TW201614252A - Electronic component transporting device and electronic component inspecting device - Google Patents

Electronic component transporting device and electronic component inspecting device

Info

Publication number
TW201614252A
TW201614252A TW104132628A TW104132628A TW201614252A TW 201614252 A TW201614252 A TW 201614252A TW 104132628 A TW104132628 A TW 104132628A TW 104132628 A TW104132628 A TW 104132628A TW 201614252 A TW201614252 A TW 201614252A
Authority
TW
Taiwan
Prior art keywords
electronic component
inspecting
members
abutting
transporting device
Prior art date
Application number
TW104132628A
Other languages
Chinese (zh)
Other versions
TWI617817B (en
Inventor
Satoshi Nakamura
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201614252A publication Critical patent/TW201614252A/en
Application granted granted Critical
Publication of TWI617817B publication Critical patent/TWI617817B/en

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

This invention provides an electronic component transporting device equipped with an abutting member having a first member and a plurality of second members abutting the electronic components. At least one of the first member and the plurality of second members has a thermal conductivity of 16(W/(m.K)) or above. In addition, the electronic component inspecting device of this invention is equipped with an abutting member having at least a first member, a plurality of second members abutting the electronic components, and an inspecting part for inspecting the electronic components At least one of the first member and the plurality of second members has a thermal conductivity of 16(W/(m.K)) or above.
TW104132628A 2014-10-06 2015-10-02 Electronic component conveying device and electronic component inspection device TWI617817B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014205491A JP2016075549A (en) 2014-10-06 2014-10-06 Electronic component conveyance device and electronic component inspection device

Publications (2)

Publication Number Publication Date
TW201614252A true TW201614252A (en) 2016-04-16
TWI617817B TWI617817B (en) 2018-03-11

Family

ID=55951269

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132628A TWI617817B (en) 2014-10-06 2015-10-02 Electronic component conveying device and electronic component inspection device

Country Status (2)

Country Link
JP (1) JP2016075549A (en)
TW (1) TWI617817B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6736651B2 (en) * 2018-12-27 2020-08-05 浜松ホトニクス株式会社 Cooling unit, objective lens module, semiconductor inspection device, semiconductor inspection method
JP7227193B2 (en) * 2020-07-15 2023-02-21 浜松ホトニクス株式会社 Cooling unit, objective lens module, semiconductor inspection device, semiconductor inspection method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4119104B2 (en) * 2001-07-12 2008-07-16 株式会社アドバンテスト Pusher with heater, electronic component handling apparatus, and electronic component temperature control method
TW200829090A (en) * 2006-12-18 2008-07-01 Kaylu Ind Corp High thermal and electrical conduction carrying-plate

Also Published As

Publication number Publication date
TWI617817B (en) 2018-03-11
JP2016075549A (en) 2016-05-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees