TW556252B - Transportable container including an internal environment monitor - Google Patents

Abstract

A system is disclosed allowing non-invasive, continuous local and remote sensing of the internal environmental characteristics of transportable containers. The system utilizes a variety of sensors inside the container to sense internal environmental conditions.

Description

556252 Fifth, the application of the invention claims priority to the application of Miyazaki, which has priority over the United States Provisional Patent Application No. 60/261, 〇35, filed on January 10, 2001, and named as containing a built-in The smart wafer box of the surveillance system is incorporated here with reference items. BACKGROUND OF THE INVENTION The present invention relates to the manufacture of semiconductor wafers, and is particularly directed to a system that allows a movable container to have non-invasive, continuous local and remote measurements of internal environmental characteristics. '-Description of related technologies, a standard mechanical interface (SMIF) system proposed by Hewlett-Packard Company, has been disclosed in U.S. Patent Application Nos. 4, 532, 97 0 and 4, 534, 389. SMIF System The goal is to reduce part ic! Ef luxes to semiconductor wafers (" wafers) during the entire semiconductor manufacturing process during wafer storage and transfer. This can be partially accomplished by mechanically verifying that during the storage and transfer, a gaseous medium (such as air or nitrogen) surrounding the wafer is stationary relative to the wafer, and that particles in the surrounding air will not enter Adjacent wafer environment. This environment can be considered a "clean environment" here. 、 \ A SMIF system has three main components ^: (丨) closed wafer box for storing and transporting wafers and [or] wafer boxes:; 5 (2) —input / output (丨 / 0) The mini-clean environment is placed in a semiconductor processing tool to provide a clean space (filled with clean air) to transport exposed wafers-and / or wafer cassettes back and forth inside the processing tool; (3)-the interface is used to Wafer Carrying Box and smIF Mini Jie-4-a tmWms) A4 ^ (210 χ 297 mm) 556252, * A7 _ B7 V. Description of the Invention (2) Between the clean environment, transport wafers and / or wafers Cassette without contaminating exposed wafers and / or wafer cassettes. A proposed SMIF system is further described in a paper entitled "SMIF ··-A Technology for Wafer Box Delivery in VLSI Manufacturing", a solid-state technology journal by Mihir Parikh and Ulrich Kaempf, July 1984 111 to 115 pages. The SMIF wafer transfer cassette usually includes a wafer cassette lid (pod d00r) and a wafer housing to provide a closed environment for wafer storage and transportation. " Back-open type wafer box 100, as shown in FIG. 1A, the wafer box cover 101 is horizontally placed on the bottom of the wafer box 100, and is matched with the upper wafer housing 10. 3. The wafer is supported by the wafer cassette 105, and then transferred to the wafer cassette cover ι01. The open-type wafer box 110, as shown in FIG. 1B, can also be called a front-opening centralized wafer box, or FOUPs for short. It includes a wafer box cover m, which is placed on a vertical plane, and Cooperates with the wafer case 113. The wafer (not shown) is not supported by a wafer cassette (not shown) loaded in the wafer housing 113, or it is supported by a shelf. In order to transport wafers from a back-open or front-open wafer cassette to a process tool 505 (FIG. 5) in a wafer manufacturing facility, wafer cassettes have traditionally been manually or automatically loaded onto a load port assembly line port assembly) 507 (Figure 5) The knife is basically not placed on the process tool, or it is part of the process tool 505. The load port assembly line 507 includes an access port, which is covered by a port door cover (not shown) without a wafer box. When loading a wafer cassette on the load port assembly line 507, the wafer cassette lid is aligned with the port door lid in the rear-open and front-open systems. ： Once the wafer cassette is placed on the load port assembly line 507, the paper size inside the door cover is -5- suitable paper standard (CNS) Α4 specifications _ χ 297 public director) 556252 I A7

The mechanism prevents the port door cover on the wafer housing from being locked, and moves the wafer box cover and the port door cover to a position where the processing tool 405 can access the wafer. The wafer case is maintained near the currently exposed access port, so that the inside of the process tool and the wafer case are kept in a clean environment. In the rear-open system, the port door cover with the wafer box cover 101 and wafer-carring cassette 105 support is lowered to the load port assembly line 507. The wafer handling robots within the load port assembly line 507 or the process tool 505 will thus access specific wafers from the wafer cassette for transport between the wafer cassette and the process tool. In the front-open, system, the wafer handling robot can directly access the wafer from the wafer housing 113 to transport between the wafer cassette 110 and the process tool 505. These types of systems protect the wafer from particulate contamination. Particulates can cause considerable damage in the semiconductor process because of the use of small-sized semiconductor component process technology. Usually advanced semiconductor processes use 1.5 micron or smaller technologies. Unnecessary contamination particles are larger than 0.1 micron, in fact, will interfere with semiconductor components of 1 micron. Of course, the size of smaller semiconductor components is a trend, and today's R & D laboratories have reached 0.1 micron or smaller. As component sizes continue to shrink, contaminating particles and molecular contaminants have become a concern in semiconductor manufacturing processes. #Wafer passes through a process and contamination can occur from several sources. For example, during the process, certain gases, liquids, pressures, related or unboxed light, vibrations, electrostatic charges, and contaminants can affect the final yield of a semiconductor. Therefore, it is important to control these parameters in the wafer box during the manufacturing process. According to the previously discussed SM IF technology, the environment inside the sealed wafer box is already showing -6- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 556252 A7

To enhance the ability of the manufacturer to control the surrounding environment of the semiconductor wafer. However, the 'Crystal 11 box will often be opened' while automatically performing wafer transport and manual operations by technicians on the load port assembly line, such as during wafer box cleaning ° and 'Case contains many valves' to allow liquid to seal the crystal Shipped back and forth on round boxes. Here, each operation and the characteristics of the wafer box are in the box, and the pair + conductor wafer # may be a potential source of contamination. Everyone knows that when performing wafer batch testing, it is necessary to randomly or select the problematic wafer box to test the internal environmental characteristics when or after the components are formed on the wafer. When this operation can identify problems after they have been established, the known test system will not indicate when or where the problems occurred. Therefore, this test operation is often performed too late to prevent wafer contamination. Moreover, when one of the contaminated wafer cassettes is allowed to continue through the process, it usually contaminates other process tools and wafer batches. Traditional testing methods still do not identify areas within the manufacturing equipment that cause contamination to the wafer. So there is an idea to provide an apparatus and method for proactively monitoring the environment within a wafer cassette and a process station. SUMMARY OF THE INVENTION The present invention is broadly described and includes a mobile container having an internal environment that isolates the surrounding air. The movable container includes a detector for monitoring the internal environmental characteristics in the wafer cassette and transmitting the monitored data. The removable container also includes a power supply to provide power to the debt detector. ;; On the other hand, the size of the removable paper used to monitor the internal environmental characteristics of the movable container applies the Chinese National Standard (CNS) A4 specification (210X 297 public directors) 556252 A7 __ B7 V. Description of the invention (5) Monitoring system with an internal environment that isolates the surrounding air. The mobile valley monitoring system includes a detector to monitor the status of the internal ring characteristics in the wafer cassette and transmit the monitored data. The system also includes a transceiver that communicates with the detector to receive and transmit data from the detector. On the other hand, a removable container with an internal environment that isolates the surrounding air has been provided. This movable container includes multiple detectors, each of which is within the movable container, monitors different internal environmental conditions, and transmits monitoring to the conditions. The transceiver can also be included in a removable container, which can receive and transmit data from the detector. 'On the other hand, a network of detectors has been provided to monitor the internal environmental conditions in removable containers. The detector network includes a network bus, a transceiver connected to the network bus, multiple network node network buses, and multiple detectors. The detector is connected to a network bus, and the detector monitors the internal environmental conditions in each detector. It also provides information about internal environmental conditions to the network bus. In a further aspect, the present invention includes a method for monitoring the internal environmental conditions within a container as the container passes through a manufacturing facility. The steps of this method include inside the container with a detector to monitor the internal environmental conditions? Generate data related to the surveillance situation 'and send that data to a remote location. The diagram briefly illustrates that the present invention will now be described in terms of numbers, in which: FIG. 1A is a schematic diagram of a rear-opening wafer cassette; FIG. 1 β is a schematic diagram of a front-opening wafer cassette; -8- 556252 5. Description of the invention (6) Figure 2 疋 A schematic perspective view of a wafer cassette including an internal detector network according to a specific embodiment of the present invention; Figure 3 is a general detector using micro-electromechanical technology 4 is a block diagram of a system architecture according to a specific embodiment of the present invention: and FIG. 5 is a block diagram of a wafer manufacturing equipment including a movable wafer cassette monitoring system of a specific embodiment. A detailed description of specific embodiments of the present invention is described below in the semiconductor wafer manufacturing process, SMIF wafer transfer box used to transport semiconductor wafers. However, everyone is aware that specific embodiments of the present invention may be used with removable containers instead of SMIF wafer transfer cassettes. For example, specific embodiments of the present invention may be related to semiconductor bulk boxes and wafer boxes used to transport unfinished products, rather than semiconductor wafers, such as reticles and flat panel displays. It is better understood that specific embodiments of the present invention are compliant and comply with all applicable SEMI standards. However, everyone has noticed that other possible embodiments of the present invention may not comply with the SEMI standard. FIG. 2 illustrates a block diagram of a specific embodiment of a movable container monitoring system 2000 including a movable wafer cassette: 201 and an internal detector network 200. Various specific embodiments of the mobile container monitoring system OO provide non-intrusive, continuous local and remote detection of internal environmental characteristics. The movable wafer cassette 201 in FIG. 2 may be any type of wafer cassette, such as a rear-opened wafer cassette, a front-opened wafer cassette, and the like. As shown above, the removable container's • 9-this paper size is suitable for wealth 0ϊϋ ^^ 4_ (2ι () χ 297 公 爱) 556252 A7 B7 V. Description of the invention (7) The type is not relevant to the specific embodiment of the present invention Important, while other removable containers, wafer cassettes, and SMIF may be used. The size of the unfinished product to be transported in the wafer cassette and other embodiments may vary, but may be 200mm or 300mm wafers, for example. The internal detector network 202 includes detectors 204. Each detector is included in or attached to a removable wafer cassette 201. A built-in power supply 406 (Figure 4) is used to provide Power is supplied to various detectors, and an internal transceiver 208 is used to receive and forward data from the detector 204. In a specific embodiment, the internal transceiver may include a memory (not shown) for storing data received from the detector. May-The mobile container monitoring system 2000 may also include an external transceiver 210 for receiving and forwarding data from the internal detector 208. As explained below, the internal transceiver 208 may be omitted in other possible specific embodiments. In addition, the external transceiver 210 can be configured as part of a host computer 418 (FIG. 4). Each detector 204 may be a known construction and range from a < simple analog detector to a more complex detector operating in accordance with micro-electromechanical (MEMS) technology. More complex detection The detector may include an integrated converter-detector element and a digital signal processor (" DSP '') to provide embedded sampling, analysis, and reporting of all data in the detector 204. The gray detector The templates can be those used for spectroscopic research, rotator positioning, image detection, chemical composition detection, and residual gas analysis. A block diagram of a specific embodiment of the detector 304 using MEMS technology is shown in Figure 3. In addition, Can include memory to store data.:; Detector 204 is distributed in removable wafer cassettes in various configurations 2101 -10-This paper size applies to China National Standard (CNS) A4 specifications (210 X 297mm) 556252 A7 B7 V. Description of the invention (8) around. The detector 204 can be mounted to the movable wafer box housing 21 3 so that it will not interfere with the placement of the movable wafer box 201 Wafers in or out of wafer cassette 201 Everyone also intends to provide more than one detector 204 'or detector input to detect a single internal environmental characteristic at different locations or areas in the movable wafer cassette 201. Figure 4 is a description of the detection A block diagram of a specific embodiment of the detector network 401. It is generally understood that various control network protocols can be used to collect messages from various detectors and send messages to remote locations, such as a process Host computer 418. In a specific example, the control network can be implemented by Lonfforks® from Echelon®.-This system uses a number of points 414a '414b located in a movable b box 2 01, 414c. This node also connects various detectors 404a, 404b, 404c, power supply 406 and internal transceiver 408 to each other via the network bus 416. The servers 404a-404c are similar and related to the description The detector 204 in Fig. 2. Similarly, the internal transceiver 404 is similar to the internal transceiver 208 in Fig. 2. The detectors 404a-404c include a temperature detector 404a for detecting temperature, Seismometer 404b to detect Motion and vibration, and a humidity test 404c, used to detect the relative humidity in the movable wafer box 201. This specific embodiment is just a model, and the movable box 201 may include fewer detectors Or some additional detectors are combined with all, some, some, or no detectors 404a-404c to detect various other internal environmental characteristics. The temperature detector 404a may be a wafer mounted Analog or digital temperature detector in box 201. It is generally known that more than one detector like this can be used. -11- This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) 556252 A7 _______B7 5 The invention description (9 ~ " is used to determine whether the temperature gradient occurs in the wafer cassette 201. If the ballast detector 204a is an analog detector, an analog-to-digital converter may be provided to convert the sampled analog temperature to digital representation. Alternatively, a digital temperature detector can be used. For example, a MIC384 two-zone thermal monitor from Micre 1 Company, San Jose 'CA 95131 can be used. The detector comes in a small, low-cost package, including a built-in processor and memory. The detector 404a further includes additional channels for detecting the temperature of different regions in the wafer cassette 201. Each channel may be placed in a different location in the wafer cassette 201 to detect different temperatures in the region. The temperature detector 404a is connected to the node 414a and includes a processor, such as Motorola® Neuron 3150, and a detector bus interface, such as the Echelon® FTT-10A twisted pair transceiver, which Pass the message to the network bus 416. Seismometer 404b can provide vibration and vibration debt measurement in a removable wafer cassette 201. A sample of this detector 404b is used to match a specific example of the present invention with an analog output type uniaxial seismometer, MEMSIC, Inc. Andover, MA 01810, model MX1010C. The detector can measure acceleration along an axis from 1 to 10 g, and convert the measured value into a bit signal through a built-in analog-to-digital converter. Detector 4041) may include additional channels to allow vibration and vibration to be detected along other axes. It is generally known that other detectors can be used to detect vibration and vibration. For example, known piezoelectric detectors can be used to convert acceleration to a measurable voltage. The seismometer 404b is connected to the node 414b, and preferably includes a processor, for example, -12- this paper size applies the national standard (⑽) M specification (21GX 297 public director)-556252 A7 B7 5. Description of the invention )

The Motorola® Neuron 3150, and a detector bus interface, such as the Echelon® FTT-10A twisted pair transceiver, are used to pass messages from the temperature detector 404a to the network bus 416. A specific embodiment of the present invention may also include a humidity detector 404c. The humidity detector 404c may be an analog or digital detector mounted on the housing of the wafer cassette 201. The digital humidity detector 404c used in a specific embodiment of the present invention is a HIH related series humidity debt detector manufactured by Honeywel 1, Morristown, NJ 07962. The humidity detector 404c includes a single channel for measuring #humidity in the wafer cassette 201. Other possible humidity detectors may include additional channels for measuring humidity in different areas within the wafer cassette 201. Humidity detector 4 0 4 c connected to node 414 c includes a processor, such as Motorola® Neuron 3150, and a detector bus interface, such as Echelon® FTT-10A twisted pair transceiver for detecting temperature The detector 404c sends a message to the network bus 416. According to the above, wafer box 201 may include additional analog or digital debt detectors to detect other conditions (such as pressure, gas composition, gas particles, static electricity) in wafer box 201. Organization, exposure, vibration, electromagnetic light emission, wafer oxidation changes, electrolysis, etc.), each can be connected to the network via a network node. The wafer cassette 201 may also include a detector to determine its position within the manufacturing equipment. The position detector ^ may use a Global Positioning System (’GPS "), an internal tracking system, or other types of location tracking technology. The round box 2 01 can also include a reset mechanism to clear the data collected by the debt detector and return the detector to a neutral state. The reset mechanism can be -13- This paper size applies to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) 556252 • A7 factory _B7 V. Description of the invention (11) It is a machine on the wafer box 201 Switch, a software reset program provided by the host computer 418, or built into the detector network, or the detector can be automatically reset at a predetermined position in the manufacturing facility, or on a predetermined event, such as One wafer box is clean. In addition, resetting can be applied to any combination of detectors, not all detectors need to be reset. The power supply 406 supplies power to each of the detectors 404a-404c, the detector nodes 414a-414c, and the internal transceiver 408. The power supply 406 can be placed on the outer surface of the wafer case, and is connected to various different testers via a network bus 416. The power supply 406 can alternatively be placed in the movable wafer cassette 201. The power supply 40-6 may be of a known construction, and may include a tightly diversified energy source 'such as a rechargeable battery pack or a nine-volt alkaline battery pack. The power supply may further include a regulating circuit 'as is well known in the art. In a specific embodiment, one or more of the detectors may include a built-in power supply, thereby reducing the need for the power supply 406 'or allowing the power supply 406 to be omitted entirely. When required by various nodes and detectors, the power supply 406 can provide power to each detector node via a network bus 416. Alternatively, the power supply 406 can be connected to a node 414a-414c, as described above, and the power supply 406 included in the detector network allows the power supply 406 to be monitored. The internal transceiver 408 can be located anywhere in the removable crystal box 201 and communicates with the external transceiver 410. The internal transceiver 408 can communicate with the external transceiver 410 for any type of wireless data transmission. For example, electromagnetic radiation can be used for communication, such as infrared (about 10u Hz to -14- this paper size applies to Chinese national standards (cnsTT4 specification (210 x 297 public love) 556252 A7 B7) 5. Description of the invention ( 12 10 "Hertz), radio waves (approximately 3 仟 Hertz to 300 仟 Hertz) (eg: FM (FM), AM "), radar, RF Communication services (" PCS "), etc.) and ultra-low frequency (about 0 Hz to 3 GHz). Specific embodiments of RF systems can use analogy, code division multiple access (" CDMA "), time sharing Multiplex Access (" TDMA "), Cellular Digital Packet Data (" CDPD "), or any other RF transmission protocol. The transceiver 408 can be connected to the detector network 401 via a main bus 420 The network nodes 414a-414c can be configured as a master-slave network, where the master bus 420 acts as a gateway or router / for receiving data from each node 414a-414c, and forwarding-forwarding Message to external transceiver 41. In one other possible In the embodiment, individual nodes may be very complicated, so the network may be configured as a dock-dock network. In this specific embodiment, the 'transceiver 408 and the main bus 4 2 0 may be omitted, and each The individual detector points 414a-414c can directly communicate with the external transceiver 410 using any of the above-mentioned electromagnetic radiation frequencies. _ Main sink> 70 «row 420 merges immediately next to the network nodes 414a-414c to form a A gateway or router is used to transfer data via a data collection and a digital signal processor (" DSP "), such as TMS 320C30 of Texas Instruments®. ^ Data transmission to external transceiver 410, it Whether it is transmitted by the internal transceiver 408 or directly from the detectors 404a-4 (ftc), either continuously or intermittently. If the data is transmitted intermittently, 'it may not be stored in the memory of the detector ， Or in the internal memory of the internal transceiver 4 d8 and use packet transmission, such as: CDPD technology. -15- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 556252

Alternatively, the data can only be transferred, if the corresponding internal surrounding conditions exceed the predefined required operating range. In this specific embodiment, the k material itself may be transmitted, or only a warning signal may be transmitted, thereby identifying that the internal characteristics in the wafer cassette are beyond the required operating range. In a specific embodiment, an audible alarm can be activated, thereby alerting the manufacturing equipment operator that the environmental conditions inside the wafer cassette 201 are not within the required operating range. In addition, if the detector data is stored on the above-mentioned wafer cassette 201 memory, the data can be read later by a computer to determine which type of environmental conditions have exceeded the scope of operation, as well as equipment laws and what Time and location are contaminated. 'In another specific embodiment, the data is transmitted from the wafer cassette 201 after following an external request instruction. For example, the host computer 418 (FIG. 4) sends a status request command to the wafer cassette 201 at a predetermined time interval, for example, every 10 seconds. The wafer box 2 01 transmits the current tester data to the host computer 418 according to the status request command. Certain FOUPs now operate with IR tags or RF pills, and can receive information about various unfinished products in the wafer box and messages passed to the manufacturing host computer 418 to identify unfinished products in the wafer box. When they are inside the manufacturing facility, they pass through various stations. This IR tag and the system using it have been described in U.S. Patent Nos. 5,097,421, 4,974,166 and 5,166,884 'Examples by Maney et al. +. This RF pills and the system using it have been described in the examples of U.S. Patent Nos. 4,827,110 and 4,888,473, Rossi et al., And U.S. and Chinese Patent Nos. 5, 339,074, Shindley. Each of the above identification patents has been designated as the present invention -16-This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) 556252

The owners are each incorporated by reference here. In other possible specific embodiments of the present invention, the IR tag or RF piu performs the function of the transceiver 408 to receive signals from various detector nodes 414a-414c, and to pass messages to the external transceivers 41o and [or ] Host computer 418. Various detector nodes 414a-414c and main bus 420 are connected to each other via a network bus 416. The network bus is connected to the bus by a micro 5-wire. It can connect to power (+ v, -v) and transmit and Receives (tx, rX) signals and includes an electromagnetic protection shield. The network bus 4Γ6 may be a slender and elastic flat ribbon 'adhered or embedded in the housing of the movable wafer box 201, and is branched to various nodes during manufacture. Alternatively, the network bus 416, the detector 404, and the internal transceiver 408 can be glued to the existing wafer cassette and hermetically closed the channel (referred to herein as " tap "). ) To the various nodes generated in the wafer box. Additional taps were also formed in the wafer cassette 201, which later allowed the introduction of additional detectors. In a specific embodiment, when a detector is added, a portion of the detector enters the tap, destroying the membrane of the network bus 416, thereby increasing the detector of the detector network. The network bus 416 can pass through the cassette housing 213 on a tap, allowing the power and information to be transmitted between the inside and outside of the cassette. The network bus 41 6 is just an example for connecting various nodes in a detector network. Other possible communication protocols include electromagnetic frequencies, fiber optics, or other methods using known topologies such as star, loop, daisy chain, or free-form configurations. As shown above, FIG. 4 is only a specific implementation of the present invention to convey the relevant information. -17- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) 556252

Example from internal wafer box characteristic information to manufacturing host computer 418. It is generally understood that industry standard networks other than LonWorks® can be used to implement a detector network 401, such as a controller area network (" CAN ") bus or TCP / IP Ethernet. Fig. 4 further illustrates that the external transceiver 41 is located on a remote movable wafer box 20 such as a load port assembly line 507 (Fig. 5). A support surface on the movable wafer cassette 201 is installed in a manufacturing room 503a-5503 (for example, on a ceiling or a wall). In a specific embodiment, each processing unit 505 may include an external transceiver 410 for receiving information from the internal transceiver 408. This message is then transmitted to the host computer 418 via a wired or wireless transmission or regional processing. When the wafer cassette is placed on the load port assembly line, since the internal and external transceivers are close to each other, this specific embodiment allows the use of a high-frequency transmission system, which basically deteriorates transmission over long distances. In addition, in the manufacturing equipment, it includes some different manufacturing rooms' usually on some different floors or in different buildings, with an external transceiver 41 on the processing tool, allowing messages to be transmitted to the host computer 418 ( Can be placed in a remote location or in a manufacturing room) from each room and / or building. In addition, the external hair dryer located on the processing tool can communicate with individual processing tools, and if the information about the introduction of pollutants is received from the wafer cassette 201, the processing tool can be immediately turned off without the host computer 418. Pass the message. Immediately disabling the processing tool can reduce the number of contaminants being introduced into the processing tool and / or reduce the number of contaminated wafers :. When the removable wafer cassette 201 includes the internal transceiver 408 and is moved to the manufacturing equipment -18- This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm)

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-Edge 556252 A7 B7 16 V. Description of the invention When in the surroundings, the internal transceiver 408 will broadcast to a different external transceiver 41o. The external transceiver 410 is connectable to a remote network node and includes a processor and a bus interface as described above. The messages received by the external transceiver 410 are collected by a data

Bit signal processor, for example: TMS 320C30 of Texas Instruments® is passed to the network node. The remote network node may also include a standard RS-232 serial communication port to pass the detector message to the manufacturing host computer 418. It is generally understood that various other known communication protocols can be used in other possible specific embodiments instead of the RS-232 interface, such as wireless transmission. In a possible other specific embodiment, the message may be passed directly to the host computer 418 from the nodes 404a-404c, thereby eliminating the need for an external transceiver 410. The host computer 418 is configured to receive data from each movable wafer cassette 201 in a manufacturing facility. The host computer 418 can continuously cycle data 'for each movable wafer cassette 201 so that reading from the wafer cassette can be discovered instantly. In another possible embodiment, the host computer 418 is configured to investigate the wafer box 201 and transmit a status request command when they pass a manufacturing process. Follow the survey to send messages about status and location. Actively investigating wafer 201 provides an additional security measurement. ^ If the wafer cassette 201 does not respond to the survey, 'The wafer cassette is either defective or not within the communication range of the host computer 418, or it is removed from the manufacturing equipment. Once the host computer 418 receives information from a particular wafer. Box The host computer 418 can perform any of a variety of different operations: * τ. For example, if one or more of the measured internal wafer box characteristics are beyond the expected range, the host computer -19- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)

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Give operators the ability to compare the effectiveness of wafer cassettes and tools through the fabrication of a large number of semiconductor wafers. In a specific embodiment of the invention, the detector network provides data on the internal environmental characteristics of the sealed wafer cassette as it passes through the semiconductor manufacturing process. However, in another possible specific embodiment, the present invention can be used to detect the internal environmental characteristics of the load port mini-clean environment, wherein the wafer cassette has been placed. In particular, as explained in the background of the invention, in order to transfer unfinished products between a wafer cassette and a process tool, the wafer cassette is loaded into a load port, and the wafer cassette door is separated from the wafer cassette housing to provide Access to unfinished products. The cassette case is usually left at the position of the load, and the access that has been removed from the wafer box door is sealed. According to its specific embodiment, the > The information is about the internal environmental characteristics of the load / mini-clean environment. And / or the programming tools attached to the mini-clean environment. Figure 5 illustrates a typical manufacturing facility 500, including a removable wafer cassette monitoring system 200. Manufacturing The device 500 may include a main aisle 501 and a plurality of processing rooms 503a, 503b, 503c, 503d, 503e, and 503f. Each processing room may contain one or more processing tools, such as a processing tool 505. As discussed above A processing tool 505 generally includes a load port assembly line 507 for loading and unloading wafer cassettes. According to a specific embodiment of the present invention, the manufacturing equipment 500 includes a movable wafer cassette monitoring system 200 (Figure 2), '甬 to monitor the movement of the movable wafer box, such as the round box 511 throughout the manufacturing equipment 500. As discussed above, there are many different configurations for monitoring the movable wafer box 51 丨... for example ... Room 50 3a-503 f may include an external transceiver 51 〇a to receive -21-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 556252 A7 ------- -B7 V. Description of the invention (19) Data transmitted from a specific room. Alternatively, each load port assembly line 507 'may include an external transceiver, for example, the external transceiver 51b may be located in a specific room. Message from wafer box 511 of load port assembly line 507. In addition, a major external transceiver, such as external transceiver 5ioc, is located in main aisle 501 and can be used to receive all wafers located in manufacturing equipment 500 The transmission of the box. The message received by the external receiver 51 Oa-510c can be transmitted to a host computer, such as the host computer 520a, located at the manufacturing equipment 500, or to the host computer 52b, located thousands of miles away. End position 525 ·. Although the present invention has been described in detail here, it should be understood that the present invention is not limited to the specific embodiments disclosed. Those skilled in the art can make different changes, Substitutions and modifications without departing from the spirit of the present invention Or range, such as the range of the appended patent described and defined. This paper -22- applies China National Standard Scale (CNS) A4 size (210X297 Kimiyoshi)

Claims (1)

556252 & No. _Ποοι! No. 92 Patent Application 9: Going in the Docket: Applying for Qin Li's Scope Replacement (August 1992) A BCD 1 · A SMIF wafer is used to transport each wafer 'and has the isolation of the surrounding air. The interior is used to support a wafer transfer box. This package will be seen one day. : One of each statement, said two: two-day 3 solid shell and matching with the wafer shell to remove the wafer; flat plan, Izumi's multiple sensors installed in the wafer transfer box, Each sensor can & depending on the conditions in the child's environment, and transmit data on the monitoring status of the wafer; and an external power supply to provide power to each sensor. 2. The standard mechanical interface wafer transfer box as described in the scope of patent application 专利 丨, wherein the sensor is continuously in the wafer transfer box, = ㈣ the state of the environment. Θ # 3. For example, a standard mechanical interface wafer transfer box with a scope of 1 patent application, in which the data is transmitted using electromagnetic radiation. Li ^ ... 4. For example, the standard mechanical interface wafer transfer box system of the patent application No. 3., wherein the electromagnetic radiation is in a frequency range of about 3 kilohertz to about 300 billion hertz. 5. The standard mechanical interface wafer transfer box system according to the first patent application scope, wherein the sensor further includes a memory for storing data about the monitoring status. 6. The standard mechanical interface wafer transfer box system according to item 1 of the patent application range, wherein the sensor is mounted on an internal portion of the wafer transfer box. 7. The standard mechanical interface wafer transfer box system according to item 1 of the patent application, wherein the sensor includes a plurality of sensor inputs and is placed in an individual position of the wafer transfer box. Each sensor input can be O: \ 76 \ 76104-920804 D〇C of this wafer transfer box This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 556252 A8 B8 C8 Monitor the status of the internal environment from other locations. 8 · The standard mechanical interface wafer transfer box system as claimed in item 1 of the patent scope, further comprising: a transceiver that communicates with the sensor, and the transceiver can receive and transmit data from the sensor. 9. The standard mechanical interface wafer transfer box system according to item 8 of the patent application, wherein the transceiver is tightly connected to the wafer transfer box, and wherein the data is transmitted to a network bus. 10. The standard mechanical interface wafer transfer box system according to item 8 of the patent application, where 其中 > the material is transmitted between the sensor and the transceiver using electromagnetic light transmission. 11. The standard mechanical interface wafer transfer box system of claim 10, wherein the electromagnetic radiation is in a frequency range of about 3 kHz to about 300 billion Hz. 12 · — A standard mechanical interface wafer. A round transfer box and a monitoring system that can monitor the environmental conditions of one of the standard mechanical interface wafer transfer boxes with an internal environment that isolates the surrounding air. The standard mechanical interface wafer transfer box and The monitoring system includes: a sensor that can be installed in the standard mechanical interface wafer transfer box, the sensor can monitor an environmental condition and transmit data indicating the environmental condition; and a transceiver that can be installed in the The standard mechanical interface wafer transfer box, the transceiver can be electrically communicated with the sensor to receive the data and send the data to a second transceiver located outside the standard mechanical interface wafer transfer box. 1 O: \ 76 \ 76104-920804.DOC \ 2- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) binding 556252 A8 B8 C8 -------__ D8 VI. Apply for a special application ~ 13. If you apply for a standard mechanical interface wafer transfer box and monitoring system of item 12 of the patent scope, the transceiver is connected to a processing tool . 14. If applying for the standard mechanical interface wafer transfer box and monitoring system in item 13 of the patent scope, wherein the transceiver provides the data to the processing tool, and if the reading data is not within the required operating range, the Processing tool 0 1 5. The standard mechanical interface wafer transfer box and monitoring system as described in item 12 of the Chinese Reading Patent, further comprising: a host computer that can receive and process data sent by the second transceiver. 16. If you read the standard mechanical interface wafer transfer box and monitoring system in item 15 of the patent scope, the host computer is located at a remote position relative to the standard mechanical interface wafer transfer box. 17. If the standard mechanical interface wafer transfer box and monitoring system of item 15 of the patent application scope, wherein the host computer determines whether the monitored environmental conditions in the standard mechanical interface wafer transfer box are within the required operating range . 18. The standard mechanical interface wafer transfer box and monitoring system as claimed in item 17 of the patent application, wherein if the internal environmental condition is not within the required operating range, the host computer does not start the processing tool. 1 9 · A standard mechanical interface wafer transfer box and monitoring system for a standard mechanical interface wafer transfer box having an internal environment that isolates the surrounding air, including a standard mechanical interface wafer transfer box including a crystal Round case and one box cover that matches the wafer case: a plurality of sensors, each of which can monitor one of the environmental conditions of the internal environment and transmit data indicating the environmental conditions; -3-O: \ 76 \ 76104.920804.DOO This paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) 556252 AB c D 6. Patent application scope-a transceiver, which communicates with the sensors, can receive the data and transmit The data is sent to an object located outside the wafer of the standard mechanical interface; and a source supplier is used to provide power to the plurality of sensors and the transceiver. 20. The standard mechanical interface wafer transfer box and monitoring system according to item 19 of the patent application scope, wherein the at least one or more sensors are selected from a group, including: a temperature sensor; a humidity sensor Sensor; and an accelerometer sensor. 2 1 · If the standard mechanical interface wafer transfer box and monitoring system of item 19 of the patent application, the communication between the plurality of sensors and the transceiver can be performed by a network bus. 2 2. A standard mechanical interface wafer transfer box with a monitoring system that can simultaneously monitor many internal environmental conditions in the standard mechanical interface wafer transfer box. The wafer transfer box includes a container shell, a container door, And a monitoring system, the monitoring system includes: a network bus embedded in the container shell; a transceiver electrically connected to the network bus; a plurality of network nodes; each network node may be connected to the network Bus power connection; and a plurality of sensors electrically connected to the network node, each sensor can monitor an internal environmental condition in the wafer transfer box, and transmit information about the internal environmental condition to The transceiver. O: \ 76 \ 76104-920804.DOC \ 5-4-This paper size applies to Chinese National Standard (CNS) A4 specification (210X 297 mm) 556252 A8 B8 C8 D8 VI. Patent application scope 23. The standard mechanical interface wafer transfer box of 22 items, wherein the plurality of network nodes are configured as a master-slave network, and wherein the network bus can be used as a channel. 24. For example, the standard mechanical interface wafer transfer box with the scope of patent application No. 22, wherein the plurality of network nodes are configured as a terminal-to-terminal network. O: \ 76 \ 76104-920804.DOC \ 5 ~ 5 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)