TWI246448B - Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby - Google Patents

Abstract

Chemical mechanical polishing/planarization (CMP) apparatus, method, and substrate produced thereby. Polishing surface with non-uniform recesses therein. CMP head and method having integral slurry dispensing mechanism. CMP apparatus and method having rotating retaining ring. CMP apparatus and method having soft backed polishing head. CMP providing efficient use of slurry in polishing and planarizing processes. Substrate (semiconductor wafer) produced by CMP apparatus or method. In one embodiment, apparatus (100) includes subcarrier (160) with flexible member (185) attached to lower substrate holding surface (165). Flexible member (185) has hole(s) (195) therein so that pressurized fluid introduced between flexible member and subcarrier (160) directly presses substrate (105) against polishing surface (125). Number and size of holes (195) are selected to provide sufficient friction between flexible member (185) and substrate (105) to cause rotation when drive mechanism rotates subcarrier (160). Subcarrier (160) having port adapted to draw vacuum on cavity (215) between lower surface (165) and flexible member (185). Flexible member and substrate (105) serve as valve (225) to isolate port from cavity when a predetermined vacuum has been achieved.

Description

1246448 A7 B7 V. OBJECTS OF THE INVENTION G) [Scope of the Invention] The present invention relates generally to systems, devices and methods relating to polishing and planarizing substrates, particularly to chemical mechanical planarization or polishing (CMP). ) Apparatus and method. [Background] Chemical mechanical planarization or polishing, commonly known as CMP, is a method of planarizing or polishing semiconductors and other types of substrates. Flattening the semiconductor substrate or wafer surface between certain processing steps allows more layers of circuitry to be stacked on the device in a vertical direction. As structure sizes shrink, density increases, and semiconductor wafer sizes increase, CMP processing requirements become more stringent. From the standpoint of manufacturing semiconductor products at low cost, uniformity of processing between wafers and wafers and uniformity of flatness across the entire surface of a wafer are important issues. As the structure or configuration of the surface of a semiconductor wafer is gradually reduced, the problem of non-uniform planarization is typically increased by about 0.2 micrometers (em). This type of problem is commonly referred to as the Inside Wafer Non-Uniformity (WIWNU) problem. Printing by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives, has been known to have a number of reasons for uniformity. Including the backside pressure applied to the wafer during the planarization process, the polishing pad (p〇Hshing pad) is non-uniform in the edge effect due to the typical difference in the interaction between the wafer edge and the mid-wafer region, and the metal and The non-uniform deposition of the oxide layer can be compensated for by adjusting the material removal by a planarization or polishing process. But efforts to address the impact of all problems have not been fully successful to date. Regarding the polishing properties of the back side of the wafer, conventional mechanical tools typically use a hard backing polishing head (hereinafter sometimes referred to as "head,,, hea(j) 91874. This paper size applies to the Chinese National Standard (CNS). A4 specification (2〗 297 297 mm) 1246448 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 B7 V. Invention description (2) to push the wafer to the polished surface, in other words, the polishing head has a hard bearing surface Directly pushing the back side of the semiconductor wafer. As a result, any change in the bearing surface of the polishing head, or any material pressure trapped between the wafer and the bearing surface, will result in a non-uniform application of pressure to the back side of the wafer. Thus, the front side of the wafer is typically not The ability to conform to the polished surface' results in uneven planarization. In addition, such a rigid back design often requires a relatively high polishing pressure (eg, from about 6 psi to about 8 pSi) to provide between the wafer and the polishing surface. Reasonable degree of conformity. This relatively high pressure effectively deforms the wafer, causing some areas of the wafer to remove excess material, while the amount of material removed in other areas is too small, resulting in poor planarization. The figure compensates for the aforementioned hard-back problem by providing a plug-in between the receiving surface and the wafer to be polished, attempting to provide some softness in the hard back system. This type of insert is commonly referred to as a wafer insert. This type of plug-in is a problem' because the wafer plug-in often causes variations in the process, resulting in wafer-to-wafer variation. This variation is not constant and usually cannot be measured. One of the problems is the absorption of water used in the polishing process. Or other fluids such as slurry. Because the amount of water absorbed by the insert increases with the life, there are often variations in the wafers. This process variation can be pre-conditioned in the water before the plug-in is pre-conditioning and the plug-in characteristics This process variation is controlled to a limited extent by changing the plug-in before changing to an unacceptable level. So 'the initial use of the plug-in is similar to the post-use, but this will increase the maintenance cost of the device and reduce the process throughput (pr〇cess) In addition, due to, for example, the thickness of the plug-in, the continuation of the continuation, and the material being captured in the hard back Unacceptable process variations are still observed between plug-ins or plug-ins and wafers. -Installation - (Please read the note on the back 1 to fill out this page) · This paper scale applies to China National Standard (CNS) A4 specification (210 ^ 297 mm) 2 91874 1246448 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed A7 B7 V. Invention Description (3) The use of plug-ins also requires precise control of the entire surface of the plug to be adhered to, due to any non-uniformity of the surface of the head. Perfection, or deviation from flatness or parallelism, will typically manifest as flattening variations across the entire wafer surface. For example, a conventional aluminum or ceramic plate is fabricated and then polished and polished before being placed on the head. The cost of the machine is increased, especially when setting up long positions. On the other hand, when a soft back is used, the soft material of the insert does not distort the wafer when the wafer is pressed back toward the polishing crucible. A lower extinction pressure can be used to achieve a wafer front facing polishing pad. The shapeability is not distorted, so polishing can be achieved with both uniformity and good flatness. Better flattening uniformity can be achieved, at least in part, because the polishing rates of similar structures for individual grains on the wafer are equal. In recent years, it has also tried to use the soft back, but it has not been fully satisfied. One type of soft back is described in U.S. Patent No. 6, s. Shendon teaches stretching the film or flexure of the lower surface of the head to form a cavity or cavity that is pressurized to push the substrate against the polishing surface. Although this approach has been significantly improved with respect to hardheads with or without inserts, this approach has not been fully satisfactory for a number of reasons. One problem with this approach is that the material cannot be reduced or eliminated due to trapping between the crucible and the wafer. Another problem is that vacuum cannot be used to hold the wafer to the head due to the presence of the film during the load or unload operation. In addition, the use of membranes actually increases non-uniformity due to the introduction of multiple changes, such as thickness or flexibility of the transmembrane surface and improper erection of the membrane may wrinkle. Table paper & Applicable to China National Standard (CNS) A4 specifications (210 x 297 public) ^ --------^ -------- (Please read the note on the back and fill out this page)

01 «Τ1 1246448 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 91894 A7 b/ V. Invention Description (4) Other soft back designs use wafer edge and head seals to form cavities, then pressurize and polish Directly pressing the wafer away from the polishing surface during planarization. One of the methods is described in U.S. Patent No. 5,635,083, the disclosure of which is incorporated herein by reference. Breivogel teaches the use of a lip seal to the outer edge of the back side of the wafer to form a peak between the head and the wafer, which is the desired pressurized air. Unfortunately, while this approach provides a soft back, it eliminates several problems associated with the use of a hard back and a soft back with a film, but does not allow sufficient bonding between the wafer and the receiving surface to provide wafers in the machine. The torque 'here is rotated during the polishing operation. Another item of this approach is that although the vacuum can be used to hold the wafer and the head, the wafer is only supported at the edge, so an unacceptable degree of bending occurs, resulting in damage or loss of the wafer. As for correcting or compensating the edge calendering effect, attempts have also been made to adjust the shape of the retaining crucible and modify the holding ring pressure to adjust the amount of material removed from the wafer near the retaining ring. Typically, the amount of material removed from the edge of the wafer is large and the edge of the wafer is over-polished. In order to correct this over-polishing situation, the holding ring pressure is usually adjusted to be slightly higher than the back side pressure of the wafer, so that the polishing amount in this area is slightly compressed by the holding ring, within a few millimeters of the holding ring ((5) (4) The material removed by the wafer is reduced. However, even this kind of effort is still unsatisfactory because the flattening pressure on the outer periphery of the wafer can only be adjusted indirectly based on the holding ring pressure. The effective distance of the compression effect of the retaining ring cannot be extended to the yen. Any distance from the edge. It is also impossible to independently adjust the holding ring pressure, edge pressure or total backside pressure of the wafer to achieve the desired effect. Another problem with the conventional CMP head using the retaining ring is that the holding ring is suitable for the following table. National Standard (cns) A4^^7^:^ --------Book·-------' f Please read the note on the back and fill in this page again} 1246448 A7 V. Invention Note (5) Any specified point corresponds to the designated portion of the wafer that is clamped to the sub-carrier during the entire (four) light operation. Thus, holding the high or low point on the lower surface of the clothing will also cause the crystal. Round uneven polishing. Although, it can hold the ring The surface is processed to have a high degree of flatness 'but it is not expensive'. Especially because the retaining ring is a consumable, the retaining ring often needs to be replaced as the wafer is polished. The non-uniform sentence for adjusting the material removal to adjust the wafer Deposition 'even if you have worked hard, this compensation method or machine is rarely provided. Non-uniform deposition comes from the circuit structure formed on the wafer or from the characteristics of the deposited layer. For example, the steel layer that has become more common in high-speed integrated circuits Shape: A thicker layer of the center of the wafer than the edge. But it is desirable to have a Weiguang method and device that provides a higher rate of removal from the center of the wafer than at the edge. Scheduled for slurry purity and suspension in slurry The size of the grinding particles in the economy is strictly regulated, so the price of the slurry becomes expensive. In addition, in order to prevent pollution and to provide mechanistic results, the slurry is usually not recycled or recycled, such as property. The major operating cost is the slurry cost of the staff There is still a need for a device and method that provides excellent planar consumerization, control edge planarization, and allows for adjustment of wafer material removal conditions. The compensation for non-uniform deposition of layers on the wafer is required. And the printing method allows the wafer to be vacuum-clamped to the soft back > while reducing or eliminating the crystal paper & degree applicable to the Chinese National Standard (CNS) A4 gauge (210 X 297 public Chu) Finally, the conventional CMP The problem with the device and method is the efficiency and waste of the use of the material. The slurry is typically a chemically active liquid in which the abrasive material is suspended to enhance the rate at which the material is removed from the wafer surface. Since the material = is distributed on the polished surface in front of the head, it is typical to dispense an excess of pulp to ensure that the entire area between the wafer and the polishing surface is covered when the slurry flows through the polishing surface. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Staff Consumer Cooperatives 1246448 A7 I------ Β7 —_ V. Inventions (6) Stress on the circle. There is a further need for a CMp device that provides a sufficient amount of slurry to the polishing surface without causing excessive waste. [Brief Description of the Invention] In summary, the present invention relates to a CMP system, apparatus and method for polishing and planarizing a substrate to achieve uniformity of height flattening across the substrate surface. The present invention includes numerous systems, devices, structures, and method features associated with chemical mechanical polishing (CMp). In one aspect, the invention provides a chemical mechanical polishing apparatus and method having a polishing surface with a non-uniform recess therein. In another aspect, the present invention provides an integrated mechanical slurry dispensing mechanism to a chemical mechanical polishing head and method. In yet another aspect, the present invention provides a chemical mechanical polishing apparatus and method having a rotating holding ring. In still another aspect, the present invention provides a chemical mechanical polishing apparatus and method having a soft back polishing head. In still another aspect, the present invention provides an apparatus and method for more efficient use of slurry for polishing and planarization. In still another aspect, the present invention provides a workpiece, such as a semiconductor wafer, fabricated by the apparatus or method of the present invention. θ According to another aspect of the invention, a polishing head for positioning a substrate having a surface on a polishing surface of a polishing apparatus is provided for processing a substrate from which material is removed. The polishing head includes a carrier with a flexible member, such as a diaphragm attached to the bottom surface, to which the substrate is held during the polishing operation. The flexure has a receiving surface designed to receive the substrate thereon and a plurality of apertures extending through the flexure. When the substrate is clamped to the receiving surface of the flexure, a cavity or chamber is defined by the lower surface of the carrier, the flexure and the substrate. The cavity design is suitable for the substrate to be straightened to the paper size during the polishing operation. Chinese National Standard (CNS) AO See (210 X 297 mm) 6 91874

1246448 A7 B7 V. INSTRUCTIONS (7) Push to the polished surface. Preferably, when the carrier includes the driving mechanism and rotates the sub-carrier during the polishing operation, the size and the number of the holes are selected to provide sufficient for the Ministry of Commerce, the Intellectual Property Bureau, the consumer, the printed device, and the substrate. The friction force imparts rotational energy to the substrate. In one embodiment, the lower surface of the sub-carrier also includes a port for introducing pressurized fluid into the cavity and a channel for distributing pressurized fluid throughout the cavity. The mouthpiece is also used to vacuum the cavity to hold the substrate on the receiving surface' and to detect that the substrate is suitable for being clamped to the receiving surface when the polishing apparatus further includes a vacuum switch coupled to the mouthpiece. The vacuum open relationship configuration is switched from on to off or from off to on when the pre-vacuum vacuum is reached. In one embodiment of the present embodiment, the flexure, substrate, and jaw design are suitable for use as a valve to separate the fistula from the cavity when a predetermined vacuum is achieved. When the cavity is evacuated, the flexure (the hole of the flexure is sealed by the substrate) is sucked inward until the flexible contact is made and the mouth of the lower surface of the sub-carrier is sealed. The mouthpiece may or may not have a raised lip to aid in sealing. This design allows for a degree of vacuum, thus controlling the degree of deformation of the flexure and substrate to minimize stress on the substrate. According to another characteristic aspect of the invention, a substrate for polishing a surface and a polishing head on the polishing surface of the polishing apparatus is provided for processing the substrate to remove material on the substrate. The polishing head includes a carrier that carries a sub-carrier suitable for holding the substrate during a polishing operation and a holding ring that is rotatably disposed about the sub-carrier. The lower surface of the retaining ring is substantially flush with the surface of the plate that is clamped to the sub-carrier, and the lower surface of the retaining ring contacts the light-removing surface during processing. The retaining ring deforms the polished surface to reduce the rate at which material is removed from the edge of the substrate. With conventional carriers, any change or rule of the lower surface of the retaining ring will result in a local increase in the removal rate of the irregular attachment material from the edge of the substrate or 5 dimensions applicable to the Chinese National Standard (CNS) A4 Regulations---- - " ) 7 Q1X74 Please read the meaning of η back first

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reduce. However, with the use of the carrier of the present invention, the effect of the edge removal rate of the substrate during processing can be minimized because the retaining ring can be rotated relative to the sub-carrier, the surface of the retaining ring facing the material is minimized from the edge of the substrate. In a specific embodiment, the 'sub-carrier is driven by the driving mechanism, and the frictional force between the holding ring and the calendering surface causes the holding ring to be relatively outer' to separate the holding ring from the holding ring to the holding ring. With rotation. Please read the first Φ % 事 智 智 智 智 智 财 财 财 财 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 : Holding the ring is suitable for applying a force to the holding ring during (iv) operation. The bearings are, for example, ball bearings, hydrodynamic bearings, roller bearings or tapered bearings. If desired, the retaining ring advancement includes a second lip-coupled retaining ring on the third lip-engaging support ring to the support ring when the carrier (four) smooth surface is raised. According to another characteristic aspect of the invention, the polishing apparatus includes a polishing head for positioning the substrate having a surface on the polishing surface of the apparatus for processing the sheet metal to remove material therefrom. The polishing head includes a carrier carrying a table below ^ suitable for holding the substrate during the polishing operation. In one embodiment, the carrier is provided with a plurality of slits extending through the bottom surface around the entire lower surface for polishing the polishing surface of the polishing material during operation. Usually the mouth is designed to be suitable for mixing abrasive materials with abrasive materials onto the polishing surface. Alternatively, if the polishing surface includes a stationary abrasive member thereon, the mouthpiece is adapted to dispense chemicals, such as water, to the polishing surface during the polishing operation. The trick is to evenly set the circumference of the annular space between the surrounding retaining ring and the sub-carrier. In another embodiment, during the maintenance operation, the mouthwash is further adapted to fill this page.

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I This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 public meal 91874)

I 1246448 A7 V. INSTRUCTIONS (9) The annular space between the rinsing retaining ring and the sub-carrier. In this embodiment, the CMP apparatus includes a slurry supply source that supplies slurry to a plurality of ports, a flushing fluid supply source that supplies flushing fluid to the plurality of ports, and a buffer for supplying the slurry to the supply of the flushing fluid Exchange between. In another aspect, the present invention is directed to a material removed from a substrate surface to

I I polishing device. The polishing apparatus includes a polishing head adapted to hold the substrate during the polishing operation, and a polishing surface having a plurality of recesses for dispensing the chemical between the substrate and the polishing head when there is relative movement between the substrate and the polishing surface Polished surface. The uneven spacing of the number of recesses across the polishing surface provides a varying rate of removal across the material of the polishing surface. The spacing of the recesses across the polishing surface varies from the first zone to the second zone to provide a different removal rate for the first zone and the second zone. Typically, the first zone has a slower removal rate than the second zone when the extent of each successive recess of the first zone is higher than the second zone. In a specific embodiment, the number of recesses includes slots having non-uniform dimensions or spaced apart by a radial direction. Alternatively, the recess may include a plurality of open cavities or dimples and a dimming surface, the size and concentration of which may vary across the entire evacuation surface. BRIEF DESCRIPTION OF THE DRAWINGS This invention will be more apparent in the following description of the present invention. FIG. 1 is a view showing an example of multi-head polishing or flattening. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a schematic cross-sectional side view showing a polishing head according to an embodiment of the present invention; ^33 is a second portion of the polishing head portion taken along line 3·3 of FIG. Plane 度 ^ 过 过 Chinese National Standard q 1246448 V. Inventive Description (10) Figure 'shows a specific embodiment of a flexure according to the present invention; FIG. 4 is another embodiment of a flexure according to the present invention 3 is a plan view similar to FIG. 3 of another embodiment of the flexure according to the present invention; FIG. 6 is still another embodiment of the flexure according to the present invention. 3 is a plan view similar to FIG. 3; FIG. 7 is a plan view similar to FIG. 3 of another embodiment of the compliant member according to the present invention; FIG. 8 is a polishing view according to a second embodiment of the present invention. The cross-sectional view taken along line 8_8 of Figure 2; Figure 9 shows the basis BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10 is a schematic cross-sectional view showing a lower surface of a sub-carrier having a slit on a lower surface; FIG. 10 is a schematic cross-sectional view showing a polishing head having a rotary holding ring according to an embodiment of the present invention; Figure 11 is a schematic cross-sectional view showing a portion of a polishing head having an integrated-body slurrying mechanism for dispensing chemicals onto a polishing surface according to an embodiment of the present invention; and Figure 12 is a view showing another embodiment according to the present invention; A detailed cross-sectional view of a polishing head of the embodiment. The polishing head has an integrated body-distributing mechanism for aggregating chemicals to the polishing surface via an annular space between the holding ring and the sub-carrier; FIG. 13A is A schematic plan view showing a polished surface having non-uniformly spaced slits in accordance with a specific embodiment of the present invention

Please read the back of the note first. Item J Write this page Order Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumer Cooperatives. Paper Size / JiiS帛 + Θ @家标准(CNS) A4 Specification (210 X 297 Meals 10 91874 1246448

V. DESCRIPTION OF THE INVENTION (u) Figure 1 is a schematic partial cross-sectional side view showing the polished surface of Fig. 13A, and Fig. 14 is a view showing a polished surface having a non-uniform spacing of the spiral grooving BRIEF DESCRIPTION OF THE DRAWINGS FIG. 15 is a schematic plan view showing another embodiment of a polishing surface having a plurality of non-uniformly spaced helical slots; FIG. 16 is a view showing a concentric ellipse having a non-uniform spacing BRIEF DESCRIPTION OF THE DRAWINGS FIG. 17 is a schematic plan view showing a specific embodiment of a linear polishing surface of a county having a non-uniformly spaced distance parallel slit; FIG. 18 is a view showing a polishing surface according to the present invention; a portion of the abbreviated cross section of the polishing surface having a plurality of evenly spaced apart slots but having a non-uniform depth. FIG. 19 is a view showing a portion of the polished surface of the polishing surface according to the present invention having a plurality of evenly spaced apart slits. But having a non-uniform width, FIG. 20 is a schematic plan view showing a illuminating surface having a non-uniformly spaced cavity according to an embodiment of the present invention; and FIG. 2 is a view showing according to the present invention A flow chart of a specific embodiment of a method for polishing or planarizing a substrate. [Description of component symbols] 100 CMP device 105 Substrate 110 Base Π 5 Rotary platform 120 Polishing pad 丨 25 Polished surface ^--------^-------- (Please read the notes on the back first) Fill in this page again) Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperatives Printed the paper and applied the Chinese National Standard (CNS) A4 specification (210 X 297 public) 11 91874 1246448 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing V. INSTRUCTIONS (i2) 130 Bridge 135 Rotating frame 140 Removal head 142 Single motor 145 Motor drive chain 150 Head mounting assembly 155 Carrier 160 Sub-carrier 162 Flange 163 Screw 164 Internal lower surface 165 Lower surface 166 Airtight pad 167 Internal support ring 168 External support ring 170 Retaining ring 175 Cavity 176 Second airtight pad 177 Lower skirt 179 Screw 180 Second closed cavity 185 Flexure 190 Bearing surface 195 Hole π 200 Support ring 205 Hold ring Surface 210 Angle Ring 215 Lower Cavity 220 Channel 225 Port 230 Lip 235 Isolation Valve 240 Vacuum Switch 243 Spacer 245 Upper Channel 250 Land 260 Bearing 265 Inner Housing 270 Ball 275 Outer seat 280 inner annular space 285 first lip 290 second lip 295 bolt 300 spindle portion 305 head 310 surface 320 pulping mechanism IIIIIIII 1 I · 1 III 1 II « — — — — — — I — (please read first The sound on the back is the same as the matter. Please fill in this page. The paper size is applicable to the China National Standard (CNS) A4 specification (210 x 297 mm). 12 91874 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed 1246448 A7 B7

V. INSTRUCTIONS (13) 325 Mouthwash 330 Flushing Fluid Supply Source 335 Slurry Supply Source 340 Valve 345 Groove 350 Cavity Six [Detailed Description of the Invention The present invention provides an improved method and apparatus for polishing or planarizing a substrate. The detailed description set forth below includes specific structures, arrangements, materials, shapes, and the like. It will be apparent to those skilled in the art that the present invention may be practiced without these specific details, and the method and apparatus of the present invention are not limited thereto. Referring to Fig. 1, a chemical mechanical polishing or planarization (CMp) apparatus 100 for a calender substrate 105 is shown. As used herein, "polishing" - means the evacuation or planarization of substrate 105, including substrates for flat panel displays, solar cells, and, in particular, semiconductor substrates or wafers on which circuit components have been deposited. Semiconductor wafers are typically thin, brittle disks of nominal diameters from 1 mm to 3 mm. Currently, 100mm, 200mm and 300mm semiconductor wafers are widely used in the industry. The method and apparatus 1 of the present invention is applicable to semiconductor wafers and other substrates 1 〇 5 having diameters of at least up to 300 mm and larger. For clarity, details of the CMP apparatus 100, which is well known and not related to the present invention, are deleted. Further details of the CMP apparatus are described, for example, in another U.S. patent application filed on May 12, 2000 by the applicant, entitled "Pneumatic diaphragm with separate holding ring and multi-zone wafer pressure control" CMP head system and method"; and another invention title applied for on May 12, 2000, the same application date. CMP system and method for improving edge and ring section material removal control with multiple pressure section loads And the US provisional application filed on May 12, 2002, the title of the invention "has many I-i --------^---------Aw (please Read the phonetic transcription on the back? Please fill out this page.) This paper & applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 13 91874 1246448 A7 V. Description of invention (14) Pressure ring section sub-load The CMP system and method for the removal and control of the 战^ ^ & J warfare materials are incorporated herein by reference. 订# The Ministry of Economic Affairs, the Intellectual Property Bureau, the employee consumption cooperative, the CMP device, including the pedestal 11〇 Supports large-volume rotation when rotating. There is a light-removing pad on the rotating platform. 20 mounted on it, the glare has: First polished 125' (four) polished surface of the substrate 1 () 5. Polished (four) q typical of polyamine (four) material 'for example, from Lodell, Newark, Delaware (RODEL) Further, a plurality of recesses (not shown in Fig. 1) may be provided on the polishing surface 125, such as a grooving (gI*_e) or a cavity 俾 dispensing chemical or slurry between the polishing surface and the dragging The surface of the substrate 1G5. The slurry (the word squeaking refers to a chemically active liquid with a grinding material suspended therein, and the slurry is used to increase the removal rate of the material from the substrate surface. Typically, the slurry system and the substrate are 〇 At least one of the materials on 5 is chemically active and has a pH of from about 1 Torr to about 11. For example, 'appropriate violet is composed of about 12% mill (four) and 1% oxidant in water base' and includes particles having a particle size of about 100 nm. Colloidal cerium oxide or aluminum oxide. If desired, as an alternative or addition to the slurry, the polishing surface 125 of the polishing pad 12 can have a fixed abrasive material embedded thereon, such as from 3M Company. In a specific embodiment of a CMp device with fixed abrasive, polishing operation The chemical that is applied to the polishing surface can be water. The susceptor 110 also supports the bridge 130, which in turn supports the rotating frame 135, and the polishing frame has one or more polishing heads 14 〇 during the polishing operation. The 5 series is clamped thereto. The design of the bridge 130 allows the rotating frame lifting and lowering to allow the surface of the substrate 105 held on the polishing head 140 to contact the polishing surface 125 during the polishing operation. The CMP device shown in Fig. A specific embodiment is a multi-headed Chinese meter, which means that each rotating frame 135 has a plurality of polishing heads 14〇; but a single head is known. 14 91874 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative prints 1246448 A7 ______B7____ V. Invention description (15) CMP Apparatus 100' The polishing head 140, polishing surface 125, and polishing method of the present invention can be used in a multi-head or single-head type polishing apparatus 100. In addition, in this particular CMP design, each polishing head 140 is driven by a single motor 142, the motor drives a chain 145, which in turn transmits the various polishing heads through a chain and sprocket mechanism (not shown); however, the invention can be used for each The polishing head 140 is exemplified by a separate motor rotation, and/or each polishing head is driven by means other than a chain and sprocket type transmission. In addition to the rotation of the polishing pad 120 and the polishing head 140, the rotating frame 13A can perform the orbital movement of the polishing head by centering the fixed center axis of the polishing table 115. Moreover, the polishing head 140 of the present invention can be used in all manner of the CMP apparatus 1' including machines that utilize linear motion or reciprocating motion as is well known in the art. The CMP apparatus 100 also incorporates a chemical pulping mechanism (not shown in Figure 1) to dispense the slurry chemical or slurry onto the polishing surface 125 during the polishing operation, to control the slurry and the slurry and the polishing head 140 on the polishing surface. a moving controller (not shown), and a plurality of different flow passages 旋转 a rotating unit that communicates a pressurized fluid such as air, water, vacuum, etc., between a fixed source external to the polishing head and a portion on or inside the polishing head (Fig. Not shown). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to Figure 2, a specific embodiment of an optical head according to the present invention will be described. Referring to Fig. 2, the polishing head 14 includes a head mounting assembly 15 for mounting the polishing head to the rotating frame 135, and a carrier 155 for clamping on the positioning substrate 105 and the polishing surface 125 during the polishing operation. . The carrier 155 typically includes a sub-carrier 160 on which the lower surface 165 of the sub-carrier holds the substrate 1〇5, and a retaining ring 170 is disposed on a portion of the peripheral surrounding sub-carrier. The sub-carrier 160 and the retaining ring 170 are suspended by the carrier 155, so that it can be rarely-------------------------- (Please read the back Precautions and then fill in this page) Clothing paper size 剌 Zhongguan Jiaxian (CNS) A4 specifications (2) Qx 297 public meals) 15 91874 1246448 Ministry of Economic Affairs Intellectual Property Bureau employees consumption cooperatives printed A7 B7 V. Inventions (16) Friction Unbonded to move in the vertical direction. The sub-carrier 160 and the retaining ring 170 are provided with a small amount of mechanical tolerance between adjacent components to allow the sub-carrier and retaining ring to float on the polishing surface 125 in a manner that allows for a slight angular change during the polishing operation. Referring to Figure 2, the flange 162 is attached to the inner lower surface 164 of the carrier 155 via screws 163 or other fasteners. The flange 162 is joined to the inner support ring 167 by a flexure or airtight gasket 166, and flexibly supports the sub-carrier 16 through the outer support ring 168, and defines a closed chamber or cavity 175 for the sub-load. With 160 above. The retaining ring 17 is supported by a second flexure or airtight pad 176 extending between the sub-carrier 16A of the carrier 155 and the skirt 177. The retaining ring 170 is coupled to the second airtight cushion 176 through an adhesive (not shown) or through a screw 179 or other fastener attached to the back panel on the side of the airtight cushion, as shown in FIG. 2 The flange 162, the lower skirt portion 177, the inner and outer support rings 167, 168 and the second airtight cushion form a second closed cavity 8 above the retaining ring 170. In operation, the sub-carrier 160 and the retaining ring 17 are each biased toward the polishing surface 125, respectively, while providing relative movement between the slurry and the substrate 1〇5 and the polishing surface 125 to polish the substrate. The spring pressure may be provided by a spring (not shown) or by the weight of the sub-carrier 160 or the retaining ring 170 itself. Preferably, as shown in FIG. 2, the sub-carrier 160 and the retaining ring 170 are introduced into the sealed chambers or chambers 175, 18, respectively, above the sub-loads 160 and the retaining ring 170: The polishing surface 125 is pressed. A pressurized fluid is preferred because the pressurized fluid is more uniformly and more easily changed to adjust the polishing or removal rate. Typically, the applied pressure is between about 4.5 and 5.5 pS1, and more typically about 5 psi. However, these ranges are for illustrative purposes only, and any pressure from about 2 psi to about 8 psi is ^--------1--------- (please read the back of the * before you do Fill in this page) This paper size applies to China National Standard (CNS) A4 specification (210 X 297 public) 16 91874 1246448

V. INSTRUCTIONS (17) (Please read the notes on the back and then fill out this page) Adjust to achieve the intended drag or flattening effect. More preferably, the spring pressure or pressure applied to the retaining ring 170 is greater than the spring pressure or pressure applied to the sub-carrier 16〇 to slightly deform the polished surface! 25 thus reduces the so-called edge effect to provide a more uniform removal rate and planarization across the entire surface of the substrate 105. The edge effect refers to a tendency that the removal rate of the edge of the substrate 105 is larger than that of the middle portion due to the interaction of the polishing surface 125 with the edge of the substrate. By pressing down and slightly deforming the polishing surface 125 near the edge of the substrate 1〇5, the retaining ring 170 reduces the pressure that pushes the edge of the substrate toward the polishing surface, thereby reducing the local removal rate to a rate of removal closer to other regions across the surface of the substrate. degree. According to the present invention, the sub-carrier 160 may include a flexible insert such as a flexible member 185 or a film on the bottom surface 165. The flexible insert has a receiving surface 19〇, and the substrate ι〇5 is received. On this side. The flexible member 185 has a plurality of openings or apertures 195 extending through the thickness to the receiving surface 190. At least a portion of the pressurized fluid is applied directly to the surface of the substrate 1053, and the substrate is directly pressurized toward the light-removing surface 125. Typically, the applied pressure is about 2 to 8 psi, and more typically about 5 psi. Preferably, the number and size of the apertures 195 are selected to maximize the area of the substrate i 05 directly exposed to the pressurized fluid while providing sufficient area 190 to engage and contact the substrate 105 to provide torque during the rotational operation. Or the rotation can be from the polishing head 140 to the substrate. Advantages of the flexure 185 of the present invention include: (1) reducing or eliminating the effect of particles or impurities trapped between the receiving surface 190 and the substrate 105 on the degree of polishing uniformity by reducing the area at which the particles will be captured; (ii) reducing Or eliminating non-uniformities caused by polishing of the substrate wrinkles; and (iii) reducing or eliminating polishing non-uniformities due to variations in thickness of the flexure 185. The flexure 185 and the opening 195 in the opening or the opening of the paper are suitable for the Chinese National Standard (CNS) A4 specification (210x 297 metric tons) 17 91874 1246448 A7 5. The invention description (18). In addition, the retaining ring 170 can be suspended from the carrier 155 by the support ring 2 俾 and can be rotated at different speeds relative to the sub-carrier 16 基板 upper substrate 1 〇 5 during the polishing operation. The support ring 200 is designed to apply pressure to the retaining ring 17〇 during the polishing operation. There are two advantages to providing the retaining ring 170 in a rotating manner around the substrate 1〇5. The first point is that since the substrate 105 and the retaining ring 17 are rotated at different speeds, there is no single point on the lower surface 205 of the retaining ring that will correspond to a single point of the edge of the substrate during the polishing operation. Thus, the high or low point on the lower surface 2〇5 of the holding ring 170 can be reduced (even if not completely eliminated) to affect the substrate edge removal rate, thereby preventing uneven projection of the surface of the substrate 1〇5. The second point is that since the influence of the high and low points of the lower surface 2〇5 of the retaining ring 170 is minimized, the lower surface 2〇5 of the retaining ring does not need to be polished to a high degree of flatness, and thus the production cost of the retaining ring can be reduced. In addition, since the retaining ring 170 is a consumable, the substrate i 05 is worn away as it is polished, and the cost of the retaining ring is reduced, which greatly reduces the operating cost during the operational life of the CMP device. The holding ring 170 in rotation is described in detail later. 4 The flexible member 185 is illustrated with reference to Fig. 2 and Figs. 3 to 7, showing various embodiments of the receiving surface 1 90 and the aperture 195 therein. Referring again to Figure 2, the flexure 1 85 is typically made of a polymeric material that does not react with the substrate 105 and chemicals used in the light transfer operation, such as ePDM, EPR, fluorenone or rubber, and flexibility. The member 85 is stretched over the sub-carrier lower surface 165 and separated from the lower surface 165 by an annular edge or an angular ring member, and the crucible is formed into a lower cavity 215 which is sub-supported by the sub-carrier ι6. 165, the angle ring member 210, the flexure 185 and the bearing 190 bearing the surface 190 ------------ loading (please read the back of the note to write this page) Ministry of Intellectual Property Bureau employees consumption cooperatives printed paper scale applicable to China National Standard (CNS) A4 regulation (210 297 mm) 18 91874 1246448 A7 B7 V. Invention description (19) on the lower side of the substrate 105 . The pressurized fluid is directed to the lower cavity 215 via the passage 22, and the passage 22 is coupled to the port 225 of the lower surface 165 of the sub-carrier 16. The corner ring member 210 may be made of a non-compressible or substantially non-compressible material, such as a metal, a hard polymer material, etc.; or to reduce edge effects, the corner ring member is made of a compressible material or an elastic material such as soft plastic, rubber, or stone. Made of materials such as oxygen. Referring to Figure 3, there is shown a plan view of a writing surface 190 of a flexure 185 in accordance with an embodiment of the present invention. This figure shows that a plurality of orifices 15〇 are distributed in a regular symmetry manner across the spanning surface 190. As previously described, the number and size of apertures ι 95 are selected to provide a sufficient area for the receiving surface 19 to contact the substrate 105 to impart torque or transfer energy to the substrate during polishing operations to cause substrate rotation. The surface area of the bearing surface is found to have a total area of orifices 195 of from about 50 to about 90% of the surface area, and more preferably from about 66 to about 75% of the surface area to provide sufficient bonding. In a preferred embodiment, the edge of the aperture 195 provides a higher torque by stiffening the flexure 185 relative to the direction of rotation of the polishing head 140 to increase the engagement between the flexure and the substrate 105. For example, an aperture 19 5 having the shape shown in the printed figure of the Intellectual Property Officer X Consumer Cooperative of the Ministry of Economic Affairs can increase the engagement when the polishing head is rotated in a clockwise direction. Other designs and patterns for the aperture 195 of the flexure 185 receiving surface 190 are shown in Figures 4-7. Figure 4 is a plan view showing another embodiment of a flexure 1 85 having a plurality of larger apertures 195 having a more regular spacing without an included rim. Figure 5 is a plan view of another embodiment of a flexure 185 showing a plurality of circular apertures 195 in a schematic view. Although the specific embodiment is shown, the size of the perforated paper is applicable to the Chinese National Standard (CNS) A4 specification (21〇χ297 mm). 19 91874 1246448 A7 B7 5. Inventive Note (20) The diameters of the ports 1 95 are equal. It is to be understood, however, that the size and number of orifices and the cross-bearing surface 190 can be varied without departing from the scope of the invention. Figure 6 is a plan view showing another embodiment of a flexure 185 having a plurality of chevrons or 乂-shaped apertures 195 disposed about the periphery of the receiving surface 190 of the flexure 185. Again, although not shown, the flexure 185 can have a second loop aperture 195 located inside the first loop and concentric with the first loop. The chevron aperture 195 of the second turn may be oriented in the same direction or opposite to the first turn. However, it has been found that the reversal of the chevron toward the direction of rotation of the polishing head 140 increases the engagement between the flexure 185 and the substrate 105 thereby providing higher torque. A plan view of yet another embodiment of the flexure 185 is shown in Figure 7. In Figure 7, aperture 195 includes two relatively large openings or apertures. Again, although shown as a circle, the apertures 195 may have any regular or irregular shape including polygonal and elliptical shapes, and the apertures do not need to have the same shape or large 〇 Ministry of Economic Affairs Intellectual Property Bureau employees consumption cooperatives printed reference 8 In another feature of the present invention, the raised lip 230 of the lower surface port 225 of the sub-carrier 16 and the flexure 185 having the wafer 1〇5 thereon are suitable as the isolation valve 235. The mouthpiece 22 5 is used to separate the mouth 225 from the lower cavity 215 when the lower cavity is evacuated. During the polishing operation, when the substrate does not contact the polishing surface 125, the substrate 1〇5 is vacuumed to the receiving surface 190 in the lower cavity 215. For example, evacuation can be performed during and after the polishing operation during loading and unloading. In the prior art, the problem that the polishing layer has a soft insert and the vacuum is used to clamp the substrate to the polishing head causes the substrate to be deformed to cause stress on the substrate, especially for the edge of the substrate, and the edge of the substrate is changed from a flat surface to a concave surface. The greatest extent, the result may result in the entire injury or wear of the substrate. Depending on the processing point at which the loss occurs, the paper size of the semiconductor substrate is applicable to the Chinese National Standard (CNS) A, 4 specifications (210x 297 mm). 20 91874 1246448 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed A7 B7 V. Invention Note (21) The loss will be much more. Thus, the advantages of the present invention are separated from the lip 230 of the mouthpiece 225 via the optional flexure 185, which can be separated from the lower cavity 215 when a predetermined vacuum has been reached. The predetermined vacuum is selected to provide sufficient force to clamp the substrate 105 and the receiving surface 190 while reducing the deformation of the flexible member ι 85, thereby reducing the stress on the substrate. If desired, the CMP apparatus 100 further includes a vacuum switch 240 or transducer (shown schematically in Figure 8) coupled to the port 225, which senses the receiving surface 19 by the switching state or the changing state when the predetermined vacuum is reached. The existence of 5. As shown in Fig. 8, the aperture I% of the flexure is sized and positioned such that the aperture 195A on the opposite side of the jaw 225 has a diameter smaller than the diameter of the surrounding lip 230. The aperture edge seals the opening to the substrate. 05. An advantage of this embodiment is that it allows direct application of vacuum to the substrate 105, evacuation, and removal of any air pocket between the substrate and the receiving surface 1 90. Additionally, in another embodiment (not shown), the aperture 195 can be sized and positioned such that the substantially unbroken location of the flexure ι 85 is on the opposite side of the mouth 2 25 . An advantage of this embodiment is that it can reduce the problem of failure of any isolation valve 235 due to misalignment of orifice 1 95 with mouth 225. In another embodiment illustrated in Figures 2 and 9, the lower surface 165 of the sub-carrier 160 further includes a spacer 243, the spacer having one or more slots or channels 245 disposed in the mouth 225 and below The outer space of the cavity 215 assists in evacuating the lower cavity; and assists in introducing pressurized fluid into the lower cavity during the polishing operation. The spacer 243 includes a separate component that is positioned or securely attached to the lower surface 165 of the sub-carrier 16 by an adhesive or mechanical fastener (not shown). In addition, as shown in Fig. 9, the channel 245 is attached to the sub-carrier 160. I ^ --------^--------- (Please read the notes on the back and fill in this page. The paper & degree is applicable to the Chinese National Standard (CNS) A4 specification (210x 297 public meals) 21 91874 1246448 A7 V. Inventive Note (22) The lower surface 165 directly processes the crucible to form the inter-body 2 43. Fig. 9 is a schematic view showing a specific embodiment of the present invention, and a right side view of a lower surface 165 of a sub-carrier 160 of a plurality of symmetrically spaced radial passages 245. In a further refinement of the present embodiment, the flexure 185 is selected from the land portion 250 of the raised portion of the "female bucket" or the lower surface 165 of the lower surface 165. The deformation of the flexure 185 can be further reduced, thereby supporting the yoke substrate 105, preventing excessive bending on the substrate, and further reducing the stress on the ν violent plate. The exact separation distance will depend on a number of factors. The decision 'includes the base cup month ^ ^ arrogant and the size or diameter of the undercut surface 19 。. It is found that for a diameter of about 200 mm, the appropriate spacing is less than about 100 microns. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives, with reference to Figures 2 and 10, which illustrate the rotating holding ring 17〇, and Figure 2 shows a different embodiment of the rotating holding ring. Referring again to Figure 2, the holding ring 17 has an upper The surface 225 is in a face-to-face (symmetric) relationship with the lower surface 26 of the support ring 200 and is separated from the support ring by a bearing 260. The bearing 26 can be a ball bearing, a · μ body dynamic bearing, a roller bearing or a cone Bearing. 2 and the concrete example shown in the figure, the bearing 260 is a roller bearing having an inner race or inner casing 265, a plurality of balls 270, and an outer race 275 formed on the retaining ring 170. The inner annular space 280 is disposed between the retaining ring ι7〇 and the sub-carrier 16〇, so that the retaining ring 170 and the sub-carrier 16〇 can rotate relative to each other during the polishing operation. Preferably, the retaining ring 170 further includes a coupling mechanism. The mechanism will couple to the carrier 15 when the polishing head 140 is raised by the polishing surface 125. In the particular embodiment illustrated in Figure 2, when the polishing head 140 is raised by the polishing surface 125, the coupling is held by the retaining ring 170 The first lip 285 is achieved, and the first lip bond supports the paper size for the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 22 91874 1246448 A7 __B7 V. Invention Description (23 y ring 200 and second Lip 290. In the non-specific embodiment, the first lip 285 is formed by a plurality of bolts 295. 'The individual bolts have a main shaft portion and are inspected on the solid, clothing or bearing body 265, and the bolts. There is a head 305 with a surface drawn by the main σ Ρ / ° 4 direction And the second lip 290 of the support ring 200 is joined when the carrier 155 is raised by the polishing surface 125. Preferably, at least three bolts 295 are evenly spaced apart from the periphery of the retaining ring m. Support ring 200. As explained in the text, by reducing (even if not eliminating) the effect of the low point of the lower surface 2〇5 of the retaining ring 17 7 , the rotating retaining ring provides uniformity of surface material removal rate across the substrate 〇 5 The increase and the flattening of the substrate are increased. The holding ring can be rotated relative to the sub-carrier 16〇 during the polishing operation, and the rotation mode is caused by the friction between the holding and the polishing surface i 2 5, thereby causing the holding ring to be sub-loaded. The 160 has a slower rotation and the sub-carrier 16 is rotated by the transmission mechanism. Additionally, the retaining jaw 170 can be rotated by a second transmission mechanism coupled thereto. The second transmission mechanism can be a split motor 315 as shown in Fig. ο, or a gear or chain and sprocket drive coupled to the polishing head drive (not shown). The advantage of a particular embodiment that relies on friction to rotate the retaining ring 170 is that the design is simple and durable. An advantage of using a second embodiment of the second transmission mechanism is that the difference in rotational speed between the substrate 105 and the retaining ring 17 that is clamped on the sub-carrier 丨6〇 can be controlled, and the reverse rotation can be maintained in the direction of the sub-carrier. ring. In another feature of the invention, the optical head 14 having an integrated pulping mechanism 320 is provided for slurrying chemicals or slurry onto the polishing surface 125 during the polishing operation. In order to prevent contamination and provide consistent results, the slurry is usually not recycled or recycled. In addition, due to the purity of the slurry and the paper & the Chinese National Standard (CNS) A4 specification (210 X 297 mm)

Please read the notes on the back first. J. Fill in the page. I ^ Page I. The Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumers Co., Ltd. Printed by Q1X74 1246448 A7 ------——^--- V. Inventions (24) Special There is a strict requirement for the abrasive particle size of the suspension slurry, so a significant cost factor for the conventional operation of the cMp device is the slurry cost. One of the problems with the conventional cMp device 100 is that the slurry is dispensed onto the polishing surface 125 in front of the polishing head, so that an excess slurry must be dispensed to ensure that the substrate will cover the substrate as it flows through the polishing surface 125. The entire surface with the polishing surface 125. The polishing head uo according to the present invention includes a plurality of ports 325 that are positioned around the carrier 155 or around the holding ring 170 of the substrate 105, thereby ensuring that the king area between the substrate and the polishing surface 125 is covered and reduced or eliminated. Waste of slurry. The large h and number of the mouthpieces 3 2 5 are selected to provide sufficient hiding power and diameter in relation to the size of the substrate 105 that accepts the light. In addition, the size of the cornice 325 is also selected to be compatible. The specific slurry viscosity and particle size used. For example, it was found to use a slurry with a viscosity of 1.5 centipoise and a particle size of i 〇〇 nanometer to grind 2 〇 () Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed on the millimeter substrate 105, the diameter is about 3 to about! The mouth of the millimeter is about 2 to 2 feet. In one embodiment, as shown in Fig. u, the slurry is slurried by a mouthwash 325, and the mouth is uniformly dispersed around the lower surface 2〇5 of the retaining ring 17. In another example, as shown in Fig. 12, the mouthpiece 325 is disposed in the annular space 28 of the holding ring 17A and the sub-carrier 160. Preferably, the cornice is evenly spaced between the retaining ring 17〇 and the sub-carrier 160 around the annular space 28〇. More preferably, the CMp device 100 further includes a flushing fluid supply 330, a slurry supply 33 5 and a valve 340 for switching therebetween, and the port 325 is further adapted to flush the retaining ring 170 and the secondary during maintenance operations. The carrier has an annular space of 28 inches. In yet another feature, the present invention is directed to a polishing surface 125 having a plurality of depressions or recesses that are non-uniformly concentrated on the polishing surface and that control the removal rate across the surface of the substrate 105. As mentioned above, the concave surface of the polishing surface 125 is applicable to the Chinese National Standard (CNS) A4 specification (210 297 mm) 24 91874 1246448

V. INSTRUCTIONS INSTRUCTIONS (25) Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperatives Printing Dispersion chemicals or slurries are between the polished surface and the surface of the substrate 1〇5 placed on it. Typically, the recess can be a plurality of slots 345 or a plurality of pockets or cavities 350, which may or may not have the same dimensions and may or may not be spaced apart across the polishing surface 125. In other words, the recess includes a slot 345 or cavity 350 having a radially spaced non-uniform spacing across the polishing surface or a slot 345 or cavity 350 having a non-uniform loading area. Referring to Figure 13A, in a specific embodiment, the polishing surface 125 is a rotating surface having a disk shape, and the concave portion includes a plurality of concentric slits 345 having a uniform ice and width. Evenly distributed across the polished surface. Note that in Fig. 13A and Figs. 14, 15, 16 and 17 which will be described later, since the slit 345 has a small width with respect to the polishing surface 152, the slit is shown as a single solid line. This line indicates that the grooving is on the polished surface 125 and should not be considered as any message that conveys the dimensions of the grooving. Generally, the surface area of the polishing surface 125 contacting the substrate 105 is large due to the large distance between the slits 345, and as shown in Fig. 13B, the removal rate of this region is larger than that of the other regions. Thus, as shown by the dashed line 3 55 of Figures 13A and 13B, the positioning polishing head 14〇 will provide a higher removal rate at the center of the substrate 105 than the edge, and the edge will periodically move through the concentrated region with a higher slot 345 (or cut The lower surface area between the slots). This is particularly desirable for processing substrates having multiple layers of material, such as a copper layer, which tend to exhibit a convex shape due to the nature of the material and the deposition process. For the polishing surface 125 having the slit 345 as shown in Fig. 13A, the change grooving is found, and about 20 slits are changed from each radial straight line of the first zone to about 1 slit of the second zone, and the first The removal rate between the first zone and the second zone is about 5%, and the first zone provides a slower removal rate than the second zone. 〇^9 ^--------Book-------!# (Please Read the precautions on the back and fill out this page. Applicable paper graves are applicable to China National Standard (CNS) A4 (21〇χ297 mm). 25 91874 1246448 A7 B7 V. Inventions (26) Others have multiple The design and pattern of the polishing surface 125 of the evenly spaced slots 345 is shown in Figures 14-17. Fig. 14 is a schematic view showing a plan view of a specific embodiment of a polishing surface 1 2 5 having a single non-uniformly spaced helical slot 354. The grooving 345 provides a relatively shallow surface area between the center and the edge of the edge of the polishing surface 125 in a spiral or wound manner and a relatively surface area between the center and the edge intermediate portion. Fig. 15 is a schematic view showing a specific embodiment of a polishing surface 1 2 5 having a plurality of non-uniformly spaced helical slits 345. Again, the slits 345 are spaced apart from each other and wound to provide a zone having a lower surface area between the slits near the center and edge of the polishing surface 125, and a higher area in between. Surface area. Figure 16 is a simplified plan view showing a particular embodiment of a polishing surface 125 having non-uniformly spaced concentric ellipses 345. Figure 17 is a schematic plan view showing a specific embodiment of a linear polishing surface 125 having non-uniformly spaced parallel slits 345. It should be noted that in this embodiment, the linear polishing surface 125 may be a fixed linear surface, the polishing head 14〇 is moved on a fixed linear surface, or the linear polishing surface is a rotating belt (not shown). Printed by the Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperatives Figures 18 through 20 show other designs and patterns of the polished surface 125 in which the spacing between the recesses is relatively uniform and the dimensions of the recesses vary to provide different removal rates for each zone. Referring to Fig. 18, a partial cross-sectional side view of a particular embodiment of a polishing surface 125 having a plurality of uniformly spaced slots 345 and having a uniform width and a non-uniform depth is provided. In this embodiment, the surface area of the polishing surface 125 contacting the substrate ι 5 is constant in each zone, and the difference in removal rate is controlled by changing the depth of the slit 345 to adjust the amount of slurry in the zone. This embodiment can be used in a method which uses an abrasive material and a slurry, and is particularly useful as an important component of the chemical reactive polishing process of the slurry. 1246448 A7 B7 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperatives Printing V. Invention Description (27) Figure 19 is a view showing a polishing surface having a plurality of uniformly spaced slots but having a non-uniform width according to an embodiment of the present invention. Partial cross-section of 1 2 5 . As described above, the change in surface area of the contact substrate 1〇5 provides a difference in removal rate. Figure 20 is a plan view showing a plan view of a light-removing surface 125 of a cavity 350 having a uniform spacing but a non-uniform size, in accordance with an embodiment of the present invention. It should be noted that the cavity 3 5 shown in Figure 20 is sized and shaped for illustrative purposes only. 'It cannot be considered to convey any restrictions on the dimensions or shape of the cavity. The cavity shape can be regular or irregular. The cavity can be It has a dimension ranging from a few tenths of a meter to a few millimeters. Again, the change in surface area of the contact substrate 1〇5 will provide a difference in removal rate. Although not shown, it is readily understood that the change in removal rate can also be achieved across a uniform size cavity 35 that is non-uniformly spaced apart from the relief surface 125 or a uniformly spaced cavity having a uniform size opening and varying depth. Referring now to Figure 21, a method of operating CMP apparatus 100 in accordance with the present invention. In the initial loading step, the substrate 105 is received on the bearing surface 190 of the flexure 185 (step 360). A vacuum is applied through the mouth 225 at the lower cavity 215 (step 3 65) until a predetermined degree of vacuum is reached and the mouth is separated (step 37A). The presence of the substrate 1〇5 on the receiving surface 190 is sensed by switching the vacuum switch 240 coupled to the port 225 as needed (step 375). The substrate 1〇5 is disposed on the polishing surface 225 (step 380), and the pressurized fluid is guided into the lower cavity 21 to push the substrate toward the polishing surface 125 (step 385). A chemical such as water or slurry is slurried to the polishing surface 125 (step 390)' and distributed through the recesses on the polishing surface between the substrate 1〇5 and the polishing surface (step 395). These recesses may provide a slit 345 or a cavity 350 that is spaced apart and/or non-uniform in size. The cross-polishing surface 125 is provided as described above (please read the TOP on the back and fill in the page). The paper & degree applies to the Chinese National Standard (CNS) A4 specification (210 X 297 public meals) 27 91874 1246448 A7 B7 V. The change rate of the invention (28). Relative motion is provided between the polishing surface 125 and the substrate 1〇5 to polish the substrate (step 400). If necessary, the holding ring ι7〇 is rotated at different speeds relative to the sub-carrier 160 and the substrate 1〇5 held thereon to reduce, if not eliminate, the effect of the high and low points of the lower surface 205 of the holding ring 170 on the removal rate (steps) 405). After the polishing is completed and the polishing head 14 〇, the holding ring 17 〇 and the polishing table Π 5 are stopped, the vacuum is again applied to the lower cavity 215 (step 41 〇) until the predetermined degree of vacuum is reached (step 415), the substrate 1 〇 5 Raised by the polishing surface 125 (step 420). Some important features of the present invention will now be repeated, further emphasizing its structure's functions and advantages. SUMMARY OF THE INVENTION The present invention is directed to a polishing head for positioning a substrate having a surface on a polishing surface of a polishing apparatus. The polishing head includes a carrier, a sub-carrier carried by the carrier, the sub-carrier being adapted to hold the substrate during the drag operation, and a retaining ring disposed in a rotatable surround sub-carrier. The retaining ring has a lower surface that is substantially flush with the substrate surface and contacts the polishing surface during the polishing operation. The retaining ring is rotatable relative to the substrate held on the sub-carrier to prevent non-flat polishing of the substrate surface. In one embodiment, the sub-carrier can rotate the substrate held thereon during the polishing operation, and the retaining ring can be rotated at a different speed than the substrate on the clamping sub-carrier. In another embodiment, the polishing head further includes a support ring system in face-to-face relationship with the upper surface of the retaining ring and spaced from the retaining ring by a bearing. The support ring is adapted to apply pressure to the retaining ring during the polishing operation. The bearings can be ball bearings, fluid dynamic bearings, roller bearings or tapered bearings. Preferably, the winter paper is suitable for the _ home standard (CNS) A4 specifications (2) 〇 x 297 ^) --- (please read the back; i intend to fill out this page) - installed. Ministry of Economics intellectual property Bureau employee consumption cooperative printing 1246448 A7 V. Invention description (Lip II Li: a first lip, when the carrier is raised by the polishing surface - the second lip is turned to hold the ring to the support ring. In this case, please read the back of the matter. i policy page I w IIIIII book the spindle adjacent to the 'first lip including multiple screw inspections' each screw has a protrusion = a head, the head has a surface by the spindle The radial direction is outwardly slid to the second nip of the support ring when the carrier is raised by the polishing surface. To the solid = in the specific embodiment, the polishing head further comprises a transmission mechanism, and the coating is caused by the holding ring during the polishing operation. The friction between the secondary load and the rotary two =::: can be used for a period of time. The polishing head of the invention can be used in a polishing device, such as CMP. The U-shaped further includes a polishing surface and a slurry with a purple mechanism, which is suitable for: first operation The slurry is supplied to the polishing surface during the period. In addition, the drag device has a polishing surface having a fixed abrasive disposed thereon, and a chemical pulping mechanism adapted to dispense the chemical to the polishing surface during the polishing operation. In a specific embodiment, a polishing apparatus is provided for polishing the surface The method of the substrate, the polishing apparatus has a polishing surface, and the carrier is provided with a sub-carrier and a retaining ring disposed around the sub-carrier and having a lower surface. The method comprises the steps of: setting the substrate on the sub-carrier, The surface of the US plate is substantially flush with the lower surface of the ring, and the surface of the substrate and the holding ring are twisted to push the surface of the calender substrate toward the polishing surface, and the ring is held relative to the sub-carrier to inhibit the surface of the substrate. Flat evacuation. The method further includes the step of rotating the holding on the sub-carrier substrate during the polishing operation, and the step of rotating the holding ring includes the step of rotating the holding ring at a different speed than the substrate clamped on the sub-carrier 1__— _ This paper scale applies to China National Standard (CNS) A4 specification (210 X 997 cm). A 29 91874 1246448 A7 _B7 V. Description of invention (3〇) A specific In the embodiment, the friction is applied to the holding loop: 4 involves the step of rotating the retaining ring by polishing the lower surface of the topcoat. The second: the optical device further includes the transmission base to engage the holding ring to hold the ring: the steps include operation The transmission mechanism rotates the holding ring; the two-loaded side: the optical head includes a substrate Lt that is fixedly held by the rotating fixed holding ring: the holding ring is rotated relative to the sub-carrier, so that: T is uniformly polished. In an embodiment, the means for rotating the retaining ring can rotate the retaining ring at the same speed as the substrate held on the sub-carrier. In another embodiment, the carrier further includes a support ring system in a face-to-face relationship with the upper surface of the retaining ring. In the polishing operation, the application of the temple pressing force to the holding % 'allows the rotation of the holding ring relative to the substrate to separate the support ring from the holding ring. Bearing In yet another embodiment, the optical head further includes a transmission mechanism that is coupled to the retaining ring to ensure rotation of the substrate relative to the substrate held by the sub-load during the light-removal operation. Thus the friction between the retaining ring and the extinguishing surface is such that: % can be rotated relative to the sub-carrier during the polishing operation. The invention is also directed to a polishing head having a surface substrate positioned on a polishing surface of a polishing apparatus. The polishing head includes a carrier adapted to hold the substrate during the calendering operation. The carrier has a lower surface, the flexure is secured to the carrier and extends across the lower surface, and the corner ring member is disposed between the flexure and the lower surface to form a cavity 6 between the flexure and the lower surface. The carrier is provided with a passageway in communication with the lower surface for introducing pressurized fluid into the interior of the cavity. The flexure has a receiving surface adapted to engage the substrate to urge the substrate toward the polishing surface during the polishing operation. The flexure has a certain thickness and a plurality of holes extend through the thickness to the installation—(Please read the back of the precautions 爯 fill out this page) Order · Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Print this paper Μ义 China Standard (CNS) A4 Specification (21G X 297 Metric) 30 91874 1246448 A7 V. INSTRUCTIONS (31) The receiving surface is used to directly apply pressure to the substrate. Preferably, the flexure is further adapted to seal the substrate against the receiving surface and to pressurize the cavity. In one embodiment, the carrier further includes a sub-carrier carried by the carrier, the flexure being securely attached to the sub-carrier and extending across the lower surface of the sub-carrier. In another embodiment, the polishing apparatus further includes a transmission mechanism for rotating the carrier during the polishing operation, the number and size of the plurality of holes being selected to provide a frictional force between the receiving surface of the flexible member and the substrate, and imparting rotational energy to the substrate . In yet another embodiment, the lower surface of the carrier includes a port that communicates with the passage. The mouthpiece is adapted to contain pressurized fluid to the interior of the cavity during the polishing operation. In one version of this embodiment, the lower surface of the carrier further includes at least all of the slots adapted to dispense pressurized fluid from the mouth throughout the cavity. In another form, the cornice is further adapted to evacuate the chamber six, and the flexure and the substrate are used as valves to separate the fistula from the cavity when the predetermined vacuum is reached. Preferably, the predetermined vacuum is selected to clamp the substrate to the receiving surface during loading and unloading before and after the polishing operation. More preferably, the polishing apparatus further comprises a vacuum switch coupled to the Ministry of Economy, the Intellectual Property Office, the employee consumption cooperative, the printing mouth, and the predetermined vacuum is selected to switch the vacuum switch when the substrate is clamped to the receiving surface. The polishing head of the present invention is particularly useful for polishing devices such as CMp. Typically, the apparatus further includes a polishing surface, and the slurry dispensing mechanism is adapted to dispense the slurry onto the polishing surface during the polishing operation. Additionally, the apparatus has a polishing surface with a fixed abrasive thereon and a chemical dispensing device adapted to dispense the chemical to the polishing surface during the polishing operation. This paper & degree applies to China National Standard (CNS) A4 grid (210 X 297 mm) 31 91874 1246448 A7 - B7 V. Inventive Note (32) In another feature, a method is provided for polishing with a polishing device A substrate having a side having a polishing surface and a carrier provided with a lower surface 'and a flexure extending across the lower surface. The tie member has a bearing surface and a thickness and a plurality of holes extend through the thickness to the receiving surface. The method includes the steps of positioning a substrate between the carrier and the polishing surface, engaging the flexible member with the substrate, and stopping the substrate surface on the polishing surface, and applying pressure to the flexible member to push the substrate toward the polishing surface, thus polishing the substrate The steps of the surface. The pressure extends through the orifice and thus directly applies pressure to the substrate. In a specific embodiment, the carrier further comprises a corner ring member disposed between the flexure and the lower surface to form a cavity, the lower surface of the cavity having a mouth adapted to introduce pressurized fluid into the cavity, applying pressure to the blade The step of the feature design accommodates pressurized fluid to the interior of the cavity via the fistula. Preferably, the polishing apparatus further includes the transmission mechanism rotating the carrier during the polishing operation, the method further comprising the step of providing torque to the substrate through the flexure. More preferably, the number and size of the plurality of holes extending through the thickness of the flexure are selected to provide a sufficient degree of friction between the printed surface of the printed member of the Intellectual Property Office and the substrate during the polishing operation. The substrate provides rotational energy. In one embodiment, the cornice is further adapted to evacuate the cavity, the method further comprising the step of loading the substrate onto the receiving surface by vacuuming the cavity. Preferably, the step of loading the vacuum further involves separating the mouth and the cavity using the flexure and the substrate as a valve when a predetermined vacuum is reached. Furthermore, the polishing device has a vacuum switch coupled to the mouth. The loading step involves the use of a switching vacuum switch to sense the presence of the substrate on the wood sheet when the predetermined vacuum is reached. The Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applied. Meal) 32 91874 1246448 A7 B7 V. Description of invention (33). The method further includes evacuating the cavity during the unloading step after the polishing operation to clamp the substrate to the receiving surface before the carrier is raised from the polishing surface. In still another feature, the polishing apparatus for polishing a substrate has means for directly applying a pressurized fluid to the substrate, pushing the substrate toward the polishing surface, and means for transferring the rotational energy from the carrier to the substrate during the polishing operation. Preferably, the means for applying the pressurized fluid directly to the substrate comprises the attachment of the flexure to the lower surface of the carrier that holds the substrate during the polishing operation. The flexure has a receiving surface adapted to engage the substrate, having a thickness and a plurality of apertures extending through its thickness to the receiving surface for direct application of pressure to the substrate. More preferably, the means for imparting rotational energy to the substrate by the carrier includes a flexure receiving surface. The number and size of the apertures are selected to provide sufficient friction between the receiving surface and the substrate to provide rotational energy to the substrate. The invention also relates to a polishing head for polishing a substrate having a surface to a polishing surface of a polishing apparatus, the apparatus having a carrier adapted to hold the substrate during a polishing operation. The carrier has a lower surface that is securely attached to the carrier and extends through the lower surface. The flexure has a bearing surface for engaging the substrate. The carrier is provided with a rake extending through the lower surface for extraction, and the corner ring member is disposed between the flexure and the lower surface adjacent the rake. The wrap member has a thickness and at least one of the apertures extends through the thickness to the receiving surface, the aperture being substantially aligned with the chin. The flexure can be moved by the first position, the flexure being spaced apart from the lower surface adjacent the jaw at the first position, and the flexible member is attached to the position of the person. The lower surface around the mouth, the orifice is at least partially aligned with the mouth, so the mouth can be extracted and the substrate can be held to the receiving surface during at least part of the polishing operation.

@ θ家标准(CNS)A4秘(2)Q χ 29tT^J in this paper

Aw ^ ^---------. (Please read the note on the back and fill out this page) 01 «7/1 1246448 A7 B7 V. Description of invention (34) This spacer is essentially limited to apply only It is extracted to a portion of the substrate, thus reducing undesired stress on the rest of the substrate. Preferably, the flexible member is adapted to seal the substrate on the receiving surface and permit evacuation of the cavity. In one embodiment, the flexure and the substrate act as a valve to separate the jaws from the cavity when a predetermined vacuum is achieved, thereby reducing deformation of the flexure and minimizing stress on the substrate being held on the receiving surface. In one version of this embodiment, the spacer includes a thickness separating the flexure and the lower surface of the carrier, the thickness being selected to further reduce the deformation of the flexure when the cavity is evacuated. Reduce the stress on the substrate held on the receiving surface. In another aspect, the polishing apparatus further includes a vacuum switch coupled to the mouthpiece for sensing the presence of the substrate on the receiving surface by switching the vacuum switch when a predetermined vacuum is reached. In another embodiment, the polishing apparatus further includes a drive mechanism for rotating the carrier during the polishing operation, the aperture being sized to obtain sufficient friction between the flexure receiving surface and the substrate to provide rotational energy to the substrate. In still another embodiment, the plurality of apertures extend through the thickness of the flexure to the receiving surface. In one aspect of the embodiment, the carrier further includes a passage communicating with the jaw for introducing pressurized fluid into the interior of the cavity during the polishing operation; and the plurality of apertures adapted to allow pressurized fluid to pass directly through the plurality of apertures The port is applied to the substrate and the substrate is pressed against the polishing surface during the polishing operation. In another aspect, the polishing apparatus further includes a transmission mechanism for rotating the carrier during the polishing operation, the number of apertures being selected to provide sufficient friction between the receiving surface of the flexure and the substrate to supply rotational energy to the substrate. In another feature, a method is provided for using a polishing device (please read the back; i tone?: fill out this page). The Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative, prints the paper and applies it to the Chinese country. Standard (CNS) A4 specification (210 x 297) 34 91874 1246448

The light-removing substrate having a surface, with a carrier, is adapted to hold the substrate during the polishing operation. The carrier has a lower surface to which a flexure is attached, and an angular ring member is disposed between the flexure and the lower surface to form a cavity between the flexure and the lower surface. The lower surface of the vehicle is provided with a mouthwash. The mouthpiece is suitable for vacuuming the cavity. The flexure has a receiving surface to accommodate the substrate. The flexure has a thickness and at least one aperture extends through the thickness to the receiving surface. The method includes the steps of receiving the substrate on the receiving surface, evacuating the cavity, clamping the substrate to the carrier, and setting the surface of the substrate to the polishing surface. Preferably, the step of evacuating the cavity includes separating the opening and the cavity with the flexure and the substrate as a valve when a predetermined vacuum has been reached. Preferably, the polishing apparatus further comprises the step of including the vacuum switch and the mouth opening method further comprising the step of sensing the presence of the substrate on the receiving surface by switching the vacuum switch when the predetermined vacuum has been reached. The invention also relates to a polishing head for positioning a substrate having a surface on a polishing surface of a polishing apparatus. The polishing head includes a carrier having a bottom surface. The bottom surface includes a lower surface adapted to hold the substrate during the polishing operation. The carrier is provided with a plurality of bees extending across the bottom surface around the lower surface for dispensing polishing material onto the polishing surface during operation. Usually the mouthpiece is designed to fit the slurry from the abrasive to the polished surface. Additionally, when the polishing surface comprises a stationary abrasive, the cornice is adapted to dispense slurry to the polishing surface during the polishing operation. In a specific embodiment, the cornice is disposed inside the retaining ring. In another embodiment, the carrier further includes a sub-carrier having a receiving surface, the substrate is clamped on the receiving surface Y during the polishing operation, and the holding ring is disposed around the sub-carrier and borrows from the annular space. Separate the paper from the sub-carriers and apply the Chinese National Standard (CNS) A4 specification (L) 10 X 297 mm) Please read the meaning of the back page and fill in the information on this page. Printed by the company Q1874 1246448 A7 ____________Β7^_ V. Description of the invention (36) In one version of the specific embodiment, the mouthpiece is placed inside the %-shaped space between the holding ring and the sub-carrier. Preferably, the cornice is evenly spaced from the %-shaped space between the retaining ring and the sub-carrier. It is better to have 2 to 3 埠 mouths. The optimum boring is further adapted to flush the ring between the retaining ring and the sub-carrier during maintenance operations. Finishing The polishing head of the present invention is particularly useful for polishing devices such as CMp. The typical apparatus further includes a polishing surface adapted to slurry the slurry comprising the abrasive to the polishing surface during the polishing operation. In addition, there is a fixed abrasive on the polishing surface, and the mouth is suitable for mixing water to the polishing surface during the light-removing operation. In another aspect, a method of polishing a substrate having a surface is provided which utilizes a polishing apparatus having a polishing surface and a carrier having a bottom surface adapted to hold the substrate during the polishing operation. The method comprises the steps of: «Relocating the substrate on the lower surface of the carrier, pushing the carrier against the polishing surface, thereby pushing the surface of the substrate toward the polishing surface, and slurrying the polishing material onto the polishing surface via the bottom surface of the carrier. In one embodiment, the polishing surface is provided with a fixed abrasive thereon, and the step of dispensing the chemical to the polishing surface comprises dispensing purple water onto the evacuation surface. Further, the chemical mechanical polishing apparatus further includes a slurry supply source for supplying the slurry to the plurality of rinsing ports, and the step of dissolving the syrup to the polishing surface comprises the step of dissolving the slurry to the polishing surface. In one version of this embodiment, the polishing apparatus further includes a flushing fluid supply source that supplies flushing fluid to the plurality of ports 'and a valve is exchanged between the slurry supply source and the flushing fluid supply source'. The method includes the substrate Steps to further rinse multiple rinsings after polishing 0 fttRead the phonetic transcription on the back first? Matters to fill out this page) - Packing ------------- Order ---------. Ministry of Economic Affairs Intellectual Property Bureau employees consumption cooperatives printed this paper scale applies to Chinese national standards (CNSM4 specifications (21〇 χ 297 mm) 36 91874 1246448 Ministry of Economic Affairs Intellectual Property Office Staff Cooperative Cooperative Printed A7 B7 V. Invention Description (37) In another aspect, a polishing head provided with a surface of a substrate on a polishing surface of a polishing device, a polishing head A slurry apparatus is provided for dispensing the chemical from the polishing head to the polishing surface during the polishing operation. In one embodiment, the apparatus for slurrying the polishing head includes means for dispensing the slurry comprising the abrasive onto the polishing surface. Additionally, the polishing surface is provided with a fixed abrasive thereon, and the means for dispensing the chemical by the polishing head includes means for dispensing the slurry to the polishing surface during the polishing operation. In another embodiment, the polishing head is formulated with a chemical. The device includes a plurality of ports disposed inside the retaining ring. The preferred carrier further includes a sub-carrier having a receiving surface, the substrate is clamped on the receiving surface during the polishing operation, and the ring system is retained The sub-carrier is centrally disposed and spaced apart from the sub-carrier by an annular space. More preferably, the plurality of openings are disposed inside the annular space between the retaining ring and the sub-carrier. The invention also relates to a surface of the substrate A polishing device for removing material. The polishing device includes a polishing head adapted to hold the substrate during the polishing operation, and a polishing surface having a plurality of recesses. When the substrate and the polishing surface are opposed to each other (4), the distribution chemicals are interposed between the polishing Between the substrate of the head ± and the light-transferring surface, the rate of material change of the plurality of concave portions having a non-uniform interval across the polishing surface is a variable number. The first portion of the concave portion across the polishing surface is changed from the first region to the second region to provide the first The difference between the material removal rate of the zone and the second zone. In one embodiment, the plurality of recesses comprise slots, the slots having non-uniform spacing distances across the radial direction of the polishing surface. In the embodiment - the slot Having a non-uniform wearing area. Preferably, the spacing distance between the plurality of recesses across the polishing surface is changed from the first zone to the second zone, and the first zone paper & degree is applicable to the China National Standard (CNS) A4 specification. 210 x 297 mm) (Please read the 4 on the back and fill out this page) ϋ n ϋ n*-rJa ϋ ϋ nn ϋ n 1246448 V. Description of invention (38) Difference with the removal rate of the second interval $ , 丨To V is 5 /〇. The better concentration of multiple grooving is more concentrated in the first zone than in the second zone. The first zone provides a lower removal rate than the second zone. The spacing between the polishing surface and the eccentric cutting groove is changed from the first region of the first region to the second (four) per-straight line. The grooving has a substantially uniform depth and a substantially uniform width. Usually, the number of slots 屮筮-E 每一 of each straight line in the first zone is more than the first, and the first zone provides a lower removal rate than the second zone. The grooving may be a parallel grooving, a concentric grooving, a concentric elliptical grooving, a helical grooving with varying pitches across the helix, or a single-spiral grooving. In addition, the recess may include a plurality of open cavities or dimples on the polishing surface. When the polishing surface has a fixed abrasive fixed thereto, the recess is adapted to dispense water between the substrate held between the polishing head and the polishing surface during the polishing operation. The outer recess is adapted to dispense the abrasive containing slurry between the substrate held between the polishing head and the polishing surface during the polishing operation. Yet another aspect provides a polishing apparatus that removes material from the surface of the substrate. The polishing apparatus includes a polishing head adapted to hold the substrate during the polishing operation, and a polishing surface having a plurality of recesses for the relative movement between the substrate and the polishing surface, and the slurrying chemical is interposed between the substrate held by the polishing head Between the polished surface. The recess has a non-uniform size across the polishing surface, and the change in size from the first zone to the second zone provides a different rate of change from the first zone to the second zone across the polishing surface. In one embodiment, the recess includes a plurality of cavities on the polishing surface, and the plurality of cavity depths are varied from the first zone to the second zone to provide a difference in removal rates between the first zone and the second zone.

Please read the back of the note first.

|装本· Page I Booked by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumer Cooperatives, Printed Paper & Applicable to China National Standard (CNS) A4 Specification (21〇χ 297 Meals) 38 91874 1246448 Ministry of Economic Affairs, Intellectual Property Bureau, Staff Consumption Cooperative Printing A7 V. Inventive Note (39) In another embodiment, the recess comprises a plurality of cavities on the polishing surface, each cavity having a cross-sectional area parallel to the polishing surface 'the plurality of cavities each having a cross-sectional area from the first region The change to the second zone provides a difference in the removal rate between the first zone and the second zone. In another embodiment, the recess includes a plurality of slots on the polishing surface, the slots have a certain depth, and the depth of the plurality of slots is changed from the first region to the second region to provide the first region and the second interval. Remove rate differences. In still another specific embodiment, the concave portion includes a plurality of slits on the polishing surface, each of the slits has a certain width, and the respective widths of the plurality of slits are changed from the first region to the second region, and the first region and the first region are provided. The difference removal rate of the second interval. In another aspect, a method is provided for removing material from a polishing surface of a substrate using a polishing apparatus having a polishing head adapted to hold the substrate during a polishing operation, and having a plurality of recesses on the polishing surface, between the substrate and the polishing surface When there is relative motion, the slurry chemical is interposed between the polishing head and the polishing surface. The plurality of recesses have a non-uniform spacing across the polishing surface to provide a variable material removal rate across the polishing surface. The method comprises the steps of: positioning a substrate on a polishing head, pushing a surface of the substrate toward the polishing surface, dispensing the chemical to the polishing surface, and providing relative motion between the substrate and the polishing surface, at a rate of change across the polishing surface by the substrate Surface removal material. In one embodiment, the recess spacing across the phosphor side varies from the first region to the second region, and provides relative motion between the substrate and the polishing surface. The step of removing material from the substrate surface includes providing a first region and a second interval. The step of removing the rate difference. In another embodiment, the recess comprises a plurality of slots, each slot having a non-A wave & degree applicable to the Chinese National Standard (Cns) A4 specification (210 X 297 mm) Q1 «7zl I ^----- ---^-------- ίPlease read the notes on the back and fill out this page.) 1246448 A7 -____ D7_ V. INSTRUCTIONS (4〇) Substantially uniform depth and substantially uniform width. In still another embodiment, the recess includes a plurality of cavities each having a substantially uniform depth and a substantially uniform cross-sectional area of the parallel polishing surface. In still another embodiment, the present invention provides a workpiece or substrate, such as a semiconductor wafer, fabricated using the apparatus of the present invention. In still another embodiment, the present invention provides a workpiece or substrate, such as a semiconductor wafer, fabricated using any of the foregoing methods or procedures in accordance with the present invention. It is to be understood that the various features and advantages of the specific embodiments of the present invention are set forth in the foregoing description of the embodiments of the invention. In particular, the structure and arrangement of the components can be varied within the scope of the principles of the invention, and the extent of the broad general scope of the scope of the appended claims. ^ Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing This paper scale applies China National Standard (CNS) A4 specification (210 x 297 public ^ 40 91874

Claims (1)

</ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; a transmission mechanism for rotating the polishing head during a polishing operation, the polishing head comprising: a carrier adapted to clamp a substrate during a polishing operation, the carrier having a lower surface; a flexible member secured to the carrier And extending across the lower surface of the carrier, the flexure has a receiving surface engageable with the substrate and a plurality of openings extending through the flexure to the thickness of the receiving surface; a spacer disposed on the flexible Forming a cavity between the piece and the lower surface, the cavity being defined by the lower surface of the carrier, the spacer, the flexure, and the substrate; __2_ Ministry of Economic Affairs Central Bureau of Standards Staff Welfare Committee prints a passage And communicating with the lower surface to introduce pressurized fluid into the interior of the cavity to facilitate pushing the substrate toward the polishing surface during the polishing operation; wherein 'selecting the number and size of the plurality of openings俾The pressurized fluid is applied directly to the substrate; and wherein at least one of the plurality of openings has an edge that is angled toward the direction of rotation of the polishing head to strengthen the flexure to increase Friction. A polishing head according to claim 1, wherein the carrier further comprises a sub-carrier carried by the carrier, and wherein the flexure is firmly fixed to the sub-carrier and extends across the lower surface of the sub-carrier . This paper scale applies to China National Standard (CNS) Α4 specification (210 X 297 public) 91874 1246448 H3 If the application scope of the patent scope is *, the number and size of the multiple openings are selected + ^ ^ ^ Provides sufficient enthalpy force between the receiving surface of the flexure and the substrate to impart rotational energy to the substrate. For example, the first section of the patent application is the first to be thrown, wherein the lower surface of the carrier comprises a mouthpiece and channel connection $14, which is suitable for receiving pressurized fluid inside the cavity during the polishing operation. For example, if you apply for a patented rib (fl Chu 1 I scoop person | 苐 4 item of polishing head, where the lower surface of the carrier is into the ^ channel, it is suitable for dispensing pressurized fluid from the mouth of the cavity throughout the cavity. The polishing head of the fourth item, wherein the mouthpiece is reusable, and the portion of the flexure is covered and sealed, so as to be Separating the crucible from the cavity during vacuum. The diminishing head of claim 6 is selected, wherein the predetermined vacuum is selected to clamp the substrate to the polishing surface during and after the polishing operation and the unloading operation. Printed by the Central Bureau of Standards and Staff Welfare Committee. For example, the optical head of claim 6 of the patent application, wherein the pepper device further comprises a vacuum switch coupled to the mouthpiece, and wherein the predetermined vacuum system is selected to be clamped to the receiving surface of the substrate. The vacuum switch can be switched on. 9. A chemical mechanical polishing device having a polishing head as claimed in the scope of the patent application, the device further comprising a ^ 5 pulp distribution mechanism suitable for polishing operation During the delivery of the slurry to the polishing surface. 10. A chemical mechanical polishing device, such as the application of the third paragraph _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The scale applies to China National Standard (CNS) 2973⁄4~一~^·^ Fixed grinding surplus 2 91874 1246448 The polishing surface on it and a chemical pulping mechanism are suitable for the mixing of chemicals to the polishing surface during the operation of the pepper. 11. A method of polishing a substrate having a surface using a polishing apparatus, the polishing apparatus having a polishing head, a polishing surface, a transmission mechanism for rotating the polishing head during a polishing operation, a carrier having a lower surface, and a tread The article extends across the lower surface, the flexure has an opening that engages the substrate and an opening through which the plurality of openings extend to the thickness of the receiving surface, the method comprising the steps of: positioning the substrate on the receiving surface to form a cavity defined by the lower surface of the carrier, the spacer, the flexure, and the substrate; positioning the polishing head on the polishing surface to rely on the polishing surface of the substrate; The lower surface communication passage introduces pressurized fluid into the cavity to press the substrate against the polishing surface during a polishing operation, the pressurized fluid extending through the openings for direct application to the substrate; and the central standard of the economic department The employee welfare committee prints and rotates the polishing head to impart rotational energy to the substrate; wherein at least one of the plurality of openings has Edge, the edge opposite the direction of rotation of the polishing head was angled to strengthen those of the flexible member is coupled to the substrate increases the frictional force. 1 2. The method of claim π, wherein the carrier further comprises a spacer disposed between the flexure and the lower surface of the carrier to form the cavity, the carrier having a mouth on the lower surface Suitable for introducing the pressurized fluid into the interior of the cavity, and wherein the paper is introduced into the cavity by the Chinese National Standard (CNS) A4 specification (21〇X 297 cm) 91874 1246448 The step involves importing the pressurized flow! The step of the fistula entering the inside of the cavity. 13·If the scope of the patent application is 丨2, ^, the method, wherein the mouth is further suitable for vacuuming the cavity, and the straight sergeant &amp; ^ v, 琢 method further comprises clamping the substrate to the cavity The loading step of receiving the surface and unloading. 14. The method of claim 13 wherein the step of loading the cavity further comprises winter; when the field reaches a predetermined vacuum, by partially covering the flexure And seal the ux i dry mouth and separate the mouth and cavity. 15. The method of claim 13 wherein the polishing apparatus further comprises a vacuum switch coupled to the dry mouth, and wherein the loading step comprises when the predetermined vacuum is reached, the mother ± seven &gt; /, Second, the substrate is sensed to exist on the receiving surface by switching the vacuum switch. 16. For example, in the case of the patent Scope No. 13, the method is further included in the polishing operation, and during the unloading of the sputum, the cavity is evacuated and lifted by the polishing surface. Hold the substrate on the receiving surface before. 17 - A polishing head for positioning a substrate having a surface on a polishing surface of a polishing apparatus, the polishing head comprising: a central standard bureau employee welfare committee printed by the Ministry of Economic Affairs, which is suitable for holding a substrate during a polishing operation The load has a lower I face and the 埠 mouth extends through the 纟s to supply a flexible member that is securely fastened to the carrier and extends across the lower surface, the flexure having a receiving surface for Engaged with the substrate, and at least one opening extends through the thickness of the receiving surface; _ _ spacer ′ is disposed between the flexure and the lower j-face to report the national standard (CNS) A4 Specification (210 X 297 metric f ^ 〜---^ 4 91874 !246448 H3 The cavity defined by the lower surface of the carrier, the spacer, the flexure and the substrate; and wherein the flexure is The first position is moved, the flexure is spaced apart from the lower surface adjacent the chin at the first position, and the second position wherein a portion of the flexure engages the lower surface to surround the chin to cover when a predetermined vacuum is reached And sealing the mouth, thus making the base The non-desired stress on the board is minimized. The polishing head of claim 17 wherein the spacer comprises a thickness selected to reduce deformation of the flexure when evacuating the cavity. The reduction of the stress applied to the substrate held by the receiving surface. The polishing head of claim 17, wherein the polishing device advancement comprises a vacuum switch coupled to the mouthpiece and when the predetermined vacuum has been reached The vacuum switch is switched to sense the presence of the substrate on the bearing surface. The polishing head of claim 17, wherein the polishing device advance comprises a transmission mechanism for rotating the carrier during the polishing operation, and wherein the at least The size of one opening is selected to provide sufficient friction between the bearing surface of the flexure and the substrate. The substrate is provided with a rotational energy welfare board. 21. The polishing head of claim 17 of the patent application, wherein most openings extend, wear The thickness of the flexible member to the receiving surface. 22. The polishing head according to claim 21, wherein the carrier further comprises a channel and The mouth is used together for guiding and adding -1 body to the cavity part during the polishing operation; and the plurality of openings are suitable for the sturdy &quot;this paper size applies to the Chinese national ϋΝ5) Α4 specification (21〇χ 297 幻幻- Pressurization ^ Chu 5 91874 1246448 The substrate is applied directly to the substrate via a plurality of openings to push the substrate toward the polishing surface during the polishing operation. 23. The polishing head according to claim 21, wherein the polishing device enters a v-package 3 - a transmission mechanism rotates the carrier during the polishing operation, and the number and size of the plurality of openings are selected to provide the flexure The sufficient friction between the receiving surface and the substrate provides rotational energy to the substrate. 24. A method of polishing a substrate having a surface using a polishing apparatus, the polishing apparatus comprising a polishing surface and a polishing head adapted to hold a substrate during a polishing operation, the polishing head having a carrier having a lower surface, being firmly fixed a flexure extending over the lower surface of the carrier and a spacer disposed between the flexure and the lower surface, the flexure having a yoke surface adapted to receive the substrate, the flexure having a thickness and At least one aperture extending through the thickness to the receiving surface, the method comprising the steps of: receiving the substrate on the receiving surface to form a cavity defined by the lower surface of the carrier, the spacer, the flexure, and the substrate The substrate is placed on the carrier by vacuuming the cavity at the lower surface of the lower surface; the Central Bureau of Standards Staff Welfare Committee of the Ministry of Economic Affairs prints a part of the flexible part when the predetermined vacuum has been reached. The gap is covered and sealed to minimize the amount of stress exposed to the substrate; and the surface of the substrate is positioned on the polishing surface. The method of claim 24, wherein the polishing apparatus further comprises a vacuum switch coupled to the mouthpiece, wherein the method further comprises: applying a vacuum switch to sense the substrate storage paper size when the predetermined vacuum is reached; China National Standard (CNS) - A4 Specification (210 X 297 public) ~ 6 91874 1246448 It is the step of bearing the face. 26. Method of applying for patent scope item 24 Wafer. 27. The method of applying for the patent scope, item 11, wafer. 28. A substrate, which is processed by, for example, a semiconductor in which the substrate comprises a semiconductor, wherein the substrate comprises a method of semiconductor item 11 of the semiconductor wafer, and the semiconductor wafer is Manufacturing is handled as described in Section 11 of the Patent Application. 30. A kind of substrate, which is printed by the Ministry of Economic Affairs, Department of Economics, and the Standards of the Ministry of Economic Affairs, X. The 24 item method handles manufacturing. 32. A polishing head for removing a substrate having a surface on a polishing surface of a polishing apparatus, the polishing head comprising a carrier, a sub-carrier carried by the carrier, suitable for polishing operation During the clamping of the substrate 'and a retaining ring, the rotating type is disposed centering on the sub-carrier, and the holding surface has a lower surface, the lower surface is substantially flush with the surface of the substrate and contacts the polishing surface during the polishing operation, and the retaining ring can be The non-flat polishing of the substrate surface is suppressed relative to the rotation of the substrate on the sub-carrier. 3. The polishing head of claim 32, wherein the sub-carrier is rotatable to a substrate clamped thereon during a polishing operation, and wherein the retaining ring is engageable with the sub-carrier The substrate rotates at different speeds. This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 public) 7 91874 1246448 H3 ': Please, with - a branch of the letter and the upper surface of the holding ring to smash the animal by a bearing Face-to-face relationship, and pressure is applied to the solid:: open, the support ring is suitable for the polishing operation period 35: 2: Patented item 34 of the moving head, wherein the bearing is selected from the group: fluid dynamic bearing, light bearing And the tapered bearing consists of 36. If the package polishing head 'where ^ ^ ^ 4, § when the carrier is lifted from the calender surface to the support ring, the first lip joint support ring retention 37. The polishing head of item 36, wherein the first part; includes a plurality of screw inspections, each bolt has a sun-stained male main shaft and a crotch portion of the head surface ==/ is convex outward in the radial direction, and is attached to the vehicle The second lip of the support ring is joined by the polished face + liter % head # surface. 38. A polishing head according to claim 32, wherein one of the transmission mechanisms coupled to the retaining soil causes the retaining ring to rotate relative to the sub-carrier during the polishing operation. 39. The polishing head of claim 32, wherein the friction between the retaining ring and the light-transferring surface causes the retaining ring to rotate relative to the sub-carrier during the polishing operation. 40-chemical mechanical polishing device having a polishing head according to the scope of the patent application, the device further comprising a polishing surface and a workmanship_____ This paper size is applicable to the 0113⁄4 standard (CNS) A4 specification (210 X 297^17 pulp distribution mechanism which is suitable for dispensing slurry to a polishing machine during polishing operation to a polishing machine 3, which has a polishing surface as in claim 32, further comprising a polishing surface, the light-removing mechanism The surface-loaded abrasive is applied to the 'and-chemical pulping mechanism for slurrying chemicals to the polishing surface during the polishing operation. 42. A method for polishing a substrate having a surface using a polishing apparatus, the first The device has a polishing surface, and the method comprises the following steps: the clamping substrate is read on the polishing surface and the surface of the substrate to be polished is substantially in contact with the lower surface of the polishing surface; pressing the surface of the substrate away from the polishing surface; The removal rate of the material that reduces the edge of the substrate by using a retaining ring to deform the polishing surface around the annular region of the substrate. / (4) Smooth surface and the base Relative movement is provided between the surfaces to polish the surface of the substrate; and the retaining ring is rotated relative to the surface of the substrate against an axis perpendicular to the surface of the substrate to inhibit non-flat polishing of the surface of the substrate. The method of claim 44, wherein the step of providing relative motion between the light-removing surface and the surface of the substrate is included in the polishing operation during the polishing operation. The step of having the substrate, and the step of rotating the holding ring in the step of rotating the holding ring at a speed not equal to the substrate held on the sub-carrier. 44. The method of claim 42 , the step of rotating the holding ring comprises the step of rotating the holding ring in a direction different from the substrate, 4 5. The method of the fourth item of the patent scope of the second object, and the hanging of the present Applicable to China National Standard Polishing U-in 9 91874 1246448 H3 package = one transmission mechanism is transferred to the holding ring, and the step of 46 包含 includes operating the transmission mechanism 俾 rotation holding ring The method of claiming a patent, wherein the substrate is a body. 47. A polishing head, the substrate of the polishing head surface on the polishing surface is positioned on the polishing device - the carrier 1 = The calendering device comprises a carrier, a clamping substrate, and a second carrier and is adapted to be used during the light-removal operation and a holding ring is provided around the sub-carrier. 2 the retaining ring has a lower surface. The surface of the substrate is flush and contacts the polishing surface during the operation of the light, and the rotating type is firmly fixed; the device of the carrier allows the holding ring to rotate relative to the sub-carrier to inhibit the polishing of the substrate. The moving head, wherein the sub-carrier can rotate the substrate clamped thereon during the polishing process, and the device in which the rotation holding % can rotate the holding ring at a different speed from the substrate clamped on the sub-carrier. 49. The polishing head of claim 47, wherein the carrier further comprises a support ring having a face-to-face relationship with the upper surface of the retaining ring, applying pressure to the retaining ring during the polishing operation, and wherein the retaining garment is The device that rotates relative to the substrate includes a bearing that separates the support ring from the retaining ring. The polishing head of the item 47 of the patent application scope further includes a transmission mechanism that is lightly coupled to the holding ring, and the transmission mechanism causes the holding ring to be thrown on the sub-carrier. The substrate rotates. 〕 NS) A4 Zhen Ge (210 X into the lane, 10 91874 1246448 := The polishing head of item 47, wherein the retaining ring and the polishing and rubbing force cause the retaining ring to rotate relative to the sub-carrier during the polishing operation. 52. The substrate comprises a semiconductor wafer as claimed in the 42nd π heart-shaped cookware. 53-type substrate' is manufactured by the method of claim 42 of the patent application. 54. A semi-V-body wafer, which is manufactured by a process as described in the scope of the patent application. a polishing head for positioning a substrate having a surface on a polishing surface of a polishing apparatus, the polishing apparatus comprising a carrier having a bottom surface, the bottom surface including a lower surface The lower surface is adapted for a polishing operation/monthly holding of the substrate, the carrier being provided with a plurality of slits extending through the bottom surface around the lower surface for slurrying the polishing material onto the polishing surface during operation. Printed by the Employees' Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs 56. For the polishing head of the 55th patent application, the plurality of rinsing mouths are further suitable for dispensing the slurry containing the abrasive to the polishing surface. 57. The polishing head of claim 55, wherein the polishing surface comprises a polishing surface having a solid abrasive thereon; and wherein the plurality of openings are further adapted to dispense water onto the polishing surface during the polishing operation. 58. The polishing head of claim 55, wherein the plurality of mouthpieces are disposed inside the retaining ring. 59. The polishing head of claim 55, wherein the carrier further comprises 11 91874 1246448 And the retaining ring is rotatably disposed around the sub-carrier and is separated from the sub-carrier by an annular space. 6 0. For example, the polishing head of the 59 patents of Fan Yuanchu, the plurality of 埠 is set inside the annular space between the retaining ring fish and the early π system. 6 1. For example, apply for the polishing head of the 60th item of the patented tendon &amp; ^ inch range, in which the winter is uniformly separated by the annular space between the retaining ring and the sub-carrier (four). The bald head, which is more: ~ contains 2 to 30 mouthwashes. L. The polishing head of claim 60, wherein the plurality of V fittings flush the retaining ring and the sub-carrier space during the maintaining operation. I 64. A chemical mechanical polishing apparatus having a polishing head according to claim 55, further comprising a polishing surface; and wherein the plurality of openings are adapted to dispense abrasive-containing material during a polishing operation Slurry onto the polished surface. 'The Ministry of Economic Affairs, Central Bureau of Standards, Staff Welfare Committee printed 65. A chemical mechanical polishing device having a polishing head as claimed in claim η, the device further comprising a polishing surface with a fixed abrasive thereon, wherein The plurality of jaws are adapted to dispense slurry to the polishing surface during the polishing operation. 66. A method of polishing a substrate having a surface using a polishing apparatus, the polishing apparatus having a polishing surface and a carrier having a bottom surface including a lower surface adapted to hold the substrate during a polishing operation, the method comprising the following steps : Position the substrate on the lower surface of the carrier, push the carrier toward the polishing surface and push the surface of the substrate toward the polishing surface. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) _ - - 12 91874 1246448 Polishing material onto the polishing surface via the bottom surface of the carrier. 67. The method of claim 2, wherein the polishing surface comprises a polishing surface on which the π has a fixed abrasive; and wherein the step of dissolving the chemical onto the light-removing surface comprises mixing water to polishing The method of claim 66, wherein the polishing apparatus further comprises a slurry supply source for supplying the slurry to the plurality of mouthwashes, and wherein the step of the slurrying chemicals to the polishing surface comprises The method of dispensing a slurry to a polishing surface. 69. The method of claim 68, wherein the polishing apparatus further comprises a flushing fluid supply source for supplying flushing fluid to the plurality of ports and a valve for intervening Switching between the slurry supply source and the flushing fluid supply source, and wherein the method further comprises the step of rinsing the plurality of openings after polishing the substrate. 70. A polishing head for positioning a substrate having a surface on the polishing device a polishing head on the polishing surface, the polishing apparatus comprising a carrier adapted to hold the substrate during the polishing operation, and a holding ring suspended by the carrier, the solid The holding ring is placed around the periphery of the substrate held by the carrier, and the Central Bureau of Standards Staff Welfare Committee printing paste device of the Ministry of Economics is used to dispense the chemicals from the polishing head to the polishing surface during the polishing operation. The polishing head of claim 70, wherein the apparatus for dispensing the chemical σ σ from the polishing head comprises means for dispensing the slurry containing the abrasive to the polishing surface. 72. The polishing head of claim 70, wherein The polished surface comprises a polished surface having a fixed abrasive on: g:; and wherein the paper is applied to the Chinese National Standard (CNS) A4 gauge (210 X 297 mm) 13 91874 1246448 H3 self-polishing head The device for the ventilating port is included in the device for distributing the main surface of the water during the polishing operation. 73. For the polishing head of the 70th item of the patent 圚箓 圚箓, the chemical of the head is 人 人 人The first garment is provided with a plurality of jaws disposed in the holding ring. The polishing head is in the 73rd item of the patent application, wherein the carrier further comprises a sub-load JL, #一"The sub-loader has a bearing surface on which the substrate is clamped during the polishing surface, and in which the holding ring-rotating garment, the 疋田 ij vehicle is disposed around the belt and the sub-carrier Separated. The polishing head of claim 74, wherein the plurality of mouthpieces are disposed inside the annular space between the retaining ring and the sub-carrier. 76. The method of claim 66, wherein the substrate comprises a semiconductor wafer. 77. A substrate produced by processing according to the method of claim 66. 7 8. A semiconductor wafer manufactured by a process as claimed in claim 66. Printed by the Staff Standards Committee of the Central Bureau of Standards of the Ministry of Economic Affairs 79. A polishing apparatus for removing material from the surface of a substrate, the polishing apparatus comprising: a polishing head adapted to hold the substrate during the polishing operation; and the paper scale is applicable to the Chinese national standard (CNS) A4 size (210 X 297 mm) A polished surface containing multiple cavities. When there is relative motion between the substrate and the polishing surface, the distribution of chemicals is between the substrate and the polishing surface held on the polishing head. a plurality of cavities with a first zone different from a second zone 14 91874 1246448 The plurality of cavities are concentrated in the same t &lt; non-uniform spacing of the pattern across the polishing surface, 俾 from the first zone to the first zone providing a rate of removal of material across the relief surface. 80. The polishing apparatus of claim 79, wherein each of the plurality of cavities comprises a non-uniform cross-sectional area parallel to the polishing surface, and wherein the plurality of cavities are each worn. The area is different from the first zone to the second zone to provide a difference in removal rate between the first P&amp; and the second zone. 81. The polishing apparatus of claim 7, wherein the plurality of cavities have a substantial depth and a substantially uniform cross-sectional area parallel to the light-receiving surface. 82. The polishing apparatus of claim 79, wherein the distance between the plurality of cavities across the polishing surface is changed from the first zone to the second zone, and the difference in removal rates of the first zone and the second zone is at least 5 %. 83. If the device of claim 79 of the patent scope is applied, the central welfare bureau employee welfare committee of the plurality of cavity economic departments prints more concentrated in the first zone than the first zone, and wherein the first zone has Lower removal rate than the second zone. 84. The polishing apparatus of claim 79, wherein the number of rectilinear cavities in the first zone is greater than the second zone, and wherein the first zone provides a lower removal rate than the second zone. 85. The polishing apparatus of claim 79, wherein the plurality of cavities are selected from the group consisting of: a cavity having a circular cross-sectional area; the same hole, the n-domain is a pattern and the country is configured豕早早 (CNS) A4 size (210 X 297 mm) --- 15 91874 1246448 cavity; cavity; configured with a spiral area with a higher concentration of cavity to have a lower set cavity And the spiral region of the cavity is arranged in a pattern by a cavity having the concentric region of the raised region of the concentrated region with a non-domain pattern. • A polishing apparatus comprising one member, as in the scope of the patent application, wherein the polishing bread cavity is adapted to be thrown first = the polishing surface fixed thereon and between the plurality of substrates and the polishing surface. The slurry is held between the polishing heads. For example, the polishing apparatus of the 79th patent, wherein the plurality of chambers are disposed during the polishing operation, and the slurry containing the abrasive is placed between the workpieces. Between the substrate of the polishing head and the polishing surface. 88. The polishing apparatus of claim 79, wherein the polished bread comprises a rotating polishing surface. Printed by the Staff Standards Committee of the Central Bureau of the Ministry of Economic Affairs. 89. A polishing device for removing material from the surface of a substrate. The polishing device comprises: a polishing head 'which is suitable for holding the substrate during the polishing operation; and the paper size is applicable to the Chinese national standard. (CNS) Α4 size (210 χ 297 mm) A polished surface containing a plurality of recesses between the substrate and the polishing surface. The slurrying chemicals are interposed between the polishing surfaces of the substrate held by the polishing head. Having a non-uniform depth across the polished surface, the degree of recess varies from the first zone to the second zone, providing a cross-polishing cross-polishing of the polished face material, Ad桢坆ν ιοί 八衫, ' -------- The apparatus of claim 89, wherein the plurality of recesses comprise a plurality of cavities on the polishing surface, each cavity having a wear area parallel polishing surface. And the cross-sectional area of each of the plurality of cavities is changed from the first zone to the second zone. 91. The polishing apparatus of claim 89, wherein the plurality of recesses comprise a plurality of slots on the polishing surface. 92. The polishing apparatus of claim 1, wherein each of the plurality of slits has a width, and wherein the respective widths of the plurality of slits are changed from the first zone to the second zone. 93. A method of removing material from a surface of a substrate using a polishing apparatus having a polishing head adapted to hold the substrate during a polishing operation, and a polishing surface comprising a plurality of recesses for relative movement between the substrate and the polishing surface The slurrying chemical is interposed between the substrate held by the polishing head and the polishing surface, and the plurality of recesses have a non-uniform depth to be different from the cross-polished surface of the first to second regions, and the first region is provided from the first region to the The Central Bureau of Standards Staff Welfare Committee of the Ministry of Economic Affairs of the Second District prints the variable removal rate of the material across the polished surface. The method includes the following steps: positioning the substrate on the polishing head; pushing the surface of the substrate toward the polishing surface; To the polishing surface: and providing relative motion between the substrate and the polishing surface to remove material from the surface of the substrate across the rate of change of the polishing surface. If you apply for the method in the 93rd section of the patent, the name of the paper is called the sentence. The paper size applies to the Chinese National Standard (CNS). The A4 specification is a concave 4 colors. 91874 1246448 The sipe has a uniform uniform width. 95. The plurality of cavities in the scope of the patent application, wherein the plurality of cavities:: wherein the plurality of recesses comprise a uniform uniform wearing area. Having a parallel to the polished surface 96. The first wafer of the patent application range. The method of the member, wherein the substrate comprises a semiconductor substrate, and the substrate is manufactured by the method of claim 93. a 9 8. A kind of 导 曰 日 m day, one line is manufactured by the method of applying for the patent scope item 93. 9 9. If the polishing head of the first member of the patent application scope is selected, wherein the number and size of the opening of the guest that extends through the thick product of the flexure is selected to be carried out in the The surface and the substrate have sufficient frictional force to provide rotational energy to the substrate during the polishing operation. 10 0. For the polishing head of claim 99, wherein the number and size of the plurality of openings αs _ _ U k are provided for at least about 66 percent of the total area of the 面L port. Printed by the Staff and Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs 101. If the polishing head of the sixth paragraph of the patent application is applied, the mouthpiece contains the rise. P promotes sealing and limits the extent of deformation of the winding member and the substrate. 102. The method of claim 19, wherein the number and size of the plurality of openings extending through the thickness of the flexure are selected to provide sufficient coverage between the receiving surface of the flexure and the substrate Friction right and right in the country 18 91874 1246448 The method of claim 10, wherein the number and size of the plurality of openings are selected to provide a total area of the aperture of at least about 66 percent of the bearing surface. I〇4. A polishing head for positioning a substrate having a surface on a polishing surface of a polishing apparatus, the polishing apparatus being a right garment having a transmission for rotating the polishing head during a polishing operation The polishing head comprises: - a carrier that can hold the substrate during a polishing operation, the carrier having a lower surface and a slit extending through the lower surface as a supply suction; a flexible member that is secure Secured to the carrier and extending across the carrier and extending through the lower surface of the carrier, the flexure having a receiving surface engageable with the substrate and a plurality of openings extending through the flexure to the thickness of the receiving surface; a spacer that is not disposed between the flexure and the lower surface to form a cavity VIII' defined by the lower surface of the carrier, the spacer, the flexure, and the substrate; The passage is in communication with the lower surface to: the Central Bureau of Standards and Staff Welfare Committee of the Ministry of Economic Affairs prints a vacuum on the cavity to urge the substrate toward the receiving surface during the polishing operation; introducing pressurized fluid into the cavity, Facilitating pressing the substrate toward the polishing surface during the polishing operation; wherein the number and size of the plurality of openings are selected, and the pressurized fluid is directly applied to the substrate; the paper scale is applicable to the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) wherein at least one of the plurality of openings has an edge, the edge of the 19 91874 1246448 being angled against the direction of rotation of the polishing head to strengthen the flexure to increase friction coupled to the substrate ;as well as. Wherein the pulling member is moved from a first position in which the flexure is spaced apart at a lower surface in the vicinity of the jaw, and when a predetermined vacuum is reached, in the second position, The tying member is lightly fitted around the lower surface of the mouth to cover and seal the mouth, thereby minimizing undesired stress on the substrate. 105. The polishing head of claim 10, wherein the number and size of the plurality of openings extending through the thickness of the flexure are selected to provide a dough on the scented surface of the flexure. And sufficient friction between the substrates to impart rotational energy to the substrate during the polishing operation. In the chaos, please ask for the scope of patents! (d) A polishing head wherein the number and size of the plurality of openings are selected to provide at least about 66 percent of the total area of the port. 107. In the first paragraph (4) of the first paragraph (4) of the patent (4), the mouthpiece includes a rising lip to promote sealing and limit the degree of deformation of the flexure. The Employees' Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs prints a polishing head that is in the scope of claim 32, wherein the holding ring can be rotated against the axis of the surface of the substrate on the sub-carrier. 109. The polishing head of claim 32, wherein the fixing is rotatable relative to the carrier. (10) The polishing head of claim 47, wherein the polishing head is used to rotate the 1246448 H3 on the surface of the surface of the substrate on the σHaij carrier. 111. If the patent application is in the 47th item, the octopus is used for the Jiang dynasty. The holding ring is fixed to the carrier and the carrier is rotated. a money holding ring relative to the H2.-type polishing head, to be a polishing surface of the substrate device 2 having a surface, the polishing head comprising: - a carrier; - by the carrier and capable of being polished during the operation a sub-carrier for holding the substrate; a retaining ring rotatably disposed opposite the sub-carrier, the retaining ring substantially filling the surface of the substrate and contacting the upper surface and the lower surface of the polishing surface during the polishing operation a surface that is rotatable relative to a substrate held on the submount; and a backing ring having a facing relationship on the retaining ring and being detached from the retaining ring by a bearing, The back ring can supply pressure to the retaining ring during the polishing operation. The polishing head of claim 79, wherein the plurality of cavities 6 comprise a recess having a circular cross-sectional area. The polishing head of claim 89, wherein the depth of the plurality of recesses in the first zone is greater than the ice of the plurality of recesses in the second zone, and wherein the first zone provides a comparison This second zone is a low removal rate. The polishing head of claim 89, wherein the interval of the plurality of recesses in the first zone spans the polishing surface and is different from the first zone to the second zone to provide A difference in removal rate of at least 5 percent between the first zone and the second zone. 11 6. For the polishing head of claim 90, the cavity is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public) ----:-二-21 91874 1246448 H3 is across the polishing surface in a concentrated pattern in which the first region is different from the plurality of cavities of the second region. U7. The polishing head of claim 91, wherein the plurality of grooving grooves are non-uniformly spaced across the polishing surface to provide material removal of the first 々^ region from the cross-polished surface of the first region rate.抛光8. The polishing head of claim 117, wherein the number of each linear grooving groove in the first zone is greater than in the second zone, and wherein the first zone provides lower than the second zone The removal rate. 119. The polishing head of claim 117, wherein a spacing of the plurality of slits across the polishing surface varies from each straight line in the first zone to each slot in the second zone A straight line 吋 2 slots. 120. The polishing head of claim 91, wherein the plurality of slots have a substantially uniform width and are evenly spaced across the polishing surface. Printed by the Central Bureau of Standards and Staff Welfare Committee of the Ministry of Economic Affairs This paper scale applies to the Chinese National Standard (CNS) Α4 specification (210 X 297 mm) 91874