592004 玫、發明說明： 【發明所屬之技術領域】 本發明係關於-種結合厚膜電阻及薄膜線路之印刷電 路板及其製法’尤指-種兼具印刷式電阻及高密度精細線 路之印刷電路板。 【先前技術】 以印刷電路板之製程技術而言，所形成之線路密度是 ,漸提高’相對而言’設置在電路板上的電子元件，無論 是主動式或被動式元件’其尺寸亦隨之縮+，在線路*電鲁 子元件兩者的精細度同步提高的要求之下，如何保有較佳 的生產效率是生產廠商所應考量的。 -就設置於電路板上的元件來看，最常見到的應屬被動. 兀件-電阻益。現今在電路板上的電阻器，大多是採用式 晶片式的電阻器’利用表面黏著技術（smt)黏接於印 刷電路板的線路上。惟此藉a y 4 氓此種曰曰片式的電阻器，其缺點係當 電阻器欲設於電路板上時’該晶片式電阻器係呈突出於電 路板表面而具有-定的厚度存在，對於要求輕薄電路板之# 電子裝置〒言’此類電阻器顯得較無法滿足其要求。再者 ’因使用表面點著技術亦先行於電路板之適當位置，加工 形成對應的連接銲點’就電路板之加工過程來看，亦須佔 據一定程度的作業時間’如此-來將阻礙生產線效率。 【發明内容】 係提供一種結合厚膜電 法，以印刷電阻取代習 有鑑於此，本發明之主要目的 阻及薄膜線路之印刷電路板及其製 3 592004 用晶片電阻’並配合直接錢銅（DPC)技術形成高品質 ^專膜線路’除有效提升印刷電路板之生產效率外，亦同 時兼顧產品良率。 為達成前述目的，本發明之技術手段係包含有兩階段 ，分別為厚膜電阻形成及薄膜線路形成，其中： 前述厚膜電阻之形成係具有如下步驟： 電極導體印刷，係於-基板表面之適當位置形成有成 對之電極導體，各對電極導體係為—厚膜電阻之兩接點； 電阻印刷，於前述各對電極導體之間係塗佈電阻層而# 構成一完整的厚膜電阻； .保護層印刷，係於前述電阻層表面施以—低溫介質印 刷； 緊接别述厚膜電阻之後’係於該基板上形成薄m · 線路，其包含有如下步驟： 形成鈦/銅層’係在基板表面依序錢鍍形成一鈦層及592004 Description of invention: [Technical field to which the invention belongs] The present invention relates to a kind of printed circuit board combining thick film resistors and thin film circuits and a manufacturing method thereof, especially a kind of printing that has both printed resistors and high-density fine circuits. Circuit board. [Previous technology] In terms of the printed circuit board manufacturing technology, the density of the formed circuits is gradually increasing the "relatively speaking" of the electronic components arranged on the circuit board, regardless of the size of the active or passive components. Shrinking +, under the requirement of increasing the fineness of both the circuit and the electrical components, how to maintain better production efficiency should be considered by the manufacturer. -In terms of components placed on the circuit board, the most common should be passive components. Resistors. Today, most of the resistors on the circuit board are chip-type resistors. They are bonded to the printed circuit board using surface mount technology (smt). However, by virtue of this type of chip resistor, the disadvantage is that when the resistor is intended to be placed on a circuit board, the chip resistor has a predetermined thickness protruding from the surface of the circuit board. For electronic devices that require thin and light circuit boards, it is said that such resistors are less able to meet their requirements. Furthermore, 'Because the surface spotting technology is also used at the appropriate position of the circuit board, the corresponding connection solder joints are processed.' From the perspective of the processing process of the circuit board, it must also occupy a certain amount of operating time. 'This-will hinder the production line effectiveness. [Summary of the Invention] The present invention provides a combined thick-film electrical method to replace printed wiring resistors with printed resistors. In view of this, the main purpose of the present invention is to block printed circuit boards with thin film circuits and their manufacturing methods. DPC) technology forms a high-quality ^ special film circuit '. In addition to effectively improving the production efficiency of printed circuit boards, it also takes into account product yield. In order to achieve the foregoing object, the technical means of the present invention includes two stages, namely, forming a thick film resistor and forming a thin film circuit, wherein: the formation of the foregoing thick film resistor has the following steps: The electrode conductor is printed on the substrate surface. Pairs of electrode conductors are formed at appropriate positions, and each pair of electrode conductor systems are two contacts of a thick film resistor; for resistance printing, a resistive layer is coated between the aforementioned pair of electrode conductors to form a complete thick film resistor ; The protective layer is printed on the surface of the aforementioned resistive layer—low temperature dielectric printing; Immediately after the other thick film resistors are used to form a thin m · circuit on the substrate, which includes the following steps: forming a titanium / copper layer 'It is sequentially formed on the substrate surface to form a titanium layer and
貼乾膜，係於前述銅層上方形成一乾膜； +光頜〜’於忒乾膜上方施加一具有線路圖案的y 經曝光顯影後於乾膜上形成線路圖案； 路 •、，1路電^係於“線路圖案部分經顿而形成金 餘的乾膜及銅層/鈦層 除膜/蝕刻，係去除基板上多 以形成完整的薄膜線路。 由前述兩階段的製程中 本發明之電阻係採印刷方式 4 592004 而直接形成於基板表面，配合薄膜線路的印刷製程，於印 ^電路板上幾乎是呈平面設置，令整體電路設計顯得較為 :潔’再者’因省略了於基板上鑽設、電鍍電阻導通孔的 乂驟，對於印刷電路板之前段作業程序可大幅簡化。 【實施方式】The dry film is pasted to form a dry film above the aforementioned copper layer; + light jaw ~ 'apply a y with a line pattern over the dry film to form a line pattern on the dry film after exposure and development; ^ It is based on the "pattern of the circuit pattern to form a dry film of gold and copper layer / titanium layer removal / etching. It removes a lot of substrate to form a complete thin film circuit. From the aforementioned two-stage process, the resistance of the present invention The printing method 4 592004 is directly formed on the surface of the substrate. With the printing process of the thin film circuit, it is almost flat on the printed circuit board, which makes the overall circuit design look more clean: because it is omitted on the substrate The steps of drilling and plating the resistance vias can greatly simplify the front-end operation procedure of the printed circuit board.
、，請參閱第—圖所示，為本發明之製程流程圖，可概略 分為兩大部分’前半段製程係形成厚膜電阻，而後半段製 ，係利用直接錄銅技術（DPC)形成連接該厚膜電阻: 樣線路。形成厚膜電阻之步驟依序係具有：（ 電極導體印刷（101)、高溫燒結（102)、電阻印 、高溫燒結（104)、低溫介質印刷（1 5)、高溫燒結（1 0 6)、（ 1 〇 7)清洗/乾燥等 〇 ^ 5月令阅弟 一 ”·认〜/予肤电限裂程係於 一土板/ 1 )表面之適當位置印刷有成對的電極導體（工 該電極導體（11)係、作為電阻兩端之接點，其塗 布旱度約為2 5 ± 5 u m ;塗佈完成祛，旅γ _ 步驟 成後係經一南溫燒結 5 導體（1 1)加以m燒結條件為8 b〇C/5〇min。 料閱第二圖所示，於電極導體（li)形成後，於 兩電極導體（丄"之間係塗佈上電阻層（丄2 兮 電阻層（1 2 )材料的電阻係數、塗 人 4 值’在電阻層（12)印刷完成後，同樣利用高 固化，燒結條件亦同樣為8 5 〇。。/ 5 〇 5 592004 要辛即是：：阻器的電阻值除決定於材料特性之外，另-要京即疋兩電極導體c ，舉例而 (11)之間的電阻層（⑴長度 )形狀由a ":亟導體（1 1 )之間的電阻層（1 2 辦加，相㉚ 為連巧曲折線段’其有效長度自然 曰 士的該曲折電阻之阻值亦會提高。 如第四圖所示，於前述電阻層（ -保護層（1 ” … “ 1 2 )上方係再印刷 1 3)，其厚度大約為1 δ ±3 um，因電阻 於外在裱境溫度、漭声 濕度改變下，其電阻值易產生變化，故 利用低溫介質的# I ^ 4作為一保蠖膜，以減低環境條件變化 寻斤產生的阻值改變。古玄^ ^雈 °亥保濩層（1 3 )同樣經由高溫燒 、、·σ步驟固化於電阻L ^ Μ” ％阻層（1 2 )上，並經清洗/乾燥而完成 則丰&厚膜電阻的製程。 |旱膜電阻形成後’緊接著的是印刷電路板上薄膜線 路的裝程，凊再參閱第一圖所示，其步驟包含有··賤鍵鈦 :銅（2 ◦ 1 )、貼乾膜（2 〇 2 )、曝光顯影（2 〇 3 、線路電鍍（2 0 1 )、除膜/蝕刻（2 0 5 )等，盆 中： 〆、 %參考第五A圖所示，前述濺鍍鈦，銅（2〇丄）步 驟中，主要係於基板（1 )上依序滅-鈦層（2 1 )及- 銅層（2 2 )’鈦層（2 1 )的厚度約為1 000-1 250 ， 而銅層（2 2 )的厚度則大約& 4〇〇〇 ±1〇%。 士第五B圖所示’於完成鈦/銅滅鐘後，係於前述銅 層（2 2 )上貼附以乾膜（2 3 )，乾膜（DRY FILM)是一 種對紫外線反應的聚合性樹脂，其功能係在聚合後保護線 592004 路不被蝕刻掉。 乾膜（2 3 )貼合後乃進行曝光顯影（2 〇 3 )程序 ，曝光』步驟：曝光是將線路製成一光罩（2 4 )後，先 行定位及平貼於前述乾膜（2 3 )上’再經；：線：射： 乾膜（23)產生聚合作用’而由於光罩（24)的使用 ’紫外線係無法透射光罩（2 4 )上的線路部 >，因此， 乾膜（2 3 )上未被紫外線照射的部分，將無法產生聚合 作用（如第五c圖所示）。 而顯影係利用顯影液將未產生聚合的乾膜（2 3 )( 即預定的線路圖案）去除，以物理及化學剝除方式將需要 =留的線路顯現出來，而顯露出銅層（2 2 );以前述製 程步驟所構成之線路，具有細直平整之特性。 請參考第五D圖所示，經顯露的線路圖案部份，係於 t經由一電鑛程序於銅層（2 2)上形成適當厚度的銅線 (2 5 )，而構成基本的線路離型。 之2線路（2 5)完成後’係去除基板（1)表面殘留 乾膜（2 3 )，如第五E目& $。 請參閱第五F圖所示，除了銅線路（25)以外的多 、曰（2 1 )，係利用蝕刻方式將其自 基板（1 )表®) t、/ I rr 入 ' 路。 以去除，如此即形成第二階段的薄膜線 第、圖中所不，於已形成厚膜電阻的基板（ 面進行前述薄膜線路的製程後，各厚膜電阻之電極導體； 1 1 )係均可對應連接至薄膜線路上，惟在此須聲明的一 7 點是，本發明之厚膜電阻及薄膜線路，係可依照實際電路 設計形成於基板（1 )的單面，或是於基板雙面而構成雙 層線路板，此點並不特別加以限制。 藉由以上詳細說明，可看出本發明之技術手段因採用 了印刷式電阻，故可省略於基板上鑽設、電鍍電阻導通孔 的步驟’對於印刷電路板之前段作業程序可大幅簡化，整 體而言已具備有顯著的新穎性及進步性，於符合發明專利 要件之下，爰依法提出申請。 【圖式簡單說明】 C 一）圖式部分 第一圖：係本發明之製程流程圖。 意圖第二圖：係、本發明於—基板上形成電極導體之平面示 第三圖：係本發明於兩電極導體之間形成電阻層之示 第四圖 係本發明於電阻層上形成一 保護層之示意圖 第五A 第六圖 平面示音ρπ 疋、1¾ 五F圖：係本發明薄膜線路其製造流程圖。 係本發明於基板形成厚膜電阻及薄膜線路之 (二）元件代表符號 ^ 1 )基板 (12)電阻層 (21)鈦層 (11)電極導體 (1 3 )保護層 (2 2 )鋼層 592004 (23)乾膜 （24)光罩 (2 5 )銅線路 (1 0 1 )電極導體印刷 ( 1 0 2 ) ( 1 0 4 ) ( 1 0 6 )高溫燒結 (1 0 3 )電阻印刷 (1 0 5 )低溫介質印刷 (1 0 7 )清洗/乾燥 (201)濺鍍鈦/銅 (2 0 2 )貼乾膜 (2 0 3 )曝光顯影 (2 0 4 )線路電鍍 (2 0 5 )除膜/蝕刻Please refer to the figure below for the process flow chart of the present invention, which can be roughly divided into two parts: the first half of the process is to form a thick film resistor, and the second half of the system is formed using direct copper recording technology (DPC). Connect this thick film resistor: sample line. The steps for forming a thick film resistor are: (electrode conductor printing (101), high temperature sintering (102), resistance printing, high temperature sintering (104), low temperature medium printing (1 5), high temperature sintering (106)), (1 07) Cleaning / drying, etc. ^ May ordering the first one "· Recognition ~ / Pre-skinning electric crack limiting process is on a soil plate / 1) Paired electrode conductors are printed at appropriate positions on the surface The electrode conductor (11) is used as the contact point at both ends of the resistor, and its coating dryness is about 2 5 ± 5 um; after the coating is completed, the γ _ sintered 5 conductors (1 1) The sintering conditions are 8 b〇C / 5〇min. As shown in the second figure, after the electrode conductor (li) is formed, a resistance layer (丄 2) is applied between the two electrode conductors (丄 "). After the resistive layer (12) is printed, the high resistivity is also used, and the sintering conditions are also 8 5 〇. / 5 〇 592004 Yes: In addition to the resistance of the resistor depends on the material properties, the other is to make the two electrode conductors c, for example, and the resistance layer between (11) (⑴ The length) shape is formed by a resistance layer (1 2) between the conductors (1 1), which is a coincident meandering line segment. Its effective length naturally means that the resistance value of the meandering resistance will also increase. As shown in the fourth figure, the above-mentioned resistance layer (-protective layer (1 "..." 1 2) is further printed 1 3), and its thickness is about 1 δ ± 3 um. When the humidity is changed, the resistance value is likely to change. Therefore, # I ^ 4 of the low-temperature medium is used as a protective film to reduce the change in resistance caused by changes in environmental conditions. Gu Xuan ^ ^ 雈 ° 亥 保 濩The layer (1 3) is also cured on the resistor L ^ M ″% resist layer (1 2) through a high-temperature firing, σ step, and is washed / dried to complete the process of thick & thick film resistors. Immediately after the resistor is formed is the process of mounting the thin-film circuit on the printed circuit board. Refer to the first figure again. The steps include: • low bond titanium: copper (2 ◦ 1), dry film (2 〇). 2), exposure and development (203), circuit plating (201), film removal / etching (205), etc., in the basin: 〆,% Refer to the fifth A As shown, in the foregoing step of sputtering titanium and copper (20 丄), the -titanium layer (2 1) and-the copper layer (2 2) 'titanium layer (2 1) are mainly sequentially destroyed on the substrate (1). And the thickness of the copper layer (2 2) is about & 4000 ± 10%. As shown in Figure 5B, after the titanium / copper quenching is completed, the A dry film (2 3) is attached to the aforementioned copper layer (2 2). The dry film (DRY FILM) is a polymerizable resin that reacts to ultraviolet light, and its function is to protect the 592004 road from being etched away after polymerization. After the dry film (2 3) is bonded, it is subjected to an exposure and development (2 0 3) procedure. The exposure step is: after the exposure is made into a photomask (2 4), it is first positioned and flatly pasted on the dry film (2). 3) On the 're-pass ;: line: shot: dry film (23) produces polymerization' and because of the use of the photomask (24) 'ultraviolet light cannot pass through the circuit part on the photomask (2 4)', therefore, The portion of the dry film (2 3) that is not irradiated with ultraviolet light will not be able to polymerize (as shown in Figure 5c). The developing system uses a developing solution to remove the non-polymerized dry film (2 3) (that is, a predetermined circuit pattern), and physically and chemically strips the exposed remaining circuits to reveal the copper layer (2 2 ); The line formed by the aforementioned process steps has the characteristics of thin, straight and flat. Please refer to the fifth figure D. The exposed part of the circuit pattern is formed by a copper wire (2 5) of appropriate thickness on the copper layer (2 2) through an electrical ore process, which constitutes the basic circuit separation. type. After the completion of the second circuit (2 5), the remaining dry film (2 3) on the surface of the substrate (1) is removed, such as the fifth E & $. Please refer to the fifth figure F. In addition to the copper circuit (25), there are many (2 1), which are etched from the substrate (1) table ®) t, / I rr into the circuit. In order to remove, in this way, the second stage of the thin film line is formed. As shown in the figure, after the thick film resistor has been formed on the substrate (the surface of the thin film resistor is processed, the electrode conductors of each thick film resistor; 1 1) are all It can be connected to the thin film circuit correspondingly, but one point to be stated here is that the thick film resistor and thin film circuit of the present invention can be formed on one side of the substrate (1) according to the actual circuit design, or on the substrate. It does not specifically limit this point to form a double-layer circuit board. From the above detailed description, it can be seen that the technical means of the present invention adopts printed resistors, so the steps of drilling and plating resistive vias on the substrate can be omitted. As far as it is concerned, it has already possessed significant novelty and advancement. Under the requirements of invention patents, it has filed an application in accordance with the law. [Schematic description] C a) Schematic part The first diagram: a process flow chart of the present invention. The second diagram is intended: the plane of the present invention forming an electrode conductor on a substrate is shown in the third diagram: the diagram of the present invention forming a resistance layer between two electrode conductors the fourth diagram is the invention forming a protection on the resistor layer Schematic diagram of the layers. Fifth A. Sixth. Plane sounds ρπ 疋, 1¾. F. F: These are the manufacturing flowcharts of the thin film circuit of the present invention. (2) Element representative symbols for forming thick film resistors and thin film circuits on a substrate according to the present invention ^ 1) Substrate (12) Resistance layer (21) Titanium layer (11) Electrode conductor (1 3) Protective layer (2 2) Steel 592004 (23) Dry film (24) Photomask (2 5) Copper line (1 0 1) Electrode conductor printing (1 0 2) (1 0 4) (1 0 6) High temperature sintering (1 0 3) Resistance printing ( 1 0 5) Low temperature media printing (1 0 7) Cleaning / drying (201) Sputtered titanium / copper (2 0 2) Dry film (2 0 3) Exposure development (2 0 4) Circuit plating (2 0 5) Film removal / etching
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