is coated with a ^ ϋ pole: the point is that the resistor 9 1 is implemented on the PC board, and the bottom end PC board 9 The contact surface of 0 is too small, and the limit is affected by "丨L==, and the fixing effect is also affected. Resistance 9 is another conventional resistor: body decomposition diagram

I face and after the electric welding on the surface of the base 921 -1 first map is not the same as this will be thin copper electrode page 4 1253088 case number 90132345 five, invention description (2) 2 bent down The effect of the C resistance 9 2 on the implementation is fixed with P. It is only 9 2 2, the volume is small, the bending is stable, and the current and electricity are also welded as shown in the second D diagram. In addition, when the cold shrinkage is inflated, please refer to the third figure. Think of the 'Large South temperature often with solder paste 9 3 (or silver bubbles, so in the microscopic lower pole 9 1 2 (9 2 2) is prone to oxidation phenomenon; high resistance, will reduce the expected high welding temperature is very high, easy to make 2 (9 2 2) The deterioration of the welding base will cause the resistance to be resisted. In view of this, how to achieve the main goals of current, low resistance and high power.

Type structure, c board 90 soul point is that the folding force is quite resistant or is affected by the 'electrode 9 shortcomings except the effect change is shown as the formula 4 connection technology poor) as the 'discoverable contact between the two, the tin contact surface In the process of the substrate 9, the variation of the variation error overcomes the metal rate. The second C generates a large, plate-type resistance is not easy, and to a certain extent, the high effective contact surface affects the medium of the fixed electrode of the resistance resistance. , solder paste substrate 9 1 1 will have a small air-filled paste 9 3 (or can achieve the pass 1 1 (9 2 quality 'especially the effect of adding 'accuracy plate-type resistance' is shown in the figure. Thin at both ends of the contact area And the limitation of the solder joint. The temperature spot welding method is difficult to accurately value the accuracy and the electrode 1 way, in 9 3 itself (921 or gas chamber shaped silver paste), the electric resistance effect. 1) or electricity is affected at the solder joints, and this The invention wants Hitb f and the preferred copper sheet to have no electrical edge. In addition, the formula and the base are easy to store during the fixed release process, or the electricity is formed. This temperature is low, and secondly, the pole is near 9 1 , and the surface is pursued. The technology of the present invention The present invention means a metal plate structure type resistance, resistance alloy plate) to a thick film electrically town two ends of formula;:; * in; the base (Formula $ electrically ------ ί an electrode, an electrode located in the base

1253088 j No. 9Q132345 V. Description of invention (3) The area of the upper and lower sides of the body, and the other surface is fixed on the surface of the surface layer of the substrate. Step 1 of the metal plate type of the invention (plate rolling): Step 2 (punching) : Will ^

Apply the coating on the right two sides, in step 3 (Electrical Mine) Step 4 (Cut) Step 5 (Cut) Step 6 (Coating) The base will be thick in step 7 (fixed heat sink for the above) Steps to complete the supply of the perfect metal plate type, and more coated with a sheet to promote the resistance of the metal base strip-shaped substrate in the center of the strip film electroforming electric money after cutting the base surface electrode meets U): to be coated After that, the heat-dissipating heat-dissipating method can be used to distribute the heat-dissipating heat-dissipating method body plate rolling body to form a strip-shaped metal surface coating dew in a fixed metal-based manner, and to apply the L standard coating half, and the coating is completed to detect no supply to the industry. Left, functional effects. As follows: Striped with stamping holes. Two electrodes of the body. The metal substrate is cut into a block base and the groove is read to have a resistance value of a coating layer, and only the heat dissipation and the edge-resistant shape are retained, and the surface and both sides are used to increase the coating material to dry and dry the material. Type error, that is, use. Once the metal is dissipated, the solid build is achieved. It can be packaged and shipped at low temperatures. In the present invention, the electrode is produced at both ends of the substrate by thick film electroforming, because the substrate and the electrode are not easily deteriorated, so that only the crucible is between the two. The contact area is increased; the electrode is integrally covered at the end of the substrate, and the area of the single-sided electric welding combined with the substrate is increased by 2 to 4 times. Electricity

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Page 6 1253088 --- Case No. 90132345__年月日日_____ V. Description of invention (4) There is no gap between the pole and the base, no small air bag or air chamber, no oxidation, so that two The contact surface is more reliable, so that the amount of current passed can be higher, and a lower resistance value can be produced up to 〇1 Q. Furthermore, the contact area between the electrode and the substrate is large, and a good heat dissipation effect can be produced. In addition, the heat dissipation effect of the coating is further improved, and the heat dissipation of the resistor is made faster, and the temperature rise is low, and the resistance accuracy is not easily distorted during use. Therefore, it is effective to reduce the error value and increase the power consumption. [Embodiment] = According to the embodiment shown in the figure, the following is explained in detail: Ming = gin, fourth, fifth A to five H, the fourth figure shows the creation of the flow, the flow chart The fifth A to the fifth figure is the principle of the resistance of the present invention. The figure shows the manufacturing process of the metal plate type resistor 1 厚 thick edge (such as the step edge grid 1 step film electroforming step edge diagram); above the five squares four 1: plate rolling forming 6 1 • punching 6 2, stamping the strip-shaped base 1 with a die, etc. • and creating a positioning hole 12 in the center (as shown in Figure 5B); 々电钱6 3, the two sides of the strip-shaped metal substrate 1 The electrode 2 is formed at a low temperature of 0. 5 mm or more (as shown in the fifth c-figure); the strip 2 6 4 ' is formed to form the strip-shaped metal substrate 1 of the electrode 2 and the positioning hole 12 and are equally cut into a block shape (eg, The five series rolled the resistive alloy plate 1 into a strip groove. The block metal substrate 1 was cut into at least one to determine its resistance value, and the groove was formed and sprayed.

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V. INSTRUCTIONS (5) 々Processing 14 Removal of burrs and horns (edges and edges or grinding treatments; Fig.) or other removal of bristles Step 6: Painting 66, in the base Ί ^ layer, but retaining the electrodes at both ends 2 is the second death with coating 3 coated with heat-dissipating, high-temperature resistant coating (such as the road grievance, and the coating 3 series mining - ^ X Le five F map); $7: fixed 埶 ' 'will heat sink .4 placed on the paint 3 (the 2 paint 3 is in a semi-dry state, then the fixed effect is achieved, and becomes - " = After the paint is dry, after the above steps are completed, the finished #姐电阻1 〇 finished product. 5 ( It is encapsulated after the conventional technique; m: it can be used in the surface encapsulation industry. The fifth drawing), to provide the preliminary forming structure of the metal plate type resistance after the completion of the above step 4, and has become a Inventive electric block-shaped substrate ί is electroformed by thick film at both ends. Therefore, as long as the method of forming a thick film by electroforming at both ends of the elongated substrate 1 or by a block-shaped method, the electrodes 2 are formed and formed. The cutting q J belongs to the mouth of the invention. The sixth figure shows the two of the fifth G diagram, the structure of the substrate 1 The surface of the electrode base layer 1 (including the upper, lower and left and right sides) is coated with a thick film by 4^^, and the heat sink which has been treated by the insulation is fixed on the coating layer 3. /, medium, and electrode 2 directly attached to the surface of the substrate 1, so that the substrate 1 and the electrode 2 are connected without gaps and air bags. Further, it can be found from the fifth figure that the electrode 2 is coated on the upper and lower sides of the base 1 and on the left and right sides. On both sides and side, 'in the resistance of the formula, the electrode can only cover the side of the two ends of the base or the upper side ^^ can not cover the lower side and the left and right sides, so the hair

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Χ253〇^^ ## 90132345 Description of invention (6) The area in which the substrate 1 is in contact with the electrode 2 is 2 4 times larger than that of the conventional single-sided contact. The resistance value of this formula can only be 0.005 Q~G.5Q, ^ The town system achieves an accuracy of 0.0 0 05 Ω~0.5 Ω, which can be relatively lifted. The coating 3 of the invention adopts a high heat dissipation, high temperature resistance, and a coating which is satisfactory, so the resistance i 〇 heat dissipation "Child, can effectively control the resistance:: The difference is less than 0. U, the precision is improved. Secondly, the bottom plate of the electrode 2 is in a flat shape, and a good contact effect can be obtained when it is fixed on the PC board 7. The seventh figure shows another embodiment of the electric resistance scraping surface of the present invention. The bottom plate 22 of the terminal electrode 2 is a longer and wider end, and the length of the bottom plate 2 2 is longer than that of the top plate 23, so the area of the 盥pc = touch is larger, so that a better contact effect can be produced.妾 Γ Γ : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : . . .,.n"The temperature produced by the same under the same (four) is compared with the conventional formula and the diagonal line R3 in the comparison diagram of the resistance I of the present invention is a formula ===: the power is about 0.4 watt. In the figure, the diagonal line R 0 C 犄 斗 p p1nno 广 疋 疋 不 不 不 本 本 本 本 本 本 本 本 本 本 本 本 本 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻",, this month is in & degree, as can be seen from the foregoing eighth and ninety-two graphs, the base electrode 2 of the present invention is thicker-film electrocasting than the conventional welding method, and the power is two. In heat dissipation and

The tenth figure shows the power comparison diagram of the conventional heat sink without the heat sink. In the figure, the curve R R & "this month month /, the political hot film; ~; - ^ curve R 5 4 f type at 7 (TC resistance power case number 90132345 (7)

The value is 100%, and the power value is gradually decreased after 70 °C. 6 When the aluminum metal is used as the heat sink for the invention, the curve R 1253088 in the figure. The power value is 140%, and the power after 70 ° C. The resistance curve R7 of the value of Tao at 7〇<t is the actual reduction of the copper metal as the heat sink in the present invention; the resistance power value in the figure is 1 7 〇%, and the power after ^0 °C ^ ^ ' As can be seen from the above table at 70 ° C, the resistance of the present invention is fixed by aluminum = _ drop. Therefore, the resistance power value of the latter is far better than that of the conventional heat sink: copper: gold u: and superior to the aluminum heat sink. And copper A... piece

The invention discloses a method for forming an electrode at both ends of a substrate by inventing a low-temperature thick film electroforming, which increases the contact area between the electrode and the substrate, so that the current cover & adds a lower resistance value; The design of the heat sink on the base can make the heat dissipation effect better, and it is not easy to cause distortion of the resistance precision, which can improve the power of use. Because the manufacturing method and structure contain industrial use value, the invention application is filed according to law.

Page 101253088 Case No. 90132345 _Μ 简单Revision diagram simple description [Illustration first map first B diagram first C diagram second A diagram second B diagram • second C diagram second D diagram custom resistor (A) The three-dimensional exploded view. A three-dimensional combination diagram of the conventional resistor (1). A cross-sectional view of the conventional resistor (1). The stereoscopic exploded view of the conventional resistor (2). Schematic diagram of the manufacturing of the resistor (2). Schematic diagram of the implementation of the conventional resistor (2). A schematic view of the conventional resistor (3). Fig. 2 is a microscopic diagram of the substrate and the electrode of the conventional resistor. Fig. 4: Manufacturing flow chart of the resistor of the present invention 〇 fifth A to Η Figure: Schematic diagram of the manufacturing process of the resistor of the present invention 〇 sixth figure fifth G Fig. 6 is a cross-sectional view, Fig. 7 is a cross-sectional view showing another resistor structure of the present invention, Fig. 8 is a comparison of the temperature of the resistor and the resistor of the present invention, and Fig. 9 is a graph comparing the power of the resistor with the temperature rise of the present invention. Figure 10 Comparison of the power of the heat sink without the heat sink and the heat sink with the heat sink

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Claims (1)

1253088 _ Case No. 90132345_年月日日__ VI. Patent application scope 1. A metal plate type resistance method is: plate rolling, rolling the metal substrate plate into strips, and the strip substrate can be punched out at equal intervals before plating. Edge grid and central positioning hole; electroplating, electroforming the low-temperature thick film on both sides of the strip metal substrate to form electrodes on both sides; cutting 'cutting the long strip substrate after the electrode electrode into a block shape; sand blasting, After cutting, sandblasting is applied to the surface of the block substrate; coating, applying a heat-dissipating coating layer on the surface of the block substrate; and fixing the heat sink to fix the metal heat sink on the coating layer; The two ends of the substrate are plated by thick film to form an electrode, so that the electrode is coated on both ends of the block substrate, so that the electrode and the block substrate have a gap-free adhesion state, so that the amount of current passing through is increased, resulting in lower The resistance value. 2. The method according to claim 1, wherein at least one of the dicing grooves is cut at the substrate after electroplating. 3. The method of making a resistance as described in claim 1 or 2, wherein the blasting can be replaced by a grinding process. 4 . A metal plate type resistor structure, comprising: a block base body, a flat plate resistance alloy plate; an electrode fixed at two ends of the block base body, the electrode is coated on the upper two sides, the left and right sides and the side sides of the block base body And a heat sink fixed on the block substrate, wherein the heat sink and the block substrate are adhered and fixed by the coating layer; the heat dissipation effect is better by the combination of the metal plate type resistors. Page 13 1253088 _ Case No. 90132345_年月日日__ VI. Application for patent range It is not easy to cause distortion of resistance accuracy and can improve the power consumption. 5. The resistor structure of claim 4, wherein the length of the bottom plate of the electrode is longer than that of the top plate. 6. The resistor structure of claim 4, wherein the heat sink is an insulated copper metal. 7. The resistor structure of claim 4, wherein the heat sink is an insulated aluminum metal. 8. The resistor structure of claim 4, wherein the electrode has a thickness of 0.5 mm or more. Page 14 T251Q8S Fourth picture 1253088 rev.---90132345_年月月日 Chinese invention summary (invention name: metal plate type resistor manufacturing method and structure) A metal (that is, the coating process for the heat dissipation of the resistance alloy is the coating layer and solidification; 'Before the type of resistance structure. The body contact area is added to the value of 0. 0 0 0 1 Ω. It is better, it is not easy to use thick film electricity and adhere to the metal plating after the substrate is adhered, and the finished product is the basis of the method. The design of the production board is improved by using two types of plate type electric plates. The method of rolling the plate into a fixed heat method is as described above, and the formation of the resistor is formed in the coating type and the punching sheet. Through the on-body resistance enhancement method, the electrode, the upper layer of the layer, and the electric current of the electric coating are used to set the heat dissipation distortion. The surface layer of the casting method is coated with a heat sink and the groove is formed into a plate type. Low, the power can be layered on the substrate; the resistance and heat dissipation effect of the metal plate and the base of the resistor plate are made. (1) The representative figure of the case is: the sixth picture ( a), the representative symbol of the representative figure in this case is a simple description: sheet 1 · base 2 · · electrode 3: coating layer 4 • • heat dissipation VI, English invention summary (invention name