TW202339100A - Package inspection apparatus and tray structure thereof - Google Patents

Abstract

A package inspection apparatus includes a carrying platform, a tray, an image capturing module and a light source module. The carrying platform includes a base and a backlight module disposed on the base. The try is disposed on the backlight module and includes a plurality of carrying units for carrying a plurality of package structures respectively. Each of the carrying units includes a plurality of grooves exposing a peripheral region of the corresponding package structure. The image capturing module is disposed over the carrying platform and configured to capture an image of at least a part of the package structures. The light source module is disposed between the image capturing module and the carrying platform.

Description

Packaging inspection machine and its tray structure

The present disclosure relates to a testing machine and its tray structure, and in particular to a packaging testing machine and its supporting tray structure.

Semiconductor packaging technology includes many packaging forms, among which the Thin Small Outline Package (TSOP) form is currently a very widely used packaging form in IC packaging. In the conventional manufacturing method of thin and small outline packages, the After the chip is placed on the carrier (such as a lead frame) and electrically connected, part of the lead frame and the chip are covered with packaging colloid, and pins for external electrical connection are formed around the packaging colloid, and then the After cutting into individual parts, SMT technology (surface mounting technology) is used to directly attach it to the surface of the printed circuit board.

However, when the lead frame is covered with packaging glue, because the pins of the lead frame are in direct contact with the packaging glue, it is easy for the packaging glue to overflow to the lower surface of the pins and the gaps between the pins, thereby affecting the lead frame. electrical reliability. Therefore, during the production process, attention must be paid to whether the packaging colloid has glue overflow and whether the glue overflow exceeds the allowable range. In the past, the above-mentioned inspection work was performed manually and visually. However, this method was not only labor-intensive, but also lacked objective standards in execution. Therefore, further review and feasible solutions are needed.

The present disclosure provides a packaging inspection machine and its tray structure, which can automatically detect the degree of glue overflow of the packaging structure and improve the detection accuracy.

The present disclosure discloses a packaging inspection machine, which includes a carrying platform, a tray, an image capture module and a light source module. The carrying platform includes a base and a backlight module arranged on the base. The tray is disposed on the backlight module and includes a plurality of carrying units, respectively used to carry a plurality of packaging structures, wherein each carrying unit includes a plurality of grooves exposing a peripheral area of the corresponding packaging structure. The image capture module is disposed above the carrying platform and used to capture at least part of the images of the multiple package structures. The light source module is arranged between the image capture module and the carrying platform.

The present disclosure discloses a tray structure for a packaging inspection machine. The tray is arranged on a backlight module and includes a plurality of carrying units. The plurality of carrying units are respectively used to carry a plurality of packaging structures, and each of the carrying units includes an exposed A plurality of grooves in a peripheral area of the corresponding packaging structure.

Based on the above, the carrying platform of the packaging inspection machine of the present disclosure is provided with a backlight module, and a tray for carrying the packaging structure is provided on the backlight module. Moreover, the tray structure of the packaging inspection machine includes a plurality of carrying units, and each The carrying unit includes a plurality of grooves for exposing peripheral areas of the corresponding package structure (for example, corresponding to outer pins of the package structure). In this configuration, the surface light source provided by the backlight module under the tray can be transmitted through the groove, thus further illuminating at least the peripheral area of the packaging structure to improve the contrast between light and dark between the packaging structure and the background, which is beneficial to the packaging inspection machine. The interpretation of images captured by its image capture module can thereby improve the accuracy of image interpretation by packaging inspection machines.

The aforementioned technical contents, features and effects of the present disclosure will be clearly presented in the following detailed description of each embodiment with reference to the drawings. Directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the disclosure. Furthermore, in the following embodiments, the same or similar elements will be given the same or similar numbers.

FIG. 1 is a schematic diagram of a packaging inspection machine according to an embodiment of the present disclosure. Referring to FIG. 1 , in some embodiments, the packaging inspection machine 100 may include a carrying platform 110 , a tray 120 , an image capture module 130 and a light source module 140 . In one embodiment, the package inspection machine 100 may be, for example, an automated optical inspection (Automated Optical Inspection, AOI) machine. In this embodiment, the carrying platform 110 may further include a base 112 and a backlight module 114 disposed on the base 112 . In this embodiment, the backlight module 114 may be disposed on the carrying platform 110 , for example. Furthermore, the base 112 of the carrying platform 110 may, for example, have a setting groove 1121 to dispose the backlight module 114 in the setting groove 1121 of the base 112, and the packaging structure may also be disposed in this setting groove 1121. and placed on the backlight module 114 . With this configuration, the packaging inspection machine 100 can provide a surface light source emitting light from bottom to top through the backlight module 114 located on the carrying platform 110, so as to facilitate the image capture module 130 and/or human eyes to inspect defects in the packaging structure ( defect) condition.

In one embodiment, the carrying platform 110 can be used as the carrying body of the packaging inspection machine 100 for placing multiple packaging structures (such as the packaging structure 200 shown in FIG. 3 ) thereon. In some embodiments, the carrying platform 110 can further be coupled to a combination of various types of mechanical components that can drive the connecting element to move or rotate, such as a robotic arm, a height adjustment mechanism, a slide rail, a turntable, a screw, a motor and/or a cylinder, etc. The packaging structure 200 placed on the carrying platform 110 is raised, lowered, moved and/or rotated.

In some embodiments, the image capture module 130 is movably disposed above the carrying platform 110 and is used to capture at least part of the image of the package structure 200 . For example, the image capture module 130 may be a camera, video camera, or other device, and the image capture module 130 may include an image sensor (for example, a charge coupled device (CCD), a complementary metal oxide semiconductor) (Complementary Metal-Oxide-Semiconductor, CMOS), etc.), optical lenses, image control circuits and other components. In this embodiment, the optical lens of the image capture module 130 may include a fisheye lens. Here, a fisheye lens refers to a lens with a viewing angle close to or equal to 180°. The focal length of this type of lens is extremely short. Generally speaking, lenses with a focal length of 16 mm or shorter can usually be considered as fisheye lenses. Of course, the present disclosure is not limited to this. The lens specifications (for example, imaging aperture, magnification, focal length, imaging viewing angle, image sensor size, etc.) and quantity of the image capture module 130 can be determined according to actual needs. adjust.

In some embodiments, the light source module 140 is disposed between the image capture module 130 and the carrying platform 110 . Furthermore, the light source module 140 is movably disposed above the carrying platform 110, and the light source module 140 can be a coaxial light source, a backlight light source, an annular light source, a hemispherical light source, a strip light source, a point light source, or a strip light source. Compose various types of light sources such as rotatable frame light sources. In some embodiments, the light source module 140 can move in one, two or more axes relative to the carrying platform 110 . For example, the light source module 140 can be lifted, moved, and/or rotated relative to the carrying platform 110 . In addition, the number of light source modules 140 can be adjusted according to actual needs, and the brightness distribution provided by the light source modules 140 can also be adjusted.

FIG. 2 is a schematic diagram of a tray of a packaging inspection machine according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram of a packaging structure applied to a packaging inspection machine according to an embodiment of the present disclosure. Please refer to FIGS. 1 to 3 simultaneously. In some embodiments, the tray 120 is disposed on the backlight module 114 , and the tray 120 may include a plurality of carrying units 122 , which are respectively used to carry a plurality of packaging structures 200 . In one embodiment, each carrying unit 122 includes an opening 1222 and a plurality of trenches 1221, wherein the opening 1222 is used to expose the central area of the corresponding packaging structure 200, and the trenches 1221 is used to expose the corresponding packaging structure 200. peripheral area. In this embodiment, the grooves 1221 may surround at least opposite two sides of the opening 1222 respectively. With this configuration, the surface light source provided by the backlight module 114 below the tray 120 can be transmitted through the groove 1221, and can further illuminate the peripheral area of the package structure 200 to facilitate identification by the image capture module 130 above.

Specifically, in this embodiment, the packaging structure 200 may include a packaging glue 210 and a plurality of external pins 220 extending outward from the packaging glue 210 as shown in FIG. 3 . In one embodiment, the packaging structure 200 may be a thin small outline package (TSOP), which may include a lead frame and an encapsulant 210 encapsulating the lead frame, wherein the lead frame It includes a chip holder and the plurality of external pins 220 . The chip holder is encapsulated in the encapsulant 210 and used to set the chip. The external pins 220 can extend outside the encapsulant 210 . Generally speaking, during the manufacturing process of the packaging structure 200 , the packaging glue 210 easily overflows to the lower surface of the outer pins 220 and the gap between the outer pins 220 , thus affecting the electrical reliability of the packaging structure 200 . Therefore, the packaging inspection machine 100 must be used to detect whether the packaging colloid 210 has glue overflow and whether the degree of glue overflow exceeds the allowable range.

In view of this, in this embodiment, the plurality of grooves 1221 of each carrying unit 122 can be used to expose the peripheral area of the corresponding packaging structure 200 (for example, corresponding to the outer pin 220 of the packaging structure 200). That is to say, The opening 1222 of the carrying unit 122 may correspond to the encapsulant 210 , and the trench 1221 may correspond to at least part of the outer pin 122 . With this configuration, the surface light source provided by the backlight module 114 under the tray 120 can be transmitted through the groove 1221, thereby further illuminating the area near the outer pins 220 of the packaging structure 200, so as to facilitate the packaging inspection machine 100. Interpretation of images captured by the image capture module 130 . In addition, in this embodiment, the color of the tray 120 can be a light color. Specifically, the color level of the tray 120 can be about 20 or more levels different from the color level of the encapsulant 210 to further improve the external pins. 220 between the light and dark contrast between the packaging colloid 210 (if any) and the background, thereby improving the accuracy of image interpretation by the packaging inspection machine 100.

FIG. 4 is a partially enlarged schematic diagram of the packaging structure of FIG. 3 . In one embodiment, please refer to FIG. 1 and FIG. 4 , the image capture module 130 is used to capture images of at least two adjacent outer pins 220 (such as the images shown in FIG. 4 ). In addition, the packaging inspection machine 100 may further include a processor 150 as shown in FIG. 1 , which is coupled to the image capture module 130 to determine whether two adjacent components are located outside the image capture module 130 based on the image captured by the image capture module 130 . Whether the ratio of the maximum glue overflow depth L1 of the packaging glue 212 between the pins 220 to the length L2 of the outer pin 110 is greater than a preset ratio. In this embodiment, the preset ratio may be approximately 25%, for example. That is to say, if the processor 150 determines that the ratio of the maximum glue overflow depth L1 to the length L2 of the outer pin 110 is substantially greater than 25%, the processor 150 determines that the defect of the package structure 200 is greater than the acceptable range and based on this Make an interpretation result (for example, determine that the encapsulation structure is unqualified (fail)), and perform subsequent exception handling such as discarding it.

5 to 7 are schematic diagrams of a carrying unit of a packaging inspection machine according to different embodiments of the present disclosure. It must be noted here that the carrying unit 122 of the packaging inspection machine 100 of this embodiment is similar to the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, where the same numbers are used to represent the same. or similar components, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in this embodiment. The following will describe the differences between the carrying unit 122 of the packaging inspection machine 100 of this embodiment and the previous embodiment.

In some embodiments, the groove 1221 of the carrying unit 122 may have various configurations according to product characteristics. For example, please refer to FIG. 5 first. In this embodiment, corresponding to the shape of the packaging structure, the carrying unit 122 may have a pair of long sides 1223 and a pair of short sides 1224, and the grooves 1221 may at least be opposite to each other along the The two long sides 1223 are provided to expose the outer pins 122 provided along the two opposite long sides of the package structure 200 as shown in FIG. 3 , so that the surface light source provided by the backlight module 114 below can pass through the trench 1221 and shine through to illuminate the area near the outer pins 220 of the package structure 200 . Furthermore, each groove 1221 may extend along the corresponding long side 1223 , and may extend from opposite ends of the long side 1223 toward the center of the short side 1224 respectively. In this embodiment, the plurality of grooves 1221 may be symmetrically arranged and spaced apart from each other at a specific distance.

Please refer to FIG. 6 again. In one embodiment, the outer pins of the package structure may be disposed along two opposite short sides, for example. Correspondingly, the trench 1221a used to carry the carrying unit 122a of the package structure may be provided along at least two short sides 1224 facing each other to expose the outer pins provided along the two opposite short sides of the package structure. Furthermore, each groove 1221a may extend along the corresponding short side 1224, and may extend toward the center of the long side 1223 at opposite ends of the short side 1224 respectively. In this embodiment, the plurality of grooves 1221a may be symmetrically arranged and spaced apart from each other at a specific distance.

Please refer to FIG. 7 again. In one embodiment, the outer pins of the package structure may be disposed along each side of the package structure, for example, respectively along a pair of long sides and a pair of short sides. Correspondingly, the grooves 1221b used to carry the carrying unit 122b of the above-mentioned package structure can be provided along the two long sides 1223 and the two short sides 1224 that are opposite to each other, so as to expose the outer grooves 1221b provided along each side of the package structure. pin. Furthermore, each trench 1221b may be spaced apart from each other by a specific distance.

FIG. 8 is a schematic diagram of a light source module of a packaging inspection machine according to an embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 8 . In this embodiment, the light source module 140 may be a hemispherical diffused light source. Specifically, the light source module 140 of this embodiment has a hemispherical reflective diffusion lampshade. A plurality of light sources 142 are arranged in this hemispherical lampshade, and the light sources (such as light-emitting diodes) 142 are directed upward to illuminate the hemisphere. shaped lampshade, in this way, the light emitted by the light source 142 is diffused by the diffuser lampshade, forming a uniform lighting area below the light source 142, which is significantly different from the general direct light source lighting effect. In this embodiment, the light source module 140 may have an opening 144, so that the image capturing module 130 disposed above can capture images of the package structure through the opening 144. Under such a configuration, by illuminating the light source module 140, the image captured by the image capture module 130 can have no obvious shadows, and there can be no strong reflected light on the smooth surface, which can avoid shadows or shadows during image capture. The impact of reflection can reduce the difficulty of image processing.

In summary, the carrying platform of the packaging inspection machine of the present disclosure is provided with a backlight module, and the tray used to carry the packaging structure is provided on the backlight module, and the tray structure of the packaging inspection machine includes a plurality of carrying units. And each carrying unit includes a plurality of grooves for exposing the peripheral area of the corresponding packaging structure (for example, corresponding to the outer pin of the packaging structure). In this configuration, the surface light source provided by the backlight module under the tray can be transmitted through the groove, thus further illuminating at least the peripheral area of the packaging structure to improve the contrast between light and dark between the packaging structure and the background, which is beneficial to the packaging inspection machine. The interpretation of images captured by its image capture module can thereby improve the accuracy of image interpretation by packaging inspection machines.

100:Packaging inspection machine 110: Bearing platform 112:Pedestal 1121: Set the groove 114:Backlight module 120:Pallet 122, 122a, 122b: Bearing unit 1221, 1221a, 1221b: groove 1222:Open your mouth 1223:Long side 1224:Short side 130:Image capture module 140:Light source module 142:Light source 144:Open your mouth 150:processor 200:Package structure 210: Encapsulating colloid 220: External pin L1: Maximum glue overflow depth L2: length

FIG. 1 is a schematic diagram of a packaging inspection machine according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a tray of a packaging inspection machine according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram of a packaging structure applied to a packaging inspection machine according to an embodiment of the present disclosure. FIG. 4 is a partially enlarged schematic diagram of the packaging structure of FIG. 3 . 5 to 7 are schematic diagrams of a carrying unit of a packaging inspection machine according to different embodiments of the present disclosure. FIG. 8 is a schematic diagram of a light source module of a packaging inspection machine according to an embodiment of the present disclosure.

100:Packaging inspection machine

110: Bearing platform

112:Pedestal

1121: Set the groove

114:Backlight module

120:Pallet

130:Image capture module

140:Light source module

142:Light source

144:Open your mouth

150:processor

Claims (10)

A packaging inspection machine, including: A carrying platform, which includes a base and a backlight module disposed on the base; A tray is provided on the backlight module and includes a plurality of carrying units, wherein the plurality of carrying units are respectively used to carry a plurality of packaging structures, and each of the carrying units includes a plurality of peripheral areas that expose the corresponding packaging structure. trench; An image capture module is disposed above the carrying platform and used to capture at least part of the images of the plurality of package structures; and A light source module is disposed between the image capture module and the carrying platform. The packaging inspection machine of claim 1, wherein each of the carrying units further includes an opening for exposing a central area of the corresponding packaging structure, and the plurality of grooves respectively surround at least opposite two sides of the opening. The packaging inspection machine of claim 1, wherein each packaging structure includes a packaging colloid and a plurality of external pins extending outward from the packaging colloid. The packaging inspection machine of claim 3, wherein each of the carrying units further includes an opening corresponding to the packaging gel, and the plurality of grooves correspond to at least part of the plurality of external pins. The package inspection machine of claim 3, wherein the image capturing module is used to capture images of at least two adjacent ones of the plurality of external pins. The packaging inspection machine of claim 3 further includes a processor coupled to the image capture module and used to interpret the image captured by the image capture module. The packaging inspection machine as claimed in claim 3, wherein a color gradation of the color of the tray and a color gradation of the color of the packaging colloid differ by more than 20 steps. The packaging inspection machine of claim 1, wherein the light source module includes a hemispherical diffused light source. The packaging inspection machine of claim 1, wherein the lens of the image capture module includes a fisheye lens. A tray structure for packaging and testing machines, including: A tray is provided on a backlight module and includes a plurality of carrying units, wherein the plurality of carrying units are respectively used to carry a plurality of packaging structures, and each of the carrying units includes a peripheral area exposing a corresponding packaging structure. Multiple grooves.

Images