TWI220785B - Memory module with directly chip-attaching and method for making thereof - Google Patents

Abstract

A memory module with directly chip-attaching comprises a memory module substrate having a plurality of frame sockets for directly attaching and positioning separate memory chips in order to combine packaging process and module assembling process and to economize a resin-potting step. A making method of the memory module makes use of module level test for simultaneously testing the bare memory chips and the substrate in order to reduce test cost.

Description

1220785 V. Description of the Invention (1) [Field of the Invention] The present invention relates to a memory module [memory modu 1 e], and particularly relates to a chip directly attached to the memory module and a manufacturing method thereof. [Previous technology] The manufacturing method of the conventional memory module is divided into three main processes, that is, the memory wafer manufacturing process of the memory volume circuit, the memory chip packaging process, and the memory module assembly process. Memory wafers are provided by a wafer fabrication plant, and wafer testing and laser repair are performed. After that,-the wafer packaging plant electrically connects the wafers formed by the wafer dicing to a carrier such as a lead frame, Circuit board or circuit adhesive film] and sealed with resin to form a memory package structure, whose type is such as thin small outline package pen [Thin Small Outline Package, TS0P] or ball grid array: [Bal 1 Grid Array package, BGA] and so on, and perform electrical test and / or aging test on the -j package packaging structure [burn-ne], and then a module assembly factory will pack multiple memory package structures =]; memory The body module substrate [small printed circuit board] constitutes a memory ^ ^ ~ [memory module], and the final product test is performed. As far as the two = group standard processes are concerned, the manufacture of each memory module You need to know the same test equipment, that is, the wafer test machine and the package structure test. The test machine is not set, although the above machines are used as the test card of the test memory and mold. [Used to contact the wafer] However, the HI-FIX test board of the test machine [for joining the packaging structure] = the socket test board of the test machine [for the memory module] are tested the same, Unable to integrate in the manufacturing method of each memory module;

1220785 V. Description of the invention (2) Three types of expensive and various undeniable developments are used. Therefore, the memory chip packaging process and the Republic of China patent module and its process module [D irect manufacturing method, such as the first "Yuanyuan" 11 "Second wafer test" 1 4 The test circle selectively cuts the wafer group 20 series 2 1 series After forming the convexity, the "chip group 20 flip chip 18" step is performed, which is deemed insufficient, Block 2 2 is required. Although the test step 1 2 of the completed chipset 20 has been tested in a stable manufacturing method, the test machine's setup cost is equivalent ^, and the test will increase the test cost. Ground, the memory module is oriented Low unit price and high memory capacity, in addition to high-capacity and high-density memory wafers, the manufacturing costs of continuous research groups should also be effectively reduced, especially for the reduction of integration and test costs of module assembly processes. 7 2 3 7 2 "Chip directly attached memory" "It is revealed that there is a kind of chip directly attached memory ly Chip Attaching memory module." "Provide the" first wafer test "1 2," aging test "J / and test" 14 steps, after that, according to the second crystal / circle test results, in the "wafer cutting" 1 5 steps, This crystal is formed into a plurality of memory chip groups 20, as shown in FIG. 2, which is integrally composed of a plurality of side-by-side wafers 21, the wafer blocks 22, and “providing a memory module substrate” 16 in step m. Attach the chip set to the substrate "step 17, which is to interface the memory module substrate 30 with the fixation of" packaged in the chip set 20 and the memory module substrate 30 ^ ^ packaging material 4〇 [underf iu] Encapsulate these convex parts ^ The second part of the chip directly attached to the memory module above = chip B packaging process and module assembly process, but its inventory 悛 Ϊ 3 f state test Working shape ~ body frame, and electrical connection status and memory of substrate 30

(I 1220785 V. Description of the invention (3) --------- The function of the body, the group substrate 30, etc., cannot be effectively detected, and it is manufactured. It is still possible that the think body pull group is bad Another problem that needs attention is the production of group 20. After the wafer is manufactured, the wafer cannot be completely cut. Selective cutting must be performed according to the test results to produce a wafer group 2 with a plurality of wafers 21 〇, each wafer cutting path is different, the automatic design of cutting is more complicated and difficult than conventional wafer cutting. For example, the defective wafer 21 is not properly dispersed on the wafer, which will make the integrated wafer group 20 difficult.制 #, Furthermore, it is known that the individual chip has a larger area of the chipset 20, and when the memory module substrate 30 is attached, there is a greater thermal variable stress 'easy to peel off or warp. Another' In Patent Gazette Bulletin No. 4 52320 "Flip-Chip Direct Carrying (FC-DCA) Memory Module" patent, it is disclosed that a chip is directly attached to a redundant memory module [DC A memory module]. Memory chip flip-chip bonding (fHp chip m〇unting] to a substrate, f is electrically connected to the substrate, but the wafer and the substrate are bonded by bumps 'The thermal expansion coefficient of the wafer and the substrate of the printed circuit board are different, easy to detach or the bump breaks' need to be A filler [⑽derfiiiing mater 1 a + 1] is applied between the wafers and the substrate to improve the position of the wafer on the substrate, and after the filler is applied, if a bad crystal is detected. ί Repairing or replacing individual chips, a bad crystal t ^ memory module and other good chips cannot be used. [Objective and Summary of the Invention] I i β μ of the present invention > Λ ^ Wang Yao Purpose Is to provide a chip directly attached to the memory phase: the group 'use Xi p々 prepare to throw ^ y yuyou board group substrate base for direct chip attachment

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It achieves the integration of packaging and module positioning, and saves the effect of glue application steps.

The body module of the present invention is based on the provision of a chip directly attached to the memory for positioning and replacement of the Z core, and the frame base of the module substrate for directly attaching the chip. After module-level testing, bad direct-attached Japanese-Japanese films still have the effect of being replaceable. The purpose of the present invention is to provide a chip directly attached to the memory head J; W4 after the wafer is cut, 'the memory chip is directly: = the frame of the heart module module substrate And at least one module A too: W to test the wafer and the substrate at the same time, to achieve the effect of reducing the cost of test machine setup and reducing the cost of testing.

Μ Μ ^ ^ Another purpose of January is to provide a method for directly attaching memory to a chip :, and the method of making clothes, which is to test a plurality of ^ f pieces on a module substrate and test at the module level. Later, chip replacement can still be performed, and effective jade testing is at the module level. ^ The chip directly attached memory module according to the present invention includes a 6-module module substrate and a plurality of directly attached memory chips. The memory module substrate has a wafer attachment surface. A plurality of frame bases are formed on the wafer attaching surface, and contact ends are formed in the frame bases. The memory chips are individually arranged on the frame base of the memory module substrate, and each memory chip is formed. There are a plurality of lead terminals, such as a flat pad or a convex shape, and are electrically connected to the contact ends of the corresponding frame base. Preferably, the memory module substrate is provided with a positioning cover, such as a metal shell plate The positioning cover has a pressing surface 'such as a convex plane' which corresponds to a frame base of the memory module substrate,

Υί Page '--- ~ --- 1220785 V. Description of the invention (5) A manufacturing method for directly attaching the chips to the frame and directly attaching the memory module according to the wafer of the present invention, which ^ ρΓΪ The following steps are provided in the system: a wafer is provided, the wafer is provided with a plurality of memory two: a slice; the wafer is cut to form a plurality of individual memory wafers, and a mother C memory wafer is formed with a lead end; Provide a memory module. The base module of the 5th memory module module has a wafer attachment surface, and a plurality of frame bases are formed on the surface, and a contact end is formed in the frame bases; a predetermined number is attached. The memory chips to the frame bases of the memory module substrate make the lead ends of the memory chip and the contact ends of the frame bases conductive; the first module test is in the memory module. The memory on the substrate = slices. When the first module test, the bad memory chip can be called j, and then the second module test is performed; preferably, another —The burn-in test can be implemented in wafer type or module type. [Detailed description of the invention] With reference to the attached drawings, the present invention will enumerate the following embodiments: According to a specific embodiment of the present invention, as shown in Figures 3 and 4, a crystal straight # 妾 paste memory The body module system mainly includes a memory module substrate 丨 and a plurality of memory chips 1 2 0, among which the memory chips J 2 0 are SJRAM [Synchronous Dynamic Random Access Memory], DDR DRAM [Multiplier , DDR SDRAM], DDR SDRAM [Synchronous Rate Dynamic Random Access Memory], Rambus DRAM or flash [Flash Memory], etc., are formed in each memory chip 120 series The plurality of lead-in ends 121 'The lead-in ends 121 may be flat or convex. The memory module US board 1 30 is a small board-shaped or strip-shaped printed circuit board.

1220785 V. Description of the invention (6) A plurality of circuit layers [about 4 to 8 layers or more], one side of the memory module substrate 130 is formed with a plurality of gold fingers 131 [gold finge] r] for When inserted, it is connected to another electronic component, such as a motherboard. In this embodiment, 'the memory module substrate 130 is a DDR DIMM substrate [Double Data Rate Dual In-line Memory Module], which has 184 Gold finger, however, the present invention does not limit the memory module substrate, the number of gold fingers, and the memory module substrate 1 30 may also be SDRAM [Synchronous Dynamic Random Access Memory], f 1 ash [ Flash memory] or other memory module substrates, the memory module substrate 1 3 0 and a gold finger 1 3 1 on both sides of each side is formed with a buckle slot 1 3 2 for insertion and positioning and Stable, the memory module substrate 1 30 has a wafer attaching surface 1 33, the wafer attaching surface 133 is formed with a plurality of frame bases 140, and each frame base 140 has electrical contact ends 1 4 1 , Corresponding to the lead ends 1 2 1 of the memory chip 1 2 0, and the contact ends 1 4 1 are via The internal circuit of the memory module substrate 丨 3 〇 is connected to the gold finger 1 31, the frame bases 140 can be integrally formed on the frame edge [copper] of the memory module substrate 130 It is a separately installed plastic adapter, ceramic adapter or film adapter for the positioning of the memory chip 1 2 0 when directly attached, so the memory chip 1 2 0 is positioned at the frame J 4 〇, no packaging materials or fillers may be required. In addition, after module-level testing, defective direct-attach chips can still be replaced. Preferably, the memory module further includes a positioning cover 1 50, such as The metal cover plate or the plastic cover plate, the positioning cover 15 0 has a pressing surface 15 1. If it is a convex plane, it corresponds to the frame seat 1 4 0 of the memory module substrate 1 3 0. When the fixing bolt passes through the coupling hole 134 of the memory module substrate 130, the positioning cover 50 is tight

Page 9 1220785 V. Description of the invention (7). The memory module substrate 1 3 0 is attached to the memory module substrate 1 3 1 and the memory chips 1 2 0 are closely fixed to the frame bases 1 2 0. 40, has the effect of stabilizing the memory chip I 2 0 and improving the heat dissipation of the memory chip 120. The manufacturing method of the chip directly attached to the memory module of the present invention is to manufacture the above-mentioned memory module, as shown in FIG. 5, and the steps are mainly packaged to include the "provide a wafer" 1 11 "Wafer dicing" 11 3. "Providing a memory module substrate" 11 4. "Attaching a chip to the substrate" 11 5 and "First module test" 1 1 6 of which, in "Providing a wafer" In step 111, a wafer is provided, which has a plurality of memory chips. Preferably, after the step of "providing a wafer" Π1, a "burn-in test" 11 2 is performed, and φ is about 1 2 In the temperature environment of 5 ~ 150 ° C, a voltage higher than the normal operation of the memory [-2. 5 V] is applied to the wafer to damage the early defective memory chip on the wafer. "Memory chip" refers to a memory chip that cannot be used for a long time, and is easy to be damaged internally during the warranty period of semiconductor products. It should be removed from good products as much as possible. According to the "bath curve" theory, chips that have undergone burn-in test will be able to be used. Effectively reduce the early failure rate of the memory, in addition, the "burn-in The "test" 11 2 can also be performed on the memory module substrate 130 after the "attach the wafer to the substrate" step 11 5. In the "wafer dicing" step 11 3, the wafer is cut into a plurality of numbers. Individual memory chips 120. ⑩ In the steps of “Providing a memory module substrate” 11 4, a memory module substrate 1 3 0 is provided, and a plurality of frames are formed on the wafer attaching surface 1 3 3 of the memory module substrate 1 30. Block 1 40; In the step of "attaching a wafer to a substrate" _ II 5, it is obtained from the wafer a proper number of plural

Page 10 1220785

Brother memory chip 120 (such as 2, 4, 8, 16, 32, or other numbers), and is attached to the frame base of the memory module substrate 130, 4 0, and by the frame base 4 0. Mouth, and make the lead terminal 12 of the memory chip 1 2 0 electrically connect to the contact pad 1 4 1 of the frame base 1 40; and then perform the "first module test" 丨丨 6 steps 'as shown in FIG. 6' is a memory module test machine mold f to test the memory module substrate bonded to the chip 120 丨 30, the memory module test machine There is a test substrate 丨 6 〇, when the memory module substrate 130 is inserted into the test substrate 16 〇 slot 丨 61, the memory module substrate 1300 gold finger 1 3 1 It is electrically connected to the module test machine for performing module-level tests that can be repaired. In addition to the slot-type test machine, the probe-type test machine can also be used to test the chips at the module level.丨 2 〇; In the "first module test" 1 16, if a bad memory chip is measured, then perform the "replacement chip" step 1 1 7 based on the first module test Result 'Remove the bad memory chip 1 2 0 in the memory module substrate 1 3 0 frame 1 4 0 and replace it with another memory chip, preferably the memory of 5' The body chip is a known good chip [K η 〇w η Good Die, KGD]; after the 117 steps of "replace the chip", it is better to 'perform the "second module test" 11 8 to use the memory module Group test machine module tests the replaced memory module substrate 1 30. The memory module substrate 1 30 is connected to the socket 1 71 or other probes of the test substrate 170 to confirm the quality. And for the classification judgment; finally, the "installation cover" 11 9 project is performed, and a positioning cover 150 is installed on the memory module substrate 130 to improve the heat dissipation and stability of the memory chips 120. Sex. Therefore, the manufacturer of the chip directly attached to the memory module according to the present invention

Page 11 1220785 V. Description of the invention (9) The legal system effectively integrates the packaging process and the module assembly process, and uses module-level testing to ensure the electrical connection between the chip 1 2 0, the memory module substrate 1 3 0 and the above. Sexual connection lines, etc., and eliminate the glue filling step. The protection scope of the present invention shall be determined by the scope of the appended patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. . : Ug

1220785 on page 12 Brief description of the drawings [Illustration of the drawings] Figure 1 • A manufacturing method of a conventional chip directly attached to a memory module Figure 2 • A cross-sectional schematic diagram of a conventional chip directly attached to a memory module, ·: Figure 3 • An exploded view of a chip directly attached to a memory module according to a specific embodiment 5 of the present invention y Figure 4 • According to a specific embodiment 5 of the present invention, the chip is directly attached to a memory module Sectional view of the group Figure 5 • According to the present invention-specific embodiment 5 The manufacturing flow chart of the chip directly attached to the memory module j and • Figure 6 • According to the present invention-specific embodiment 5 The chip A cross-sectional view of a direct-attached memory module in a sub-module test manufacturing step. [Illustration of drawing number] 11 Provide a wafer 12 No. One wafer test 13 Aging test formula 14 Second wafer test 15 Wafer dicing 16 Provide memory module substrate 17 Directly attach the chip group to the substrate 18 Package 20 Chip group 21 Chip 22 Bump 30 Module substrate 40 Packaging material (i 111 provides wafer 112 burn-in test 113 wafer cutting 114 provides memory module substrate 115 attaches the wafer to the substrate-116-second module test 117 replacement wafer

Page 13 1220785

Brief description of drawings on page 14 118 Second module test 119 Mounting cover 120 Chip 121 Leading end 130 Memory module substrate 131 Gold finger 132 Buckle groove 133 Wafer attaching surface 134 Bonding hole 140 Frame base 141 Contact End 150 positioning cover 151 pressing surface 160 test substrate 161 slot

Claims (1)

1220785 VI. Scope of patent application [Application for patent 1, 1. A crystal-memory sticking surface end; and a plurality of frame bases, each connected to the corresponding 2, such as the application group, it should be another positioning cover base for 3, such as application Group, of which 4, such as the application group, of which 5, such as the application group, the range of which is directly attached to the memory module, the body module substrate 'has a plurality of frame bases formed on a crystal, the memory chip' A memory chip contacting end 6 and a patent of a frame base include a close-fitting patent model, a positioning patent model, a positioning patent model, and a number of records directly surrounding the first positioning and pressing surface. The second cover of the second cover is the first cover of the 1st body crystal. The cover is separately provided on the system with the crystal cover described in the above item 0, and is combined with, corresponding to the crystal of the wafer in these items. The bonding surface is a lead-memory module of the wafer described in the crystal-metal case described in the convex item, and includes: a sheet-attached surface, and a plurality of substrates of the chip are formed to contact the memory module substrate Number of derivatives End and electrically conducting sheet directly attached to the memory module memory module board, module board of the bezel frame memory. The film is directly attached to the plane of the memory mold. Directly attached to the memory template. The sheet is directly attached to the memory module and is flat or raised. Manufacturing method containing Qci The steps are as follows: 1. Provide a # memory chip, each of the memory chips, the wafer has a plurality of cuts to form the wafer to form a plurality of individual memory chips; Body module substrate, the memory module substrate has a Page 15 1220785 VI. Patent application scope Wafer attaching surface, a plurality of frames are formed on the surface, and contact ends are formed in the frames; a predetermined number of the memory chips are attached to the memory mold Set the frame bases of the substrate so that the lead ends of the memory chip are in contact with the contact ends of the frame base; and the first module tests the memory chips in the frame base of the memory module substrate. 7. The method for manufacturing a chip directly attached to a memory module as described in item 6 of the scope of the patent application, wherein in the first module test, when at least one memory chip is measured to be defective, another method is used. A memory chip replaces a defective chip. i. a η · 5 P- 'tear, wv V.im trace 8. The method for manufacturing a chip directly attached to a memory module as described in item 7 of the scope of patent application, which includes the following steps: the second time The module tests the memory chips on the memory module substrate after the chip replacement step. 9. The manufacturing method of directly attaching a memory module as described in item 7 of the scope of the patent application, wherein the replacement memory chip is a known good chip [Known Good Die, KGD]. 10. The manufacturing method of directly attaching a memory module to a chip as described in item 6, 7, or 8 of the scope of patent application, further comprising the steps of: providing a positioning cover having a pressing surface, Corresponding to the frame base of the memory module substrate, the positioning cover and the memory module substrate are combined, so that the pressing surface of the positioning cover closely fixes the chips to the frame bases. Page 16 1220785 VI. Scope of patent application 1 1. The method for manufacturing a wafer direct-attach module as described in item 7 of the scope of patent application, which further includes the steps of: performing a test [bur η-intest] to damage the early stage Bad record 0 memory burn-in test volume