TWI226077B - Liquid processing apparatus and liquid processing method - Google Patents

Liquid processing apparatus and liquid processing method Download PDF

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Publication number
TWI226077B
TWI226077B TW091112429A TW91112429A TWI226077B TW I226077 B TWI226077 B TW I226077B TW 091112429 A TW091112429 A TW 091112429A TW 91112429 A TW91112429 A TW 91112429A TW I226077 B TWI226077 B TW I226077B
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Taiwan
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substrate
nozzle
liquid
processing
processing liquid
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TW091112429A
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Chinese (zh)
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Tetsuya Sada
Kazuhito Miyazaki
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Tokyo Electron Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting

Abstract

The developing process unit (DEV) 24 comprises a roller transferring mechanism 14 for transferring an LCD substrate G in a single direction almost in the horizontal attitude, a main developer discharge nozzle 51a and a sub-developer discharge nozzle 51b for discharging the developer to the LCD substrate G, and a nozzle moving mechanism 60a for scanning the main and sub-developer discharge nozzles 51a, 51b over the LCD substrate G. While the main and sub-developer discharge nozzles 51a, 51b are scanned over the LCD substrate G by driving the nozzle moving mechanism 60a, these developer discharge nozzles 51a, 51b discharge the developer to the LCD substrate G. Accordingly, uniform developing process can be performed in the entire part of the LCD substrate G by shortening the supply period of the developer.

Description

1226077 A7 B7 五、發明説明(彳) 〔發明的目的〕 〔發明所屬的技術領域及其領域的先前技術〕 (請先閲讀背面之注意事項再填寫本頁) 本發明是關於例如使用於液晶顯示裝置(L C D )的 玻璃基板等的基板進行顯像處理等的液體處理裝置及液體 處理方法。 〔先前技術〕 在L C D的製造上,是以在L C D玻璃基板(以下簡 稱「L C D基板」)形成抗蝕膜(resist film )後,以特定 的電路圖案(pattern)將該抗蝕膜曝光,再將其做顯像處 理的所謂照相平版術(photolithography ),在L C D基板 上形成電路圖案。在此,例如針頭顯像處理,已有 J P 1 1 - 8 7 2 1 0A揭示一種在水平姿勢搬運的基板 表面塗敷顯像液以在基板上形成浸置式顯影(puddle),並 保持特定時間以進行顯像反應的方法與裝置。 經濟部智慧財產局員工消費合作社印製 可是,近來,對於L C D基板的大型化有強烈的要求 ,已出現一邊達到1公尺的大型產品。要一邊將此種大型 LCD基板水平搬運,一邊在LCD基板表面塗敷顯像液 時,最初塗敷顯像液的部分與最後塗敷顯像液的部分的接 觸顯像液的時間差變大,因此,在顯像反應進行中發生參 差,不易在L C D基板整體上得到均勻的顯像圖形。 雖然可以藉由加速L C D基板的搬運速度在短時間內 塗敷顯像液,但是如加速L C D基板的搬運速度時,爲了 在顯像反應所需要的時間內以相同速度搬運L C D基板, 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇><297公釐) -4- 1226077 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(2 ) 因此,必須延長搬運L C D基板的距離,因此發生裝置的 覆蓋區(foot print )變大的新問題。要縮短L C D基板的 搬運距離非將形成顯像液的浸置式顯影(puddle )的L C D 基極緊急停止不可,此時,L C D基板上的顯像液因爲加 速度而溢落而無法充分進行顯像反應。而且由於緊急停止 L C D基板,L C D基板受到強大負荷,以致L C D基板 有破裂的可能。 〔發明應完成的技術上課題〕 本發明是鑑及此種問題而完成,其目的在提供一種液 體處理裝置與液體處理方法,它即使大型的基板也可以在 基板整體上進行均勻的液體處理而不擴大裝置的覆蓋區。 本發明的第1形態提供一種液體處理裝置,其具備: 將基板以大致水平的姿勢搬運至一方向的搬運機構,在以 上述搬運機構搬運的基板表面排出處理液的處理液噴嘴, 以及將上述處理液噴嘴以特定速度在上述基板上移動的噴 嘴移動機構, 利用上述噴嘴移動機構一邊移動上述處理液噴嘴,一 邊由上述處理液噴嘴排出上述處理液並在上述基板上塗敷 上述處理液。 本發明的第2形態提供一種液體處理方法,其包括: 將基板以大致水平的姿勢搬運至進行液處理的液處理區域 的工程,在上述液體處理區域中,將上述基板的搬運停止 或將上述基板的搬運速度延遲到比到上述液體處理區域的 —丨卜L——f I, (請先閲讀背面之注意事項再填寫本頁) 訂1226077 A7 B7 V. Description of the invention (彳) [Objective of the invention] [Technical field to which the invention belongs and its prior art] (Please read the notes on the back before filling out this page) The present invention relates to the use of, for example, liquid crystal displays A liquid processing apparatus and a liquid processing method for performing a development process such as a substrate such as a glass substrate of a device (LCD). [Previous Technology] In the manufacture of LCDs, a resist film is formed on an LCD glass substrate (hereinafter referred to as "LCD substrate"), and then the resist film is exposed with a specific circuit pattern, and then The so-called photolithography, which is used for development processing, forms a circuit pattern on the LCD substrate. Here, for example, a needle development process, JP 1 1-8 7 2 1 0A has been disclosed in which a developing solution is coated on the surface of a substrate conveyed in a horizontal posture to form an immersion development (puddle) on the substrate and held for a specific time. Method and device for developing reaction. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. However, recently, there has been a strong demand for large-scale LCD substrates, and large-scale products that have reached 1 meter on the side have appeared. When the large-sized LCD substrate is transported horizontally and the developer is coated on the surface of the LCD substrate, the time difference between the first developer-applied developer solution and the last developer-applied developer developer is greater. Therefore, unevenness occurs during the development reaction, and it is difficult to obtain a uniform development pattern on the entire LCD substrate. Although it is possible to apply the developing solution in a short time by accelerating the conveying speed of the LCD substrate, if the conveying speed of the LCD substrate is accelerated, in order to convey the LCD substrate at the same speed within the time required for the development reaction, the paper size Applicable to China National Standard (CNS) A4 specification (21〇 < 297 mm) -4- 1226077 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (2) Therefore, the LCD substrate must be extended for transportation Distance, a new problem that the footprint of the device becomes larger (foot print) occurs. In order to shorten the conveying distance of the LCD substrate, it is necessary to stop the LCD base of the immersion development (puddle) that forms the developing solution urgently. At this time, the developing solution on the LCD substrate overflows due to acceleration and cannot fully develop the reaction. . In addition, due to the emergency stop of the L C D substrate, the L C D substrate is subjected to a strong load, so that the L C D substrate may be cracked. [Technical Issues to Be Solved by the Invention] The present invention has been made in consideration of such problems, and an object thereof is to provide a liquid processing apparatus and a liquid processing method, which can perform uniform liquid processing on the entire substrate even with a large substrate. Do not enlarge the coverage area of the device. According to a first aspect of the present invention, there is provided a liquid processing apparatus including: a transport mechanism that transports a substrate to a direction in a substantially horizontal posture; a processing liquid nozzle that discharges a processing liquid on a surface of the substrate transported by the transport mechanism; and A nozzle moving mechanism that moves the processing liquid nozzle on the substrate at a specific speed, and uses the nozzle moving mechanism to move the processing liquid nozzle while discharging the processing liquid from the processing liquid nozzle and coating the processing liquid on the substrate. A second aspect of the present invention provides a liquid processing method including a process of transferring a substrate to a liquid processing region where liquid processing is performed in a substantially horizontal posture, and in the liquid processing region, stopping the transportation of the substrate or stopping the substrate. The substrate transportation speed is delayed compared to the above-mentioned liquid processing area — 丨 L — f I, (Please read the precautions on the back before filling this page) Order

Jn. ."τ· 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -5- 1226077 A7 B7 五、發明説明(3 ) (請先閲讀背面之注意事項再填寫本頁) 基板搬運速度更慢的工程,以及一邊將對上述基板塗敷處 理液的處理液噴嘴將上述處理液排出上述基板上並將上述 處理液塗敷於基板上的工程。 本發明的第3形態提供一種液體處理裝置,其具備: 將基板以大致水平的姿勢搬運至一方向的搬運機構,在以 上述搬運機構搬運的基板表面排出顯像液的顯像液噴嘴, 以及將上述顯像液噴嘴在上述基板上以特定速度在與上述 基板的搬運方向相反的方向移動的噴嘴移動機構, 利用上述噴嘴移動機構一邊移動上述顯像液噴嘴,一 邊由上述顯像液噴嘴排出上述顯像液並在上述基板上塗敷 上述顯像液。 本發明的第4形態爲用於施予曝光處理的基板進行顯 像處理的液體處理方法,它包括: 將基板以大致水平的姿勢搬運至要進行顯像液塗敷的 顯像液塗敷區域的工程, 經濟部智慧財產局員工消費合作社印製 在上述顯像液塗敷區域中,停止上述基板的搬運或將 上述基板的搬運速度延遲至比到達上述顯像液塗敷區域的 基板搬運速度更慢的工程, 一邊將要在上述基板上塗敷顯像液的顯像液噴嘴水平 移動至上述基板上,一邊由上述顯像液噴嘴將上述顯像液 排出並在上述基板上以進行塗敷上述顯像液的工程,以及 將塗敷過上述顯像液的基板搬運至去除顯像液的除液 處理區域的工程。 利用本發明的第1至第4形態的液體處理裝置與液體 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇><297公釐) -6- 1226077 A7 __ _B7_ 五、發明説明(4 ) (請先閲讀背面之注意事項再填寫本頁) 處理方法即可以特定速度將處理液噴嘴移動而在短時間內 於基板上塗敷處理液。如此一來,即可以在基板整體進行 均勻的液體處理。另外,因爲不必將塗敷過處理液的基板 高速搬運,所以不必緊急停止基板,因此也不會發生處理 液由基板上溢落以至於顯像反應停頓,或由於緊急停止所 引起的應力而在基板發生扭曲,以致基板傳送過速( overrun )而破裂等問題。此外,基板的搬運所需要的空間 只要與先前相同即可,所以可以抑制裝置的覆蓋區(foot print)的擴大。 〔發明的構造及作用〕 經濟部智慧財產局員工消費合作社印製 下面要參照附圖詳細說明本發明的構造與作用。在此 ,在本實施形態中,是以本發明使用於進行已施行過曝光 處理的L C D基板的顯像處理的顯像處理單元(D E V ) 之情形爲例加以說明。圖1爲表示具備本發明的一實施形 態的顯像處理單元(D E V )並連續進行抗蝕膜的形成到 顯像爲止的處理的抗蝕劑塗敷與顯像處理系統1 〇 〇的槪 略構造的平面圖。 該抗蝕劑塗敷與顯像處理系統1 0 〇具備用於載置收 容多個LCD基板G的匣盒C的匣盒站(搬出入部)1, 具有多個處理單元而用於對L C D基板G進行包括塗敷及 顯像的一連串處理的處理站(處理部)2,以及在與曝光 裝置4之間進行L C D基板G的交接的介面站(介面部) 3,在處理站2的兩端分別配置匣盒站1與介面站3。另 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 1226077 A7 B7 五、發明説明(5 ) 外,在圖1中,設抗蝕塗敷與顯像處理系統1 0 0的長度 方向爲X方向,在平面上與X方向正交的方向爲Y方向。 (請先閱讀背面之注意事項再填寫本頁) 匣盒站1具備在Y方向排列載置匣盒c的載置台9與 處理站2之間進行L C D基板G的搬進搬出的搬運裝置 1 1,在該載置台9與外部之間進行匣盒C的搬運。另外 ,搬運裝置1 1具有搬運臂1 1 a,可以沿著匣盒C的排 列方向的Y方向設置的搬運路1 0上面移動,藉由搬運臂 1 1 a在處理站2之間進行L C D基板G的搬進搬出。 經濟部智慧財產局員工消費合作社印製 處理站2基本上具有延伸至X方向的L C D基板G搬 運用的平行的二列搬運線A與B,沿著搬運線A由匣盒1 側朝向介面站3排列著擦洗處理單元(S C R ) 2 1,第 1熱處理單元區2 6,抗蝕處理單元2 3以及第2熱處理 單元區2 7。另外,沿著搬運線B由介面站3側向匣盒站 1排列有第2熱處理單元區2 7,顯像處理單元(DEV )2 4, i線紫外線照射單元(i 一 U V ) 2 5,以及第 3熱處理單元區28。在擦洗處理單元(SCR) 2 1上 的一部分設有準分子U V照射單元(.e - U V ) 2 2。另 外,準分子11¥照射單元(6—11¥)2 2是爲了擦洗之 前爲去除L C D基板G的有機物而設置,i線紫外線照射 單元(i - U V ) 2 5則爲了進行顯像的脫色處理而設置 〇 擦洗處理單元(SCR) 2 1在構造上LCD基板G 可以在其中略呈水平姿勢一邊搬運一邊進行洗淨處理與乾 燥處理。顯像處理單元(D E V ) 2 4如後面的詳細說明 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -8- Ϊ226077 A7 B7 五、發明説明(6 ) ,LCD基板G也可以一邊在略呈水平姿勢被搬運,一邊 進行顯像液塗敷,顯像液的顯像液洗淨以及乾燥處理。在 該等擦洗處理單元(S CR) 2 1及顯像處理單元( D E V ) 2 4中,L C D基板G的搬運是以例如滾輪搬運 或輸送帶搬運,而LCD基板G的搬進口與搬出口是設置 於相面對的短邊上。另外,將L C D基板G搬到i線U V 照射單元(i 一 U V ) 2 5是由與顯像處理單元(D E V )2 4的搬運機構相同的機構連續進行。 在抗蝕劑處理單元2 3依序配置抗蝕劑塗敷處理裝置 (CT) 23 a,是藉由在大致上保持於水平的LCD基 板G上滴下抗蝕液並使L C D基板G旋轉特定的旋轉數, 俾使抗蝕液擴充到L C D基板G整體以形成抗蝕膜,減壓 乾燥裝置(V D ) 2 3 b,用於減壓乾燥形成於L C D基 板G上的抗蝕膜,以及周緣抗蝕劑去除裝置(E R ) 2 3 c ,利用可以掃瞄L C D基板G的四邊的溶劑排出頭 以去除附著於L C D基板G周緣的多餘抗蝕劑。在抗蝕劑 處理單元2 3中,在該等抗蝕劑塗敷處理裝置(C 丁) 2 3 a,減壓乾燥裝置(V D ) 2 3 b以及周緣抗蝕劑去 除裝置(E R ) 2 3 c之間設有搬運臂以搬運L C D基板 G。 第1熱處理單元區2 6具有兩個熱處理單元段(TB )31, 32,是由層合要將LCD基板G施予熱處理的 熱處理單元所構成,熱處理單元段(T B ) 3 1是設置於 擦洗單元(SCR) 2 1傍,而熱處理單元段(TB) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) !」——?! (請先閱讀背面之注意事項再填寫本頁)Jn.. &Quot; τ · This paper size applies to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -5- 1226077 A7 B7 V. Description of the invention (3) (Please read the precautions on the back before filling this page) A process in which a substrate is conveyed at a slower speed, and a process in which a processing liquid nozzle that applies a processing liquid to the substrate while discharging the processing liquid onto the substrate and applying the processing liquid to the substrate. A third aspect of the present invention provides a liquid processing apparatus including a transfer mechanism that transfers a substrate to a direction in a substantially horizontal posture, a developing solution nozzle that discharges a developing solution on a surface of the substrate that is transferred by the transfer mechanism, and A nozzle moving mechanism that moves the developing liquid nozzle on the substrate at a specific speed in a direction opposite to the conveyance direction of the substrate, and uses the nozzle moving mechanism to discharge the developing liquid nozzle while moving the developing liquid nozzle The developer is coated on the substrate with the developer. A fourth aspect of the present invention is a liquid processing method for performing a development process on a substrate subjected to an exposure process, and the method includes: transporting the substrate to a developing solution application area where a developing solution is applied in a substantially horizontal posture; The project is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in the above-mentioned developer coating area, stopping the substrate transfer or delaying the substrate transfer speed to a substrate transfer speed that reaches the developer coating area. For a slower process, while the developing solution nozzle to which the developing solution is to be applied on the substrate is horizontally moved onto the substrate, the developing solution nozzle is used to discharge the developing solution and apply the developing solution to the substrate. Process of developing solution, and process of transferring the substrate coated with the developing solution to a liquid removal processing area where the developing solution is removed. Use of the liquid processing devices and liquids of the first to fourth aspects of the present invention The Chinese paper standard (CNS) A4 specification (21〇 > < 297 mm) is applied to the paper size of this paper. (4) (Please read the precautions on the back before filling in this page) The processing method can move the processing liquid nozzle at a specific speed and apply the processing liquid on the substrate in a short time. In this way, uniform liquid processing can be performed on the entire substrate. In addition, because it is not necessary to transport the substrate coated with the processing liquid at high speed, it is not necessary to stop the substrate urgently. Therefore, the processing liquid does not overflow from the substrate, so that the development reaction is stopped, or the stress caused by the emergency stop is caused. The substrate is distorted, causing the substrate to overrun and break. In addition, since the space required for substrate transportation is the same as before, it is possible to suppress the expansion of the footprint of the device. [The Structure and Function of the Invention] Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The structure and function of the present invention will be described in detail below with reference to the drawings. Here, in this embodiment, a case where the development processing unit (D E V) of the present invention is used to perform the development processing of the L C D substrate subjected to the exposure processing will be described as an example. FIG. 1 is a schematic diagram of a resist application and development processing system 100 that includes a development processing unit (DEV) according to an embodiment of the present invention and continuously performs processing from formation of a resist film to development. Constructed floor plan. This resist coating and development processing system 100 is provided with a cassette station (carry-in / out section) 1 for mounting a cassette C which houses a plurality of LCD substrates G, and includes a plurality of processing units for processing the LCD substrates. A processing station (processing section) 2 that performs a series of processes including coating and development, and an interface station (interface portion) 3 that transfers the LCD substrate G to the exposure device 4 at both ends of the processing station 2 Cassette station 1 and interface station 3 are configured separately. In addition, this paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 1226077 A7 B7 V. Description of the invention (5) In addition, in Figure 1, the length of the resist coating and development processing system 100 is set. The direction is the X direction, and the direction orthogonal to the X direction on the plane is the Y direction. (Please read the precautions on the back before filling in this page.) Cassette station 1 is equipped with a conveying device 1 for loading and unloading the LCD substrate G between the stage 9 and the processing station 2 in which cassettes c are arranged in the Y direction. The cassette C is transported between the mounting table 9 and the outside. In addition, the conveying device 11 has a conveying arm 11a, and can move along the conveying path 10 provided in the Y direction of the arrangement direction of the cassettes C. The LCD substrate is processed between the processing stations 2 by the conveying arm 1a G's moving in and out. The Printing and Processing Station 2 of the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs basically has two parallel rows of conveying lines A and B for conveying LCD substrates G in the X direction. 3 arranges a scrub processing unit (SCR) 21, a first heat treatment unit area 26, a resist treatment unit 23, and a second heat treatment unit area 27. In addition, along the transfer line B, a second heat treatment unit area 27, a development processing unit (DEV) 24, and an i-ray ultraviolet irradiation unit (i-UV) 2 5 are arranged from the interface station 3 to the cassette station 1. And the third heat treatment unit region 28. An excimer U V irradiation unit (.e-U V) 2 2 is provided on a part of the scrub processing unit (SCR) 2 1. In addition, the excimer 11 ¥ irradiation unit (6-11 ¥) 2 2 is provided for removing organic matter of the LCD substrate G before scrubbing, and the i-ray ultraviolet irradiation unit (i-UV) 2 5 is used for decolorization of development On the other hand, a scrubbing treatment unit (SCR) 2 is provided. 1 In the structure, the LCD substrate G can be cleaned and dried while being transported in a slightly horizontal posture. Development processing unit (DEV) 2 4 As explained in detail later, this paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -8-Ϊ226077 A7 B7 5. Description of the invention (6), LCD substrate G can also The developer is applied while being carried in a slightly horizontal posture, and the developer of the developer is washed and dried. In the scrub processing unit (S CR) 2 1 and the development processing unit (DEV) 2 4, the LCD substrate G is conveyed by, for example, a roller conveyance or a conveyor belt, and the conveyance inlet and the conveyance outlet of the LCD substrate G are Set on opposite short sides. In addition, the transfer of the L C D substrate G to the i-line U V irradiation unit (i-U V) 25 is performed continuously by the same mechanism as the transport mechanism of the development processing unit (D E V) 24. A resist application processing device (CT) 23 a is sequentially arranged in the resist processing unit 23, and the resist liquid is dripped on the LCD substrate G which is held substantially horizontally, and the LCD substrate G is rotated. The number of rotations is to expand the resist solution to the entire LCD substrate G to form a resist film, and a vacuum drying device (VD) 2 3 b is used to dry the resist film formed on the LCD substrate G under reduced pressure. The etchant removal device (ER) 2 3 c uses a solvent discharge head that can scan the four sides of the LCD substrate G to remove excess resist attached to the periphery of the LCD substrate G. In the resist processing unit 2 3, the resist coating processing device (C) 2 3 a, the reduced-pressure drying device (VD) 2 3 b, and the peripheral resist removing device (ER) 2 3 A carrying arm is provided between c to carry the LCD substrate G. The first heat treatment unit area 2 6 has two heat treatment unit sections (TB) 31, 32, which are formed by laminating heat treatment units for applying heat treatment to the LCD substrate G. The heat treatment unit sections (TB) 3 1 are provided for scrubbing Unit (SCR) 2 1 side, and heat treatment unit segment (TB) This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm)! "—— ?! (Please read the precautions on the back before filling this page )

、1T 經濟部智慧財產局g£消費合作社印製 -9 - 1226077 A7 __B7_ _ 五、發明説明(7 ) 3 2是設置於抗蝕劑處理單元2 3傍。在該等兩個熱處理 單元段(TB) 3 1與3 2之間設置第1搬運裝置3 3。 (請先閱讀背面之注意事項再填寫本頁) 如圖2的第1熱處理單元區2 6的側面圖所示,熱處 理單元段(T B ) 3 1由下面依次具有用於交接L C D基 板D的傳遞單元(PASS) 6 1,對LCD基板G進行 脫水焙烤處理的脫水焙烤單元(D Η p ) 6 2與6 3,以 及對L C D基板G施予疏水化處理的黏合處理單元(A D )6 4的4段的層合構造,另外,熱處理單元段(T B ) 3 2由下面依次具有用於交接L C D基板G的傳遞單元( PASS) 6 5,用於冷卻LCD基板G的兩個冷卻單元 (C〇L ) 6 6與6 7,以及對L C D基板G進行疏水化 處理的黏合處理單元(A D ) 6 8的4段的層合構造。 第1搬運裝置3 3是進行透過傳遞單元(PASS) 6 1接受來自擦洗處理單元(SCR) 21的LCD基板 G,上述熱處理單元間的LCD基板G的搬進搬出,以及 透過傳遞單元(PASS) 65對抗鈾劑處理單元23的 L C D基板G的交接。 經濟部智慧財產局員工消費合作社印製 第1搬運裝置3 3具備向上下延伸的導軌9 1,沿著 導軌升降的升降構件9 2,設置於升降構件9 2上面成可 旋轉的支承構件9 3與設置於支承構件9 3上成可進退運 動,並保持L C D基板G的基板保持臂9 4。而升降構件 9 2的升降是利用馬達9 5驅動,支承構件9 3的旋轉是 利用馬達9 6驅動,基板保持臂9 4的進退運動是利用馬 達9 7驅動。第1搬運裝置3 3可以如此上下運動,前後 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -10- 1226077 A7 B7 五、發明説明(8) 運動以及旋轉運動,也可以存取熱處理單元段(τ B ) 3 1與3 2的任一單元。 (請先閲讀背面之注意事項再填寫本頁} 第2熱處理單元區2 7具有兩個熱處理單元段(TB )3 4與3 5,是由對L C D基板G施予熱處理的熱處理 單元層合而成,熱處理單元段(TB) 3 4設置於抗蝕劑 處理單元2 3傍,而熱處理單元段(τ B ) 3 5則設置於 顯像處理單元(DEV) 2 3傍。而在該兩個熱處理單元 段(TB ) 3 4與3 5之間設有第2搬運裝置3 6。 如圖3第2熱處理單元區27的側面圖所示,熱處理 單元(TB) 3 4由下面依次由進行LCD基板G的交接 的傳遞單元(PASS) 69以及對LCD基板G進行預 烘烤處理的三個預烘烤單元(PREBAKE) 70, 71,72四層層合而成,而熱處理單元段(TB) 35 由下面依次由進行L C D基板G的交接的傳遞單元( PASS) 73,用於冷卻LCD基板G的冷卻單元( 經濟部智慧財產局員工消費合作社印製 C〇L ) 7 4,以及對L C D基板G進行預烘烤處理的兩 個預烘烤單元(PREBAKE) 75與76四層層合而 成。 第2搬運裝置36透過傳遞單元(PASS) 69接 受來自抗蝕劑處理單元2 3的LCD基板G,進行上述熱 處理單元間的L C D基板G的搬進搬出,透過傳遞單元( P A S S ) 7 3對顯像處理單元(D E V ) 2 4進行 L C D基板G的交接,以及進行對後述的介面站3的基板 交接部延伸冷卻台(E X T · C〇L ) 4 4的交接及接收 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - 1226077 A7 B7 五、發明説明(9 ) 。另外,第2搬運裝置3 6具有與第1搬運裝置3 3相同 的構造,也可以存取熱處理單元段(T B ) 3 4與3 5任 (請先閲讀背面之注意事項再填寫本頁) 一單元。 第3熱處理單元區2 8具有兩個熱處理單元段(TB )37與38,是由對LCD基板G施予熱處理的熱處理 單元層合而成,熱處理單元段(TB) 3 7是設置於顯像 處理單元(DEV) 24傍,而熱處理單元段(TB) 3 8則設置於匣盒站1傍。而且在該等兩個熱處理單元段 (TB) 3 7與3 8之間設有第3搬運裝置3 9。 如圖4的第3熱處理單元區2 8的側面圖所示,熱處 理單元段(T B ) 3 7由下面依次由交接L C D基板G的 傳遞單元(P A S S ) 7 7與對L C D基板G進行後烘烤 處理的三個後烘烤單元(P〇BAKE) 78,79與 80四層層合而成。另外,熱處理單元段(TB) 38具 有由下面依次由後烘烤單元(P〇BAKE) 81,進行 L C D基板G的交接及冷卻的傳遞冷卻單元(P A S S · C〇L ) 8 2,以及對L C D基板G進行後烘烤處理的兩 經濟部智慧財產局員工消費合作社印製 個後烘烤單元(P〇B A K E ) 8 3與8 4四層層合的構 造。 第3搬運裝置39透過傳遞單元(PASS) 77接 受來自i線紫外線照射單元(i 一 U V ) 2 5的L C D基 板G,在上述熱處理單元間將L C D基板G搬進搬出,以 及透過傳遞冷卻單元(PASS · C〇L) 8 2對匣盒站 1交接L CD基板G。另外,第3搬運裝置3 9也具有與 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -12- 1226077 A7 ___ B7 五、發明説明(1〇) 第1搬運裝置3 3相同的構造,也可以存取熱處理單元段 (TB) 37與38的任一單元。 (請先閱讀背面之注意事項再填寫本頁} 在處理站2的各處理單元及搬運裝置被配置成如上所 述構成2排的搬運線A與B,且基本上成爲處理的順序, 在該等搬運線A與B之間設有空間4 0。而且設有可以來 回運動的送件裝置(基板載置構件)4 1。該送件構件 4 1構造上可以保持L C D ‘基板G,透過送件裝置4 1在 搬運線間進行L C D基板G的交接。對送件裝置4 1的 L CD基板G的交接是由上述第1到第3搬運裝置3 3, 3 6與3 9來進行。 經濟部智慧財產局員工消費合作社印製 介面站3具備:在處理站2與曝光裝置4之間進行 L C D基板G的搬進搬出的搬運裝置4 2,用於配置緩衝 匣台(B U F ) 4 3,以及具有冷卻功能的基板交接部延 伸冷卻台(EXT-COL) 44,抬頭拉(TITLER) 與周邊曝光裝置(E E )上下層合的外部裝置塊4 5設置 成鄰接於搬運裝置4 2。搬運裝置4 2具有搬運臂4 2 a ,利用該搬運臂4 2 a在處理站2與曝光裝置4之間進行 L C D基板G的搬進搬出。 在如此構成的抗蝕劑塗敷與顯像處理系統1 〇 〇中, 首先配置於匣盒站1的載置台9的匣盒C中的L CD基板 G由搬運裝置1 1直接搬入處理站2的準分子UV照射單 元(e - UV) 22以進行擦光處理。然後,利用搬運裝 置1 1,將L C D基板G搬進擦光洗淨處理單元(S C R )2 1以供擦光。擦光洗淨處理後,L C D基板G被利用 本紙張尺度i用中Ϊ8Ι家標準(CNS ) A4規格(210X297公釐) " " -13- 1226077 A7 B7 五、發明説明(Μ) 例如滾輪搬運法搬運至屬於第1熱處理單元區2 6的熱處 理單元段(ΤΒ)的傳遞單元(PASS) 61。 (請先閲讀背面之注意事項再填寫本頁) 配置於傳遞單元(P A S S ) 6 1的L C D基板G首 先被搬運至熱處理單元段(TB) 3 1的脫水烘烤單元( DHP) 62與63的任一方以加熱處理,然後,搬運至 熱處理單元段(TB) 32的冷卻單元(COL) 66與 6 7的任一方冷卻後,爲提高抗鈾劑的穩定性,被搬運到 熱處理單元段(TB) 3 1的黏合處理單元(AD) 64 及熱處理單元段(TB) 3 2的黏合處理單元(AD) 6 8的任一方,並在該處以HMD S進行黏合(adhesion) 處理(疏水化處理)。然後,L C D基板G被搬運到冷卻 單元(C0L) 6 6與6 7的任一方冷卻,再搬運至熱處 理單元段(TB) 32的傳遞單元(PASS) 65。進 行此種一連串處理時的L C D基板G的搬運處理全部由第 1搬運裝置3 3實行。 經濟部智慧財產局員工消費合作社印製 配置於傳遞單元(PASS) 6 5的LCD基板G是 以抗鈾劑處理單元2 3的搬運臂搬進抗鈾劑處理單元2 3 內。LCD基板G在抗蝕劑塗敷處理裝置(CT) 23a 被旋轉塗敷後,被搬運到減壓乾燥裝置(V D ) 2 3 b以 進行減壓乾燥,再搬運至周緣抗蝕劑去除裝置(E R ) 2 3 c以去除L C D基板G周緣的多餘抗蝕劑。而在去除 周緣抗蝕劑結束後,L C D基板G被搬運臂由抗蝕劑處理 單元2 3轉交給第2熱處理單元區2 7所屬的熱處理單元 段(TB) 34的傳遞單元(PASS) 69。 ^紙張尺度適用中國國家標準(CNS ) A4規格(210X29?公釐) " -14- 1226077 A7 ^~E_ 五、發明説明(12) (請先閲讀背面之注意事項再填寫本頁} 配設於傳遞單元(P A S S ) 6 9的L C D基板G被 第2搬運裝置3 6搬運到熱處理單元段(tb) 3 4的預 供烤單元(PREBAKE) 70,71與72及熱處理 單元段(TB) 3 5的預烘烤單元(?尺£8厶尺狂) 7 5與7 6的任一方進行預烘烤處理,然後,被搬運至熱 處理單元段(TB) 3 5的冷卻單元(C〇l) 74以冷 卻至特定溫度。然後,再利用第2搬運裝置3 6搬運到熱 處理單元段(TB) 3 5之傳遞單元(PASS) 73。 然後,LCD基板G被第2搬運裝置36搬到介面站 3的延伸冷卻台(EXT · COL) 44,並被介面站3 的搬運裝置4 2搬運到外部裝置段4 5的周邊曝光裝置( EE)進行曝光以去除周邊抗蝕劑,然後,被搬運裝置 4 2搬運到曝光裝置4,在該處L CD基板G上的抗蝕膜 被曝光而形成特定的圖案。看情形,有時將L C D基板G 收容於緩衝台(B U F ) 4 3上面的緩衝匣盒後才搬運至 曝光裝置4。 經濟部智慧財產苟員工消費合作社印製 結束曝光後,LCD基板G由介面站3的搬運裝置 4 2搬進外部裝置段4 5的上層的抬頭拉(T I TL ER ),而在L C D基板G註記特定資訊後,即放置於延伸冷 卻台(EXT · COL) 44。LCD基板G被第2搬運 裝置36由延伸冷卻台(EXT · C〇L) 44搬運到第 2熱處理單元區2 7所屬的熱處理段(TB) 3 5的傳遞 單元(PASS) 73 。 藉由使由傳遞單元(P A S S ) 7 3延伸至顯像處理 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -15- 1226077 A7 B7__ 五、發明説明(13) 單元(D E V ) 2 4的例如滾輪機構發生作用,L C D基 (請先閱讀背面之注意事項再填寫本頁) 板G即由傳遞單元(P A S S ) 7 3被搬進顯像處理單元 (D E V ) 2 4,並在該處施予顯像處理。該項顯像處理 工程將在後面詳細說明。 顯像處理結束後,L C D基板G藉由連接於顯像處理 單元(D E V ) 2 4的搬運機構,例如滾輪搬運機構搬運 到i線U V照射單元(i 一 U V ) 2 5,而對L C D基板 G施予脫色處理。然後,L C D基板G藉由i線U V照射 單元(i - UV) 2 5內的滾輪搬運機構搬出到屬於第3 熱處理區2 8的熱處理單元段(TB) 3 7的傳遞單元( P A S S ) 7 7。 配置於傳遞單元(PASS) 77的LCD基板G被 第3搬運裝置3 9搬運到熱處理單元段(TB) 3 7的後 烘烤單元(P〇BAKE) 78,79與80及熱處理單 元段(TB) 38的後烘烤單元(P〇BAKE) 81, 8 3與8 4的任一方以進行後烘烤處理,然後被搬運到熱 處理單元段(TB) 38的傳遞冷卻單元(PASS· 經濟部智慧財產局員工消費合作社印製 C〇L ) 8 2以冷卻至特定溫度後,藉由匣盒站1的搬運 裝置11收容於配置在匣盒站1之特定匣盒0中° 其次,要詳細說明顯像處理單元(D E V ) 2 4的構 造。圖5爲表示顯像處理單元(D E V ) 2 4的槪略構造 ,圖6爲平面圖。顯像處理單元(DEV) 2 4是由導入 區2 4 a,第1顯像液供應區2 4 b,第2顯像液供應區 2 4 c,顯像液去除區2 4 d,洗淸區2 4 e,以及乾燥 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -16- 1226077 A7 B7_ 五、發明説明(14 ) (請先閱讀背面之注意事項再填寫本頁) 區2 4 f所構成。導入區2 4 a鄰接熱處理單元段(TB )3 5的傳遞單元(P A S S ) 7 3,而乾燥區2 4 f鄰 接i線U V照射單元(i 一 u V ) 2 5。 在傳遞單元(P A S S ) 7 3與i線U V照射單元( i - U V ) 2 5之間設有以馬達等驅動轉動滾輪以搬運 L C D基板G至特定方向的滾輪搬運機構1 4,藉由操作 該滾輪搬運機構1 4,可以將該L C D基板G由傳遞單元 (PASS) 73通過顯像處理單元(DEV) 24搬向 i線U V照射單元(i 一 u V ) 2 5。滾輪1 7爲使 LCD基板G不致發生彎曲等,在LCD基板G的搬運方 向及該搬運方向的垂直方向設置一定數目。另外,在圖6 中並未圖示該滾輪搬運機構1 4。 經濟部智慈財產局員工消費合作社印製 如圖5所示,在顯像處理單元(D E V ) 2 4中,滾 輪搬運機構1 4被分割成3個區域,且每一區域可以獨立 驅動。傳遞單元(PASS) 73與導入區24a是利用 第1馬達1 5 a的驅動搬運L C D基板G。此外,第1顯 像液供應區2 4 b,與第2顯像液供應區2 4 c以及顯像 液去除區2 4 d是利用第2馬達1 5 b的驅動搬運L C D 基板G。再者,淸洗區2 4 e與乾燥區2 4 f是利用第3 馬達1 5 c的驅動搬運L C D基板G。這種滾輪搬運機構 1 4的分別驅動也可以例如對構成顯像處理單元(D E V )2 4的每一區域進行。 傳遞單元(P A S S ) 7 3具有升降自如的頂升桿( lifting pin) 1 6。在保持有LCD基板G的第2搬運裝置 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) — " -17- 1226077 A7 B7 __ 五、發明説明(15) (請先閱讀背面之注意事項再填寫本頁) 36的基板保持臂94進入傳遞單元(PASS) 73中 的狀態下使頂升桿1 6上升時,L C D基板G即由基板保 持臂9 4轉交予頂外桿1 6。接著,如在將基板保持臂 9 4由傳遞單元(PASS) 7 3退出後降下頂升桿16 時,LCD基板G即被載置於傳遞單元(PASS) 7 3 內的滾輪1 7上面。藉由驅動第1馬達1 5 a , L C D基 板G可以由傳遞單元(PAS S) 7 3搬出到導入區 2 4 a 〇 導入區24a是設置於傳遞單元(PASS) 73與 第1顯像液供應區2 4 b之間做爲緩衝區域的,該導入區 2 4 a是用於防止顯像液由第1顯像液供應區2 4 b飛散 到傳遞單元(PASS) 73等而污染傳遞單元( P A S S ) 7 3。 第1顯像液供應區2 4 b是用於對由導入區2 4 a搬 來的L C D基板G進行最初的顯像液的塗厚(形成浸置式 顯影)的區域,而設有對L C D基板G塗敷顯像液的顯像 液供應機構6 0。 經濟部智慧財產局員工消費合作社印製 圖7是由L C D基板G的搬運方向的上游側所見第1 顯像液供應區2 4 b的構造。顯像液供應機構6 0具有對 L C D基板G排出顯像液的主顯像液噴嘴5 1 a與副顯像 液噴嘴5 1 b (以下簡稱顯像噴嘴5 1 a與5 1 b )兩支 噴嘴,用於固定該兩支噴嘴的噴嘴固定構件5 5,用於保 持噴嘴固定構件5 5的噴嘴保持構件5 6,用於升降噴嘴 保持構件5 6的升降裝置,以及使顯像噴嘴5 1 a與 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -18- 1226077 A7 _ B7 _ 五、發明説明(16) 5 1 b掃瞄於X方向的噴嘴移動機構6 0 a。1T Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs g £ Consumer Cooperatives -9-1226077 A7 __B7_ _ V. Description of the Invention (7) 3 2 is set on the resist processing unit 2 3. A first transfer device 3 3 is provided between the two heat treatment unit sections (TB) 3 1 and 3 2. (Please read the precautions on the back before filling in this page.) As shown in the side view of the first heat treatment unit area 2 6 of FIG. 2, the heat treatment unit segment (TB) 3 1 has a transfer for transferring the LCD substrate D from the bottom in order. Unit (PASS) 61, a dehydration baking unit (D Η p) 6 2 and 6 3 for dehydrating and baking the LCD substrate G, and an adhesion processing unit (AD) 6 4 for applying hydrophobic treatment to the LCD substrate G Laminated structure of 4 stages. In addition, the heat treatment unit stage (TB) 3 2 has a transfer unit (PASS) 6 for transferring the LCD substrate G in order from the bottom, and two cooling units (C〇) for cooling the LCD substrate G. L) 6 and 6 7 and a four-stage laminated structure of an adhesion processing unit (AD) 6 8 that hydrophobizes the LCD substrate G. The first conveying device 3 3 is a transmission unit (PASS) 6 1 receives the LCD substrate G from the scrubbing processing unit (SCR) 21, the LCD substrate G between the heat treatment units is carried in and out, and the transmission unit (PASS) 65 resists the transfer of the LCD substrate G of the uranium agent processing unit 23. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the first conveying device 3 3 is provided with a guide rail 9 1 extending up and down, a lifting member 9 2 for lifting and lowering along the guide rail, and a support member 9 3 provided on the lifting member 9 2 so as to rotate thereon The substrate holding arm 94 is provided to be movable forward and backward on the supporting member 93 and holds the LCD substrate G. The lifting of the lifting member 92 is driven by a motor 95, the rotation of the support member 93 is driven by a motor 96, and the advancing and retreating motion of the substrate holding arm 94 is driven by a motor 97. The first conveying device 3 3 can move up and down in this way. The size of this paper is applicable to the Chinese national standard (CNS) A4 (210X297 mm) -10- 1226077 A7 B7. 5. Description of the invention (8) Movement and rotation can also be stored. Take any one of the heat treatment unit segments (τ B) 3 1 and 3 2. (Please read the precautions on the back before filling in this page} The second heat treatment unit area 2 7 has two heat treatment unit sections (TB) 3 4 and 35, which are laminated by heat treatment units that apply heat treatment to the LCD substrate G. Therefore, the heat treatment unit segment (TB) 3 4 is disposed near the resist processing unit 2 3, and the heat treatment unit segment (τ B) 3 5 is disposed near the development processing unit (DEV) 2 3. A heat transfer unit section (TB) 3 4 and 3 5 are provided with a second conveying device 36. As shown in the side view of the second heat treatment unit area 27 of FIG. 3, the heat treatment unit (TB) 3 4 is sequentially processed from below by the LCD The pass-through unit (PASS) 69 of the substrate G and three pre-baked units (PREBAKE) 70, 71, 72 for pre-baking the LCD substrate G are laminated in four layers, and the heat treatment unit segment (TB) 35 The transfer unit (PASS) 73 for transferring the LCD substrate G, the cooling unit for cooling the LCD substrate G (COL printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs) 7 4 and the LCD substrate G Two pre-baking units (PREBAKE) 75 and 76 for pre-baking The second conveying device 36 receives the LCD substrate G from the resist processing unit 2 3 through the transfer unit (PASS) 69, carries in and out the LCD substrate G between the heat treatment units, and passes through the transfer unit (PASS) 7 3 to the development processing unit (DEV) 2 4 to transfer the LCD substrate G, and to the substrate transfer section extension cooling stage (EXT · COL) 4 of the interface station 3 to be described later. China National Standard (CNS) A4 specification (210X297 mm) -11-1226077 A7 B7 5. Description of the invention (9). In addition, the second conveying device 36 has the same structure as the first conveying device 33, and can also be stored. Take heat treatment unit segments (TB) 3 4 and 35 (please read the notes on the back before filling out this page) one unit. The third heat treatment unit area 2 8 has two heat treatment unit segments (TB) 37 and 38. Yes It is formed by laminating a heat treatment unit that applies heat treatment to the LCD substrate G. The heat treatment unit segment (TB) 3 7 is disposed near the development processing unit (DEV) 24, and the heat treatment unit segment (TB) 3 8 is disposed in the cassette. Box stand 1 Pong. And in these two The third heat treatment unit section (TB) 3 7 and 3 8 are provided with a third conveying device 39. As shown in the side view of the third heat treatment unit section 2 8 of FIG. 4, the heat treatment unit section (TB) 3 7 is in order from below The transfer unit (PASS) 7 7 which transfers the LCD substrate G and the three post-baking units (POBAKE) 78, 79 and 80 which post-bake the LCD substrate G are laminated in four layers. In addition, the heat treatment unit segment (TB) 38 has a transfer cooling unit (PASS · COL) 8 2 that transfers and cools the LCD substrate G from the post-bake unit 81 (P0BAKE) 81 in this order, and the LCD The consumer co-operatives of the two employees of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a post-baking unit (P0BAKE) 8 3 and 8 4 with a four-layer laminated structure on the substrate G. The third conveying device 39 receives the LCD substrate G from the i-ray ultraviolet irradiation unit (i-UV) 2 5 through a transmission unit (PASS) 77, carries the LCD substrate G in and out between the heat treatment units, and transmits the LCD substrate G through the transmission cooling unit ( PASS · COL) 8 2 pair of cassette stations 1 transfers the L CD substrate G. In addition, the third conveying device 39 also has the Chinese national standard (CNS) A4 specification (210X 297 mm) that is compatible with this paper size. -12- 1226077 A7 ___ B7 V. Description of the invention (10) The first conveying device 3 3 With the same structure, it is also possible to access any one of the heat treatment unit sections (TB) 37 and 38. (Please read the precautions on the back before filling out this page} Each processing unit and conveying device in processing station 2 is configured to form two rows of conveying lines A and B as described above, and basically becomes the order of processing. There is a space 40 between the transfer lines A and B. Furthermore, there is a feeding device (substrate mounting member) 41 that can move back and forth. This feeding member 41 can hold the LCD 'substrate G in structure and transmit through The component device 41 transfers the LCD substrate G between the transfer lines. The transfer of the L CD substrate G to the transfer device 41 is performed by the above-mentioned first to third transfer devices 3 3, 3 6 and 39. Economy The Intellectual Property Bureau employee consumer cooperative print interface station 3 is provided with a transport device 4 2 for carrying in and out of the LCD substrate G between the processing station 2 and the exposure device 4, and is used to configure a buffer box table (BUF) 4 3, And an extension cooling stage (EXT-COL) 44 for the substrate transfer part with a cooling function, and an external device block 45, which is laminated on top and bottom with the peripheral exposure device (EE), is disposed adjacent to the conveying device 42. The conveying device 4 2 has a carrying arm 4 2 a, and using this carrying arm 4 2 a The LCD substrate G is carried in and out between the processing station 2 and the exposure device 4. In the resist coating and development processing system 100 configured as described above, it is first placed on the mounting table of the cassette station 1 The L CD substrate G in the cassette C of 9 is directly carried into the excimer UV irradiation unit (e-UV) 22 of the processing station 2 by the carrying device 11 for polishing treatment. Then, the LCD substrate is carried by the carrying device 11 G is moved into the polishing and cleaning processing unit (SCR) 21 for polishing. After the polishing and cleaning process, the LCD substrate G is used in this paper. The standard is 8I (CNS) A4 (210X297 mm). " " -13- 1226077 A7 B7 V. Description of the invention (M) For example, the roller conveying method is used to transfer the pass unit (PASS) 61 which belongs to the heat treatment unit section (TB) of the first heat treatment unit area 26. (Please read first) Note on the back, please fill in this page again.) The LCD substrate G placed in the pass unit (PASS) 6 1 is first transferred to the heat treatment unit section (TB) 3 1 of the dehydration baking unit (DHP) 62 and 63 for heating Process and then transfer to cooling unit of heat treatment unit section (TB) 32 COL) 66 and 6 7 After cooling, in order to improve the stability of the uranium-resistant agent, it was transferred to the bonding unit (AD) 64 and the heat treatment unit (TB) 3 2 of the heat treatment unit (TB) 3 1 Adhesion processing unit (AD) 6 8 Any one of them is subjected to an adhesion treatment (hydrophobization treatment) with HMD S there. Then, the L C D substrate G is transferred to one of the cooling units (C0L) 6 6 and 6 7 to be cooled, and then transferred to the transfer unit (PASS) 65 of the thermal processing unit section (TB) 32. All the conveyance processing of the L C D substrate G when performing such a series of processing is performed by the first conveying device 33. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The LCD substrate G disposed in the pass unit (PASS) 6 5 is moved into the uranium-resistant agent processing unit 2 3 by the carrying arm of the uranium-resistant agent processing unit 2 3. After the LCD substrate G is spin-coated in the resist application processing device (CT) 23a, it is transported to a reduced-pressure drying device (VD) 2 3 b for reduced-pressure drying, and then transferred to a peripheral resist removal device ( ER) 2 3 c to remove excess resist on the periphery of the LCD substrate G. After the peripheral resist is removed, the L C D substrate G is transferred from the resist processing unit 23 to the transfer unit (PASS) 69 of the heat treatment unit section (TB) 34 belonging to the second heat treatment unit area 27 by the carrying arm. ^ The paper size applies the Chinese National Standard (CNS) A4 specification (210X29? Mm) " -14- 1226077 A7 ^ ~ E_ V. Description of the invention (12) (Please read the precautions on the back before filling this page} Configuration The LCD substrate G in the transfer unit (PASS) 6 9 is transported to the heat treatment unit section (tb) 3 by the second conveying device 3 6 4 PREEBAKE units 70, 71 and 72 and the heat treatment unit section (TB) 3 5 pre-baking unit (? Feet £ 8 厶 狂) 7 5 and 7 6 are pre-baked, and then transferred to the heat treatment unit section (TB) 3 5 cooling unit (C0l) 74 to cool to a specific temperature. Then, the second transfer device 36 is transferred to the transfer unit (PASS) 73 of the heat treatment unit section (TB) 3 5. The LCD substrate G is then transferred to the interface station by the second transfer device 36. 3 extended cooling stage (EXT · COL) 44 and is carried by the interface device 3's conveyance device 4 2 to the external device section 4 5's peripheral exposure device (EE) for exposure to remove peripheral resist, and then, the conveyed device 4 2 is transferred to the exposure device 4 where the resist film on the L CD substrate G is exposed to form a specific Depending on the situation, sometimes the LCD substrate G is stored in the buffer box (3) on the buffer table (BUF) 4 3 before being transferred to the exposure device 4. After printing is completed, the LCD substrate G of the Intellectual Property Department of the Ministry of Economic Affairs and the Consumer Cooperative will print the LCD substrate. G is transferred from the transfer device 4 2 of the interface station 3 to the upper head lift (TI TL ER) of the external device section 4 5. After the LCD substrate G notes specific information, it is placed on the extension cooling stage (EXT · COL) 44 The LCD substrate G is transferred by the second transfer device 36 from the extended cooling stage (EXT · COL) 44 to the transfer unit (PASS) 73 of the heat treatment section (TB) 3 5 to which the second heat treatment unit area 27 belongs. Extending from the transmission unit (PASS) 7 3 to the development process The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -15- 1226077 A7 B7__ 5. Description of the invention (13) Unit (DEV) 2 4 For example, the roller mechanism works, and the LCD base (please read the precautions on the back before filling in this page). The plate G is moved into the development processing unit (DEV) 2 4 by the transfer unit (PASS) 7 3, and there Development process is performed. The details will be described later. After the development process is completed, the LCD substrate G is transferred to the i-line UV irradiation unit (i-UV) by a transport mechanism, such as a roller transport mechanism, connected to the development processing unit (DEV) 2 4 2 5 The LCD substrate G is subjected to a decoloring treatment. Then, the LCD substrate G is carried out by the roller conveyance mechanism in the i-ray UV irradiation unit (i-UV) 2 5 to the heat treatment unit section (TB) 3 7 belonging to the third heat treatment zone 2 8 3 PASS 7 7 . The LCD substrate G disposed in the transfer unit (PASS) 77 is transferred by the third transfer device 39 to the heat treatment unit section (TB) 37, and the post-baking unit 78, 79, and 80 and the heat treatment unit section (TB ) 38 post-baking unit (P0BAKE) 81, 8 3 and 8 4 for post-baking treatment, and then transferred to the heat treatment unit section (TB) 38 transfer cooling unit (PASS · Ministry of Economy wisdom) The property bureau employee consumer cooperative prints COL) 8 2 to cool to a specific temperature, and then it is stored in the specific box 0 arranged in the box station 1 by the carrying device 11 of the box station 1 ° Next, it will be explained in detail Structure of a development processing unit (DEV) 24. FIG. 5 shows a schematic structure of the development processing unit (D E V) 24, and FIG. 6 is a plan view. The development processing unit (DEV) 24 is composed of a lead-in area 2 4 a, a first developer supply area 2 4 b, a second developer supply area 2 4 c, a developer removal area 2 4 d, and washing. Zone 2 4 e, and the size of this paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -16- 1226077 A7 B7_ 5. Description of the invention (14) (Please read the precautions on the back before filling this page) Area 2 4 f. The lead-in area 2 a is adjacent to the transfer unit (P A S S) 7 3 of the heat treatment unit section (TB) 35, and the drying area 2 f is adjacent to the i-line U V irradiation unit (i-u V) 2 5. Between the transfer unit (PASS) 7 3 and the i-ray UV irradiation unit (i-UV) 2 5, a roller conveying mechanism 1 4 that rotates a roller driven by a motor or the like to convey the LCD substrate G to a specific direction is provided. The roller conveying mechanism 14 can carry the LCD substrate G from the transfer unit (PASS) 73 through the development processing unit (DEV) 24 to the i-ray UV irradiation unit (i-u V) 2 5. In order to prevent the LCD substrate G from being bent or the like, the rollers 17 are provided in a certain number in the conveying direction of the LCD substrate G and the vertical direction of the conveying direction. The roller conveyance mechanism 14 is not shown in FIG. 6. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs As shown in Fig. 5, in the development processing unit (DEV) 24, the roller conveying mechanism 14 is divided into 3 regions, and each region can be driven independently. The transfer unit (PASS) 73 and the lead-in area 24a carry the L C D substrate G by the drive of the first motor 15a. In addition, the first developer supply area 2 4 b, the second developer supply area 2 4 c, and the developer removal area 2 4 d are used to transport the L C D substrate G by the drive of the second motor 15 b. In addition, the cleaning zone 2 4 e and the drying zone 2 4 f are used to transport the L C D substrate G by the drive of the third motor 15 c. Such a separate driving of the roller conveyance mechanism 14 may be performed, for example, for each area constituting the development processing unit (D E V) 2 4. The transfer unit (P A S S) 7 3 has a lifting pin 1 6 which can be raised and lowered freely. The second conveying device holding the LCD substrate G. The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm) — " -17- 1226077 A7 B7 __ 5. Description of the invention (15) (Please read the back first Please note that this page is to be filled in again.) When the substrate holding arm 94 of 36 enters the transfer unit (PASS) 73 and the jack 16 is raised, the LCD substrate G is transferred from the substrate holding arm 9 4 to the top outer rod 1 6. Next, when the substrate holding arm 94 is pulled out by the transfer unit (PASS) 7 3 and the jack 16 is lowered, the LCD substrate G is placed on the rollers 17 inside the transfer unit (PASS) 7 3. By driving the first motor 15a, the LCD substrate G can be carried out by the transfer unit (PAS S) 7 3 to the lead-in area 2 4 a 〇 The lead-in area 24a is provided in the transfer unit (PASS) 73 and the first developing liquid supply Areas 2 4 b are used as buffer areas. The introduction area 2 4 a is used to prevent the developing solution from being scattered from the first developing solution supply area 2 4 b to the transfer unit (PASS) 73 and so on to contaminate the transfer unit ( PASS) 7 3. The first developing liquid supply area 2 4 b is an area for coating the LCD substrate G carried from the introduction area 2 4 a with the initial coating thickness (forming immersion development), and is provided with an LCD substrate. G. A developer supply mechanism 60 for applying developer. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Fig. 7 shows the structure of the first developer supply area 2 4 b as seen from the upstream side in the conveyance direction of the LCD substrate G. The developing liquid supply mechanism 60 has two main developing liquid nozzles 5 1 a and a sub developing liquid nozzle 5 1 b (hereinafter referred to as developing nozzles 5 1 a and 5 1 b) that discharge the developing liquid to the LCD substrate G. A nozzle, a nozzle fixing member 5 5 for fixing the two nozzles, a nozzle holding member 5 6 for holding the nozzle fixing member 5 5, a lifting device for lifting the nozzle holding member 5 6, and a developing nozzle 5 1 a and this paper size apply the Chinese National Standard (CNS) A4 specification (210X297 mm) -18- 1226077 A7 _ B7 _ V. Description of the invention (16) 5 1 b Nozzle moving mechanism scanned in the X direction 6 0 a.

(請先閲讀背面之注意事項再填寫本頁J 噴嘴移動機構6 0 a具備:用於保持弓形臂5 8,導 軌5 9 a,使弓形臂5 8沿著導軌5 9 a掃瞄的驅動機構 4 6,用於保持導軌5 9 a的導軌保持構件5 9 b,以及 用於固定導軌保持構件5 9 b的導軌固定台5 9 c。另外 ,顯像液供應機構6 0具備升降裝置5 7與控制驅動機構 4 6的控制機構4 7,該控制機構4 7可以控制來自顯像 噴嘴5 1 a與5 1 b的顯像液的排出量以及排出的開始與 中止。 經濟部智慧財產局員工消費合作社印製 另外,在圖7另示出滾輪搬運機構1 _4的構造。亦即 ,滾輪搬運機構1 4具備:延伸於L C D基板G的搬運方 向(X方向)並由第2馬達1 5b (在圖7未圖示,參照 圖5 )旋轉於X軸周圍的樞軸1 9,固定於樞軸1 9而旋 轉於X軸周圍的第1齒輪1 9 a,在L C D基板G的寬方 向(Y方向)滾輪1 7以一定間隔設置較長的樞軸1 8, 安裝成在樞軸1 8的一端與第1齒輪1 9 a嚙合,並將第 1齒輪1 9 a的X軸周圍的旋轉轉換成Y軸周圍的旋轉的 第2齒輪1 8 a,安裝於樞軸1 8的另一端,並藉由第2 齒輪1 8 a的旋轉透過樞軸1 8旋轉的第3齒輪1 8 b, 在X軸周圍旋轉自如的樞軸1 9 ’ ,以及安裝於樞軸 1 9 ’俾與齒輪1 8 b嚙合,並將第3齒輪1 8 b的Y軸 周圍的旋轉轉換成X軸周圍的旋轉的第4齒輪1 9 b。 在滾輪搬運機構1 4中,用於使樞軸1 8旋轉的驅動 部是由樞軸1 9,第1齒輪1 9 a,第2齒輪1 8 a ,以 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 一 ~ -19- 1226077 A7 __ _B7__ 五、發明説明(17) (請先閱讀背面之注意事項再填寫本頁) 及第2馬達15b所構成,第3齒輪18b,樞軸19’ ,與第4齒輪1 9 b使樞軸1 8的旋轉順暢,並扮演支撐 樞軸1 8的角色。 圖8爲表示主顯像液噴嘴5 1 a的構造斜視圖。主顯 像液噴嘴5 1 a具有LCD基板G的寬度方向(Y方向) 的長的構造。在主顯像液噴嘴5 1 a上部中央設有對主顯 像液噴嘴5 1 a供應顯像液的顯像液供應管4 9 a,使其 可以在下端沿著長度方向形成的排出口 4 9 b將顯像液排 出略呈帶狀。副顯像液噴嘴5 1 b具有與主顯像液噴嘴 5 1 a相同的構造。 顯像噴嘴5 1 a與5 1 b爲使長度方向與Y方向相一 致,是以噴嘴固定構件5 5平行保持於一定間隔。另外, 經濟部智慧財產局8工消費合作社印製 可以藉由驅動升降裝置5 7升降噴嘴保持構件5 6來升降 顯像噴嘴5 1 a與5 1 b,藉此,可以調節顯像噴嘴 5 1 a與5 1 b的排出口 4 9 b與L CD基板G表面之間 的間隙。另外,在弓形臂5 8兩端形成有嵌合於導軌 5 9 a的嵌合部5 8 a,藉由驅動機構4 6將弓形臂5 8 在導軌5 9 a的長度方向滑動自如於X方向。 在顯像液供應機構6 0內,藉由從顯像噴嘴5 1 a, 5 1 b —邊對L CD基板G向Y方向排出略呈長帶狀的顯 像液,一邊將顯像噴嘴5 1 a與5 1 b掃瞄於X方向(即 將弓形臂5 8滑行於X方向),即可以在L c D基板G的 表面塗敷顯像液。 要在L C D基板G整體上均勻進行顯像處理,必須盡 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇〆297公釐) -20- 1226077 A7 _ B7 五、發明説明(18) (請先閱讀背面之注意事項再填寫本頁) 量在短時間內且均句地在L C D基板G上塗敷顯像反應時 所必要的量的顯像液。利用兩支顯像噴嘴5 1 a與^ 1 b 可以在短時間內穩定地排出特定量的顯像液。顯像噴嘴 5 1 a與5 1 b的掃瞄速度宜大於1 〇 〇 ^ m /秒而小於 5 0 0 m m / 秒。 顯像噴嘴5 1 a與5 1 b的掃瞄速度小於1 〇 〇 m m /秒時,因爲不必掃瞄顯像噴嘴5 1 a與5 1 b即可變更 L C D基板G的搬運速度以進行相同的處理,因此,無法 看出掃瞄顯像噴嘴5 1 a與5 1 b的好處。另一方面,如 大於5 0 0 m m /秒時,塗敷速度過快,因此發生未塗到 顯像液的部分,或發生顯像液容易由L C D基板G溢出等 缺點。如顯像噴嘴5 1 a與5 1 b的掃瞄速度在此範圍內 時,不管L C D基板G的長度塗敷開始與塗敷完畢的時間 差不成問題,而可進行顯像液的塗敷。 經濟部智慧財產局g(工消費合作社印製 此外,對L C D基板G的塗敷次數不限於一次,也可 以進多次的塗敷處理。例如,在對L C D基板G上面進行 一次塗敷後,也可以將顯像噴嘴5 1 a與5 1 b上升,再 回到原來的位置進行塗敷的動作。 圖9 A爲將圖5所示的顯像噴嘴5 1 a與5 1 b的配 置形態更詳細圖示的側面圖,而圖9 B爲表示一邊由顯像 噴嘴5 1 a與5 1 b排出顯像液,一邊使顯像噴嘴5 1 a 與5 1 b掃瞄的狀態的說明圖。 在顯像液供應機構6 0中,要在L C D基板G表面塗 敷顯像液時,要使弓形臂5 8掃瞄於與L C D基板G的搬 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -21 - 1226077 A7 B7 五、發明説明(19) (請先閲讀背面之注意事項再填寫本頁) 運方向相反的方向。主顯像液噴嘴5 1 a被配設於基板搬 運方向的上游側,而副顯像液噴嘴5 1 b則被配設於基板 搬運方向的下游側,俾主顯像液噴嘴5 1 a先對L C D基 板G塗敷顯像液。藉由對主顯像液噴嘴5 1 a排出而塗敷 於L C D基板G上的顯像液補充由副顯像液噴嘴5 1 b排 出的顯像液,爲進行顯像反應,可以對L C D基板G供應 充分的顯像液,藉以縮短顯像時間,並且提升顯像精密度 〇 要掃瞄顯像噴嘴5 1 a與5 1 b時,副顯像液噴嘴 5 1 b與L C D基板G的間隙寬度(gap ) D宜設定成比主 顯像液噴嘴5 1 a與L C D基板G的間隙寬度d爲寬,俾 使副顯像液噴嘴5 1 b下端不致將主顯像液噴嘴5 1 a已 經排出於L C D基板G上面的顯像液推出顯像噴嘴5 1 a 與5 1 b的掃瞄方向(參照圖9 B )。 經濟部智慧財產局員工消費合作社印製 例如,假設間隙寬d爲1 · 5 m m至2 · 5 m m,間 隔寬D爲3 m m至5 m m。間隙寬小於1 . 5 m m時,主 顯像液噴嘴5 1 a的定位稍爲困難。另外,如間隙寬d大 於2 . 5 m m時,則排出顯像液時,顯像液中會捲入氣泡 以致氣泡附著於L C D基板G表面,在該部分有顯像不良 的顧慮。如間隙寬D大於5 m m時,則已經塗敷於L C D 基板G的顯像液被過度攪拌,因而發生線寬均勻性降低的 問題。另外,由於將離開主顯像液噴嘴5 1 a塗敷於 L C D基板G上的顯像液的距離設成小於1 m m,因此可 以防止氣泡的捲入等。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -22- 1226077 A7 _ _B7___ 五、發明説明(2〇) 顯像噴嘴5 1 a與5 1 b是對垂直方向保持5度以上 1 5度以內的角度Θ的傾斜狀態。 (請先閱讀背面之注意事項再填寫本頁) 例如,在由主顯像液噴嘴5 1 a向L C D基板G排出 的顯像液容易向主顯像液噴嘴5 1 a的掃瞄方向前方擴張 時,由主顯像液噴嘴5 1 a排出至L C D基板G的顯像液 對L C D基板G的衝擊(impact,即顯像液衝擊L C D基板 G的勢力)是由早先塗敷於.L C D基板G上面的顯像液上 面施加,因此,如與顯像液直接排出L C D基板G時比較 ,則較弱。因此,會發生顯像精密度降低的問題。 由於將主顯像液噴嘴5 1 a僅傾斜一定角度Θ,因此 ,由主顯像液噴嘴5 1 a所排出的顯像液便不容易向顯像 噴嘴5 1 a與5 1 b的掃瞄方向的前方擴張。因此,因爲 由顯像液噴嘴5 1 a所排出的顯像液的衝擊直接施加於 L C D基板G,所以可以提升顯像精密度。 經濟部智慧財產局員工消費合作社印製 因爲由副顯像液噴嘴5 1 b會由主顯像液噴嘴5 1 a 所排出的顯像液上面重新排出顯像液,因此原來由副顯像 噴嘴5 1 b所排出的顯像液與主顯像噴嘴5 1 a的情形比 較,對L C D基板G並未給予大的衝擊。爲不使早先塗敷 於L C D基板G的顯像液受到由副顯像液噴嘴5 1 b排出 的顯像液強力攪拌,副顯像液噴嘴5 1 b也宜僅傾斜於特 定角度0。 如上所述,第1影像供應區2 4 b因爲使顯像噴嘴 5 1 a與5 1 b —邊掃瞄,一邊將顯像液排出L C D基板 G,所以不必以高速搬運L C D基板G。因此,可以防止 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇><297公釐) -23- 1226077 A7 £7_______ 五、發明説明(21 ) (請先閲讀背面之注意事項再填寫本頁) 因爲L C D基板G的搬運時的傳送過速(overrun )與搬運 的緊急停止而發生L C D基板G的彎曲或破損事故的發生 。另外,在供應顯像液後,不必緊急停止L C D基板G, 因此可以防止塗敷於L C D基板G的顯像液的溢落,而可 以有效利用顯像液。 在第1顯像液供應區2 4 b中,雖然可以一邊以低速 搬運L C D基板G,或停止L C D基板G以進行顯像液的 塗敷,但如使用停止L C D基板G以塗敷顯像液的方法時 ,特別可以在穩定的狀態下進行,因此可以提高線寬的均 勻性。 在將於第1顯像液供應區2 4 b塗敷過顯像液的 L C D基板G搬運至顯像液去除區2 4 d當中,顯像液有 由L C D基板G上面溢落的情形。在第2顯像液供應區 2 4 c中,爲了防止此種L C D基板的搬運途中,顯像液 由L C D基板G溢落以致顯像反應無法進行,可以重新對 L C D基板G補充顯像液。 經濟部智慧財產局員工消費合作社印製 在第2顯像液供應區2 4 c中,具有與主顯像液噴嘴 5 1 a相同構造的顯像液補充噴嘴5 1 c被固定於具有與 弓形臂5 8相同構造的不動臂(未圖示)俾其長度方向成 爲Y方向。特定量的顯像液由顯像液補充噴嘴5 1 c以略 呈長帶狀排出到以滾輪搬運機構1 4搬運的L C D基板G 上面,藉此,補充搬運時由L C D基板G溢落的顯像液。 在顯像液去除區2 4 d設有將L C D基板G轉換成例 如斜向姿勢的未圖示的姿勢轉換機構以及排出用於沖洗 ϋ張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) "" -24- 1226077 A7 B7 五、發明説明(22) (請先閱讀背面之注意事項再填寫本頁) L C D基板G表面的顯像液的淸洗液(例如純水)的淸洗 液噴嘴5 2。在L C D基板G上的顯像反應是在由第1顯 像液供應區2 4 b搬運到顯像液去除區2 4 d中間進行。 在顯像液去除區2 4 d中,藉將L C D基板G轉換成斜向 姿勢以流掉L C D基板G上面的顯像液,再以保持L C D 基板G於斜向姿勢,由L C D基板G上端向下端沿者 L C D基板G表示一邊掃瞄淸洗液噴嘴5 2,一邊在 L C D基板G表面排出純水,即可沖走L C D基板G上的 顯像液。 淸洗液噴嘴5 2爲了能夠在短時間內沖洗顯像液,在 構造上使其能以例如5 0 0 m m /秒的·速度掃瞄。實際上 ,將淸洗液噴嘴5 2的掃瞄速度調節爲1 〇 〇 m m /秒至 3 0 0 m m/秒之間,更好爲2 0 0 m m/秒至3 0 0 m m /秒之間,即可提升顯像圖案的線寬均勻性。淸洗液 噴嘴5 2與顯像噴嘴5 1 a與5 1 b —樣可以使用能將淸 洗液排出成膜狀的構造的噴嘴,藉此可以防止顯像不均勻 的發生。 經濟部智慧財產局員工消費合作社印製 在淸洗區2 4 e安裝有將純水等的淸洗液排出到 L C D基板G的淸洗噴嘴5 3。在淸洗區2 4 e是邊以特 定速度搬運LCD基板G,邊對LCD基板G的表面與裡 面排出淸洗液以進附著於L C D基板G的顯像液的去除與 淸洗。另外,淸洗噴嘴5 3具有比L C D基板G的寬度更 長的形狀,以便向L C D基板G的寬度方向整體排出淸洗 液。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -25- 1226077 A7 B7 五、發明説明(23 ) 在通過淸洗區2 4 e的L C D基板G被搬運的乾燥區 2 4 f中,設有以一定風壓噴射氮氣等乾燥氣體的噴氣嘴 (air nozzle,即氣刀(air knife )) 5 4。在乾燥區 2 4 f,是以一定速度將L CD基板G邊搬運邊對L CD 基板G的表面與裡面噴射乾燥氣體,俾將附著於L C D基 板G的淸洗液體吹走以乾燥L C D基板G。噴氣嘴5 4具 有比L C D基板G的寬度更長的形狀,可以對L C D基板 G的寬度方向整體排出乾燥氣體。經過乾燥處理的L C D 基板G是利用滾輪搬運機構1 4搬運到i線U V照射單元 (i — U V ) 2 5。 其次,要說明顯像處理單元(D E V ) 2 4的顯像處 理工程。圖1 0爲表示顯像處理工程的槪況的流程圖( flow chart )。搬進傳遞單元(PASS) 73的LCD基 板G是由滾輪搬運機構1 4搬運通過導入區2 4 a而進入 第1顯像液供應區2 4 b (步驟1 ) 。L C D基板G由該 傳遞單元(P A S S ) 7 3搬運到第1顯像液供應區 2 4 b之速度假設爲例如6 5 m m/秒。 在第1顯像液供應區2 4 b中,將L C D基板G呈停 止於特定位置的狀態(步驟2 ),並將顯像噴嘴5 1 a與 5 1 b以例如2 4 0 m m /秒的局速一邊掃猫一邊將顯像 液排出L C D基板G表面以進行顯像液的塗敷(步驟3 ) 。藉使L C D基板呈停止狀態,即容易控制顯像噴嘴 5 1 a與5 1 b的驅動。另外,可以穩定地將顯像液塗敷 於L C D基板上面。 ^紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 、11 經濟部智慧財產局員工消費合作社印製 -26- 1226077 A7 B7 五、發明説明(24) (請先閱讀背面之注意事項再填寫本頁) 圖1 1爲表示顯像噴嘴5 1 a與5 1 b的掃瞄形態的 說明圖。顯像噴嘴5 1 a與5 1 b是假定由圖1 1右側掃 瞄至左側,圖1 1所示的L c D基板G的右端定爲「塗敷 開始端」,而左端爲「塗敷結束端」。利用升降裝置5 7 調整顯像噴嘴5 1 a與5 1 b的高度位置後,操作驅動機 構4 6以開始顯像噴嘴5 1 a與5 1 b的掃瞄。當主顯像 液噴嘴5 1 a由塗敷開始端到達右側的特定位置,例如塗 敷開始端的右側1公分的位置(以下簡稱「排出開始位置 」)時,即由主顯像液噴嘴5 1 a開始排出顯像液(步驟 3a)。藉此,可以確實由塗敷開始端塗敷顯像液。同樣 地,在副顯像液噴嘴5 1 b到達排出開始位置時,即開始 由副顯像液噴嘴5 1 b排出顯像液(步驟3 b )。 經濟部智慧財產局員工消費合作社印製 然後,使顯像噴嘴5 1 a與5 1 b掃瞄L C D基板G 上面俾在L C D基板G整體塗敷顯像液(步驟3 c )。此 時,如早先參照圖9 A及圖9 B所說明,在顯像噴嘴 5 1 a與5 1 b掃瞄L CD基板G上面時,顯像液被朝向 顯像噴嘴5 1 a與5 1 b的斜下後方排出。另外,副顯像 液噴嘴5 1在L C D基板G塗敷顯像液而不至於將主顯像 液噴嘴5 1 a塗敷於L C D基板G上的顯像液扒出顯像噴 嘴5 la與5 lb的掃瞄方向。 雖然也可以繼續對L C D基板G排出顯像液直到副顯 像液噴嘴5 1 b通過塗敷結束端爲止,但是最好在主顯像 液噴嘴5 1 a到達塗敷結束端後中止由主顯像液噴嘴 5 1 a的顯像液的排出(步驟3 d ),在副顯像液排出噴 ^紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐1 一 -27- 1226077 A7 __ _B7___ 五、發明説明(25) (請先閱讀背面之注意事項再填寫本頁) 嘴5 1 a到達塗敷結束端後中止由副顯像液噴嘴5 1 b的 顯像液的排出(步驟3 e ),並移動顯像液噴嘴5 1 a與 5 1 b俾使副顯像液噴嘴5 1 b下端接近或頂接L C D基 板G的塗敷結束端(步驟3 f )。由於將顯像液噴嘴 5 1 b移動至該位置,而可以防止塗敷於L CD基板G上 面的顯像液由塗敷結束端溢落。如將副顯像液噴嘴5 1 b 頂接於L C D基板G時,應進行極細緻控制以免因爲該頂 接而損傷L C D基板G。 在結束圖1 1所示的一次塗敷作業後,將顯像噴嘴 5 1 a與5 1 b退回至塗敷開始端以再度對L CD基板G 塗敷顯像液也屬理想(步驟3 g )。藉由對L C D基板G 進行多次塗敷即可一邊維持高顯像精密度,一邊縮短顯像 時間。 經濟部智葸財產局員工消費合作社印製 圖12A,圖12B與圖12C分別表示對LCD基 板G的塗敷條件與所製得的顯像圖樣特性的關係的說明圖 ,圖1 2 A爲表示顯像噴嘴5 1 a與5 1 b的掃瞄速度與 線寬均勻性的關係,圖1 2 B爲表示塗敷次數與線寬的關 係,圖1 2 C表示塗敷次數與線寬均勻性的關係。(Please read the precautions on the back before filling in this page. J Nozzle moving mechanism 6 0 a: Drive mechanism for holding the arched arm 5 8 and guide rail 5 9 a and scanning the arched arm 5 8 along the rail 5 9 a 46, a rail holding member 5 9 b for holding the rail 5 9 a, and a rail fixing stand 5 9 c for fixing the rail holding member 5 9 b. In addition, the developing liquid supply mechanism 60 includes a lifting device 5 7 With the control mechanism 47 controlling the driving mechanism 46, the control mechanism 47 can control the discharge amount of the developing liquid from the developing nozzles 5 1 a and 5 1 b, and the start and stop of the discharge. Employees of the Bureau of Intellectual Property, Ministry of Economic Affairs Printed by a consumer cooperative. In addition, the structure of the roller conveyance mechanism 1_4 is shown in FIG. 7. That is, the roller conveyance mechanism 14 is provided with the conveyance direction (X direction) of the LCD substrate G, and it is extended by the 2nd motor 15b ( 7 is not shown, refer to FIG. 5) A pivot 19 rotating around the X axis, a first gear 19 a fixed to the pivot 19 and rotating around the X axis, in a wide direction of the LCD substrate G ( Y direction) The rollers 17 are provided with longer pivots 18 at a certain interval, and are mounted on one of the pivots 18 The second gear 1 8 a that meshes with the first gear 1 9 a and converts the rotation around the X axis of the first gear 1 9 a into the rotation around the Y axis is mounted on the other end of the pivot 18 and borrows The third gear 1 8 b rotated by the rotation of the second gear 1 8 a through the pivot 18, the pivot 19 9 ′ that rotates freely around the X-axis, and the pivot 1 9 ′ and the gear 1 8 b The third gear 1 8 b meshes with the rotation around the Y axis to convert the rotation around the X axis to the fourth gear 1 9 b. In the roller transport mechanism 14, a driving unit for rotating the pivot 18 It is composed of the pivot 19, the first gear 1 9 a, and the second gear 1 8 a. The Chinese national standard (CNS) A4 specification (210X 297 mm) is applied to this paper size. 1 ~ -19- 1226077 A7 __ _B7__ 5 2. Description of the invention (17) (Please read the precautions on the back before filling out this page) and the second motor 15b, the third gear 18b, the pivot 19 ', and the fourth gear 1 9b make the pivot 18 It rotates smoothly and plays the role of supporting the pivot 18. Figure 8 is a perspective view showing the structure of the main developing liquid nozzle 5 1 a. The main developing liquid nozzle 5 1 a has a width direction (Y direction of the LCD substrate G) A long structure. At the center of the upper part of the main developing liquid nozzle 5 1 a, a developing liquid supply pipe 4 9 a for supplying the developing liquid to the main developing liquid nozzle 5 1 a is provided, so that it can be along the length direction at the lower end. The formed discharge port 4 9 b discharges the developing solution into a band shape. The sub developing solution nozzle 5 1 b has the same structure as the main developing solution nozzle 5 1 a. The developing nozzles 5 1 a and 5 1 b are aligned in the longitudinal direction with the Y direction, and are held in parallel by a fixed interval between the nozzle fixing members 55. In addition, the 8th Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed that the development nozzles 5 1 a and 5 1 b can be raised and lowered by driving the lifting device 5 7 to raise and lower the nozzle holding member 5 6, whereby the development nozzle 5 1 can be adjusted. The clearance between the discharge ports 4 9 b of a and 5 1 b and the surface of the L CD substrate G. In addition, fitting parts 5 8 a fitted to the guide rails 5 9 a are formed at both ends of the arched arms 5 8, and the arched arms 5 8 can be slid freely in the X direction by the driving mechanism 4 6 in the longitudinal direction of the rails 5 9 a. . In the developing liquid supply mechanism 60, the developing nozzle 5 1 a, 5 1 b is discharged from the developing substrate 5 toward the CD substrate G toward the Y direction, and the developing nozzle 5 is discharged. 1 a and 5 1 b scan in the X direction (that is, the arcuate arm 5 8 slides in the X direction), that is, the surface of the substrate L c D can be coated with a developing solution. In order to perform uniform development processing on the entire LCD substrate G, it is necessary to apply the Chinese national standard (CNS) A4 specification (21〇〆297 mm) to the paper size -20- 1226077 A7 _ B7. 5. Description of the invention (18) ( Please read the precautions on the back before filling in this page.) Apply the amount of developer necessary for the development reaction on the LCD substrate G in a short amount of time. By using two developing nozzles 5 1 a and ^ 1 b, a specific amount of developing liquid can be stably discharged in a short time. The scanning speeds of the imaging nozzles 5 1 a and 5 1 b should be more than 100 m / s and less than 500 m / s. When the scanning speeds of the developing nozzles 5 1 a and 5 1 b are less than 1000 mm / sec, it is not necessary to scan the developing nozzles 5 1 a and 5 1 b to change the conveying speed of the LCD substrate G to perform the same Therefore, the benefits of scanning the imaging nozzles 5 1 a and 5 1 b cannot be seen. On the other hand, if it is more than 500 m / s, the application speed is too fast, so that the parts that are not coated with the developing solution, or the developing solution is liable to overflow from the LCD substrate G, and other disadvantages. If the scanning speeds of the developing nozzles 5 1 a and 5 1 b are within this range, the application time of the developing liquid can be applied regardless of the difference between the length of the L C D substrate G and the time between the start of coating and the completion of coating. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs (printed by the Industrial and Consumer Cooperative) In addition, the number of coatings on the LCD substrate G is not limited to one, and multiple coating processes may be performed. It is also possible to raise the developing nozzles 5 1 a and 5 1 b and then return to the original position to perform the coating operation. Fig. 9A shows the arrangement of the developing nozzles 5 1 a and 5 1 b shown in Fig. 5. FIG. 9B is a side view showing the image in more detail, and FIG. 9B is an explanatory diagram showing a state in which the developing nozzles 5 1 a and 5 1 b are scanned while the developing liquid is discharged from the developing nozzles 5 1 a and 5 1 b. In the developing solution supply mechanism 60, when applying the developing solution on the surface of the LCD substrate G, the arcuate arm 5 8 should be scanned with the LCD substrate G, and the paper size shall conform to the Chinese National Standard (CNS) A4. Specifications (210X297mm) -21-1226077 A7 B7 V. Description of the invention (19) (Please read the precautions on the back before filling this page) The direction of transport is opposite. The main developing liquid nozzle 5 1 a is arranged at The upstream side of the substrate conveyance direction, and the sub developing liquid nozzle 5 1 b is arranged on the downstream side of the substrate conveyance direction. First, the main developing liquid nozzle 5 1 a is coated with a developing liquid on the LCD substrate G first. The developing liquid coated on the LCD substrate G is discharged by the main developing liquid nozzle 5 1 a and supplemented by a sub-development image. The developing liquid discharged from the liquid nozzle 5 1 b can supply a sufficient developing liquid to the LCD substrate G for developing reaction, thereby shortening the developing time and improving the developing precision. To scan the developing nozzle 5 1 When a and 5 1 b, the gap width (gap) D of the sub developing liquid nozzle 5 1 b and the LCD substrate G should be set to be wider than the gap width d of the main developing liquid nozzle 5 1 a and the LCD substrate G, 俾Prevent the lower end of the sub developing liquid nozzle 5 1 b from pushing the developing liquid of the main developing liquid nozzle 5 1 a on the LCD substrate G out of the scanning directions of the developing nozzles 5 1 a and 5 1 b (see FIG. 9). B) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. For example, suppose the gap width d is 1.5 mm to 2.5 mm, and the gap width D is 3 mm to 5 mm. When the gap width is less than 1.5 mm, the main The positioning of the developing solution nozzle 5 1 a is slightly difficult. In addition, if the gap width d is greater than 2.5 mm, the developing solution may be caught in the developing solution when it is discharged. The bubbles cause bubbles to adhere to the surface of the LCD substrate G, and there is a concern of poor development in this part. If the gap width D is greater than 5 mm, the developing solution that has been applied to the LCD substrate G is excessively stirred, resulting in uniform line width. In addition, since the distance from the developing solution applied to the LCD substrate G from the main developing solution nozzle 5 1 a is set to less than 1 mm, it is possible to prevent the inclusion of bubbles and the like. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -22- 1226077 A7 _ _B7___ V. Description of the invention (20) The imaging nozzles 5 1 a and 5 1 b are kept above 5 degrees in the vertical direction An inclination of an angle Θ within 15 degrees. (Please read the precautions on the back before filling in this page.) For example, the developer discharged from the main developer nozzle 5 1 a to the LCD substrate G easily expands forward in the scanning direction of the main developer nozzle 5 1 a. At this time, the impact of the developing liquid discharged from the main developing liquid nozzle 5 1 a to the LCD substrate G on the LCD substrate G (impact, that is, the force of the developing liquid impacting the LCD substrate G) was previously applied to the LCD substrate G. The upper developing liquid is applied on the upper side, and therefore, it is weaker than when the developing liquid is directly discharged from the LCD substrate G. Therefore, a problem occurs in that the development precision is reduced. Since the main developing liquid nozzle 5 1 a is inclined only by a certain angle Θ, it is difficult to scan the developing liquid discharged from the main developing liquid nozzle 5 1 a to the developing nozzles 5 1 a and 5 1 b. Direction forward expansion. Therefore, since the impact of the developing liquid discharged from the developing liquid nozzle 5 1 a is directly applied to the L C D substrate G, the developing precision can be improved. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs because the developing solution is discharged from the developing solution nozzle 5 1 a by the auxiliary developing solution nozzle 5 1 b. Compared with the case of the main developing nozzle 5 1 a, the developing liquid discharged from 5 1 b does not give a large impact to the LCD substrate G. In order to prevent the developing solution previously applied to the LCD substrate G from being strongly stirred by the developing solution discharged from the auxiliary developing solution nozzle 5 1 b, the auxiliary developing solution nozzle 5 1 b should also be inclined only at a specific angle 0. As described above, in the first image supply area 2 4 b, the developing nozzles 5 1 a and 5 1 b are scanned while the developing liquid is discharged from the L C D substrate G, so it is not necessary to carry the L C D substrate G at high speed. Therefore, this paper standard can be prevented from applying the Chinese National Standard (CNS) A4 specification (21〇 > < 297 mm) -23- 1226077 A7 £ 7 _______ V. Description of the invention (21) (Please read the precautions on the back before (Fill in this page) The LCD board G is bent or damaged due to the overrun during the conveyance of the LCD substrate G and the emergency stop of the conveyance. In addition, it is not necessary to stop the LCD substrate G immediately after the developer is supplied, so that the developer liquid applied to the LCD substrate G can be prevented from overflowing, and the developer can be effectively used. In the first developing liquid supply area 2 4 b, although the LCD substrate G can be conveyed at a low speed or the LCD substrate G can be stopped to apply the developing liquid, if the LCD substrate G is stopped to apply the developing liquid, The method can be carried out in a stable state, so the uniformity of the line width can be improved. When the L C D substrate G coated with the developer in the first developer supply area 2 4 b is transferred to the developer removal area 24 4 d, the developer may overflow from the upper surface of the L C D substrate G. In the second developing liquid supply area 2 4 c, in order to prevent the developing liquid from overflowing from the LCD substrate G during the transportation of the LCD substrate and the development reaction cannot proceed, the LCD substrate G may be replenished with the imaging liquid. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in the second developer supply area 2 4 c, the developer supplement nozzle 5 1 c having the same structure as the main developer nozzle 5 1 a is fixed to the bow A fixed arm (not shown) having the same structure as the arm 588 has a length direction of the Y direction. A specific amount of the developing solution is discharged from the developing solution replenishing nozzle 5 1 c in a slightly long strip shape onto the LCD substrate G conveyed by the roller conveying mechanism 14, thereby replenishing the developing liquid overflowing from the LCD substrate G during conveyance. Like liquid. The developing solution removing area 2 4 d is provided with a posture conversion mechanism (not shown) that converts the LCD substrate G into, for example, an oblique posture, and discharges the diametral scale. The Chinese National Standard (CNS) A4 specification (210X297 mm) is applied. ) " " -24- 1226077 A7 B7 V. Description of the invention (22) (Please read the precautions on the back before filling in this page) 淸 Cleaning solution (eg pure water) of the developing solution on the surface of LCD substrate G Washing liquid nozzle 5 2. The developing reaction on the L C D substrate G is carried out from the first developing solution supply area 2 4 b to the developing solution removal area 2 4 d. In the developing solution removing area 24 d, the LCD substrate G is converted into an oblique posture to drain the developing liquid on the LCD substrate G, and then the LCD substrate G is kept in the oblique posture, and the upper end of the LCD substrate G is oriented The lower edge of the LCD substrate G indicates that while scanning the cleaning liquid nozzle 5 2 and discharging pure water on the surface of the LCD substrate G, the developing liquid on the LCD substrate G can be washed away. The washing liquid nozzle 52 is structured so that it can scan at a speed of, for example, 500 m / s, in order to wash the developing liquid in a short time. In fact, the scanning speed of the cleaning liquid nozzle 52 is adjusted to 100 mm / sec to 300 mm / sec, and more preferably 200 mm / sec to 300 mm / sec. , You can improve the line width uniformity of the development pattern. Rinse solution nozzles 5 2 and development nozzles 5 1 a and 5 1 b-It is also possible to use nozzles capable of discharging the Rinse solution into a film structure, thereby preventing development unevenness. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A washing nozzle 5 3 for discharging washing liquid such as pure water to the LCD substrate G is installed in the washing area 2 4 e. In the cleaning area 2 4e, the LCD substrate G is conveyed at a specific speed, and the cleaning liquid is discharged to the surface and the inside of the LCD substrate G to remove and clean the developing solution attached to the LCD substrate G. The cleaning nozzle 53 has a shape longer than the width of the LCD substrate G so as to discharge the cleaning liquid in the entire width direction of the LCD substrate G. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -25- 1226077 A7 B7 V. Description of the invention (23) In the drying area 2 4 f where the LCD substrate G passing through the washing area 2 4 e is transported An air nozzle (i.e., an air knife) 5 4 for spraying dry gas such as nitrogen at a certain wind pressure is provided. In the drying zone 2 4 f, the L CD substrate G is sprayed with a dry gas on the surface and the inside of the L CD substrate G while being transported at a certain speed, and the cleaning liquid adhering to the LCD substrate G is blown away to dry the LCD substrate G. . The nozzle 54 has a shape longer than the width of the L C D substrate G, and can discharge the dry gas to the entire width direction of the L C D substrate G. The dried CD substrate G is transferred to the i-line U V irradiation unit (i — U V) 2 5 by a roller transfer mechanism 1 4. Next, the development processing process of the development processing unit (DEV) 24 will be explained. FIG. 10 is a flow chart showing the status of the development processing process. The LCD substrate G carried in the transfer unit (PASS) 73 is carried by the roller conveyance mechanism 14 through the introduction area 2 4 a and enters the first developer supply area 2 4 b (step 1). The speed at which the L C D substrate G is conveyed by the transfer unit (PASS) 7 3 to the first developer supply area 2 4b is, for example, 6 5 m / s. In the first developing solution supply area 2 4 b, the LCD substrate G is stopped at a specific position (step 2), and the developing nozzles 5 1 a and 5 1 b are set at, for example, 2 40 mm / sec. At a local speed, the developer is discharged from the surface of the LCD substrate G while scanning the cat to apply the developer (step 3). If the L C D substrate is in a stopped state, it is easy to control the driving of the developing nozzles 5 1 a and 5 1 b. In addition, the developing solution can be stably applied on the upper surface of the LCD substrate. ^ The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page), 11 Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs -26- 1226077 A7 B7 V. Description of the Invention (24) (Please read the precautions on the back before filling out this page) Figure 1 1 is an explanatory diagram showing the scanning form of the developing nozzles 5 1 a and 5 1 b. The imaging nozzles 5 1 a and 5 1 b are assumed to be scanned from the right side to the left side in FIG. 11. The right end of the L c D substrate G shown in FIG. 11 is set as the “coating start end” and the left end is “coated End. " After the height positions of the developing nozzles 5 1 a and 5 1 b are adjusted by the lifting device 5 7, the driving mechanism 4 6 is operated to start scanning of the developing nozzles 5 1 a and 5 1 b. When the main developing liquid nozzle 5 1 a reaches a specific position on the right side from the coating start end, for example, a position 1 cm to the right of the coating starting end (hereinafter referred to as the "discharge start position"), the main developing liquid nozzle 5 1 a a Start to drain the developer (step 3a). Thereby, the developer can be reliably applied from the application start end. Similarly, when the sub developing solution nozzle 5 1 b reaches the discharge start position, the developing solution is started to be discharged from the sub developing solution nozzle 5 1 b (step 3 b). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, the developing nozzles 5 1 a and 5 1 b are scanned on the upper surface of the LCD substrate G, and the entire surface of the LCD substrate G is coated with a developing solution (step 3 c). At this time, as described earlier with reference to FIGS. 9A and 9B, when the developing nozzles 5 1 a and 5 1 b scan the upper surface of the L CD substrate G, the developing solution is directed toward the developing nozzles 5 1 a and 5 1. The obliquely lower back is discharged. In addition, the sub developing liquid nozzle 51 applies the developing liquid to the LCD substrate G without the main developing liquid nozzle 5 1 a coated on the LCD substrate G. The developing nozzles 5 la and 5 are pulled out. Scanning direction of lb. Although the developer liquid may be continuously discharged to the LCD substrate G until the sub developer liquid nozzle 5 1 b passes through the coating end, it is best to stop the main developer after the main developer liquid nozzle 5 1 a reaches the coating end. Discharge the imaging liquid from the image liquid nozzle 5 1 a (step 3 d), and spray it at the secondary imaging liquid discharge. V. Description of the invention (25) (Please read the precautions on the back before filling in this page) Mouth 5 1 a Stops the discharge of the developer liquid from the sub developer liquid nozzle 5 1 b after reaching the coating end (step 3 e ), And move the developing liquid nozzles 5 1 a and 5 1 b to bring the lower end of the sub developing liquid nozzle 5 1 b close to or in contact with the coating end of the LCD substrate G (step 3 f). 5 1 b moves to this position to prevent the developer liquid applied on the L CD substrate G from overflowing from the end of application. For example, when the auxiliary developer nozzle 5 1 b is attached to the LCD substrate G, Extremely fine control is performed so as not to damage the LCD substrate G due to this attachment. After finishing one coating operation shown in FIG. The image nozzles 5 1 a and 5 1 b are returned to the application start end to apply the developing liquid to the L CD substrate G again (step 3 g). By applying the LCD substrate G multiple times, one side can be used. Maintaining high development precision while shortening the development time. Figure 12A, Figure 12B and Figure 12C are printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, respectively, showing the coating conditions for the LCD substrate G and the developed pattern. An explanatory diagram of the relationship between characteristics, FIG. 1 A is a relationship between the scanning speed of the developing nozzles 5 1 a and 5 1 b and the uniformity of the line width, and FIG. 1 2 B is a relationship between the number of coatings and the line width. Figure 1 2C shows the relationship between the number of coatings and the uniformity of the line width.

圖1 2 A至C所表示的結果是利用形成有線寬8 # m 或1 0 //m的特定圖案的光罩(mask ),在特定條件下曝 光處理L C D基板G,然後,以各種條件將L C D基板G 顯影,再以掃瞄式電子顯微鏡(S E Μ )觀察以該方法製 得的抗鈾膜的圖案並測定線寬(顯像圖案中凸部的寬度) 而求得。在該SEM觀察中,爲進行對整體LCD基板G 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) " -28 - 1226077 經濟部智慧財產局員工消費合作社印製 A7 ____B7五、發明説明(26) 的觀察,在L C D基板G的中心附近在等角度相交的8個 方向設置多個放射狀的觀察點。 圖1 2 A所示.的結果是利用形成有線寬1 〇 # m的圖 案的光罩,將來自顯像噴嘴5 1 a與5 1 b的顯像液的排 出流量與顯像噴嘴5 1 a與5 1 b的掃瞄速度無關地設成 固定,另將顯像時間(開始塗敷顯像液到由L C D基板G 去除顯像液爲止的時間)設成固定而製得。此外,圖 1 2A中的一支直方圖(histogram )是與一片LCD基板 G相對應。 由圖1 2 A所示知悉,顯像噴嘴5 1 a與5 1 b的塗 敷次數爲一次時,顯像噴嘴5 1 a與5 1 b的掃瞄速度較 快的一方,塗敷均勻性會提升。此應爲顯像塗敷開始端部 的顯像液的滯留量降低,在該開始端部所發生的顯像的一 部分過剩反應被抑制,以及因爲L C D基板G整體塗敷時 間短,以致在L C D基板G整體均勻地進行了顯像反應所 致。 所謂「在顯像塗敷開始端部的一部分過剩反應」所指 如下。亦即,顯像液是隨著顯像噴嘴5 1 a與5 1 b的掃 瞄供應於掃猫方向,但是此時一部分顯像液會流到掃目苗方 向的相反方向。該項流回的顯像液無法超過顯像液塗敷開 始端部而停留在該處。因此,在顯像塗敷開始端部,顯像 液成爲供應過剩的狀態而顯像反應超起其他部位而進行過 剩反應。該現象的一部分過剩反應的結果增加面內的線寬 的參差不均。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 『裝- -訂 .L---Γ · -29 - 1226077 A7 _ΒΊ ___ 五、發明説明(27) (請先閱讀背面之注意事項再填寫本頁) 因爲藉由增加顯像噴嘴5 1 a與5 1 b的掃瞄速度, 可以降低流回顯像液的量,因此可以抑制顯像液塗敷開始 端的一部分的過剩反應。 此外,因爲將來自顯像噴嘴5 1 a與5 1 b的顯像液 的排出流量與顯像時間設成固定,因此掃瞄速度爲1 0 0 m m /秒時,平均線寬接近光罩的圖樣爲9 · 9 4 // m, 但在L C D基板G整體的線寬的不均變大。另一方面,當 掃瞄速度爲2 1 0 m m /秒時,平均線寬變得較光罩的圖 案稍小的9 · 7 8 // m,但L C D基板G整體的寬度不均 變小。結果,顯像噴嘴5 1 a與5 1 b的掃瞄速度快的時 候,對於顯像液的抗蝕劑的衝撃增大,而顯像反應被促進 ,因此,掃瞄速度爲2 1 0 m m /秒時,顯像反應超過應 爲原因之一。因此,要使顯像噴嘴5 1 a與5 1 b高速掃 瞄時,藉將顯像時間縮短,即可將平均線寬接近光罩的圖 案,而且應可提升線寬均勻性。 經濟部智慧財產局員工消費合作社印製 圖1 2 B所示的結果是表示使用形成有線寬8 // m的 圖案的光罩,並將顯像噴嘴5 1 a與5 1 b的掃瞄速度定 爲8 0 m m /秒,顯像液排出量爲5 . 6公升/分鐘時以 及顯像噴嘴5 1 a與5 1 b的掃瞄速度定爲1 6 0mm/ 秒,顯像液排出量爲9 . 4公升/分鐘時,設定固定的顯 像時間而將塗敷次數變化時的平均線寬。如圖1 2 B所示 ,塗敷次數增加時,平均線寬變小。此表示塗敷次數一增 加,顯像反應加速進行,所以藉由藉加塗敷次數應可以縮 短顯像時間。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -30- 1226077 A7 _____ B7 五、發明説明(28) 圖1 2 c所示的結果表示使用形成有8 // m的圖案的 光罩,並將顯像噴嘴5 1 a與5 1 b的掃瞄速度定爲8 0 m m /秒,顯像液排出量爲5 · 6公升/分鐘時以及將顯 像噴嘴5 1 a與5 1 b的掃瞒速度定爲1 6 0 m m /秒, 顯像液排出量爲9 · 4公升/分鐘時,設定固定的顯像時 間並使塗敷次數變化時的線寬均勻性。此外,圖1 2 C中 的一支直方圖(histogram)與一片L C D基板G相對應。 如圖1 2 C所示,塗敷次數相同時,則顯像噴嘴 5 1 a與5 1 b的掃瞄速度越快,線寬均勻性有提升的傾 向。另外,顯像噴嘴5 1 a與5 1 b的掃瞄速度快時( 1 6 0 m m /秒)時,如塗敷次數增加,則線寬均勻性提 高。由此結果可知,顯像噴嘴5 1 a與5 1 b的掃瞄速度 快以及增加塗敷次數,對線寬均勻性的提升有效。 將在第1顯像液供應區2 4 b的塗敷處理結束後的 L C D基板G用滾輪搬運機構1 4,以4 6 m m /秒的搬 運速度搬運到第2顯像液供應區2 4 c (.步驟4 )。也可 以在L C D基板G通過第2顯像液供應區2 4 c時,由顯 像液補充噴嘴5 1 c對L C D基板G上面補充顯像液(步 驟5 )。 被搬運到第2顯像液供應區2 4 c的L C D基板G再 被搬運到顯像液去除區2 4 d (步驟6 ),在該處,將 L C D基板G轉換成斜向姿勢以流掉L C D基板上的顯像 液(步驟7 ),再將L C D基板G保持於斜向姿勢的狀態 ,由淸洗液噴嘴5 2對L C D基板G表面排出淸洗液,例 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) (請先閱讀背面之注意事項再填寫本頁)The results shown in FIGS. 1 2 A to C are that the LCD substrate G is exposed and processed under specific conditions using a mask with a specific pattern forming a wire width of 8 # m or 1 0 // m. Then, the LCD substrate G is exposed under various conditions. The LCD substrate G was developed, and then the pattern of the anti-uranium film prepared by this method was observed with a scanning electron microscope (SEM), and the line width (the width of the convex portion in the development pattern) was measured and determined. In this SEM observation, in order to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) to the paper size of the entire LCD substrate G, this paper printed A7 ____B7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the observation of the invention (26), a plurality of radial observation points are provided near the center of the LCD substrate G in eight directions that intersect at an equal angle. The result is shown in FIG. 1A. The result is that the discharge flow rate of the developing solution from the developing nozzles 5 1 a and 5 1 b and the developing nozzle 5 1 a are formed by using a mask formed with a pattern with a line width of 10 mm. Regardless of the scanning speed of 5 1 b, it is set to be fixed, and the development time (the time from the start of application of the developer to the removal of the developer by the LCD substrate G) is set to be fixed. In addition, a histogram in FIG. 12A corresponds to an LCD substrate G. As shown in FIG. 1A, when the application times of the developing nozzles 5 1 a and 5 1 b are once, the scanning speed of the developing nozzles 5 1 a and 5 1 b is faster, and the coating uniformity is higher. Will improve. This is because the retention amount of the developing solution at the beginning of the imaging application is reduced, a part of the excessive reaction of the imaging occurring at the beginning of the imaging is suppressed, and the entire coating time of the LCD substrate G is short, so that The substrate G is uniformly caused to undergo a development reaction. The so-called "excessive reaction at a part of the beginning of image development coating" means as follows. That is, the developing solution is supplied to the cat scanning direction with the scanning of the developing nozzles 5 1 a and 5 1 b. However, at this time, a part of the developing solution will flow in the direction opposite to the scanning direction. The developer liquid returned by this item cannot exceed the beginning of application of the developer and stay there. Therefore, at the end of the development application, the developer is in an oversupply state, and the development reaction is excessively caused by the excess reaction at other parts. As a result of part of this phenomenon, an excessive reaction increases the unevenness of the line width in the plane. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) "Packing--Ordering. L --- Γ · -29-1226077 A7 _ΒΊ ___ 5 2. Description of the invention (27) (Please read the precautions on the back before filling in this page) Because the scanning speed of the imaging nozzles 5 1 a and 5 1 b can be increased, the amount of imaging fluid flowing back can be reduced, so Excessive reaction at a part of the beginning of application of the developer is suppressed. In addition, since the discharge flow rate and the development time of the developing solution from the developing nozzles 5 1 a and 5 1 b are fixed, the average line width is close to that of the photomask at a scanning speed of 100 mm / sec. The pattern is 9 · 9 4 // m, but the variation in line width across the entire LCD substrate G becomes large. On the other hand, when the scanning speed is 210 m / s, the average line width becomes slightly smaller than the pattern of the mask 9 · 7 8 // m, but the overall unevenness of the width of the LCD substrate G becomes smaller. As a result, when the scanning speeds of the developing nozzles 5 1 a and 5 1 b are fast, the impact of the resist on the developing solution increases and the developing reaction is promoted. Therefore, the scanning speed is 2 10 mm When the imaging response per second is exceeded, it should be one of the reasons. Therefore, if the imaging nozzles 5 1 a and 5 1 b are scanned at high speed, the average line width can be brought closer to the pattern of the mask by shortening the development time, and the line width uniformity should be improved. The results shown in Figure 1 2B are printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The result shows that a mask with a pattern of 8 // m in width is used, and the scanning speeds of the imaging nozzles 5 1 a and 5 1 b are scanned. The scanning speed is set at 80 mm / sec, and the scanning liquid discharge rate is 5.6 liters / minute, and the imaging nozzles 5 1 a and 5 1 b are set at 160 mm / sec. At 9.4 liters / minute, the average line width when a fixed development time is set and the number of application times is changed. As shown in Figure 1 2B, as the number of coatings increases, the average line width decreases. This means that as the number of application times increases, the development reaction speeds up, so it should be possible to shorten the development time by increasing the number of application times. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -30- 1226077 A7 _____ B7 V. Description of the invention (28) The results shown in Figure 1 2 c indicate the use of a pattern with 8 // m Mask, and set the scanning speeds of the imaging nozzles 5 1 a and 5 1 b to 80 mm / sec, and the imaging fluid discharge volume at 5.6 liters / minute, and the imaging nozzles 5 1 a and 5 When the sweep speed of 1 b is set to 160 mm / sec, and the developer discharge amount is 9.4 liters / minute, a fixed development time is set and the line width is uniform when the number of application times is changed. In addition, a histogram in FIG. 12C corresponds to a piece of the LCD substrate G. As shown in FIG. 1C, when the number of coatings is the same, the faster the scanning speed of the developing nozzles 5 1 a and 5 1 b is, the more uniform the line width is. In addition, when the scanning speeds of the developing nozzles 5 1 a and 5 1 b are fast (160 mm / sec), if the number of application times is increased, the line width uniformity is improved. From this result, it can be seen that the scanning speeds of the developing nozzles 5 1 a and 5 1 b are fast and the number of application times is increased, which is effective for improving the uniformity of the line width. The LCD substrate G after the coating process in the first developing solution supply area 2 4 b is finished is transferred to the second developing solution supply area 2 4 c by a roller conveying mechanism 1 4 at a transfer speed of 4 6 mm / sec. (.Step 4). When the L C D substrate G passes through the second developer liquid supply area 2 4 c, the developer liquid replenishing nozzle 5 1 c may be used to replenish the developer liquid on the L C D substrate G (step 5). The LCD substrate G transferred to the second developing solution supply area 2 4 c is further transferred to the developing solution removal area 2 4 d (step 6), where the LCD substrate G is converted into an oblique posture to flow away. The developing solution on the LCD substrate (step 7), and then the LCD substrate G is maintained in an oblique posture, and the cleaning solution nozzle 5 2 discharges the cleaning solution to the surface of the LCD substrate G. For example, this paper size applies the Chinese national standard (CNS) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling this page)

、1T 經濟部智慧財產局員工消費合作社印製 -31 - 1226077 A7 B7 五、發明説明(29) 如純水,以沖洗L C D基板G上面的顯像液(步驟8 )。 (請先閲讀背面之注意事項再填寫本頁) 接著,L C D基板G被搬運至淸洗區2 4 e (步驟9 ),在該處將LCD基板G以特定速度搬運並在LCD基 板G的表面及裡面排出淸洗液以去除與洗淨附著於L C D 基板G的顯像液(步驟1 0 )。一邊進行該項淸洗處理, 一邊通過淸洗區2 4 e的L C D基板G即被搬運到乾燥區 2 4 f (步驟1 1 )。在乾燥區2 4 f,一邊以特定速度 搬運L C D基板,一邊利用氣刀5 4進行乾燥處理(步驟 1 2 )。結束乾燥處理的L C D基板G即被滾輪搬運機構 1 4搬運至i線U V照射單元(i 一 U V ) 2 5 (步驟 1 3 ),並在該處施予特定的紫外線照射處理。 經濟部智慧財產局員工消費合作社印製 以上已對本發明的實施形態加以說明,惟本發明並不 侷限於上述形態。例如,配置於第1顯像液供應區2 4 b 的顯像液噴嘴也可以爲1個或3個。使用1個顯像液噴嘴 時,因爲必須增大由顯像液噴嘴所排出的顯像液流量,因 此必須控制來自顯像液噴嘴的顯像液的排出狀態,如顯像 液的排出方向與排出強度以免顯像液的排出趨勢變強以致 排出於L C D基板G的顯像液由L C D基板G溢落。 另外,在第1顯像液供應區2 4 b中,也可以一邊以 不使L C D基板G上面所塗敷的顯像液溢落的程度的速度 搬運,一邊在L C D基板G塗敷顯像液,而不必使L C D 基板G停下來。再者,雖然假定顯像噴嘴5 1 a與5 1 b 的掃瞄方向爲與L C D基板G的搬運方向相反,惟如要停 止L C D基板G時,也可以使顯像噴嘴5 1 a與5 1 b向 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ' ' •32- 1226077 A7 B7_______ 五、發明説明(3〇) 與L C D基板G的搬運方向垂直的方向掃瞄。 (請先閱讀背面之注意事項再填寫本頁) 〔發明的效果〕 如上所說明,利用本發明的液體處理裝置與液體處理 方法,可以藉使處理液噴嘴以特定速度掃瞄,在短時間內 在基板上塗敷處理液,因此,可以在基板整體進行均勻的 液體處理。藉此,可以獲得提升基板的品質與降低不良產 品的發生率的效果。此外,由於不必以快速搬運塗敷過處 理液的基板,因此不必緊急停止基板,不會因此處理液由 基本上溢落而妨礙液體處理的進行,也不必再補充溢落的 處理液體的相等量。再者,由於可以防止由於緊急停止的 應力所發生的基板的扭曲,或基板傳送過速(overrun )而 破的問題的發生,因此製造產率提高,維修負擔減輕。此 外,搬運基板所需的空間只要與先前相同即可,可以抑制 裝置的覆蓋區的擴大。 〔圖式之簡單說明〕 經濟部智慧財產局員工消費合作社印製 圖1爲具備本發明的顯像處理單元的抗蝕劑塗敷與顯 像處理系統的槪略平面圖。 圖2爲表示圖1所示的抗鈾劑塗敷與顯像處理系統的 第1熱處理單元區的側面圖。 圖3爲表示圖1所示的抗蝕劑塗敷與顯像處理系統的 第2熱處理單元區的側面圖。 圖4爲表示圖1所示的抗蝕劑塗敷與顯像處理系統的 本紙張尺度適用中國國家標準(CNS ) A4規格(公釐) ~ -33- 經濟部智慧財產局員工消費合作社印製 1226077 A7 _ B7___ 五、發明説明(31) 第3熱處理單元區的側面圖。 圖5爲本發明的顯像處理單元的槪略側面圖。 圖6爲圖5所示的顯像處理單元的槪略平面圖。 圖7爲由L C D基板的搬運方向的上游側所見的具有 圖5所示的顯像處理單元的第1顯像液供應區構造的正面 圖。 圖8爲表示配設於圖5所示顯像處理單元的第1顯像 液供應區的主顯像液噴嘴的構造的斜視圖。 圖9 A爲表示圖5所示的主顯像液噴嘴與副顯像液噴 嘴的配置形態的側面圖。 圖9 B爲表示利用圖5所示的主顯像液噴嘴與副顯像 液噴嘴所形成的顯像液的塗敷形態的側面圖。 圖1 0爲表示顯像處理工程之槪況的流程圖。 圖1 1爲表示主顯像液噴嘴與副顯像液噴嘴的掃瞄形 態的說明圖。 圖1 2 A爲表示主顯像液噴嘴與副顯像液噴嘴的掃瞄 速度與所製得的顯像圖案的線寬均勻性的關係的說明圖。 圖1 2 B爲表示主顯像液噴嘴與副顯像液噴嘴的塗敷 次數與所製得的顯像圖案的線寬的關係的說明圖。 圖1 2 C爲表示主顯像液噴嘴與副顯像液噴嘴的塗敷 次數與所製得的顯像圖案的線寬均勻性的關係說明圖。 〔符號說明〕 1 ......匣盒站, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁} 裝 -訂 -34- 1226077 A7 B7 五、發明説明(32) 經濟部智慧財產局員工消費合作社印製 2 … … 處理站, 3 … … 介面站, 1 4 …滾輪搬 運 機 構, 1 7 …滾輪, 2 4 …顯像處 理 單 元( D V D ) 2 4 a ......導入 區 , 2 4 b ......第1 顯 像 液供 應 區, 2 4 c ......第2 顯 像 液供 應 區, 2 4 d ......顯像 液 去 除區 2 4 e ……淸洗 區 2 4 f ......乾燥 區 > 5 1 a ......主顯 像 液 噴嘴 y 5 1 b ......副顯 像 液 噴嘴 y 5 1 c ......顯像 液 補 充噴 嘴 5 2 … …淸洗液 噴 嘴 5 3 … …淸洗噴 嘴 y 5 4 … …空氣噴 嘴 ( 氣刀 ) y 5 5 …噴嘴固 定 構 件, 5 6 … …噴嘴保持 構 件, 5 7 … …升降裝 置 y 5 8 … …弓形臂 y 5 9 a ......導軌 y 6 0 … …顯像液 供 應 機構 6 0 a ......噴嘴 移 動 機構 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -35- 1226077 A7 B7 五、發明説明(33) 10 0……抗蝕劑塗敷與顯像處理系統(處理裝置) (請先閲讀背面之注意事項再填寫本頁) 經濟部智慈財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -36-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the 1T -31-1226077 A7 B7 V. Description of the invention (29) If pure water is used, rinse the developing liquid on the substrate G of the LCD substrate (step 8). (Please read the precautions on the back before filling in this page.) Then, the LCD substrate G is transported to the cleaning area 2 4e (step 9), where the LCD substrate G is transported at a specific speed and on the surface of the LCD substrate G. Then, the cleaning solution is discharged to remove and clean the developing solution attached to the LCD substrate G (step 10). While performing this dewashing process, the L C D substrate G passing through the dewashing zone 2 4 e is transferred to the drying zone 2 4 f (step 1 1). In the drying zone 2 4 f, the L C D substrate is conveyed at a specific speed, and the drying process is performed by the air knife 5 4 (step 1 2). The L C D substrate G after the drying process is transferred to the i-line U V irradiation unit (i-U V) 2 5 (step 1 3) by the roller transfer mechanism 1, and a specific ultraviolet irradiation process is applied there. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The embodiments of the present invention have been described above, but the present invention is not limited to the above forms. For example, the number of the developer nozzles arranged in the first developer supply area 2 4 b may be one or three. When using one developer nozzle, the flow rate of developer solution discharged from the developer nozzle must be increased. Therefore, the ejection state of developer solution from the developer nozzle must be controlled. The discharge intensity is such that the discharge tendency of the developing liquid becomes strong so that the developing liquid discharged on the LCD substrate G overflows from the LCD substrate G. In addition, in the first developing solution supply region 2 4 b, the developing solution may be applied to the LCD substrate G while being conveyed at a speed that does not cause the developing solution applied on the LCD substrate G to overflow. Without having to stop the LCD substrate G. In addition, although the scanning directions of the developing nozzles 5 1 a and 5 1 b are assumed to be opposite to the conveying direction of the LCD substrate G, if the LCD substrate G is to be stopped, the developing nozzles 5 1 a and 5 1 may be used. b Apply the Chinese National Standard (CNS) A4 specification (210X297 mm) to this paper size. '• 32-1226077 A7 B7_______ V. Description of the invention (30) Scanning in a direction perpendicular to the conveying direction of the LCD substrate G. (Please read the precautions on the back before filling in this page) [Effects of the invention] As explained above, with the liquid processing device and liquid processing method of the present invention, the processing liquid nozzle can be scanned at a specific speed in a short period of time. Since the processing liquid is applied to the substrate, uniform liquid processing can be performed on the entire substrate. Thereby, the effects of improving the quality of the substrate and reducing the incidence of defective products can be obtained. In addition, since it is not necessary to quickly transfer the substrate coated with the processing liquid, it is not necessary to stop the substrate urgently, and the processing liquid does not hinder the progress of the liquid processing due to the overflow of the processing liquid. . Furthermore, it is possible to prevent the substrate from being distorted due to the stress of the emergency stop or the substrate from being broken due to overrun of the substrate, so that the manufacturing yield is improved and the maintenance burden is reduced. In addition, the space required to transport the substrate may be the same as before, and the expansion of the coverage area of the device can be suppressed. [Brief description of the figure] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Figure 1 is a schematic plan view of a resist coating and development processing system provided with the development processing unit of the present invention. Fig. 2 is a side view showing a first heat treatment unit area of the anti-uranium agent coating and developing processing system shown in Fig. 1. Fig. 3 is a side view showing a second heat treatment unit region of the resist application and development processing system shown in Fig. 1. Fig. 4 shows the paper size of the resist coating and development processing system shown in Fig. 1. Applicable to China National Standard (CNS) A4 (mm) ~ -33. Printed by the Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs 1226077 A7 _ B7___ V. Description of the invention (31) Side view of the third heat treatment unit area. FIG. 5 is a schematic side view of a development processing unit of the present invention. FIG. 6 is a schematic plan view of the development processing unit shown in FIG. 5. FIG. Fig. 7 is a front view of the structure of a first developing solution supply region having the developing processing unit shown in Fig. 5 as viewed from the upstream side in the conveyance direction of the LCD substrate. Fig. 8 is a perspective view showing a structure of a main developing liquid nozzle provided in a first developing liquid supply area of the developing processing unit shown in Fig. 5; Fig. 9A is a side view showing the arrangement of the main developer liquid nozzle and the sub developer liquid nozzle shown in Fig. 5; Fig. 9B is a side view showing the application form of the developing solution formed by the main developing solution nozzle and the sub developing solution nozzle shown in Fig. 5. FIG. 10 is a flowchart showing the state of the development processing process. Fig. 11 is an explanatory view showing scanning states of a main developing liquid nozzle and a sub developing liquid nozzle. Fig. 12A is an explanatory diagram showing the relationship between the scanning speed of the main developing liquid nozzle and the sub developing liquid nozzle and the line width uniformity of the prepared developing pattern. Fig. 12B is an explanatory diagram showing the relationship between the number of application times of the main developing liquid nozzle and the sub developing liquid nozzle and the line width of the developed developing pattern. Fig. 12C is an explanatory diagram showing the relationship between the number of application times of the main developing liquid nozzle and the sub developing liquid nozzle and the line width uniformity of the prepared developing pattern. 〔Symbols〕 1 ...... Box box station, this paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling in this page} Binding-Book-34 -1226077 A7 B7 V. Description of the invention (32) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy 2…… processing station, 3…… interface station, 1 4… roller conveying mechanism, 1 7… roller, 2 4… imaging Processing unit (DVD) 2 4 a ... lead-in area, 2 4 b ... first developer supply area, 2 4 c ... second developer supply area , 2 4 d …… Developing solution removing area 2 4 e …… Washing area 2 4 f …… Drying area> 5 1 a ...... Main developing liquid nozzle y 5 1 b ...... Developing liquid nozzle y 5 1 c ...... Developing liquid replenishing nozzle 5 2…… washing liquid nozzle 5 3…… washing nozzle y 5 4… Air nozzle (air knife) y 5 5… nozzle fixing member, 5 6…… nozzle holding member, 5 7…… lifting device y 5 8…… arched arm y 5 9 a ...... rail y 6 0…… developing liquid supply mechanism 6 0 a… nozzle moving mechanism (please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) -35- 1226077 A7 B7 V. Description of the invention (33) 10 0 …… Resist coating and development processing system (processing device) (Please read the note on the back first Please fill in this page again) The paper printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies the Chinese National Standard (CNS) A4 (210X297 mm) -36-

Claims (1)

1226077 A8 B8 C8 _^_§_____ 六、申請專利範圍1 1·一種液體處理裝置,具備:將基板以略爲水平姿 勢搬運於一個方向的搬運機構, 在被上述搬運機構搬運的基板表面排出處理液的處理 液噴嘴,以及以特定速度在上述基板上移動上述處理液噴 嘴的噴嘴移動機構, 利用上述噴嘴移動機構一邊移動上述處理液噴嘴,一 邊由上述處理液噴嘴排出上述處理液並在上述基板塗敷上 述處理液。 2 ·如申請專利範圍第1項的液體處理裝置,其中在 利用上述處理液噴嘴塗敷上述處理液而由上述搬運機構搬 運的基板表面,另具備再度塗敷上述處理液的固定處理液 補充噴嘴。 3 .如申請專利範圍第2項的液體處理裝置,其中上 述處理液補充噴嘴具有在與上述基板的搬運方向正交之方· 向的長形形狀, 並對通過上述處理液補充噴嘴下方的基板,在與上述 搬運方向正交的整個方向,將上述處理液補充成大致上成 帶狀。 4 .如申請專利範圍第1、2或3項的液體處理裝置 ,其中上述噴嘴移動機構使上述處理液噴嘴移動至與上述 基板的搬運方向爲相反的方向。 5 .如申請專利範圍第1、2或3項的液體處理裝置 ,其中上述處理液噴嘴是由與上述噴嘴移動機構的移動方 向爲正交之方向的長形主處理液噴嘴與副處理液噴嘴的兩 本紙張尺度適用中國國家揉準(CNS ) A4規格(210X297公嫠) (請先閲讀背面之注意事項再填寫本頁) -裝- 經濟部智慧財產局員工消費合作社印製 -37- 1226077 A8 B8 C8 ___D8 六、申請專利範圍2 支噴嘴所構成, (請先閲讀背面之注意事項再填寫本頁) 上述主處理液噴嘴與上述副處理液噴嘴是並排配置成 上述主處理液噴嘴位於上述噴嘴移動機構的移動方向的前 方,而上述副處理液噴嘴位於上述移動方向的後方,並且 由上述主處理液噴嘴及副處理液噴嘴對上述基板在與 上述移動方向正交的方向整體將上述處理液排出大致上呈 帶狀。 6 _如申請專利範圍第5項的液體處理裝置,其中上 述副處理液噴嘴輿基板之間的間隙,係比上述主處理液噴 嘴與上述基板之間的間隙爲寬。 7 ·如申請專利範圍第5或6項的液體處理裝置,其 中上述主處理液噴嘴與副處理液噴嘴被保持於對垂直方向 呈5度以上小於1 5度的傾斜狀態,俾使在利用上述噴嘴 移動機構移動時,可以向移動方向的斜下後方排出上述處· 理液。 經濟部智慧財產局員工消費合作社印製 8 _如申請專利範圍第5或6項的液體處理裝置,其 中另具備用於升降上述主處理液噴嘴與副處理液噴嘴的升 降機構, 上述升降機構將上述副處理液噴嘴的底面接近上述端 面附近,俾上述副處理液噴嘴到達要結束上述處理液的排 出的上述基板端面附近的特定位置時,塗敷於上述基板的 處理液不至於由上述端面溢落。 9 ·如申請專利範圍第1、2或3項的液體處理裝置 ,其中當要對上述基板進行上述處理液的塗敷時,上述搬 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 一~ 1226077 A8 B8 C8 _ D8 六、申請專利範圍3 運機構停止操作以停止該基板。 (請先閱讀背面之注意事項再填寫本頁) 1 〇 ·如申請專利範圍第1、2或3項的液體處理裝 置,其中上述噴嘴移動機構使上述處理液噴嘴在1 0 〇m m/秒以上5 0 0 m m/秒以下移動於大致水平方向。 1 1 · 一種液體處理方法,具有: 將基板搬運到略呈水平姿勢以進行液體處理的液體處 理區域的工程, 在上述液體處理區域中,將上述基板的搬運停止或將 上述基板的搬運速度設成比搬運至上述液體處理區域的速 度更慢的工程,以及 一邊將用於塗敷處理液於上述基板的處理液噴嘴水平 移動於上述基板上,一邊由上述處理液噴嘴在上述基板上 排出上述處理液以使在上述基板上塗敷處理液的工程。 1 2 .如申請專利範圍第1 1項的液體處理方法,其· 中一邊以一定速度搬運塗敷有上述處理液的基板,一邊由 用於塗敷處理液於上述基板的被固定之處理液補充噴嘴排 出上述處理液,再於上述基板塗敷上述處理液。 經濟部智慧財產局員工消費合作社印製 1 3 ·如申請專利範圍第1 1或1 2項的液體處理方 法,其中在塗敷處理液於上述基板的工程中,當上述處理 液噴嘴到達應結束上述處理液的排出的上述基板的端面附 近時,藉由中止來自上述處理液噴嘴的上述處理液的排出 ,同時將上述處理液噴嘴接近上述端面附近,俾使塗敷於 上述基板上的處理液不致由上述端面溢落。 1 4 ·如申請專利範圍第1 1或1 2項的液體處理方 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -39 - 1226077 AS B8 C8 D8 __ 六、申請專利範圍4 (請先閱讀背面之注意事項再填寫本頁) 法,其中在上述基板塗敷處理液的工程中,一邊由上述處 理液噴嘴排出上述處理液,一邊在上述基板上大致水平方 向移動上述處理液噴嘴數次以塗敷上述處理液於上述基板 上。 1 5 .如申請專利範圍第1 1或1 2項的液體處理方 法,其中在上述基板塗敷處理液的工程中,在移動上述處 理液噴嘴於大致水平方向時,是由上述處理液噴嘴將上述 處理液朝向上述處理液噴嘴的移動方向的斜下後方排出。 1 6 .如申請專利範圍第1 1或1 2項的液體處理方 法,其中在上述基板塗敷處理液的工程中,是使用兩支噴 嘴做爲上述處理液噴嘴以塗敷上述處理液於基板上。 17.—種液體處理裝置,是用於對已經施行曝光處 理的基板實施顯像處理,具備: 將基板以大致水平姿勢搬運至一個方向的搬運機構, 在被上述搬運機構搬運的基板表面排出顯像液的顯像 液噴嘴,以及 經濟部智慧財產局員工消費合作社印製 以特定的速度將上述顯像液噴嘴在基板上移動至與上 述基板的搬運方向相反的方向之噴嘴移動機構,並且 利用上述噴嘴移動機構一邊移動上述顯像液噴嘴,一 邊由上述顯像液噴嘴排出上述顯像液以將上述顯像液塗敷 於上述基板上。 1 8 ·如申請專利範圍第1 7項的液體處理裝置,其 中另具備在以上述顯像液噴嘴塗敷上述顯像液而以上述搬 運機構搬運的基板表面再度塗敷上述顯像液的固定顯像液 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) - 40- 1226077 A8 Β8 C8 D8 々、申請專利範圍5 補充噴嘴。 19.一種液體處理方法,用於進行已曝光處理的基 板的顯像處理,具有: 以大致上水平姿勢將基板搬運至進行顯像液塗敷的顯 像液塗敷區域的工程, 在上述顯像液塗敷區域中,停止上述基板的搬運或使 上述基板的搬運速度比將基板搬運至上述顯像液塗敷區域 的速度爲慢的工程, 在上述基板上,一邊將在上述基板上塗敷顯像液的顯 像液噴嘴水平移動於上述基板上,一邊由上述顯像液噴嘴 排出上述顯像液以在上述基板上塗敷上述顯像液的工程, 以及 將塗敷過上述顯像液的基板搬運至去除上述顯像液的 液體去除處理區域的工程。 2 〇 .如申請專利範圍第1 9項的液體處理方法,其 中在基板上塗敷顯像液的工程之後,在搬運上述基板至液 體去除處理區域之前,以特定速度一邊搬運上述已塗敷顯 像液之基板,一邊由對基板塗敷顯像液的固定顯像液補充 噴嘴排出上述顯像液再度對上述基板進行塗敷上述顯像液 的處理。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) _ -41 - (請先閱讀背面之注意事項再填寫本頁) -裝_ 訂 經濟部智慧財產局員工消費合作社印製1226077 A8 B8 C8 _ ^ _ § _____ VI. Patent application scope 1 1. A liquid processing device including: a transport mechanism that transports a substrate in a slightly horizontal posture in one direction, and discharges processing on the surface of the substrate transported by the transport mechanism Liquid processing liquid nozzle, and a nozzle moving mechanism for moving the processing liquid nozzle on the substrate at a specific speed, while using the nozzle moving mechanism to move the processing liquid nozzle, the processing liquid nozzle is discharged from the processing liquid nozzle and the substrate is discharged onto the substrate. Apply the treatment liquid. 2. The liquid processing device according to item 1 of the patent application scope, wherein the surface of the substrate which is coated with the processing liquid by the processing liquid nozzle and transported by the conveying mechanism is further provided with a fixed processing liquid replenishing nozzle for recoating the processing liquid . 3. The liquid processing device according to item 2 of the patent application scope, wherein the processing liquid replenishing nozzle has an elongated shape in a direction orthogonal to the substrate conveyance direction, and the substrate below the nozzle is passed through the processing liquid replenishing nozzle. The treatment liquid is replenished in a substantially band shape in the entire direction orthogonal to the conveyance direction. 4. The liquid processing apparatus according to claim 1, 2, or 3, wherein the nozzle moving mechanism moves the processing liquid nozzle to a direction opposite to a conveyance direction of the substrate. 5. The liquid processing device according to claim 1, 2, or 3, wherein the processing liquid nozzle is an elongated main processing liquid nozzle and a sub-processing liquid nozzle in a direction orthogonal to the moving direction of the nozzle moving mechanism. The two paper sizes are applicable to the Chinese National Standard (CNS) A4 (210X297). (Please read the notes on the back before filling out this page.) A8 B8 C8 ___D8 6. The scope of patent application is composed of 2 nozzles. (Please read the precautions on the back before filling this page.) The main processing liquid nozzle and the sub processing liquid nozzle are arranged side by side so that the main processing liquid nozzle is located above The nozzle moving mechanism is forward of the moving direction, and the sub-processing liquid nozzle is located rearward of the moving direction, and the main processing liquid nozzle and the sub-processing liquid nozzle as a whole process the processing on the substrate in a direction orthogonal to the moving direction. The liquid discharge is roughly band-shaped. 6 _ The liquid processing device according to item 5 of the application, wherein the gap between the sub-processing liquid nozzle and the substrate is wider than the gap between the main processing liquid nozzle and the substrate. 7 · The liquid processing device according to item 5 or 6 of the scope of patent application, wherein the main processing liquid nozzle and the sub processing liquid nozzle are maintained in an inclined state of 5 degrees or more and less than 15 degrees in the vertical direction, so that the above-mentioned When the nozzle moving mechanism is moved, the processing liquid can be discharged obliquely downward and rearward in the moving direction. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 8 _If the liquid treatment device in the scope of patent application No. 5 or 6, it also has a lifting mechanism for lifting and lowering the main processing liquid nozzle and the sub processing liquid nozzle, the lifting mechanism will The bottom surface of the sub-processing liquid nozzle is close to the vicinity of the end surface. When the sub-processing liquid nozzle reaches a specific position near the end surface of the substrate to end the discharge of the processing liquid, the processing liquid applied to the substrate will not overflow from the end surface. drop. 9 · If the liquid processing device of the scope of patent application No. 1, 2 or 3, in which the above-mentioned substrate is to be coated with the above-mentioned processing liquid, the above-mentioned paper size for transfer is applicable to the Chinese National Standard (CNS) A4 specification (210X297) (Centi) I ~ 1226077 A8 B8 C8 _ D8 VI. Patent application scope 3 The transport mechanism stops operation to stop the substrate. (Please read the precautions on the back before filling this page) 1 〇 · If the liquid treatment device of the patent application scope item 1, 2 or 3, where the nozzle moving mechanism makes the processing liquid nozzle above 100 mm / sec It moves in the horizontal direction below 500 mm / sec. 1 1 · A liquid processing method comprising: a process of transferring a substrate to a liquid processing area in a slightly horizontal posture to perform liquid processing; in the liquid processing area, stopping the transfer of the substrate or setting a transfer speed of the substrate A process that is slower than conveying to the liquid processing area, and horizontally moving a processing liquid nozzle for applying a processing liquid onto the substrate onto the substrate while discharging the processing liquid nozzle onto the substrate The processing liquid is a process of applying a processing liquid on the substrate. 1 2. The liquid processing method according to item 11 of the scope of patent application, wherein while the substrate coated with the processing liquid is transported at a constant speed, the fixed processing liquid for coating the processing liquid on the substrate is transferred. The replenishing nozzle discharges the processing liquid, and then applies the processing liquid to the substrate. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 3 · If the liquid treatment method of item 11 or 12 of the scope of patent application is applied, in the process of applying the treatment liquid to the substrate, the nozzle of the treatment liquid should be terminated When the processing liquid is discharged near the end surface of the substrate, the processing liquid nozzle is stopped from being discharged from the processing liquid nozzle, and the processing liquid nozzle is approached near the end surface, so that the processing liquid applied on the substrate is caused Do not spill from the above-mentioned end surface. 1 4 · If you apply for liquid treatment of item 11 or 12 in the scope of patent application, the paper size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -39-1226077 AS B8 C8 D8 __ VI. Application scope 4 (Please read the precautions on the back before filling out this page) method, in the process of coating the substrate with the processing liquid, while the processing liquid is discharged from the processing liquid nozzle, the processing liquid is moved substantially horizontally on the substrate The nozzle was applied to the substrate several times to apply the processing solution. 15. The liquid processing method according to item 11 or 12 of the scope of patent application, wherein in the process of coating the substrate with the processing liquid, when the processing liquid nozzle is moved in a substantially horizontal direction, the processing liquid nozzle The processing liquid is discharged obliquely downward and rearward in a moving direction of the processing liquid nozzle. 16. The liquid processing method according to item 11 or 12 of the scope of patent application, wherein in the process of coating the substrate with the processing liquid, two nozzles are used as the processing liquid nozzles to apply the processing liquid to the substrate. on. 17. A liquid processing device for developing a substrate that has been subjected to exposure processing, comprising: a transport mechanism that transports the substrate to a direction in a substantially horizontal posture, and discharges the display on the surface of the substrate transported by the transport mechanism. The developing liquid nozzle of the imaging liquid, and the nozzle moving mechanism for moving the developing liquid nozzle on the substrate to a direction opposite to the carrying direction of the substrate at a specific speed printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and use The nozzle moving mechanism discharges the developing solution from the developing solution nozzle while moving the developing solution nozzle to apply the developing solution to the substrate. 1 8 · The liquid processing device according to item 17 of the patent application scope, further comprising a fixing device for applying the developing solution to the developing solution nozzle and applying the developing solution to the substrate surface transported by the conveying mechanism. The size of the developer solution paper is in accordance with Chinese National Standard (CNS) A4 (210X297 mm)-40-1226077 A8 Β8 C8 D8 々, patent application scope 5 supplementary nozzle. 19. A liquid processing method for developing an exposed-processed substrate, the method comprising: carrying the substrate in a substantially horizontal posture to a developer-applying region to which developer is applied; and In the image liquid application region, the process of stopping the substrate transfer or making the substrate transfer speed slower than the speed of transferring the substrate to the developer coating region is to apply the substrate onto the substrate while coating the substrate. A process in which a developing solution nozzle of the developing solution is horizontally moved on the substrate, while the developing solution is discharged from the developing solution nozzle to apply the developing solution on the substrate, and the process of applying the developing solution to the developing solution is performed. Process for transferring a substrate to a liquid removal processing area from which the above-mentioned developing liquid is removed. 2 〇. The liquid processing method according to item 19 of the patent application scope, wherein after the process of coating the developing liquid on the substrate, before the substrate is transferred to the liquid removal processing area, the coated developing image is transferred at a specific speed. While the substrate is liquid, the developing solution is discharged from the fixed developing solution replenishing nozzle that applies the developing solution to the substrate, and the process of applying the developing solution to the substrate is performed again. This paper size applies to China National Standard (CNS) A4 (210X297 mm) _ -41-(Please read the precautions on the back before filling out this page)-Equipment _ Order Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs
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JP4643684B2 (en) 2011-03-02
CN100402163C (en) 2008-07-16

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