TW201435299A - A method and apparatus of profile measurement - Google Patents

A method and apparatus of profile measurement Download PDF

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TW201435299A
TW201435299A TW103102079A TW103102079A TW201435299A TW 201435299 A TW201435299 A TW 201435299A TW 103102079 A TW103102079 A TW 103102079A TW 103102079 A TW103102079 A TW 103102079A TW 201435299 A TW201435299 A TW 201435299A
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plane
imaging
image
lens
imaging sensor
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TW103102079A
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Chinese (zh)
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Tzyy-Shuh Chang
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Og Technologies Inc
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Priority claimed from US14/091,970 external-priority patent/US20140152771A1/en
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Abstract

A system and method for profile measurement based on triangulation involves arrangement of an image acquisition assembly relative to an illumination assembly such that an imaging plane is parallel to a light plane (measurement plane defined by where the light plane impinges on the object), which supports uniform pixel resolution in the imaging plane. The image acquisition assembly includes an imaging sensor having a sensor axis and a lens having a principal axis, wherein the lens axis is offset from the imaging axis.

Description

輪廓測量的方法和設備 Method and apparatus for contour measurement 相關申請案之交叉參考Cross-reference to related applications

本申請案主張2012年12月1日申請之美國臨時申請案第61/732,292號('292申請案)及2013年3月15日申請之美國臨時申請案第61/793,366號('366申請案)的權利。'292申請案及'366申請案皆就好像在本文中被完全地闡述而據此以引用方式併入。 This application claims US Provisional Application No. 61/732,292 (the '292 application) filed on December 1, 2012, and US Provisional Application No. 61/793,366 (the '366 application) filed on March 15, 2013 )s right. Both the '292 application and the '366 application are hereby fully incorporated herein by reference.

本發明大體上係關於一種用於物件之以成像為基礎之輪廓及/或尺寸測量的系統。 The present invention generally relates to a system for imaging-based contouring and/or dimensional measurement of articles.

下文僅出於提供上下文之目的而闡述此背景描述。因此,在此背景描述不以其他方式當作先前技術的程度上,此背景描述之任何態樣既不明確地又不隱含地被承認為對照本發明之先前技術。 This background description is set forth below for the purpose of providing context only. Therefore, to the extent that the background description is not to be taken as a prior art, it is not to be construed as an

用於二維(2D)及三維(3D)物件之以成像為基礎之輪廓測量的系統正在廣泛使用中。吾人可在範圍為自測量、處理序控制、模型化至導引之許多應用中發現此等以成像為基礎之輪廓測量系統。 Systems for imaging-based profilometry for two-dimensional (2D) and three-dimensional (3D) objects are in widespread use. We can find these imaging-based profilometry systems in many applications ranging from self-measurement, process control, and modeling to guidance.

在許多技術途徑當中,極常見的技術被稱為三角測量(triangulation),其中將一經結構化光圖案(諸如,一亮圓點、一明線、一十字形、一圓圈,或複數個此等者,或其組合)自一個角度投影至所關注物件表面上,且使用一成像感測器或一個以上成像感測器以自不同角度檢視反射光圖案。角差將形成用以求出自使光圖案反射之物件表面至光圖案產 生源之距離的基礎。成像感測器典型地為攝影機,但可使用其他光敏性感測器。最常見的光源將為用於產生雷射圓點、雷射線或其他圖案之雷射。亦可使用產生相似光照效應(被稱為結構光照(structural lighting))之其他光源。成像感測器之相似設置亦應用於如下情形:可在測量垂直於另一物件(諸如,油墨施配針狀物)之平面上之圖案的同時避免對該物件(例如,該針狀物)之機械干涉。在此狀況下可使用均一區域照明:定向(具有預定入射角)抑或非定向(亦即,陰天照明)。 Among many technical approaches, the most common technique is called triangulation, where a structured light pattern (such as a bright dot, a bright line, a cross, a circle, or a plurality of such) , or a combination thereof, is projected from an angle onto the surface of the object of interest, and an imaging sensor or more than one imaging sensor is used to view the reflected light pattern from different angles. The angular difference will be formed to determine the surface of the object that reflects the light pattern to the light pattern. The basis of the distance from the source. The imaging sensor is typically a camera, but other photosensitive sensors can be used. The most common source of light will be a laser used to create laser dots, lightning rays or other patterns. Other sources that produce similar illumination effects (known as structural lighting) can also be used. A similar arrangement of imaging sensors also applies to situations where the object (eg, the needle) can be avoided while measuring a pattern perpendicular to the plane of another object, such as an ink dispensing needle. Mechanical interference. Uniform area illumination can be used in this situation: orientation (with a predetermined angle of incidence) or non-orientation (ie, cloudy illumination).

該途徑(使成像感測器與光照平面或經光照平面成角度)為吾人所熟知且被良好地實踐。然而,此途徑具有一些不當特性。第一,光或光圖案(來自光源)之投影與由成像感測器反射之光或光圖案之檢視之間的角度差(被稱作測量角)對測量解析度係關鍵的。使用小於90度之角度的已知途徑放大成像平面之一部分中的大小且縮減成像平面之另一部分中的大小;然而,此情形引起總影像解析度縮減。第二,測量角亦判定三角測量計算中之數學模型的複雜性。對於小於90度之測量角,該模型複雜,此在於:其涉及至少三角變換。 This approach (making the imaging sensor at an angle to the illumination plane or the illuminated plane) is well known and well practiced. However, this approach has some improper characteristics. First, the angular difference between the projection of the light or light pattern (from the light source) and the inspection of the light or light pattern reflected by the imaging sensor (referred to as the measurement angle) is critical to the measurement resolution. A known approach using an angle of less than 90 degrees magnifies the size in one portion of the imaging plane and reduces the size in another portion of the imaging plane; however, this situation causes a reduction in overall image resolution. Second, the measurement angle also determines the complexity of the mathematical model in the triangulation calculation. For measurement angles less than 90 degrees, the model is complex in that it involves at least a triangular transformation.

因此,需要一種克服上文所闡述之問題中之一或多者的改良型輪廓及尺寸測量系統及方法。 Accordingly, there is a need for an improved profile and size measurement system and method that overcomes one or more of the problems set forth above.

前述論述僅意欲說明本領域且不應被視為否認申請專利範圍範疇。 The foregoing discussion is intended to be illustrative only and is not to be construed as a

依據本發明之教示的具體實例提供一種用於物件之輪廓及尺寸測量的系統及方法,其依靠至少具有經移位透鏡之偏移影像獲取總成而至少以光平面或經光照平面及成像平面(其中俘獲影像)之平行性為特徵。 A specific example in accordance with the teachings of the present invention provides a system and method for contouring and dimensioning an object that relies on an offset image acquisition assembly having at least a shifted lens, at least in a light plane or a light plane and an imaging plane The parallelism of the captured image is characteristic.

在一具體實例中,提供一種用於判定一物件之一輪廓的系 統。該系統包括一照明總成、一影像獲取總成,及一資料單元。該照明總成經組態以將一光平面投影至該物件之一外部表面上。該影像獲取總成包括一成像感測器及一透鏡。該成像感測器經組態以俘獲一成像平面之一影像,其中該成像平面實質上平行於該光平面且位於該光平面中。該透鏡具有一主軸線且安置於該光平面與該成像感測器之間。該透鏡係相對於該成像感測器而定位成使得該主軸線自一感測器軸線偏移,其中該感測器軸線實質上垂直於該成像感測器且穿過該成像感測器之一中心。該資料單元(典型地為具有一顯示器之一電腦,或單獨地為一顯示器)經組態以接收該經俘獲影像且使用至少該經俘獲影像來形成該輪廓。 In a specific example, a system for determining the contour of an object is provided System. The system includes a lighting assembly, an image acquisition assembly, and a data unit. The illumination assembly is configured to project a light plane onto an exterior surface of one of the objects. The image acquisition assembly includes an imaging sensor and a lens. The imaging sensor is configured to capture an image of an imaging plane, wherein the imaging plane is substantially parallel to the optical plane and is located in the optical plane. The lens has a major axis and is disposed between the light plane and the imaging sensor. The lens is positioned relative to the imaging sensor such that the major axis is offset from a sensor axis, wherein the sensor axis is substantially perpendicular to the imaging sensor and passes through the imaging sensor One center. The data unit (typically a computer having one display, or a single display) is configured to receive the captured image and use at least the captured image to form the contour.

亦呈現一種形成一物件之一外部表面之一輪廓的方法。 A method of forming a contour of an outer surface of an object is also presented.

在另一具體實例中,提供一種用於在主軸線(該軸線垂直於一物件且穿過該物件之中心)由另一物件佔據時判定該物件之平面特徵(諸如,2D投影尺寸或形狀)的系統。該系統包括一照明總成、一影像獲取總成,及一資料單元。該照明總成經組態以將一平面光投影至該物件之表面上且形成經光照平面。該影像獲取總成包括一成像感測器及一透鏡。該成像感測器經組態以俘獲一成像平面之一影像,其中該成像平面實質上平行於該經光照平面且位於該經光照平面中。該透鏡具有一主軸線且安置於該經光照平面與該成像感測器之間。該透鏡係相對於該成像感測器而定位成使得該主軸線自一感測器軸線偏移,其中該感測器軸線實質上垂直於該成像感測器且穿過該成像感測器之一中心。該資料單元(典型地為具有一顯示器之一電腦,或單獨地為一顯示器)經組態以接收該經俘獲影像且使用至少該經俘獲影像來形成輪廓、外形或其他平面特徵。 In another embodiment, a method is provided for determining a planar feature (such as a 2D projection size or shape) of an object when the main axis (which is perpendicular to an object and passing through the center of the object) is occupied by another object. system. The system includes a lighting assembly, an image acquisition assembly, and a data unit. The illumination assembly is configured to project a planar light onto a surface of the object and form a illuminated plane. The image acquisition assembly includes an imaging sensor and a lens. The imaging sensor is configured to capture an image of an imaging plane, wherein the imaging plane is substantially parallel to the illuminated plane and is located in the illuminated plane. The lens has a major axis and is disposed between the illuminated plane and the imaging sensor. The lens is positioned relative to the imaging sensor such that the major axis is offset from a sensor axis, wherein the sensor axis is substantially perpendicular to the imaging sensor and passes through the imaging sensor One center. The data unit (typically a computer having one display, or a single display) is configured to receive the captured image and use at least the captured image to form a contour, shape, or other planar feature.

自閱讀以下描述及申請專利範圍後,且自檢閱隨附圖式後,本發明之前述及其他態樣、特徵、細節、效用及優點將顯而易見。 The above and other aspects, features, details, utilities and advantages of the present invention will be apparent from the description and appended claims.

10‧‧‧三維物件 10‧‧‧3D objects

12‧‧‧外部表面 12‧‧‧External surface

14‧‧‧輪廓探測系統 14‧‧‧Contour detection system

14a‧‧‧輪廓探測系統 14a‧‧‧Contour detection system

16‧‧‧複合輪廓 16‧‧‧Complex profile

18‧‧‧照明總成 18‧‧‧Lighting assembly

20‧‧‧光線源 20‧‧‧Light source

20a‧‧‧光平面源 20a‧‧‧Light plane source

22‧‧‧光平面 22‧‧‧Light plane

24‧‧‧影像 24‧‧‧ images

241‧‧‧第一影像 24 1 ‧‧‧First image

242‧‧‧第二影像 24 2 ‧‧‧Second image

243‧‧‧第三影像 24 3 ‧‧‧ Third image

26‧‧‧輪廓區段 26‧‧‧ Outline section

261‧‧‧第一輪廓區段 26 1 ‧‧‧First contour section

262‧‧‧第二輪廓區段 26 2 ‧‧‧Second contour section

263‧‧‧第三輪廓區段 26 3 ‧‧‧The third contour section

28‧‧‧影像獲取總成 28‧‧‧Image acquisition assembly

281‧‧‧影像獲取總成 28 1 ‧‧‧Image acquisition assembly

282‧‧‧影像獲取總成 28 2 ‧‧‧Image acquisition assembly

283‧‧‧影像獲取總成 28 3 ‧‧‧Image acquisition assembly

30‧‧‧透鏡 30‧‧‧ lens

32‧‧‧主軸線 32‧‧‧Main axis

34‧‧‧感測器軸線 34‧‧‧Sensor axis

36‧‧‧第一預定距離 36‧‧‧First predetermined distance

38‧‧‧第二預定距離 38‧‧‧second predetermined distance

40‧‧‧成像感測器 40‧‧‧ imaging sensor

41‧‧‧點線 41‧‧‧ dotted line

42‧‧‧經聚焦成像平面 42‧‧‧Focused imaging plane

421‧‧‧經聚焦成像平面 42 1 ‧‧‧Focused imaging plane

422‧‧‧經聚焦成像平面 42 2 ‧‧‧Focused imaging plane

423‧‧‧經聚焦成像平面 42 3 ‧‧‧Focused imaging plane

44‧‧‧預定大小/範圍 44‧‧‧Predetermined size/range

46‧‧‧第三預定距離 46‧‧‧ third predetermined distance

48‧‧‧資料單元 48‧‧‧data unit

50‧‧‧電子處理器 50‧‧‧Electronic processor

52‧‧‧記憶體 52‧‧‧ memory

54‧‧‧輪廓產生器 54‧‧‧ contour generator

56‧‧‧環形本體/環本體 56‧‧‧Circular body/ring body

58‧‧‧雷射 58‧‧‧Laser

601‧‧‧第一共同點 60 1 ‧ ‧ first common point

602‧‧‧第二共同點 60 2 ‧‧‧second common point

603‧‧‧第三共同點 60 3 ‧‧‧ Third common point

310‧‧‧天線材料層/經印刷物件 310‧‧‧Antenna material layer / printed object

312‧‧‧基板 312‧‧‧Substrate

314‧‧‧XY台 314‧‧‧XY

328‧‧‧影像獲取總成 328‧‧‧Image acquisition assembly

330‧‧‧透鏡 330‧‧‧ lens

340‧‧‧成像感測器 340‧‧‧ imaging sensor

341‧‧‧左側視場距離 341‧‧‧left field of view distance

343‧‧‧右側視場距離 343‧‧‧ Right field of view distance

351‧‧‧泵 351‧‧‧ pump

352‧‧‧容器 352‧‧‧ Container

353‧‧‧裝置 353‧‧‧ device

354‧‧‧空氣/油墨混合物 354‧‧‧Air/ink mixture

355‧‧‧針狀物 355‧‧‧ needle

356‧‧‧氣溶膠噴霧 356‧‧‧ aerosol spray

388‧‧‧第二影像獲取總成 388‧‧‧Second image acquisition assembly

A‧‧‧縱向軸線 A‧‧‧ longitudinal axis

圖1A為用於判定物件之輪廓的系統之具體實例的圖解及示意視圖。 Figure 1A is a diagrammatic and schematic view of a specific example of a system for determining the contour of an object.

圖1B為使用圖1A之系統而俘獲之影像的圖解視圖,其展示對應於物件輪廓之部分的區段。 FIG. 1B is a diagrammatic view of an image captured using the system of FIG. 1A, showing a section corresponding to a portion of the contour of the object.

圖1C為圖1A之部分的放大。 Figure 1C is an enlargement of the portion of Figure 1A.

圖2為資料單元之實施例項。 2 is an embodiment of a data unit.

圖3為用於判定物件之輪廓之替代配置的圖解及示意視圖。 Figure 3 is a diagrammatic and schematic view of an alternate configuration for determining the contour of an object.

圖4為習知雷射三角測量輪廓測量系統的圖解及示意視圖。 4 is a diagram and schematic view of a conventional laser triangulation profile measurement system.

圖5至圖7分別為用於判定物件之輪廓的系統之另一具體實例的前圖解視圖、後圖解視圖及側圖解視圖,該系統使用適合於判定三維物件之圓周之輪廓的多個偏移影像獲取總成。 5 through 7 are front, rear, and side plan views, respectively, of another embodiment of a system for determining the contour of an object using a plurality of offsets suitable for determining the contour of the circumference of the three-dimensional object. Image acquisition assembly.

圖8A至圖8C為展示使用圖5至圖7之具體實例而俘獲的各別影像上之複數個分離輪廓區段的簡化圖解視圖,且此等輪廓區段對應於物件輪廓之各別部分。 8A-8C are simplified pictorial views showing a plurality of discrete contour segments on respective images captured using the specific examples of FIGS. 5-7, and such contour segments correspond to respective portions of the contour of the object.

圖8D為展示圖8A至圖8C之複數個區段之組合的簡化圖解視圖。 Figure 8D is a simplified pictorial view showing a combination of the plurality of segments of Figures 8A-8C.

圖9為展示形成物件之輪廓之方法的流程圖。 Figure 9 is a flow chart showing a method of forming an outline of an object.

圖10說明當前設計之微印表機。 Figure 10 illustrates the currently designed microprinter.

圖11說明使用透鏡移位之設計的微印表機。 Figure 11 illustrates a microprinter using a lens shift design.

在進行具體實例之詳細描述之前,首先將闡述用於輪廓測量之系統及方法的一般綜述。如【先前技術】所描述,已知的是在輪廓測量系統中使用小於90度之測量角。然而,如本文所闡述,當測量角為90度時測量解析度可最大化,且另外,當測量角為90度時用以判定物件輪廓及尺寸之數學模型變得簡化。然而,用於輪廓測量之已知系統(特別是具有掃描功能之系統)不使用90度之測量角。原因係至少雙重的。 Before proceeding with the detailed description of specific examples, a general overview of systems and methods for contour measurement will first be described. As described in [Prior Art], it is known to use a measurement angle of less than 90 degrees in a profile measurement system. However, as explained herein, the measurement resolution can be maximized when the measurement angle is 90 degrees, and in addition, the mathematical model for determining the contour and size of the object becomes simplified when the measurement angle is 90 degrees. However, known systems for profile measurement (especially systems with scanning capabilities) do not use a 90 degree measurement angle. The reason is at least double.

第一,更需要使光投影抑或成像感測器垂直於正被測量之物件表面。此情形將縮減掃描之數學。第二,大測量角可造成硬體干涉正被掃描之物件,除非視場之良好部分被浪費。結果,基於三角測量之典型輪廓測量裝置經設計成具有約30度至60度之測量角。一些輪廓測量裝置甚至可具有在此範圍外之角度。結果,如由成像感測器所檢視,測量平面(亦即,經投影光圖案之光行進地點)中之光學解析度將係部位相依的。即,若物件表面在測量平面之不同部位處截取經投影光圖案,則像素空間中之測量結果將不同。此外,需要一聚焦深度,此係因為測量平面偏離成像平面。高光學解析度(典型地具有較淺聚焦深度)可限制測量範圍或引起額外測量變化。對於穩定之物件,此情形可能並不係非常關鍵的。然而,對於待測量物件可在測量平面中實質上移動之一些應用,真實三維(3D)校準可為一問題。 First, it is more desirable to have the light projection or imaging sensor perpendicular to the surface of the object being measured. This situation will reduce the math of the scan. Second, large measurement angles can cause hardware to interfere with objects being scanned unless a good portion of the field of view is wasted. As a result, a typical profile measuring device based on triangulation is designed to have a measurement angle of about 30 to 60 degrees. Some profile measuring devices may even have angles outside of this range. As a result, the optical resolution in the measurement plane (i.e., the location of travel of the light through the projected light pattern) will be part dependent, as viewed by the imaging sensor. That is, if the surface of the object intercepts the projected light pattern at different portions of the measurement plane, the measurement results in the pixel space will be different. In addition, a depth of focus is required because the measurement plane is offset from the imaging plane. High optical resolution (typically with a shallow depth of focus) can limit the measurement range or cause additional measurement variations. For stable objects, this situation may not be critical. However, true three-dimensional (3D) calibration can be a problem for some applications where the object to be measured can move substantially in the measurement plane.

根據本發明之教示的具體實例使用實質上90度之測量角,使得測量平面中之像素解析度將實質上均一。另外,成像感測器上之主動成像區域的較大部分將可用於測量平面中之成像,從而增加解析度(亦即,用於物件上之俘獲的像素,例如,該等像素之全部或至少大多數)。根據本教示之具體實例的特徵為用於輪廓測量(使用三角測量)之系統,該系統使用實質上90度之測量角(或實質上使用90度之測量角),以及完全地利用成像感測器之主動成像區域。 A specific example in accordance with the teachings of the present invention uses a measurement angle of substantially 90 degrees such that the pixel resolution in the measurement plane will be substantially uniform. Additionally, a larger portion of the active imaging area on the imaging sensor will be available for imaging in the measurement plane, thereby increasing resolution (ie, for capturing pixels on the object, eg, all or at least of the pixels) most). A feature according to a specific example of the present teachings is a system for contour measurement (using triangulation) that uses a measurement angle of substantially 90 degrees (or substantially a measurement angle of 90 degrees) and fully utilizes imaging sensing The active imaging area of the device.

用於判定物件(例如,可為三維物件)之輪廓的系統之具體實例可用於數個有用目的,例如,用於製造處理序中以確認或驗證出物件之製造符合預定形狀及/或預定尺寸規格。僅舉例而言,此輪廓探測系統(profiling system)可用以判定圓形物件之「圓度」,或判定非圓形物件(比如,H型梁或軌道)之「形狀」。根據本教示之輪廓探測系統的具體實例可用於判定鋼物件之實際形狀。 Specific examples of systems for determining the contour of an article (e.g., can be a three-dimensional object) can be used for several useful purposes, for example, in a manufacturing process to confirm or verify that the article is manufactured to a predetermined shape and/or predetermined size. specification. By way of example only, this profiling system can be used to determine the "roundness" of a circular object or to determine the "shape" of a non-circular object (eg, an H-beam or track). Specific examples of contour detection systems in accordance with the present teachings can be used to determine the actual shape of a steel article.

圖1A及圖1C為根據本教示之輪廓探測系統14之具體實例的圖解及示意視圖,輪廓探測系統14用於判定具有外部表面12之三維物件10的輪廓16。物件10可沿著被表示為「A」之縱向軸線而延伸。在所說明具體實例中,系統14包括照明總成18、影像獲取總成28,及資料單元48。 1A and 1C are diagrammatic and schematic views of a specific example of a contour detection system 14 for determining a contour 16 of a three-dimensional object 10 having an exterior surface 12 in accordance with the present teachings. The article 10 can extend along a longitudinal axis designated "A". In the illustrated embodiment, system 14 includes illumination assembly 18, image acquisition assembly 28, and data unit 48.

照明總成18包括經組態以將光平面22投影至物件10之表面12上的至少一線源20,諸如,雷射線或具有相同效應之其他光線源。線源20可具有適合於選定成像感測器及透鏡的任何波長或多個波長之組合,其在紅外線、可見光或紫外線之區域中或被知道在0.01微米至1000微米之範圍內。在不損失一般性的情況下,本發明將採用術語「雷射」作為線源20。光平面22亦被稱為上文所描述之測量平面。在所說明具體實例中,源20係相對於物件10而配置成使得光平面22實質上垂直於物件10之外部表面12,且因此垂直於縱向軸線「A」。在此狀況下,光平面與測量平面(亦即,光平面照射至物件之表面上所處的平面)將相同。光平面22與物件10之表面12相互作用,其中物件10可由影像獲取總成28成像,此將在下文予以描述。應理解,若物件10之橫截面幾何形狀需要來自多個照明角之光照以提取物件10之輪廓或輪廓之區段,則光平面22係可藉由一個以上線源20而形成,且由多個線源20發射之光實質上位於光平面22中。 The illumination assembly 18 includes at least one line source 20 configured to project the light plane 22 onto the surface 12 of the object 10, such as a lightning ray or other source of light having the same effect. Line source 20 can have any wavelength or combination of wavelengths suitable for the selected imaging sensor and lens, either in the infrared, visible or ultraviolet region or known to be in the range of 0.01 microns to 1000 microns. The present invention will use the term "laser" as the line source 20 without loss of generality. Light plane 22 is also referred to as the measurement plane described above. In the illustrated embodiment, source 20 is configured relative to object 10 such that light plane 22 is substantially perpendicular to outer surface 12 of article 10, and thus perpendicular to longitudinal axis "A." In this case, the light plane and the measurement plane (i.e., the plane in which the light plane illuminates onto the surface of the object) will be the same. The light plane 22 interacts with the surface 12 of the object 10, wherein the object 10 can be imaged by the image capture assembly 28, as will be described below. It should be understood that if the cross-sectional geometry of the object 10 requires illumination from multiple illumination angles to extract a segment or contour of the object 10, the light plane 22 can be formed by more than one line source 20, and The light emitted by the line source 20 is substantially located in the light plane 22.

影像獲取總成28包含透鏡30(例如,會聚透鏡或具有相似功能之透鏡)及成像感測器40,透鏡30及成像感測器40兩者可包含習知構造。僅舉例而言,成像感測器40可包含(僅舉幾個例子)電荷耦合裝置(charge-coupled device,CCD)、互補金屬氧化物半導體(complementary metal-oxide semiconductor,CMOS)裝置,或視訊攝影管(video camera tube)。影像獲取總成28經組態以俘獲經聚焦成像平面42之影像24(圖1B最佳地所展示),此影像24將含有對應於由影像獲取總成28成像之輪廓16之部分的輪廓區段26。在所說明具體實例中,影像獲取總成28(特別是透鏡30 及成像感測器40)係相對於源20而配置成使得經聚焦成像平面42實質上位於光平面22與物件10之外部表面12相互作用所處的測量平面中。換言之,經聚焦成像平面42實質上平行於光平面22(亦即,所說明具體實例中之測量平面)且位於光平面22中。 The image acquisition assembly 28 includes a lens 30 (eg, a converging lens or lens having similar functions) and an imaging sensor 40, both of which may comprise conventional constructions. By way of example only, imaging sensor 40 may comprise, by way of example only, a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS) device, or a video camera. Video camera tube. Image acquisition assembly 28 is configured to capture image 24 of the focused imaging plane 42 (best shown in FIG. 1B) that will contain contour regions corresponding to portions of contour 16 imaged by image acquisition assembly 28. Paragraph 26. In the illustrated embodiment, the image acquisition assembly 28 (particularly the lens 30) The imaging sensor 40) is configured relative to the source 20 such that the focused imaging plane 42 is substantially located in the measurement plane in which the light plane 22 interacts with the exterior surface 12 of the object 10. In other words, the focused imaging plane 42 is substantially parallel to the light plane 22 (i.e., the measurement plane in the particular example illustrated) and is located in the light plane 22.

另外,透鏡30相對於成像感測器40而偏中心,就好像成像感測器40較大(在圖1A中被說明為點線41,且出於細節起見而在圖1C中被較佳地放大)且以透鏡30為中心。透鏡30具有與其相關聯之主軸線32。另外,成像感測器40亦具有與其相關聯之感測器軸線34,感測器軸線34實質上垂直於成像感測器40之平面且穿過成像感測器40之中心。藉由將透鏡30在光平面22與成像感測器40之間安置成使得主軸線32自感測器軸線34偏移達第一預定距離36而達成偏移。影像獲取總成28(亦即,透鏡/感測器)自縱向軸線「A」徑向地偏移達第二預定距離38。由於此等關係,成像平面42之特徵為預定大小/範圍44,如圖1A中由擴展虛線圍封之體積所展示。可在兩個維度上描述成像平面42之大小,例如,在垂直維度或Y軸線上描述為第三預定距離46且在水平維度或X軸線上描述為另外預定距離(圖1A中未示,但將被視為延伸進/出頁面)。實務上,吾人可將透鏡30定位成居中至點線41(假定較大成像感測器)以達成預期成像平面42所處的較大視場,且接著將實際成像感測器40在點線41內定位於使得實際視場映射至預期成像平面42之位置處。熟習此項技術者將瞭解如下事實:成像平面42之大小及位置係藉由成像感測器40之大小及位置、透鏡30之光學屬性、預定距離以及諸如視線之已知光學規則而判定。 Additionally, lens 30 is off center with respect to imaging sensor 40 as if imaging sensor 40 is larger (illustrated as dotted line 41 in Figure 1A, and is preferred in Figure 1C for purposes of detail). Zoomed in and centered on the lens 30. Lens 30 has a major axis 32 associated therewith. In addition, imaging sensor 40 also has a sensor axis 34 associated therewith that is substantially perpendicular to the plane of imaging sensor 40 and passes through the center of imaging sensor 40. The offset is achieved by locating the lens 30 between the light plane 22 and the imaging sensor 40 such that the main axis 32 is offset from the sensor axis 34 by a first predetermined distance 36. Image acquisition assembly 28 (i.e., lens/sensor) is radially offset from longitudinal axis "A" by a second predetermined distance 38. Because of these relationships, imaging plane 42 is characterized by a predetermined size/range 44, as shown by the volume enclosed by the expanded dashed line in Figure 1A. The size of the imaging plane 42 can be described in two dimensions, for example, as a third predetermined distance 46 on the vertical or Y axis and as a further predetermined distance on the horizontal or X axis (not shown in Figure 1A, but Will be treated as an extension into/out page). In practice, the person can position the lens 30 to center to the dotted line 41 (assuming a larger imaging sensor) to achieve a larger field of view where the intended imaging plane 42 is located, and then place the actual imaging sensor 40 at the dotted line. The position within 41 is such that the actual field of view is mapped to the desired imaging plane 42. Those skilled in the art will be aware of the fact that the size and position of the imaging plane 42 is determined by the size and position of the imaging sensor 40, the optical properties of the lens 30, the predetermined distance, and known optical rules such as line of sight.

資料單元48經組態以自影像獲取總成28接收及處理影像24,且形成輪廓16。在一具體實例中,資料單元48為可將影像自影像獲取總成28分配至適合於使用者觀測輪廓16之對應顯示器(圖1中未示)的視訊信號組織裝置,諸如,視訊多工器。輪廓區段26對應於輪廓16之部分, 且指示光平面22照射於物件10之外部表面12上之處。因此,產生複數個輪廓區段26之複數個影像獲取總成28可配置於複數個顯示器(圖1中未示)上,使得輪廓區段26在該等顯示器上形成物件10之全輪廓16。 The data unit 48 is configured to receive and process the image 24 from the image acquisition assembly 28 and form a contour 16. In one embodiment, the data unit 48 is a video signal organization device that can distribute images from the image acquisition assembly 28 to a corresponding display (not shown in FIG. 1) suitable for the user to view the contour 16, such as a video multiplexer. . The contour section 26 corresponds to a portion of the contour 16 And indicating that the light plane 22 is incident on the outer surface 12 of the article 10. Thus, the plurality of image acquisition assemblies 28 that produce the plurality of contour segments 26 can be disposed on a plurality of displays (not shown in FIG. 1) such that the contour segments 26 form a full outline 16 of the object 10 on the displays.

然而,熟習此項技術者將瞭解電子處理領域之進步,且應理解,如圖2所說明,一替代具體實例係使資料單元48包括一或多個電子處理器50(其可屬於習知構造)以及一關聯記憶體52(其亦可屬於習知構造)。資料單元48可進一步包括輪廓產生器54,在一具體實例中,輪廓產生器54可包含儲存於記憶體52中之軟體,該軟體在由處理器50執行時經組態有規定程序及變換模型以處理影像24且判定影像24中含有之輪廓區段26(圖1B最佳地所展示)。在此具體實例中,產生複數個輪廓區段26之複數個影像獲取總成28可經配置成使得輪廓區段26在資料單元48中形成物件10之全輪廓16,之後在顯示器上形成物件10之全輪廓16。在又一替代具體實例中,輪廓產生器54可全部地或部分地包括替換或支援軟體之計算硬體以用於執行本文所描述之功能。 However, those skilled in the art will appreciate advances in the field of electronic processing, and it should be understood that, as illustrated in FIG. 2, an alternate embodiment is such that data unit 48 includes one or more electronic processors 50 (which may be of conventional construction) And an associated memory 52 (which may also be of a conventional construction). The data unit 48 may further include a contour generator 54 which, in one embodiment, may include software stored in the memory 52, the software being configured with a prescribed program and a transformation model when executed by the processor 50 The image 24 is processed and the contour section 26 contained in the image 24 is determined (best shown in FIG. 1B). In this particular example, the plurality of image acquisition assemblies 28 that generate the plurality of contour segments 26 can be configured such that the contour segments 26 form the full contour 16 of the article 10 in the data unit 48, after which the article 10 is formed on the display. Full outline 16. In yet another alternative embodiment, the contour generator 54 may include, in whole or in part, a computing hardware that replaces or supports the software for performing the functions described herein.

現在參看圖1A至圖1C,依據本教示之具體實例有利,此係因為成像平面42平行於光平面22。此關係將引起線性測量模型以及測量平面中之均一像素解析度。在測量平面上可存在用於最佳測量結果之最佳化聚焦,此係因為測量平面不偏離成像平面42。亦即,本教示中之所需聚焦深度實質上接近0。此情形特別適合於涉及高光學解析度之應用。當組合複數個輪廓區段以形成一完整輪廓時,此配置亦將簡化三維(3D)校準,如下文更詳細地所描述。透鏡30相對於成像感測器40(及物件10)之偏移使成像平面42相對於成像感測器40適當地定位,使得完整範圍44(亦即,成像平面42之大小)完全地可用於對物件10之輪廓測量,同時提供沿著軸線「A」用於物件10之清晰移動路徑,而不以其他方式干涉諸如影像獲取總成28之其他物件。 Referring now to Figures 1A-1C, it is advantageous in accordance with the specific embodiments of the present teachings that the imaging plane 42 is parallel to the light plane 22. This relationship will result in a linear measurement model and uniform pixel resolution in the measurement plane. There may be an optimized focus for the best measurement on the measurement plane, since the measurement plane does not deviate from the imaging plane 42. That is, the desired depth of focus in the present teaching is substantially close to zero. This situation is particularly suitable for applications involving high optical resolution. This configuration will also simplify three-dimensional (3D) calibration when combining multiple contour segments to form a complete contour, as described in more detail below. The offset of the lens 30 relative to the imaging sensor 40 (and the object 10) causes the imaging plane 42 to be properly positioned relative to the imaging sensor 40 such that the full range 44 (i.e., the size of the imaging plane 42) is fully available The contour of the object 10 is measured while providing a clear path of movement along the axis "A" for the object 10 without otherwise interfering with other items such as the image capture assembly 28.

圖3展示未完全地達成圖1A之具體實例之優點的替代配置。在透鏡30定位於典型居中位置中(亦即,主透鏡軸線與感測器軸線重合)的情況下,如圖3所說明,成像平面42將具有較大範圍,其被展示為相比於圖1A之具體實例具有較大垂直延伸區。然而,此替代配置達成較不理想之光學解析度,此係因為如圖3所展示的單獨地沿著Y軸線之成像平面42的大約50%或更多將由於對成像感測器40(及亦對透鏡30)之水平干涉而不可用。 FIG. 3 shows an alternative configuration that does not fully achieve the advantages of the specific example of FIG. 1A. Where the lens 30 is positioned in a typical centered position (ie, the main lens axis coincides with the sensor axis), as illustrated in Figure 3, the imaging plane 42 will have a larger range, which is shown as compared to the figure A specific example of 1A has a large vertical extent. However, this alternative configuration achieves less desirable optical resolution because approximately 50% or more of the imaging plane 42 along the Y axis alone as shown in FIG. 3 will be due to the imaging sensor 40 (and Horizontal interference to lens 30) is also not available.

圖4展示此項技術中所知之輪廓測量設置的習知配置。圖4中之成像平面42不平行於測量平面。雖然在此配置中成像平面42中之像素解析度均一,但如由成像感測器40所檢視的至測量平面上之經投影像素解析度將均一。 Figure 4 shows a conventional configuration of profile measurement settings as known in the art. The imaging plane 42 in Figure 4 is not parallel to the measurement plane. Although this configuration of the imaging plane 42 pixel resolution uniform, but as the imaging sensor 40 to measure the viewing plane through the projection on the pixel resolution will not be uniform.

在另外具體實例中,輪廓探測系統(在下文中為系統14a)併入經組態以圍繞物件之圓周而投影光平面的經修改照明總成18,以及經組態以圍繞物件之圓周而成像的多個影像獲取總成28。如此組態之系統14a能夠圍繞物件之整個圓周而完全地進行輪廓探測。 In another specific example, a contour detection system (hereinafter system 14a) incorporates a modified illumination assembly 18 that is configured to project a light plane around the circumference of the object, and is configured to image around the circumference of the object. Multiple images acquire assembly 28. The system 14a thus configured is capable of completely performing contour detection around the entire circumference of the object.

圖5至圖7為用於圍繞三維物件10之整個圓周而判定輪廓之系統14a的等角視圖。系統14a包括光平面源20a,光平面源20a相似於圖1A中之光線源20,但其經特定地組態以圍繞物件10之整個圓周而投影光平面22。在一具體實例中,光平面源20a包括環形(亦即,環)本體56,圍繞環形本體56安置有複數個雷射58。每一雷射58產生一各別雷射線。雷射58配置於環本體56上且對準(每一雷射相對於其他雷射而對準),使得由雷射58產生之複數個雷射線皆實質上位於光平面22中。 5 through 7 are isometric views of a system 14a for determining a contour around the entire circumference of the three-dimensional object 10. System 14a includes a light plane source 20a that is similar to light source 20 in FIG. 1A, but that is specifically configured to project light plane 22 around the entire circumference of object 10. In one embodiment, the light plane source 20a includes an annular (i.e., ring) body 56 with a plurality of lasers 58 disposed about the annular body 56. Each laser 58 produces a respective Ray Ray. The lasers 58 are disposed on the ring body 56 and aligned (each laser is aligned with respect to other lasers) such that a plurality of lightning rays generated by the laser 58 are substantially located in the light plane 22.

系統14a進一步包括類似於圖1A所展示之影像獲取總成的複數個影像獲取總成28。作為一實例,在不損失一般性的情況下,系統14a之所說明具體實例包括相對於縱向軸線「A」圓周地配置之三個影像獲取總 成281、282及283。每一影像獲取總成281、282及283自軸線「A」徑向地偏移達第二預定距離38(正如圖1A中之總成28一樣)。在所說明具體實例中,三個影像獲取總成281、282及283係以大約120度之間隔(圍繞軸線「A」均勻地)進行配置。 System 14a further includes a plurality of image acquisition assemblies 28 similar to the image acquisition assembly shown in FIG. 1A. As an example, the illustrated example of system 14a includes three image acquisition assemblies 28 1 , 28 2 , and 28 3 circumferentially disposed relative to the longitudinal axis "A" without loss of generality. Each of the image acquisition assemblies 28 1 , 28 2 , and 28 3 is radially offset from the axis "A" by a second predetermined distance 38 (as in assembly 28 of Figure 1A). In the illustrated embodiment, the three image acquisition assemblies 28 1 , 28 2 , and 28 3 are configured at intervals of approximately 120 degrees (evenly about the axis "A").

然而,應理解,雖然在所說明具體實例中使用三個影像獲取總成281、282及283以用於圓形物件之完整輪廓探測,但在其他具體實例中可使用更多或更少影像獲取總成,此取決於至少(i)物件之形狀,及(ii)所要輸出輪廓。舉例而言,在一些具體實例中,可使用六個、七個、八個或八個以上影像獲取總成,例如,對於某些複雜形狀,諸如,「H」型樑或軌道。將基於物件10之橫截面幾何形狀而使多個影像獲取總成之採用最佳化。總成28之位置圍繞物件10之圓周可能或可能不均勻地隔開。用於總成28之第二預定距離38可針對總成28中每一者被個別地選擇,且無需相同。 However, it should be understood that although three image acquisition assemblies 28 1 , 28 2 , and 28 3 are used in the illustrated embodiment for full contour detection of circular objects, more or more may be used in other embodiments. The image acquisition assembly is less dependent on at least (i) the shape of the object, and (ii) the desired contour to be output. For example, in some embodiments, six, seven, eight, or more image acquisition assemblies may be used, for example, for certain complex shapes, such as "H" beams or tracks. The use of multiple image acquisition assemblies will be optimized based on the cross-sectional geometry of the object 10. The position of the assembly 28 may or may not be evenly spaced around the circumference of the article 10. The second predetermined distance 38 for the assembly 28 can be individually selected for each of the assemblies 28 and need not be the same.

影像獲取總成281、282及283中每一者俘獲各別成像平面421、422及423之各別影像241、242、243(圖8A至圖8C最佳地所展示)。儘管圖5至圖7中未示,但系統14a亦包括類似於系統14(圖1A)中之資料單元的資料單元48以一起處理影像241、242、243以形成輪廓16。在一些具體實例中,物件10可沿著軸線「A」而移動,而非靜止。 Image acquisition assembly 281, 282 and 283 of each of the respective image capturing plane 421, 422 and the respective images of 241 423, 242, 243 (FIGS. 8A to 8C best Shown). Although not shown in FIGS. 5-7, system 14a also includes a data unit 48 similar to the data unit in system 14 (FIG. 1A) to process images 24 1 , 24 2 , 24 3 together to form contour 16. In some embodiments, the article 10 can be moved along the axis "A" rather than stationary.

偏移影像獲取總成之一個優點係關於多個資料片段(影像241、242、243)可被處理及整合以形成複合輪廓16的簡易性。在習知配置中,每一影像獲取總成將具有其自有3D三角校準功能。在此等配置中,具有3個、4個或甚至8個成像器將會極大地使總系統校準處理序極快速地變複雜。 One advantage of the offset image acquisition assembly is the ease with which multiple data segments (images 24 1 , 24 2 , 24 3 ) can be processed and integrated to form the composite contour 16 . In a conventional configuration, each image acquisition assembly will have its own 3D triangulation function. In these configurations, having three, four, or even eight imagers will greatly complicate the overall system calibration process.

在依據本發明之教示的具體實例中,自每一影像241、242、243獲得之輪廓資料(輪廓區段)可歸因於2維(2D)均一映射之可用性而被更容易地繫結在一起或被映射以形成複合輪廓。在該等具體實例中,來 自多個影像獲取總成之多個(例如,三個)資料集的整合僅需要雷射平面之二維平面校準,而無需如在習知技術中之三維非線性校準。被表示為421、422、423的經聚焦成像平面之至少某些部分之重疊允許資料單元48基於來自影像獲取總成之輪廓區段之至少重疊部分而在2D上執行校準。 In a specific example in accordance with the teachings of the present invention, contour data (contour segments) obtained from each image 24 1 , 24 2 , 24 3 can be more easily attributed to the availability of 2-dimensional (2D) uniform mapping. Tied together or mapped to form a composite contour. In these specific examples, the integration of multiple (eg, three) data sets from multiple image acquisition assemblies requires only two-dimensional planar calibration of the laser plane without the need for three-dimensional nonlinearities as in the prior art. calibration. The overlap of at least some portions of the focused imaging planes represented as 42 1 , 42 2 , 42 3 allows the data unit 48 to perform calibration on 2D based on at least overlapping portions of the contour segments from the image acquisition assembly.

圖8A至圖8C為自各別影像獲取總成281、282及283獲得之影像241、242、243的簡化表示,其中影像241、242、243中每一者含有或以其他方式展示一各別輪廓區段261、262、263。關於系統14a,輪廓產生器54(執行於資料單元48中)經組態以判定分別在第一影像241、第二影像242及第三影像243中之第一輪廓區段261、第二輪廓區段262及第三輪廓區段263。輪廓區段261、262、263分別對應於物件10之複合輪廓16的第一部分、第二部分及第三部分。第一輪廓區段261、第二輪廓區段262及第三輪廓區段263中每一者可包含一各別二維輪廓區段,如所展示。 8A to 8C are images obtained from the respective assembly 281, 282 and 283 the image obtained of 241, 242, 243 to simplify the representation, wherein the images 241, 242, 243 contained in each Or otherwise present a respective contour section 26 1 , 26 2 , 26 3 . Regarding system 14a, contour generator 54 (implemented in data unit 48) is configured to determine first contour segments 26 1 in first image 24 1 , second image 24 2 , and third image 24 3 , respectively The second contour section 26 2 and the third contour section 26 3 . The contour sections 26 1 , 26 2 , 26 3 respectively correspond to the first portion, the second portion and the third portion of the composite profile 16 of the article 10. Each of the first contour section 26 1 , the second contour section 26 2 , and the third contour section 26 3 may include a respective two-dimensional contour section, as shown.

圖8D為複合輪廓16之圖解視圖。輪廓16係可藉由輪廓產生器54(執行於資料單元48上)而形成。為了判定複合輪廓,可將輪廓產生器54進一步組態有識別任何兩個鄰近輪廓區段之間的共同點及幾何特徵之校準處理序。作為圖8D所展示之實例,在不損失一般性的情況下,輪廓產生器54可識別(i)第一輪廓區段261與第二輪廓區段262之間的第一共同點601、(ii)第二輪廓區段262與第三輪廓區段263之間的第二共同點602,及(iii)第一輪廓區段261與第三輪廓區段263之間的第三共同點603。輪廓產生器54仍經進一步組態以藉由根據至少經識別之第一共同點601、第二共同點602及第三共同點603而使用至少第一輪廓區段261、第二輪廓區段262及第三輪廓區段263連同物件10之其他尺寸及幾何特徵(諸如,直徑)來形成物件10之輪廓16。應瞭解,在一具體實例中,可將第一影像241、第二影像242及第三影像243首先記錄至一共同座標系統。亦應瞭解,若物件10之橫截面為多邊形,則輪廓區段26可為比如正方形或六邊形之多邊形之 部分,使得在校準處理序期間較容易地識別共同點以及其他尺寸及幾何特徵(諸如,邊緣之角度及長度)。若提供具有已知尺寸及幾何特徵之物件10,則校準處理序將引起一變換模型,該變換模型將自由影像獲取總成28獲取之影像產生的輪廓區段26在複合輪廓16被建構的座標系統中變換成輪廓區段26'。每一影像獲取總成28將具有其自有唯一變換模型,使得來自不同影像獲取總成28之輪廓區段26變換至同一座標系統中以合併成複合輪廓16。所描述之校準處理序可伺服具有N個影像獲取總成28之系統,其中N為等於或大於2之整數。 FIG. 8D is a diagrammatic view of composite profile 16. The contour 16 can be formed by a contour generator 54 (implemented on data unit 48). To determine the composite profile, the profile generator 54 can be further configured with a calibration process that identifies common points and geometric features between any two adjacent profile segments. As an example shown in FIG. 8D, profile generator 54 may identify (i) a first common point 60 1 between first contour segment 26 1 and second contour segment 26 2 without loss of generality. (ii) a second common point 60 2 between the second contour section 26 2 and the third contour section 26 3 , and (iii) between the first contour section 26 1 and the third contour section 26 3 The third common point is 60 3 . The contour generator 54 is still further configured to use at least the first contour segment 26 1 , the second by utilizing at least the identified first common point 60 1 , the second common point 60 2 , and the third common point 60 3 The contour section 26 2 and the third contour section 26 3 together with other dimensions and geometric features (such as diameter) of the article 10 form the contour 16 of the article 10. It should be understood that in a specific example, the first image 24 1 , the second image 24 2 , and the third image 24 3 may be first recorded to a common coordinate system. It should also be appreciated that if the cross-section of the object 10 is a polygon, the contour section 26 can be part of a polygon such as a square or a hexagon, such that common points and other dimensions and geometric features are more easily identified during the calibration process ( Such as the angle and length of the edge). If an object 10 having known dimensions and geometric features is provided, the calibration process will result in a transformation model that coordinates the contour segment 26 produced by the image acquired by the free image acquisition assembly 28 at the composite contour 16 The system transforms into a contour section 26'. Each image acquisition assembly 28 will have its own unique transformation model such that contour segments 26 from different image acquisition assemblies 28 are transformed into the same coordinate system for merging into composite contours 16. The described calibration process can servo a system having N image acquisition assemblies 28, where N is an integer equal to or greater than two.

圖9為說明由系統14(或14a)執行以判定三維物件之輪廓之處理序的流程圖。該處理序在步驟62中開始。 Figure 9 is a flow diagram illustrating the processing sequence performed by system 14 (or 14a) to determine the contour of a three-dimensional object. The process sequence begins in step 62.

步驟62涉及將光平面投影至物件10之外部表面12上。可實質上如上文所闡述之具體實例中所描述來執行步驟62,例如,藉由操作至少一光線源以產生光平面22(例如,如在系統14中),或擴展該途徑以產生圍繞物件之整個圓周而照射至物件上的光平面22(例如,如在系統14a中)。該處理序前進至步驟64。 Step 62 involves projecting a light plane onto the outer surface 12 of the article 10. Step 62 can be performed substantially as described in the specific examples set forth above, for example, by operating at least one source of light to produce a light plane 22 (e.g., as in system 14), or extending the pathway to create a surrounding object The entire circumference is illuminated to the light plane 22 on the object (e.g., as in system 14a). The process proceeds to step 64.

步驟64涉及使用偏移影像獲取總成來俘獲成像平面之影像。可實質上如上文所闡述之具體實例中所描述來執行步驟64。成像平面42將實質上平行於光平面/測量平面,且透鏡之主軸線將自感測器軸線偏移,皆以達成上述有益效應。在一些具體實例中,可使用單一影像獲取總成以俘獲一影像,而在其他具體實例中,可使用多個影像獲取總成以俘獲複數個影像。該處理序接著前進至步驟66。 Step 64 involves capturing the image of the imaging plane using the offset image acquisition assembly. Step 64 can be performed substantially as described in the specific examples set forth above. The imaging plane 42 will be substantially parallel to the light plane/measurement plane, and the main axis of the lens will be offset from the sensor axis to achieve the beneficial effects described above. In some embodiments, a single image acquisition assembly can be used to capture an image, while in other embodiments, multiple image acquisition assemblies can be used to capture a plurality of images. The process sequence then proceeds to step 66.

步驟66涉及使用來自步驟64之該或該等經俘獲影像來形成可為三維物件之物件之輪廓。可實質上如上文所闡述之具體實例中所描述來執行步驟66。舉例而言,在系統14a之具體實例中,可由輪廓產生器54藉由如下各者來執行步驟66:(i)判定經俘獲影像中之輪廓區段;(ii)將 自校準處理序獲得之變換模型應用於該等輪廓區段;及(iii)組合該等輪廓區段。 Step 66 involves using the captured image from step 64 or the captured images to form an outline of the object that can be a three-dimensional object. Step 66 can be performed substantially as described in the specific examples set forth above. For example, in a particular example of system 14a, step 66 may be performed by contour generator 54 by (i) determining a contour segment in the captured image; (ii) A transformation model obtained from the self-calibration process is applied to the contour segments; and (iii) combining the contour segments.

可在一不同具體實例中組態系統14a,此在於:每一影像獲取總成28與一個照明總成18個別地耦接,且形成一輪廓掃描器。在輪廓掃描器內,照明總成18與影像獲取總成28之間的關係固定。可使用多個輪廓掃描器以形成具有系統14a之相同功能的系統。為了避免光平面之干涉,熟習此項技術者應知道,每一輪廓掃描器可裝備有具有唯一波長之一光平面,且可使用對應光學濾光器以選擇為特定輪廓掃描器所關注之光平面。另一途徑係使不同輪廓掃描器沿著軸線「A」而偏移。 The system 14a can be configured in a different embodiment in that each image acquisition assembly 28 is individually coupled to an illumination assembly 18 and forms a contour scanner. Within the contour scanner, the relationship between the illumination assembly 18 and the image acquisition assembly 28 is fixed. Multiple contour scanners can be used to form a system with the same functionality of system 14a. In order to avoid interference of the light plane, those skilled in the art will appreciate that each profile scanner can be equipped with a light plane having a unique wavelength and that a corresponding optical filter can be used to select the light of interest for a particular profile scanner. flat. Another way is to offset the different contour scanners along the axis "A".

本教示之輪廓探測功能性可單獨地及/或結合額外光學成像功能性予以使用,額外光學成像功能性係諸如表面檢測,諸如由表面檢測設備執行,表面檢測設備係(例如)類似於2002年12月27日申請之美國申請案第10/331,050號('050申請案)(現在為美國專利第6,950,546號)及2008年9月24日申請之美國申請案第12/236,886號('886申請案)(現在為美國專利第7,627,163號)中描述之檢測設備。'050申請案及'886申請案皆就好像在本文中被完全地闡述而據此以引用方式併入。 The profile detection functionality of the present teachings can be used alone and/or in conjunction with additional optical imaging functionality, such as surface inspection, such as performed by a surface inspection device, such as 2002. US Application No. 10/331,050 (the '050 Application) (now U.S. Patent No. 6,950,546) filed on Dec. 27, and U.S. Application Serial No. 12/236,886 filed on September 24, 2008 (the '886 application) The detection device described in the present invention (now U.S. Patent No. 7,627,163). Both the '050 application and the '886 application are hereby fully incorporated herein by reference.

應理解,如本文所描述,系統14(及系統14a)(特別是主要電子控制單元(亦即,資料單元48))可包括此項技術中所知之習知處理設備,該習知處理設備能夠執行儲存於關聯記憶體中之經預程式化指令,其皆根據本文所描述之功能性而執行。此電子控制單元可進一步屬於具有ROM、RAM、非揮發性及揮發性(可修改)記憶體之組合兩者的類型,使得可儲存任何軟體且任何軟體仍可允許儲存及處理經動態產生之資料及/或信號。應進一步理解,術語「頂部」、「底部」、「向上」、「向下」及其類似者係僅出於描述方便起見,且本質上不意欲為限制性的。 It should be understood that system 14 (and system 14a) (particularly the primary electronic control unit (i.e., data unit 48)), as described herein, can include conventional processing devices known in the art, such conventional processing devices Pre-programmed instructions stored in associated memory can be executed, all performed in accordance with the functionality described herein. The electronic control unit may further be of a type having a combination of ROM, RAM, non-volatile and volatile (modifiable) memory such that any software can be stored and any software can still store and process dynamically generated data. And / or signal. It should be further understood that the terms "top", "bottom", "upward", "downward" and the like are for convenience of description only and are not intended to be limiting in nature.

雖然已展示及描述一或多個特定具體實例,但熟習此項技術 者應理解,可在不脫離本教示之精神及範疇的情況下進行各種改變及修改。 Although one or more specific examples have been shown and described, this technique is familiar to It should be understood that various changes and modifications may be made without departing from the spirit and scope of the teachings.

本發明之教示鑒於諸如針對微印刷或3D印刷之線上測量及監視的其他應用亦有利。在不損失一般性的情況下,將使用氣溶膠針狀物來將微天線印刷於基板上用作一實例。圖10說明微天線印表機之現有設計。基板312典型地安裝於XY台314上,XY台314可根據命令而移動以將基板312相對於印表機中之其他固定裝置攜載至所要位置。典型地包括供應加壓空氣之泵351,其具有控制加壓空氣之純度、含量、壓力、體積及流率的能力。加壓空氣可經由裝置353處之文氏管(Venturi)效應而使來自容器352之油墨混合,該油墨為沈積物材料及溶劑之混合物。裝置353可包括允許控制空氣/油墨混合物354之比率的閥。空氣/油墨混合物流移動至典型地固定於印表機中之針狀物355中,且自該針狀物之末端逸出作為氣溶膠噴霧356。空氣充當油墨之載劑,且油墨將在基板之表面上停留於指定部位處且形成所要天線材料層310。空氣/油墨流之控制及XY台運動將在基板312上形成天線圖案。 The teachings of the present invention are also advantageous in view of other applications such as on-line measurement and monitoring for micro-printing or 3D printing. An aerosol needle will be used to print the micro-antenna on the substrate as an example without loss of generality. Figure 10 illustrates an existing design of a micro-antenna printer. Substrate 312 is typically mounted on XY stage 314, which can be moved according to commands to carry substrate 312 to a desired location relative to other fixtures in the printer. A pump 351 that supplies pressurized air is typically included that has the ability to control the purity, content, pressure, volume, and flow rate of the pressurized air. Pressurized air may mix ink from vessel 352 via a Venturi effect at device 353, which is a mixture of deposit material and solvent. Device 353 can include a valve that allows control of the ratio of air/ink mixture 354. The air/ink mixture stream is moved into a needle 355 that is typically affixed to the printer and escapes from the end of the needle as an aerosol spray 356. The air acts as a carrier for the ink and the ink will stay at the designated location on the surface of the substrate and form the desired layer of antenna material 310. Air/ink flow control and XY stage motion will form an antenna pattern on substrate 312.

為了驗證在天線圖案是否符合設計規格方面之印刷品質,典型地使用影像獲取總成328。雖然照明可在應用中經良好地設計成將均一照明投影至基板312上之所關注區域上,但在使用定向(例如,暗場或同軸光照)抑或非定向(例如,陰天光照)途徑的情況下,總成328經安置成使得其主軸線與氣溶膠針狀物之主軸線成角度,以避免機械干涉。歸因於此角度,基板312至影像獲取總成328之距離係部位相依的且可顯著地變化。如圖10所說明,左側視場距離341實質上小於右側視場距離343。結果,影像品質對於印表機常常不適當。變化之距離(341/343)造成影像中之不同像素解析度。此外,印刷之尺度常常在次微米至幾微米之範圍內,且聚焦深度在此光學解析度下很淺。淺聚焦深度限制自總成328獲取之影像的使用。在習知實踐中,出於經印刷天線圖案之準確尺寸測量及檢測之 目的而需要第二影像獲取總成388,其主軸線自氣溶膠針狀物偏移且垂直於基板312。然而,第二總成388在印刷期間不能提供任何資訊。 In order to verify the print quality in terms of whether the antenna pattern meets design specifications, image acquisition assembly 328 is typically used. While illumination can be well designed in applications to project uniform illumination onto the area of interest on the substrate 312, in the use of orientation (eg, dark or coaxial illumination) or non-directional (eg, cloudy) illumination. In the present case, the assembly 328 is positioned such that its major axis is at an angle to the main axis of the aerosol needle to avoid mechanical interference. Due to this angle, the distance between the substrate 312 and the image capture assembly 328 is dependent and can vary significantly. As illustrated in Figure 10, the left field of view distance 341 is substantially less than the right field of view distance 343. As a result, image quality is often inadequate for printers. The varying distance (341/343) causes different pixel resolutions in the image. In addition, the scale of printing is often in the range of submicron to a few microns, and the depth of focus is very shallow at this optical resolution. The shallow focus depth limits the use of images acquired from assembly 328. In the practice of practice, the accurate size measurement and detection of printed antenna patterns A second image acquisition assembly 388 is required for the purpose, with the main axis offset from the aerosol needle and perpendicular to the substrate 312. However, the second assembly 388 cannot provide any information during printing.

可使用本發明以解決此問題。圖11說明如下具體實例:用以在主軸線(該軸線垂直於經印刷物件310且穿過經印刷物件310之中心)由比如氣溶膠針狀物355之另一物件佔據時判定經印刷物件310之平面特徵(諸如,2D投影尺寸或形狀)的系統。該系統包括影像獲取總成328。該系統可進一步包括經組態以將平面光投影至物件312之表面上且形成經光照平面的照明總成(圖11中未示)。光可具有適合於選定成像感測器及透鏡的任何波長或多個波長之組合,其在紅外線、可見光或紫外線之區域中或被知道在0.01微米至1000微米之範圍內。影像獲取總成328包括成像感測器340及透鏡330。成像感測器340經組態以俘獲成像平面之影像,其中成像平面實質上平行於經光照平面且位於經光照平面中。透鏡330具有主軸線且安置於經光照平面與成像感測器340之間。透鏡330係相對於成像感測器340而定位成使得主軸線自感測器軸線偏移,其中感測器軸線實質上垂直於成像感測器340且穿過成像感測器340之中心。可包括資料單元(圖11中未示),且資料單元可經組態以接收經俘獲影像且提供至少經俘獲影像之觀測或處理以用於至少監視、測量及/或缺陷偵測。 The present invention can be used to solve this problem. 11 illustrates a specific example for determining a printed article 310 when the main axis (which is perpendicular to the printed article 310 and through the center of the printed article 310) is occupied by another article such as aerosol needle 355. A system of planar features such as 2D projection size or shape. The system includes an image acquisition assembly 328. The system can further include an illumination assembly (not shown in FIG. 11) configured to project planar light onto the surface of the object 312 and form a illuminated plane. The light may have any wavelength or combination of wavelengths suitable for the selected imaging sensor and lens, either in the infrared, visible or ultraviolet region or known to be in the range of 0.01 microns to 1000 microns. Image acquisition assembly 328 includes imaging sensor 340 and lens 330. Imaging sensor 340 is configured to capture an image of the imaging plane, wherein the imaging plane is substantially parallel to the illuminated plane and is located in the illuminated plane. Lens 330 has a major axis and is disposed between the illuminated plane and imaging sensor 340. Lens 330 is positioned relative to imaging sensor 340 such that the major axis is offset from the sensor axis, with the sensor axis being substantially perpendicular to imaging sensor 340 and passing through the center of imaging sensor 340. A data unit (not shown in FIG. 11) can be included, and the data unit can be configured to receive the captured image and provide at least observation or processing of the captured image for at least monitoring, measuring, and/or defect detection.

熟習此項技術者應瞭解,外部照明可能不係必要的。取決於待成像物件之材料及溫度,自發射輻射、紅外線、可見光或紫外線可由經適當地選擇以接收此輻射之影像獲取總成俘獲。舉例而言,CCD感測器可用於短波長紅外線及可見光,且微輻射熱計感測器(microbolometer sensor)可用於長波長紅外線。 Those skilled in the art should be aware that external lighting may not be necessary. Depending on the material and temperature of the object to be imaged, self-emissive radiation, infrared, visible or ultraviolet light may be captured by an image acquisition assembly that is suitably selected to receive the radiation. For example, CCD sensors can be used for short-wavelength infrared and visible light, and microbolometer sensors can be used for long-wavelength infrared.

吾人主張: I claim that:

10‧‧‧三維物件 10‧‧‧3D objects

12‧‧‧外部表面 12‧‧‧External surface

14‧‧‧輪廓探測系統 14‧‧‧Contour detection system

16‧‧‧複合輪廓 16‧‧‧Complex profile

18‧‧‧照明總成 18‧‧‧Lighting assembly

20‧‧‧光線源 20‧‧‧Light source

22‧‧‧光平面 22‧‧‧Light plane

24‧‧‧影像 24‧‧‧ images

28‧‧‧影像獲取總成 28‧‧‧Image acquisition assembly

30‧‧‧透鏡 30‧‧‧ lens

32‧‧‧主軸線 32‧‧‧Main axis

34‧‧‧感測器軸線 34‧‧‧Sensor axis

36‧‧‧第一預定距離 36‧‧‧First predetermined distance

38‧‧‧第二預定距離 38‧‧‧second predetermined distance

40‧‧‧成像感測器 40‧‧‧ imaging sensor

41‧‧‧點線 41‧‧‧ dotted line

42‧‧‧經聚焦成像平面 42‧‧‧Focused imaging plane

44‧‧‧預定大小/範圍 44‧‧‧Predetermined size/range

46‧‧‧第三預定距離 46‧‧‧ third predetermined distance

48‧‧‧資料單元 48‧‧‧data unit

A‧‧‧縱向軸線 A‧‧‧ longitudinal axis

Claims (26)

一種用於產生一物件之一三維輪廓的系統,其包含:一照明總成,其經組態以將一光平面投影至該物件之一外部表面上;一影像獲取總成,其包含一成像感測器及一透鏡,該成像感測器具有一影像平面且經組態以俘獲一成像平面上之一影像,其中該成像平面實質上平行於該光平面且位於該光平面中,該透鏡具有一主軸線且安置於該光平面與該成像感測器之間,該透鏡係相對於該成像感測器而定位成使得該主軸線自一感測器軸線偏移,其中該感測器軸線實質上垂直於該成像感測器且穿過該成像感測器之一中心部分;及一資料單元,其經組態以接收該影像且自該影像形成該三維輪廓。 A system for generating a three-dimensional contour of an object, comprising: an illumination assembly configured to project a light plane onto an outer surface of the object; an image capture assembly including an image a sensor and a lens having an image plane and configured to capture an image on an imaging plane, wherein the imaging plane is substantially parallel to and in the light plane, the lens having a main axis disposed between the optical plane and the imaging sensor, the lens being positioned relative to the imaging sensor such that the main axis is offset from a sensor axis, wherein the sensor axis A portion substantially perpendicular to the imaging sensor and passing through a central portion of the imaging sensor; and a data unit configured to receive the image and form the three-dimensional contour from the image. 如申請專利範圍第1項之系統,其中該透鏡定位於該光平面與該成像感測器之間,使得投影於該光平面上之該成像平面之一大小在垂直於該光平面之一方向上不干涉該成像感測器及該透鏡。 The system of claim 1, wherein the lens is positioned between the optical plane and the imaging sensor such that one of the imaging planes projected on the optical plane is in a direction perpendicular to one of the optical planes. The imaging sensor and the lens are not interfered. 如申請專利範圍第1項之系統,其中該透鏡係相對於該成像感測器而定位以在該光平面上形成具有一預定大小之該成像平面。 The system of claim 1, wherein the lens is positioned relative to the imaging sensor to form the imaging plane having a predetermined size on the light plane. 如申請專利範圍第1項之系統,其中該透鏡包含一會聚透鏡。 The system of claim 1, wherein the lens comprises a converging lens. 如申請專利範圍第1項之系統,其中該照明總成經進一步組態以自至少一線光源投影該光平面。 The system of claim 1, wherein the illumination assembly is further configured to project the light plane from at least one line source. 如申請專利範圍第5項之該線光源包含選自包含一雷射、一結構光照源及一線形狀光投影儀之群組的一線光源。 The line source of claim 5, wherein the line source comprises a line source selected from the group consisting of a laser, a structured illumination source, and a line shape light projector. 如申請專利範圍第1項之系統,其中該照明總成經進一步組態以圍繞該物件之該外部表面而完全地投影該光平面,且其中該影像獲取總成為一第一影像獲取總成且該影像為一第一影像,該第一影像獲取總成自一縱向軸線徑向地偏移達一第一預定距離,沿著該縱向軸線安置有 該物件,該系統進一步包括:一第N影像獲取總成,其中N為等於或大於2之一整數,該第N影像獲取總成經組態以分別俘獲位於該光平面內之第N成像平面之第N影像,且其中該第N影像獲取總成自該縱向軸線徑向地偏移達一第N預定距離,且該N個影像獲取總成係相對於該縱向軸線而圓周地配置成使得該N個成像平面共同完全地跨越該物件之圓周。 The system of claim 1, wherein the illumination assembly is further configured to completely project the light plane around the outer surface of the object, and wherein the image acquisition is always a first image acquisition assembly and The image is a first image, and the first image capturing assembly is radially offset from a longitudinal axis by a first predetermined distance along which the longitudinal axis is disposed. The object, the system further comprising: an Nth image acquisition assembly, wherein N is an integer equal to or greater than 2, the Nth image acquisition assembly configured to respectively capture an Nth imaging plane located in the optical plane An Nth image, and wherein the Nth image acquisition assembly is radially offset from the longitudinal axis by an Nth predetermined distance, and the N image acquisition assemblies are circumferentially disposed relative to the longitudinal axis such that The N imaging planes collectively span the circumference of the object. 如申請專利範圍第7項之系統,其中該N個影像獲取總成係沿著該360°圓周以大致均勻隔開方式進行圓周地配置。 The system of claim 7, wherein the N image acquisition assemblies are circumferentially disposed along the 360° circumference in a substantially evenly spaced manner. 如申請專利範圍第7項之系統,其中該資料單元包含至少一電子處理器,該資料單元進一步包括儲存於記憶體中以供該至少一電子處理器執行之一輪廓產生器,該輪廓產生器經組態以判定該等影像中之各別區段、使用根據校準而獲得之預定各別模型來變換該等區段,及使用該等區段來形成該輪廓。 The system of claim 7, wherein the data unit comprises at least one electronic processor, the data unit further comprising a contour generator stored in the memory for execution by the at least one electronic processor, the contour generator The sections are configured to determine respective segments in the images, use predetermined predetermined models obtained from calibration to transform the segments, and use the segments to form the contours. 如申請專利範圍第7項之系統,其中該N個影像被記錄至一個單一座標系統。 For example, in the system of claim 7, wherein the N images are recorded to a single standard system. 如申請專利範圍第10項之該記錄係基於自一多邊形橫截面輪廓之一校準物件採取的該N個影像。 The record, as in claim 10, is based on the N images taken from a calibration object of one of the polygonal cross-sectional profiles. 如申請專利範圍第1項之系統,其中該照明總成包含複數個雷射,每一雷射產生一雷射線,其中該複數個雷射配置於一環上且經對準成使得該複數個雷射線位於該光平面中。 The system of claim 1, wherein the illumination assembly comprises a plurality of lasers, each of the lasers generating a thunder ray, wherein the plurality of lasers are disposed on a ring and aligned such that the plurality of thunders The ray is located in the plane of the light. 如申請專利範圍第1項之系統,其中該成像感測器包含選自包含一電荷耦合裝置(CCD)、一互補金屬氧化物半導體(CMOS)裝置及一視訊攝影管之群組的一感測器。 The system of claim 1, wherein the imaging sensor comprises a sensing selected from the group consisting of a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS) device, and a video tube. Device. 如申請專利範圍第1項之系統,其中該照明總成係相對於該物件而配置成使得該光平面實質上垂直於該物件之該外部表面。 The system of claim 1, wherein the illumination assembly is configured relative to the object such that the light plane is substantially perpendicular to the outer surface of the object. 一種形成一物件之一外部表面之一輪廓的方法,其包含如下步驟:將一光平面投影至該物件之一外部表面上;使用一偏移成像獲取總成來俘獲實質上平行於該光平面且位於該光平面中之一成像平面之一影像,該偏移成像獲取總成包含一成像感測器及一透鏡,其中該透鏡具有一主軸線且安置於該光平面與該成像感測器之間,且其中該透鏡係相對於該成像感測器而定位成使得該主軸線自一感測器軸線偏移,該感測器軸線實質上垂直於該成像感測器且穿過該成像感測器之一中心部分;及使用一資料單元而使用至少該經俘獲影像來形成該輪廓。 A method of forming an outline of an exterior surface of an object, comprising the steps of: projecting a light plane onto an exterior surface of the object; using an offset imaging acquisition assembly to capture substantially parallel to the light plane And an image of one of the imaging planes in the optical plane, the offset imaging acquisition assembly includes an imaging sensor and a lens, wherein the lens has a main axis and is disposed on the optical plane and the imaging sensor And wherein the lens is positioned relative to the imaging sensor such that the main axis is offset from a sensor axis that is substantially perpendicular to the imaging sensor and passes through the imaging a central portion of the sensor; and using at least one of the captured images to form the contour using a data unit. 如申請專利範圍第15項之方法,其中投影進一步包含圍繞該物件之該外部表面而完全地投影該光平面的步驟。 The method of claim 15, wherein the projecting further comprises the step of completely projecting the light plane around the outer surface of the object. 如申請專利範圍第15項之方法,其進一步包含複數個偏移影像獲取總成各自俘獲位於該光平面中之一各別成像平面之一各別影像,該方法進一步包含如下步驟:判定該複數個經俘獲影像中之各別區段、使用根據校準而獲得之預定各別模型來變換該等區段,及使用該等區段來形成該輪廓。 The method of claim 15, further comprising a plurality of offset image acquisition assemblies each capturing a respective image of one of the respective imaging planes in the optical plane, the method further comprising the step of: determining the complex number Each of the captured images is transformed using the predetermined individual models obtained from the calibration, and the segments are used to form the contour. 如申請專利範圍第15項之方法,其中該偏移影像獲取總成為一第一影像獲取總成且該影像為一第一影像,該方法進一步包含如下步驟:分別使用第N偏移影像獲取總成來俘獲位於該光平面中之第N成像平面之第N影像,其中N為等於或大於2之一整數;判定分別在該N個影像中之N個區段,其中該等第N區段分別對應於該物件之該輪廓之第N部分,且其中該N個區段中每一者包含一各別二維區段;使用根據校準而獲得之一對應預定模型來變換該N個區段中每一者;及 使用該N個區段來形成該物件之該輪廓。 The method of claim 15, wherein the offset image acquisition is always a first image acquisition assembly and the image is a first image, the method further comprising the steps of: acquiring the total using the Nth offset image respectively. Forming an Nth image of the Nth imaging plane located in the optical plane, where N is an integer equal to or greater than 2; determining N segments in the N images, wherein the Nth segments Corresponding to the Nth portion of the contour of the object, respectively, and wherein each of the N segments comprises a respective two-dimensional segment; transforming the N segments using a corresponding predetermined model obtained according to the calibration Each of them; and The N segments are used to form the contour of the object. 如申請專利範圍第18項之方法,其中將該N個影像記錄至一個單一座標系統。 The method of claim 18, wherein the N images are recorded to a single standard system. 如申請專利範圍第19項之該記錄係基於自一多邊形橫截面輪廓之一校準物件採取的該N個影像。 The record as set forth in claim 19 is based on the N images taken from a calibration object of one of the polygonal cross-sectional profiles. 一種用於產生一物件之一平面影像的系統,其包含:一照明總成,其經組態以將光投影至該物件之一表面上且在該物件之該表面上形成一經光照平面;及一影像獲取總成,其包含一成像感測器及一透鏡,該成像感測器具有一成像平面且經組態以俘獲該成像平面上之一影像,其中該成像平面實質上平行於該經光照平面且位於該經光照平面中,該透鏡具有一主軸線且安置於該經光照平面與該成像感測器之間,該透鏡係相對於該成像感測器而定位成使得該主軸線自一感測器軸線偏移,其中該感測器軸線實質上垂直於該成像感測器且穿過該成像感測器之一中心部分。 A system for producing a planar image of an object, comprising: an illumination assembly configured to project light onto a surface of the object and form a lighted plane on the surface of the object; An image acquisition assembly comprising an imaging sensor and a lens, the imaging sensor having an imaging plane and configured to capture an image on the imaging plane, wherein the imaging plane is substantially parallel to the illumination Plane and located in the illuminated plane, the lens has a main axis and is disposed between the illuminated plane and the imaging sensor, the lens is positioned relative to the imaging sensor such that the main axis The sensor axis is offset, wherein the sensor axis is substantially perpendicular to the imaging sensor and passes through a central portion of the imaging sensor. 如申請專利範圍第21項之系統,其進一步包括一資料單元,該資料單元經組態以接收該平面影像以達成顯示之目的、儲存之目的、處理之目的、分析之目的,或該等前述目的之任何組合。 The system of claim 21, further comprising a data unit configured to receive the planar image for display purposes, for storage purposes, for processing purposes, for analysis purposes, or for the foregoing Any combination of purposes. 如申請專利範圍第21項之系統,其中該透鏡定位於該經光照平面與該成像感測器之間,使得投影於該經光照平面上之該成像平面之一大小具有一中心軸線,該中心軸線垂直於該經光照平面且以一預定距離而自該成像感測器之中心軸線偏移。 The system of claim 21, wherein the lens is positioned between the illuminated plane and the imaging sensor such that one of the imaging planes projected onto the illuminated plane has a central axis, the center The axis is perpendicular to the illuminated plane and is offset from the central axis of the imaging sensor by a predetermined distance. 如申請專利範圍第21項之系統,其中該透鏡係相對於該成像感測器而定位以在該經光照平面上形成具有一預定大小之該成像平面。 The system of claim 21, wherein the lens is positioned relative to the imaging sensor to form the imaging plane having a predetermined size on the illuminated plane. 一種形成一離軸表面之一影像的方法,其包含如下步驟: 將光投影至該物件之一表面上且形成一經光照平面;及使用一偏移成像獲取總成來俘獲實質上平行於該經光照平面且位於該經光照平面中之一成像平面之一影像,該偏移成像獲取總成包含一成像感測器及一透鏡,其中該透鏡具有一主軸線且安置於該光平面與該成像感測器之間,且其中該透鏡係相對於該成像感測器而定位成使得該主軸線自一感測器軸線偏移,該感測器軸線實質上垂直於該成像感測器且穿過該成像感測器之一中心部分。 A method of forming an image of an off-axis surface, comprising the steps of: Projecting light onto a surface of the object and forming a lighted plane; and using an offset imaging acquisition assembly to capture an image of one of the imaging planes substantially parallel to the illuminated plane and located in the illuminated plane, The offset imaging acquisition assembly includes an imaging sensor and a lens, wherein the lens has a major axis and is disposed between the optical plane and the imaging sensor, and wherein the lens is sensed relative to the imaging The device is positioned such that the main axis is offset from a sensor axis that is substantially perpendicular to the imaging sensor and passes through a central portion of the imaging sensor. 如申請專利範圍第25項之方法,其進一步包括使用一資料單元之一程序,該資料單元經組態以接收該影像以達成顯示之目的、儲存之目的、處理之目的、分析之目的,或該等前述目的之任何組合。 The method of claim 25, further comprising using a program of a data unit configured to receive the image for display purposes, for storage purposes, for processing purposes, for analysis purposes, or Any combination of the foregoing objects.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110596135A (en) * 2018-05-25 2019-12-20 上海翌视信息技术有限公司 Sheet glass edge flaw detection device based on image acquisition

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