TW201508294A - Bed type detection mechanism for detecting alignment and conductivity of optical element - Google Patents

Bed type detection mechanism for detecting alignment and conductivity of optical element Download PDF

Info

Publication number
TW201508294A
TW201508294A TW102130470A TW102130470A TW201508294A TW 201508294 A TW201508294 A TW 201508294A TW 102130470 A TW102130470 A TW 102130470A TW 102130470 A TW102130470 A TW 102130470A TW 201508294 A TW201508294 A TW 201508294A
Authority
TW
Taiwan
Prior art keywords
displacement
conductive glass
fine adjustment
electrical
axis direction
Prior art date
Application number
TW102130470A
Other languages
Chinese (zh)
Other versions
TWI470250B (en
Inventor
Yu-Ying Qiu
Hao-Wei Li
bo-wei Song
Guo-Hao Wu
xin-jie Qiu
Original Assignee
Chiuan Yan Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chiuan Yan Technology Co Ltd filed Critical Chiuan Yan Technology Co Ltd
Priority to TW102130470A priority Critical patent/TW201508294A/en
Application granted granted Critical
Publication of TWI470250B publication Critical patent/TWI470250B/zh
Publication of TW201508294A publication Critical patent/TW201508294A/en

Links

Landscapes

  • Tests Of Electronic Circuits (AREA)

Abstract

A bed type detection mechanism for detecting alignment and conductivity of an optical element includes a base, a fine-tuning device, a displacement device, an electrical measurement platform, and an electrical measurement device. The fine-tuning device is disposed on the base for outputting power and fine moving relative to the base along the X-axis direction and the Y-axis direction. The displacement device is disposed on the fine-tuning device for outputting adequate power and moving relative to the displacement device along the X-axis direction and the Y-axis direction. The electrical measurement platform is disposed on the displacement device and moves through the linkage of the fine-tuning device and the displacement device for allowing conductive glass to be placed thereon. The electrical measurement device is disposed on the base for performing contact electrical detection on the conductive glass aligned with the electrical measurement platform.

Description

床台式光學元件對位與導電性之檢測機構 Bed table optics alignment and conductivity detection mechanism

本發明係與檢測設備有關,更詳而言之係指一種床台式光學元件對位與導電性之檢測機構。 The present invention relates to a detection device, and more particularly to a detection mechanism for alignment and conductivity of a bed-top optical component.

按,隨著電子產品輕薄化與高性能的要求,不僅讓IC設計和製造上技術日益求精,同時也驅動著IC封裝技術的進步。以LCD產業而言,隨著LCD的規格從VGA提昇到WXGA,將使LCD面板上的線路製作變得複雜,若不增加驅動電路的數量情形下,則必須讓每顆驅動電路的接腳數目增加。這樣的技術演進下,驅動電路封裝技術有從TAB(Tape Automated Bonding)逐漸往COF(Chip on Film)或COG(Chip on Glass)方向發展。COG的方式是直接將長好的金凸塊的晶粒,用覆晶的方式直接焊在導電玻璃面板上的線路,可以省去TAB捲帶。由於TAB捲帶的成本很高,佔TAB封裝成本七成以上,因此COG在成本優勢上是相當引誘人的。COG雖有低成本的優勢,可是卻一直無法取代TAB封裝,原因在於COG必須將驅動電路安裝在玻璃面板上才可以檢查面板點亮的結果。若是無法點亮也無法重工,必須將整 個驅動電路拔掉,相當麻煩。關鍵部分在於如何在安裝前就能夠檢查出該導電玻璃之驅動電路的好壞,提高安裝的良率才能讓COG技術更廣泛被使用。 According to the requirements of thin and light electronic products and high performance, not only the IC design and manufacturing technology is becoming more and more refined, but also the advancement of IC packaging technology. In the LCD industry, as the LCD specifications are upgraded from VGA to WXGA, the circuit fabrication on the LCD panel will be complicated. If the number of driving circuits is not increased, the number of pins per driving circuit must be made. increase. Under such technology evolution, the driver circuit packaging technology has gradually evolved from TAB (Tape Automated Bonding) to COF (Chip on Film) or COG (Chip on Glass). The COG method is to directly solder the crystal grains of the long gold bumps to the wires on the conductive glass panel by flip chip, and the TAB tape can be omitted. Because the cost of TAB tape is very high, accounting for more than 70% of the cost of TAB packaging, COG is quite attractive in terms of cost advantages. Although COG has the advantage of low cost, it has not been able to replace the TAB package because the COG must install the driver circuit on the glass panel to check the result of the panel lighting. If it cannot be lit and cannot be reworked, it must be It is quite troublesome to unplug the drive circuit. The key part is how to check the driving circuit of the conductive glass before installation and improve the installation yield to make the COG technology more widely used.

隨著晶圓級封裝技術成為主流,驅動電路的凸塊檢測仍是在晶片型態下完成。這方面的檢測需求,已有許多廠商提供相關之機台。之後晶圓切割到最終測試之間,產品仍有可能會被污染或有損傷。目前普遍的品管做法是靠統計製程管制;可是由於無法做到完全的檢測,進而影響到往後組裝之良率,對這樣的先進技術的發展也會帶來不良的影響。 As wafer-level packaging technology becomes mainstream, bump detection of driver circuits is still done in wafer type. In this regard, many manufacturers have provided related machines. After the wafer is cut to the final test, the product may still be contaminated or damaged. At present, the common quality control practices rely on statistical process control; however, due to the inability to achieve complete testing, which affects the rate of assembly in the future, it will also have a negative impact on the development of such advanced technologies.

因此,如何能有效地提升對導電玻璃進行檢測之效率,便為目前相關業者所急須解決之課題。 Therefore, how to effectively improve the efficiency of detecting conductive glass is an urgent problem to be solved by current practitioners.

本案發明人鑑於習知檢測機構所衍生的各項缺點,乃亟思加以改良創新,並經多年苦心孤詣潛心研究後,終於成功研發完成本件床台式光學元件對位與導電性之檢測機構。 In view of the shortcomings derived from the conventional testing institutions, the inventors of the present invention have improved and innovated, and after years of painstaking research, they have successfully developed the detection mechanism for the alignment and conductivity of the bed-top optical components.

本發明之目的即在於提供一種床台式光學元件對位與導電性之檢測機構,係能有效增進檢測之效率者。 It is an object of the present invention to provide a detection mechanism for alignment and conductivity of a bed-top optical component, which is effective for improving the efficiency of detection.

可達成上述發明目的之床台式光學元件對位與導電性之檢測機構,包括有:一基座;一微調裝置,係設置於該基座工作範圍上,該微調裝置包含有一微調載板、若干 設置於該微調載板與該基座間之旋轉平移組件及若干驅動該微調載板沿該旋轉平移組件進行X軸方向、Y軸方向精細位移以及朝θ方向精細旋轉之微調動力單元,該微調裝置輸出適當之動力而沿X軸方向及Y軸方向進行相對該位移裝置之精細位移;一位移裝置,係設置於微調裝置之微調載板,該位移裝置包含一位移載板、若干設置於該位移載板與該微調載板間之位移滑軌組件及若干驅動該位移載板沿該位移滑軌組件進行X軸方向與Y軸方向位移之位移動力單元,而該位移裝置可輸出適當之動力而沿X軸方向及Y軸方向進行相對該基座之位移;一電測平台,係設置於該位移裝置之位移載板上,該電測平台以受該位移裝置及該微調裝置所連動而位移,用以供一導電玻璃放置者,而該電測平台上具有若干以預定間距排列之真空吸附孔,以對放置之導電玻璃產生真空吸力;一電測裝置,包含有一支撐架、一Z軸動力單元、一電測座、至少一影像對位單元及一接觸式電測板;該支撐架係設置於該基座上,該Z軸動力單元係設置於該支撐架上,用以產生一沿Z軸方向往復移動之動力,該電測座係連接於該Z軸動力單元上,以受該Z軸動力單元所連動,而可沿Z軸方向進行往復之位移,該影像對位單元係設置於該電測座上,用以對位於該電測平台上之導電玻璃進行取像,並提供影像訊號供控制器判讀導電玻璃上的驅動電路位置是否正確,該接觸式電測板係設置於該電測座上,並可於一水 平電測位置至一垂直移動位置間進行90度之翻轉,並提供接觸測試訊號供控制器判讀,而該電測裝置用以對位於該電測平台上之導電玻璃進行接觸式之電性檢測者;一控制器,該控制器與該微調裝置、位移裝置、電測平台及該電測裝置電性連接,以控制該微調裝置、位移裝置、電測平台及該電測裝置之作動與停止者,並能進行對該影像對位單元之影像訊號(即導電玻璃上的驅動電路位置)進行判讀,若位置有誤差即透過微調裝置進行位置校正,並對該接觸式電測板之接觸測試訊號進行判讀者。 The detection mechanism for the alignment and conductivity of the bed-top optical component, which can achieve the above object, includes: a pedestal; a fine adjustment device is disposed on the working range of the pedestal, the fine adjustment device includes a fine adjustment carrier plate, and a plurality of a rotary translation assembly disposed between the fine adjustment carrier and the base; and a fine adjustment power unit for driving the fine adjustment carrier to perform fine displacement in the X-axis direction and the Y-axis direction along the rotary translation assembly and finely rotating in the θ direction, the fine adjustment device Outputting appropriate power to perform fine displacement relative to the displacement device along the X-axis direction and the Y-axis direction; a displacement device is disposed on the fine adjustment carrier of the fine adjustment device, the displacement device includes a displacement carrier plate, and a plurality of displacements are disposed on the displacement a displacement slide assembly between the carrier plate and the fine adjustment carrier plate and a plurality of displacement power units for driving the displacement carrier plate along the displacement slide assembly for X-axis direction and Y-axis direction, and the displacement device can output appropriate power Displacement relative to the base along the X-axis direction and the Y-axis direction; an electrical measurement platform is disposed on the displacement carrier of the displacement device, and the electrical measurement platform is coupled by the displacement device and the fine adjustment device Displacement for placing a conductive glass, and the electric measuring platform has a plurality of vacuum adsorption holes arranged at a predetermined interval to generate vacuum suction on the placed conductive glass An electric measuring device comprises a support frame, a Z-axis power unit, an electric test stand, at least one image alignment unit and a contact type electrical test board; the support frame is disposed on the base, the Z The shaft power unit is disposed on the support frame for generating a reciprocating movement in the Z-axis direction, and the electric measuring block is coupled to the Z-axis power unit to be coupled by the Z-axis power unit, and Reciprocating displacement along the Z-axis direction, the image aligning unit is disposed on the electric measuring seat for taking image of the conductive glass located on the electric measuring platform, and providing an image signal for the controller to interpret the conductive glass The position of the driving circuit is correct. The contact type measuring board is disposed on the electric measuring seat and can be used in one water. Performing a 90-degree flip between the flat measurement position and a vertical movement position, and providing a contact test signal for the controller to interpret, and the electrical measurement device is used for performing contact electrical detection on the conductive glass located on the electrical measurement platform. The controller is electrically connected to the fine adjustment device, the displacement device, the electrical measurement platform and the electrical measurement device to control the actuation and stop of the fine adjustment device, the displacement device, the electrical measurement platform and the electrical measurement device. And the image signal of the image aligning unit (ie, the position of the driving circuit on the conductive glass) can be interpreted. If the position is in error, the position is corrected by the fine adjustment device, and the contact test of the contact type electrical measuring board is performed. The signal is judged by the reader.

是以,本發明所提供之床台式光學元件對位與導電性之檢測機構,能以更有效率之方式進行對導電玻璃進行檢測,以提升產品之產值。 Therefore, the detection mechanism of the alignment and conductivity of the bed-top optical component provided by the invention can detect the conductive glass in a more efficient manner to improve the output value of the product.

而本發明進一步提供一種床台式光學元件對位與導電性之檢測機構的檢測方法包含有:步驟1:該控制器控制該位移裝置之位移,使帶動該電測平台至一放料位置,而由操作者將欲檢測之一導電玻璃放置於該電測平台上,並由該等真空吸附孔所產生之真空吸力加以吸附;步驟2:接著再由控制器控制該位移裝置之位移,使帶動該電測平台至一電測位置;步驟3:並由該電測裝置之影像對位單元進行對導電玻璃之驅動電路位置進行取像(即影像訊號),若有誤差時,便由該控制器控制該微調裝置精密地調整該電測平台之位置,直至調整至正確位置;步驟4:由該電測裝置之接 觸式電測板由呈垂直狀態之垂直移動位置翻轉至呈水平狀態之水平電測位置,使該接觸式電測板與導電玻璃之驅動電路接觸,而能對該導電玻璃進行電性之檢測;步驟5:當對該導電玻璃之其一區域電測完畢後,該電測裝置之接觸式電測板便由呈水平狀態之水平電測位置翻轉至呈垂直狀態之垂直移動位置,並由該控制器再控制該位移裝置帶動該電測平台進行位移,使該導電玻璃之另一待測區域(即下一個驅動電路位置)與該電測裝置對位。 The present invention further provides a method for detecting the alignment and conductivity of a bed-top optical component, including: Step 1: The controller controls the displacement of the displacement device to drive the electrical measurement platform to a discharge position, and The operator places one of the conductive glasses to be tested on the electric measuring platform, and adsorbs by the vacuum suction generated by the vacuum adsorption holes; Step 2: Then the controller controls the displacement of the displacement device to drive The electrical measuring platform is connected to an electrical measuring position; step 3: the image aligning unit of the electrical measuring device performs image capturing (ie, image signal) on the driving circuit position of the conductive glass, and if there is an error, the control is performed by the control Controlling the fine adjustment device to precisely adjust the position of the electrical measurement platform until it is adjusted to the correct position; Step 4: connecting by the electrical measurement device The touch-type electrical measuring board is turned from a vertical moving position in a vertical state to a horizontal electrical measuring position in a horizontal state, so that the contact type electrical measuring board is in contact with the driving circuit of the conductive glass, and the conductive glass can be electrically detected. Step 5: After the electrical measurement of one area of the conductive glass is completed, the contact type electrical measuring board of the electrical measuring device is turned from the horizontal electrical measuring position in the horizontal state to the vertical moving position in the vertical state, and The controller then controls the displacement device to drive the electrical measurement platform to be displaced, so that another area to be tested (ie, the position of the next drive circuit) of the conductive glass is aligned with the electrical measurement device.

1‧‧‧基座 1‧‧‧Base

2‧‧‧微調裝置 2‧‧‧ fine-tuning device

21‧‧‧微調載板 21‧‧‧ fine-tuning carrier board

22‧‧‧旋轉平移組件 22‧‧‧Rotary translation assembly

23‧‧‧微調動力單元 23‧‧‧ fine tuning power unit

3‧‧‧位移裝置 3‧‧‧displacement device

31‧‧‧位移載板 31‧‧‧ Displacement carrier

32‧‧‧位移滑軌組件 32‧‧‧Displacement rail assembly

33‧‧‧位移動力單元 33‧‧‧displacement power unit

4‧‧‧電測平台 4‧‧‧Electric measurement platform

41‧‧‧真空吸附孔 41‧‧‧Vacuum adsorption holes

5‧‧‧電測裝置 5‧‧‧Electrical measuring device

51‧‧‧支撐架 51‧‧‧Support frame

52‧‧‧Z軸動力單元 52‧‧‧Z-axis power unit

53‧‧‧電測座 53‧‧‧Electrical test stand

54‧‧‧影像對位單元 54‧‧‧Image Alignment Unit

55‧‧‧接觸式電測板 55‧‧‧Contact electric measuring board

6‧‧‧控制器 6‧‧‧ Controller

91‧‧‧導電玻璃 91‧‧‧Conductive glass

911‧‧‧驅動電路 911‧‧‧ drive circuit

圖1為本發明一較佳實施例之立體組合圖。 1 is a perspective assembled view of a preferred embodiment of the present invention.

圖1A為圖1的A部分之局部放大圖。 Fig. 1A is a partial enlarged view of a portion A of Fig. 1.

圖2係為基座與微調裝置立體組合示意圖。 FIG. 2 is a schematic diagram of a three-dimensional combination of a pedestal and a fine adjustment device.

圖3係為圖2之立體透視示意圖;說明該微調裝置內部構造。 Figure 3 is a perspective perspective view of Figure 2; illustrating the internal configuration of the trimming device.

圖4為該微調裝置與該位移裝置立體組合圖。 4 is a perspective assembled view of the fine adjustment device and the displacement device.

圖5為圖4之立體分解圖。 Figure 5 is an exploded perspective view of Figure 4.

圖6為該位移裝置立體組合示意圖。 Figure 6 is a schematic perspective view of the displacement device.

圖7為該位移裝置與電測平台立體組合圖。 Figure 7 is a perspective assembled view of the displacement device and the electrical measurement platform.

圖8係為位移裝置、微調裝置與電測平台立體組合示意圖。 FIG. 8 is a schematic diagram of a three-dimensional combination of a displacement device, a fine adjustment device and an electrical measurement platform.

圖9為圖1所示實施例之作動側視圖。 Figure 9 is a side elevational view of the embodiment of Figure 1.

圖10係圖1所示實施例之局部構件作動示意圖。 Figure 10 is a schematic view showing the operation of the partial members of the embodiment shown in Figure 1.

圖11係圖1所示實施例之局部構件作動俯視圖。 Figure 11 is a top plan view of the partial member of the embodiment of Figure 1.

圖12係圖1所示實施例另一視角之立體圖。 Figure 12 is a perspective view of another perspective of the embodiment of Figure 1.

圖13係圖1所示實施例之局部構件作動示意圖。 Figure 13 is a schematic view showing the operation of the partial members of the embodiment shown in Figure 1.

圖14為本發明之流程方塊圖。 Figure 14 is a block diagram of the flow of the present invention.

請參閱圖1至圖13,本發明所提供之床台式光學元件對位與導電性之檢測機構,主要包括有:一基座1、一微調裝置2、一位移裝置3、一電測平台4、一電測裝置5及一控制器6所組構而成。 Referring to FIG. 1 to FIG. 13 , the detecting mechanism for the alignment and conductivity of the bed-top optical component provided by the present invention mainly includes: a base 1 , a fine adjustment device 2 , a displacement device 3 , and an electrical measurement platform 4 . An electric measuring device 5 and a controller 6 are combined.

該基座1,係可穩固地置放於一平面上(如圖1至圖3所示)。 The base 1 can be stably placed on a plane (as shown in FIGS. 1 to 3).

該微調裝置2,係設置於該基座1之工作範圍上,可輸出適當之動力而沿X軸方向及Y軸方向進行相對該位移裝置3之精密細微位移。該微調裝置2具有一微調載板21、若干設置於該微調載板21與該基座1間之旋轉平移組件22及若干驅動該微調載板21沿該旋轉平移組件22進行X軸方向、Y軸方向精細位移以及朝θ方向精細旋轉之微調動力單元23(如圖2至圖3所示)。 The fine adjustment device 2 is disposed on the working range of the susceptor 1, and can output appropriate electric power to perform precise fine displacement with respect to the displacement device 3 in the X-axis direction and the Y-axis direction. The fine adjustment device 2 has a fine adjustment carrier 21, a plurality of rotary translation components 22 disposed between the fine adjustment carrier 21 and the base 1, and a plurality of driving the fine adjustment carrier 21 along the rotational translation assembly 22 in the X-axis direction, Y. Fine adjustment of the axial direction and fine adjustment of the power unit 23 (shown in Figures 2 to 3).

該位移裝置3,係設置於該位移裝置3上,可輸出適當之動力而沿X軸方向及Y軸方向進行相對該微調裝置2之位移;該位移裝置3具有一位移載板31、若干設置於該 位移載板31與該微調載板21間之位移滑軌組件32及若干驅動該位移載板31沿該位移滑軌組件32進行X軸方向與Y軸方向位移之位移動力單元33(如圖4至圖7所示)。 The displacement device 3 is disposed on the displacement device 3 and can output appropriate power to perform displacement relative to the fine adjustment device 2 along the X-axis direction and the Y-axis direction; the displacement device 3 has a displacement carrier 31 and a plurality of settings In this a displacement slide assembly 32 between the displacement carrier 31 and the fine adjustment carrier 21 and a plurality of displacement power units 33 for driving the displacement carrier 31 along the displacement slide assembly 32 for X-axis direction and Y-axis displacement (as shown in the figure) 4 to Figure 7).

該電測平台4,係設置於位移裝置3之位移載板31上,以受該位移載板31之該位移裝置3所連動以及受微調裝置2精密位移,該電測平台4上並具有若干以預定間距排列之真空吸附孔41,以對放置之一導電玻璃91產生真空吸力者(如圖7至圖9所示)。 The electric measuring platform 4 is disposed on the displacement carrier 31 of the displacement device 3 to be coupled by the displacement device 3 of the displacement carrier 31 and precisely displaced by the fine adjustment device 2, and the electrical measurement platform 4 has a plurality of The vacuum suction holes 41 are arranged at a predetermined interval to generate a vacuum suction force for placing one of the conductive glasses 91 (as shown in FIGS. 7 to 9).

該電測裝置5,係設置於該基座1上,用以對位於該電測平台4上之導電玻璃91進行接觸式之電性檢測者。該電測裝置5具有一支撐架51、一Z軸動力單元52、一電測座53、一影像對位單元54及一接觸式電測板55;該支撐架51係設置於該基座1上,並具有一預定高度,該Z軸動力單元52係設置於該支撐架51上,用以產生一沿Z軸方向往復移動之動力,該電測座53係連接於該Z軸動力單元52上,以受該Z軸動力單元52所連動,而可沿Z軸方向進行往復之位移,該等影像對位單元54分別為一攝影裝置,係設置於該電測座53上,係用以對位於該電測平台4上之導電玻璃91進行取像,該接觸式電測板55係設置於該電測座53上,並可於一水平電測位置至一垂直移動位置間進行度之翻轉(如圖1、圖7至圖9所示)。 The electrical measuring device 5 is disposed on the base 1 for performing a contact type electrical detection on the conductive glass 91 located on the electrical measuring platform 4. The electric measuring device 5 has a supporting frame 51, a Z-axis power unit 52, an electric measuring block 53, an image aligning unit 54 and a contact electric measuring board 55; the supporting frame 51 is disposed on the base 1 And having a predetermined height, the Z-axis power unit 52 is disposed on the support frame 51 for generating a power for reciprocating movement in the Z-axis direction, and the electrical test block 53 is coupled to the Z-axis power unit 52. The image aligning unit 54 is a photographic device, which is disposed on the electrical pedestal 53 and is used for being coupled to the Z-axis power unit 52. The conductive glass 91 on the electrical test platform 4 is imaged, and the contact electrical test board 55 is disposed on the electrical test stand 53 and can be used between a horizontal electrical measurement position and a vertical moving position. Flip (as shown in Figure 1, Figure 7 to Figure 9).

該控制器6,係設置於該基座1一側,並與微調 裝置2、位移裝置3、電測平台4及該電測裝置5電性連接,以控制該微調裝置2、位移裝置3、電測平台4及該電測裝置5之作動與停止者,並能進行對該影像對位單元54之影像訊號(即導電玻璃91上的驅動電路911位置)進行判讀,若位置有誤差即透過微調裝置3進行位置校正,對該接觸式電測板55之接觸測試訊號進行判讀者。 The controller 6 is disposed on the side of the base 1 and is fine-tuned The device 2, the displacement device 3, the electrical measurement platform 4 and the electrical measurement device 5 are electrically connected to control the actuation and stop of the fine adjustment device 2, the displacement device 3, the electrical measurement platform 4 and the electrical measurement device 5, and can The image signal of the image aligning unit 54 (ie, the position of the driving circuit 911 on the conductive glass 91) is interpreted. If the position is in error, the position is corrected by the fine adjustment device 3, and the contact test of the contact type measuring board 55 is performed. The signal is judged by the reader.

而該導電玻璃91上以陣列佈置有複數個驅動電路911,提供電測裝置5之影像對位單元54判讀該導電玻璃91的型號與檢測位置。 On the conductive glass 91, a plurality of driving circuits 911 are arranged in an array, and the image aligning unit 54 of the electrical measuring device 5 is provided to interpret the model and the detecting position of the conductive glass 91.

是以,上述即為本發明所提供一較佳實施例之床台式光學元件對位與導電性之檢測機構各部構件及其組裝方式之介紹,接著參考全部圖式將其使用方式介紹如下:步驟1:首先,由該控制器6控制該位移裝置3之位移,使帶動該電測平台4至一放料位置,而由操作者將欲檢測之一導電玻璃91放置於該電測平台4上,並由該等真空吸附孔41所產生之真空吸力加以吸附;步驟2:接著再由控制器6控制該位移裝置3之位移,使帶動該電測平台4至一電測位置;步驟3:並由該電測裝置5之影像對位單元54進行對導電玻璃91之驅動電路911位置進行取像(即影像訊號),若有誤差時,便由該控制器6控制該微調裝置2精密地調整該電測平台4之位置,直至調整至正確位置; 步驟4:由該電測裝置5之接觸式電測板55由呈垂直狀態之垂直移動位置翻轉至呈水平狀態之水平電測位置(如圖10~11所示),使該接觸式電測板55與導電玻璃91之驅動電路911接觸,而能對該導電玻璃91進行電性之檢測;步驟5:當對該導電玻璃91之其一區域電測完畢後,該電測裝置5之接觸式電測板55便由呈水平狀態之水平電測位置翻轉至呈垂直狀態之垂直移動位置,並由該控制器6再控制該位移裝置3帶動該電測平台4進行位移(如圖12所示),使該導電玻璃91之另一待測區域(即下一個驅動電路911位置)與該電測裝置5對位。 Therefore, the above is a description of each component of the detecting mechanism of the alignment and conductivity of the bed-top optical component according to a preferred embodiment of the present invention, and the manner of assembling the same, and then the manner of use thereof is as follows: 1: First, the displacement of the displacement device 3 is controlled by the controller 6 to drive the electrical measurement platform 4 to a discharge position, and the operator places a conductive glass 91 to be placed on the electrical measurement platform 4. And adsorbed by the vacuum suction generated by the vacuum adsorption holes 41; Step 2: Then the controller 6 controls the displacement of the displacement device 3 to drive the electrical measurement platform 4 to an electrical measurement position; Step 3: The image aligning unit 54 of the electrical measuring device 5 performs image capturing (ie, image signal) on the position of the driving circuit 911 of the conductive glass 91. If there is an error, the controller 6 controls the fine tuning device 2 to precisely Adjusting the position of the electrical test platform 4 until it is adjusted to the correct position; Step 4: The contact type electrical measuring plate 55 of the electrical measuring device 5 is turned from a vertical moving position in a vertical state to a horizontal electrical measuring position in a horizontal state (as shown in FIGS. 10 to 11), so that the contact type electrical measuring is performed. The board 55 is in contact with the driving circuit 911 of the conductive glass 91, and can electrically detect the conductive glass 91. Step 5: After the electrical measurement of one area of the conductive glass 91 is completed, the contact of the measuring device 5 The electric measuring board 55 is turned from the horizontal electric measuring position in the horizontal state to the vertical moving position in the vertical state, and the controller 6 controls the displacement device 3 to drive the electric measuring platform 4 to perform displacement (as shown in FIG. 12). The other area to be tested (ie, the position of the next driving circuit 911) of the conductive glass 91 is aligned with the electrical measuring device 5.

是以,重覆以上步驟3~5之流程,由影像對位單元54進行對導電玻璃91之驅動電路911位置進行取像、由該微調裝置2精密地調整該電測平台4之位置、並將接觸式電測板55由呈垂直狀態之垂直移動位置翻轉至呈水平狀態之水平電測位置,使該接觸式電測板55與導電玻璃91之驅動電路911接觸,以能對該導電玻璃91進行電性之檢測,藉此便能持續地對導電玻璃91之各區域驅動電路911進行電性檢測。 Therefore, by repeating the above steps 3 to 5, the image aligning unit 54 performs image capturing on the position of the driving circuit 911 of the conductive glass 91, and the fine adjustment device 2 precisely adjusts the position of the electrical measuring platform 4, and The contact type electrical measuring plate 55 is turned from the vertical moving position in the vertical state to the horizontal electric measuring position in the horizontal state, so that the contact type electrical measuring plate 55 is in contact with the driving circuit 911 of the conductive glass 91 to enable the conductive glass The electrical detection is performed by 91, whereby the electrical drive of each of the area drive circuits 911 of the conductive glass 91 is continuously performed.

另外,該電測裝置5之Z軸動力單元52係受該控制器6所控制,以自動地因應進行檢測之導電玻璃91厚度而調整其Z軸之高度(如圖11所示)。 In addition, the Z-axis power unit 52 of the electric measuring device 5 is controlled by the controller 6 to automatically adjust the height of the Z-axis according to the thickness of the conductive glass 91 to be detected (as shown in FIG. 11).

是以,本發明所提供之床台式光學元件對位與導電性之檢測機構,能以更有效率之方式進行對導電玻璃91進行檢測,以提升產品之產值。 Therefore, the detection mechanism for the alignment and conductivity of the bed-top optical component provided by the present invention can perform the detection of the conductive glass 91 in a more efficient manner to improve the output value of the product.

上列詳細說明係針對本發明之一可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The detailed description of the preferred embodiments of the present invention is intended to be limited to the scope of the invention, and is not intended to limit the scope of the invention. The patent scope of this case.

綜上所述,本案不但在空間型態上確屬創新,並能較習用物品增進上述多項功效,應已充分符合新穎性及進步性之法定發明專利要件,爰依法提出申請,懇請 貴局核准本件發明專利申請案,以勵發明,至感德便。 In summary, this case is not only innovative in terms of space type, but also can enhance the above-mentioned multiple functions compared with the customary items. It should fully meet the statutory invention patent requirements of novelty and progressiveness, and apply for it according to law. This invention patent application, in order to invent invention, to the sense of virtue.

1‧‧‧基座 1‧‧‧Base

3‧‧‧位移裝置 3‧‧‧displacement device

4‧‧‧電測平台 4‧‧‧Electric measurement platform

41‧‧‧真空吸附孔 41‧‧‧Vacuum adsorption holes

5‧‧‧電測裝置 5‧‧‧Electrical measuring device

51‧‧‧支撐架 51‧‧‧Support frame

6‧‧‧控制器 6‧‧‧ Controller

91‧‧‧導電玻璃 91‧‧‧Conductive glass

Claims (3)

一種床台式光學元件對位與導電性之檢測機構,包括:一基座;一微調裝置,係設置於該基座工作範圍上,該微調裝置包含有一微調載板、若干設置於該微調載板與該基座間之旋轉平移組件及若干驅動該微調載板沿該旋轉平移組件進行X軸方向、Y軸方向精細位移以及朝θ方向精細旋轉之微調動力單元,該微調裝置輸出適當之動力而沿X軸方向及Y軸方向進行相對該位移裝置之精細位移;一位移裝置,係設置於微調裝置之微調載板,該位移裝置包含一位移載板、若干設置於該位移載板與該微調載板間之位移滑軌組件及若干驅動該位移載板沿該位移滑軌組件進行X軸方向與Y軸方向位移之位移動力單元,而該位移裝置可輸出適當之動力而沿X軸方向及Y軸方向進行相對該基座之位移;一電測平台,係設置於該位移裝置之位移載板上,該電測平台以受該位移裝置及該微調裝置所連動而位移,用以供一導電玻璃放置者,而該電測平台上具有若干以預定間距排列之真空吸附孔,以對放置之導電玻璃產生真空吸力;一電測裝置,包含有一支撐架、一Z軸動力單元、一電測座、至少一影像對位單元及一接觸式電測板;該支撐架係設置於該基座上,該Z軸動力單元係設置於該支撐架 上,用以產生一沿Z軸方向往復移動之動力,該電測座係連接於該Z軸動力單元上,以受該Z軸動力單元所連動,而可沿Z軸方向進行往復之位移,該影像對位單元係設置於該電測座上,用以對位於該電測平台上之導電玻璃進行取像,並提供影像訊號供控制器判讀導電玻璃上的驅動電路位置是否正確,該接觸式電測板係設置於該電測座上,並可於一水平電測位置至一垂直移動位置間進行90度之翻轉,並提供接觸測試訊號供控制器判讀,而該電測裝置用以對位於該電測平台上之導電玻璃進行接觸式之電性檢測者;一控制器,該控制器與該微調裝置、位移裝置、電測平台及該電測裝置電性連接,以控制該微調裝置、位移裝置、電測平台及該電測裝置之作動與停止者,並能進行對該影像對位單元之影像訊號對導電玻璃上的驅動電路位置進行判讀,若位置有誤差即透過微調裝置進行位置校正,對該接觸式電測板之接觸測試訊號進行判讀者。 The invention relates to a detection mechanism for alignment and conductivity of a bed-top optical component, comprising: a pedestal; a fine adjustment device is disposed on the working range of the pedestal, the fine adjustment device comprises a fine adjustment carrier plate, and a plurality of fine adjustment carrier plates are disposed on the fine adjustment carrier plate a rotary translation assembly between the base and a plurality of fine-tuning power units for driving the fine-tuning carrier plate to perform fine displacement in the X-axis direction and the Y-axis direction along the rotational translation assembly and finely rotating in the θ direction, the fine adjustment device outputs appropriate power along The X-axis direction and the Y-axis direction are finely displaced relative to the displacement device; a displacement device is disposed on the fine adjustment carrier of the fine adjustment device, the displacement device includes a displacement carrier, and a plurality of displacement carriers are disposed on the displacement carrier and the fine adjustment carrier a displacement slide assembly between the plates and a displacement power unit for driving the displacement carrier along the displacement slide assembly for X-axis direction and Y-axis direction, and the displacement device can output appropriate power along the X-axis direction and The Y-axis direction is displaced relative to the base; an electrical measurement platform is disposed on the displacement carrier of the displacement device, and the electrical measurement platform is adapted to receive the displacement device The fine adjustment device is displaced and displaced for a conductive glass holder, and the electrical measurement platform has a plurality of vacuum adsorption holes arranged at a predetermined interval to generate vacuum suction on the placed conductive glass; and an electrical measurement device, including a support frame, a Z-axis power unit, an electric test stand, at least one image alignment unit and a contact type electrical test board; the support frame is disposed on the base, and the Z-axis power unit is disposed on the support frame And a power for reciprocating in the Z-axis direction, the electric measuring block is connected to the Z-axis power unit to be reciprocally displaced along the Z-axis direction by the Z-axis power unit. The image aligning unit is disposed on the electrical measuring base for taking image of the conductive glass located on the electrical measuring platform, and providing an image signal for the controller to determine whether the position of the driving circuit on the conductive glass is correct. The electric measuring board is disposed on the electric measuring seat, and can perform a 90 degree flip between a horizontal electric measuring position and a vertical moving position, and provides a contact test signal for the controller to interpret, and the electric measuring device is used for Conducting a contact type electrical tester on the conductive glass on the electrical measurement platform; a controller electrically connected to the fine adjustment device, the displacement device, the electrical measurement platform and the electrical measurement device to control the fine adjustment The device, the displacement device, the electric measuring platform and the actuating and stopping of the electric measuring device, and can perform the interpretation of the position of the driving circuit on the conductive glass by the image signal of the image aligning unit, if the position has an error Position correction means through the fine adjustment, the reader is arbitrated test signal contacts contact the electrical measuring plate. 如申請專利範圍第1項所述之床台式光學元件對位與導電性之檢測機構,其中該影像對位單元為一攝影裝置。 The apparatus for detecting alignment and conductivity of a bed-top optical component according to claim 1, wherein the image alignment unit is a photographing device. 一種床台式光學元件對位與導電性之檢測機構的檢測方法包含有:步驟1:該控制器控制該位移裝置之位移,使帶動該電測平台至一放料位置,而由操作者將欲檢測之一導電玻璃放 置於該電測平台上,並由該等真空吸附孔所產生之真空吸力加以吸附;步驟2:接著再由控制器控制該位移裝置之位移,使帶動該電測平台至一電測位置;步驟3:並由該電測裝置之影像對位單元進行對導電玻璃之驅動電路位置進行取像(即影像訊號),若有誤差時,便由該控制器控制該微調裝置精密地調整該電測平台之位置,直至調整至正確位置;步驟4:由該電測裝置之接觸式電測板由呈垂直狀態之垂直移動位置翻轉至呈水平狀態之水平電測位置,使該接觸式電測板與導電玻璃之驅動電路接觸,而能對該導電玻璃進行電性之檢測;步驟5:當對該導電玻璃之其一區域電測完畢後,該電測裝置之接觸式電測板便由呈水平狀態之水平電測位置翻轉至呈垂直狀態之垂直移動位置,並由該控制器再控制該位移裝置帶動該電測平台進行位移,使該導電玻璃之另一待測區域(即下一個驅動電路位置)與該電測裝置對位。 A method for detecting the alignment and conductivity of a bed-top optical component includes: Step 1: The controller controls the displacement of the displacement device to drive the electrical measurement platform to a discharge position, and the operator will Detect one of the conductive glass Putting on the electric measuring platform and adsorbing by the vacuum suction generated by the vacuum adsorption holes; Step 2: controlling the displacement of the displacement device by the controller to drive the electric measuring platform to an electric measuring position; Step 3: The image aligning unit of the electrical measuring device performs image capturing (ie, image signal) on the driving circuit position of the conductive glass. If there is an error, the controller controls the fine adjusting device to precisely adjust the power. Measure the position of the platform until it is adjusted to the correct position; Step 4: The contact type electrical measuring board of the electric measuring device is turned from the vertical moving position in the vertical state to the horizontal electric measuring position in the horizontal state, so that the contact type electrical measuring The board is in contact with the driving circuit of the conductive glass, and the conductive glass can be electrically detected; Step 5: After the electrical measurement of one area of the conductive glass is completed, the contact type electrical measuring board of the electric measuring device is The horizontal electric measurement position in a horizontal state is turned to a vertical movement position in a vertical state, and the controller further controls the displacement device to drive the electric measurement platform to perform displacement, so that the conductive glass is another Sensing region (i.e., a driving circuit at a position) to the position measuring device.
TW102130470A 2013-08-26 2013-08-26 Bed type detection mechanism for detecting alignment and conductivity of optical element TW201508294A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102130470A TW201508294A (en) 2013-08-26 2013-08-26 Bed type detection mechanism for detecting alignment and conductivity of optical element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102130470A TW201508294A (en) 2013-08-26 2013-08-26 Bed type detection mechanism for detecting alignment and conductivity of optical element

Publications (2)

Publication Number Publication Date
TWI470250B TWI470250B (en) 2015-01-21
TW201508294A true TW201508294A (en) 2015-03-01

Family

ID=52784789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102130470A TW201508294A (en) 2013-08-26 2013-08-26 Bed type detection mechanism for detecting alignment and conductivity of optical element

Country Status (1)

Country Link
TW (1) TW201508294A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694611B (en) * 2019-05-01 2020-05-21 蔡東猛 The measurement and repair flow for micro light-emitting diodes and image sensors

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235964B2 (en) * 2003-03-31 2007-06-26 Intest Corporation Test head positioning system and method
CN101488371B (en) * 2009-03-04 2010-12-29 上海微电子装备有限公司 Precise positioning platform with six freedom of motion
TW201121696A (en) * 2009-12-25 2011-07-01 Metal Ind Res & Dev Ct Ultra-precision piezoelectric positioning platform
CN102059589B (en) * 2010-10-21 2013-04-17 大连理工大学 Device and method for detecting inclination angle error of laser displacement sensor
TW201321742A (en) * 2011-11-30 2013-06-01 Chiuan Yan Technology Co Ltd Optical system
TW201328832A (en) * 2012-01-13 2013-07-16 Chiuan Yan Technology Co Ltd Manual fine-tuning deflecting stage device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694611B (en) * 2019-05-01 2020-05-21 蔡東猛 The measurement and repair flow for micro light-emitting diodes and image sensors

Also Published As

Publication number Publication date
TWI470250B (en) 2015-01-21

Similar Documents

Publication Publication Date Title
TWI490478B (en) Substrate inspection device
CN201203583Y (en) Optical detector for printed circuit board
KR102072061B1 (en) Apparatus for bending substrate, apparatus and method for inspecting bended substrate
CN107478871A (en) It is a kind of to be used for flexible OLED panel and FPC automatic aligning lighting-up equipment
JP2018029172A (en) Crimping device
CN104515914A (en) Testing mechanism and testing method of alignment and conductivity of bed type optical components
KR102058364B1 (en) Substrate Bonding Apparatus
CN113013067A (en) Transfer method with detection and chip repair functions
CN113161273A (en) Position deviation detection method and device, position abnormality determination method and conveyance control method
JP5062204B2 (en) Component mounting board inspection method and apparatus, and component mounting apparatus
TW201508294A (en) Bed type detection mechanism for detecting alignment and conductivity of optical element
CN202793746U (en) Light-emitting diode (LED) optical wand measurement machine
KR101354690B1 (en) Pannel moving device for touch screen pannel producing apparatus
TWI603410B (en) Testing system for re-constructed wafer and the method thereof
KR100553816B1 (en) Cog bonder
KR101219285B1 (en) Inspection method and apparatus of substrate
CN218447851U (en) Wafer carrying device
JP7496506B2 (en) Component crimping device and component crimping method
JP2000200805A (en) Bonding of electronic component
KR20140000500A (en) Auto-lighting apparatus and driving method thereof
TWI699608B (en) Apparatus for assembling an optical device
JP2003249530A (en) Mounter for semiconductor element, and method of positioning board, using the mounter
JP4383255B2 (en) Electronic component mounting method and apparatus
KR101194190B1 (en) Bonding apparatus for fabricating camera module
TW202414655A (en) Mounting equipment and substrate manufacturing equipment

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees