TW202104041A - Method for processing fragile substrates employing temporary bonding of the substrates to carriers - Google Patents

Abstract

The present invention is directed to a method for processing a fragile, e.g. (ultra-)thin and/or large, substrate (1) having a front side surface and a back side surface, the method comprising bonding the back side surface of the substrate (1) to a first carrier (2) at one or more first bonding areas, applying one or more first vacuum treatment processes to the front side surface of the substrate (1), and debonding the first carrier (2) from the back side surface of the substrate (1), wherein the one or more first bonding areas comprise only a fraction of the back side surface, the fraction being less than 50% of the back side surface. Furthermore, the present invention pertains to a method for manufacturing vacuum coated substrates for providing optical, optoelectronic and semiconductor devices, displays, micro-displays, device carrier systems for advanced packaging technology, such as fanout substrates, the method comprising the previously specified method for processing a substrate (1).

Description

Method for processing the fragile substrate by temporarily bonding the fragile substrate to the carrier

The present invention relates to a method for processing fragile substrates such as (ultra) thin and/or large substrates such as glass or semiconductor wafers. In particular, the present invention relates to temporarily bonding a substrate to a carrier, and further includes applying more than one vacuum treatment process to the surface of the substrate. In addition, the present invention relates to a method for manufacturing a vacuum coated substrate using the proposed substrate processing method.

In order to manufacture high-quality, high-performance optical, optoelectronic and semiconductor devices for advanced applications in fields such as photonics, optoelectronics, microelectromechanical systems (MEMS), and wireless communications, the trend is toward thinner and thinner processing. Growing substrates. Such substrates are extremely fragile and easily damaged during direct handling. For example, when they are prepared for processing and transportation in a system for processing substrates, the system includes multiple modules for different manufacturing steps. In addition, when the substrate undergoes a vacuum processing process, considerable stress and strain are applied to the substrate. Therefore, in the prior art, such fragile substrates are typically mechanically clamped between two ring frames along the circumference of the substrate to be transported during the entire substrate processing. However, this has the disadvantage that most of the peripheral area of the substrate is sacrificed in the mechanically clamped area, that is, the area that can be used to provide the final product. In addition, such clamping systems are labor intensive and difficult to automate. Particles are easily formed on the surface of the clamping frame. Therefore, the clamping frame needs to be cleaned frequently. Therefore, there is a need for improved methods for handling and handling fragile substrates.

One of the objectives of the present invention is to provide an improved method for handling and processing fragile substrates, such as (ultra) thin and large substrates. This purpose is achieved by the method according to claim 1. Specific embodiments of the method according to the invention are given in the appendix.

In addition, another object of the present invention is to provide an improved method for manufacturing vacuum-coated substrates to provide high-quality, high-performance optical, optoelectronic and semiconductor devices. This objective is achieved by the method according to claim 20.

The present invention provides a method for processing a substrate, the substrate having a front side surface and a back side surface, and the method includes the following steps: a) bonding the backside surface of the substrate to the first carrier at more than one first bonding area; b) applying more than one first vacuum treatment process to the front surface of the substrate; and c) detach the first carrier from the backside surface of the substrate, The one or more first joining regions only include a part of the back surface, and the part is less than 50% of the back surface.

According to the proposed method, only a part of the backside surface of the substrate, that is, less than 50% of the backside surface of the substrate, is temporarily bonded to the first bonding area at more than one separate (that is, individual) first bonding area One carrier. In order to be able to transport the substrate easily, temporarily join a large and thin substrate to a strong first carrier, and then perform more than one first vacuum treatment process on the substrate, including a physical or chemical coating process, such as physical gas Phase deposition (PVD), chemical vapor deposition (CVD) and atomic layer deposition (ALD) or plasma etching processes (especially thin films, surface treatment), they will impose considerable stress and strain on the substrate, usually Causes substantial warpage/deformation/bending of the substrate surface. However, by firmly bonding the substrate to the elastic first carrier, such deformation of the substrate (or at least greatly reduced) is avoided. Once the vacuum treatment process on the front side surface of the substrate has been completed, the temporary bonding can be released by appropriate release means. By selectively bonding only a part of the backside surface of the substrate to the first carrier at more than one first bonding area, that is, by minimizing the first bonding area as much as possible to achieve the required bonding strength , To ensure that when the first bonding area becomes unusable, especially if it is damaged (for example, by the residue of the first bonding/disengaging process), most of the total substrate area (for example, 90%) remains usable, To provide the final product (such as described in claim 20).

In one embodiment, the method further includes the following steps: d) after step b) of applying the one or more first vacuum treatment processes, and before step c) of detaching the first carrier or substantially simultaneously with step c) of detaching the first carrier (for example Together), bonding the front side surface of the substrate to the second carrier at more than one second bonding area (while maintaining the bonding with the first carrier); e) after step c) of detaching the first carrier, applying one or more second vacuum treatment processes to the backside surface of the substrate; and f) separating the second carrier from the front surface of the substrate, The one or more second joining regions only include a part of the front side surface, and the part is less than 50% of the front side surface.

According to the proposed method, a part of the front side surface of the substrate, for example up to 50% of the front side surface of the substrate, is temporarily bonded to the second carrier at more than one separate (ie, individual) second bonding area. Perform temporary bonding of a large and thin substrate to a strong second carrier while still temporarily bonding to a strong first carrier, in order to prevent serious warpage/deformation/bending of the thin substrate (this will cause problems from the first carrier After detachment, before joining to the second carrier), and once the first carrier has been detached from the substrate, the substrate is easily handled, and then more than one second vacuum treatment process is performed on the substrate, including a physical or chemical coating process , Such as physical vapor deposition (PVD), chemical vapor deposition (CVD) and atomic layer deposition (ALD) or plasma etching process (especially thin film, surface treatment), they put considerable stress and strain on the substrate, It usually causes substantial warpage/deformation/bending of the substrate surface. However, by already firmly bonding the substrate to the elastic second carrier, such deformation of the substrate is again avoided (or at least greatly reduced). Once the vacuum processing process on the backside surface of the substrate has been completed, the temporary bonding can be released by a suitable release method. By selectively bonding only a part of the front side surface of the substrate to the second carrier at more than one second bonding area, that is, by minimizing the second bonding area as much as possible to achieve the required bonding strength, To ensure that when the second bonding area becomes unusable (especially damaged) by the second bonding/disengaging process, most of the total area of the substrate (for example, 90%) remains available to provide the final product ( (As described in claim 20). Maintaining the bond with the first carrier also makes it easier and faster to bond the substrate to the second carrier.

In another embodiment, the method further includes the following steps: after the step of applying the one or more first vacuum treatment processes, and before the step of applying the one or more second vacuum treatment processes, removing the substrate from one The front processing position is flipped to a back processing position. In order to apply more than one second vacuum processing process to the backside surface of the substrate, it is typically necessary to flip (180°) the substrate from the front side processing position to the back side processing position. This movement is particularly subtle for large and thin substrates, and by bonding the substrate to the first or second carrier, or to the first and second carriers at the same time, the strain and stress are reduced, and the substrate is only bonded to the substrate. Compared with one of the two carriers flipping simultaneously, this movement provides increased support. Therefore, before bonding the substrate to the second carrier while still bonding the substrate to the first carrier, after bonding the substrate to the second carrier and simultaneously bonding the substrate to the first carrier, or after removing the substrate from the first carrier After detaching and simultaneously bonding the substrate to the second carrier, a step of turning the substrate over may be performed.

In another embodiment of the method, the total area of the one or more first bonding regions is less than 10%, especially less than 5%, more especially less than 2% of the total area of the backside surface of the substrate.

In another embodiment of the method, the total area of the one or more second bonding regions is less than 10%, especially less than 5%, more especially less than 2% of the total area of the front side surface of the substrate.

In another embodiment of the method, the one or more first and/or second joining regions are point-shaped or (straight or curved) linear.

In another embodiment of the method, more than three first bonding areas are used.

In another embodiment of the method, more than three second bonding areas are used.

In another embodiment of the method, one or more of the first bonding regions are located on the periphery of the backside surface of the substrate, and in particular, at least one of the first bonding regions is located A central area of the backside surface of the substrate.

In another embodiment of the method, one or more of the second bonding regions are located on the periphery of the front side surface of the substrate, and in particular, at least one of the second bonding regions is located on the A central area of the front surface of the substrate.

In another embodiment of the method, the one or more second joining areas are positioned opposite to the one or more first joining areas, and in particular, the one or more second joining areas are opposite to the one or more first joining areas. A bonding area is aligned.

In another embodiment, the one or more first and/or second bonding regions cannot be used due to bonding and/or disengagement, so as to provide the first and/or second vacuum treatment process by applying the more than one first and/or second vacuum processing processes. The resulting product, for example due to residues of the bonding material or strain/stress associated with bonding and/or disengagement.

In another embodiment of the method, at least one of Van der Waals force (intermolecular force), electrostatic force, and application of a polymer bonding material is used to achieve contact with the first and/or second carrier. Bonding, especially in the form of bonding pads and/or strips. The size of the bonding area is designed so that the total bonding force provided at the bonding area for bonding the substrate to the first or second carrier is sufficient to maintain the weight of the substrate (when facing the ground and suspended on the first or second carrier) . This means that when the total bonding area is reduced to maintain the weight of the substrate, the bonding force per unit area will increase. In relation to helping the substrate to detach from the first/second carrier, it is important to keep the bonding force per unit area below a positioning level/critical value. However, the goal is to minimize the total bonding area as much as possible, as this increases/maximizes the area in the substrate that can be used to provide the final product.

In a specific embodiment that utilizes electrostatic bonding force, the electrostatic bonding force is generated by reversing the applied charge, while simultaneously detaching the first carrier from the back side surface of the substrate and bonding the front side surface of the substrate to the second carrier. Therefore, detaching the back side surface of the substrate from the first carrier and bonding the front side surface of the substrate to the second carrier are performed together (that is, when the charge is reversed to reverse the direction of the electrostatic holding force/bonding force, basically at the same time). It is also pointed out here that the bonding area is minimized in order to maximize the area of the substrate that can be used to provide the final product.

The bonding can be performed under normal atmospheric pressure conditions or in a vacuum (especially under a pressure below atmospheric pressure). Likewise, the detachment can be performed under normal atmospheric pressure conditions or in a vacuum (especially at a pressure lower than atmospheric pressure). Regarding pressure and/or temperature, neither joining nor disengaging need to be performed under the same conditions.

In another embodiment of the method, the polymer bonding material includes at least one of the following: organic materials, silicone resins, polyamides, materials containing carboxyl end groups, especially multi-component materials of two-component materials, The multi-component material contains photosensitive substances, especially primers.

In another embodiment of the method, the bonding with the first and/or second carrier is achieved by a one-directional bonding/adhesive structure having a directional-dependent bonding/adhesive characteristic, especially when the first and/or second carriers are attached When applied at one or second bonding area, it provides greater bonding force in a direction perpendicular to the front or back surface of the substrate than in a direction parallel to the front or back surface of the substrate .

In another embodiment of the method, the detachment of the first and/or second carrier is achieved by at least one of the following: applying an (external) mechanical separation force or a chemical solvent to the first and /Or the second bonding area and exposing the first and/or second bonding area to light and/or heat, the light being particularly laser light, more particularly UV light of an excimer laser. The detachment can be performed especially at room temperature.

In another embodiment of the method, in order to detach the first carrier, especially to apply the laser light toward the back surface of the substrate via the first carrier, and/or to detach the second carrier, especially The laser light is applied toward the front surface of the substrate via the second carrier.

In another embodiment of the method, the front surface of the substrate is coated with an optical filter layer, especially a near-infrared NIR (band pass) filter layer, especially the optical filter layer is applied with the one The result of the above first vacuum treatment process.

In another embodiment of the method, at least one of the one or more first and/or second vacuum treatment processes includes at least one of the following: (plasma) etching, plasma cleaning, and vacuum coating Cover, especially physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD), more particularly on the front surface of the substrate and/or At least one of an optical filter layer, a metallization layer, and a dielectric layer is deposited on the backside surface.

In another embodiment of the method, the substrate has a thickness of less than 500 μm, especially less than 250 μm.

In another embodiment of the method, the first and/or second carrier has a thickness greater than 500 μm, especially greater than 1 mm.

In another embodiment of the method, the substrate has a lateral extension of at least 100 mm, especially at least 200 mm.

In another embodiment of the method, the first and/or second carrier has a lateral extension of at least 100 mm, especially at least 200 mm.

In another embodiment of the method, the first and/or second carrier is adapted to function as a stabilizing body or supporting/fixing structure, especially rigid.

In another embodiment of the method, the first and/or second carrier has a flat or curved surface.

In another embodiment of the method, the coefficient of thermal expansion of the substrate is substantially the same as the coefficient of thermal expansion of the first and/or second carrier, and in particular, the substrate is composed of the same coefficient of thermal expansion as the first and/or second carrier. The carrier is made of the same material.

In another embodiment of the method, the substrate is a glass or semiconductor wafer.

In another embodiment of the method, the first and/or second carrier system is made of glass, ceramic material, metal or metalized material (for example, having a metal surface such as a metal surface coating).

In another embodiment of the method, steps a) to c) and steps d) to f) are continuously repeated one or more times. In this way, additional (third, fourth, etc.) vacuum processing processes are applied to the front and back surfaces of the substrate. The first carrier and the second carrier can be reused for this purpose, or can be replaced with additional (third, fourth, etc.) other carriers. Generally, the carrier can be designed and adapted to be a one-time (disposable) or (multiple) reusable carrier. In the latter case, the carrier may need to be cleaned regularly, that is, used for a certain number of times. (Engagement/disengagement cycle) after.

In another embodiment of the method, bonding is achieved by the following: thermally actuated adhesive, pressure actuated adhesive, solvent actuated adhesive, UV (ultraviolet) actuated adhesive, (low temperature) plasma Actuation adhesive, high-voltage discharge activation adhesive, or any combination thereof. As part of the bonding process, the bonding material can be actuated by applying heat, pressure, solvent, UV light (at a selected wavelength, such as 300 nm), high voltage discharge, (low temperature) plasma, or any combination thereof. When in contact with the activated bonding material or adhesive, the substrate adheres or attaches to the carrier, thus bonding the substrate (the backside surface or the front side surface thereof) to the (first or second) carrier.

The present invention further provides a method for manufacturing a vacuum-coated substrate to provide high-quality, high-performance optical, optoelectronic and semiconductor devices, displays, microdisplays, and devices for advanced packaging technologies such as fan-out substrates A carrier system, the method includes the previously mentioned method for processing a substrate.

In the following, we use an exemplary substrate in the form of a large circular ultra-thin glass wafer, such as a substrate with a diameter of 200 mm and a thickness of 200 μm, to exemplify and provide details of the method according to the present invention. However, the proposed method is also applicable to fragile substrates of other sizes, thicknesses and materials.

In order to stabilize the fragile substrate, it is joined to the carrier for subsequent handling. Examples of suitable carriers with different bonding patterns/bonding areas are illustrated in Figures 1a) to c). These exemplary carriers 2 have the same circular shape, size, and flatness as the substrate mounted on the carrier 2. For example, the carrier 2 is also made of the same glass material as the substrate, and therefore has the same coefficient of thermal expansion as the substrate, but is considerably thicker, for example, 1 mm thick. Therefore, the carrier 2 is much stronger than a fragile substrate, and therefore can function as a stabilized body or support structure for the substrate. Figure 1a) shows a top view of the first (or likewise/similarly, second) carrier 2 with four small dot/circular bonding pads 3, 3', 3'', 3'' In the exemplary configuration of, three of these bonding pads are located at the periphery of the carrier 2 (that is, close to its outer edge), and the fourth of these bonding pads is located at the center of the carrier 2. The total bonding area of the pads 3, 3', 3", and 3" is approximately 2% of the total area of the back side surface (or front side surface) of the substrate. Figure 1b) is a top view showing the carrier 2 having an alternative exemplary configuration of three strip-shaped bonding pads 3, 3', 3" extending radially from the center of the substrate. In this case, the total bonding area of the pads 3, 3', 3" is about 10% of the total area of the back side surface (or front side surface) of the substrate. Finally, Figure 1c) shows a top view of the carrier 2. The carrier 2 has a central point-shaped bonding pad 3"' and three circumferentially arranged circumferentially arc-shaped bonding pads 3, 3', 3". Illustrative configuration. In this case, the total bonding area of the pads 3, 3', 3", 3'" is approximately 6% of the total area of the back side surface (or front side surface) of the substrate. According to the present invention, bonding pads/bonding areas of other shapes and sizes are conceivable to bond at most a part of 50% of the back side surface (or front side surface) of the substrate to the carrier 2.

According to the example illustrated in FIG. 2, the substrate 1 is first mounted and bonded to the first carrier 2 (see step 101 in FIG. 2b). The backside surface of the substrate 1 is temporarily bonded to the carrier 2 by, for example, polymer bonding using four small round (dot-shaped) bonding pads 3, 3', 3", and 3"'. These The first three bonding pads 3, 3', 3" are, for example, arranged to be equally spaced apart from each other along the periphery of the carrier 2, and the fourth bonding pad 3"' is located at the center of the carrier 2 ( See Figure 1a) and Figure 2a) i)). These bonding pads 3, 3', 3", 3'" only occupy a small space (about 2% of them) on the backside surface of the substrate 1, and are therefore covered on the backside surface of the substrate 1 (first ) In the case of (de)bonding damage or contamination at the bonding area, this will only result in a small loss of the area that can be used to provide the final product, that is, only a small part of the area of the substrate 1 is sacrificed due to the bonding. On the other hand, these bonding areas are sufficient to fix the substrate 1 during the subsequent vacuum processing process, and avoid warping of the substrate surface due to the stress and strain applied to the substrate 1 (now fixed by the carrier 1) by the vacuum processing process /Deformation/Bending.

Subsequently, one or more first vacuum treatment processes are applied to the front side surface of the substrate 1, for example, an optical coating 6 such as an optical filter layer is deposited on the front side surface (see step 102). After that, while the back side surface of the substrate 1 is still bonded to the carrier 2, the front coated surface of the substrate 1 is bonded to the second carrier 4 again at the second bonding area, for example by polymer bonding (see Step 103 and Figure 2a)ii). The second carrier 4 is the same as the first carrier 2, that is, the shape, size and material, and the shape, size and position of the bonding pads 5, 5', 5", 5"' are the same. The first bonding area and the second bonding area are therefore aligned relative to each other. After the front side surface of the substrate 1 is bonded to the second carrier 4, the back side surface of the substrate 1 is separated, that is, detached from the first carrier 2 (see step 104). This detachment is achieved, for example, by exposing the polymer bond to UV light of an excimer laser. UV light passes through the first carrier 2 and interacts with the first polymer on the backside surface of the substrate 1 at the first bonding area, but does not interact with the first polymer on the front surface of the substrate 1 at the second bonding area. The two polymer bonds interact, thus leaving the second bond intact because it is blocked by the optical filter (eg NIR bandpass filter) layer/coating 6 previously deposited on the front surface of the substrate 1. If the bonding/disengaging system is achieved by, for example, an electrostatic force instead, the disengagement from the first carrier 2 and the bonding to the second carrier 4 are simultaneously performed by reversing the electrostatic bonding/holding charge. It should be pointed out that during this stage of the process/method, the substrate 1 should always be bonded to at least one of the first and second carriers 2, 4 in order to ensure that the The stress applied to the substrate 1 during the period will not cause the substrate surface to warp/deform/bend. If the substrate 1 is released from the first carrier 2 without being bonded to the second carrier 4 (that is, it is temporarily unbonded to the This happens when the carrier is not fixed to a stabilized body or support structure that can withstand the stress and strain applied by the previous first vacuum processing process).

After being separated from the first carrier 2, the substrate 1 joined to the second carrier 4 is turned over (that is, rotated 180° to the other side thereof; see step 105 and FIG. 2a)iii). Then, one or more second vacuum treatment processes are applied to the back side surface/bottom side surface of the substrate 1 that is now facing upward (see step 106), and another coating layer 7 is deposited on the back side surface/bottom side surface of the substrate 1 On the bottom side surface. These second vacuum treatment processes may be different from the first vacuum treatment processes applied to the front side surface/top side surface of the substrate 1. Finally, for example, by exposing the polymer bond to UV light on the excimer laser again, the substrate 1 is detached from the second carrier 4.

It should be noted that it is also possible to perform flipping/reversing the substrate 1 to the other side before detaching/separating the substrate 1 from the first carrier 2 (that is, between steps 103 and 104). This has the advantage that the substrate is bonded to both the first carrier 2 and the second carrier 4, providing additional stability while being flipped/inverted onto the other side.

It should be noted that by using only a few (that is, three to four) small dot-shaped bonding pads, the release system is simplified and faster to achieve, and in addition, the sacrificed total bonding area is minimized, so that the substrate A small part of the total surface area of 1 may potentially not be used to provide products by destructive engagement/disengagement, which is an important advantage of the method proposed according to the present invention.

Figure 3a) depicts a series of top views of an exemplary system for processing a substrate, which illustrates how the substrate and carrier move through individual system modules during various stages of processing the substrate according to the method of the present invention. The system includes a cassette station 8 in which a plurality of substrates and (first and second) carriers are stored before and after the processing is completed. Three different system modules are arranged around the box carrier station 8 and are adjacent to the box carrier station 8. They are respectively the assembly station 9, the turning station 10 and the load lock 11, and each of them can be accessed from the box carrier station 8. In the assembly station 9, the substrate is bonded to the (first and second) carrier and detached from the (first and second) carrier. In the turning station, the substrate is turned 180° from its front/top processing position to its back/bottom processing position. The box carrier station 8, the assembly station 9 and the turning station 10 work under normal/surrounding atmosphere. However, in order to apply a vacuum processing process, the substrate needs to be moved to the processing module 13 operating under vacuum. To this end, the substrate to be processed is transferred to the load lock 11, and air is pumped in the load lock 11 to achieve a vacuum. Next, the substrate is transferred through the vacuum carrier 12, which includes a conveying/conveying means such as a robot (arm) or a conveyor, and enters the processing module 13, where more than one ( The first and second) vacuum processing processes are applied to the substrate. The processing module 13 can be composed of several modules, and each module is suitable for applying a certain process in the vacuum processing process, such as etching, plasma cleaning and vacuum coating, especially physical vapor deposition (PVD), Chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD). Figure 3b) shows a series of corresponding side views of the substrate to be bonded to the carrier and the corresponding sequence of the steps of the method according to the invention.

Initially, the substrate and the first carrier are loaded from the cassette station 8 to the assembly station 9 (see Figure 3a) i) two downward arrows), in the assembly station 9, the backside surface of the substrate is joined to the first On a carrier (see step 201 and Figure 3b) i)). Then, the substrate fixed to the first carrier is passed through the load lock 11, and is transported by the vacuum carrier 12 to the processing module 13 (see the left arrow in Figure 3a) i)), and the processing module 13 The top coating is deposited on the front side surface/top side surface of the substrate (see step 202). After this, the substrate coated on one side is returned to the assembly station 9 (see the right arrow in Fig. 3a) ii)). Load the second carrier from the cassette station 8 to the assembly station 9 (see the downward arrow in Fig. 3a) ii) and the first action of step 203). Now, the front side surface of the substrate is joined to the second carrier (see the second action of step 203 and Figure 3b) ii)), after which, the back side surface of the substrate is detached from the first carrier (see step 203, the first Three actions and Figure 3b)iii)). Next, the first carrier is returned to the box carrier station 8 (see Figure 3a) iii) in the upward short arrow), and the substrate fixed to the second carrier is transferred to the turning station 10 (see Figure 3a) iii) in Upward long arrow), in the turning station 10, the substrate is turned from its back side surface to its front side surface, that is, it is turned over 180° (see step 204 and FIG. 3b) iv)). After that, the substrate fixed to the second carrier is passed through the load lock 11, and is transported by the vacuum carrier 12 to the processing module 13 (see the left arrow in Figure 3a) iii)), in the processing module In 13 the bottom coating is deposited on the backside surface/bottom side surface of the substrate (see step 205). Next, return the double-sided coated substrate to the assembling station 9 (see Figure 3a) iv) in the right arrow). In the assembling station 9, the front surface of the substrate is detached from the second carrier (see step 206) One action and Figure 3b)v)). Finally, the second carrier and the double-sided coated substrate are returned to the two upward arrows in the cassette station 8 (see FIG. 3a) iv) and the second and third actions of step 206).

Figure 3b) depicts a series of top views of an alternative exemplary system for processing substrates, illustrating how substrates and carriers move through individual system modules during various stages of substrate processing according to the method of the present invention. Alternative systems contain the same modules but are interconnected in different ways. Here, the box carrier station 8 is only attached to the load lock 11, and the load lock 11, the assembly station 9, the turning station 10 and the processing module 13 are all arranged around and adjacent to the vacuum carrier 12. The functions of the individual modules remain unchanged. However, the bonding and disengagement and the inversion/inversion of the substrate onto the other side thereof are performed under vacuum. Figure 4b) shows a series of identical corresponding side views of the substrate bonded to the carrier, and the corresponding sequence of the steps of the method according to the invention as shown in Figure 3b).

Initially, the substrate and the first carrier are loaded from the cassette station 8 via the load lock 11, and transported by the vacuum carrier 12 to the assembly station 9 (see the two long left arrows in Fig. 4a) i))), The backside surface of the substrate is bonded to the first carrier in the assembly station 9 (see step 201 and FIG. 4b) i). Then, the substrate fixed to the first carrier is transported to the processing module 13 by the vacuum carrier 12 (see Figure 4a) i) the leftward short arrow), in the processing module 13, the top coating is deposited On the front side surface/top side surface of the substrate (see step 202). Next, the single-sided coated substrate is returned to the assembly station 9 (see the right arrow in Figure 4a) ii)). The second carrier is transported to the assembly station 9 by the vacuum carrier 12 (see FIG. 4a) and the downward arrow in ii) and the first action of step 203). Now, the front side surface of the substrate is bonded to the second carrier (see the second action of step 203 and Figure 4b) ii)), after which, the back side surface of the substrate is detached from the first carrier (see step 203, the first Three actions and Figure 4b)iii)). Next, the first carrier is transported to the vacuum carrier (see the short upward arrow in Figure 4a) iii)), and the substrate fixed to the second carrier is transported to the turning station 10 by the vacuum carrier 12 (see The upward long arrow in Fig. 4a) iii)), in the reversing station 10, the substrate is reversed from its back side surface to its front side surface, that is, 180° (see step 204 and Fig. 4b) iv)). After that, the substrate fixed to the second carrier is transported to the processing module 13 by the vacuum carrier 12 (see the left arrow in Figure 4a) iii)). In the processing module 13, the bottom coating Deposited on the backside surface/bottom surface of the substrate (see step 205). After this, the double-sided coated substrate is returned to the assembling station 9 (see Figure 4a) iv) in the right short arrow), in the assembling station 9, the front side surface of the substrate is detached from the second carrier (see step The first action of 206 and Figure 4b)v)). Finally, the second carrier and the double-sided coated substrate are returned via the load lock 11 to the two long rightward arrows in the cassette station 8 (see FIG. 4a) iv) and the second and third actions of step 206).

It should be pointed out again that in the sequence described in conjunction with FIG. 3 and FIG. 4, while the substrate is bonded to both the first and second carriers, the steps of flipping/reversing the substrate can be performed alternately, so as to compare with The substrate is joined to only one of the two carriers and turned over at the same time to achieve increased support. As another alternative, before bonding the substrate to the second carrier and detaching the substrate from the first carrier, the substrate bonded to the first carrier may be inverted/reversed.

1: substrate 2: The first carrier, carrier 1 3: Bonding pad on carrier 1 (temporary bonding) 3': Bonding pad on carrier 1 (temporary bonding) 3'': Bonding pad on carrier 1 (temporary bonding) 3''': Bonding pad on carrier 1 (temporary bonding) 4: The second carrier, carrier 2 5: Bonding pad on carrier 2 (temporary bonding) 5': Bonding pad on carrier 2 (temporary bonding) 5'': Bonding pad on carrier 2 (temporary bonding) 5''': Bonding pad on carrier 2 (temporary bonding) 6: Front side coating/top side coating 7: Back side coating/bottom side coating 8: Box carrier station 9: Assembly station 10: Flip station 11: Load lock 12: Vacuum carrier 13: Processing module

Hereinafter, the present invention will be further explained by non-limiting specific embodiments and with reference to the accompanying drawings, which show the following content: Figure 1a) is a top view of an exemplary carrier according to the present invention, the carrier having an exemplary configuration of four dot-shaped bonding pads, Figure 1b) is a top view of an exemplary carrier according to the present invention, the carrier having an exemplary configuration of three strip bonding pads, and Figure 1c) is a top view of an exemplary carrier according to the present invention, the carrier having an exemplary configuration of a central point-shaped bonding pad and three circumferentially arranged arc-shaped bonding pads; Figure 2a) is a series of side views of an exemplary substrate bonded to a carrier at the front side surface and the back side surface during the three exemplary stages of the method according to the present invention, and Figure 2b) is an exemplary sequence of steps of the method according to the present invention; Figure 3a) is a series of top views of an exemplary system for processing a substrate, which illustrates how the substrate and carrier move through the system module during the four exemplary stages of the method according to the present invention, and Figure 3b) is a series of corresponding side views of the substrate bonded to the carrier and the corresponding sequence of the steps of the method according to the present invention; and Figure 4a) is a series of top views of an alternative exemplary system for processing substrates, which illustrates how the substrate and carrier move through the system module during the four exemplary stages of the method according to the present invention, and Figure 4b) is a series of corresponding side views of the substrate bonded to the carrier and the corresponding sequence of the steps of the method according to the present invention. In the drawings, the same reference numerals denote the same components.

1: substrate

2: The first carrier, carrier 1

3: Bonding pad on carrier 1 (temporary bonding)

3": Bonding pad on carrier 1 (temporary bonding)

3''': Bonding pad on carrier 1 (temporary bonding)

4: The second carrier, carrier 2

5: Bonding pad on carrier 2 (temporary bonding)

5": Bonding pad on carrier 2 (temporary bonding)

5''': Bonding pad on carrier 2 (temporary bonding)

6: Front side coating/top side coating

7: Back side coating/bottom side coating

Claims (20)

A method for processing a substrate (1), the substrate (1) has a front side surface and a back side surface, the method includes the following steps: Bonding the backside surface of the substrate (1) to the first carrier (2) at more than one first bonding area; Applying more than one first vacuum treatment process to the front surface of the substrate (1); and Detach the first carrier (2) from the back surface of the substrate (1), The one or more first joining regions only include a part of the back surface, and the part is less than 50% of the back surface. For example, the method of request item 1, further includes the following steps: After the step of applying the one or more first vacuum treatment processes, and before the step of detaching the first carrier (2) or substantially simultaneously with the step of detaching the first carrier (2), at more than one The front side surface of the substrate (1) is bonded to the second carrier (4) at the second bonding area of ??; After the step of detaching the first carrier (2), applying more than one second vacuum treatment process to the backside surface of the substrate (1); and Detach the second carrier (4) from the front surface of the substrate (1), The one or more second joining regions only include a part of the front side surface, and the part is less than 50% of the front side surface. For example, the method of claim 1 or 2, further comprising the following steps: after the step of applying the one or more first vacuum treatment processes, and before the step of applying the one or more second vacuum treatment processes, the substrate (1 ) Flip from a front side processing position to a back side processing position. Such as the method of any one of claims 1 to 3, wherein at least one of the following conditions is met: The total area of the one or more first bonding regions is less than 10% of the total area of the backside surface of the substrate (1), especially less than 5%, more especially less than 2%; The total area of the one or more second bonding regions is less than 10% of the total area of the front side surface of the substrate (1), especially less than 5%, more especially less than 2%; The one or more first and/or second joining areas are dotted or linear; Use more than three first joining areas; Use more than three second joining areas; One or more of the first bonding regions are located on the periphery of the backside surface of the substrate (1), and in particular, at least one of the first bonding regions is located on the back of the substrate (1) A central area on the side surface; One or more of the second bonding areas are located on the periphery of the front surface of the substrate (1), and in particular, at least one of the second bonding areas is located on the front surface of the substrate (1) A central area of The one or more second bonding areas are positioned opposite to the one or more first bonding areas, and in particular, the one or more second bonding areas are aligned with the one or more first bonding areas; The one or more first and/or second bonding areas cannot be used due to bonding and/or disengagement to provide products produced by applying the one or more first and/or second vacuum treatment processes. The method according to any one of claims 1 to 4, wherein at least one of Van der Waals force, electrostatic force and application of a polymer bonding material is used to achieve the interaction with the first and/or second carrier (2, 4) The bonding, especially in the form of bonding pads (3, 3', 3", 3"') and/or strips (3, 3', 3"). The method of claim 5, wherein the polymer bonding material comprises at least one of the following: organic materials, silicone resins, polyamides, materials containing carboxyl end groups, especially multi-component materials of two-component materials, The component material contains photosensitive substances, especially primers. Such as the method of claim 5, wherein the bonding with the first and/or second carrier (2, 4) is achieved by a one-directional bonding structure having a direction-dependent bonding characteristic, especially in the one or more first Or when applied at the second bonding area, compared to the direction parallel to the front side surface or back side surface of the substrate (1), it is provided in the direction perpendicular to the front side surface or back side surface of the substrate (1) Greater joining force. The method according to any one of claims 1 to 7, wherein the detachment of the first and/or second carrier (2, 4) is achieved by at least one of the following: applying a mechanical separation force or a chemical Solvent to the first and/or second bonding area and exposing the first and/or second bonding area to light and/or heat, the light is particularly laser light, more particularly UV light of an excimer laser . Such as the method of claim 8, wherein in order to detach the first carrier (2), the laser light is applied to the backside surface of the substrate (1) through the first carrier (2), and/or in order to make The second carrier (4) is detached, in particular, the laser light is applied toward the front surface of the substrate (1) via the second carrier (4). The method according to any one of claims 1 to 9, wherein the front surface of the substrate (1) is coated with an optical filter layer, especially a near-infrared filter layer, especially wherein the optical filter layer is The result of applying the one or more first vacuum treatment processes. The method according to any one of claims 1 to 10, wherein at least one of the one or more first and/or second vacuum treatment processes includes at least one of the following: etching, plasma cleaning, and vacuum coating Covering, especially physical vapor deposition, chemical vapor deposition, plasma enhanced chemical vapor deposition and atomic layer deposition, more especially the deposition of an optical filter on the front surface and/or back surface of the substrate (1) At least one of layer, depositing a metallization layer, and depositing a dielectric layer. Such as the method of any one of claims 1 to 11, wherein at least one of the following conditions is met: The substrate (1) has a thickness of less than 500 μm, especially less than 250 μm; The first and/or second carrier (2, 4) has a thickness greater than 500 μm, especially greater than 1 mm; The substrate (1) has a lateral extension of at least 100 mm, especially at least 200 mm. The method according to any one of claims 1 to 12, wherein the first and/or second carrier (2, 4) is suitable for acting as a stabilizing body or supporting structure, especially rigid. The method according to any one of claims 1 to 13, wherein the first and/or second carrier (2, 4) has a flat or curved surface. The method according to any one of claims 1 to 14, wherein the coefficient of thermal expansion of the substrate (1) is substantially the same as that of the first and/or second carrier (2, 4), and in particular, The substrate (1) is made of the same material as the first and/or second carrier (2, 4). The method according to any one of claims 1 to 15, wherein the substrate (1) is a glass or semiconductor wafer. The method according to any one of claims 1 to 16, wherein the first and/or second carrier (2, 4) is made of glass, ceramic material, metal or metalized material. Such as the method of any one of claims 1 to 17, wherein the steps of claim 1 and the steps of claim 2 are continuously repeated one or more times. The method according to any one of claims 1 to 18, wherein the bonding is achieved by the following: heat-actuated adhesive, pressure-actuated adhesive, solvent-actuated adhesive, UV-actuated adhesive, plasma-actuated Adhesives, high-voltage discharge activated adhesives, or any combination thereof. A method for manufacturing a vacuum-coated substrate (1) to provide optical, optoelectronic, and semiconductor devices, displays, microdisplays, and device carrier systems for advanced packaging technologies such as fan-out substrates, the method includes as requested The method for processing a substrate (1) according to any one of items 1 to 19.

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