TWI248614B - Bank control circuit in RAMBUS DRAM and semiconductor memory device thereof - Google Patents
Bank control circuit in RAMBUS DRAM and semiconductor memory device thereof Download PDFInfo
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- G—PHYSICS
- G11—INFORMATION STORAGE
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- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
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1248614 ---^^__ 五、發明說明(1) —--- <發明之範圍> · 祕上^ t明係關於隨機存取記憶體排(RAMBUS)DRAM的儲存 體控制電路去 w a 茶’尤其是關於一種RAMBUS DRAM的儲存體控 带 /、糸以控制記憶體儲存體的控制電路與位址閂鎖 ^ 母兩们儲存體各共有一個的方式來縮小電路面積者。 <發明之背景> 、1248614 ---^^__ V. Description of invention (1) —--- <Scope of invention > · Secret on the memory control circuit of random access memory bank (RAMBUS) DRAM The tea is especially used for a RAMBUS DRAM storage control strip, a control circuit for controlling the memory bank, and a location latch to reduce the circuit area. <Background of invention>
第1圖表7^傳統的RAMBUS DRAM的方塊圖。其係由一各 ,有個记憶儲存體的上位及下位記憶體塊部1 2、1 4所構 、的"己隱私塊1 0 ’為了連接記憶儲存體的寫入與讀出數據 於外部所須串聯/並聯變換用上位及下位串聯/並聯移位部 1 6 ☆ 1 8二以上位及下位串聯/並聯移位部1 6、1 8為中介所 收又的。貝出數據輸出於外部,而從外部所收受之寫入數據 輸出於上位及下位串聯/並聯移位部16、1 8用輸入/輸出端 2〇 ’及分別控制上位與下位串聯/並聯移位部16、18動 用控制部2 2所構成者。 記憶體塊10具有32個記憶儲存體,而各由含16個儲存 體的上位記憶體塊部丨2與下位記憶體塊部丨4所構成。1st chart 7^ A block diagram of a conventional RAMBUS DRAM. It consists of a separate and a lower memory block of the memory bank, and the privacy block 1 0 ' is configured to connect the read and read data of the memory bank. Externally connected series/parallel conversion upper and lower series/parallel shifting parts 1 6 ☆ 1 8 2 or more and lower series/parallel shifting parts 1 6 and 1 8 are received by the intermediary. The output data of the bus output is external, and the write data received from the outside is output to the upper and lower serial/parallel shifting sections 16, and the input/output terminal 2'' and the upper and lower serial/parallel shifts are respectively controlled. The units 16 and 18 use the controller 22. The memory block 10 has 32 memory banks, and each of the upper memory block portion 2 and the lower memory block portion 4 includes 16 banks.
上位串聯/並聯移位部丨6將上位記憶體塊部丨2讀出的 128位元並聯數據RDA —top[127:〇]變換為16位元數據偶數 RDA一top[7:0]、奇數RDA — top[7:〇]而輸出,而該下位串聯 /並聯移位部18則將下位記憶體塊部14所讀出之128位元並 聯數據RDA — bot [127:0]變換為16位元數據偶數RM — b〇t[h 〇]、奇數 RDA 一 bot[7:0]而輸出。 · 上位及下位串聯/並聯移位部丨6、1 8的動作可大別為The upper series/parallel shift unit 丨6 converts the 128-bit parallel data RDA_top[127:〇] read by the upper memory block unit 丨2 into 16-bit metadata even RDA-top[7:0], odd number RDA — top[7:〇] is output, and the lower serial/parallel shifting unit 18 converts the 128-bit parallel data RDA_bot [127:0] read by the lower memory block unit 14 into 16 bits. The metadata is evenly RM — b〇t[h 〇], odd RDA-bot[7:0] and output. · The upper and lower series/parallel shifting parts 丨6, 1 8 can be differently
1248614 — 五、發明說明(2) 一。其一為將寫入動作時分8 一 為1 2 8位%的串聯一並聯另么位几串聯數據變換 =體塊讀出的卿元數據變 變換。 β的亚聯一直聯 在寫入動作時,將2具上位及 16、18同時輸入的寫入數據,分位串聯/亚聯移位部 12與下位記憶體塊部14,而使只^達於上位記憶體塊部 址選擇的數據寫入於記憶體塊1 〇。麸2 f :1 〇由寫入位 具上位及下位串聯/並聯移位部16、“'18八在^出動作時,2 1 0接受讀出數據而傳達於輸出端。 刀k /、記憶體塊 第2圖為裝設於第1圖所示之上 記憶體塊i 4 )内之傳統記憶儲存體控^電^^ (或下部 圖。如圖所示’傳統記憶儲存體控制電路係龙構成 據的16個記憶儲存體部(3q<〇〉〜3〇 ’、 ·為了儲存數 存體的上部及下部各有—個以便在寫入與J)出動在記上儲 數據用之17個感測放大部(4〇 <〇 >〜4〇 乍才感測 感:放大部(4。<〇>〜40<16>)動 驅動部(5〇<。>〜5。<16>);驅動 =大 〇 >,60 <15 >之字線舆副字 '線w „3〇 < μ , β η / η、 η / ! π:、 丨口王子線及副字線驅 " ,接收收來的主動信號,預充帝 信號(Precharge Slgnal),及廣域位址信號(Gi〇bai、-1248614 — V. Description of invention (2) 1. One is to divide the write operation time into a series of 1 2 8 bit % of the series one parallel series of other bits of the series data transformation = the block data read transform. The sub-join of β is always connected to the write data of the two upper bits and 16, 18 simultaneously, and the series/sub-transfer unit 12 and the lower memory block unit 14 are divided into four. The data selected at the upper memory block location is written in the memory block 1 〇. Bran 2 f : 1 〇 is written by the upper position and the lower serial/parallel shifting unit 16 , "When 1818 is in the operation, 2 1 0 receives the read data and transmits it to the output. Knife / /, memory Figure 2 is a diagram of a conventional memory storage device (or lower diagram) installed in the memory block i 4 ) shown in Fig. 1. As shown in the figure, 'traditional memory storage control circuit system The 16 memory storage parts of the dragon (3q<〇>~3〇', · in order to store the upper and lower parts of the number of storage bodies, so that they can be written and J) are stored in the data. Each of the sensing and amplifying parts (4〇<〇>~4〇乍 sensed feeling: the enlarged part (4. <〇>~40<16>) moving drive part (5〇<.>~ 5. <16>); drive = big 〇>, 60 <15 > word line 舆 adverb 'line w „3〇< μ , β η / η, η / ! π:, 丨口Prince line and sub-line drive ", receive the received active signal, precharge signal (Precharge Slgnal), and wide area address signal (Gi〇bai, -
Address Signal),來產生控制各相應於位址信號 儲存體的感::大驅動部,主字線、副字線驅動部、°及: 元綾之咸測放大控制信號,士仝A k ^ ^ 1248614 五、發明說明(3) 信號、及位元線等化作 <。>〜7。<15>)所構:者。"空制部及位址問鎖部⑴ 二控制部及位址問鎖部(70 <0 >〜7〇 <15 > . > 記憶儲存體部(30<()>〜3 在母一個 動信號與預加信號傲為廣❹各日f有一個°當有主 控制部與位址閃鎖部(7n\^號^n生%,各記憶储存體的 域位置信號是否為Γ記 位置互相符合,記惰儲‘ _:、位置仏* ’如果儲存體 部作動適當的記憶儲存體上部盘 鎖=之控制 藉儲存體位址選1=;:線與副字線驅動部,於此, 儲存體内,儘;r鳩維持字線於記憶 鎖位址所改變㈣域位址㈣被以主動模式接收的問 當第η記憶儲存體(30 <η >)被廣域位址 二有第Μ),及第(“1)記憶儲存體 <n > ) 3〇 <n +1 > )被預充電,然後第 (30<n>)即被作韌如丄 、攸弟憶儲存體 祐、阳傅目^動。例如,假如記憶儲存體1(30 <1 >) Ϊ) ' ^^^#ΜΚ30< ) 及5己隐儲存體2(30<2>)全部祜早苜右千 儲存體Κ3〇 < ! > )即被作動。)又',气己預4電/麵然後記憶 < 2 > ) Λ , Λ1'/ # 140 (30 < 0 > } ^ ^ ^ # It2(30 =2。>)直到3己憶儲存體1(3〇<1>)被預充電前並不被作Address Signal), to generate the control corresponding to the address signal storage body:: large drive part, main word line, sub-word line drive part, ° and: 绫 绫 salty amplification control signal, Shi Tong A k ^ ^ 1248614 V. Description of the invention (3) The signal, and the bit line are converted into <. >~7. <15>) Constructed: "empty department and address question lock unit (1) two control unit and address question lock unit (70 <0 >~7〇<15 > . > memory storage unit (30<()> ~3 In the mother a dynamic signal and pre-added signal proudly wide, each day f has a ° when there is a main control part and address flash lock part (7n \ ^ number ^ n%%, the domain position signal of each memory bank Whether it is the position of the Γ 互相 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Department, in the storage body, do; r鸠 maintain the word line changed in the memory lock address (4) domain address (four) is received in the active mode when the nth memory storage (30 < η >) was The wide area address has a third level, and the ("1) memory bank <n >) 3〇<n +1 >) is precharged, and then the (30<n>) is made For example, if the memory storage body 1 (30 <1 >) Ϊ) ' ^^^#ΜΚ30<) and 5 hidden storage 2 ( 30<2>)All 祜 苜 苜 right 储存 storage Κ 3〇 ≪ ! > ) is actuated.) And ', gas has pre-4 electricity / face and then remember < 2 > ) Λ , Λ 1' / # 140 (30 < 0 > } ^ ^ ^ # It2( 30 = 2. >) Until 3 memories 1 (3〇<1>) are not pre-charged
第6頁 1248614 Γ- 丨 一 五、發明說明(4) 此ΪΓ:這種傳統Rafflbus dram的儲存體控制部有 一些缺點。例如,存在有由於各記憶有 位址閂鎖部致徒增其佈置面積的問^。、 卫1部與 <發明之總論> f π制部的=^月乃為了解決上述傳統Rambus DRAM儲存 肢扰制邠的問4而開發者。本發明的一個目存 藉配置一個控制電路與一個位址閃 t種 件。 積的儲存體控制電路及其半導體記憶元 y 為了達成上揭目的,本發明的半導妒記_开杜 :亍:屬儲存體動作的半導體記憶元件中,包己=二乃執 體的區域位丄::廣域位址信號並問鎖所選擇儲存 又Γΐΐίΐ 閃鎖電路,為其特徵。 以”:屬儲存體動作的半導體記憶元:件, 也、、且成的複數儲存體;及在該 =^由自己憶 :數:存體中’究應活性化哪一個 二決定在該 路,為其特徵。 1U储存體的複數控制電 Λ 1祉1口琥亚閃鎖所選擇儲 第7頁 1248614 五、發明說明(5) 存的區域位址信號之複數位址閂鎖電路;及由各該相 的2個儲存體所共有’而產生複數控制信號,並決定在該 稷數儲存體中,究應活性化哪一個儲存體的複數控制/ 路,為其特徵。 =,為了達成上揭目的,本發明的Rambus DRAM儲存 :豆^制電路包括:儲存數據用的複數記憶儲存體部,·在夂 :”己:儲存體部的上部舆下部各配個,以便在寫入盥口 存二部的^複數感,放大驅動部;及在含有驅動各記憶儲 P ^ U 、子線與副字線用的複數主字線及副字線驅動部的 nu*s DRAM中,為該記憶儲存體部每2個共有1個,以接 控制信號與廣域位址信號而產生控制位於該2個記 二=,:體的3個感測放大驅動部,2個主字線及副字線驅動 j寺徵。位兀線用各信號的複數控制部與位址閂鎖部,為其 卿批制,恭為了達成上揭目的,本發明的Rambus DRAM儲存 =二h兒路包括·儲存數據用的複數記憶儲存體部;在各 體部的上部與下部各配置1個,以便在寫^ I詨感^感測數據用的複數感測放大部;含有為了控制 I "放大部動作用複數感測放大驅動部的Rambus 今纪愔锉ί該記憶儲存體部每2個中共有1個,用以驅動各 ^思月體部的字線與副字線的複數主字線及副字線驅 决:ΐ ί 口該記憶儲存體部每2個中共有1個,用以接收外 采的動信號,預充電信號,與廣域位址信號,而產生押Page 6 1248614 Γ- 丨 1-5, invention description (4) This ΪΓ: This traditional Rafflbus dram storage control department has some shortcomings. For example, there is a question of increasing the layout area due to the address latching portion of each memory. , 卫 1 and <General Theory of Invention> The f π system of the ^^ month was developed to solve the above-mentioned traditional Rambus DRAM storage artifacts. One object of the present invention is to configure a control circuit with an address flash. The memory control circuit of the product and its semiconductor memory element y. In order to achieve the above object, the semi-conducting 本 亍 亍 亍 亍 亍 亍 亍 亍 亍 亍 属 属 属 属 属 属 属 属 属 属 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存Bit 丄:: Wide-area address signal and ask the lock to select the storage and Γΐΐίΐ flash lock circuit, which is characterized by it. ": semiconductor memory element that is a storage object: a piece, also, and a plurality of storage bodies; and in the = ^ by their own memory: number: in the body of the study should be activated which one is determined in the road The characteristics of the 1U storage complex control unit 1 祉 1 port Hu Ya flash lock selected storage page 7 1248614 V, invention description (5) stored area address signal complex address latch circuit; A complex control signal is generated by the combination of the two banks of the respective phases, and it is determined that the complex control/path of which one of the banks should be activated in the number of banks is characterized. In summary, the Rambus DRAM storage of the present invention includes: a plurality of memory storage units for storing data, and a plurality of memory storage units for storing data in the upper part of the storage body for writing in the upper part. The complex sense of the two parts of the oral memory, the amplification drive unit; and the nu*s DRAM including the complex main word line and the sub word line drive unit for driving the memory P ^ U , the sub line and the sub word line, The memory storage unit has one for every two, to connect the control signal and the wide-area address letter. Generating a control located two note = 2 3 ,: sense amplification driving portion body, two main word lines and sub-word line driver j Temple syndrome. The bit line uses the complex control unit and the address latch unit of each signal for its approval. In order to achieve the above, the Rambus DRAM storage of the present invention includes a plurality of memory storage for storing data. a body; one for each of the upper and lower portions of each body portion for writing a complex sense amplifying portion for sensing data; and for controlling the I "amplifying portion for complex sense amplification driving The Rambus of this department has one in every two memory storage units, which is used to drive the complex main word lines and sub-word lines of the word lines and sub-word lines of each body. Each port of the memory storage unit has one for receiving the external signal, the pre-charge signal, and the wide-area address signal.
第8頁 1248614Page 8 1248614
制各該位於該2個却.格 主字線與副字二= 及位址閃鎖部,為其特徵了位70、,表的信號用之複數控制部 <較佳具體實施例之詳細描述> 之儲;^ μ二^二…所附圖不詳細描述本發明Rai"bus DRAM :儲存體控制電路以及其半導體記憶元件之較佳具體實施 DRAM儲存體控制 予第3圖為本發明一實施例中的Rambus 氣路的方塊構成圖。The system is located in the two main word lines and the sub-words two = and the address flash lock portion, which is characterized by a bit 70, the signal for the table is used for the complex control portion <best embodiment of the preferred embodiment The description of the present invention does not describe in detail the Rai"bus DRAM of the present invention: the storage control circuit and the semiconductor memory device thereof are preferably embodied in the DRAM storage body control. A block diagram of the Rambus gas path in one embodiment.
1控制電路包括:儲存數據用的n個記憶儲存體⑴。 :),纟各記憶儲存體部(130<n>)之上部及下部各有 以供寫入及讀出動作時感測數據用n +1個感測放大 〇 <n +1 >);控制各該感測放大部(140 <n +1 >)動 二乍用的n+1個感測放大驅動部(15〇 <n+1 >),·驅動各該 兄憶儲存體部(1 30 <n >)之字線與副字線用的n個主字線 及副字線驅動部(160 <η >);及記憶儲存體中每2個共有工 個,接收外來主動信號,預充電信號舆廣域位址信號、,以 產生控制各该位於2個記憶儲存體的2個感測放大驅動部,1 The control circuit includes: n memory banks (1) for storing data. :), in the upper and lower portions of each memory storage unit (130<n>), there are n +1 sensing amplifications for the sensing data when writing and reading operations 〇 <n +1 >) Controlling each of the sense amplifying sections (140 <n +1 >) for n+1 sensing amplification driving sections (15〇<n+1 >), driving each of the brothers n main word lines and sub word line driving units (160 < η >) for the word line and the sub word line of the storage unit (1 30 < n >); and 2 for each of the memory banks Receiving an external active signal, pre-charging a signal, and a wide-area address signal, to generate and control two sensing amplification driving sections located in each of the two memory storage bodies.
2個主字線及副字線驅動部,與位址線信號用的n/2個控制 部及位址閂鎖部(170<n/2>)。 本發明的Rambus DRAM之儲存體控制電路,係利用2個 儲存體不會被同時活性化的Rambus DRAM特性,而構成2個 儲存體部(1 3 0 < 0 : 1 > )共有1個控制部及位址閂鎖部(丨7 〇 <n > )之方式。Two main word lines and sub word line drive units, and n/2 control units and address latch units for the address line signals (170 < n/2 >). The memory control circuit of the Rambus DRAM of the present invention has two Rams DRAM characteristics (1 3 0 < 0 : 1 > ) The method of the control unit and the address latching unit (丨7 〇<n >).
時,:ί制:屬於廣域信號的主動信號與預充電信號發生 蛣仞二制邵及位址閂鎖部(170 <η >)即確認所拉a 生 —1是否為本身所屬2個記憶儲存體之位址之廣 ⑽〔部疋Ϊ所;:之廣域位址信號選擇1個控制 閃鎖部,將對域位址信號所選㊣的1個控制部及位址 ^ ^ ^ ^ # r ί # ^ ^ ^ ^ ^ ^ ^ ^ ^ 1, ^ 精所接收的主動信號與預充電隹 杈式與預充電模式的動作。 貝兄電‘就做主動 部,ΐ廣域位址信號所選擇的控制部及位址問鎖 存體之廣域位址信號而維持二儲 影響。、、泉即使外來的廣域位址信號變動亦不致更受 批在丨f 4圖為本發明之另一實施例中的Rambus DRAM儲存蝴 工电路的方塊構成圖。該控制^ ^ ^ ^ ^ ^ ^ ^ ^ >)上ίί =丄);在各記憶儲存體部(230<n >)上邛及下部各有丨個,以供寫入及 用n+1個感測放大部(24〇 < Κ動作k感測數據 Μ24ί) <n u \ u ),控制各該感測放大 : :二1 的。+1個感測放大驅動部( 25 0 <n + 1,),§己憶儲存體部⑵G<n>)2個巾共有其 Γ^ίΓ^ 主子、'泉及副子線驅動部(26〇<η/2>);及記憶儲存體部 ⑽<η>)2個中共有其!個’以供接收 充電信號與廣域位址信號,而產生驅動各位於2個記憶儲預 存體的2個感測放大驅動部與丨個主字線及副字線驅動部, 1248614 五、發明說明(8) 及2個兄憶儲存體的·位址線之信號的n / 2個控制部及位址閃 鎖部(270 <n/2>)。 依本實施例的Rambus DRAM的儲存體控制電路,係利 用2個儲存體不會同時被活性化的Rambus DRAM特性,而構 成2個儲存體部( 23 0 <0: 1 >)共有1個控制部及位址閂鎖部 ( 27 0 <n > ),與1個主字線及副字線驅動部(2 6 0 < 〇 >)之 方式。 士 首先’當屬於廣域信號的主動信號與預充電信號發生 時’各控制部及位址閂部(270 <n >)即確認所接收之廣域 ,址信號是否為本身所屬2個記憶儲存體之位址信號。由 =依所接收之廣域位址信號選擇1個控制部及位址閂鎖’ ,。又,由廣域位址信號所選擇的1個控制部及位址閂鎖 將對應於2個記憶儲存體中接收之廣域位址信號的記 憶儲存體,藉所接收的主動信號與預充電信號做主動模 與預充電模式的動作。 、 ^ 再者,由廣域位址信號所選擇的控制部及位址閂鎖 1 ^内部的位址閃鎖f路閃鎖主動模式時接收的廣域位 t號,即使外來的廣域位址信號改變 維持、記憶儲存體内之字線。 不更又,v#,以 =時,由接收該控制部及位址問鎖部(27〇 <n所問 9廣域位址信號之主字線及副字線驅動部(26〇 <n〉 固」己,儲存體中驅動對應於位址信號m個 主予線及副字線。 吨贯妝< 此外,本發明並不限定於本實施例,而可在不脫離本 1248614 五、發明說明(9) 發明意旨之範圍内做多樣的變更實施。 從以上的說明,可知依照本發明之Rambus DRAM之儲 存體控制電路以及其半導體記憶元件,可從每2個儲存體 中提供1個給各控制記憶儲存體的控制電路與位址閂鎖電 路共用,因而可獲得節省電路面積的效果。 <1When: ί system: the active signal and the pre-charge signal belonging to the wide-area signal occur in the second system and the address latching part (170 < η >) to confirm whether the pull-a--1 is its own 2 The address of a memory bank is wide (10) [Ministry Office;: The wide-area address signal selects one control flash lock, and the positive control unit and address are selected for the domain address signal ^ ^ ^ ^ # r ί # ^ ^ ^ ^ ^ ^ ^ ^ ^ 1, ^ The received active signal with pre-charged pre-charge and pre-charge mode actions. Bell Brothers ‘is doing the active part, the control unit selected by the wide-area address signal and the wide-area address signal of the address lock lock to maintain the influence of the second bank. Even if the external wide-area address signal changes, it will not be more approved. The block diagram of the Rambus DRAM storage circuit in another embodiment of the present invention. The control ^ ^ ^ ^ ^ ^ ^ ^ ^ >) upper ίί = 丄); in each memory storage unit (230 < n >) on the 邛 and the lower one each for writing and n + 1 sense amplification section (24〇<Κ action k sensing data Μ24ί) <nu \ u ), controlling each of the sense amplifications: : 2 of 1. +1 sense amplification driver (25 0 < n + 1,), § memory unit (2) G<n>) 2 towels share their Γ^ίΓ^ master, 'spring and sub-line drive unit ( 26〇<η/2>); and memory storage unit (10) <η>) For receiving the charging signal and the wide-area address signal, generating two sensing amplification driving sections and two main word lines and sub-word line driving sections each located in two memory storage pre-stores, 1248614 V. Invention Explanation (8) and 2 brothers recall the n / 2 control units of the signal of the address line of the bank and the address flash lock unit (270 < n/2 >). The memory control circuit of the Rambus DRAM according to the present embodiment uses two Rams DRAM characteristics in which two banks are not simultaneously activated, and two storage units (23 0 < 0: 1 >) are shared. The control unit and the address latch unit (27 0 < n > ) and the one main word line and the sub word line drive unit (2 6 0 < 〇 >). First, 'when the active signal and pre-charge signal belonging to the wide-area signal occur', each control unit and address latch (270 <n >) confirms the received wide-area, whether the address signal is 2 of its own. The address signal of the memory bank. One control unit and address latch ' is selected by = according to the received wide area address signal. Moreover, one control unit and address latch selected by the wide area address signal will correspond to the memory storage body of the wide area address signal received in the two memory storages, and the received active signal and precharge The signal acts as a master mode and a precharge mode. , ^ Furthermore, the control part selected by the wide-area address signal and the address latch 1 ^ internal address flash lock f-channel flash lock active mode when receiving the wide-area bit t, even if the external wide-area bit The address signal changes to maintain the word line in the memory. No more, v#, when =, by receiving the control part and the address request lock part (27〇<n asked 9 wide-area address signal main word line and sub-word line drive part (26〇<; n> 固 固 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , V. DESCRIPTION OF THE INVENTION (9) Various changes are implemented within the scope of the invention. From the above description, it is understood that the memory control circuit of the Rambus DRAM and its semiconductor memory element according to the present invention can be provided from every two banks. A control circuit for each control memory bank is shared with the address latch circuit, thereby achieving an effect of saving circuit area.
第12頁 1248614 圖式簡單說明 弟1圖為傳統Rani bus DRAM的方塊圖。 第2圖為第1圖之方塊内所有傳統記憶儲存體控制電路 的方塊構成圖。 第3圖為本發明之一實施例中的Rambus DRAM儲存體控 制電路的方塊構成圖。 第4圖為本發明之另一實施例中的Rambus DRAM儲存體 控制電路的方塊構成圖。 〈圖示中元件與標號之對照> 130<0>〜130<11>、230<0> 〜230<n> :記憶儲存㉖ 部 月且 140<0> 〜i4〇<n+l>、240<0> 〜240<n+l> :残、、則 放大部 " 150<0> 〜I50<n+1>、250<〇> 〜250<n+l> :咸、、則 放大驅動部 160<0> 〜16〇<n>、260 <0〉〜260<n/2> :主字線及 副字線驅動部 170 <0 > 〜170 <n/2 >、2 7 0 <〇 > 〜2 70 <11/2>:控制部 及位、址閂鎖部Page 12 1248614 Schematic of the diagram The brother 1 is a block diagram of the traditional Rani bus DRAM. Figure 2 is a block diagram of the control circuit of all conventional memory banks in the block of Figure 1. Figure 3 is a block diagram showing the Rambus DRAM bank control circuit in one embodiment of the present invention. Figure 4 is a block diagram showing the Rambus DRAM bank control circuit in another embodiment of the present invention. <Control of Elements and Labels in the Drawings> 130<0>~130<11>, 230<0>~230<n>: Memory storage 26 months and 140<0>~i4〇<n+l> , 240 <0>〜240<n+l> : residual, then enlargement "150<0>~I50<n+1>,250<〇>~250<n+l> : salty, then The amplification drive unit 160<0>~16〇<n>, 260 <0>~260<n/2>: main word line and sub word line drive unit 170 <0 > ~170 <n/2 >, 2 7 0 <〇> ~2 70 <11/2>: control unit and bit, address latch
第13頁Page 13
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KR10-2001-0029104A KR100401508B1 (en) | 2001-05-25 | 2001-05-25 | Circuit for control bank of rambus dram |
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JP (1) | JP4115129B2 (en) |
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Cited By (1)
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TWI451246B (en) * | 2007-08-21 | 2014-09-01 | Microsoft Corp | Multi-level dram controller to manage access to dram |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003132674A (en) * | 2001-10-26 | 2003-05-09 | Mitsubishi Electric Corp | Semiconductor memory |
JP4200420B2 (en) * | 2002-06-13 | 2008-12-24 | パナソニック株式会社 | Semiconductor memory device and method for writing semiconductor memory device |
US7113443B2 (en) * | 2004-10-14 | 2006-09-26 | International Business Machines Corporation | Method of address distribution time reduction for high speed memory macro |
KR100639614B1 (en) * | 2004-10-15 | 2006-10-30 | 주식회사 하이닉스반도체 | Data output compress circuit for testing cells in banks and its method |
KR100949266B1 (en) * | 2008-06-30 | 2010-03-25 | 주식회사 하이닉스반도체 | Semiconductor memory device |
US9064562B2 (en) | 2013-04-03 | 2015-06-23 | Hewlett-Packard Development Company, L.P. | Memory module having multiple memory banks selectively connectable to a local memory controller and an external memory controller |
KR102193444B1 (en) | 2014-04-28 | 2020-12-21 | 삼성전자주식회사 | Semiconductor memory device and memory system including the same |
US10373665B2 (en) | 2016-03-10 | 2019-08-06 | Micron Technology, Inc. | Parallel access techniques within memory sections through section independence |
US10217494B2 (en) * | 2017-06-28 | 2019-02-26 | Apple Inc. | Global bit line pre-charging and data latching in multi-banked memories using a delayed reset latch |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60186949A (en) | 1984-03-05 | 1985-09-24 | Nec Eng Ltd | Memory bank system |
JP2601951B2 (en) * | 1991-01-11 | 1997-04-23 | 株式会社東芝 | Semiconductor integrated circuit |
JP2894170B2 (en) * | 1993-08-18 | 1999-05-24 | 日本電気株式会社 | Memory device |
JPH07221762A (en) | 1994-01-27 | 1995-08-18 | Hitachi Ltd | Packet processing method and communication interface device |
US6154826A (en) | 1994-11-16 | 2000-11-28 | University Of Virginia Patent Foundation | Method and device for maximizing memory system bandwidth by accessing data in a dynamically determined order |
US5513148A (en) * | 1994-12-01 | 1996-04-30 | Micron Technology Inc. | Synchronous NAND DRAM architecture |
JPH0973776A (en) | 1995-09-07 | 1997-03-18 | Mitsubishi Electric Corp | Synchronous semiconductor memory |
KR100192573B1 (en) * | 1995-09-18 | 1999-06-15 | 윤종용 | Memory device of multi-bank structure |
JPH09306162A (en) | 1996-05-09 | 1997-11-28 | Minoru Furuta | Control system for dram |
DE19654595A1 (en) | 1996-12-20 | 1998-07-02 | Pact Inf Tech Gmbh | I0 and memory bus system for DFPs as well as building blocks with two- or multi-dimensional programmable cell structures |
US6075743A (en) * | 1996-12-26 | 2000-06-13 | Rambus Inc. | Method and apparatus for sharing sense amplifiers between memory banks |
KR100246337B1 (en) * | 1997-03-26 | 2000-03-15 | 김영환 | Circuit for selecting bank of rambus |
US6141765A (en) | 1997-05-19 | 2000-10-31 | Gigabus, Inc. | Low power, high speed communications bus |
JP3828249B2 (en) * | 1997-07-29 | 2006-10-04 | 株式会社東芝 | Dynamic semiconductor memory device |
US5999481A (en) | 1997-08-22 | 1999-12-07 | Micron Technology, Inc. | Method and apparatus for controlling the operation of an integrated circuit responsive to out-of-synchronism control signals |
KR100261218B1 (en) | 1997-12-08 | 2000-07-01 | 윤종용 | Pin assignment method of semiconductor memory device & semiconductor memory device inputing packet signal |
US5959929A (en) | 1997-12-29 | 1999-09-28 | Micron Technology, Inc. | Method for writing to multiple banks of a memory device |
JP3494346B2 (en) * | 1998-03-03 | 2004-02-09 | シャープ株式会社 | Semiconductor memory device and control method thereof |
JP4226686B2 (en) | 1998-05-07 | 2009-02-18 | 株式会社東芝 | Semiconductor memory system, semiconductor memory access control method, and semiconductor memory |
KR100308067B1 (en) | 1998-06-29 | 2001-10-19 | 박종섭 | How to control row address strobe path |
JP2000149598A (en) | 1998-11-04 | 2000-05-30 | Hitachi Ltd | Semiconductor storage device |
JP3725715B2 (en) | 1998-11-27 | 2005-12-14 | 株式会社東芝 | Clock synchronization system |
US6125422A (en) | 1999-03-17 | 2000-09-26 | Rambus Inc | Dependent bank memory controller method and apparatus |
KR100639197B1 (en) * | 2000-06-01 | 2006-10-31 | 주식회사 하이닉스반도체 | Clock control buffer circuit of rambus dram |
KR100696770B1 (en) * | 2001-06-30 | 2007-03-19 | 주식회사 하이닉스반도체 | Prefetch device for high speed DRAM |
-
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI451246B (en) * | 2007-08-21 | 2014-09-01 | Microsoft Corp | Multi-level dram controller to manage access to dram |
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