TW202141673A - Positioning method and positioning device for preventing reduction of processing capability per unit time - Google Patents

Abstract

The present invention relates to a positioning method, which may position a sheet body (CP) at a predetermined position using surface tension of liquid, and includes the following steps: a supporting step for supporting the sheet body (CP) having a hydrophilic portion with hydrophilicity disposed on a supporting surface (12A); a liquid supply step for supplying liquid to the hydrophilic portion (12F); and, a liquid recycling step for recycling liquid from the hydrophilic portion (12F).

Description

Positioning method and positioning device

The invention relates to a positioning method and a positioning device.

A positioning method for positioning a plurality of sheet-like bodies at predetermined positions using the surface tension of the liquid is known (for example, refer to Document 1: Japanese Patent Application Laid-Open No. 2010-245452). The positioning method described in Document 1 is to coat water (liquid) on the hydrophilic film 31a (hydrophilic part) formed on the upper surface (support surface) of the support substrate 31 (support member), and arrange the wafer 20 (sheet-shaped) on the hydrophilic part. After the sheet is positioned at a predetermined position by the surface tension of the liquid on the hydrophilic part, it must wait until the liquid in the hydrophilic part evaporates to the extent that the sheet is supported by the supporting surface, so the processing capacity per unit time is reduced. .

[The problem to be solved by the invention] The purpose of the present invention is to provide a positioning method and a positioning device that can prevent the processing capacity per unit time from being reduced. [Technical means to solve the problem] The present invention adopts the composition contained in the claim. According to the present invention, since the liquid is recovered from the hydrophilic part of the supporting surface, it is not necessary to wait until the liquid in the hydrophilic part evaporates to the extent that the sheet-like body is supported by the supporting surface, and the reduction in processing capacity per unit time can be prevented. In addition, if the flow path provided inside the support member having the support surface is used to supply the liquid to the hydrophilic portion, the liquid can be reliably supplied to the hydrophilic portion. In addition, if the liquid recovered from the hydrophilic part is supplied to the hydrophilic part again, the consumption of the liquid can be suppressed.

Hereinafter, an embodiment of the present invention will be described based on FIGS. 1A to 1E. Furthermore, the X-axis, Y-axis, and Z-axis in the present embodiment are in an orthogonal relationship, respectively, the X-axis and Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the aforementioned predetermined plane. Furthermore, in this embodiment, when viewing the direction from the hand side of FIGS. 1A to 1E parallel to the Y axis as a reference, "up" is the direction of the arrow on the Z axis, and "down" is the opposite. Direction, "Left" is the arrow direction of the X axis, "Right" is the opposite direction, "Front" is the hand direction in Figures 1A~1E parallel to the Y axis, and "Back" is the opposite direction. The positioning device EA of the present invention is a device that uses the surface tension of liquid LQ such as water, alcohol solution, etc. to position a semiconductor chip (hereinafter also referred to as "chip") CP in a predetermined position as a sheet, and it is equipped with a support Means 10, liquid supply means 20, and liquid recovery means 30. Support means 10 support the wafer CP on the hydrophilic part 12F with hydrophilicity of the support surface 12A; liquid supply means 20 supply liquid LQ to the hydrophilic part 12F; liquid recovery means The system 30 recovers the liquid LQ from the hydrophilic part 12F. The positioning device EA is arranged in the vicinity of the separating means 40 and the peeling means 50. The separating means 40 applies tension to the adhesive sheet AS to which a plurality of wafers CP are attached to expand the distance between the wafers CP; the peeling means 50 is from the wafer The CP peels off the subsequent sheet AS. The supporting means 10 is equipped with: a direct-acting motor 11 as a driving device and a stage 12 as a supporting member. The support surface 12A which is adsorbed and held by the pressure reducing means 23 such as an aerator. In the case of this embodiment, the decompression means 23 is configured to be shared by the support means 10 and the liquid recovery means 30. The stage 12 is provided with a recessed portion 12B provided on the upper surface, a flow path 12C provided in the interior of the stage 12 and communicating with the recessed portion 12B, a porous resin arranged in the recessed portion 12B and the upper surface of which serves as a support surface 12A, etc. The porous member 12D. On the supporting surface 12A, as shown in the AA diagram in FIG. 1A, the hydrophobic portion 12E having hydrophobicity is formed in a lattice shape, and the hydrophilic portion 12F is divided by the hydrophobic portion 12E. In this embodiment, the water-repellent portion 12E is configured by applying a water-repellent material 12G such as an adhesive or resin to the inner surface of a groove formed in a grid on the support surface 12A; the hydrophilic portion 12F is configured by roughing , Sandblasting and other rough surface forming means, implement rough surface treatment to become a non-smooth rough surface. The liquid supply means 20 is provided with: a storage tank 21 containing the liquid LQ, a pressurizing means 22 such as a pressurizing pump or a turbine, a pressure reducing means 23, and a communication state of the pressurizing means 22 and a pressure reducing means 23 to the storage tank 21 The switching valve 24 for switching and the switching valve 25 are connected to the flow path 12C through the pipe 25A and switch the communication position of the flow path 12C with the tank 21 at the upper and bottom of the tank 21. The liquid supply means 20 is configured to supply the liquid LQ to the hydrophilic portion 12F using a flow path 12C provided inside the stage 12 having the support surface 12A. The storage tank 21 communicates with the switching valve 25 through the pressure-side pipe 21A and the pressure-reduction side pipe 21B. The liquid recovery means 30 adopts a structure shared with the liquid supply means 20, and is configured to recover the liquid LQ from the hydrophilic part 12F using a flow path 12C provided inside the stage 12 having the support surface 12A. The separating means 40 is provided with a plurality of direct-acting motors 41 as a driving machine, and a chuck cylinder 42 as a driving machine. The chuck barrel 42 is supported by the output shaft 41A of each linear motion motor 41, and is a holding means having a pair of gripping claws 42A. The peeling means 50 is provided with a linear motor 51 as a driving machine, and a chuck barrel 52 as a driving machine. The chuck cylinder 52 is supported by the slider 51A of the linear motor 51, and is a holding means having a pair of gripping claws 52A. The operation of the above positioning device EA will be described. In addition, the following steps performed by the positioning device EA are steps performed in the method of manufacturing a semiconductor device including the chip CP. First of all, for the positioning device EA in which the components are arranged in the initial position shown in FIG. The conveying means shown in the figure conveys the plurality of wafers CP attached to the next sheet AS to a predetermined position above the stage 12. The separating means 40 drives the linear motor 41 and the chuck barrel 42, as shown in the two-point chain in Fig. 1A As shown in the line, the adhesive sheet AS is held by a pair of holding claws 42A. Next, the separating means 40 drives the linear motion motor 41, and as shown in FIG. 1B, tension is applied to the adhesive sheet AS to expand the interval between the plurality of wafers CP (separation step). At this time, the gaps between the wafers CP are enlarged so as to face the hydrophilic portions 12F of the support surface 12A. Then, the support means 10 drives the linear motor 11, as shown in FIG. 1B, the stage 12 is raised to bring the support surface 12A into contact with the wafer CP, and then the pressure reducing means 23 is driven to start the wafer CP using the support surface 12A. Adsorption and retention (supporting process). Next, the separating means 40 drives the chuck tube 42 to release the grip of the sheet AS by the gripping claws 42A, and the supporting means 10 drives the linear motor 11 until the sheet AS reaches a predetermined height to the left of the chuck tube 52 The stage 12 is lowered up to the position. Next, the peeling means 50 drives the linear motor 51 and the chuck cylinder 52, and the right end of the adhesive sheet AS is gripped by a pair of gripping claws 52A. Next, the supporting means 10 drives the linear motor 11 to lower the stage 12 to return to the initial position. At the same time, the peeling means 50 drives the linear motor 51, as shown in FIG. 1C, to move the chuck barrel 52 to the left. It moves and peels the adhesive sheet AS from the wafer CP (peeling process). If the adhesive sheet AS is peeled from all the wafers CP, after the peeling means 50 stops the drive of the linear motor 51, the chuck cylinder 52 is driven to release the holding of the adhesive sheet AS by the gripping claws 52A, and the peeled adhesive The sheet AS falls toward a collection box, a collection bag, and other collection means (not shown) located below it. Then, if the supporting means 10 stops the driving of the decompression means 23 and the adsorption and holding of the wafer CP on the supporting surface 12A is released, the liquid supply means 20 drives the switching valves 24, 25, as shown in FIG. 1D, by adding After the pressure-side piping 21A connects the recess 12B with the pressurizing means 22, the pressurizing means 22 is driven to increase the pressure in the storage tank 21. Thereby, the liquid LQ is supplied to the hydrophilic portion 12F of the support surface 12A through the pressure-side pipe 21A, the switching valve 25, the pipe 25A, the flow path 12C, and the porous member 12D (liquid supply step). When the liquid LQ is supplied to the hydrophilic part 12F, the liquid LQ swells in the hydrophilic part 12F, pushing up the wafer CP as shown in FIG. 1D. If the wafer CP is pushed up by the liquid LQ, the wafer CP is positioned at a predetermined position using the surface tension of the liquid LQ as shown by the two-dot chain line in FIG. 1D. Next, when the liquid supply means 20 stops the driving of the pressurizing means 22, the liquid recovery means 30 drives the switching valves 24, 25, as shown in FIG. After that, the pressure reducing means 23 is driven to reduce the pressure in the storage tank 21. Thereby, the liquid LQ on the hydrophilic part 12F of the support surface 12A is recovered into the storage tank 21 through the porous member 12D, the flow path 12C, the pipe 25A, the switching valve 25, and the pressure-reducing pipe 21B (liquid recovery step). If the liquid LQ located on the hydrophilic portion 12F is recovered, the wafer CP abuts on the support surface 12A, and the adsorption and holding of the wafer CP by the support surface 12A starts. At this time, each wafer CP is positioned at a predetermined position at a predetermined angle, and is supported by the support surface 12A in a state of being positioned at the predetermined position. The liquid LQ recovered from the hydrophilic portion 12F in the liquid recovery step is again supplied toward the hydrophilic portion 12F in the next liquid supply step. Then, the supporting means 10 stops the driving of the decompression means 23 and releases the suction and holding of the wafer CP by the supporting surface 12A. Then, a transporting means not shown transports the wafer CP from the supporting surface 12A, and the wafer CP is stacked on the lead Frame, substrate, etc. (layering process). Next, if all the wafers CP are transported from the support surface 12A, each means drives the respective driving equipment to return each member to the initial position, and then repeats the same process as described above. According to the above-mentioned embodiment, because the liquid LQ is recovered from the hydrophilic part 12F on the supporting surface 12A, it is not necessary to wait until the liquid LQ of the hydrophilic part 12F evaporates to the extent that the wafer CP is supported by the supporting surface 12A, and the processing capacity per unit time can be prevented. reduce. As described above, the best configuration, method, etc. for carrying out the present invention are disclosed in the foregoing description, but the present invention is not limited thereto. That is, although the present invention is mainly illustrated and described for specific embodiments, it does not deviate from the technical idea and purpose of the present invention. For the above-mentioned embodiments, the shape, material, quantity, and For other detailed structures, various modifications can be made by those with ordinary knowledge in the relevant technical field. In addition, the above-disclosed descriptions that limit shapes, materials, etc. are merely illustrative descriptions for easy understanding of the present invention, and are not intended to limit the present invention. Therefore, some or all of the limitations on shapes, materials, etc. are released. The following component names are also included in the present invention. For example, the supporting means 10 can also use the supporting surface 12A to adsorb and hold the wafer CP by a pressure reducing means independent of the liquid recovery means 30, or it can also be used to hold the wafer CP without using the supporting surface 12A after the liquid recovery process. Adsorption keeps. The water-repellent portion 12E may be configured by attaching a hydrophobic sheet, film, tape, or the like to the support surface 12A, or subjecting the support surface 12A to surface treatment or coating that can exhibit hydrophobicity. The hydrophilic portion 12F may be configured by attaching a hydrophilic sheet, film, tape, or the like to the support surface 12A, or subjecting the support surface 12A to surface treatment or coating that can exhibit hydrophilicity. The liquid supply means 20 may also be configured to supply the liquid LQ from the outside of the stage 12 toward the support surface 12A using a nozzle, hose, etc., or prevent the liquid LQ recovered from the hydrophilic part 12F in the liquid recovery process from facing the hydrophilic part 12F Supply again. The liquid recovery means 30 may be provided as a separate unit from the liquid supply means 20. In this case, the flow path 12C of the stage 12 and the liquid supply means 20 may be shared and the liquid LQ may be recovered from the flow path 12C. The stage 12 is provided with a recovery channel different from the channel 12C, and the liquid LQ is recovered from the recovery channel. The separating means 40 may also apply tension in the up and down direction to the adhesive sheet AS, or give a total of 4 directions to the right, left, front and rear, 2 directions to the right and left, and a total of left front, left rear and right. Tensions in 3 directions or 5 directions or more including components in the front, rear, left, and right directions expand the gap between the wafers CP; when a frame member such as a ring frame integrated with the wafer CP through the adhesive sheet AS is used, By supporting the frame member and applying tension to the adhesive sheet AS, the gap between the chips CP can be enlarged; it can also be bonded with a fragile layer, grooves, and notches to form a state that can be singulated into a plurality of chips CP Tension is applied to the adhesive sheet AS of the semiconductor wafer (hereinafter also referred to as "wafer") to divide the wafer into a plurality of chips CP to expand the gap between the chips CP. The fragile layer is used by a laser irradiation device , The chemical agent application device and other fragile means are formed physically or chemically, and the grooves and notches are formed by cutting means such as a cutter. The separating means 40 may be provided or not provided in the positioning device EA of the present invention. When the separating means 40 is not provided, another device may be used to increase the distance between the wafers CP. The peeling means 50 may be provided or not provided in the positioning device EA of the present invention. When the peeling means 50 is not provided, other devices can be used to peel off the adhesive sheet AS, or cutting means such as a cutter, etc. The adhesive sheet AS is cut along the gap between the plurality of wafers CP by gas blowing by a gas blowing means such as a nozzle, and the cut adhesive sheet AS is bonded to the wafer CP as it is. The positioning device EA may include: a bonding means for bonding the adhesive sheet AS on the wafer CP or wafer using a pressing member such as a pressing roller, and may also include: a laser irradiation device for cutting the wafer into a plurality of chips CP, Cutting means such as cutters may also be provided with an integrated means for integrating the chip CP or the wafer with the frame member through the adhesive sheet AS, or it may be configured to combine a plurality of chips that are not bonded to the adhesive sheet AS The CP is conveyed by a conveying means not shown, and is placed on the hydrophilic part 12F of the support surface 12A. The liquid LQ used in the positioning device EA is not particularly limited as long as it has a certain surface tension. For example, it may be an alcohol solution containing ethanol, propanol, glycerin, and the like. In the foregoing embodiment, although it was shown as an example that a plurality of wafers CP are positioned as the sheet-like body, one wafer CP may be used as the sheet-like body. Either the support step or the liquid supply step may be performed first, and the liquid supply step may be performed after the support step is performed, or the support step may be performed after the liquid supply step is performed. When the support step is performed after the liquid supply step is performed, the wafer CP can be peeled from the adhesive sheet AS while maintaining the gap between the wafers CP with another device. After the liquid supply step is performed, the peeled wafer CP can be transferred to The supporting surface 12A is supported. The lamination process and the recycling process may be implemented or not. The frame member, in addition to the ring-shaped frame, may also be non-circular (not connected to the outer periphery), circular, elliptical, polygonal, or other shapes. The means and steps of the present invention are not limited as long as they can complete the actions, functions, or steps described for the means and steps, and are of course not limited to the structure of the single embodiment shown in the foregoing embodiment. And process. For example, the supporting step is only required to support the sheet-like body by using a plurality of hydrophilic portions provided on the supporting surface with hydrophilicity. Refer to the technical common sense at the time of application. (The other means and procedures are the same). Next, the material, type, shape, etc. of the sheet AS and the sheet-like body are not particularly limited. For example, the adhesive sheet AS and the sheet-shaped body may be circular, elliptical, polygonal, or other shapes, and the adhesive sheet AS may be of pressure-sensitive adhesive, heat-sensitive adhesive, or the like. Such an adhesive sheet AS may be, for example, a single layer having only an adhesive layer, an intermediate layer between the substrate and the adhesive layer, and three or more layers including a coating layer on the upper surface of the substrate. It may also be a so-called double-sided adhesive sheet capable of peeling the base material from the adhesive layer. The double-sided adhesive sheet may have a single-layer or multiple-layer intermediate layer, or a single-layer or multiple-layer without intermediate layer. Also as a sheet-like body, for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers or compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, ceramics, wood boards, resins, etc. The body object may also be a composite formed by two or more of them, and it may also be an object of any form of member, article, etc. When the sheet AS is changed to a functional and useful name, for example, it can be a label for information recording, a label for decoration, a protective sheet, a dicing tape, a die attach film, and a die bonding tape. , The recording layer forms any sheet, film, tape, etc. such as a resin sheet. The drive machine of the foregoing embodiment can be used: electric machines such as rotary motors, linear motors, linear motors, single-axis robots, multi-joint robots with two or more joints, air cylinders, hydraulic cylinders, and Actuators such as rod cylinders and rotary cylinders can also be directly or indirectly combined. In the foregoing embodiment, when a pressing means such as a pressing roller, a pressing head, or a pressing member is used as the person to press the object to be pressed, instead of or in combination with the above-exemplified ones, a roller, a round bar, or a plate may be used. (blade) materials, rubber, resin, sponge, etc., can also be compressed by blowing air, gas and other gases, and the press can be composed of deformable members such as rubber, resin, etc. Can be composed of non-deformable components. When supporting (holding) means or supporting (holding) members are used for supporting (holding) the supported member (holding member), a holding means such as a mechanical chuck or a chuck barrel can be used, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction suction, driving machine, etc. to support (hold) the supported member. When a cutting means or a cutting member is used to cut the member to be cut, or to form a cut or cut line in the member to be cut, it can be used instead of the above-exemplified or used in combination with it. Cutting knife, laser cutting machine, ion beam, firepower, heat, water pressure, electric heating wire, gas or liquid spray, etc., can also be combined with a suitable driving machine to perform cutting. Cut off.

10: Supporting means 11, 41: Direct drive motor 11A, 41A: output shaft 12: Stage 12A: Bearing surface 12B: recess 12C: Flow path 12D: Porous member 12E: hydrophobic part 12F: Hydrophilic part 12G: Water repellent material 20: Liquid supply means 21: storage tank 21A: Pressure side piping 21B: Decompression side piping 22: Pressure means 23: Decompression means 24, 25: switching valve 25A: Piping 30: Liquid recovery means 40: Separation means 42,52: chuck barrel 42A, 52A: gripping claw 50: Stripping means 51: Linear motor 51A: Sliding parts AS: then slice CP: Semiconductor wafer (sheet body) EA: Positioning device LQ: Liquid

[Fig. 1A] is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention. [Fig. 1B] is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention. [Fig. 1C] is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention. [Fig. 1D] is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention. [Fig. 1E] is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention.

10: Supporting means

11, 41: Direct drive motor

11A, 41A: output shaft

12: Stage

12A: Bearing surface

12B: recess

12C: Flow path

12D: Porous member

12E: hydrophobic part

12F: Hydrophilic part

12G: Water repellent material

20: Liquid supply means

21: storage tank

21A: Pressure side piping

21B: Decompression side piping

22: Pressure means

23: Decompression means

24, 25: switching valve

25A: Piping

30: Liquid recovery means

40: Separation means

42,52: chuck barrel

42A, 52A: gripping claw

50: Stripping means

51: Linear motor

51A: Sliding parts

AS: then slice

CP: Semiconductor wafer (sheet body)

EA: Positioning device

LQ: Liquid

Claims (4)

A positioning method is a positioning method that uses the surface tension of a liquid to position a sheet in a predetermined position, which implements the following steps: The supporting step of supporting the aforementioned sheet-like body by using the hydrophilic part with hydrophilicity provided on the supporting surface, The liquid supply step of supplying liquid to the aforementioned hydrophilic part, A liquid recovery step of recovering the liquid from the hydrophilic part. The positioning method according to claim 1, wherein: In the liquid supply step, the liquid is supplied to the hydrophilic portion using a flow path provided inside the support member having the support surface. The positioning method according to claim 1 or 2, wherein: In the liquid supply step, the liquid recovered from the hydrophilic portion in the liquid recovery step is supplied again to the hydrophilic portion. A positioning device is a positioning device that uses the surface tension of a liquid to position a sheet-shaped body at a predetermined position, and is equipped with: The support means for supporting the aforementioned sheet-shaped body by using the hydrophilic part with hydrophilicity provided on the support surface, Liquid supply means for supplying liquid to the aforementioned hydrophilic part, and Liquid recovery means for recovering the liquid from the hydrophilic part.

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