TW202214082A - Cooling module and notebook computer using same - Google Patents

Abstract

A cooling module and a notebook computer with the cooling module include an upper cover shell, a liquid crystal display panel frame, a keyboard frame, a lower cover shell, and a cooling module, which are used for dissipating at least one heating element in the notebook computer, the cooling module also includes: a lower cover shell with an accommodating space for placing at least one heating element; a heat exchange layer in thermal contact with the heating element; and a copper conductive layer or a copper foil layer, which is provided on the inner surface of the lower cover shell through copper plating technology or lamination technology at least one high-temperature area is formed in the peripheral area of at least one heating element inside the notebook computer, and a relatively low-temperature area is formed in other areas other than the at least one high-temperature area, and through the copper conductive layer or the copper foil layer, the temperature is reduced at least one high temperature area conducts to a relatively low temperature area.

Description

Cooling module and notebook computer with the same

The present invention relates to a heat dissipation module and a notebook computer having the heat dissipation module, and in particular to a heat dissipation module for enhancing the heat dissipation of the notebook computer through copper plating on a lower cover casing (piece D).

Due to the thinning development of notebook computers, the thickness of notebook computers is getting thinner and thinner, which limits the cooling space and the size of cooling structures and fans in the notebook computers. Therefore, when the notebook computer runs at high speed, it is necessary to increase the fan speed to increase the cooling airflow inside the notebook computer. However, when the cooling airflow is insufficient, the heat sources such as processing chips in the notebook computer cannot reach the required amount. The heat dissipation efficiency causes the temperature of the processing chip to be too high. At this time, in order to prevent the damage of the processing chip, the notebook computer will reduce the operating speed of the processing chip, thereby leading to the lack of performance degradation.

Generally speaking, the shell of notebook computer can be divided into A (upper cover shell), B (LCD panel frame), C (keyboard frame), D (lower cover shell), and relatively speaking, most of the The processing chips and components that are more prone to heat in notebook computers, such as batteries and display chips, are located at the position of the D part. Therefore, the temperature control of the D part is extremely important. At present, the industry mainly uses heat pipes, radiators and A cooling module composed of a fan, and the airflow generated by the fan will take away the heat transmitted to the radiator, but the larger heat will cause the temperature of the computer system to increase, making it impossible to quickly cool down by the fan alone, and the fan exits The hot air that is exported from here often makes users feel uncomfortable, and the noise is also increased due to the increase of the fan speed.

The present invention provides a heat dissipation module and a notebook computer with the heat dissipation module. The purpose of the invention is to improve the heat dissipation mode of the notebook computer, increase the available heat dissipation area, strengthen the heat dissipation speed, and disperse the heat dissipation positions. So that the user will not feel uncomfortable.

A heat dissipation module of the present invention is arranged in an electronic device to dissipate heat from a heating element in the electronic device. The heat dissipation module comprises: a lower cover shell, which is arranged under the electronic device and is made of a metal material It has an accommodating space for placing the heating element; a heat exchange layer is arranged below the heating element and is in thermal contact with the heating element; and a copper conducting layer is arranged on the heating element through a copper plating technology The inner surface of the lower cover shell is in contact with the heat exchange layer, and is in contact with the lower surface of the heat exchange layer.

In one embodiment of the present invention, the lower cover shell is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy.

In an embodiment of the present invention, the above-mentioned heat exchange layer can be in thermal contact by means of heat conduction in direct contact with the heating element, or in thermal contact by means of heat convection not in direct contact with the heating element, and a Heat is conducted to the copper conductive layer.

In an embodiment of the present invention, a high temperature area is formed in the peripheral area of the heating element in the above-mentioned electronic device, and a relatively low temperature area is formed in other areas other than the high temperature area, and the copper conductive layer is passed through to make the temperature Conduction from the high temperature region to the relatively low temperature region.

A heat dissipation module of the present invention can also be installed in an electronic device to dissipate heat from a heating element in the electronic device. The heat dissipation module includes: a lower cover shell, which is arranged below the electronic device and is a It is made of metal material and has an accommodating space for placing the heating element; a heat exchange layer is arranged under the heating element and is in thermal contact with the heating element; and a copper foil layer is arranged in the lower cover shell The surface is in contact with the heat exchange layer and is in contact with the lower surface of the heat exchange layer; wherein, there is a thermally conductive adhesive layer under the copper foil layer, so that the copper foil layer is adhered to the inner surface of the lower cover shell.

In one embodiment of the present invention, the lower cover shell is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy.

In an embodiment of the present invention, the above-mentioned heat exchange layer can be in thermal contact by means of heat conduction in direct contact with the heating element, or in thermal contact by means of heat convection not in direct contact with the heating element, and a Heat is conducted to the copper foil layer.

In an embodiment of the present invention, a high temperature area is formed in the peripheral area of the heating element in the above-mentioned electronic device, and a relatively low temperature area is formed in other areas other than the high temperature area, and through the copper foil layer, the temperature is increased. Conduction from the high temperature region to the relatively low temperature region.

In an embodiment of the present invention, the above-mentioned thermally conductive adhesive layer has thermal conductivity and can conduct a heat of the heating element to the lower cover shell.

A notebook computer of the present invention includes an upper cover shell, a liquid crystal display panel frame, a keyboard frame, a lower cover shell, and a heat dissipation module for dissipating heat from at least one heating element in the notebook computer. The module also includes: a lower cover shell, which is arranged under the notebook computer, is made of a metal material, and has an accommodating space for placing the at least one heating element; a heat exchange layer is arranged on the heating element The bottom is in thermal contact with the heating element; and a copper conductive layer is disposed between the inner surface of the lower cover shell and the heat exchange layer, and is connected to the lower surface of the heat exchange layer through a copper plating technology or a bonding technology. contact; wherein, at least one high temperature area is formed in the peripheral area of the at least one heating element in the notebook computer, and a relatively low temperature area is formed in other areas other than the at least one high temperature area, and through the copper conductive layer, the temperature is increased Conduction is conducted from the at least one high temperature region to the relatively low temperature region.

In an embodiment of the present invention, the above-mentioned keyboard frame is combined with the lower cover shell to generate the accommodating space for the at least one heating element.

In an embodiment of the present invention, the upper cover shell and the lower cover shell are metal shells, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy.

In one embodiment of the present invention, the above-mentioned heat exchange layer can be in thermal contact by means of thermal conduction in direct contact with the at least one heating element, or thermally contacted by means of thermal convection in which the at least one heating element is not in direct contact , and conducts a heat to the copper conductive layer.

The effect of the present invention is that, by improving the heat dissipation method of the notebook computer, the available heat dissipation area is increased, the heat dissipation space of the bottom surface of the host computer is increased, and the heat dissipation efficiency of the host computer is further enhanced, so as to enhance the speed of heat dissipation and the position of the heat dissipation. Disperse to achieve the purpose of reducing the temperature of the notebook computer.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following specific embodiments are given together with the accompanying drawings, and are described in detail as follows.

FIG. 1 is a reference diagram of a copper-plated structure of a heat dissipation module according to the present invention. In FIG. 1 , a heat dissipation module 110 is disposed in an electronic device to dissipate heat from a heating element 100 in the electronic device. The heat dissipation module 110 includes a lower cover shell 111, which is disposed below the electronic device, It is made of a metal material and has an accommodating space 120 for placing the heating element 100; a heat exchange layer 112 disposed under the heating element 100 and in thermal contact with the heating element 100; and a copper conductive layer 113 , disposed between the inner surface of the lower cover shell 111 and the heat exchange layer 112 through a copper plating technique, and in contact with the lower surface of the heat exchange layer 112 .

In this embodiment, the above-mentioned lower cover shell 111 is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy.

In the present embodiment, the above-mentioned heat exchange layer 112 can be in thermal contact by means of thermal conduction in direct contact with the heating element 100 , or thermally contacted by means of thermal convection which is not in direct contact with the heating element 100 , and a Heat is conducted to the copper conductive layer 113 .

In this embodiment, a high temperature area is formed in the peripheral area of the heating element 100 in the above-mentioned electronic device, and a relatively low temperature area is formed in other areas other than the high temperature area, and the copper conductive layer 113 is passed through to make the temperature from The high temperature region conducts to the relatively low temperature region.

FIG. 2 is a reference diagram of a copper foil structure of a heat dissipation module according to the present invention. In FIG. 2, a heat dissipation module 210 is disposed in an electronic device to dissipate heat from a heating element 200 in the electronic device. The heat dissipation module 210 includes: a lower cover shell 211, which is disposed below the electronic device, It is made of a metal material and has an accommodating space for placing the heating element 200 ; a heat exchange layer 212 , which is arranged under the heating element 200 and is in thermal contact with the heating element 200 ; and a copper foil layer 213 , is disposed between the inner surface of the lower cover shell 211 and the heat exchange layer 212, and is in contact with the lower surface of the heat exchange layer 212; wherein, there is a thermally conductive adhesive layer 214 under the copper foil layer 213 to make the copper foil The layer 213 is adhered to the inner surface of the lower cover shell 211 .

In this embodiment, the above-mentioned lower cover shell 211 is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy.

In the present embodiment, the above-mentioned heat exchange layer 212 can be in thermal contact by means of thermal conduction which is in direct contact with the heating element 200, or thermally contacted by means of thermal convection which is not in direct contact with the heating element 200, and a Heat is conducted to the copper foil layer 213 .

In this embodiment, a high temperature region is formed in the peripheral region of the heating element 200 in the above-mentioned electronic device, and a relatively low temperature region is formed in other regions other than the high temperature region, and the copper foil layer 213 is passed through to make the temperature from The high temperature region conducts to the relatively low temperature region.

In this embodiment, the above-mentioned thermally conductive adhesive layer 241 has thermal conductivity and can conduct the heat of the heating element 200 to the lower cover shell 211 .

3 is a side view of a copper-plated structure of a heat dissipation module according to the present invention. In FIG. 3 , a copper conductive layer 320 is plated on the inner surface of the lower cover shell 310 , and a heat exchange layer 330 is disposed on the copper conductive layer 320 .

In this embodiment, the above-mentioned lower cover shell 310 is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy.

In the present embodiment, the above-mentioned heat exchange layer 330 can be in thermal contact by means of heat conduction in direct contact with the heating element, or thermally in contact by means of heat convection not in direct contact with the heating element, and conducts a heat. to the copper conductive layer 320 .

In this embodiment, a high temperature area is formed in the peripheral area of the heating element in the above-mentioned electronic device, and a relatively low temperature area is formed in other areas outside the high temperature area, and through the copper conductive layer 320, the temperature is changed from the The high temperature region conducts to the relatively low temperature region.

4 is a side view of a copper foil structure of a heat dissipation module according to the present invention. In FIG. 4 , a copper foil layer 420 is plated on the inner surface of the lower cover shell 410 , and a heat exchange layer 430 is arranged above the copper foil layer 420 , wherein a thermally conductive adhesive layer 440 is arranged under the copper foil layer 420 to make the The copper foil layer 420 is adhered to the inner surface of the lower cover shell 410 .

In this embodiment, the above-mentioned lower cover shell 410 is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy.

In this embodiment, the above-mentioned heat exchange layer 430 can be in thermal contact by means of heat conduction that is in direct contact with the heating element, or can be in thermal contact by means of heat convection that is not in direct contact with the heating element, and conducts heat to the heating element. The copper foil layer 420 .

In this embodiment, a high temperature area is formed in the peripheral area of the heating element in the above-mentioned electronic device, and a relatively low temperature area is formed in other areas other than the high temperature area, and the copper foil layer 420 is passed through the copper foil layer 420. The high temperature region conducts to the relatively low temperature region.

In this embodiment, the above-mentioned thermally conductive adhesive layer has thermal conductivity and can conduct a heat of the heating element to the lower cover shell.

5 is a schematic diagram of a heat dissipation direction of a heat dissipation module according to the present invention. In FIG. 5, the lower cover shell, which is arranged under the notebook computer, is made of metal material and has an accommodating space for placing the at least one heating element; the heat exchange layer is arranged below the heating element, thermally in contact with the heating element; and a copper conductive layer or copper foil layer 510 is disposed between the inner surface of the lower cover shell and the heat exchange layer through copper plating technology or lamination technology, and is connected to the lower surface of the heat exchange layer. contact; wherein, at least one high temperature area 520 is formed in the peripheral area of the at least one heating element in the notebook computer, and a relatively low temperature area 530 is formed in other areas other than the at least one high temperature area 520, and through the copper conductive layer or the copper foil layer 510 , the temperature is conducted from the at least one high temperature region 520 to the relatively low temperature region 530 .

In this embodiment, the at least one high temperature region mentioned above is 45.4 degrees C and 46.9 degrees C, respectively. Conduction is conducted to the relatively low temperature region through the copper conductive layer or the copper foil layer 510, and the measured temperatures are 43.6 degrees C, 38.1 degrees C, 37.2 degrees C and 36.8 degrees C.

6 is a schematic diagram of a copper conduction structure of a heat dissipation module according to the present invention. In FIG. 6, the copper conductive layer or copper foil layer 610 is based on the at least one heating element, such as a central processing unit (CPU) 620, a network unit 630, a fan 640 and a heat pipe in a notebook computer At least one high temperature area formed by the surrounding area of the heating element such as pipe) 650, according to the heat conduction path, a copper conductive layer or copper foil layer 610 is arranged in a part of the area of the lower cover shell 660 to conduct the heat to the at least one high temperature area. The other regions form a relatively low temperature region.

In this embodiment, the above-mentioned copper conductive layer is disposed between the inner surface of the lower cover shell and the heat exchange layer through a copper plating technique, and is in contact with the lower surface of the heat exchange layer.

In this embodiment, the above-mentioned copper foil layer is disposed between the inner surface of the lower cover shell and the heat exchange layer through a bonding technique, and is in contact with the lower surface of the heat exchange layer.

In this embodiment, the shape of the above-mentioned copper conduction layer can be changed according to the heat conduction path.

In this embodiment, the shape of the above-mentioned copper foil layer can be changed according to the heat conduction path.

To sum up, the present invention can increase the available heat dissipation area by improving the heat dissipation method of the notebook computer, increase the heat dissipation space on the bottom surface of the host computer, and further enhance the heat dissipation efficiency of the host computer, so as to enhance the speed of heat dissipation and dissipate the heat. The position of the device is scattered to achieve the purpose of reducing the temperature of the notebook computer.

100: heating element 110: Cooling module 111: Lower cover shell 112: heat exchange layer 113: Copper conductive layer 120: Accommodating space 200: heating element 210: cooling module 211: Lower cover shell 212: heat exchange layer 213: Copper foil layer 214: Thermally conductive adhesive layer 310: Lower cover shell 320: Copper conductive layer 330: heat exchange layer 410: Lower cover shell 420: copper foil layer 430: heat exchange layer 440: thermally conductive adhesive layer 510: Copper conductive layer or copper foil layer 520: at least one high temperature area 530: Relatively low temperature area 610: Copper conductive layer or copper foil layer 620: Central Processing Unit (CPU) 630: Network Unit 640: Fan 650: heat pipe (heat pipe) 660: Lower cover shell

FIG. 1 is a reference diagram of a copper-plated structure of a heat dissipation module according to the present invention. FIG. 2 is a reference diagram of a copper foil structure of a heat dissipation module according to the present invention. 3 is a side view of a copper-plated structure of a heat dissipation module according to the present invention. 4 is a side view of a copper foil structure of a heat dissipation module according to the present invention. 5 is a schematic diagram of a heat dissipation direction of a heat dissipation module according to the present invention. FIG. 6 is a schematic diagram of the arrangement of the copper conductive layer of a heat dissipation module according to the present invention.

100: heating element

110: Cooling module

111: Lower cover shell

112: heat exchange layer

113: Copper conductive layer

120: Accommodating space

Claims (12)

A heat dissipation module is arranged in an electronic device to dissipate heat from a heating element in the electronic device, and the heat dissipation module comprises: A lower cover shell, disposed below the electronic device, is made of a metal material, and has an accommodating space for placing the heating element; a heat exchange layer disposed below the heating element and in thermal contact with the heating element; and A copper conductive layer is disposed between the inner surface of the lower cover shell and the heat exchange layer through a copper plating technology, and is in contact with the lower surface of the heat exchange layer. The heat dissipation module according to item 1 of the scope of the application, wherein the lower cover shell is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy. A heat dissipation module as described in item 1 of the patent application scope, wherein the heat exchange layer can be in thermal contact by means of heat conduction in direct contact with the heating element, or by means of heat convection not in direct contact with the heating element. thermal contact and conducts a heat to the copper conductive layer. A heat dissipation module as described in item 1 of the scope of the application, wherein a high temperature area is formed in the peripheral area of the heating element in the electronic device, and a relatively low temperature area is formed in other areas other than the high temperature area, and through the The copper conductive layer conducts the temperature from the high temperature region to the relatively low temperature region. The heat dissipation module according to claim 4, wherein the copper conductive layer changes the shape of the copper conductive layer from the high temperature region to the relatively low temperature region according to the temperature. A heat dissipation module is arranged in an electronic device to dissipate heat from a heating element in the electronic device, and the heat dissipation module comprises: A lower cover shell, disposed below the electronic device, is made of a metal material, and has an accommodating space for placing the heating element; a heat exchange layer disposed below the heating element and in thermal contact with the heating element; and a copper foil layer, disposed between the inner surface of the lower cover shell and the heat exchange layer, and in contact with the lower surface of the heat exchange layer; Wherein, there is a thermally conductive adhesive layer under the copper foil layer, so that the copper foil layer is adhered to the inner surface of the lower cover shell. The heat dissipation module according to item 6 of the scope of the application, wherein the lower cover shell is a metal shell, and the metal material is any one of magnesium alloy, aluminum alloy or aluminum-magnesium alloy. A heat dissipation module as described in claim 6, wherein the heat exchange layer can be in thermal contact by means of heat conduction in direct contact with the heating element, or by means of heat convection not in direct contact with the heating element thermal contact and conduct a heat to the copper foil layer. A heat dissipation module as described in item 6 of the scope of the patent application, wherein a high temperature area is formed in the peripheral area of the heating element in the electronic device, and a relatively low temperature area is formed in other areas other than the high temperature area, and through the The copper foil layer conducts the temperature from the high temperature region to the relatively low temperature region. The heat dissipation module as described in claim 6, wherein the copper foil layer changes the shape of the copper foil layer in the conduction direction from the high temperature region to the relatively low temperature region according to the temperature. The heat dissipation module as described in claim 6, wherein the thermally conductive adhesive layer has thermal conductivity and can conduct a heat of the heating element to the lower cover shell. A notebook computer includes an upper cover shell, a liquid crystal display panel frame, a keyboard frame, a lower cover shell, and a heat dissipation module for dissipating heat from at least one heating element in the notebook computer, the heat dissipation module comprising: : A lower cover shell, disposed below the notebook computer, is made of a metal material, and has an accommodating space for placing the at least one heating element; a heat exchange layer disposed under the at least one heating element and in thermal contact with the heating element; and A copper conductive layer or a copper foil layer is disposed between the inner surface of the lower cover shell and the heat exchange layer through a copper plating technology or a lamination technology, and is in contact with the lower surface of the heat exchange layer; Wherein, at least one high-temperature area is formed in the peripheral area of the at least one heating element in the notebook computer, and a relatively low-temperature area is formed in other areas other than the at least one high-temperature area, and passes through the copper conductive layer or the copper foil layer , so that the temperature is conducted from the at least one high temperature region to the relatively low temperature region; Wherein, the copper conductive layer or the copper foil layer changes the shape of the copper conductive layer or the copper foil layer in the conduction direction from the high temperature region to the relatively low temperature region according to the temperature.

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