TW201820440A - Breaking method and breaking device for brittle material substrate can retain the brittle material substrate on the flexible support board so that it can be closely attached to the flexible support board by pressing the roller - Google Patents

Abstract

A brittle material substrate is held on a cutting ring and carried on a stage to prevent the substrate from being bent. A sapphire substrate 30 is held on adhesive tape 32 pasted to cutting ring 31. An elastic support board 40 is disposed on a glass table 12 of a breaking device. A cutting ring 31 is fixed thereon. By pressing a roller 22 over the sapphire substrate 30 and enabling it to relatively move, the sapphire substrate 30 is closely in contact with the elastic support board 40. Secondly, a monitor camera confirms the scribe line, and a breaking rod is descended from right above the scribe line to separate the brittle material substrate.

Description

   Method and device for cutting brittle material substrate   

The invention relates to a cutting method and a cutting device for cutting a thinner brittle material substrate.

When breaking a brittle material substrate, for example, as shown in Patent Document 1, a scribe line is formed on the brittle material substrate in advance, and the substrate is held on a supporting table through a cutting ring, and the breaking rod is drawn from the upper side by a cutting ring. Press directly above and break.

However, when the brittle material substrate is thin, the peripheral portion of the substrate is liable to warp. Once the substrate of the brittle material is warped, the focus of the monitoring camera is difficult to focus when the scribe line formed on the substrate is recognized from below, so that there is a disadvantage that it is difficult to press the breaking lever right above the scribe line to break it .

Patent Document 2 proposes a processing device that, when a substrate such as a semiconductor wafer is cut using laser light, in order to correct the bending even if the end portion is bent upward, air is flowed into the recess from the upper portion of the semiconductor wafer. The wafer and press the wafer to correct it.

    [Prior technical literature]         [Patent Literature]    

[Patent Document 1] Japanese Patent Laid-Open No. 2015-188968

[Patent Document 2] Japanese Patent Laid-Open No. 2010-29930

When the device of Patent Document 2 is used to break a brittle material substrate, since the air flows from the upper portion of the substrate into the space of the recessed portion and presses the substrate from the upper portion, the recessed portion must be made airtight and air must flow in. The pump has a problem that the structure becomes complicated.

The present invention has been completed focusing on such a problem, and an object thereof is to allow a thin substrate that is easy to bend to be closely adhered to a stage and be accurately cut off.

In order to solve this problem, a method for breaking a brittle material substrate according to the present invention includes: adhering and holding a brittle material substrate formed with a scribe line on an adhesive tape held by a frame body; and holding a transparent elastic support plate as a whole Hold on a transparent table; hold the fragile material substrate together with the frame body on the elastic support plate; roll the roller from the upper part of the fragile material substrate held on the frame body to make the fragile material The substrate is in close contact with the elastic support plate; a scribe line of the brittle material substrate closely attached to the elastic support plate is detected by a monitoring camera; and the brittle material is detected by following the scribe line detected by the monitoring camera. The upper part of the substrate lowers the breaking rod and cuts the brittle material substrate along the scribe line.

In order to solve this problem, a breaking device of the present invention is used for breaking a fragile material substrate. The breaking device includes: a frame-shaped body that holds the frangible material substrate formed with a scribe line on an adhesive tape; a transparent table; The supporting plate holds the frame-shaped body on the table; the lifting mechanism vertically moves the breaking rod up and down with respect to the surface of the fragile material substrate held on the elastic supporting plate; the freely rotating roller is held on the table. The upper part has a rotation axis parallel to the surface of the table; a relative moving means moves the table relative to the breaking rod and the roller; and a monitoring camera detects the formation of the brittle material substrate from below the table Of the line.

With the present invention having the above-mentioned features, the brittle material substrate can be held on the elastic support plate, and even a thin substrate that is easily bent can be pressed against the elastic support plate by pressing with a roller. Therefore, by confirming the substrate that is in close contact with the elastic support plate with the monitoring camera, it is possible to accurately locate the breaking rod. By breaking the fracturing bar along the scribe line, the effect can be obtained that the brittle material substrate can be accurately cut.

10‧‧‧ Breaking device

11‧‧‧ base

12‧‧‧ glass table

13‧‧‧Y-axis moving mechanism

14‧‧‧Frame-shaped fixing member

15‧‧‧Servo motor

17‧‧‧Horizontal fixed member

18‧‧‧ up moving components

21‧‧‧ lower moving member

22‧‧‧ roller

23‧‧‧ surveillance camera

24‧‧‧ Split

30‧‧‧ sapphire substrate

31‧‧‧ cutting ring

32‧‧‧ Adhesive tape

33‧‧‧ protective film

40‧‧‧ Elastic support plate

41‧‧‧ film

FIG. 1 is a schematic perspective view of a breaking device according to an embodiment of the present invention.

Fig. 2 is a schematic side view of a breaking device according to an embodiment of the present invention.

FIG. 3 is a perspective view showing details of a glass table and a brittle material substrate held on the glass table.

FIG. 4 is a side view showing a state in which a brittle material substrate is held on an elastic support plate on a glass table using a cutting ring, and a state in which the substrate is brought into close contact with each other.

Next, the outline of the cutting device 10 for cutting a brittle material substrate used in this embodiment will be described. FIG. 1 is a schematic perspective view of a breaking device according to an embodiment of the present invention, and FIG. 2 is a schematic side view thereof. The breaking device 10 has a transparent glass table 12 that can be moved on the base 11 in the positive or negative direction of the y-axis. Below the glass table 12 is provided a Y-axis moving mechanism 13 that moves the glass table 12 along the y-axis direction of the base 11 and further rotates along the surface of the base 11. A frame-shaped fixing member 14 is provided on the upper portion of the glass table 12, and a servo motor 15 is held on the upper portion. A ball screw 16 is directly connected to a rotation shaft of the servo motor 15, and a lower end of the ball screw 16 is rotatably supported by a horizontal fixing member 17. The upper moving member 18 includes a nut 19 that is screwed with the ball screw 16 at a central portion, and includes support shafts 20a and 20b from both ends thereof downward. The support shafts 20 a and 20 b pass through one pair of through holes of the horizontal fixing member 17 and are connected to the lower moving member 21. Below the lower moving member 21, a breaking rod 24 to be described later is mounted on the surface of the glass table 12 in a freely lifting manner. In this way, when the ball screw 16 is rotated by the servo motor 15, the upper moving member 18 and the lower moving member 21 are moved up and down integrally, and the breaking lever is also moved up and down at the same time. The drum 22 is rotatably provided below the inside of the frame-shaped fixing member 14. The rotation axis of the drum 22 is parallel to the surface of the glass table 12. In addition, it is preferable that the rotating shaft body is moved up and down in parallel within a certain range and a downward spring pressure is applied, so that the rotating shaft body is held by a spring and moves up and down freely. Here, the Y-axis moving mechanism 13 constitutes a relative movement means for moving the glass table 12 relative to the breaking lever and the roller 22, and the frame-shaped fixing member 14, the servo motor 15, the horizontal fixing member 17, and the upper and lower moving members 18, 21 are configured. Lifting mechanism for lifting the broken rod.

FIG. 2 is a side view showing a part of the breaking device 10. As shown in this figure, a glass table 12 is provided on the upper portion of the base 11. Also, inside the base 11, a monitoring camera 23 is provided for identifying a scribe line of a brittle material substrate placed on the glass table 12. The breaking rod 24 mounted on the lower moving member 21 is an elongated flat metal member having a V-shaped cross-section at the front end, and is used to press a brittle material substrate to break it.

FIG. 3 is a perspective view showing details of the glass table 12 and a brittle material substrate held on the glass table 12. In this embodiment, the sapphire substrate 30 is used as a brittle material substrate to be divided. In order to hold the substrate, a dicing ring 31 that is a ring-shaped frame used when separating a semiconductor wafer into wafers is used. As shown in the figure, an adhesive tape 32 having an adhesive material facing upward is attached to the inside of the cutting ring 31. This adhesive tape 32 is a two-layer structured tape having a base material layer such as vinyl chloride and a layer having an adhesive material thereon. The thickness of the base material layer is, for example, 80 μm, the thickness of the layer of the adhesive material is 20 μm, and the total thickness is 100 μm. Further, a sapphire substrate 30 to be cut is attached to the center of the upper surface of the adhesive tape 32. In the present embodiment, the sapphire substrate 30 has a thickness of 0.05 to 1 mm, and here, for example, is a substrate having a thickness of 0.1 mm. IC circuits such as an epitaxial film having a 1 mm angle are formed in a matrix shape on the sapphire substrate 30. In order to separate the circuits, the sapphire substrate 30 is accurately divided into a plurality of square wafers of 1 × 1 mm square. A grid-like scribe line is formed on the sapphire substrate 30 in advance. A transparent protective film 33 is attached on the sapphire substrate 30 to protect the sapphire substrate 30.

In this embodiment, when the sapphire substrate 30 is fractured, a transparent elastic support plate 40 is used. As shown in the perspective view in FIG. 3, the elastic supporting plate 40 is a circular flat plate having elasticity such as transparent silicone, and is made the same as or smaller than the glass table 12. In addition, in order to protect the surface of the elastic support plate 40 in order to ensure the smoothness of the sapphire substrate 30 during breaking, a transparent film 41 having the same shape as the elastic support plate 40 is integrally provided on the upper portion of the elastic support plate 40. As the material of the film 41, PET can be very suitably used.

Next, a method for cutting the sapphire substrate 30 will be described. First, as shown in FIG. 4 (a), an elastic support plate 40 having a film 41 fixed thereon is placed on the glass table 12 of the breaking device 10 described above. In addition, the sapphire substrate 30 is positioned on the glass table 12 with the cutting ring 31 reversed so that the sapphire substrate 30 is positioned on the elastic support plate 40. At this time, the thin sapphire substrate 30 is bent to be slightly convex upward. Therefore, there is a slight gap between the protective film 33 and the film 41.

Next, as shown in FIG. 4 (b), the roller 22 is brought into contact with the upper surface of the adhesive tape 32, the glass table 12 is moved, and the sapphire substrate 30 is pressed against the elastic support plate 40 by the roller 22. In this way, as shown in FIG. 4 (c), the air between the protective film 33 and the film 41 can be squeezed out, so that all parts of the sapphire substrate 30 can be brought into close contact with the elastic support plate 40 and the glass table 12.

In this way, even if the sapphire substrate 30 is bent, the lower surface of the protective film 33 is attracted. As shown in FIG. 2, when the sapphire substrate 30 is monitored from the monitoring camera 23, the focus can be brought into focus. Therefore, the scribe line can be correctly recognized by the monitoring camera 23 in all parts of the sapphire substrate 30.

Next, the glass table 12 is moved by the Y-axis moving mechanism 13 so that the sapphire substrate 30 is located directly below the breaking rod 24. At this time, since the glass table 12 and the elastic support plate 40 are both transparent, the sapphire substrate 30 can be moved so that the scribe line is positioned correctly below the breaking rod 24.

Next, the servo motor 15 is driven, the upper moving member 18 and the lower moving member 21 are lowered simultaneously, and the breaking lever 24 is kept vertically lowered slowly with respect to the glass table 12. In this way, the sapphire substrate 30 is deformed by being squeezed by the breaking rod 24, sinking to slightly deform the elastic supporting plate 40 into a V shape, and the crack gradually extends upward along the scribe line. Then, the cracking lever 24 is sufficiently lowered, and cracks in the sapphire substrate 30 are extended to complete the breaking. After the breaking is completed, the servo motor 15 is reversed to raise the breaking lever 24.

Next, the glass stage 12 is slightly moved in the y-axis direction by the Y-axis moving mechanism 13 at a predetermined pitch, and then the breaking rod 24 is lowered again, and repeatedly broken in the same manner. Then, after all the breaking is finished in a certain direction, the glass table 12 is rotated by 90 ° by the Y-axis moving mechanism 13. At this time, the sapphire substrate 30 may be pressure-bonded to the elastic support plate 40 again using the roller 22. Next, the breaking rod 24 is lowered to cut off the sapphire substrate 30. Furthermore, the glass stage 12 is moved by the pitch distance of the scribe line in the y-axis direction, and the breaking rod 24 is lowered in the same manner. In this way, all the cutting is completed and the sapphire substrate 30 can be cut into a lattice shape.

In addition, in this embodiment, although the sapphire substrate is described as a brittle material substrate to be cut off, the present invention can be similarly applied to other brittle material substrates.

Furthermore, in this embodiment, although the fragile material substrate is held on the adhesive tape attached to the frame-shaped dicing ring, it is sufficient as long as it is a frame-shaped body, so it is not limited to the dicing ring.

    [Industrial availability]    

Since the present invention can accurately cut a brittle material substrate using a cutting device, it is very suitable for a cutting device that accurately cuts a brittle material substrate.

Claims (2)

    A method for breaking a fragile material substrate, which comprises: adhering and holding a fragile material substrate formed with a scribe line on an adhesive tape held by a frame; and holding a transparent elastic support plate on a transparent stage; The fragile material substrate is held on the elastic support plate together with the frame body; the roller is rolled from the upper part of the fragile material substrate held on the frame body, so that the fragile material substrate is in close contact with the elastic support plate. A detection camera detects a scribe line of the brittle material substrate that is in close contact with the elastic support plate; and lowers the cracked rod from above the brittle material substrate by following the scribe line detected by the monitoring camera. , The aforementioned brittle material substrate is divided along the scribe line.         A breaking device for breaking a substrate of a brittle material, comprising: a frame-shaped body that holds the substrate of the brittle material formed with a scribe line on an adhesive tape; a transparent table; and a transparent elastic support plate held on the table The frame-shaped body; the lifting mechanism vertically moves the breaking rod up and down relative to the surface of the fragile material substrate held on the elastic support plate; the freely rotating roller is held on the upper part of the table and has a A rotation axis parallel to the plane; a relative moving means for relatively moving the stage with respect to the breaking rod and the drum; and a monitoring camera that detects a scribe line formed on the brittle material substrate from below the stage.