[茀化合物] 對式(I)所表示之茀化合物進行說明。首先，於本發明中，「未經取代之」之用語意指僅為成為母核之基。於不存在與「具有取代基」一同之記載，而僅以成為母核之基之名稱記載時，只要並未特別言及，則意指「未經取代之」。 另一方面，「具有取代基」之用語意指成為母核之基之任一氫原子被與母核相同或不同之結構之基取代。因此，「取代基」係與成為母核之基鍵結之其他基。取代基可為1個，亦可為2個以上。2個以上之取代基可相同，亦可不同。 「C1～6」等用語表示成為母核之基之碳原子數為1～6個等。該碳原子數不包括存在於取代基中之碳原子之數量。例如，具有乙氧基作為取代基之丁基被分類為C2烷氧基C4烷基。 「取代基」只要在化學上被容許，且具有本發明之效果，則並無特別限制。以下，例示可成為「取代基」之基。 氟基、氯基、溴基、碘基等鹵代基； 甲基、乙基、正丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基、正戊基、正己基等C1～6烷基； 乙烯基、1-丙烯基、2-丙烯基(烯丙基)、1-丁烯基、2-丁烯基、3-丁烯基、1-甲基-2-丙烯基、2-甲基-2-丙烯基等C2～6烯基； 乙炔基、1-丙炔基、2-丙炔基、1-丁炔基、2-丁炔基、3-丁炔基、1-甲基-2-丙炔基等C2～6炔基； 環丙基、環丁基、環戊基、環己基等C3～8環烷基； 苯基、萘基等C6～10芳基； 苄基、苯乙基等C6～10芳基C1～6烷基； 3～6元雜環基； 3～6元雜環基C1～6烷基； 羥基； 甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、第二丁氧基、異丁氧基、第三丁氧基等C1～6烷氧基； 乙烯基氧基、烯丙氧基、丙烯基氧基、丁烯基氧基等C2～6烯氧基； 苯氧基、萘氧基等C6～10芳氧基； 苄氧基、苯乙氧基等C6～10芳基C1～6烷氧基； 3～6元雜環基氧基； 3～6元雜環基C1～6烷氧基； 氯甲基、氯乙基、三氟甲基、1,2-二氯正丙基、1-氟正丁基、全氟正戊基等C1～6鹵代烷基； 三氟甲氧基、2-氯正丙氧基、2,3-二氯丁氧基等C1～6鹵代烷氧基； 胺基； 甲基胺基、二甲基胺基、二乙基胺基等C1～6烷基胺基； 苯胺基、萘胺基等C6～10芳基胺基； 苄胺基、苯乙基氨基等C6～10芳基C1～6烷基胺基； 巰基； 甲硫基、乙硫基、正丙硫基、異丙硫基、正丁硫基、異丁硫基、第二丁硫基、第三丁硫基等C1～6烷硫基； 甲磺醯基、乙磺醯基、第三丁磺醯基等C1～6烷基磺醯基； 苯硫基、萘硫基等C6～10芳硫基； 3～6元雜環基硫基； 苯基磺醯基等C6～10芳基磺醯基； 3～6元雜環基磺醯基； 氰基； 硝基。 又，關於該等「取代基」，該取代基中之任一氫原子可被不同結構之基取代。作為該情形之「取代基」，可列舉鹵代基、C1～6烷基、C1～6鹵代烷基、C1～6烷氧基、C1～6鹵代烷氧基、氰基、硝基等。 又，上述「3～6元雜環基」係包含選自由氮原子、氧原子及硫原子所組成之群中之1～4個雜原子作為環之構成原子之環狀之基。作為「3～6元雜環基」，可列舉3～6元飽和雜環基、5～6元雜芳基、5～6元部分不飽和雜環基等。 作為3～6元飽和雜環基，可列舉：氮丙啶基、環氧基、吡咯啶基、四氫呋喃基、噻唑烷基、哌啶基、哌基、嗎啉基、二氧雜環戊烷基、二氧雜環己基等。 作為5元雜芳基，可列舉：吡咯基、呋喃基、噻吩基、咪唑基、吡唑基、唑基、異唑基、噻唑基、異噻唑基、三唑基、二唑基、噻二唑基、四唑基等。 作為6元雜芳基，可列舉：吡啶基、吡基、嘧啶基、嗒基、三基等。 作為5元部分不飽和雜環基，可列舉：吡咯啉基、二氫呋喃基、咪唑啉基、吡唑啉基、唑啉基等。 作為6元部分不飽和雜環基，可列舉：異唑啉基、二氫哌喃基等。 [X1
、X2
] 式(I)中，X1
分別獨立地表示鹵代基、未經取代或具有取代基之C1～6烷基、羥基、未經取代或具有取代基之C1～6烷氧基、胺基、硝基、或氰基。m表示0～4之任一整數，n表示0～4之任一整數。 X2
分別獨立地表示鹵代基、未經取代或具有取代基之C1～6烷基、羥基、未經取代或具有取代基之C1～6烷氧基、胺基、硝基、或氰基。p表示0～4之任一整數，q表示0～4之任一整數。 作為X1
及X2
中之「鹵代基」，可列舉：氟基、氯基、溴基、碘基等。 X1
及X2
中之「C1～6烷基」可為直鏈，亦可為支鏈。作為C1～6烷基，可列舉：甲基、乙基、正丙基、正丁基、正戊基、正己基、異丙基、異丁基、第二丁基、第三丁基、異戊基、新戊基、2-甲基丁基、2,2-二甲基丙基、異己基等。 作為「C1～6烷基」上之取代基，較佳為鹵代基、羥基、C1～6烷氧基、C3～8環烷基、C6～10芳基、或氰基。 作為「具有取代基之C1～6烷基」，具體而言，可列舉： 氟甲基、氯甲基、溴甲基、二氟甲基、二氯甲基、二溴甲基、三氟甲基、三氯甲基、三溴甲基、2,2,2-三氟乙基、2,2,2-三氯乙基、五氟乙基、4-氟丁基、4-氯丁基、3,3,3-三氟丙基、2,2,2-三氟-1-三氟甲基乙基、全氟己基、全氯己基、2,4,6-三氯己基等C1～6鹵代烷基； 羥基甲基、2-羥基乙基等羥基C1～6烷基； 甲氧基甲基、乙氧基甲基、甲氧基乙基、乙氧基乙基、甲氧基正丙基、乙氧基甲基、乙氧基乙基、正丙氧基甲基、異丙氧基乙基、第二丁氧基甲基、第三丁氧基乙基等C1～6烷氧基C1～6烷基； 環丙基甲基、2-環丙基乙基、環戊基甲基、2-環己基乙基、2-環辛基乙基等C3～8環烷基C1～6烷基； 苄基、苯乙基等C7～11芳烷基； 氰基甲基、氰乙基等氰基C1～6烷基等。 作為X1
及X2
中之「C1～6烷氧基」，可列舉：甲氧基、乙氧基、正丙氧基、正丁氧基、正戊氧基、正己氧基、異丙氧基、異丁氧基、第二丁氧基、第三丁氧基、異己氧基等。 作為「C1～6烷氧基」上之取代基，較佳為鹵代基、C1～6烷氧基、C3～8環烷基、或C6～10芳基。 作為「具有取代基之C1～6烷氧基」，具體而言，可列舉：氯甲氧基、二氯甲氧基、二氟甲氧基、三氯甲氧基、三氟甲氧基、1-氟乙氧基、1,1-二氟乙氧基、2,2,2-三氟乙氧基、五氟乙氧基等C1～6鹵代烷氧基等。 作為式(I)所表示之茀化合物，具體而言，可列舉：9,9-雙(4-羥基苯基)茀＜9,9-Bis(4-hydroxyphenyl)fluorene＞、9,9-雙(4-羥基-3-甲基苯基)茀＜9,9-Bis(4-hydroxy-3-methylphenyl)fluorene＞、2,7-二溴-9,9-雙(4-羥基苯基)茀＜2,7-Dibromo-9,9-bis(4-hydroxyphenyl)fluorene＞、9,9-雙(3-胺基-4-羥基苯基)茀＜9,9-Bis(3-amino-4-hydroxyphenyl)fluorene＞、9,9-雙(4-羥基-3,5-二甲基苯基)茀＜9,9-Bis(4-hydroxy-3,5-dimethylphenyl)fluorene＞、9,9-雙(4-羥基-2,6-二溴苯基)茀＜9,9-Bis(4-hydroxy-2,6-dibromolphenyl)fluorene＞等。 [咪唑化合物] 其次，對式(II)所表示之咪唑化合物進行說明。 [R1
] 式(II)中，R1
表示氫原子、未經取代或具有取代基之C1～6烷基、或者未經取代或具有取代基之C6～10芳基。 作為R1
中之「C1～6烷基」，可列舉與上述X1
中例示之其等相同者。作為「C1～6烷基」上之取代基，較佳為鹵代基、羥基、C1～6烷氧基、C3～8環烷基、C6～10芳基、或氰基。 R1
中之「C6～10芳基」可為單環及多環之任一者。多環芳基只要至少一個環為芳香環，則剩餘之環可為飽和脂環、不飽和脂環或芳香環之任一者。 作為R1
中之「C6～10芳基」，可列舉：苯基、萘基、薁基、茚基、二氫茚基、四氫萘基等。 作為「C6～10芳基」上之取代基，可列舉：鹵代基、C1～6烷基、羥基、C1～6烷氧基、C1～6鹵代烷氧基、氰基、硝基等。 [R2
～R4
] 式(II)中，R2
～R4
分別獨立地表示氫原子、鹵代基、未經取代或具有取代基之C1～6烷基、未經取代或具有取代基之C6～10芳基、硝基、或氰基。 作為R2
～R4
中之「鹵代基」、「C1～6烷基」、及「C6～10芳基」，可列舉與上述X1
中例示之其等相同者。 作為「C1～6烷基」上之取代基，較佳為鹵代基、羥基、C1～6烷氧基、C3～8環烷基、C6～10芳基、或氰基。作為「C6～10芳基」上之取代基，可列舉：鹵代基、C1～6烷基、羥基、C1～6烷氧基、C1～6鹵代烷氧基、氰基、硝基等。 作為式(II)所表示之咪唑化合物，具體而言，可列舉：咪唑、2-乙基-4-甲基咪唑、1-甲基咪唑、2-甲基咪唑、4-甲基咪唑、1-苄基-2-甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-苯基咪唑、1,2-二甲基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、1-氰乙基-2-苯基咪唑、2-苯基-4,5-二羥基甲基咪唑等。 [晶籠化合物] 作為本發明之晶籠化合物，只要為含有式(I)所表示之茀化合物、及式(II)所表示之咪唑化合物之晶籠化合物，則並無特別限制。本發明之晶籠化合物亦可含有溶劑等第3成分，該第3成分較佳為40莫耳%以下，進而較佳為20莫耳%以下，尤佳為10莫耳%以下。 本發明之晶籠化合物可用作聚酯樹脂、環氧樹脂、環氧-聚酯樹脂、胺基甲酸酯樹脂等之樹脂硬化劑，可尤佳地用作環氧樹脂之硬化劑。又，本發明之晶籠化合物可為溶解於溶劑之液狀者，較佳為(於溶劑中析出)粉體狀者。藉由為粉體狀，例如可使用於粉體塗料。 本發明之晶籠化合物可藉由將式(I)所表示之茀化合物及式(II)所表示之咪唑化合物添加至溶劑中之後，視需要一面進行攪拌，一面進行加熱處理或加熱回流處理，而使其再結晶並析出而獲得。又，若考慮於溶劑中之易溶解性，則較佳為將式(I)所表示之茀化合物及式(II)所表示之咪唑化合物分別溶解於溶劑之後，將溶解液彼此混合。 作為溶劑，可使用水、甲醇、乙醇、異丙醇、乙酸乙酯、乙酸甲酯、二乙醚、二甲醚、四氫呋喃、1,4-二烷、丙酮、甲基乙基酮、乙腈、苯、甲苯、己烷、氯仿、二氯甲烷、四氯化碳等。作為本發明之晶籠化合物之製造時之式(I)所表示之茀化合物及式(II)所表示之咪唑化合物之添加比率，相對於式(I)所表示之茀化合物(主體)1莫耳，式(II)所表示之咪唑化合物(客體)較佳為0.1～5.0莫耳，更佳為0.5～3.0莫耳。 [環氧硬化樹脂形成用組合物] 又，作為本發明之環氧硬化樹脂形成用組合物，只要為含有環氧樹脂(成分(A))、及上述本發明之晶籠化合物(成分(B))者，則並無特別限制，關於成分(B)，如上所述。 [環氧樹脂] 作為成分(A)之環氧樹脂，可使用先前公知之各種聚環氧化合物，例如可列舉：雙(4-羥基苯基)丙烷二縮水甘油醚、雙(4-羥基-3,5-二溴苯基)丙烷二縮水甘油醚、雙(4-羥基苯基)乙烷二縮水甘油醚、雙(4-羥基苯基)甲烷二縮水甘油醚、間苯二酚二縮水甘油醚、間苯三酚三縮水甘油醚、三羥基聯苯三縮水甘油醚、四縮水甘油基二苯甲酮、雙間苯二酚四縮水甘油醚、四甲基雙酚A二縮水甘油醚、雙酚C二縮水甘油醚、雙酚六氟丙烷二縮水甘油醚、1,3-雙[1-(2,3-環氧基丙氧基)-1-三氟甲基-2,2,2-三氟乙基]苯、1,4-雙[1-(2,3-環氧基丙氧基)-1-三氟甲基-2,2,2-三氟甲基]苯、4,4'-雙(2,3-環氧基丙氧基)八氟聯苯、酚系酚醛清漆型雙環氧化合物等芳香族系縮水甘油醚化合物；脂環族二環氧基縮醛、脂環族二環氧基己二酸酯、脂環族二環氧基羧酸酯、二氧化環己烯乙烯等脂環式聚環氧化合物；鄰苯二甲酸二縮水甘油酯、四氫鄰苯二甲酸二縮水甘油酯、六氫鄰苯二甲酸二縮水甘油酯、鄰苯二甲酸二甲基縮水甘油酯、六氫鄰苯二甲酸二甲基縮水甘油酯、對羥基苯甲酸二縮水甘油酯、環戊烷-1,3-二羧酸二縮水甘油酯、二聚酸縮水甘油酯等縮水甘油酯化合物；二縮水甘油基苯胺、二縮水甘油基甲苯胺、三縮水甘油基胺基苯酚、四縮水甘油基二胺基二苯甲烷、二縮水甘油基三溴苯胺等縮水甘油胺化合物；二縮水甘油基乙內醯脲、縮水甘油基縮水甘油氧基烷基乙內醯脲、異氰尿酸三縮水甘油酯等雜環式環氧化合物等。 本發明之環氧硬化樹脂形成用組合物中之(A)成分及(B)成分中之式(II)所表示之咪唑化合物之比率相對於作為(A)成分之環氧樹脂之環氧環1莫耳，較佳為含有(B)成分中之式(II)所表示之咪唑化合物0.01～1.0莫耳，更佳為含有0.1～1.0莫耳，進而較佳為含有0.3～1.0莫耳。 又，本發明之環氧硬化樹脂形成用組合物可藉由將(A)成分及(B)成分混合而製造，但為了形成充分之混合狀態，通常加熱至室溫～100℃左右而進行混合。於環氧硬化樹脂之製造中，此時之溫度下之單液穩定性變得重要。 於本發明之組合物中，除上述成分以外，為了賦予所需之特性而亦可追加以下之成分。 (1)環氧樹脂用硬化觸媒 於本發明之組合物中，除上述硬化觸媒以外，可併用公知之硬化觸媒。 例如可列舉：1,5-二氮雜雙環[4.3.0]-5-壬烯、1,8-二氮雜雙環[5.4.0]-7-十一烯、5,6-二丁基胺基-1,8-二氮雜雙環[5.4.0]-7-十一烯等環狀脒化合物；鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、順丁烯二酸酐、偏苯三甲酸酐酸等酸酐；1,4-苯醌、2,5-甲基苯醌、1,4-萘醌、2,3-二甲基苯醌、2,6-二甲基苯醌、2,3-二甲氧基-5-甲基-1,4苯醌、2,3-二甲氧基-1,4-苯醌、苯基-1,4-苯醌等醌化合物；三伸乙基二胺、二甲基苄胺、三乙醇胺、二甲基胺基乙醇、三(二甲基胺基甲基)苯酚等三級胺化合物；鄰苯二胺、間苯二胺、對苯二胺、二胺基二苯甲烷、二胺基二苯基碸、間苯二甲胺等芳香族胺化合物；咪唑、2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑等咪唑化合物；三甲基膦、三乙基膦、三苯基膦、二苯基(對甲苯基)膦等有機膦化合物等。 (2)硬化劑 進而，可使用用以使環氧樹脂硬化之公知之硬化劑。例如可列舉：間苯二酚、鄰苯二酚、雙酚A、雙酚F等於1分子中具有2個酚性羥基之化合物；酚系酚醛清漆樹脂、甲酚酚醛清漆樹脂、甲酚芳烷基樹脂、苯酚芳烷基樹脂、聯苯芳烷基樹脂、二環戊二烯型酚樹脂、萘酚芳烷基樹脂等多元酚樹脂等。 (3)填料 又，為了控制黏度或硬化物之物性，亦可調配填料。作為填料，可使用絕緣性無機填料或晶鬚、樹脂填料。作為絕緣性無機填料，例如可列舉：玻璃、二氧化矽、氧化鋁、氧化鈦、碳黑、雲母、氮化硼等。作為晶鬚，可列舉：硼酸鋁、鈦酸鋁、氧化鋅、矽酸鈣、硫酸鎂、氮化硼等。作為樹脂填料，可使用聚胺基甲酸酯樹脂、聚醯亞胺樹脂等。 此外，金、銀、銅、鎳、焊料等金屬粒子、及碳等導電填料亦可於構成電子零件之接合用接著劑之情形時使用。 (4)其他添加劑 又，在不阻礙本發明之所需之目標特性之範圍內，可調配脫模劑、調平劑、矽烷偶合劑、阻燃劑、抗氧化劑、著色劑、矽酮系可撓劑、離子捕捉劑等公知之添加劑。 [環氧硬化樹脂] 作為本發明之環氧硬化樹脂之製造方法，只要為對上述環氧硬化樹脂形成用組合物進行加熱處理而使其硬化之方法，則並無特別限制，通常，作為加熱處理之加熱溫度，為60～250℃，較佳為100～200℃，較佳為於該溫度下進行短時間之硬化。 [使用用途] 本發明之晶籠體為潛在性優異之環氧樹脂硬化觸媒。含有其之環氧硬化樹脂形成用組合物於在室溫附近下保管之情形時長期穩定，且於進行硬化時，可於相對較低之溫度下迅速地使其硬化。 作為本發明之環氧硬化樹脂形成用組合物之使用用途，並無特別限制，例如可列舉：底部填充劑、熱硬化性預浸料、澆鑄材料、構造用接著劑、粉體塗料等。尤其可列舉與電材相關之印刷基板用預浸料、半導體、電子零件用密封材料、電子零件用接著劑、導電性接著劑、抗蝕油墨、絕緣材料等。 [實施例] 以下，藉由實施例，對本發明更具體地進行說明，但本發明之技術範圍並不限定於該等例示。 [實施例1] (晶籠化合物之製備) 於燒瓶中加入4.40 g之9,9-雙(4-羥基苯基)茀、2.76 g之2-乙基-4-甲基咪唑(以下，記為2E4MZ)、及43.0 g之己烷-乙酸乙酯混合溶劑，一面進行攪拌，一面進行3小時之加熱回流。冷卻至室溫之後，進行過濾、減壓乾燥，獲得6.46 g之生成物。對於所獲得之生成物，藉由XRD(X Ray Diffraction，X射線繞射測定)、TG-DSC(Thermogravimetry-Differential Scanning Calorimetry，熱重量-示差掃描熱量測定)及1
H-NMR(Nuclear Magnetic Resonance，核磁共振)測定，確認其為9,9-雙(4-羥基苯基)茀與2E4MZ之莫耳比為1：2之晶籠化合物A。將該等測定結果示於圖1A～圖1C中。 各光譜之測定條件如下所述(於其他實施例中亦同樣)。 [XRD測定] 裝置：Ultima IV(Rigaku公司製造) X射線源：Cu 40 kV/40 mA 測定方法：集中法 濾波器：Kβ濾波器 掃描速度：5°/min. [TG-DSC測定] 裝置：TGA-DSC1(Mettler-Toledo公司製造) Al PAN密封件 測定溫度範圍：室溫～500℃ 升溫速度：20℃/min 樣本量：約3 mg [1
H-NMR測定] 裝置：JNM-AL400(日本電子公司製造) 氘代溶劑：CD3
OD 累計次數：16次 (XRD測定) 作為原料之9,9-雙(4-羥基苯基)茀及2E4MZ之繞射圖案消失，而觀察到新穎之繞射圖案，因此確認出晶籠化(圖1A)。 (TG-DSC測定) 關於伴隨熔解之吸熱峰之起始溫度，9,9-雙(4-羥基苯基)茀為221℃，2E4MZ為48℃，相對於此，晶籠化合物為120℃。又，關於重量減少時之起始溫度，9,9-雙(4-羥基苯基)茀為326℃，2E4MZ為162℃，相對於此，晶籠化合物之源自2E4MZ之重量減少為165℃，移動至高溫側，從而可知因晶籠化而使2E4MZ之熱穩定性提高。(圖1B) (1
H-NMR測定) 根據歸屬於9,9-雙(4-羥基苯基)茀及2E4MZ之波峰積分值，可知9,9-雙(4-羥基苯基)茀及2E4MZ以1對2之形式被晶籠化(圖1C)。 [實施例2] (環氧硬化樹脂形成用組合物之製備) 相對於環氧樹脂(商品名：Epotohto(註冊商標)YD-128，東邦化成(股)製造)5 g，以2E4MZ換算計為0.2 g(相當於4 phr)之方式添加晶籠化合物A之後，於25℃下進行10分鐘之混練，藉此獲得環氧硬化樹脂形成用組合物A。 (環氧硬化樹脂形成用組合物之DSC測定) 使用DSC測定裝置(DSC1，Mettler-Toledo公司製造)，於鋁容器內以成為約8～10 mg之方式量取環氧硬化樹脂形成用組合物A，於氮氣沖洗下(氮氣之流速：50 mL/min)，自30℃升溫至250℃(升溫速度：10 k/min)，並測定基於環氧硬化樹脂形成用組合物A之硬化反應之發熱。將於橫軸取時間及溫度之測定結果示於圖1D中。 與僅包含2E4MZ之環氧硬化樹脂形成用組合物相比，包含晶籠化合物A之環氧硬化樹脂形成用組合物A其伴隨環氧硬化之發熱峰之上升溫度較高，從而確認出基於晶籠化之熱穩定性之提高(圖1D)。 [實施例3] (晶籠化合物之製備) 對於實施例1，將2E4MZ變更為1-甲基咪唑(以下，記為1MZ)2.06 g，並將溶劑自己烷-乙酸乙酯混合溶劑變更為己烷，除此以外同樣地進行製備，而獲得生成物5.86 g。根據所獲得之生成物之XRD、TG-DSC及1
H-NMR測定，確認其為9,9-雙(4-羥基苯基)茀與1MZ以1：2之莫耳比被晶籠化之晶籠化合物B。將該測定結果示於圖2A-圖2C中。 (XRD測定) 作為原料之9,9-雙(4-羥基苯基)茀之繞射圖案消失，而觀察到新穎之繞射圖案，因此確認出晶籠化(圖2A)。 (TG-DSC測定)。 1MZ為液體，伴隨分解之吸熱峰之起始溫度為117℃，相對於此，晶籠化合物之伴隨結晶熔解之吸熱峰為122℃。又，關於重量減少時之起始溫度，1MZ係自室溫附近觀察到，相對於此，晶籠化合物之源自1MZ之重量減少為113℃，移動至高溫側，從而可知因晶籠化而使熱穩定性提高(圖2B)。 (1
H-NMR測定) 根據歸屬於9,9-雙(4-羥基苯基)茀及1MZ之波峰積分值，可知9,9-雙(4-羥基苯基)茀及1MZ以1對2之形式被晶籠化(圖2C)。 [實施例4] (環氧硬化樹脂形成用組合物之製備) 對於實施例2之環氧硬化樹脂形成用組合物之製備，將晶籠化合物A變更為晶籠化合物B，除此以外同樣地進行製備，而獲得環氧硬化樹脂形成用組合物B。 (環氧硬化樹脂形成用組合物之DSC測定) 對於實施例2之環氧硬化樹脂形成用組合物之DSC測定，將環氧硬化樹脂形成用組合物A變更為環氧硬化樹脂形成用組合物B，除此以外同樣地進行測定，而測定基於硬化反應之發熱。將於橫軸取時間及溫度之測定結果示於圖2D中。 與僅包含1MZ之環氧硬化樹脂形成用組合物相比，包含晶籠化合物B之環氧硬化樹脂形成用組合物B其伴隨環氧硬化之發熱峰之上升溫度較慢，從而確認出基於晶籠化之熱穩定性之提高(圖2D)。 [實施例5] (晶籠化合物之製備) 對於實施例1，將2E4MZ變更為2-甲基咪唑(以下，記為2MZ)2.06 g，並將溶劑自己烷-乙酸乙酯混合溶劑變更為甲苯，除此以外同樣地進行製備，而獲得生成物5.96 g。對於所獲得之生成物，藉由進行XRD、TG-DSC及1
H-NMR測定，確認其為9,9-雙(4-羥基苯基)茀與2MZ之莫耳比為1：2之晶籠化合物C。將該測定結果示於圖3A-圖3C中。 (XRD測定) 作為原料之9,9-雙(4-羥基苯基)茀及2MZ之繞射圖案消失，而觀察到新穎之繞射圖案，從而確認出晶籠化(圖3A)。 (TG-DSC測定)。 關於伴隨熔解之吸熱峰之起始溫度，2MZ為141℃，相對於此，製成晶籠化合物時，為169℃。又，關於重量減少時之起始溫度，2MZ為162℃，相對於此，晶籠化合物之源自2MZ之重量減少為169℃，移動至高溫側，從而可知因晶籠化而使熱穩定性提高(圖3B)。 (1
H-NMR測定) 根據歸屬於9,9-雙(4-羥基苯基)茀及2MZ之波峰積分值，可知9,9-雙(4-羥基苯基)茀及2MZ以1對2之形式被晶籠化(圖3C)。 [實施例6] (環氧硬化樹脂形成用組合物之製備) 對於實施例2之環氧硬化樹脂形成用組合物之製備，將晶籠化合物A變更為晶籠化合物C，除此以外同樣地進行製備，而獲得環氧硬化樹脂形成用組合物C。 (環氧硬化樹脂形成用組合物之DSC測定) 對於實施例2之環氧硬化樹脂形成用組合物之DSC測定，將環氧硬化樹脂形成用組合物A變更為環氧硬化樹脂形成用組合物C，除此以外同樣地進行測定，而測定基於硬化反應之發熱。將於橫軸取時間及溫度之測定結果示於圖3D中。 與2MZ相比，環氧硬化樹脂形成用組合物C之伴隨環氧硬化之發熱峰之上升溫度較慢，從而確認出基於晶籠化之熱穩定性之提高(圖2D)。 [實施例7] 對於實施例1，將2E4MZ之添加量自2.76 g變更為2.08 g，除此以外同樣地進行製備，而獲得生成物6.27 g。藉由所獲得之生成物之XRD、TG-DSC及1
H-NMR測定，確認其為9,9-雙(4-羥基苯基)茀與2E4MZ以2對3之形式被晶籠化之晶籠化合物D。將該測定結果示於圖4A-圖4C中。 (XRD測定) 與實施例1同樣地，源自原料之繞射圖案消失，而觀測到新穎之繞射圖案，因此確認出晶籠化(圖4A)。 (TG-DSC測定)。 與實施例1同樣地，伴隨結晶之熔解之吸熱峰及重量減少時之起始溫度與單獨為2E4MZ相比，移動至高溫側，從而因晶籠化而使2E4MZ之熱穩定性提高。(圖4B)。 (1
H-NMR測定) 與實施例1同樣地，根據峰積分值，可知9,9-雙(4-羥基苯基)茀與2E4MZ以2對3之形式被晶籠化(圖4C)。 [實施例8] (環氧硬化樹脂形成用組合物之製備) 對於實施例2之環氧硬化樹脂形成用組合物之製備，將晶籠化合物A變更為晶籠化合物D，除此以外同樣地進行製備，而獲得環氧硬化樹脂形成用組合物B。 (環氧硬化樹脂形成用組合物之DSC測定) 對於實施例2之環氧硬化樹脂形成用組合物之DSC測定，將環氧硬化樹脂形成用組合物A變更為環氧硬化樹脂形成用組合物D，除此以外同樣地進行測定，而實施DSC測定。將於橫軸取時間及溫度之測定結果示於圖4D。 與實施例2同樣地，包含晶籠化合物D之環氧硬化樹脂形成用組合物D之伴隨環氧硬化之發熱峰之上升溫度較高，從而因晶籠化而對樹脂之熱穩定性提高(圖4D)。[茀 compound] The oxime compound represented by the formula (I) will be described. First, in the present invention, the term "unsubstituted" means only the base of the mother core. When there is no description together with the "substituent", and only the name of the base of the parent is described, it means "unsubstituted" unless otherwise specified. On the other hand, the term "having a substituent" means that any hydrogen atom which becomes a base of a mother nucleus is substituted with a group having the same or different structure as the mother nucleus. Therefore, the "substituent" is the other group that is bonded to the base of the mother nucleus. The substituent may be one or two or more. Two or more substituents may be the same or different. The terms "C1 to 6" indicate that the number of carbon atoms to be the base of the mother nucleus is 1 to 6. The number of carbon atoms does not include the number of carbon atoms present in the substituent. For example, a butyl group having an ethoxy group as a substituent is classified into a C2 alkoxy C4 alkyl group. The "substituent" is not particularly limited as long as it is chemically acceptable and has the effects of the present invention. Hereinafter, the basis of the "substituent" can be exemplified. Halogen group such as fluoro, chloro, bromo or iodo; methyl, ethyl, n-propyl, isopropyl, n-butyl, t-butyl, isobutyl, tert-butyl, n-pentyl C1～6 alkyl group such as benzyl or n-hexyl; vinyl, 1-propenyl, 2-propenyl (allyl), 1-butenyl, 2-butenyl, 3-butenyl, 1-methyl a C 2-6 alkenyl group such as a 2-propenyl group or a 2-methyl-2-propenyl group; an ethynyl group, a 1-propynyl group, a 2-propynyl group, a 1-butynyl group, a 2-butynyl group, C2-6 alkynyl group such as 3-butynyl group, 1-methyl-2-propynyl group; C3-8 cycloalkyl group such as cyclopropyl group, cyclobutyl group, cyclopentyl group or cyclohexyl group; phenyl group, naphthyl group C6～10 aryl; benzyl, phenethyl, etc. C6～10 aryl C1-6 alkyl; 3-6-membered heterocyclic; 3- to 6-membered heterocyclic C1-6 alkyl; hydroxy; methoxy a C1-6 alkoxy group such as a ethoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a n-butoxy group, a second butoxy group, an isobutoxy group or a third butoxy group; a vinyloxy group; a C2-6 alkenyloxy group such as an allyloxy group, a propenyloxy group or a butenyloxy group; a C6-10 aryloxy group such as a phenoxy group or a naphthyloxy group; a C6-10 which is a benzyloxy group or a phenethyloxy group; Aryl C1 ~ 6 alkoxy a 3- to 6-membered heterocyclic oxy group; a 3 to 6-membered heterocyclic C 1 -6 alkoxy group; a chloromethyl group, a chloroethyl group, a trifluoromethyl group, a 1,2-dichloro-n-propyl group, and 1 a C1 to 6 haloalkyl group such as a fluoro-n-butyl group or a perfluoro-n-pentyl group; a C1 to 6 haloalkoxy group such as a trifluoromethoxy group, a 2-chloro-n-propoxy group or a 2,3-dichlorobutoxy group; a C1-6 alkylamino group such as a methylamino group, a dimethylamino group or a diethylamino group; a C6-10 arylamino group such as an anilino group or a naphthylamino group; a benzylamino group and a phenethylamino group; C6～10 aryl C1-6 alkyl amino group; fluorenyl; methylthio, ethylthio, n-propylthio, isopropylthio, n-butylthio, isobutylthio, second butylthio, a C1-6 alkylthio group such as a tributylthio group; a C1-6 alkylsulfonyl group such as a methylsulfonyl group, an ethylsulfonyl group or a third butasulfonyl group; a C6-10 group such as a phenylthio group or a naphthylthio group; Arylthio; 3-6-membered heterocyclylthio; C6-10 sulfonyl phenylsulfonyl; 3-6-membered heterocyclylsulfonyl; cyano; nitro. Further, with respect to these "substituents", any one of the substituents may be substituted by a group having a different structure. Examples of the "substituent" in this case include a halogen group, a C1-6 alkyl group, a C1-6-6 halogenated alkyl group, a C1-6 alkoxy group, a C1-6-6 halogenated alkoxy group, a cyano group, a nitro group and the like. Further, the "3- to 6-membered heterocyclic group" includes a cyclic group selected from the group consisting of one to four hetero atoms in a group consisting of a nitrogen atom, an oxygen atom and a sulfur atom as a constituent atom of the ring. Examples of the "3- to 6-membered heterocyclic group" include a 3- to 6-membered saturated heterocyclic group, a 5- to 6-membered heteroaryl group, and a 5- to 6-membered partially unsaturated heterocyclic group. Examples of the 3- to 6-membered saturated heterocyclic group include aziridine group, epoxy group, pyrrolidinyl group, tetrahydrofuranyl group, thiazolidinyl group, piperidinyl group, and piperazine. A group, a morpholinyl group, a dioxolyl group, a dioxanyl group, and the like. Examples of the 5-membered heteroaryl group include a pyrrolyl group, a furyl group, a thienyl group, an imidazolyl group, and a pyrazolyl group. Azolyl, different Azyl, thiazolyl, isothiazolyl, triazolyl, A oxazolyl group, a thiadiazolyl group, a tetrazolyl group or the like. As the 6-membered heteroaryl group, a pyridyl group or a pyridyl group is exemplified. Base, pyrimidinyl, oxime Base, three Base. Examples of the 5-membered partially unsaturated heterocyclic group include a pyrrolinyl group, a dihydrofuranyl group, an imidazolinyl group, and a pyrazolinyl group. Oxazolinyl and the like. As a 6-membered partially unsaturated heterocyclic group, a An oxazoline group, a dihydropiperidyl group or the like. [X 1 , X 2 ] In the formula (I), X 1 each independently represents a halogeno group, an unsubstituted or substituted C1-6 alkyl group, a hydroxyl group, an unsubstituted or substituted C1-6 Alkoxy, amine, nitro, or cyano. m represents any integer from 0 to 4, and n represents any integer from 0 to 4. X 2 independently represents a halo group, an unsubstituted or substituted C 1-6 alkyl group, a hydroxy group, an unsubstituted or substituted C 1-6 alkoxy group, an amine group, a nitro group, or a cyano group. . p represents any integer from 0 to 4, and q represents any integer from 0 to 4. Examples of the "halo group" in X 1 and X 2 include a fluorine group, a chlorine group, a bromine group, and an iodine group. X X 2 1 and of the "C1 ~ 6 alkyl group" may be linear, may be branched. Examples of the C1-6 alkyl group include methyl group, ethyl group, n-propyl group, n-butyl group, n-pentyl group, n-hexyl group, isopropyl group, isobutyl group, second butyl group, and third butyl group. Butyl, neopentyl, 2-methylbutyl, 2,2-dimethylpropyl, isohexyl and the like. The substituent on the "C1-6 alkyl group" is preferably a halogen group, a hydroxyl group, a C1-6 alkoxy group, a C3-8 cycloalkyl group, a C6-10 aryl group, or a cyano group. Specific examples of the "C1-6 alkyl group having a substituent" include a fluoromethyl group, a chloromethyl group, a bromomethyl group, a difluoromethyl group, a dichloromethyl group, a dibromomethyl group, and a trifluoromethyl group. Base, trichloromethyl, tribromomethyl, 2,2,2-trifluoroethyl, 2,2,2-trichloroethyl, pentafluoroethyl, 4-fluorobutyl, 4-chlorobutyl , 3,3,3-trifluoropropyl, 2,2,2-trifluoro-1-trifluoromethylethyl, perfluorohexyl, perchlorohexyl, 2,4,6-trichlorohexyl, etc. C1～ 6 haloalkyl; hydroxymethyl, 2-hydroxyethyl and the like hydroxy C1-6 alkyl; methoxymethyl, ethoxymethyl, methoxyethyl, ethoxyethyl, methoxy n-propyl C1-6 alkoxy group such as ethoxymethyl, ethoxyethyl, n-propoxymethyl, isopropoxyethyl, second butoxymethyl or tert-butoxyethyl C1-6 alkyl group; cyclopropylmethyl, 2-cyclopropylethyl, cyclopentylmethyl, 2-cyclohexylethyl, 2-cyclooctylethyl, etc. C3-8 cycloalkyl C1-6 An alkyl group; a C7 to 11 aralkyl group such as a benzyl group or a phenethyl group; a cyano C1-6 alkyl group such as a cyanomethyl group or a cyanoethyl group; and the like. As in the 1 X X 2 and "C1 ~ 6 alkoxy group" include: methoxy, ethoxy, n-propoxy, n-butoxy, n-pentyloxy, n-hexyloxy, isopropoxy Base, isobutoxy, second butoxy, tert-butoxy, isohexyloxy and the like. The substituent on the "C1-6 alkoxy group" is preferably a halogen group, a C1-6 alkoxy group, a C3-8 cycloalkyl group, or a C6-10 aryl group. Specific examples of the "C1 to 6 alkoxy group having a substituent" include a chloromethoxy group, a dichloromethoxy group, a difluoromethoxy group, a trichloromethoxy group, and a trifluoromethoxy group. A C1 to 6 haloalkoxy group such as a 1-fluoroethoxy group, a 1,1-difluoroethoxy group, a 2,2,2-trifluoroethoxy group or a pentafluoroethoxy group. Specific examples of the hydrazine compound represented by the formula (I) include 9,9-bis(4-hydroxyphenyl)fluorene<9,9-Bis(4-hydroxyphenyl)fluorene>, 9,9-double (4-hydroxy-3-methylphenyl)fluorene <9,9-Bis(4-hydroxy-3-methylphenyl)fluorene>, 2,7-dibromo-9,9-bis(4-hydroxyphenyl)茀<2,7-Dibromo-9,9-bis(4-hydroxyphenyl)fluorene>,9,9-bis(3-amino-4-hydroxyphenyl)fluorene<9,9-Bis(3-amino- 4-hydroxyphenyl)fluorene>, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene <9,9-Bis(4-hydroxy-3,5-dimethylphenyl)fluorene>, 9, 9-bis(4-hydroxy-2,6-dibromophenyl)fluorene <9,9-Bis(4-hydroxy-2,6-dibromolphenyl)fluorene>. [Imidazole compound] Next, the imidazole compound represented by the formula (II) will be described. [R 1 ] In the formula (II), R 1 represents a hydrogen atom, an unsubstituted or substituted C1-6 alkyl group, or an unsubstituted or substituted C6-10 aryl group. Examples of the "C1 to 6 alkyl group" in R 1 include the same as those exemplified in the above X 1 . The substituent on the "C1-6 alkyl group" is preferably a halogen group, a hydroxyl group, a C1-6 alkoxy group, a C3-8 cycloalkyl group, a C6-10 aryl group, or a cyano group. The "C6 to 10 aryl group" in R 1 may be either a single ring or a polycyclic ring. As long as at least one ring is an aromatic ring, the remaining ring may be either a saturated alicyclic ring, an unsaturated alicyclic ring or an aromatic ring. Examples of the "C6 to 10 aryl group" in R 1 include a phenyl group, a naphthyl group, an anthracenyl group, an anthracenyl group, a dihydroindenyl group, and a tetrahydronaphthyl group. Examples of the substituent on the "C6-10 aryl group" include a halogen group, a C1-6 alkyl group, a hydroxyl group, a C1-6 alkoxy group, a C1-6-6 halogenated alkoxy group, a cyano group, and a nitro group. [R 2 to R 4 ] In the formula (II), R 2 to R 4 each independently represent a hydrogen atom, a halogeno group, an unsubstituted or substituted C 1 to 6 alkyl group, an unsubstituted or substituted group. C6-10 aryl, nitro, or cyano. Examples of the "halo group", the "C1 to 6 alkyl group", and the "C6 to 10 aryl group" in R 2 to R 4 are the same as those exemplified in the above X 1 . The substituent on the "C1-6 alkyl group" is preferably a halogen group, a hydroxyl group, a C1-6 alkoxy group, a C3-8 cycloalkyl group, a C6-10 aryl group, or a cyano group. Examples of the substituent on the "C6-10 aryl group" include a halogen group, a C1-6 alkyl group, a hydroxyl group, a C1-6 alkoxy group, a C1-6-6 halogenated alkoxy group, a cyano group, and a nitro group. Specific examples of the imidazole compound represented by the formula (II) include imidazole, 2-ethyl-4-methylimidazole, 1-methylimidazole, 2-methylimidazole, 4-methylimidazole, and 1 -benzyl-2-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2 -phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2 - phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and the like. [Crystal Cage Compound] The crystal cage compound of the present invention is not particularly limited as long as it is a crystal cage compound containing the hydrazine compound represented by the formula (I) and the imidazole compound represented by the formula (II). The cage compound of the present invention may contain a third component such as a solvent, and the third component is preferably 40 mol% or less, more preferably 20 mol% or less, and still more preferably 10 mol% or less. The cage compound of the present invention can be used as a resin hardener for a polyester resin, an epoxy resin, an epoxy-polyester resin, a urethane resin or the like, and can be preferably used as a hardener for an epoxy resin. Further, the cage compound of the present invention may be a liquid which is dissolved in a solvent, and is preferably a powder (precipitated in a solvent). By being in the form of a powder, for example, it can be used for a powder coating. The crystal cage compound of the present invention can be added to a solvent by adding the hydrazine compound represented by the formula (I) and the imidazole compound represented by the formula (II), and then heating or refluxing, if necessary, while stirring. It is obtained by recrystallization and precipitation. Further, in consideration of the solubility in the solvent, it is preferred to dissolve the hydrazine compound represented by the formula (I) and the imidazole compound represented by the formula (II) in a solvent, and then to mix the solutions. As the solvent, water, methanol, ethanol, isopropanol, ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, tetrahydrofuran, 1,4-two can be used. Alkane, acetone, methyl ethyl ketone, acetonitrile, benzene, toluene, hexane, chloroform, dichloromethane, carbon tetrachloride, and the like. The addition ratio of the hydrazine compound represented by the formula (I) and the imidazole compound represented by the formula (II) at the time of production of the cage compound of the present invention is relative to the hydrazine compound (main body) represented by the formula (I). The imidazole compound (guest) represented by the formula (II) is preferably from 0.1 to 5.0 mols, more preferably from 0.5 to 3.0 mols. [Epoxy-hardening resin-forming composition] The epoxy-curable resin-forming composition of the present invention contains an epoxy resin (component (A)) and the above-described cage compound (component (B) of the present invention. There is no particular restriction on the component), and the component (B) is as described above. [Epoxy Resin] As the epoxy resin of the component (A), various conventionally known polyepoxy compounds can be used, and examples thereof include bis(4-hydroxyphenyl)propane diglycidyl ether and bis(4-hydroxy-). 3,5-Dibromophenyl)propane diglycidyl ether, bis(4-hydroxyphenyl)ethane diglycidyl ether, bis(4-hydroxyphenyl)methane diglycidyl ether, resorcinol condensed water Glycerol ether, phloroglucin triglycidyl ether, trihydroxybiphenyl triglycidyl ether, tetraglycidyl benzophenone, bis resorcinol tetraglycidyl ether, tetramethyl bisphenol A diglycidyl ether , bisphenol C diglycidyl ether, bisphenol hexafluoropropane diglycidyl ether, 1,3-bis[1-(2,3-epoxypropoxy)-1-trifluoromethyl-2,2 ,2-trifluoroethyl]benzene, 1,4-bis[1-(2,3-epoxypropoxy)-1-trifluoromethyl-2,2,2-trifluoromethyl]benzene An aromatic glycidyl ether compound such as 4,4'-bis(2,3-epoxypropoxy)octafluorobiphenyl or a phenolic novolac type diepoxide; alicyclic diepoxy condensation An alicyclic aldehyde, an alicyclic diepoxy adipate, an alicyclic diepoxy carboxylic acid ester, a cyclohexene ethylene oxide or the like Polyepoxy compound; diglycidyl phthalate, diglycidyl tetrahydrophthalate, diglycidyl hexahydrophthalate, dimethyl glycidyl phthalate, hexahydroortho a glycidyl ester compound such as dimethyl glycidyl phthalate, diglycidyl p-hydroxybenzoate, cyclopentane-1,3-dicarboxylic acid diglycidyl ester or dimer acid glycidyl ester; diglycidylglycerol Glycidylamine compounds such as aniline, diglycidyltoluidine, triglycidylaminophenol, tetraglycidyldiaminodiphenylmethane, diglycidyltribromoaniline; diglycidyl carbendazim And a heterocyclic epoxy compound such as glycidyl glycidoxyalkyl carbendazim or isocyanuric acid triglycidyl ester. The ratio of the imidazole compound represented by the formula (II) in the (A) component and the component (B) in the epoxy resin-forming composition of the present invention to the epoxy ring of the epoxy resin as the component (A) 1 mole, preferably containing 0.01 to 1.0 mole of the imidazole compound represented by the formula (II) in the component (B), more preferably 0.1 to 1.0 mole, and still more preferably 0.3 to 1.0 mole. Further, the epoxy resin-forming composition of the present invention can be produced by mixing the components (A) and (B). However, in order to form a sufficiently mixed state, it is usually heated to room temperature to about 100 ° C to be mixed. . In the production of an epoxy hardening resin, the stability of the single liquid at the temperature at this time becomes important. In the composition of the present invention, in addition to the above components, the following components may be added in order to impart desired properties. (1) A curing catalyst for an epoxy resin In the composition of the present invention, in addition to the above-mentioned curing catalyst, a known curing catalyst may be used in combination. For example, 1,5-diazabicyclo[4.3.0]-5-pinene, 1,8-diazabicyclo[5.4.0]-7-undecene, 5,6-dibutyl group a cyclic guanidine compound such as amino-1,8-diazabicyclo[5.4.0]-7-undecene; phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, Anhydride such as maleic anhydride or trimellitic anhydride; 1,4-benzoquinone, 2,5-methylphenylhydrazine, 1,4-naphthoquinone, 2,3-dimethylphenylhydrazine, 2,6 - dimethyl benzoquinone, 2,3-dimethoxy-5-methyl-1,4 phenylhydrazine, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4- Anthracene compound such as benzoquinone; tertiary amine compound such as triethylamine, dimethylbenzylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; o-phenylenediamine , an aromatic amine compound such as m-phenylenediamine, p-phenylenediamine, diaminodiphenylmethane, diaminodiphenylanthracene or m-xylylenediamine; imidazole, 2-methylimidazole, 2-ethyl- Imidazole compounds such as 4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; trimethylphosphine, triethyl Phosphine, triphenylphosphine, diphenyl (p-tolyl) phosphine, etc. Phosphine compounds and the like. (2) Hardener Further, a known hardener for hardening an epoxy resin can be used. For example, resorcin, catechol, bisphenol A, and bisphenol F are equivalent to a compound having two phenolic hydroxyl groups in one molecule; a phenolic novolak resin, a cresol novolak resin, and a cresol aralkyl A polyphenol resin such as a base resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, or a naphthol aralkyl resin. (3) Filler In addition, in order to control the viscosity or the physical properties of the hardened material, the filler may also be formulated. As the filler, an insulating inorganic filler or whiskers or a resin filler can be used. Examples of the insulating inorganic filler include glass, cerium oxide, aluminum oxide, titanium oxide, carbon black, mica, and boron nitride. Examples of the whiskers include aluminum borate, aluminum titanate, zinc oxide, calcium citrate, magnesium sulfate, and boron nitride. As the resin filler, a polyurethane resin, a polyimide resin, or the like can be used. Further, metal particles such as gold, silver, copper, nickel, and solder, and conductive filler such as carbon may be used in the case of forming an adhesive for bonding electronic parts. (4) Other Additives Further, in the range which does not hinder the desired target characteristics of the present invention, a mold release agent, a leveling agent, a decane coupling agent, a flame retardant, an antioxidant, a colorant, an anthrone may be blended. Known additives such as a sling agent and an ion scavenger. [Epoxy-Cured Resin] The method for producing the epoxy-curable resin of the present invention is not particularly limited as long as it is a method of heat-treating the epoxy-curable resin-forming composition, and is usually heated. The heating temperature for the treatment is 60 to 250 ° C, preferably 100 to 200 ° C, and it is preferred to carry out curing at this temperature for a short period of time. [Use for Use] The crystal cage of the present invention is an epoxy resin hardening catalyst excellent in potential. The epoxy resin-containing composition containing the same is stable for a long period of time when stored at around room temperature, and can be rapidly cured at a relatively low temperature when it is cured. The use of the epoxy resin-forming composition of the present invention is not particularly limited, and examples thereof include an underfill, a thermosetting prepreg, a casting material, a structural adhesive, and a powder coating. In particular, a prepreg for a printed circuit board, a semiconductor, a sealing material for an electronic component, an adhesive for an electronic component, a conductive adhesive, a resist ink, an insulating material, or the like can be used. EXAMPLES Hereinafter, the present invention will be specifically described by way of examples, but the technical scope of the present invention is not limited to the examples. [Example 1] (Preparation of crystal cage compound) 4.40 g of 9,9-bis(4-hydroxyphenyl)fluorene and 2.76 g of 2-ethyl-4-methylimidazole were added to a flask (hereinafter, 2E4MZ) and 43.0 g of a hexane-ethyl acetate mixed solvent were heated and refluxed for 3 hours while stirring. After cooling to room temperature, it was filtered and dried under reduced pressure to give 6.46 g of product. For the obtained product, XRD (X Ray Diffraction), TG-DSC (Thermogravimetry-Differential Scanning Calorimetry), and 1 H-NMR (Nuclear Magnetic Resonance, It was confirmed by nuclear magnetic resonance to confirm that it is a crystal cage compound A having a molar ratio of 9,9-bis(4-hydroxyphenyl)fluorene to 2E4MZ of 1:2. The results of these measurements are shown in FIGS. 1A to 1C. The measurement conditions of each spectrum are as follows (the same applies to other examples). [XRD measurement] Apparatus: Ultima IV (manufactured by Rigaku Co., Ltd.) X-ray source: Cu 40 kV/40 mA Measurement method: concentrating filter: Kβ filter scanning speed: 5°/min. [TG-DSC measurement] Device: TGA-DSC1 (manufactured by Mettler-Toledo) Al PAN seal measurement temperature range: room temperature to 500 ° C Temperature increase rate: 20 ° C / min Sample size: about 3 mg [ 1 H-NMR measurement] Device: JNM-AL400 (Japan Ethylene company manufacture) Deuterated solvent: CD 3 OD Cumulative number: 16 times (XRD measurement) The diffraction pattern of 9,9-bis(4-hydroxyphenyl)fluorene and 2E4MZ disappeared as a raw material, and a novel winding was observed. The pattern was shot, and thus the crystal cage was confirmed (Fig. 1A). (Measurement by TG-DSC) Regarding the onset temperature of the endothermic peak accompanying melting, 9,9-bis(4-hydroxyphenyl)fluorene was 221 ° C, and 2E4MZ was 48 ° C. On the other hand, the cage compound was 120 °C. Further, regarding the initial temperature at which the weight is reduced, 9,9-bis(4-hydroxyphenyl)anthracene is 326 ° C, and 2E4MZ is 162 ° C. In contrast, the weight loss of the crystal cage compound derived from 2E4MZ is 165 ° C. By moving to the high temperature side, it is understood that the thermal stability of 2E4MZ is improved by the crystal cage. (FIG. 1B) (1 H-NMR measurement), and the peak integration value according fluorenyl attributed to 9,9-bis (4-hydroxyphenyl) 2E4MZ, the known 9,9-bis (4-hydroxyphenyl) fluorene and 2E4MZ It was crystallized in the form of 1 to 2 (Fig. 1C). [Example 2] (Preparation of a composition for forming an epoxy-curable resin) 5 g of an epoxy resin (trade name: Epotohto (registered trademark) YD-128, manufactured by Toho Chemical Co., Ltd.) in terms of 2E4MZ After the crystal cage compound A was added in an amount of 0.2 g (corresponding to 4 phr), the mixture was kneaded at 25 ° C for 10 minutes to obtain a composition A for forming an epoxy resin. (DSC measurement of the epoxy resin-forming composition) The epoxy resin-hardening resin composition was measured by the DSC measuring apparatus (DSC1, the Mettler-Toledo company) so that it may be about 8-10 mg in the aluminum container. A, under nitrogen purge (nitrogen flow rate: 50 mL/min), from 30 ° C to 250 ° C (heating rate: 10 k / min), and determination of the hardening reaction based on the epoxy resin forming composition A heat. The measurement results of the time and temperature on the horizontal axis are shown in Fig. 1D. The epoxy resin-forming composition A containing the crystal cage compound A has a higher rising temperature of the exothermic peak accompanying the epoxy hardening than the composition for forming an epoxy-curable resin containing only 2E4MZ, thereby confirming the crystal cage-based Increased thermal stability (Figure 1D). [Example 3] (Preparation of crystal cage compound) In Example 1, 2E4MZ was changed to 2.06 g of 1-methylimidazole (hereinafter referred to as 1 MZ), and the solvent alkane-ethyl acetate mixed solvent was changed to itself. The alkane was prepared in the same manner as above to obtain 5.86 g of a product. According to the XRD, TG-DSC and 1 H-NMR measurement of the obtained product, it was confirmed that 9,9-bis(4-hydroxyphenyl)fluorene and 1 MZ were crystallized at a molar ratio of 1:2. Crystal cage compound B. The measurement results are shown in Figs. 2A to 2C. (XRD measurement) The diffraction pattern of 9,9-bis(4-hydroxyphenyl)fluorene as a raw material disappeared, and a novel diffraction pattern was observed, so that crystal cage formation was confirmed (Fig. 2A). (Measured by TG-DSC). 1 MZ is a liquid, and the onset temperature of the endothermic peak accompanying decomposition is 117 ° C. On the other hand, the endothermic peak accompanying the crystal melting of the cage compound is 122 ° C. Further, regarding the initial temperature at the time of weight reduction, 1 MZ was observed from the vicinity of room temperature, whereas the weight loss of the crystal cage compound derived from 1 MZ was 113 ° C, and it was moved to the high temperature side, and it was found that the crystal cage was formed. Increased thermal stability (Figure 2B). (1 H-NMR measurement), and the peak integration value according fluorenyl attributed to 9,9-bis (4-hydroxyphenyl) 1MZ, the known 9,9-bis (4-hydroxyphenyl) fluorene, and 2-to-one 1MZ The form is caged (Fig. 2C). [Example 4] (Preparation of a composition for forming an epoxy-curable resin) The preparation of the composition for forming an epoxy-curable resin of Example 2 was carried out by changing the crystal cage compound A to the crystal cage compound B, and the same. The preparation was carried out to obtain a composition B for forming an epoxy resin. (Measurement by DSC of the epoxy resin-forming composition) The DSC measurement of the epoxy resin-forming composition of Example 2 was carried out, and the epoxy resin-forming composition A was changed to the epoxy resin-forming composition. B. Measurement was performed in the same manner as above, and heat generation by the curing reaction was measured. The measurement results of the time and temperature on the horizontal axis are shown in Fig. 2D. Compared with the composition for forming an epoxy-curable resin containing only 1 MZ, the epoxy resin-forming composition B containing the crystal cage compound B has a relatively slow rise temperature of the exothermic peak accompanying epoxy hardening, thereby confirming the crystal cage-based Improved thermal stability (Figure 2D). [Example 5] (Preparation of crystal cage compound) In Example 1, 2E4MZ was changed to 2.06 g of 2-methylimidazole (hereinafter referred to as 2MZ), and the solvent-hexane-ethyl acetate mixed solvent was changed to toluene. The preparation was carried out in the same manner as above, and 5.96 g of a product was obtained. The obtained product was confirmed to be a 1:2 crystal of 9,9-bis(4-hydroxyphenyl)fluorene and 2 MZ molar ratio by XRD, TG-DSC and 1 H-NMR measurement. Cage compound C. The measurement results are shown in Figs. 3A to 3C. (XRD measurement) The diffraction pattern of 9,9-bis(4-hydroxyphenyl)fluorene and 2MZ as a raw material disappeared, and a novel diffraction pattern was observed, thereby confirming the crystal cage (Fig. 3A). (Measured by TG-DSC). Regarding the onset temperature of the endothermic peak accompanying the melting, 2 MZ was 141 ° C, whereas in the case of the cage compound, it was 169 ° C. Further, regarding the initial temperature at the time of weight reduction, 2 MZ is 162 ° C. On the other hand, the weight loss of the crystal cage compound derived from 2 MZ is 169 ° C, and the temperature is shifted to the high temperature side, so that thermal stability due to crystal cage formation is known. Improve (Figure 3B). (1 H-NMR measurement), and the peak integration value according fluorenyl attributed to 9,9-bis (4-hydroxyphenyl) 2MZ, the known 9,9-bis (4-hydroxyphenyl) fluorene, and 2-to-one 2MZ The form is caged (Fig. 3C). [Example 6] (Preparation of a composition for forming an epoxy resin) The preparation of the epoxy resin-forming composition of Example 2 was carried out by changing the crystal cage compound A to the crystal cage compound C, and the same manner. The preparation was carried out to obtain a composition C for forming an epoxy resin. (Measurement by DSC of the epoxy resin-forming composition) The DSC measurement of the epoxy resin-forming composition of Example 2 was carried out, and the epoxy resin-forming composition A was changed to the epoxy resin-forming composition. C, except that the measurement was performed in the same manner, and the heat generation by the hardening reaction was measured. The measurement results of the time and temperature on the horizontal axis are shown in Fig. 3D. The rise temperature of the exothermic peak accompanying epoxy hardening of the epoxy resin-forming composition C was slower than that of 2 MZ, and the improvement in thermal stability by crystal cage formation was confirmed (FIG. 2D). [Example 7] In the same manner as in Example 1, except that the amount of 2E4MZ was changed from 2.76 g to 2.08 g, the preparation was carried out in the same manner to obtain a product of 6.27 g. It was confirmed by XRD, TG-DSC and 1 H-NMR measurement of the obtained product that it was crystallized in the form of 2,3-bis(4-hydroxyphenyl)fluorene and 2E4MZ in the form of 2 to 3. Cage Compound D. The measurement results are shown in Figs. 4A to 4C. (XRD measurement) In the same manner as in Example 1, the diffraction pattern derived from the raw material disappeared, and a novel diffraction pattern was observed, so that the crystal cage was confirmed (Fig. 4A). (Measured by TG-DSC). In the same manner as in the first embodiment, the endothermic peak at the time of melting of the crystal and the initial temperature at the time of weight reduction were shifted to the high temperature side as compared with 2E4MZ alone, and the thermal stability of 2E4MZ was improved by the crystal cage. (Fig. 4B). (1 H-NMR measurement) in the same manner as in Example 1, the peak integration value, known 9,9-bis (4-hydroxyphenyl) fluorene and 2E4MZ 2 is in the form of clathrate of the 3 (FIG. 4C). [Example 8] (Preparation of a composition for forming an epoxy-curable resin) The preparation of the composition for forming an epoxy-curable resin of Example 2 was carried out by changing the crystal cage compound A to the crystal cage compound D, and the same. The preparation was carried out to obtain a composition B for forming an epoxy resin. (Measurement by DSC of the epoxy resin-forming composition) The DSC measurement of the epoxy resin-forming composition of Example 2 was carried out, and the epoxy resin-forming composition A was changed to the epoxy resin-forming composition. D, except that the measurement was performed in the same manner, and DSC measurement was performed. The measurement results of the time and temperature on the horizontal axis are shown in Fig. 4D. In the same manner as in the case of the second embodiment, the epoxy resin cured composition-forming composition D containing the crystal cage compound D has a higher rising temperature of the exothermic peak accompanying the epoxy curing, and the thermal stability of the resin is improved by the crystal cage (Fig. 4D).