TW202336048A - Photocurable resin composition, cured object, three-dimensional shaped object, and method for producing casting mold - Google Patents

Photocurable resin composition, cured object, three-dimensional shaped object, and method for producing casting mold Download PDF

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TW202336048A
TW202336048A TW111149095A TW111149095A TW202336048A TW 202336048 A TW202336048 A TW 202336048A TW 111149095 A TW111149095 A TW 111149095A TW 111149095 A TW111149095 A TW 111149095A TW 202336048 A TW202336048 A TW 202336048A
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resin composition
photocurable resin
meth
acrylate
photopolymerization initiator
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井川高輔
西澤茂年
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日商Dic股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22CFOUNDRY MOULDING
    • B22C9/00Moulds or cores; Moulding processes
    • B22C9/02Sand moulds or like moulds for shaped castings
    • B22C9/04Use of lost patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The present invention provides a photocurable resin composition characterized by comprising a photopolymerization initiator (A) and a polyfunctional (meth)acrylate (B), wherein the amount of the photopolymerization initiator (A) is in the range of 10-30 parts by mass, excluding 10 parts by mass, per 100 parts by mass of the polyfunctional (meth)acrylate (B). The photopolymerization initiator (A) may at least comprise a first photopolymerization initiator (A-1), which has at least one maximal-absorption wavelength in a wavelength range of 350 nm and longer, and a second photopolymerization initiator (A-2), which has no maximal-absorption wavelength in the wavelength range of 350 nm and longer and has a maximal-absorption wavelength in a wavelength range below 350 nm. A three-dimensional shaped object comprising a cured object obtained by curing the photocurable resin composition has a high hardness and is excellent in terms of eliminability by high-temperature heating, shaping accuracy, and casting property.

Description

光硬化性樹脂組成物、硬化物、立體造形物、鑄模的製造方法及金屬鑄造物的製造方法Photocurable resin composition, cured product, three-dimensional molded object, manufacturing method of casting mold, and method of manufacturing metal casting

本發明是有關於一種光硬化性樹脂組成物、硬化物、立體造形物及鑄模的製造方法。The present invention relates to a method of manufacturing a photocurable resin composition, a cured product, a three-dimensional molded object, and a casting mold.

於製造金屬材料的成形品時,通常使用機械加工或鑄造等方法。其中,鑄造法可製造具有複雜的形狀的金屬零件或金屬製品。 作為所述鑄造法,已知有脫蠟法等,所述脫蠟法為藉由蠟或樹脂製作鑄造物的原型模型並包埋於包埋材料中,於包埋材料硬化後,對原型模型及包埋材料進行加熱,藉此將原型模型熔融、分解或焚化去除,從而於包埋材料內形成空隙,將所述空隙作為鑄模注入熔融的金屬並進行鑄造。所述脫蠟法被用於珠寶、牙科技工的領域。 When manufacturing formed products of metal materials, methods such as machining or casting are usually used. Among them, the casting method can produce metal parts or metal products with complex shapes. As the casting method, a dewaxing method is known. In the dewaxing method, a prototype model of a cast object is made with wax or resin and embedded in an investment material. After the investment material hardens, the prototype model is The investment material is heated, whereby the prototype model is melted, decomposed or incinerated to remove, thereby forming a void in the investment material, and the void is used as a mold to inject molten metal and cast. The lost wax method is used in the fields of jewelry and dental technology.

近年來,提出了使用三維(Three Dimensions,3D)列印機並藉由光硬化性樹脂組成物形成脫蠟法的原型模型(專利文獻1)。 [現有技術文獻] [專利文獻] In recent years, it has been proposed to use a three-dimensional (3D) printer to form a prototype model using a dewaxing method using a photocurable resin composition (Patent Document 1). [Prior art documents] [Patent Document]

[專利文獻1]日本專利特開2018-048312號公報[Patent Document 1] Japanese Patent Application Publication No. 2018-048312

[發明所欲解決之課題] 然而,先前的光硬化性樹脂組成物存在如下問題:光照射時的硬化速度慢而難以造形、或者硬化速度過快,因此即便少量的曝光亦會硬化,因此難以處理、且造形精度下降等。 進而,由該組成物形成的原型模型存在如下問題:由於硬度低而無法維持形狀、高溫加熱時的消失性不充分,於包埋材料內殘留了灰塵等殘渣,鑄造品的表面劣化、或者由於原型模型與包埋材料的膨脹係數的不同而使包埋材料產生裂紋或破裂。 [Problem to be solved by the invention] However, conventional photocurable resin compositions have problems such as slow curing speed when irradiated with light, making molding difficult, or too fast curing speed, so even a small amount of light exposure causes curing, making handling difficult, and molding accuracy decreases. Furthermore, prototype models formed from this composition have problems such as the inability to maintain shape due to low hardness, insufficient disappearing properties when heated at high temperatures, residues such as dust remaining in the investment material, surface deterioration of the cast product, or problems due to The difference in expansion coefficient between the prototype model and the investment material causes cracks or ruptures in the investment material.

本發明的課題在於提供一種造形精度優異的光硬化性樹脂組成物、以及硬度高、高溫加熱時的消失性及鑄造性優異的造形物。An object of the present invention is to provide a photocurable resin composition with excellent molding accuracy, and a molded article with high hardness, excellent disappearing properties when heated at high temperatures, and excellent castability.

於本說明書中,所謂「鑄造性優異」是指如下狀態,即,於使用本發明的造形物作為原型模型來製造鑄模的情況下,鑄模外部及內部無裂縫或龜裂,鑄模內部無立體造形物的殘渣、灰塵,立體造形物向鑄模的轉印性良好的狀態。 [解決課題之手段] In this specification, "excellent castability" refers to a state in which, when the molded object of the present invention is used as a prototype model to produce a mold, there are no cracks or cracks on the outside and inside of the mold, and there is no three-dimensional molding inside the mold. Residues and dust of the object are removed, and the transferability of the three-dimensional molded object to the mold is good. [Means to solve the problem]

針對該些問題,本發明者等人發現如下光硬化性樹脂組成物的硬化速度適度快,造形精度優異,且使該樹脂組成物硬化而獲得的造形物的硬度高,高溫加熱時的消失性及鑄造性優異,從而完成了本發明,所述光硬化性樹脂組成物的特徵在於,含有光聚合起始劑(A)及多官能(甲基)丙烯酸酯(B),相對於多官能(甲基)丙烯酸酯(B)100質量份,光聚合起始劑(A)的含量為超過10質量份~30質量份的範圍。In response to these problems, the present inventors discovered that a photocurable resin composition has a moderately fast curing speed and excellent molding accuracy, and that a molded object obtained by curing the resin composition has high hardness and has good disappearing properties when heated at high temperatures. and excellent castability, the present invention was completed. The photocurable resin composition is characterized by containing a photopolymerization initiator (A) and a polyfunctional (meth)acrylate (B). 100 parts by mass of methacrylate (B) and the content of the photopolymerization initiator (A) are in the range of more than 10 parts by mass to 30 parts by mass.

即,本發明包含以下態樣。 (1)一種光硬化性樹脂組成物,其特徵在於,含有光聚合起始劑(A)及多官能(甲基)丙烯酸酯(B), 相對於多官能(甲基)丙烯酸酯(B)100質量份,所述光聚合起始劑(A)的含量為超過10質量份~30質量份的範圍。 (2)如(1)所述的光硬化性樹脂組成物,其中,所述光聚合起始劑(A)至少含有在350 nm以上的波長範圍內具有至少一個極大吸收波長的第一光聚合起始劑(A-1)、以及在350 nm以上的波長範圍內不具有極大吸收波長且在小於350 nm的波長範圍內具有極大吸收波長的第二光聚合起始劑(A-2)。 (3)如(2)所述的光硬化性樹脂組成物,其中,所述第一光聚合起始劑(A-1)為選自由醯基氧化膦、雙醯基氧化膦、二茂鈦化合物、O-醯基肟化合物及噻噸酮化合物所組成的群組中的至少一種。 (4)如(2)或(3)所述的光硬化性樹脂組成物,其中,所述第二光聚合起始劑(A-2)為選自由苯烷基酮化合物、α-二酮化合物及錪鹽所組成的群組中的至少一種。 (5)如(2)~(4)中任一項所述的光硬化性樹脂組成物,其中,所述第二光聚合起始劑(A-2)相對於所述第一光聚合起始劑(A-1)的調配比例[(A-1)/(A-2)]為1/100~8/10的範圍。 (6)如(1)~(5)中任一項所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)至少含有在分子中於結構中具有聚氧伸烷基的化合物。 (7)如(6)所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)至少含有在分子中具有聚氧伸烷基及雙酚結構的化合物(B-1), 所述化合物(B-1)是改質雙酚A二(甲基)丙烯酸酯,其由 下述式(I): [化1] 表示,且R 1表示氫原子或甲基,同一分子中的多個R 1可相同亦可不同,m及n分別獨立地表示1以上的整數,m+n為2~40。 (8)如(6)或(7)所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)更含有在分子內具有一個以上的(甲基)丙烯醯基的化合物(B-2)。 (9)如(8)所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)100質量份中的所述化合物(B-1)的調配量為40質量份~90質量份。 (10)如(1)~(9)中任一項所述的光硬化性樹脂組成物,更含有非金屬有機顏料(C)。 (11)如(1)~(10)中任一項所述的光硬化性樹脂組成物,是立體光造形用途。 (12)一種硬化物,是使如(1)~(11)中任一項所述的光硬化性樹脂組成物光硬化而成。 (13)一種立體造形物,包含如(12)所述的硬化物。 (14)一種鑄模的製造方法,其特徵在於包括: 步驟(1),利用包埋材料使如(13)所述的立體造形物部分或全部包埋; 步驟(2),使所述包埋材料硬化或固化;以及 步驟(3),使所述立體造形物熔融去除、分解去除及/或焚化去除。 (15)一種金屬鑄造物的製造方法,其特徵在於包括步驟(4),所述步驟(4)是使金屬材料流入藉由如(14)所述的製造方法而獲得的鑄模中並使所述金屬材料固化。 [發明的效果] That is, the present invention includes the following aspects. (1) A photocurable resin composition characterized by containing a photopolymerization initiator (A) and a polyfunctional (meth)acrylate (B), with respect to the polyfunctional (meth)acrylate (B) 100 parts by mass, the content of the photopolymerization initiator (A) is in the range of more than 10 parts by mass to 30 parts by mass. (2) The photocurable resin composition according to (1), wherein the photopolymerization initiator (A) contains at least a first photopolymerizable compound having at least one maximum absorption wavelength in a wavelength range of 350 nm or more. An initiator (A-1), and a second photopolymerization initiator (A-2) that does not have a maximum absorption wavelength in a wavelength range of 350 nm or more and has a maximum absorption wavelength in a wavelength range of less than 350 nm. (3) The photocurable resin composition as described in (2), wherein the first photopolymerization initiator (A-1) is selected from the group consisting of free hydroxyl phosphine oxide, bis hydroxyl phosphine oxide, and titanium oxide. At least one of the group consisting of compounds, O-acyl oxime compounds and thioxanthone compounds. (4) The photocurable resin composition according to (2) or (3), wherein the second photopolymerization initiator (A-2) is selected from the group consisting of phenylalkyl ketone compounds and α-diketones. At least one from the group consisting of compounds and iodonium salts. (5) The photocurable resin composition according to any one of (2) to (4), wherein the second photopolymerization initiator (A-2) is smaller than the first photopolymerization initiator (A-2). The compounding ratio of the starting agent (A-1) [(A-1)/(A-2)] is in the range of 1/100 to 8/10. (6) The photocurable resin composition according to any one of (1) to (5), wherein the polyfunctional (meth)acrylate (B) contains at least one polyfunctional (meth)acrylate having a poly(meth)acrylate in the molecule and a structure. Oxyalkyl compounds. (7) The photocurable resin composition according to (6), wherein the polyfunctional (meth)acrylate (B) contains at least a compound having a polyoxyalkylene group and a bisphenol structure in the molecule ( B-1), the compound (B-1) is modified bisphenol A di(meth)acrylate, which has the following formula (I): [Chemical 1] represents, and R 1 represents a hydrogen atom or a methyl group, multiple R 1 in the same molecule may be the same or different, m and n each independently represent an integer of 1 or more, and m+n is 2 to 40. (8) The photocurable resin composition according to (6) or (7), wherein the polyfunctional (meth)acrylate (B) further contains one or more (meth)acrylates in the molecule acyl compound (B-2). (9) The photocurable resin composition according to (8), wherein the compound (B-1) is added in an amount of 40 parts per 100 parts by mass of the polyfunctional (meth)acrylate (B). Parts by mass ~ 90 parts by mass. (10) The photocurable resin composition according to any one of (1) to (9), further containing a non-metallic organic pigment (C). (11) The photocurable resin composition according to any one of (1) to (10) is used for stereolithography. (12) A cured product obtained by photocuring the photocurable resin composition according to any one of (1) to (11). (13) A three-dimensional shaped object including the hardened object according to (12). (14) A method of manufacturing a casting mold, characterized by comprising: step (1), using an embedding material to embed part or all of the three-dimensional shaped object as described in (13); step (2), embed the three-dimensional shaped object Hardening or solidifying the material; and step (3), removing the three-dimensional shaped object by melting, decomposing and/or incineration. (15) A method of manufacturing a metal casting, characterized by including the step (4) of flowing the metal material into the casting mold obtained by the manufacturing method as described in (14) and causing the metal material to flow into the mold. The metal material solidifies. [Effects of the invention]

根據本發明,可提供一種造形精度優異的光硬化性樹脂組成物、以及硬度高、高溫加熱時的消失性、鑄造性優異的造形物。因此,於製作鑄模時,容易進行原型模型的造形,可維持原型模型的形狀,減少原型模型加熱時的殘渣,從而可防止鑄模產生裂紋或破裂。According to the present invention, it is possible to provide a photocurable resin composition with excellent molding accuracy, and a molded article with high hardness, evaporability when heated at high temperatures, and excellent castability. Therefore, when making the casting mold, it is easy to shape the prototype model, the shape of the prototype model can be maintained, and residues when the prototype model is heated can be reduced, thereby preventing the casting mold from cracking or breaking.

以下對本發明的若干實施方式進行詳細說明。但是,本發明並不限定於以下的實施方式。再者,以後本說明書中的質量%是指將光硬化性樹脂組成物整體設為100質量%時的比例。 於本發明中,所謂「(甲基)丙烯酸酯」是指丙烯酸酯與甲基丙烯酸酯中的一者或兩者,所謂「(甲基)丙烯醯基」是指丙烯醯基與甲基丙烯醯基中的一者或兩者。 Several embodiments of the present invention are described in detail below. However, the present invention is not limited to the following embodiments. In addition, the mass % in this specification from now on means the ratio when the whole photocurable resin composition is 100 mass %. In the present invention, the so-called "(meth)acrylate" refers to one or both of acrylate and methacrylate, and the so-called "(meth)acrylyl" refers to acrylate and methacrylate. One or both of the acyl groups.

[(A)成分] 作為本發明中使用的光聚合起始劑(A)(於本說明書中,亦簡稱為(A)成分),只要是藉由紫外線或電子束等的照射而產生自由基、陽離子或陰離子的化學種、或該些的混合物即可,於可獲得本發明的效果的範圍內並無特別限制。 [(A) Ingredient] The photopolymerization initiator (A) used in the present invention (also referred to as component (A) in this specification) is any chemical that generates free radicals, cations, or anions by irradiation with ultraviolet rays, electron beams, etc. It suffices to use one or a mixture thereof, and there is no particular limitation within the range in which the effects of the present invention can be obtained.

進而,相對於多官能(甲基)丙烯酸酯(B)100質量份,本發明中的光聚合起始劑(A)的含量較佳為3質量份~50質量份的範圍,更佳為5質量份~40質量份的範圍,最佳為超過10質量份且為30質量份以下的範圍。藉由設為該些範圍,可藉由適當加快硬化速度來提高造形精度,於抑制高溫加熱時的膨脹的同時,提高消失性。因此,容易進行立體造形,防止鑄模形成時的裂紋或破裂,可減少灰塵殘留,鑄造性優異。Furthermore, the content of the photopolymerization initiator (A) in the present invention is preferably in the range of 3 to 50 parts by mass, and more preferably 5 parts by mass relative to 100 parts by mass of the polyfunctional (meth)acrylate (B). The range of parts by mass to 40 parts by mass is preferably more than 10 parts by mass and 30 parts by mass or less. By setting these ranges, the molding accuracy can be improved by suitably accelerating the hardening speed, and the disappearing properties can be improved while suppressing expansion during high-temperature heating. Therefore, three-dimensional molding is easy, cracks or breaks during mold formation are prevented, dust residues are reduced, and castability is excellent.

於本發明中,光聚合起始劑(A)較佳為含有在350 nm以上的波長範圍內具有至少一個極大吸收波長的第一光聚合起始劑(A-1)。藉此,於紫外線(特別是350 nm~450 nm附近的波長光)照射時與(甲基)丙烯酸酯化合物的反應性優異,硬化速度加快,造形精度變得良好。因此,容易進行三維立體造形。In the present invention, the photopolymerization initiator (A) preferably contains the first photopolymerization initiator (A-1) having at least one maximum absorption wavelength in the wavelength range above 350 nm. Thereby, it has excellent reactivity with (meth)acrylate compounds when irradiated with ultraviolet rays (especially light with wavelengths around 350 nm to 450 nm), the curing speed is accelerated, and the molding accuracy becomes good. Therefore, three-dimensional modeling is easy.

作為所述第一光聚合起始劑(A-1),較佳為選自由醯基氧化膦、雙醯基氧化膦、二茂鈦化合物、O-醯基肟化合物及噻噸酮化合物所組成的群組中的至少一種,具體而言,可列舉:2,4,6-三甲基苯甲醯基二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、雙(2,4-環戊二烯基)雙[2,6-二氟-3-(1-吡咯基)苯基]鈦(IV)、1-[4-(苯硫基)苯基]辛烷-1,2-二酮=2-(O-苯甲醯基肟)、2,4-二乙基噻噸酮等。該些中,就與(甲基)丙烯酸酯化合物的反應性優異,與分子量大且具有複雜結構的化合物、或於分子內包含金屬原子的化合物相比可減少煆燒時的灰塵殘留的方面而言,較佳為磷化合物,具體而言,較佳為2,4,6-三甲基苯甲醯基二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦。另外,該些化合物可單獨使用,亦可併用兩種以上。As the first photopolymerization initiator (A-1), it is preferably selected from the group consisting of hydroxyl phosphine oxide, bis hydroxyl phosphine oxide, titanocene compound, O-hydroxyl oxime compound and thioxanthone compound. At least one of the groups, specifically, examples include: 2,4,6-trimethylbenzyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzyldiphenyl) Phenylphosphine oxide, bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrolyl)phenyl]titanium(IV), 1-[4-(phenylsulfide) Base) phenyl]octane-1,2-dione=2-(O-benzyl oxime), 2,4-diethylthioxanthone, etc. Among these, they are excellent in reactivity with (meth)acrylate compounds and can reduce dust residue during baking compared to compounds with large molecular weights and complex structures or compounds containing metal atoms in the molecule. In other words, a phosphorus compound is preferred. Specifically, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyldiphenylphosphine oxide) are preferred. Phenylphosphine oxide. In addition, these compounds may be used individually or in combination of 2 or more types.

光聚合起始劑(A)較佳為更含有在350 nm以上的波長範圍內不具有極大吸收波長且在小於350 nm的波長範圍內具有極大吸收波長的第二光聚合起始劑(A-2)。 第二光聚合起始劑(A-2)於紫外線(特別是350 nm~450 nm附近的波長光)照射後亦保持未反應的狀態而大量殘存於造形物中。因此,認為有可能於對造形物進行加熱時會產生自由基、陽離子或陰離子,且與未反應的(甲基)丙烯酸酯化合物反應而進行部分硬化。因此,藉由調配第二光聚合起始劑(A-2),可抑制高溫加熱時的膨脹,可防止於製作鑄模時鑄模產生裂紋或破裂。即,鑄造性優異。 The photopolymerization initiator (A) preferably further contains a second photopolymerization initiator (A- 2). The second photopolymerization initiator (A-2) also remains in an unreacted state after being irradiated with ultraviolet rays (especially light with wavelengths around 350 nm to 450 nm) and remains in the molded object in large amounts. Therefore, it is considered that radicals, cations, or anions are generated when the molded article is heated and react with the unreacted (meth)acrylate compound to partially harden the molded article. Therefore, by blending the second photopolymerization initiator (A-2), expansion during high-temperature heating can be suppressed, and cracks or breaks in the mold can be prevented when the mold is produced. That is, the castability is excellent.

作為所述第二光聚合起始劑(A-2),較佳為選自由苯烷基酮化合物、α-二酮化合物及錪鹽所組成的群組中的至少一種,具體而言,可列舉:1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮、2,2-二甲氧基-2-苯基苯乙酮、2-羥基-1-(4-(4-(2-羥基-2-甲基丙炔基)苄基)苯基)-2-甲基丙烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮、2-二甲基胺基-2-(4-甲基苄基)-1-(4-嗎啉基-4-基-苯基)-丁烷-1-酮、苯甲醯基甲酸甲酯、雙(2-苯基-2-氧代乙酸)氧基雙乙烯、作為市售品的錪鹽(例如,商品名「歐尼凱特(Omnicat)250」,IGM公司製造)。該些中,就獲取容易性及高溫加熱時的消失性提高的觀點而言,更佳為1-羥基環己基苯基酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2,2-二甲氧基-2-苯基苯乙酮。另外,該些化合物可單獨使用,亦可併用兩種以上。The second photopolymerization initiator (A-2) is preferably at least one selected from the group consisting of phenylalkyl ketone compounds, α-diketone compounds, and ion salts. Specifically, it can be Examples: 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy -2-Methyl-1-propan-1-one, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-1-(4-(4-(2-hydroxy-2- Methylpropynyl)benzyl)phenyl)-2-methylpropan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropane-1 -Ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-1-butanone, 2-dimethylamino-2-(4-methylbenzyl) )-1-(4-morpholin-4-yl-phenyl)-butan-1-one, methyl benzylcarboxylate, bis(2-phenyl-2-oxoacetic acid)oxybis Ethylene and commercially available ion salt (for example, trade name "Omnicat 250", manufactured by IGM). Among these, 1-hydroxycyclohexylphenyl ketone and 2-methyl-1-[4-(methylthio)phenyl are more preferred from the viewpoint of ease of acquisition and improvement in disappearing property when heated at high temperatures. ]-2-morpholinylpropan-1-one, 2,2-dimethoxy-2-phenylacetophenone. In addition, these compounds may be used individually or in combination of 2 or more types.

根據以上,第一光聚合起始劑(A-1)的添加可加快硬化速度,第二光聚合起始劑(A-2)的添加可抑制高溫加熱時的造形物的膨脹。進而第一光聚合起始劑(A-1)及第二光聚合起始劑(A-2)亦有助於提高高溫加熱時的消失性。 另一方面,於第一光聚合起始劑(A-1)的調配量過多的情況下,亦會產生因硬化速度過快而導致造形精度下降等問題。 因此,就可於適度調整硬化速度以提高造形精度的同時提高高溫加熱時的消失性、抑制膨脹的方面而言,較佳為所述第二光聚合起始劑(A-2)相對於所述第一光聚合起始劑(A-1)的調配比例[(A-1)/(A-2)]較佳為1/100~1/1的範圍,更佳為1/100~9/10的範圍,特佳為1/100~8/10的範圍。 From the above, the addition of the first photopolymerization initiator (A-1) can accelerate the hardening speed, and the addition of the second photopolymerization initiator (A-2) can suppress expansion of the molded article during high-temperature heating. Furthermore, the first photopolymerization initiator (A-1) and the second photopolymerization initiator (A-2) also contribute to improving the disappearing property during high-temperature heating. On the other hand, when the blending amount of the first photopolymerization initiator (A-1) is too high, problems such as a decrease in molding accuracy due to excessive curing speed may occur. Therefore, it is preferable that the second photopolymerization initiator (A-2) has a relative ratio of The blending ratio [(A-1)/(A-2)] of the first photopolymerization initiator (A-1) is preferably in the range of 1/100 to 1/1, more preferably 1/100 to 9 /10 range, particularly preferably in the range of 1/100 to 8/10.

[(B)成分] 本發明的組成物更含有多官能(甲基)丙烯酸酯(B)(於本說明書中,亦簡稱為(B)成分)。就容易獲得高反應速度及造形精度、容易進行三維光造形的觀點而言,(B)成分較佳為具有丙烯醯基。另一方面,就與丙烯醯基相比,甲基丙烯醯基的碳-碳雙鍵的α位的立體阻礙大、容易引起聚合物的解聚、高溫加熱時的消失性高的方面而言,(B)成分較佳為具有甲基丙烯醯基。 [(B)Component] The composition of the present invention further contains polyfunctional (meth)acrylate (B) (also referred to as component (B) in this specification). From the viewpoint of easily obtaining high reaction speed and molding accuracy, and easily performing three-dimensional photomolding, the component (B) preferably has an acryl group. On the other hand, the methacrylyl group has greater steric hindrance at the α-position of the carbon-carbon double bond than the acrylyl group, easily causes depolymerization of the polymer, and has high disappearing properties when heated at high temperatures. , (B) component preferably has a methacryl group.

作為(B)成分,具體而言,可使用:羥基特戊酸新戊二醇二(甲基)丙烯酸酯、甘油的環氧丙烷改質三(甲基)丙烯酸酯、2-羥基-3-丙烯醯氧基丙基(甲基)丙烯酸酯、三(羥基乙基)異氰脲酸二(甲基)丙烯酸酯、3,9-雙[1,1-二甲基-2-(甲基)丙烯醯氧基乙基]-2,4,8,10-四側氧螺[5.5]十一烷、二噁烷二醇二(甲基)丙烯酸酯、(環氧乙烷(ethylene oxide,EO))或(環氧丙烷(propylene oxide,PO))改質雙酚A二(甲基)丙烯酸酯、(EO)或(PO)改質雙酚E二(甲基)丙烯酸酯、(EO)或(PO)改質雙酚F二(甲基)丙烯酸酯、(EO)或(PO)改質雙酚S二(甲基)丙烯酸酯、(EO)或(PO)改質4,4'-氧基二雙酚二(甲基)丙烯酸酯等二官能(甲基)丙烯酸酯;As the component (B), specifically, hydroxypivalate neopentyl glycol di(meth)acrylate, glycerin propylene oxide modified tri(meth)acrylate, 2-hydroxy-3- Acryloxypropyl (meth)acrylate, tris(hydroxyethyl)isocyanurate di(meth)acrylate, 3,9-bis[1,1-dimethyl-2-(methyl) )Acryloxyethyl]-2,4,8,10-tetrafluorospiro[5.5]undecane, dioxanediol di(meth)acrylate, (ethylene oxide, EO)) or (propylene oxide (PO)) modified bisphenol A di(meth)acrylate, (EO) or (PO) modified bisphenol E di(meth)acrylate, (EO ) or (PO) modified bisphenol F di(meth)acrylate, (EO) or (PO) modified bisphenol S di(meth)acrylate, (EO) or (PO) modified 4,4 '-Oxydibisphenol di(meth)acrylate and other difunctional (meth)acrylates;

EO改質丙三醇三(甲基)丙烯酸酯、PO改質丙三醇三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、EO改質磷酸三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、己內酯改質三羥甲基丙烷三(甲基)丙烯酸酯、丙烯酸羥基丙酯(hydroxypropyl acrylate,HPA)改質三羥甲基丙烷三(甲基)丙烯酸酯、(EO)或(PO)改質三羥甲基丙烷三(甲基)丙烯酸酯、烷基改質二季戊四醇三(甲基)丙烯酸酯、三(丙烯醯氧基乙基)異氰脲酸酯等三官能(甲基)丙烯酸酯;EO modified glycerol tri(meth)acrylate, PO modified glycerol tri(meth)acrylate, pentaerythritol tri(meth)acrylate, EO modified phosphate tri(meth)acrylate, tris(meth)acrylate Hydroxymethylpropane tri(meth)acrylate, caprolactone modified trimethylolpropane tri(meth)acrylate, hydroxypropyl acrylate (HPA) modified trimethylolpropane tri(meth)acrylate base) acrylate, (EO) or (PO) modified trimethylolpropane tri(meth)acrylate, alkyl modified dipentaerythritol tri(meth)acrylate, tris(acryloxyethyl) Trifunctional (meth)acrylates such as isocyanurate;

二-三羥甲基丙烷四(甲基)丙烯酸酯、季戊四醇乙氧基四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等四官能(甲基)丙烯酸酯;Tetrafunctional (meth)acrylates such as di-trimethylolpropane tetra(meth)acrylate, pentaerythritol ethoxy tetra(meth)acrylate, and pentaerythritol tetra(meth)acrylate;

二季戊四醇羥基五(甲基)丙烯酸酯、烷基改質二季戊四醇五(甲基)丙烯酸酯等五官能(甲基)丙烯酸酯;Pentafunctional (meth)acrylates such as dipentaerythritol hydroxypenta(meth)acrylate and alkyl-modified dipentaerythritol penta(meth)acrylate;

二季戊四醇六(甲基)丙烯酸酯等六官能(甲基)丙烯酸酯。該些可單獨使用,且亦可為了調節硬化性或黏度等而適當混合使用。Hexafunctional (meth)acrylates such as dipentaerythritol hexa(meth)acrylate. These may be used individually or may be mixed and used appropriately in order to adjust hardening property, viscosity, etc.

就於對所形成的立體造形物進行高溫加熱時容易發生分解、可產生水或二氧化碳而減少灰塵殘留的方面而言,(B)成分較佳為含有在分子中包含多個氧原子的化合物。其中,較佳為含有在結構中具有聚氧伸烷基的化合物。The component (B) preferably contains a compound containing a plurality of oxygen atoms in the molecule in that the formed three-dimensional shaped object is easily decomposed when heated to high temperature and can produce water or carbon dioxide to reduce dust residue. Among these, compounds containing a polyoxyalkylene group in the structure are preferred.

(B)成分特佳為含有在分子中具有聚氧伸烷基及雙酚結構的化合物(B-1)。藉由具有雙酚結構,硬化速度加快,造形精度提高,容易進行三維立體造形。Particularly preferred component (B) is a compound (B-1) having a polyoxyalkylene group and a bisphenol structure in the molecule. By having a bisphenol structure, the hardening speed is accelerated, the molding accuracy is improved, and three-dimensional molding is easy to perform.

作為本發明中使用的所述化合物(B-1),具體而言, 由下述式(I): [化1] 表示,且R 1表示氫原子或甲基,同一分子中的多個R 1可相同亦可不同,m及n分別獨立地表示1以上的整數。 The compound (B-1) used in the present invention is specifically represented by the following formula (I): [Chemical 1] represents, and R 1 represents a hydrogen atom or a methyl group, multiple R 1 in the same molecule may be the same or different, m and n each independently represent an integer of 1 or more.

於所述化合物(B-1)中,若式(I)中的m+n(改質量)為2以上,則可減少煆燒時的灰塵殘留。就同樣的觀點而言,m+n亦可為4以上或6以上。進而,m+n只要為40以下即可,較佳為30以下。藉此,與m+n超過40的情況相比,所形成的立體造形物的強韌性及強度提高。 另外,於多官能(甲基)丙烯酸酯(B)包含多種m+n不同的式(I)的改質雙酚A二(甲基)丙烯酸酯的情況下,該些的平均只要為2~40即可。 In the compound (B-1), if m+n (mass modified) in the formula (I) is 2 or more, dust residue during calcination can be reduced. From the same viewpoint, m+n may be 4 or more or 6 or more. Furthermore, m+n only needs to be 40 or less, preferably 30 or less. Thereby, compared with the case where m+n exceeds 40, the toughness and strength of the formed three-dimensional shaped object are improved. In addition, when the multifunctional (meth)acrylate (B) contains a plurality of modified bisphenol A di(meth)acrylates of the formula (I) with different m+n, the average of these only needs to be 2 to 40 is enough.

於式(I)所表示的化合物(B-1)在分子內具有甲基丙烯醯基的情況下,與具有丙烯醯基的情況相比,可減少煆燒時的灰塵殘留。另一方面,於相較於減少灰塵殘留而優先提高硬化速度及造形精度的情況下,亦可使用具有丙烯醯基的化合物(B-1)。When the compound (B-1) represented by the formula (I) has a methacryloyl group in the molecule, compared with the case where the compound (B-1) has an acrylyl group, dust residue during baking can be reduced. On the other hand, when priority is given to improving the hardening speed and molding accuracy rather than reducing dust residue, the compound (B-1) having an acryl group may be used.

作為本發明中使用的化合物(B-1),例如可使用作為市售品以米拉默(MIRAMER)M240、米拉默(MIRAMER)M241、米拉默(MIRAMER)M244、米拉默(MIRAMER)M249、米拉默(MIRAMER)M2100、米拉默(MIRAMER)M2101、米拉默(MIRAMER)M2200、米拉默(MIRAMER)M2300、米拉默(MIRAMER)M2301(均為製品名。美原特種化學(Miwon Specialty Chemical)公司製造)等名稱銷售的紫外線硬化樹脂。As the compound (B-1) used in the present invention, for example, commercially available products such as MIRAMER M240, MIRAMER M241, MIRAMER M244, and MIRAMER can be used. ) M249, MIRAMER M2100, MIRAMER M2101, MIRAMER M2200, MIRAMER M2300, MIRAMER M2301 (all are product names. Mihara Special UV-curable resin sold under names such as Miwon Specialty Chemical Co., Ltd.

多官能(甲基)丙烯酸酯(B)亦可於獲得本發明的效果的範圍內含有化合物(B-1)以外的光聚合性成分。例如,亦可更含有在分子內具有一個以上的(甲基)丙烯醯基的化合物(B-2)。The polyfunctional (meth)acrylate (B) may contain a photopolymerizable component other than the compound (B-1) within the range in which the effects of the present invention are obtained. For example, the compound (B-2) having one or more (meth)acrylyl groups in the molecule may be further contained.

就減少煆燒時的殘渣的方面而言,本發明中使用的化合物(B-2)較佳為僅含有氫原子、碳原子、氧原子的化合物,特佳為醇與(甲基)丙烯酸進行脫水縮合而獲得的(甲基)丙烯酸酯化合物。 作為化合物(B-2),可使用聚乙二醇、聚丙二醇、聚四亞甲基二醇、乙二醇、二乙二醇、三乙二醇、1,3-丙二醇、1,2-丙二醇、二丙二醇、三丙二醇、新戊二醇、1,3-丁二醇、2,3-丁二醇、1,4-丁二醇、1,6-己二醇、1,8-辛二醇、1,9-壬二醇、1,10-癸二醇、2,2,4-三甲基-1,3-戊二醇、3-甲基-1,5-戊二醇、環己烷二甲醇(cyclohexane dimethylol)、1,4-環己烷二醇、三環癸烷二甲醇(tricyclodecane dimethylol)等醇與(甲基)丙烯酸的反應生成物。該些化合物可單獨使用,亦可併用兩種以上。其中,就提高立體造形物的硬度的觀點而言,較佳為新戊二醇二(甲基)丙烯酸酯或聚丙二醇的二(甲基)丙烯酸酯,就減少煆燒時的灰塵殘留的觀點而言,更佳為新戊二醇二甲基丙烯酸酯或聚丙二醇的二甲基丙烯酸酯。 In order to reduce the residue during calcination, the compound (B-2) used in the present invention is preferably a compound containing only hydrogen atoms, carbon atoms, and oxygen atoms, and is particularly preferably a compound containing alcohol and (meth)acrylic acid. (Meth)acrylate compound obtained by dehydration condensation. As the compound (B-2), polyethylene glycol, polypropylene glycol, polytetramethylene glycol, ethylene glycol, diethylene glycol, triethylene glycol, 1,3-propanediol, 1,2- Propylene glycol, dipropylene glycol, tripropylene glycol, neopentyl glycol, 1,3-butanediol, 2,3-butanediol, 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol Diol, 1,9-nonanediol, 1,10-decanediol, 2,2,4-trimethyl-1,3-pentanediol, 3-methyl-1,5-pentanediol, The reaction product of alcohols such as cyclohexane dimethylol, 1,4-cyclohexanediol, and tricyclodecane dimethylol and (meth)acrylic acid. These compounds may be used individually or in combination of 2 or more types. Among them, neopentyl glycol di(meth)acrylate or polypropylene glycol di(meth)acrylate is preferable from the viewpoint of increasing the hardness of the three-dimensional molded object, and from the viewpoint of reducing dust residue during firing Specifically, neopentyl glycol dimethacrylate or polypropylene glycol dimethacrylate is more preferred.

作為本發明中使用的化合物(B-2),例如可使用作為市售品以米拉默(MIRAMER)M213、米拉默(MIRAMER)M220、米拉默(MIRAMER)M221、米拉默(MIRAMER)M222、米拉默(MIRAMER)M231、米拉默(MIRAMER)M232、米拉默(MIRAMER)M233、米拉默(MIRAMER)M235、米拉默(MIRAMER)M270、米拉默(MIRAMER)M280、米拉默(MIRAMER)M281、米拉默(MIRAMER)M282、米拉默(MIRAMER)M283、米拉默(MIRAMER)M284、米拉默(MIRAMER)M286、米拉默(MIRAMER)M2040、米拉默(MIRAMER)M2053(均為製品名。美原特種化學(Miwon Specialty Chemical)公司製造)、NK酯 A-200、NK酯 A-400、NK酯 A-600、NK酯 A-1000、NK酯 APG-100、NK酯 APG-200、NK酯 APG-400、NK酯 APG-700、NK酯 APMG-65、NK酯 2G、NK酯 3G、NK酯 4G、NK酯 9G、NK酯 14G、NK酯 23G、NK酯 3PG、NK酯 9PG(均為製品名。新中村化學工業公司製造)的名稱銷售的化合物。As the compound (B-2) used in the present invention, for example, commercially available products such as MIRAMER M213, MIRAMER M220, MIRAMER M221, and MIRAMER can be used. ) M222, MIRAMER M231, MIRAMER M232, MIRAMER M233, MIRAMER M235, MIRAMER M270, MIRAMER M280 , MIRAMER M281, MIRAMER M282, MIRAMER M283, MIRAMER M284, MIRAMER M286, MIRAMER M2040, m MIRAMER M2053 (all are product names. Manufactured by Miwon Specialty Chemical Co., Ltd.), NK ester A-200, NK ester A-400, NK ester A-600, NK ester A-1000, NK ester APG-100, NK ester APG-200, NK ester APG-400, NK ester APG-700, NK ester APMG-65, NK ester 2G, NK ester 3G, NK ester 4G, NK ester 9G, NK ester 14G, NK ester Compounds sold under the names 23G, NK ester 3PG, and NK ester 9PG (all are product names. Manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).

於本發明中的多官能(甲基)丙烯酸酯(B)含有化合物(B-1)及化合物(B-2)此兩者的情況下,相對於多官能(甲基)丙烯酸酯(B)100質量份,化合物(B-1)的調配量較佳為10質量份以上且99質量份以下的範圍,更佳為25質量份以上且95質量份以下的範圍,特佳為40質量份以上且90質量份以下的範圍。藉由設為該些範圍,硬化速度適度加快,藉此造形精度提高,煆燒時的殘渣減少。 相對於多官能(甲基)丙烯酸酯(B)100質量份,化合物(B-2)的調配量較佳為5質量份以上且80質量份以下的範圍,更佳為8質量份以上且65質量份以下的範圍,特佳為10質量份以上且50質量份以下的範圍。藉由設為該些範圍,硬化物的硬度會提高。 When the polyfunctional (meth)acrylate (B) in the present invention contains both the compound (B-1) and the compound (B-2), relative to the polyfunctional (meth)acrylate (B) 100 parts by mass, the compounding amount of compound (B-1) is preferably in the range of 10 parts by mass or more and 99 parts by mass or less, more preferably in the range of 25 parts by mass or more and 95 parts by mass or less, particularly preferably 40 parts by mass or more And the range is less than 90 parts by mass. By setting it within these ranges, the hardening speed is appropriately accelerated, thereby improving the molding accuracy and reducing the residue during firing. The compounding amount of the compound (B-2) is preferably in the range of 5 to 80 parts by mass relative to 100 parts by mass of the polyfunctional (meth)acrylate (B), more preferably 8 to 65 parts by mass. The range is not more than 10 parts by mass and not more than 50 parts by mass. By setting it within these ranges, the hardness of the hardened material will be increased.

作為所述光硬化性樹脂組成物的製造方法,並無特別限制,可利用任何方法製造。There is no particular limitation on the method for producing the photocurable resin composition, and it can be produced by any method.

本發明的光硬化性樹脂組成物視需要亦可含有光增感劑、紫外線吸收劑、抗氧化劑、聚合抑制劑、矽系添加劑、氟系添加劑、矽烷偶合劑、磷酸酯化合物、有機填料、無機填料、流變控制劑、脫泡劑、著色劑等各種添加劑。The photocurable resin composition of the present invention may also contain photosensitizers, ultraviolet absorbers, antioxidants, polymerization inhibitors, silicon additives, fluorine additives, silane coupling agents, phosphate compounds, organic fillers, inorganic fillers, etc. Fillers, rheology control agents, defoaming agents, colorants and other additives.

作為所述光增感劑,例如可列舉:脂肪族胺、芳香族胺等胺化合物、鄰甲苯基硫脲等脲化合物、二乙基二硫代磷酸鈉、s-苄基異硫脲鎓-對甲苯磺酸鹽等硫化合物等。Examples of the photosensitizer include amine compounds such as aliphatic amines and aromatic amines, urea compounds such as o-tolylthiourea, sodium diethyldithiophosphate, s-benzylisothiouronium- Sulfur compounds such as p-toluenesulfonate, etc.

作為所述紫外線吸收劑,例如可列舉:2-[4-{(2-羥基-3-十二烷基氧基丙基)氧基}-2-羥基苯基]-4,6-雙(2,4-二甲基苯基)-1,3,5-三嗪、2-[4-{(2-羥基-3-十三烷基氧基丙基)氧基}-2-羥基苯基]-4,6-雙(2,4-二甲基苯基)-1,3,5-三嗪等三嗪衍生物;2-(2'-呫噸羧基-5'-甲基苯基)苯並三唑、2-(2'-鄰硝基苄氧基-5'-甲基苯基)苯並三唑、2-呫噸羧基-4-十二烷氧基二苯甲酮、2-鄰硝基苄氧基-4-十二烷氧基二苯甲酮等。該些紫外線吸收劑既可單獨使用亦可併用兩種以上。Examples of the ultraviolet absorber include: 2-[4-{(2-hydroxy-3-dodecyloxypropyl)oxy}-2-hydroxyphenyl]-4,6-bis( 2,4-Dimethylphenyl)-1,3,5-triazine, 2-[4-{(2-hydroxy-3-tridecyloxypropyl)oxy}-2-hydroxybenzene methyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and other triazine derivatives; 2-(2'-xanthenecarboxy-5'-methylbenzene benzotriazole, 2-(2'-o-nitrobenzyloxy-5'-methylphenyl)benzotriazole, 2-xanthenecarboxy-4-dodecyloxybenzophenone , 2-O-nitrobenzyloxy-4-dodecyloxybenzophenone, etc. These ultraviolet absorbers may be used alone or in combination of two or more types.

作為所述抗氧化劑,例如可列舉:受阻酚系抗氧化劑、受阻胺系抗氧化劑、有機硫系抗氧化劑、磷酸酯系抗氧化劑等。該些抗氧化劑既可單獨使用亦可併用兩種以上。Examples of the antioxidant include hindered phenol antioxidants, hindered amine antioxidants, organic sulfur antioxidants, phosphate ester antioxidants, and the like. These antioxidants may be used alone or in combination of two or more types.

作為所述聚合抑制劑,例如可列舉:對苯二酚、甲醌、二-第三丁基對苯二酚、對甲氧基苯酚、丁基羥基甲苯、亞硝胺鹽等。Examples of the polymerization inhibitor include hydroquinone, methoquinone, di-tert-butylhydroquinone, p-methoxyphenol, butylhydroxytoluene, and nitrosamine salts.

作為所述矽系添加劑,例如可列舉:二甲基聚矽氧烷、甲基苯基聚矽氧烷、環狀二甲基聚矽氧烷、甲基氫聚矽氧烷、聚醚改質二甲基聚矽氧烷共聚物、聚酯改質二甲基聚矽氧烷共聚物、氟改質二甲基聚矽氧烷共聚物、胺基改質二甲基聚矽氧烷共聚物等具有烷基或苯基的聚有機矽氧烷、聚醚改質具有丙烯酸基的聚二甲基矽氧烷、聚酯改質具有丙烯酸基的聚二甲基矽氧烷等。該些矽系添加劑既可單獨使用亦可併用兩種以上。Examples of the silicone additive include: dimethyl polysiloxane, methylphenyl polysiloxane, cyclic dimethyl polysiloxane, methyl hydrogen polysiloxane, and modified polyether. Dimethyl polysiloxane copolymer, polyester modified dimethyl polysiloxane copolymer, fluorine modified dimethyl polysiloxane copolymer, amine modified dimethyl polysiloxane copolymer Polyorganosiloxanes with alkyl or phenyl groups, polyether-modified polydimethylsiloxane with acrylic groups, polyester-modified polydimethylsiloxanes with acrylic groups, etc. These silicon-based additives may be used alone or in combination of two or more types.

作為所述氟系添加劑,例如可列舉迪愛生(DIC)股份有限公司製造的「美佳法斯(Megaface)」系列等。該些氟系添加劑既可單獨使用亦可併用兩種以上。Examples of the fluorine-based additive include the "Megaface" series manufactured by DIC Co., Ltd. These fluorine-based additives may be used alone or in combination of two or more types.

作為所述矽烷偶合劑,例如可列舉:乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷、對苯乙烯基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基-亞丁基)丙基胺、N-苯基-3-胺基丙基三甲氧基矽烷、N-(乙烯基苄基)-2-胺基乙基-3-胺基丙基三甲氧基矽烷的鹽酸鹽、特殊胺基矽烷、3-脲基丙基三乙氧基矽烷、3-氯丙基三甲氧基矽烷、3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷、雙(三乙氧基矽烷基丙基)四硫醚、3-異氰酸酯丙基三乙氧基矽烷、烯丙基三氯矽烷、烯丙基三乙氧基矽烷、烯丙基三甲氧基矽烷、二乙氧基甲基乙烯基矽烷、乙烯基三(2-甲氧基乙氧基)矽烷等乙烯基系矽烷偶合劑;Examples of the silane coupling agent include vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane. , 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane Silane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethyl Oxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyl Methyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxy silane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propyl amine, N-phenyl-3-aminopropyltrimethoxysilane, hydrochloride of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane, Special aminosilane, 3-ureidopropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, Bis(triethoxysilylpropyl)tetrasulfide, 3-isocyanatepropyltriethoxysilane, allyltrichlorosilane, allyltriethoxysilane, allyltrimethoxysilane, Vinyl-based silane coupling agents such as diethoxymethylvinylsilane and vinyltris(2-methoxyethoxy)silane;

二乙氧基(縮水甘油基氧基丙基)甲基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷等環氧系矽烷偶合劑;Diethoxy(glycidyloxypropyl)methylsilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3 -Epoxy silane coupling agents such as glycidoxypropylmethyldiethoxysilane and 3-glycidoxypropyltriethoxysilane;

對苯乙烯基三甲氧基矽烷等苯乙烯系矽烷偶合劑;Styrenic silane coupling agents such as p-styrenetrimethoxysilane;

3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷等(甲基)丙烯醯氧基系矽烷偶合劑;3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methyl (Meth)acryloxy-based silane coupling agents such as acryloxypropylmethyldiethoxysilane and 3-methacryloxypropyltriethoxysilane;

N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基-亞丁基)丙基胺、N-苯基-3-胺基丙基三甲氧基矽烷等胺基系矽烷偶合劑;N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-( 2-Aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilane Amino-based silane coupling agents such as -N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane;

3-脲基丙基三乙氧基矽烷等脲系矽烷偶合劑;Urea silane coupling agents such as 3-ureidopropyltriethoxysilane;

3-氯丙基三甲氧基矽烷等氯丙基系矽烷偶合劑;Chloropropyl silane coupling agents such as 3-chloropropyltrimethoxysilane;

3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷等巰基系矽烷偶合劑;Thiol-based silane coupling agents such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane;

雙(三乙氧基矽烷基丙基)四硫醚等硫醚系矽烷偶合劑;Thioether silane coupling agents such as bis(triethoxysilylpropyl)tetrasulfide;

3-異氰酸酯丙基三乙氧基矽烷等異氰酸酯系矽烷偶合劑等。該些矽烷偶合劑既可單獨使用亦可併用兩種以上。Isocyanate-based silane coupling agents such as 3-isocyanatepropyltriethoxysilane, etc. These silane coupling agents may be used alone or in combination of two or more.

作為所述磷酸酯化合物,例如可列舉分子結構中具有(甲基)丙烯醯基的化合物,作為市售品,例如可列舉:日本化藥股份有限公司製造的「卡亞美(Kayamer)PM-2」、「卡亞美(Kayamer)PM-21」、共榮社化學股份有限公司製造的「萊特酯(Light Ester)P-1M」、「萊特酯(Light Ester)P-2M」、「萊特丙烯酸酯(Light Acrylate)P-1A(N)」、蘇威特(SOLVAY)公司製造的「斯珀美(SIPOMER)PAM 100」、「斯珀美(SIPOMER)PAM 200」、「斯珀美(SIPOMER)PAM 300」、「斯珀美(SIPOMER)PAM 4000」、大阪有機化學工業公司製造的「比斯克特(Viscoat)#3PA」、「比斯克特(Viscoat)#3PMA」、第一工業製藥公司製造的「新前沿(New Frontier)S-23A」;作為分子結構中具有烯丙基醚基的磷酸酯化合物的蘇威特(SOLVAY)公司製造的「斯珀美(SIPOMER)PAM 5000」等。Examples of the phosphate ester compound include compounds having a (meth)acrylyl group in the molecular structure. Examples of commercially available products include: "Kayamer PM-" manufactured by Nippon Kayaku Co., Ltd. 2", "Kayamer PM-21", "Light Ester (Light Ester) P-1M", "Light Ester (Light Ester) P-2M", "Light Ester (Light Ester) P-2M" manufactured by Kyeisha Chemical Co., Ltd. Acrylate (Light Acrylate) P-1A (N)", "SIPOMER PAM 100", "SIPOMER PAM 200", "SIPOMER ( SIPOMER PAM 300", "SIPOMER PAM 4000", "Viscoat #3PA", "Viscoat #3PMA" manufactured by Osaka Organic Chemical Industries, Ltd., Daiichi Industrial Pharmaceuticals "New Frontier S-23A" manufactured by the company; "SIPOMER PAM 5000" manufactured by the SOLVAY Company, which is a phosphate ester compound having an allyl ether group in the molecular structure, etc. .

作為所述有機填料,例如可列舉:纖維素、木質素及纖維素奈米纖維等源自植物的溶劑不溶性物質、聚甲基丙烯酸甲酯珠粒、聚碳酸酯珠粒、聚苯乙烯珠粒、聚丙烯酸苯乙烯珠粒、矽酮珠粒、玻璃珠粒、丙烯酸珠粒、苯並胍胺系樹脂珠粒、三聚氰胺系樹脂珠粒、聚烯烴系樹脂珠粒、聚酯系樹脂珠粒、聚醯胺樹脂珠粒、聚醯亞胺系樹脂珠粒、聚氟乙烯樹脂珠粒、聚乙烯樹脂珠粒等有機珠粒等。該些有機填料既可單獨使用亦可併用兩種以上。Examples of the organic filler include solvent-insoluble substances derived from plants such as cellulose, lignin, and cellulose nanofibers, polymethylmethacrylate beads, polycarbonate beads, and polystyrene beads. , polyacrylic styrene beads, silicone beads, glass beads, acrylic beads, benzoguanamine resin beads, melamine resin beads, polyolefin resin beads, polyester resin beads, Organic beads such as polyamide resin beads, polyimide-based resin beads, polyvinyl fluoride resin beads, polyethylene resin beads, etc. These organic fillers may be used alone or in combination of two or more types.

作為所述無機填料,例如可列舉二氧化矽、氧化鋁、氧化鋯、二氧化鈦、鈦酸鋇、三氧化銻等無機微粒等。該些無機填料既可單獨使用亦可併用兩種以上。另外,所述無機微粒的平均粒徑較佳為95 nm~250 nm的範圍,尤其更佳為100 nm~180 nm的範圍。Examples of the inorganic filler include inorganic fine particles such as silica, alumina, zirconium oxide, titanium dioxide, barium titanate, and antimony trioxide. These inorganic fillers may be used alone or in combination of two or more types. In addition, the average particle diameter of the inorganic fine particles is preferably in the range of 95 nm to 250 nm, and particularly preferably in the range of 100 nm to 180 nm.

於含有所述無機微粒的情況下,可使用分散助劑。作為所述分散助劑,例如可列舉:異丙基酸式磷酸酯、三異癸基亞磷酸酯、環氧乙烷改質磷酸二甲基丙烯酸酯等磷酸酯化合物等。該些分散助劑既可單獨使用亦可併用兩種以上。另外,作為所述分散助劑的市售品,例如可列舉:日本化藥股份有限公司製造的「卡亞美(Kayamer)PM-21」、「卡亞美(Kayamer)PM-2」、共榮社化學股份有限公司製造的「萊特酯(Light Ester)P-2M」等。When the inorganic fine particles are contained, a dispersion aid may be used. Examples of the dispersion aid include phosphate compounds such as isopropyl acid phosphate, triisodecyl phosphite, and ethylene oxide-modified phosphoric acid dimethacrylate. These dispersion aids may be used alone or in combination of two or more types. Examples of commercially available dispersion aids include "Kayamer PM-21" and "Kayamer PM-2" manufactured by Nippon Kayaku Co., Ltd. "Light Ester P-2M" manufactured by Eishe Chemical Co., Ltd., etc.

作為所述流變控制劑,例如可列舉:楠本化成股份有限公司製造的「帝斯巴隆(Disparlon)6900」等醯胺蠟類;畢克化學(BYK-Chemie)公司製造的「BYK410」等脲系流變控制劑類;楠本化成股份有限公司製造的「帝斯巴隆(Disparlon)4200」等聚乙烯蠟;伊斯曼化學產品(Eastman Chemical Products)公司製造的「CAB-381-2」、「CAB 32101」等乙酸丁酸纖維素等。Examples of the rheology control agent include amide waxes such as "Disparlon 6900" manufactured by Kusumoto Chemical Co., Ltd.; "BYK410" manufactured by BYK-Chemie, etc. Urea-based rheology control agents; polyethylene waxes such as "Disparlon 4200" manufactured by Kusumoto Chemical Co., Ltd.; "CAB-381-2" manufactured by Eastman Chemical Products Co., Ltd. , "CAB 32101" and other cellulose acetate butyrate, etc.

作為所述脫泡劑,例如可列舉含氟或者矽原子的寡聚物、或高級脂肪酸、丙烯酸聚合物等寡聚物等。Examples of the defoaming agent include oligomers containing fluorine or silicon atoms, or oligomers such as higher fatty acids and acrylic polymers.

作為所述著色劑,例如可列舉顏料、染料等。Examples of the colorant include pigments, dyes, and the like.

作為所述顏料,可使用公知慣用的無機顏料或有機顏料。As the pigment, well-known and commonly used inorganic pigments or organic pigments can be used.

作為所述無機顏料,例如可列舉氧化鈦、銻紅、鐵丹、鎘紅、鎘黃、鈷藍、普魯士藍、群青、碳黑、石墨等。Examples of the inorganic pigment include titanium oxide, antimony red, titanium oxide, cadmium red, cadmium yellow, cobalt blue, Prussian blue, ultramarine blue, carbon black, graphite, and the like.

作為所述有機顏料,例如可列舉喹吖啶酮顏料、喹吖啶酮醌顏料、二噁嗪顏料、酞菁顏料、蒽嘧啶顏料、蒽嵌蒽醌顏料、陰丹士林顏料、黃烷士酮顏料、苝顏料、二酮吡咯並吡咯顏料、紫環酮(perinone)顏料、喹酞酮(quinophthalone)顏料、蒽醌顏料、硫靛顏料、苯並咪唑酮顏料、偶氮顏料等。該些顏料既可單獨使用亦可併用兩種以上。Examples of the organic pigments include quinacridone pigments, quinacridonequinone pigments, dioxazine pigments, phthalocyanine pigments, anthrapyrimidine pigments, anthraquinone pigments, indanthrene pigments, and flavans. Ketone pigments, perylene pigments, diketopyrrolopyrrole pigments, perinone pigments, quinophthalone pigments, anthraquinone pigments, thioindigo pigments, benzimidazolone pigments, azo pigments, etc. These pigments may be used individually or in combination of 2 or more types.

作為所述染料,例如可列舉:單偶氮-雙偶氮等的偶氮染料、金屬錯鹽染料、萘酚染料、蒽醌染料、靛藍染料、碳陽離子(carbonium)染料、醌亞胺(quinoneimine)染料、花青染料、喹啉染料、硝基染料、亞硝基染料、苯醌染料、萘醌染料、萘二甲醯亞胺染料、紫環酮染料、酞菁染料、三烯丙基甲烷系染料等。該些染料既可單獨使用亦可併用兩種以上。Examples of the dye include azo dyes such as monoazo and disazo, metal erium salt dyes, naphthol dyes, anthraquinone dyes, indigo dyes, carbonium dyes, and quinoneimine dyes. ) dyes, cyanine dyes, quinoline dyes, nitro dyes, nitroso dyes, benzoquinone dyes, naphthoquinone dyes, naphthalenedimine dyes, iconone dyes, phthalocyanine dyes, triallylmethane Department of dyes, etc. These dyes may be used individually or in combination of 2 or more types.

於所述著色劑中,就減少煆燒時的殘渣的觀點而言,更佳為非金屬有機顏料(C)(以下,亦簡稱為(C)成分)。具體而言,特佳為喹吖啶酮顏料、喹吖啶酮醌顏料、二噁嗪顏料、偶氮顏料等。Among the colorants, from the viewpoint of reducing residue during baking, the non-metallic organic pigment (C) (hereinafter, also referred to as (C) component) is more preferred. Specifically, quinacridone pigments, quinacridonequinone pigments, dioxazine pigments, azo pigments, and the like are particularly preferred.

相對於(B)成分100質量份,本發明的組成物中的著色劑的含量較佳為0.001質量份~5質量份的範圍,進而佳為0.001質量份~1質量份的範圍,特佳為0.001質量份~0.5質量份的範圍。藉由設為該些範圍,可於提高視認性的同時,抑制造形物煆燒時生成殘渣。The content of the colorant in the composition of the present invention is preferably in the range of 0.001 to 5 parts by mass relative to 100 parts by mass of component (B), more preferably in the range of 0.001 to 1 part by mass, and particularly preferably The range is 0.001 parts by mass to 0.5 parts by mass. By setting it within these ranges, it is possible to suppress the generation of residue when the molded article is fired while improving visibility.

本發明的硬化物是將所述光硬化性樹脂組成物硬化而成。The cured product of the present invention is obtained by curing the photocurable resin composition.

本發明的硬化物可藉由對所述光硬化性樹脂組成物照射紫外線而獲得,為了效率良好地進行利用紫外線的硬化反應,可於氮氣等惰性氣體環境下照射,亦可於空氣環境下照射。The cured product of the present invention can be obtained by irradiating the photocurable resin composition with ultraviolet rays. In order to efficiently carry out the curing reaction using ultraviolet rays, it can be irradiated in an inert gas environment such as nitrogen or in an air environment. .

作為紫外線產生源,就實用性、經濟性的方面而言,一般使用紫外線燈。具體而言,可列舉:低壓水銀燈、高壓水銀燈、超高壓水銀燈、氙燈、鎵燈、金屬鹵化物燈、太陽光、發光二極體(light emitting diode,LED)等。該些中,就長時間可獲得穩定的照度的方面而言,較佳為將LED作為光源。As a source of ultraviolet rays, ultraviolet lamps are generally used in terms of practicality and economy. Specifically, examples include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, gallium lamps, metal halide lamps, sunlight, light emitting diodes (light emitting diodes, LEDs), and the like. Among these, in terms of obtaining stable illumination for a long time, it is preferable to use LED as the light source.

所述紫外線的波長只要是可使本發明的光硬化性樹脂組成物硬化的波長,則並無特別限定,可於1 nm~450 nm的範圍內適當選擇。The wavelength of the ultraviolet ray is not particularly limited as long as it can cure the photocurable resin composition of the present invention, and can be appropriately selected in the range of 1 nm to 450 nm.

再者,所述紫外線的照射可以一階段進行,亦可分為兩階段以上進行。Furthermore, the ultraviolet irradiation can be performed in one stage, or can be divided into two or more stages.

本發明的立體造形物可藉由公知的光學立體造形法來製作。The three-dimensional shaped object of the present invention can be produced by a known optical three-dimensional shaping method.

作為所述光學立體造形法,例如可列舉立體光固化成型(Stereo Lithography apparatus,SLA)方式、數位光處理(digital light processing,DLP)方式、液晶顯示器(liquid crystal display,LCD)方式、噴墨方式。Examples of the optical three-dimensional modeling method include stereolithography (Stereo Lithography apparatus, SLA) method, digital light processing (DLP) method, liquid crystal display (LCD) method, and inkjet method. .

所謂所述立體光固化成型(SLA)方式是對液狀的光硬化性樹脂組成物的槽以點的形式照射紫外線,一面移動造形台一面逐層硬化來進行立體造形的方式。The so-called stereolithography (SLA) method is a method in which ultraviolet rays are irradiated in spots of a liquid photocurable resin composition tank, and the molding table is moved to solidify it layer by layer to perform three-dimensional molding.

所謂所述數位光處理(DLP)方式、液晶顯示器(LCD)方式是對液狀的光硬化性樹脂組成物的槽以面的形式照射紫外線,一面移動造形台一面逐層硬化來進行立體造形的方式。The so-called digital light processing (DLP) method and the liquid crystal display (LCD) method perform three-dimensional modeling by irradiating ultraviolet rays on a surface of a groove of a liquid photocurable resin composition and hardening it layer by layer while moving the modeling table. Way.

所謂所述噴墨光造形法是將光硬化性樹脂組成物的微小液滴自噴嘴噴出以描繪規定的形狀圖案,然後照射紫外線而形成硬化薄膜的方法。The inkjet photolithography method is a method in which minute droplets of a photocurable resin composition are ejected from a nozzle to draw a predetermined shape pattern, and then ultraviolet rays are irradiated to form a cured film.

於該些光學立體造形法中,就能夠進行基於面的高速造形的方面而言,較佳為DLP方式。Among these optical three-dimensional modeling methods, the DLP method is preferred in terms of enabling high-speed surface-based modeling.

作為所述DLP方式的立體造形方法,只要為使用DLP方式的光造形系統的方法則並無特別限制,作為其造形條件,就立體造形物的造形精度變得良好的方面而言,需要光造形的積層間距為0.01 mm~0.2 mm的範圍,照射波長為350 nm~410 nm的範圍,光強度為0.5 mW/cm 2~50 mW/cm 2的範圍,每層的累計光量為1 mJ/cm 2~100 mJ/cm 2的範圍,其中,就立體造形物的造形精度進一步變得良好的方面而言,較佳為:光造形的積層間距為0.02 mm~0.1 mm的範圍,照射波長為380 nm~410 nm的範圍,光強度為5 mW/cm 2~15 mW/cm 2的範圍,每層的累計光量為5 mJ/cm 2~80 mJ/cm 2的範圍。 The DLP three-dimensional modeling method is not particularly limited as long as it uses a DLP light modeling system. As a forming condition, light modeling is required in order to improve the molding accuracy of the three-dimensional shaped object. The lamination spacing is in the range of 0.01 mm ~ 0.2 mm, the irradiation wavelength is in the range of 350 nm ~ 410 nm, the light intensity is in the range of 0.5 mW/cm 2 ~ 50 mW/cm 2 , and the cumulative light amount of each layer is 1 mJ/cm In the range of 2 to 100 mJ/cm 2 , in order to further improve the molding accuracy of the three-dimensional molded object, it is preferable that the lamination pitch of the photo-molding is in the range of 0.02 mm to 0.1 mm, and the irradiation wavelength is 380 nm to 410 nm, the light intensity is in the range of 5 mW/cm 2 to 15 mW/cm 2 , and the cumulative light amount of each layer is in the range of 5 mJ/cm 2 to 80 mJ/cm 2 .

關於本發明的立體造形物,就具有優異的鑄造性的方面而言,所述立體造形物的煆燒時的殘存率於氮氣環境下、400℃的條件下較佳為62%以下,更佳為57%以下,特佳為50%以下。再者,於本發明中,煆燒時的殘存率為利用熱重量示差熱測定(熱重量示差熱分析(Thermogravimetry/Differential Thermal Analysis,TG-DTA))中的[(400℃下的重量)/(25℃下的初始重量)]計算出的值。Regarding the three-dimensional shaped object of the present invention, in terms of having excellent castability, the residual rate of the three-dimensional shaped object during firing is preferably 62% or less, more preferably, under the conditions of 400° C. in a nitrogen atmosphere. The best value is below 57%, and the best value is below 50%. Furthermore, in the present invention, the residual rate during calcination is [(weight at 400°C)/ (Initial weight at 25°C)] calculated value.

本發明的立體造形物例如可用於牙科材料、汽車零件、航空宇宙相關零件、電氣電子零件、建材、室內裝飾、珠寶、醫療材料等。The three-dimensional shaped object of the present invention can be used for, for example, dental materials, automobile parts, aerospace-related parts, electrical and electronic parts, building materials, interior decoration, jewelry, medical materials, and the like.

作為所述醫療材料,例如可列舉:牙科治療用的手術導引板(surgical guide)、假牙、牙橋、牙齒矯正器具等牙科用的硬質樹脂材料。Examples of the medical material include surgical guides for dental treatment, dental hard resin materials such as dentures, dental bridges, and orthodontic appliances.

另外,本發明的立體造形物由於具有優異的硬度及鑄造性,因此對於使用所述立體造形物的鑄模的製造亦適宜。In addition, since the three-dimensional molded object of the present invention has excellent hardness and castability, it is also suitable for the production of a casting mold using the three-dimensional molded object.

作為所述鑄模的製造方法,例如可列舉如下方法等,即具有使本發明的立體造形物的一部分或全部被包埋材料包埋的步驟(1),使所述包埋材料硬化或固化的步驟(2),使所述立體造形物熔融去除、分解去除及/或焚化去除的步驟(3)。Examples of methods for manufacturing the casting mold include a method including the step (1) of embedding part or all of the three-dimensional molded object of the present invention with an embedding material, and hardening or solidifying the embedding material. Step (2), step (3) of melting, decomposing and/or incineration removing the three-dimensional shaped object.

作為所述包埋材料,例如可列舉石膏系包埋材料、磷酸鹽系包埋材料等,作為所述石膏系包埋材料,例如可列舉:二氧化矽包埋材料、石英包埋材料、方矽石包埋材料等。Examples of the investment material include gypsum-based investment materials, phosphate-based investment materials, and the like. Examples of the gypsum-based investment materials include silica investment materials, quartz investment materials, and square investment materials. Silica investment materials, etc.

作為所述步驟(1),為使本發明的立體造形物的一部分或全部被包埋材料包埋的步驟。此時,較佳為使所述包埋材料與適量的水混練。若混水比過多,則硬化時間變長,若混水比過少,則流動性變差,包埋材料料的流入會變得困難。另外,若於所述立體造形物上塗佈界面活性劑,則包埋材料良好地潤濕並融合,因此鑄造物的表面不易變粗糙,而較佳。進而,於包埋所述立體造形物時,較佳為以氣泡不附著於鑄造物表面的方式進行包埋。The step (1) is a step of embedding part or all of the three-dimensional sculpture of the present invention with an embedding material. At this time, it is preferable to knead the embedding material with an appropriate amount of water. If the water mixing ratio is too high, the hardening time will become longer. If the water mixing ratio is too small, the fluidity will become poor and the inflow of investment materials will become difficult. In addition, it is preferable to apply a surfactant to the three-dimensional shaped object because the embedding material is well wetted and fused, so that the surface of the cast object is less likely to become rough. Furthermore, when embedding the three-dimensional shaped object, it is preferable to embed it so that air bubbles do not adhere to the surface of the cast object.

作為所述步驟(2),為使所述包埋材料硬化或固化的步驟。於使用石膏系包埋材料作為所述包埋材料的情況下,使包埋材料固化的溫度較佳為200℃~400℃的範圍,較佳為於將立體造形物包埋後靜置10分鐘~60分鐘左右使其固化。The step (2) is a step of hardening or solidifying the investment material. When a gypsum-based investment material is used as the investment material, the temperature at which the investment material is cured is preferably in the range of 200°C to 400°C, and it is preferred that the three-dimensional sculpture be left to stand for 10 minutes after it is embedded. Let it cure in about 60 minutes.

作為所述步驟(3),為使所述立體造形物熔融去除、分解去除及/或焚化去除的步驟。於將所述立體造形物焚化去除的情況下,煆燒溫度較佳為400℃~1000℃的範圍,更佳為600℃~800℃的範圍。The step (3) is a step of removing the three-dimensional shaped object by melting, decomposing and/or incineration. When the three-dimensional shaped object is removed by incineration, the calcination temperature is preferably in the range of 400°C to 1000°C, more preferably in the range of 600°C to 800°C.

另外,可使金屬材料流入經過所述步驟(1)~步驟(3)而獲得的鑄模中並使所述金屬材料固化(步驟(4))而獲得金屬鑄造物。藉此,可製造與所述立體造形物的原型對應的金屬鑄造物。 [實施例] In addition, the metal material can be poured into the casting mold obtained through the steps (1) to (3), and the metal material can be solidified (step (4)) to obtain a metal cast product. Thereby, a metal casting corresponding to the prototype of the three-dimensional shaped object can be produced. [Example]

以下,列舉實施例對本發明進行更具體的說明。但是,本發明並不限定於該些實施例。(以下,關於各成分的量而記載的「份」是指「質量份」)Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these Examples. (Hereinafter, "parts" described regarding the amounts of each component refer to "parts by mass")

(實施例1) 於包括攪拌機的容器中,調配雙酚A環氧乙烷改質(10莫耳加成)二甲基丙烯酸酯80質量份、新戊二醇二甲基丙烯酸酯20質量份、2,4,6-三甲基苯甲醯基二苯基氧化膦(IGM公司製造的商品名「奧尼拉德(Omnirad)819」)2質量份、1-羥基環己基苯基酮(IGM公司製造的商品名「奧尼拉德(Omnirad)184」)10質量份,於將液體溫度控制為60℃的同時,攪拌混合1小時,均勻溶解,藉此獲得光硬化性樹脂組成物(1)。 (Example 1) In a container including a mixer, prepare 80 parts by mass of bisphenol A ethylene oxide modified (10 mol addition) dimethacrylate, 20 parts by mass of neopentyl glycol dimethacrylate, 2,4, 2 parts by mass of 6-trimethylbenzoyldiphenylphosphine oxide (trade name "Omnirad 819" manufactured by IGM), 1-hydroxycyclohexylphenyl ketone (trade name manufactured by IGM) Named "Omnirad (Omnirad) 184") 10 parts by mass, while controlling the liquid temperature to 60°C, stir and mix for 1 hour to uniformly dissolve, thereby obtaining a photocurable resin composition (1).

(實施例2~實施例14、比較例1~比較例5) 除了變更為表1~表3所示的組成以外,與實施例1同樣地獲得光硬化性樹脂組成物(2)~光硬化性樹脂組成物(14)、光硬化性樹脂組成物(R1)~光硬化性樹脂組成物(R5)。 (Example 2 to Example 14, Comparative Example 1 to Comparative Example 5) Photocurable resin compositions (2) to (14) and photocurable resin composition (R1) were obtained in the same manner as in Example 1 except that the compositions shown in Tables 1 to 3 were changed. ~Photocurable resin composition (R5).

藉由以下步驟對所述製備的光硬化性樹脂組成物(1)~光硬化性樹脂組成物(14)、光硬化性樹脂組成物(R1)~光硬化性樹脂組成物(R5)製作立體造形物的樣品,並進行各試驗。The photocurable resin composition (1) to photocurable resin composition (14) and photocurable resin composition (R1) to photocurable resin composition (R5) prepared as described above are made three-dimensional by the following steps. Samples of shaped objects and conduct various tests.

(樣品的製作) 對光硬化性樹脂組成物(1)~光硬化性樹脂組成物(14)、光硬化性樹脂組成物(R1)~光硬化性樹脂組成物(R5)分別使用面曝光方式(DLP)的光造形系統(艾希格(ASIGA)公司製造的「馬克斯(MAX)」),於各評價中形成規定形狀的立體造形物。 光造形的積層間距設為0.05 mm~0.1 mm、照射波長設為400 nm~410 nm、照度設為8 mW/cm 2、光照射時間設為每層0.5秒~7秒。將所述各條件下形成的立體造形物於乙醇中進行超音波清洗。接著,使用高壓水銀燈,對立體造形物的表面及背面以累計光量成為1000 mJ/cm 2~2000 mJ/cm 2的方式進行光照射,使立體造形物後硬化,而製作樣品。 (Preparation of sample) Surface exposure method was used for each of the photocurable resin composition (1) to photocurable resin composition (14) and the photocurable resin composition (R1) to photocurable resin composition (R5). (DLP)'s light shaping system ("MAX" manufactured by ASIGA) formed a three-dimensional shaped object of a prescribed shape in each evaluation. The layer spacing of the photoforming was set to 0.05 mm to 0.1 mm, the irradiation wavelength was set to 400 nm to 410 nm, the illumination intensity was set to 8 mW/cm 2 , and the light irradiation time was set to 0.5 seconds to 7 seconds per layer. The three-dimensional shaped objects formed under each of the above conditions were ultrasonically cleaned in ethanol. Next, a high-pressure mercury lamp is used to irradiate the surface and back of the three-dimensional molded object with light so that the cumulative light intensity becomes 1000 mJ/cm 2 to 2000 mJ/cm 2 , and the three-dimensional molded object is post-hardened to prepare a sample.

[硬度(肖氏-D硬度)的評價方法] 按照日本工業標準(Japanese Industrial Standards,JIS)K 6253-3:2012「硫化橡膠及熱塑性橡膠-硬度的求出方法-第三部分:硬度計硬度」中記載的測定方法,進行樣品的硬度(D型硬度計,GS-720R)的測定。使用所述獲得的樣品(形狀為5 mm×5 mm×3 mm的長方體),於3 mm的厚度方向上堆積兩個相同形狀的樣品,測定為厚度約6 mm。但是,不使用試驗片中混入有異物者、有氣泡者、以及有傷痕者。基於下述基準進行評價,將○設為合格。 (評價基準) ○(肖氏-D硬度為60以上) ×(肖氏-D硬度小於60) [Evaluation method of hardness (Shore-D hardness)] The hardness of the sample (D type Hardness tester, GS-720R). Using the sample obtained as described above (a rectangular parallelepiped with a shape of 5 mm × 5 mm × 3 mm), two samples of the same shape were stacked in the thickness direction of 3 mm, and the thickness was measured to be about 6 mm. However, do not use test pieces containing foreign matter, air bubbles, or scratches. Evaluation was performed based on the following standards, and ○ was considered as pass. (Evaluation criteria) ○ (Shore-D hardness is 60 or above) × (Shore-D hardness less than 60)

[煆燒時的立體造形物的殘存率測定方法] 將所述製作的樣品(形狀為5 mm×5 mm×3 mm的長方體)粉碎成5 mg~6 mg的片而得者作為試驗片,使用示差熱熱重量同時測定裝置(TG-DTA:梅特勒-托利多(Mettler Toledo)公司製造的TGA/DSC1),測定於氮氣環境下以10℃/分鐘自25℃升溫至600℃時的質量,根據[(400℃下的重量)/(25℃下的初始重量)]計算出400℃下的殘存率。該值越小,高溫加熱時的消失性越優異,基於下述基準進行評價,將A或B設為合格。 (評價基準) A:(殘存率小於57%) B:(殘存率超過57%以上且為62%以下) C:(殘存率超過62%以上) [Measurement method for the residual rate of three-dimensional shaped objects during firing] The prepared sample (rectangular parallelepiped with a shape of 5 mm × 5 mm × 3 mm) was crushed into pieces of 5 mg to 6 mg and used as test pieces. A differential thermogravimetric simultaneous measurement device (TG-DTA: Mei TGA/DSC1) manufactured by Mettler Toledo, measured in a nitrogen environment at a temperature of 10°C/min from 25°C to 600°C, based on [(weight at 400°C)/(25 Initial weight at ℃)] Calculate the residual rate at 400℃. The smaller this value is, the more excellent the disappearing properties during high-temperature heating are. The evaluation is based on the following criteria, and A or B is regarded as passing. (Evaluation criteria) A: (Survival rate is less than 57%) B: (The survival rate exceeds 57% and is below 62%) C: (The survival rate exceeds 62%)

[造形精度的測定方法] 對光硬化性樹脂組成物(1)~光硬化性樹脂組成物(14)、光硬化性樹脂組成物(R1)~光硬化性樹脂組成物(R5)分別使用面曝光方式(DLP)的光造形系統(艾希格(ASIGA)公司製造的「馬克斯(MAX)」),形成立體造形物,以使形狀成為縱5 mm×橫5 mm×厚度1.5 mm的片狀。 光造形的積層間距設為0.05 mm、照射波長設為400 nm~410 nm、照度設為8 mW/cm 2、光照射時間設為每層6秒。將所形成的立體造形物於乙醇中進行超音波清洗。接著,使用高壓水銀燈,對立體造形物的表面及背面以累計光量成為1000 mJ/cm 2~2000 mJ/cm 2的方式進行光照射,使立體造形物後硬化,而製作造形精度測定用樣品。 利用測微計對所得的造形精度測定用樣品的厚度進行測量。厚度越接近1.5 mm,造形精度越優異,基於下述基準進行評價,將A或B設為合格。 (評價基準) A(厚度(1.5 mm)的尺寸誤差小於0.1 mm) B(厚度(1.5 mm)的尺寸誤差為0.1 mm以上且小於0.15 mm) C(厚度(1.5 mm)的尺寸誤差為0.15 mm以上) [Measurement method of molding accuracy] For the photocurable resin composition (1) to photocurable resin composition (14), the photocurable resin composition (R1) to the photocurable resin composition (R5), each surface was used. A photolithography system (DLP) ("MAX" manufactured by ASIGA) is used to form a three-dimensional molded object into a sheet shape of 5 mm in length, 5 mm in width, and 1.5 mm in thickness. . The layer spacing of the photoforming was set to 0.05 mm, the irradiation wavelength was set to 400 nm to 410 nm, the illumination intensity was set to 8 mW/cm 2 , and the light irradiation time was set to 6 seconds per layer. The formed three-dimensional shaped object was ultrasonically cleaned in ethanol. Next, a high-pressure mercury lamp is used to irradiate the surface and back of the three-dimensional molded object with light so that the cumulative light intensity becomes 1000 mJ/cm 2 to 2000 mJ/cm 2 , and the three-dimensional molded object is post-hardened to prepare a sample for molding accuracy measurement. The thickness of the obtained sample for molding accuracy measurement was measured using a micrometer. The closer the thickness is to 1.5 mm, the better the molding accuracy is. The evaluation is based on the following standards, and A or B is regarded as passing. (Evaluation criteria) A (The dimensional error of the thickness (1.5 mm) is less than 0.1 mm) B (The dimensional error of the thickness (1.5 mm) is 0.1 mm or more and less than 0.15 mm) C (The dimensional error of the thickness (1.5 mm) is 0.15 mm above)

[鑄造性的評價方法] 使用方矽石包埋材料(吉野石膏銷售股份有限公司,櫻花快克(SAKURA Quick)30)與水以質量比100:33混合而成的包埋材料包埋所述獲得的樣品(形狀為圖1:利用直徑5 mm的圓柱將直徑15 mm的半球、直徑15 mm的球、直徑15 mm的圓環連接而成的形狀,全長42.5 mm),於25℃下靜置30分鐘,使包埋材料固化。繼而,藉由加熱至700℃的電爐加熱1小時,焚化所述樣品,製作鑄模。藉由目視並按照下述的基準評價此時的鑄造性。再者,於鑄模的內部,切斷鑄模,藉由目視判斷有無開裂、龜裂,有無立體造形物的殘渣、灰塵,立體造形物向鑄模的轉印性的良好/不良,將○設為合格。 (評價基準) ○:鑄模外部及內部無裂縫、龜裂,鑄模內部無立體造形物殘渣、灰塵,立體造形物向鑄模的轉印性良好。 ×:發生鑄模外部的裂縫、龜裂,鑄模內部的立體造形物的殘渣、灰塵殘留,立體造形物向鑄模的轉印不良中的至少一種,無法作為鑄模使用。 [Evaluation method of castability] The sample obtained as described above was embedded using an investment material composed of silica investment material (Yoshino Gypsum Sales Co., Ltd., SAKURA Quick 30) and water mixed at a mass ratio of 100:33 (the shape is shown in the figure) 1: Use a cylinder with a diameter of 5 mm to connect a hemisphere with a diameter of 15 mm, a ball with a diameter of 15 mm, and a ring with a diameter of 15 mm. The total length is 42.5 mm). Let it stand for 30 minutes at 25°C to allow embedding. Material solidifies. Then, the sample was incinerated by heating in an electric furnace heated to 700° C. for 1 hour, and a casting mold was produced. The castability at this time was evaluated visually based on the following criteria. Furthermore, cut the mold inside the mold and visually determine whether there are cracks and cracks, whether there are residues and dust of the three-dimensional molded object, and whether the transferability of the three-dimensional molded object to the mold is good/poor, and ○ is set as passed. . (Evaluation criteria) ○: There are no cracks or cracks on the outside or inside of the mold. There is no residue or dust from the three-dimensional molded object inside the mold. The transferability of the three-dimensional molded object to the mold is good. ×: At least one of cracks and cracks on the outside of the mold, residues and dust of the three-dimensional molded object inside the mold, and poor transfer of the three-dimensional molded object to the mold have occurred, and the mold cannot be used as a mold.

將所述各試驗的評價結果記載於表1~表3中。The evaluation results of each test are described in Tables 1 to 3.

[表1] 實施例 組成物 (1) (2) (3) (4) (5) (6) (A)成分 (A-1) 奧尼拉德(Omnirad)819 2 2 2 2 5 1 奧尼拉德(Omnirad)TPO (A-2) 奧尼拉德(Omnirad)184 10 10 15 20 7 20 奧尼拉德(Omnirad)907 奧尼拉德(Omnirad)651 (B)成分 (B-1) 化合物1 80 80 80 80 80 80 化合物2 化合物3 (B-2) 化合物4 20 20 20 20 20 20 化合物5 (C)成分 P.R.122 0.01 肖氏-D硬度 殘存率(400℃) A A A A B A 造形精度 A A A A A A 鑄造性 [Table 1] Example Composition (1) (2) (3) (4) (5) (6) (A) Ingredients (A-1) Omnirad 819 2 2 2 2 5 1 Omnirad TPO (A-2) Omnirad 184 10 10 15 20 7 20 Omnirad 907 Omnirad 651 (B) Ingredients (B-1) Compound 1 80 80 80 80 80 80 Compound 2 Compound 3 (B-2) Compound 4 20 20 20 20 20 20 Compound 5 (C) Ingredients PR122 0.01 Shore-D hardness Survival rate (400℃) A A A A B A Forming accuracy A A A A A A castability

[表2] 實施例 組成物 (7) (8) (9) (10) (11) (12) (A)成分 (A-1) 奧尼拉德(Omnirad)819 2 2 2 奧尼拉德(Omnirad)TPO 12 2 2 (A-2) 奧尼拉德(Omnirad)184 10 10 奧尼拉德(Omnirad)907 10 10 奧尼拉德(Omnirad)651 10 (B)成分 (B-1) 化合物1 80 80 80 80 80 90 化合物2 化合物3 (B-2) 化合物4 20 20 20 20 20 10 化合物5 (C)成分 P.R.122 肖氏-D硬度 殘存率(400℃) B A A A A A 造形精度 B A A A A A 鑄造性 [Table 2] Example Composition (7) (8) (9) (10) (11) (12) (A) Ingredients (A-1) Omnirad 819 2 2 2 Omnirad TPO 12 2 2 (A-2) Omnirad 184 10 10 Omnirad 907 10 10 Omnirad 651 10 (B) Ingredients (B-1) Compound 1 80 80 80 80 80 90 Compound 2 Compound 3 (B-2) Compound 4 20 20 20 20 20 10 Compound 5 (C) Ingredients PR122 Shore-D hardness Survival rate (400℃) B A A A A A Forming accuracy B A A A A A castability

[表3] 實施例 比較例 組成物 (13) (14) (R1) (R2) (R3) (R4) (R5) (A)成分 (A-1) 奧尼拉德(Omnirad)819 2 2 2 5 7 2 2 奧尼拉德(Omnirad)TPO (A-2) 奧尼拉德(Omnirad)184 10 10 8 30 奧尼拉德(Omnirad)907 奧尼拉德(Omnirad)651 (B)成分 (B-1) 化合物1 60 80 80 80 80 80 化合物2 50 化合物3 20 (B-2) 化合物4 20 20 20 20 20 20 化合物5 50 (C)成分 P.R.122 肖氏-D硬度 × 殘存率(400℃) A A C C C B A 造形精度 A A A A B A A 鑄造性 × × × × × [table 3] Example Comparative example Composition (13) (14) (R1) (R2) (R3) (R4) (R5) (A) Ingredients (A-1) Omnirad 819 2 2 2 5 7 2 2 Omnirad TPO (A-2) Omnirad 184 10 10 8 30 Omnirad 907 Omnirad 651 (B) Ingredients (B-1) Compound 1 60 80 80 80 80 80 Compound 2 50 Compound 3 20 (B-2) Compound 4 20 20 20 20 20 20 Compound 5 50 (C) Ingredients PR122 Shore-D hardness × Survival rate (400℃) A A C C C B A Forming accuracy A A A A B A A castability × × × × ×

表1~表3中的縮寫如下述般。 奧尼拉德(Omnirad)819:雙(2,4,6-三甲基苯甲醯基)苯基氧化膦,IGM公司製造,商品名「奧尼拉德(Omnirad)819」,極大吸收波長:237 nm、380 nm 奧尼拉德(Omnirad)TPO:2,4,6-三甲基苯甲醯基二苯基氧化膦,IGM公司製造,商品名「奧尼拉德(Omnirad)TPO」,極大吸收波長:275 nm、379 nm 奧尼拉德(Omnirad)184:1-羥基環己基苯基酮,IGM公司製造,商品名「奧尼拉德(Omnirad)184」,極大吸收波長:243 nm、331 nm 奧尼拉德(Omnirad)907:2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮,IGM公司製造,商品名「奧尼拉德(Omnirad)907」,極大吸收波長:230 nm、303 nm 奧尼拉德(Omnirad)651:2,2-二甲氧基-2-苯基苯乙酮,IGM公司製造,商品名「奧尼拉德(Omnirad)651」,極大吸收波長:252 nm、325 nm 化合物1:雙酚A環氧乙烷改質(加成10莫耳)二甲基丙烯酸酯,美原特種化學(Miwon Specialty Chemical)公司製造,商品名「米拉默(Miramer)M2101」 化合物2:雙酚A環氧乙烷改質(加成4莫耳)二甲基丙烯酸酯,美原特種化學(Miwon Specialty Chemical)公司製造,商品名「米拉默(Miramer)M241」 化合物3:雙酚A環氧乙烷改質(加成30莫耳)二甲基丙烯酸酯,美原特種化學(Miwon Specialty Chemical)公司製造,商品名「米拉默(Miramer)M2301」 化合物4:新戊二醇二甲基丙烯酸酯,美原特種化學(Miwon Specialty Chemical)公司製造,商品名「米拉默(Miramer)M213」 化合物5:聚丙二醇二甲基丙烯酸酯,新中村化學公司製造,商品名「NK酯 9PG」 P.R.122:顏料紅(Pigment Red)122,迪愛生(DIC)公司製造,商品名「法蘇傑恩(FASTOGEN)(註冊商標)超級洋紅(SUPER MAGENTA)R」 The abbreviations in Tables 1 to 3 are as follows. Omnirad 819: Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, manufactured by IGM Company, trade name "Omnirad 819", maximum absorption wavelength : 237 nm, 380 nm Omnirad TPO: 2,4,6-Trimethylbenzyldiphenylphosphine oxide, manufactured by IGM Company, trade name "Omnirad TPO", maximum absorption wavelength: 275 nm, 379 nm Omnirad 184: 1-hydroxycyclohexyl phenyl ketone, manufactured by IGM, trade name "Omnirad 184", maximum absorption wavelength: 243 nm, 331 nm Omnirad 907: 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropan-1-one, manufactured by IGM, trade name "Omnirad" (Omnirad) 907", maximum absorption wavelength: 230 nm, 303 nm Omnirad 651: 2,2-dimethoxy-2-phenylacetophenone, manufactured by IGM, trade name "Omnirad 651", maximum absorption wavelength: 252 nm, 325nm Compound 1: Bisphenol A ethylene oxide modified (10 mol addition) dimethacrylate, manufactured by Miwon Specialty Chemical Co., Ltd., trade name "Miramer M2101" Compound 2: Bisphenol A ethylene oxide modified (4 mol addition) dimethacrylate, manufactured by Miwon Specialty Chemical Co., Ltd., trade name "Miramer M241" Compound 3: Bisphenol A ethylene oxide modified (30 mol addition) dimethacrylate, manufactured by Miwon Specialty Chemical Company, trade name "Miramer M2301" Compound 4: Neopentyl glycol dimethacrylate, manufactured by Miwon Specialty Chemical Co., Ltd., trade name "Miramer M213" Compound 5: Polypropylene glycol dimethacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., trade name "NK ester 9PG" P.R.122: Pigment Red 122, manufactured by DIC Company, trade name "FASTOGEN (registered trademark) Super Magenta R"

如表1~表3所示,確認到實施例1~實施例14的光硬化性樹脂組成物顯示出良好的造形精度,立體造形物顯示出高硬度、以及高溫加熱時的優異的消失性,並且鑄造性變得良好。 另一方面,對於由相對於(B)成分100質量份而以10質量份以下的比例含有光聚合起始劑(A)的比較例1~比較例4形成的立體造形物,可確認到高溫加熱時的消失性及鑄造性差。進而可知,對於使用了相對於(B)成分100質量份而以30量份以上的比例含有光聚合起始劑(A)的比較例5的立體造形物,硬度降低,鑄造性劣化。 As shown in Tables 1 to 3, it was confirmed that the photocurable resin compositions of Examples 1 to 14 showed good molding accuracy, and the three-dimensional molded objects showed high hardness and excellent disappearing properties when heated at high temperatures. And the castability becomes good. On the other hand, in the three-dimensional shaped objects formed from Comparative Examples 1 to 4 containing the photopolymerization initiator (A) in a proportion of 10 parts by mass or less with respect to 100 parts by mass of the component (B), high temperatures were confirmed It has poor disappearing properties and castability when heated. Furthermore, it was found that the three-dimensional molded article of Comparative Example 5 containing the photopolymerization initiator (A) in a ratio of 30 parts by weight or more relative to 100 parts by mass of the component (B) had a reduced hardness and deteriorated castability.

without

圖1為鑄造性的評價方法中的樣品的照片。Fig. 1 is a photograph of a sample in the method for evaluating castability.

Claims (15)

一種光硬化性樹脂組成物,其特徵在於,含有光聚合起始劑(A)及多官能(甲基)丙烯酸酯(B), 相對於多官能(甲基)丙烯酸酯(B)100質量份,所述光聚合起始劑(A)的含量為超過10質量份~30質量份的範圍。 A photocurable resin composition characterized by containing a photopolymerization initiator (A) and a multifunctional (meth)acrylate (B), The content of the photopolymerization initiator (A) is in the range of more than 10 parts by mass to 30 parts by mass relative to 100 parts by mass of the polyfunctional (meth)acrylate (B). 如請求項1所述的光硬化性樹脂組成物,其中,所述光聚合起始劑(A)至少含有在350 nm以上的波長範圍內具有至少一個極大吸收波長的第一光聚合起始劑(A-1)、以及在350 nm以上的波長範圍內不具有極大吸收波長且在小於350 nm的波長範圍內具有極大吸收波長的第二光聚合起始劑(A-2)。The photocurable resin composition according to claim 1, wherein the photopolymerization initiator (A) contains at least a first photopolymerization initiator having at least one maximum absorption wavelength in a wavelength range above 350 nm. (A-1), and a second photopolymerization initiator (A-2) that does not have a maximum absorption wavelength in a wavelength range of 350 nm or more and has a maximum absorption wavelength in a wavelength range of less than 350 nm. 如請求項2所述的光硬化性樹脂組成物,其中,所述第一光聚合起始劑(A-1)為選自由醯基氧化膦、雙醯基氧化膦、二茂鈦化合物、O-醯基肟化合物及噻噸酮化合物所組成的群組中的至少一種。The photocurable resin composition according to claim 2, wherein the first photopolymerization initiator (A-1) is selected from the group consisting of hydroxyl phosphine oxide, bisyl phosphine oxide, titanocene compound, O - At least one member from the group consisting of a acyl oxime compound and a thioxanthone compound. 如請求項2所述的光硬化性樹脂組成物,其中,所述第二光聚合起始劑(A-2)為選自由苯烷基酮化合物、α-二酮化合物及錪鹽所組成的群組中的至少一種。The photocurable resin composition according to claim 2, wherein the second photopolymerization initiator (A-2) is selected from the group consisting of phenylalkyl ketone compounds, α-diketone compounds and iodonium salts. At least one of the groups. 如請求項2所述的光硬化性樹脂組成物,其中,所述第二光聚合起始劑(A-2)相對於所述第一光聚合起始劑(A-1)的調配比例[(A-1)/(A-2)]為1/100~8/10的範圍。The photocurable resin composition according to claim 2, wherein the blending ratio of the second photopolymerization initiator (A-2) to the first photopolymerization initiator (A-1) is [ (A-1)/(A-2)] is in the range of 1/100 to 8/10. 如請求項1所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)至少含有在分子中於結構中具有聚氧伸烷基的化合物。The photocurable resin composition according to claim 1, wherein the polyfunctional (meth)acrylate (B) contains at least a compound having a polyoxyalkylene group in the molecule and the structure. 如請求項6所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)至少含有在分子中具有聚氧伸烷基及雙酚結構的化合物(B-1), 所述化合物(B-1)是改質雙酚A二(甲基)丙烯酸酯,其由 下述式(I): 表示,且R 1表示氫原子或甲基,同一分子中的多個R 1可相同亦可不同,m及n分別獨立地表示1以上的整數,m+n為2~40。 The photocurable resin composition according to claim 6, wherein the polyfunctional (meth)acrylate (B) contains at least a compound (B-1) having a polyoxyalkylene group and a bisphenol structure in the molecule ), the compound (B-1) is modified bisphenol A di(meth)acrylate, which has the following formula (I): represents, and R 1 represents a hydrogen atom or a methyl group, multiple R 1 in the same molecule may be the same or different, m and n each independently represent an integer of 1 or more, and m+n is 2 to 40. 如請求項6所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)更含有在分子內具有一個以上的(甲基)丙烯醯基的化合物(B-2)。The photocurable resin composition according to claim 6, wherein the polyfunctional (meth)acrylate (B) further contains a compound (B-) having one or more (meth)acrylyl groups in the molecule 2). 如請求項8所述的光硬化性樹脂組成物,其中,所述多官能(甲基)丙烯酸酯(B)100質量份中的所述化合物(B-1)的調配量為40質量份~90質量份。The photocurable resin composition according to claim 8, wherein the compounding amount of the compound (B-1) in 100 parts by mass of the polyfunctional (meth)acrylate (B) is 40 parts by mass to 90 parts by mass. 如請求項1所述的光硬化性樹脂組成物,更含有非金屬有機顏料(C)。The photocurable resin composition according to claim 1 further contains a non-metallic organic pigment (C). 如請求項1至請求項10中任一項所述的光硬化性樹脂組成物,是立體光造形用途。The photocurable resin composition according to any one of claims 1 to 10 is used for stereolithography. 一種硬化物,是使如請求項1至請求項10中任一項所述的光硬化性樹脂組成物光硬化而成。A cured product obtained by photocuring the photocurable resin composition according to any one of claims 1 to 10. 一種立體造形物,包含如請求項12所述的硬化物。A three-dimensional shaped object including the hardened object according to claim 12. 一種鑄模的製造方法,其特徵在於包括: 步驟(1),利用包埋材料使如請求項13所述的立體造形物部分或全部包埋; 步驟(2),使所述包埋材料硬化或固化;以及 步驟(3),使所述立體造形物熔融去除、分解去除及/或焚化去除。 A method for manufacturing a casting mold, which is characterized by including: Step (1), using an embedding material to embed part or all of the three-dimensional sculpture as described in claim 13; Step (2), hardening or solidifying the investment material; and In step (3), the three-dimensional shaped object is removed by melting, decomposing and/or incineration. 一種金屬鑄造物的製造方法,其特徵在於包括步驟(4),所述步驟(4)是使金屬材料流入藉由如請求項14所述的製造方法而獲得的鑄模中並使所述金屬材料固化。A method of manufacturing a metal casting, characterized by comprising step (4) of flowing a metal material into a casting mold obtained by the manufacturing method as described in claim 14 and causing the metal material to solidify.
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