TW201431966A - Transducers and production method thereof - Google Patents

Transducers and production method thereof Download PDF

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Publication number
TW201431966A
TW201431966A TW102148522A TW102148522A TW201431966A TW 201431966 A TW201431966 A TW 201431966A TW 102148522 A TW102148522 A TW 102148522A TW 102148522 A TW102148522 A TW 102148522A TW 201431966 A TW201431966 A TW 201431966A
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Taiwan
Prior art keywords
group
organopolyoxane
converter
composition
dielectric
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TW102148522A
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Chinese (zh)
Inventor
Haruhiko Furukawa
Eiji Kitaura
Harumi Kodama
Kent R Larson
Wataru Nishiumi
Takuya Ogawa
Masayuki Onishi
Kouichi Ozaki
Michael A Rabideau
Keiji Wakita
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Dow Corning
Dow Corning Toray Co Ltd
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Publication of TW201431966A publication Critical patent/TW201431966A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/06Influence generators
    • H02N1/08Influence generators with conductive charge carrier, i.e. capacitor machines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/09Forming piezoelectric or electrostrictive materials
    • H10N30/098Forming organic materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/206Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/857Macromolecular compositions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/26Polymeric coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/102Oxide or hydroxide
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/104Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/402Coloured
    • B32B2307/4026Coloured within the layer by addition of a colorant, e.g. pigments, dyes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2206Oxides; Hydroxides of metals of calcium, strontium or barium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a transducer with two or more layers containing organopolysiloxane. Specifically, said two or more layers containing organopolysiloxane is preferred to be silicone elastomer layers obtained by curing two or more curable organopolysiloxane compositions different in the electric characteristics or the mechanical strength of its cured body, and the two or more layers are especially preferred to having a concentration gradient of ingredient or function groups in the layers to the direction of its thickness as entire body.

Description

轉換器及其製造方法 Converter and method of manufacturing same

本發明係關於具有兩個或更多個含有有機聚矽氧烷之層、尤其兩個或更多個藉由固化可固化有機聚矽氧烷組合物獲得之聚矽氧彈性物層之轉換器。此外,本發明係關於具有層之轉換器,其在作為整體之該等層中在其厚度方向上具有成份或官能基之濃度梯度。此外,本發明係關於該等轉換器之製造方法。 The present invention relates to a converter having two or more layers containing an organopolysiloxane, in particular two or more polyoxyxide layers obtained by curing a curable organopolyoxane composition . Further, the present invention relates to a converter having a layer having a concentration gradient of a component or a functional group in the thickness direction thereof in the layers as a whole. Furthermore, the invention relates to a method of manufacturing such converters.

A.G.Benjanariu等人指示,介電聚合物係用於人工肌肉之潛在材料(A.G.Benjanariu等人,「New elastomeric silicone based networks applicable as electroactive systems」,Proc.of SPIE第7976卷79762V-1至79762V-8(2011))。在此處,其展示利用加成可固化聚矽氧橡膠形成之具有單峰或雙峰網之材料的物理特性。為形成此聚矽氧橡膠,使用具有4個矽鍵結氫原子之短鏈有機氫矽氧烷作為交聯劑來交聯具有乙烯基之直鏈聚(二甲基矽氧烷)(PDMS)聚合物。此外,在B.Kussmaul等人,Actuator 2012,第13屆新致動器國際會議(13th International Conference on New Actuators),Bremen,Germany,2012年6月18-20日,第374至378頁中提及一種在電極之間夾有介電彈性物材料之致動器,該介電彈性物材料係已經用作電偶極之基團化學修飾之有機聚二甲基矽氧烷,該修飾係藉由使用交聯劑將該等基團鍵結至聚二甲基矽氧烷來實施。 AGBenjanariu et al. indicate that dielectric polymers are potential materials for artificial muscles (AGBenjanariu et al., "New elastomeric silicone based networks applicable as electroactive systems", Proc. of SPIE No. 7976 volumes 79762V-1 to 79762V-8 (2011)). Here, it shows the physical properties of a material having a unimodal or bimodal network formed by addition of a curable polyoxyxene rubber. To form the polyoxyxene rubber, a short-chain organic hydroquinone having 4 hydrazine-bonded hydrogen atoms is used as a crosslinking agent to crosslink a linear poly(dimethyl oxane) having a vinyl group (PDMS). polymer. In addition, in B. Kussmaul et al., Actuator 2012, 13th International Conference on New Actuators, Bremen, Germany, June 18-20, 2012, pp. 374-378 And an actuator having a dielectric elastomer material interposed between the electrodes, the dielectric elastomer material being used as an organic polydimethyl siloxane having a chemical modification of the group of the electric dipole, the modification being This is carried out by bonding these groups to polydimethyloxane using a crosslinking agent.

然而,在上文所提及之任一參考文獻中並未揭示可固化有機聚矽氧烷組合物之特定組成,且此外,在實踐中可固化有機聚矽氧烷組合物之物理性質對用於各種類型轉換器之工業應用之材料而言不足。因此,業內需要組合能夠滿足作為各種類型轉換器之材料之實際應用的機械特性與電特性之電活性聚合物材料。具體而言,業內非常需要固化並提供具有極佳物理特性之電活性聚合物之可固化有機聚矽氧烷組合物。此外,任何該等參考文獻從未教示或表明具有兩個或更多個藉由固化可固化有機聚矽氧烷組合物獲得之聚矽氧彈性物層之轉換器。 However, the specific composition of the curable organopolyoxane composition is not disclosed in any of the references mentioned above, and further, in practice, the physical properties of the curable organopolyoxane composition are used. Insufficient materials for industrial applications of various types of converters. Accordingly, there is a need in the art to combine electroactive polymer materials that are capable of meeting the mechanical and electrical properties of practical applications of materials for various types of converters. In particular, there is a great need in the art for a curable organopolyoxane composition that cures and provides an electroactive polymer with excellent physical properties. Moreover, any such references have never taught or indicated a converter having two or more polyoxyxide elastomer layers obtained by curing a curable organopolyoxane composition.

背景文件 Background file

非專利文件1:「New elastomeric silicone based networks applicable as electroactive systems」,Proc. of SPIE第7976卷79762V-1至79762V-8 (2011) Non-Patent Document 1: "New elastomeric silicone based networks applicable as electroactive systems", Proc. of SPIE No. 7976 Volume 79762V-1 to 79762V-8 (2011)

非專利文件2:Actuator 2012,第13屆新致動器國際會議,Bremen, Germany,2012年6月18-20日,第374至378頁 Non-Patent Document 2: Actuator 2012, 13th International Conference on New Actuators, Bremen, Germany, June 18-20, 2012, pp. 374-378

本發明之目標係提供具有多層結構與極佳機械特性及/或電特性之轉換器。 It is an object of the present invention to provide a converter having a multilayer structure with excellent mechanical and/or electrical properties.

本發明之另一目標係提供具有兩個或更多個藉由固化可固化有機聚矽氧烷組合物形成之聚矽氧彈性物層之轉換器,該組合物能夠藉由提供極佳機械特性及/或電特性、且尤其提供高比介電常數、高介電破壞強度及低楊氏模數(Young's modulus)來實現高能量密度;能在用作轉換器之介電層情形下因極佳機械強度(即抗拉強度、撕裂強度、伸長率或諸如此類)而達成耐久性及實用位移量;且能夠製造能夠用作轉換器用材料之固化物件。此外,可將各種類型之填充劑(包含已經表面處理之填充劑)與本發明之可固化有機聚矽氧烷組合物摻 和以獲得期望電特性,且本發明之可固化有機聚矽氧烷組合物可包括脫模添加劑以防止在模製成薄片時斷裂,且亦可包括用於改良絕緣破壞特性之添加劑。 Another object of the present invention is to provide a converter having two or more polyoxyxide elastomer layers formed by curing a curable organopolyoxane composition, which composition can provide excellent mechanical properties And / or electrical characteristics, and in particular to provide high specific dielectric constant, high dielectric breakdown strength and low Young's modulus to achieve high energy density; can be used in the case of the dielectric layer used as a converter Good mechanical strength (i.e., tensile strength, tear strength, elongation, or the like) achieves durability and practical displacement; and it is possible to manufacture a cured article that can be used as a material for a converter. In addition, various types of fillers (including fillers that have been surface treated) can be blended with the curable organopolyoxane compositions of the present invention. And obtaining the desired electrical characteristics, and the curable organopolyoxane composition of the present invention may include a release additive to prevent breakage upon molding into a sheet, and may also include an additive for improving insulation breakdown characteristics.

本發明之其他目標係提供能夠用作轉換器用電活性聚合物材料之可固化聚矽氧彈性物材料,提供製造該可固化聚矽氧彈性物材料之方法,及提供使用可固化聚矽氧彈性物材料之各種類型之轉換器。 Other objects of the present invention are to provide a curable polyoxoelastomer material that can be used as an electroactive polymer material for a converter, to provide a method of making the curable polyoxoelastomer material, and to provide a curable polyoxyxide Various types of converters for elastomeric materials.

本發明係本發明者藉由以下發現來達成:本發明可藉由下文所闡述之方式解決上文所提及之問題。 The present invention has been achieved by the inventors by the following findings: The present invention solves the above-mentioned problems by the means set forth below.

上文所提及之問題係藉由具有兩個或更多個含有有機聚矽氧烷之層之轉換器來解決。特定而言,該兩個或更多個含有有機聚矽氧烷之層較佳係藉由固化兩種或更多種其固化本體之電特性或機械強度不同之可固化有機聚矽氧烷組合物獲得之聚矽氧彈性物層,且該兩個或更多個層在作為整體之該等層中在其厚度方向上尤佳具有成份或官能基之濃度梯度。 The problems mentioned above are solved by a converter having two or more layers containing organopolyoxane. In particular, the two or more organic polyoxane-containing layers are preferably a curable organopolyoxane combination which cures two or more of its cured bodies by electrical or mechanical strength. The polyoxyxene elastomer layer obtained is obtained, and the two or more layers preferably have a concentration gradient of a component or a functional group in the thickness direction thereof in the layers as a whole.

此外,上文所提及之問題藉由使用與本發明相關之轉換器之可固化有機聚矽氧烷組合物來極佳地解決。 Furthermore, the above mentioned problems are solved extremely well by using a curable organopolyoxane composition of the converter associated with the present invention.

1‧‧‧致動器 1‧‧‧Actuator

2‧‧‧致動器 2‧‧‧Actuator

3‧‧‧感測器 3‧‧‧Sensor

4‧‧‧發電元件 4‧‧‧Power generation components

10a‧‧‧介電層 10a‧‧‧ dielectric layer

10b‧‧‧介電層 10b‧‧‧ dielectric layer

11a‧‧‧電極層 11a‧‧‧electrode layer

11b‧‧‧電極層 11b‧‧‧electrode layer

12‧‧‧導線 12‧‧‧ wire

13‧‧‧電源 13‧‧‧Power supply

20a‧‧‧介電層 20a‧‧‧ dielectric layer

20b‧‧‧介電層 20b‧‧‧ dielectric layer

20c‧‧‧介電層 20c‧‧‧ dielectric layer

21a‧‧‧電極層 21a‧‧‧electrode layer

21b‧‧‧電極層 21b‧‧‧electrode layer

21c‧‧‧電極層 21c‧‧‧electrode layer

21d‧‧‧電極層 21d‧‧‧electrode layer

22‧‧‧導線 22‧‧‧Wire

23‧‧‧電源 23‧‧‧Power supply

30‧‧‧介電層 30‧‧‧Dielectric layer

31a‧‧‧上部電極層 31a‧‧‧Upper electrode layer

31b‧‧‧上部電極層 31b‧‧‧Upper electrode layer

31c‧‧‧上部電極層 31c‧‧‧ upper electrode layer

32a‧‧‧下部電極層 32a‧‧‧lower electrode layer

32b‧‧‧下部電極層 32b‧‧‧lower electrode layer

32c‧‧‧下部電極層 32c‧‧‧lower electrode layer

40a‧‧‧介電層 40a‧‧‧ dielectric layer

40b‧‧‧介電層 40b‧‧‧ dielectric layer

41a‧‧‧電極層 41a‧‧‧electrode layer

41b‧‧‧電極層 41b‧‧‧electrode layer

圖1展示其中堆疊介電層之本發明實施例之致動器1之剖視圖。 1 shows a cross-sectional view of an actuator 1 of an embodiment of the present invention in which a dielectric layer is stacked.

圖2展示其中堆疊介電層及電極層之本發明實施例之致動器2之剖視圖。 2 shows a cross-sectional view of an actuator 2 of an embodiment of the present invention in which a dielectric layer and an electrode layer are stacked.

圖3展示本發明實施例之感測器3之結構。 Figure 3 shows the structure of a sensor 3 in accordance with an embodiment of the present invention.

圖4展示其中堆疊介電層之本發明實施例之發電元件4之剖視圖。 4 shows a cross-sectional view of a power generating element 4 of an embodiment of the present invention in which a dielectric layer is stacked.

圖5參考實例編號23及比較參考實例編號4之隨電場(V/μm)變化之厚度應變(%)。 Fig. 5 refers to the thickness strain (%) of the variation of the electric field (V/μm) with reference to the example number 23 and the comparative reference example number 4.

本發明轉換器之特徵在於具有兩個或更多個含有有機聚矽氧烷之層。儘管對兩個或更多個含有有機聚矽氧烷之層之功能無具體限制,但該等層較佳係介電層或導電層。此外,術語「轉換器」在本發明中意指用於將某一類型之能量轉換成不同類型之能量之元件、機器或器件。此轉換器例示為用於將電能轉換成機械能之人工肌肉及致動器;用於將機械能轉換成電能之感測器及發電元件;用於將電能轉換成音能之揚聲器、麥克風及耳機;用於將化學能轉換成電能之燃料電池;及用於將電能轉換成光能之發光二極體。 The converter of the present invention is characterized by having two or more layers containing an organopolyoxane. Although the function of two or more layers containing an organic polyoxyalkylene is not specifically limited, the layers are preferably a dielectric layer or a conductive layer. Furthermore, the term "converter" as used in the present invention means an element, machine or device for converting a certain type of energy into a different type of energy. The converter is exemplified as an artificial muscle and an actuator for converting electrical energy into mechanical energy; a sensor and a power generating element for converting mechanical energy into electrical energy; a speaker for converting electrical energy into sound energy, a microphone and a headphone; a fuel cell for converting chemical energy into electrical energy; and a light emitting diode for converting electrical energy into light energy.

此外,該兩個或更多個含有有機聚矽氧烷之層可係藉由固化兩種或更多種其固化本體之電特性或機械強度不同之可固化有機聚矽氧烷組合物獲得之聚矽氧彈性物層。用於轉換器用途之聚矽氧彈性物可藉由任何固化反應系統來固化,只要含有有機聚矽氧烷之初始未固化原材料、尤其可流動原材料可形成固化製造本體即可。通常,本發明之可固化組合物係藉由縮合固化系統或加成固化系統來固化。然而,可採用過氧化固化(自由基誘導之固化)系統或高能量射線(例如紫外線)固化系統且可用於組合物之固化系統。此外,可採用藉由形成呈溶液狀態之交聯結構並利用溶劑移除乾燥來形成固化本體之方法。 Further, the two or more layers containing the organopolyoxyalkylene may be obtained by curing two or more curable organopolyoxane compositions having different electrical properties or mechanical strengths of the cured body. Polyoxyelastomer layer. The polyoxyxene elastomer used for the purpose of the converter can be cured by any curing reaction system as long as the initial uncured raw material containing the organopolyoxysiloxane, especially the flowable raw material, can form a cured body. Generally, the curable compositions of the present invention are cured by a condensation cure system or an addition cure system. However, a peroxidation curing (free radical induced curing) system or a high energy ray (e.g., ultraviolet) curing system can be employed and can be used in the curing system of the composition. Further, a method of forming a solidified body by forming a crosslinked structure in a solution state and removing the drying by a solvent may be employed.

儘管對作為轉換器部件之該聚矽氧彈性物之形狀無具體限制,但膜形式或片形式較佳。聚矽氧彈性物膜通常可如下形成:在將可固化有機聚矽氧烷組合物模製成片狀或膜狀後,通常可藉由加熱、藉由高能量束照射或諸如此類來固化該部件。儘管對用於將可固化有機聚矽氧烷組合物模製成膜狀之方法無具體限制,但該方法例示為以下方法:藉由使用先前眾所周知之塗覆方法將可固化有機聚矽氧烷組合物塗覆於基板上來形成塗覆膜,藉由使可固化有機聚矽氧烷組合物通過配備有期望形狀之狹縫之擠出機來模製,或諸如此類。 Although the shape of the polyoxylene elastomer as the converter member is not particularly limited, a film form or a sheet form is preferred. The polyoxyelastomer film can generally be formed by: after molding the curable organopolyoxane composition into a sheet or film, the part can usually be cured by heating, by high energy beam irradiation or the like. . Although the method for molding the curable organopolyoxane composition into a film form is not particularly limited, the method is exemplified as a method of curing the organic polyoxyalkylene by using a previously known coating method. The composition is applied to a substrate to form a coating film by molding the curable organopolyoxane composition through an extruder equipped with a slit of a desired shape, or the like.

本發明之轉換器可藉由使用具有兩個或更多個堆疊聚矽氧彈性物膜之轉換器用部件來製備。例如,可堆疊兩個或更多個具有高介電性質之聚矽氧彈性物膜作為整個介電層。相似地,可在具有導電性質之聚矽氧彈性物膜之間堆疊一或多個具有高介電性質之聚矽氧彈性物膜作為電極。 The converter of the present invention can be prepared by using a component for a converter having two or more stacked polyoxyelastomer films. For example, two or more polyoxyphthalide films having high dielectric properties may be stacked as the entire dielectric layer. Similarly, one or more polyoxyxene elastomer films having high dielectric properties may be stacked as electrodes between the polyoxoelastomer films having electrically conductive properties.

[濃度梯度之設計] [Design of concentration gradient]

本發明之轉換器可堆疊有兩個或更多個層,其在作為整體之該等層中在其厚度方向上具有成份或官能基之濃度梯度。濃度梯度可係至少一種選自由以下組成之群之濃度梯度:一或多個有機聚矽氧烷之官能基含量、一或多種填充劑之含量、一或多種絕緣添加劑之含量及一或多種脫除添加劑之含量。儘管對設計層中濃度梯度之方法無具體限制,但濃度梯度可容易地藉由堆疊藉由固化兩種或更多種可固化有機聚矽氧烷組合物形成之聚矽氧彈性物膜來設計,該等可固化有機聚矽氧烷組合物之至少一種選自其固化本體中所含之填充劑含量、絕緣添加劑含量及脫除添加劑含量不同。 The converter of the present invention may be stacked with two or more layers having a concentration gradient of components or functional groups in the thickness direction thereof in the layers as a whole. The concentration gradient can be at least one concentration gradient selected from the group consisting of: the functional group content of one or more organopolyoxysiloxanes, the content of one or more fillers, the amount of one or more insulating additives, and one or more In addition to the content of the additive. Although there is no particular limitation on the method of designing the concentration gradient in the layer, the concentration gradient can be easily designed by stacking a polyoxyxene elastomer film formed by curing two or more curable organopolyoxane compositions. At least one of the curable organopolyoxane compositions is selected from the group consisting of a filler content, an insulating additive content, and a removal additive content contained in the solidified body.

[彈性物膜及層壓] [elastic film and lamination]

此類型之膜狀可固化有機聚矽氧烷組合物之厚度可設定在例如介於0.1μm至5,000μm範圍內。端視塗覆方法及存在或不存在揮發性溶劑,可使所獲得固化物件之厚度薄於應用組合物時之厚度。 The thickness of this type of film-like curable organopolyoxane composition can be set, for example, in the range of from 0.1 μm to 5,000 μm. Depending on the coating method and the presence or absence of a volatile solvent, the thickness of the cured article obtained can be made thinner than when the composition is applied.

在藉由上文所提及之方法製造膜狀可固化有機聚矽氧烷組合物後,可實施熱固化、室溫固化或高能量束照射固化,同時視情況在介電無機細粒之目標定向方向上施加電場或磁場,或在藉由施加固定時間段之磁場或電場使填充劑定向後實施固化。儘管對每一固化操作或每一固化操作期間之條件無具體限制,但若可固化有機聚矽氧烷組合物係加成型可固化有機聚矽氧烷組合物,則固化較佳係在90℃至180℃之溫度範圍內藉由在此溫度範圍內滯留30秒至30分鐘來實施。 After the film-form curable organopolyoxane composition is produced by the method mentioned above, heat curing, room temperature curing or high energy beam irradiation curing may be performed, and the target of dielectric inorganic fine particles as the case may be. An electric field or a magnetic field is applied in the orientation direction, or curing is performed after the filler is oriented by applying a magnetic field or an electric field for a fixed period of time. Although the conditions during each curing operation or each curing operation are not specifically limited, if the curable organopolyoxane composition is a form-formable curable organopolyoxane composition, the curing is preferably at 90 ° C. The temperature range of up to 180 ° C is carried out by staying in this temperature range for 30 seconds to 30 minutes.

對用於轉換器之聚矽氧彈性物無具體限制,且此厚度可為例如1μm至2,000μm。本發明之用於轉換器之聚矽氧彈性物可堆疊為1層或2層或更多層。此外,可在介電彈性物層之兩個尖端提供電極層,且可使用其中轉換器本身由多個堆疊電極層及介電彈性物層構成之組態。該組態每一單層之用於轉換器之聚矽氧彈性物之厚度可為0.1μm至1,000μm。若該等層堆疊為至少2層,則每一單層之厚度可為0.2μm至2,000μm。 The polyoxylene elastomer used for the converter is not particularly limited, and the thickness may be, for example, 1 μm to 2,000 μm. The polyoxyxene elastomer for a converter of the present invention may be stacked in one or two or more layers. Further, an electrode layer may be provided at both tips of the dielectric elastic layer, and a configuration in which the converter itself is composed of a plurality of stacked electrode layers and a dielectric elastic layer may be used. The thickness of the polyoxyxene elastomer for the converter of each of the single layers can be from 0.1 μm to 1,000 μm. If the layers are stacked in at least 2 layers, each single layer may have a thickness of 0.2 μm to 2,000 μm.

儘管對以上文所提及之方式堆疊之兩個或更多個矽彈性物固化層之模製方法無具體限制,但可使用諸如以下等方法:(1)將可固化有機聚矽氧烷組合物塗覆於基板上,固化塗層,獲得固化聚矽氧彈性物層,且然後將可固化有機聚矽氧烷組合物進一步施加在同一固化層上以重複塗覆並固化以堆疊多層;(2)在基板上以堆疊方式塗覆呈未固化或半固化狀態之可固化有機聚矽氧烷組合物,並固化已以堆疊方式塗覆之全部可固化有機聚矽氧烷組合物;或組合(1)方法與(2)方法之方法。 Although the molding method of the two or more yttrium elastic cured layers stacked in the manner mentioned above is not particularly limited, methods such as the following may be used: (1) Combination of curable organic polyoxane Applying on the substrate, curing the coating, obtaining a cured polyoxyxene elastomer layer, and then further applying the curable organopolyoxyalkylene composition on the same cured layer to repeatedly coat and cure to stack the plurality of layers; 2) coating the curable organopolyoxane composition in an uncured or semi-cured state on a substrate in a stacked manner, and curing all of the curable organopolyoxane compositions that have been applied in a stacked manner; or a combination (1) Method and (2) Method of method.

例如,可藉由模具塗覆將可固化有機聚矽氧烷組合物施加在基板上,可固化,可藉由堆疊形成2個或更多個該等聚矽氧彈性物固化層,並可將矽彈性物固化層附接至電極層以用於在本申請發明中之製造。對於此組態,2個或更多個堆疊矽彈性物固化層較佳為介電層,且電極較佳為導電層。 For example, the curable organopolyoxyalkylene composition can be applied to the substrate by die coating, can be cured, and 2 or more of the polyoxyelastomer cured layers can be formed by stacking, and The ruthenium elastomer cured layer is attached to the electrode layer for use in the manufacture of the present invention. For this configuration, the two or more stacked tantalum elastomer cured layers are preferably dielectric layers, and the electrodes are preferably conductive layers.

可藉由模具塗覆進行高速塗覆,且此塗覆方法具有高產量。在塗覆含有有機聚矽氧烷組合物之單層後,可藉由塗覆包括不同有機聚矽氧烷組合物之層來製造本發明之具有多層組態之轉換器。此外,可藉由同時塗覆多個含有每一有機聚矽氧烷組合物之層來製造。 High speed coating can be carried out by die coating, and this coating method has a high yield. After coating a monolayer comprising an organopolyoxane composition, the multi-layered configuration of the present invention can be fabricated by coating a layer comprising a different organopolyoxane composition. Further, it can be produced by simultaneously coating a plurality of layers containing each organopolyoxane composition.

作為轉換器部件之薄膜狀聚矽氧彈性物可藉由以下方式來獲得:將上文所提及之可固化有機聚矽氧烷組合物塗覆於基板上,且然 後在室溫下及藉由加熱或藉由使用高能量束照射(例如紫外輻射或諸如此類)來固化總成。此外,當堆疊薄膜狀介電聚矽氧彈性物時,可將未固化之可固化有機聚矽氧烷組合物施加在固化層上且然後依序固化,或可將未固化之可固化有機聚矽氧烷組合物堆疊成層,且然後可同時固化該等層。 The film-like polyoxyxene elastomer as a converter component can be obtained by coating the above-mentioned curable organopolyoxane composition on a substrate, and The assembly is then cured at room temperature and by heating or by using high energy beam irradiation (e.g., ultraviolet radiation or the like). Further, when the film-like dielectric polyoxyelastomer is stacked, the uncured curable organopolyoxane composition may be applied to the cured layer and then sequentially cured, or the uncured curable organic polymer may be polymerized. The oxoxane composition is stacked in layers and the layers can then be cured simultaneously.

上文所提及之薄膜狀聚矽氧彈性物尤其可用作用於轉換器之介電層。可藉由在薄膜狀聚矽氧彈性物之兩端配置電極層來形成轉換器。此外,藉由將導電無機粒子摻和至本發明之可固化有機聚矽氧烷組合物中可提供電極層功能。此外,在本發明之專利說明書中,有時將「電極層」簡稱為「電極」。 The film-like polyoxynene elastomer mentioned above is especially useful as a dielectric layer for a converter. The converter can be formed by disposing an electrode layer on both ends of the film-like polyoxyelastomer. Further, the electrode layer function can be provided by blending conductive inorganic particles into the curable organopolyoxane composition of the present invention. Further, in the patent specification of the present invention, the "electrode layer" may be simply referred to as "electrode".

上文所提及之轉換器部件之一實施例係片狀或膜狀。膜厚度通常為1μm至2,000μm,且該膜可具有單層、2層或更多層或其他數目之堆疊層結構。此外,在可能需要時,堆疊電活性聚矽氧彈性物層在用作介電層時可以5μm至10,000μm之膜厚度來使用,或可堆疊該等層以獲得更大厚度。 One embodiment of the converter component mentioned above is in the form of a sheet or a film. The film thickness is usually from 1 μm to 2,000 μm, and the film may have a single layer, two or more layers or other number of stacked layer structures. Further, the stacked electroactive polyoxoelastic layers may be used as a film thickness of 5 μm to 10,000 μm when used as a dielectric layer, or may be stacked to obtain a larger thickness, as may be required.

作為此轉換器部件之薄膜狀聚矽氧彈性物層可藉由堆疊相同的薄膜狀聚矽氧彈性物來形成,或可將具有2種或更多種不同物理特性之薄膜狀聚矽氧彈性物或預固化組合物堆疊以形成此轉換器部件。此外,薄膜狀聚矽氧彈性物層可起介電層或電極層功能。具體而言,在較佳轉換器部件中,介電層之厚度為1至1,000μm,且電極層之厚度為0.05μm至100μm。 The film-like polyoxoelastic layer as the converter member can be formed by stacking the same film-like polyoxyelastomer, or can be formed into a film-like polyoxoelastic having two or more different physical properties. The pre-cured composition is stacked to form this converter component. Further, the film-like polyoxoelastic layer may function as a dielectric layer or an electrode layer. Specifically, in a preferred converter component, the thickness of the dielectric layer is from 1 to 1,000 μm, and the thickness of the electrode layer is from 0.05 μm to 100 μm.

本發明轉換器之特徵在於,具有藉由固化本發明之用於轉換器之可固化有機聚矽氧烷組合物製造之此轉換器部件,且本發明之轉換器具有尤其包括高度堆疊之層結構(即2個或更多個介電層)之結構。本發明之轉換器可進一步具有包括3個或更多個介電層之結構。具有此高度堆疊結構類型之轉換器能因包括多個層而產生更大力。此外, 藉由堆疊多層可獲得大於藉由使用單層所獲得位移之位移。 The converter of the present invention is characterized by having such a converter component manufactured by curing the curable organopolyoxane composition for a converter of the present invention, and the converter of the present invention has a layer structure including, in particular, a highly stacked layer The structure of (ie, 2 or more dielectric layers). The converter of the present invention may further have a structure including three or more dielectric layers. A converter having this height stack type can generate more force by including multiple layers. In addition, A displacement greater than the displacement obtained by using a single layer can be obtained by stacking a plurality of layers.

本發明之轉換器較佳具有(i)含有有機聚矽氧烷之堆疊介電層部件,或(ii)具有含有有機聚矽氧烷之介電層及至少在該介電層一側上之電極層的堆疊結構。堆疊介電層部件(i)或具有介電層及至少在該介電層一側上之電極層之堆疊結構(ii)可以分步方式固化該等可固化有機聚矽氧烷組合物之每一層或藉由一次性固化堆疊塗層來形成。 The converter of the present invention preferably has (i) a stacked dielectric layer member containing an organopolyoxane, or (ii) a dielectric layer having an organopolyoxane and at least on one side of the dielectric layer. A stack structure of electrode layers. Stacking the dielectric layer component (i) or a stacked structure (ii) having a dielectric layer and an electrode layer on at least one side of the dielectric layer may cure each of the curable organopolyoxane compositions in a stepwise manner One layer is formed by a one-time curing of the stacked coating.

較佳地,在分步固化方法中,藉由以下步驟來製備部件(i)或堆疊結構(ii):將兩種或更多種其固化本體之電特性或機械強度不同之可固化有機聚矽氧烷組合物中之一種可固化有機聚矽氧烷組合物塗覆於基板上,並將塗層固化成固化聚矽氧彈性物層,然後將其他可固化有機聚矽氧烷組合物進一步塗覆在同一固化層上,並(若需要)重複固化塗層。另一方面,在一次性固化方法中,較佳藉由以下步驟來製備部件(i)或堆疊結構(ii):將兩種或更多種其固化本體之電特性或機械強度不同之可固化有機聚矽氧烷組合物中之一種可固化有機聚矽氧烷組合物塗覆於基板上,然後將其他可固化有機聚矽氧烷組合物進一步塗覆在同一塗覆層上,並固化堆疊之兩個或更多個不同塗覆層。 Preferably, in the step-wise curing method, the component (i) or the stacked structure (ii) is prepared by the following steps: curing organic polymerization of two or more cured bodies having different electrical properties or mechanical strengths A curable organopolyoxane composition in the oxoxane composition is applied to the substrate, and the coating is cured into a cured polyoxyxene elastomer layer, and then the other curable organopolyoxane composition is further Apply on the same cured layer and, if necessary, repeat the cured coating. On the other hand, in the one-time curing method, the component (i) or the stacked structure (ii) is preferably prepared by the following steps: curing the electrical properties or mechanical strength of two or more of the cured bodies thereof A curable organopolyoxane composition in the organopolyoxane composition is coated on the substrate, and then the other curable organopolyoxyalkylene composition is further coated on the same coating layer, and the stack is cured. Two or more different coating layers.

可在用於本發明轉換器之介電層之兩端包括電極。所使用之電極物質例示為金屬及金屬合金,例如金、鉑、銀、鈀、銅、鎳、鋁、鈦、鋅、鋯、鐵、鈷、錫、鉛、銦、鉻、鉬、錳或諸如此類;金屬氧化物,例如銦-錫化合物氧化物(ITO)、銻-錫化合物氧化物(ATO)、氧化釕、氧化鈦、氧化鋅、氧化錫及諸如此類;碳材料,例如碳奈米管、碳奈米角、碳奈米片、碳纖維、碳黑或諸如此類;及導電樹脂,例如聚(伸乙基-3,4-二氧基噻吩)(PEDOT)、聚苯胺、聚吡咯或諸如此類。可使用導電彈性物及具有分散在樹脂中之導電填充劑之導電樹脂。 Electrodes may be included at both ends of the dielectric layer used in the converter of the present invention. The electrode materials used are exemplified by metals and metal alloys such as gold, platinum, silver, palladium, copper, nickel, aluminum, titanium, zinc, zirconium, iron, cobalt, tin, lead, indium, chromium, molybdenum, manganese or the like. a metal oxide such as an indium-tin compound oxide (ITO), a bismuth-tin compound oxide (ATO), cerium oxide, titanium oxide, zinc oxide, tin oxide, and the like; a carbon material such as a carbon nanotube, carbon A nanohorn, a carbon nanosheet, a carbon fiber, a carbon black or the like; and a conductive resin such as poly(extended ethyl-3,4-dioxythiophene) (PEDOT), polyaniline, polypyrrole or the like. A conductive elastic material and a conductive resin having a conductive filler dispersed in the resin can be used.

電極可僅包括上文所提及導電物質中之一種物質,或可包括2種 或更多種該等導電物質。若電極包括2種或更多種類型之導電物質,則該等導電物質中之一者可起活性物質功能,且其餘導電物質可起降低電極電阻之導電材料功能。 The electrode may include only one of the above-mentioned conductive materials, or may include two Or more of these conductive materials. If the electrode includes two or more types of conductive materials, one of the conductive materials functions as an active material, and the remaining conductive materials function as a conductive material that lowers electrode resistance.

用於本發明轉換器之介電層之總厚度可設定在介於10μm至2,000μm(2mm)範圍內,但此總厚度尤其可設定為大於或等於200μm之值。具體而言,形成介電層之介電聚矽氧彈性物層之每一單層的厚度較佳為0.1μm至500μm,且此厚度尤佳為0.1μm至200μm。與使用單層相比,藉由堆疊該等聚矽氧彈性物薄層之2層或更多層可改良諸如絕緣破壞電壓、介電常數及位移量等特性。 The total thickness of the dielectric layer used in the converter of the present invention can be set in the range of 10 μm to 2,000 μm (2 mm), but the total thickness can be set to a value greater than or equal to 200 μm in particular. Specifically, the thickness of each of the single layers of the dielectric polyoxyelastomer layer forming the dielectric layer is preferably from 0.1 μm to 500 μm, and the thickness is particularly preferably from 0.1 μm to 200 μm. Characteristics such as dielectric breakdown voltage, dielectric constant, and displacement amount can be improved by stacking two or more layers of the thin layers of the polyoxyelastomers as compared with the use of a single layer.

本發明之轉換器由於本發明之轉換器之介電及機械特性而尤其能夠用作人工肌肉、致動器、感測器或發電元件。預期人工肌肉用於諸如以下等應用:機器人、護理設備、康復訓練設備或諸如此類。下文將以本發明實例之形式來解釋作為致動器之實施例。 The converter of the present invention is particularly useful as an artificial muscle, actuator, sensor or power generating component due to the dielectric and mechanical properties of the converter of the present invention. Artificial muscles are expected to be used for applications such as robots, nursing equipment, rehabilitation training equipment, or the like. An embodiment as an actuator will be explained below in the form of an example of the present invention.

[圖1至圖4] [Fig. 1 to Fig. 4]

圖1展示其中堆疊介電層之本發明實施例之致動器1之剖視圖。在此實施例中,介電層係由例如2個介電層構成。致動器1配備有介電層10a及10b、電極層11a及11b、導線12及電源13。電極層11a及11b覆蓋介電層之各別接觸表面,且該等電極層經由各別導線12連接至電源13。 1 shows a cross-sectional view of an actuator 1 of an embodiment of the present invention in which a dielectric layer is stacked. In this embodiment, the dielectric layer is composed of, for example, two dielectric layers. The actuator 1 is provided with dielectric layers 10a and 10b, electrode layers 11a and 11b, wires 12, and a power source 13. The electrode layers 11a and 11b cover respective contact surfaces of the dielectric layer, and the electrode layers are connected to the power source 13 via respective wires 12.

致動器1可藉由在電極層11a與電極層11b之間施加電壓來驅動。藉由施加電壓,介電層10a及10b因介電性質而變薄,且此使其平行於電極層11a及11b之面伸長。即,可將電能轉換成移動或位移之力或機械能。 The actuator 1 can be driven by applying a voltage between the electrode layer 11a and the electrode layer 11b. By applying a voltage, the dielectric layers 10a and 10b are thinned by dielectric properties, and are elongated parallel to the faces of the electrode layers 11a and 11b. That is, electrical energy can be converted into force or mechanical energy for movement or displacement.

圖2展示其中堆疊介電層及電極層之本發明實施例之致動器2之剖視圖。例如,根據本發明實施例,介電層係由3層構成,且電極層係由4層構成。致動器2配備有介電層20a、20b及20c、電極層21a、 21b、21c及21d;導線22;及電源23。電極層21a、21b、21c及21d各自覆蓋介電層之各別接觸表面,且該等電極層經由各別導線22連接至電源23。電極層交替連接至不同電壓側,且電極層21a及21c連接至與電極層21b及21d不同之側。 2 shows a cross-sectional view of an actuator 2 of an embodiment of the present invention in which a dielectric layer and an electrode layer are stacked. For example, according to an embodiment of the present invention, the dielectric layer is composed of three layers, and the electrode layer is composed of four layers. The actuator 2 is provided with dielectric layers 20a, 20b and 20c, an electrode layer 21a, 21b, 21c and 21d; wire 22; and power source 23. The electrode layers 21a, 21b, 21c, and 21d each cover respective contact surfaces of the dielectric layer, and the electrode layers are connected to the power source 23 via respective wires 22. The electrode layers are alternately connected to different voltage sides, and the electrode layers 21a and 21c are connected to the side different from the electrode layers 21b and 21d.

藉由在電極層21a與電極層21b之間施加電壓、在電極層21b與電極層21c之間施加電壓且在電極層21c與電極層21d之間施加電壓,可驅動致動器2。藉由施加電壓,介電層20a、20b及20c因介電性質而變薄,且此使其平行於電極層21a、21b、21c及21d之面伸長。即,可將電能轉換成移動或位移之力或機械能。 The actuator 2 can be driven by applying a voltage between the electrode layer 21a and the electrode layer 21b, applying a voltage between the electrode layer 21b and the electrode layer 21c, and applying a voltage between the electrode layer 21c and the electrode layer 21d. By applying a voltage, the dielectric layers 20a, 20b, and 20c are thinned by dielectric properties, and are elongated parallel to the faces of the electrode layers 21a, 21b, 21c, and 21d. That is, electrical energy can be converted into force or mechanical energy for movement or displacement.

儘管將致動器之實施例闡述為本發明轉換器之實例,但當自外側向本發明轉換器施加機械能(例如壓力或諸如此類)時,可在相互絕緣之電極層之間產生電位差形式之電能。即,其可用作用於將機械能轉換成電能之感測器。感測器之此實施例將闡述於下文中。 Although an embodiment of the actuator is illustrated as an example of a converter of the present invention, when mechanical energy (e.g., pressure or the like) is applied from the outside to the converter of the present invention, a potential difference form may be generated between mutually insulated electrode layers. Electrical energy. That is, it can be used as a sensor for converting mechanical energy into electrical energy. This embodiment of the sensor will be explained below.

圖3展示本發明實施例之感測器3之結構。感測器3具有以下結構:介電層30佈置在以矩陣樣模式配置之上部電極層31a、31b及31c與下部電極層32a、32b及32c之間。根據本發明實施例,例如,將電極層佈置為在垂直方向及水平方向上分別具有3列之矩陣模式。可用絕緣層來保護每一電極層之不接觸介電層30之面。此外,介電層30可包括2層或更多層含有有機聚矽氧烷之相同介電層。 Figure 3 shows the structure of a sensor 3 in accordance with an embodiment of the present invention. The sensor 3 has a structure in which the dielectric layer 30 is disposed between the upper electrode layers 31a, 31b, and 31c and the lower electrode layers 32a, 32b, and 32c in a matrix-like mode. According to an embodiment of the present invention, for example, the electrode layers are arranged in a matrix mode of three columns in the vertical direction and the horizontal direction, respectively. An insulating layer can be used to protect the surface of each electrode layer that does not contact the dielectric layer 30. Further, the dielectric layer 30 may include two or more layers of the same dielectric layer containing an organopolyoxane.

當將外力施加至此感測器3之表面時,介於上部電極層與下部電極層之間之介電層30之厚度在加壓位置處發生變化,且電極層之間之靜態電容因此厚度變化而變化。藉由量測因該等電極層之間之此靜態電容變化而引起之電極層之間之電位差,可檢測外力。即,此實施例可用作用於將機械能轉換成電能之感測器。 When an external force is applied to the surface of the sensor 3, the thickness of the dielectric layer 30 interposed between the upper electrode layer and the lower electrode layer changes at the pressing position, and the static capacitance between the electrode layers changes accordingly. And change. The external force can be detected by measuring the potential difference between the electrode layers caused by the change in the static capacitance between the electrode layers. That is, this embodiment can be used as a sensor for converting mechanical energy into electrical energy.

此外,儘管在本發明實施例之感測器3中形成3對夾有介電層之相對電極層,但可根據應用適宜地選擇電極之數目、大小、佈局或諸 如此類。 In addition, although three pairs of opposite electrode layers sandwiching the dielectric layer are formed in the sensor 3 of the embodiment of the present invention, the number, size, layout or the electrodes of the electrodes may be appropriately selected depending on the application. And so on.

發電元件係用於將機械能轉換成電能之轉換器。此發電元件可用於發電器件,開始於藉助天然能(例如波力、水力、水力或諸如此類)之發電以及因振動、撞擊、壓力變化或諸如此類引起之發電。此發電元件之實施例將闡述於下文中。 A power generation component is a converter for converting mechanical energy into electrical energy. This power generating element can be used for a power generating device, starting with power generation by natural energy (such as wave, hydraulic, hydraulic, or the like) and power generation due to vibration, impact, pressure change, or the like. Embodiments of this power generating component will be described below.

圖4展示其中堆疊介電層之本發明實施例之發電元件4之剖視圖。在此實施例中,介電層係由例如2個介電層構成。發電元件4係由介電層40a及40b以及電極層41a及41b構成。電極層41a及41b經配置覆蓋所接觸各別介電層之一個面。 4 shows a cross-sectional view of a power generating element 4 of an embodiment of the present invention in which a dielectric layer is stacked. In this embodiment, the dielectric layer is composed of, for example, two dielectric layers. The power generating element 4 is composed of dielectric layers 40a and 40b and electrode layers 41a and 41b. The electrode layers 41a and 41b are configured to cover one face of the respective dielectric layers that are in contact.

電極層41a及41b電連接至未圖解說明之負載。此發電元件4可藉由改變電極層41a與41b之間之距離來改變靜態電容,從而產生電能。即,由於藉由介電層40a及40b形成靜電場而造成呈靜電荷感應狀態之電極層41a與41b之間之元件形狀發生變化,故電荷分佈發生偏移,電極層之間之靜態電容因該偏移而發生變化,且在電極層之間產生電位差。 The electrode layers 41a and 41b are electrically connected to a load not illustrated. This power generating element 4 can change the static capacitance by changing the distance between the electrode layers 41a and 41b, thereby generating electric energy. That is, since the shape of the element between the electrode layers 41a and 41b in the electrostatic charge induction state is changed by the formation of the electrostatic field by the dielectric layers 40a and 40b, the charge distribution is shifted, and the static capacitance between the electrode layers is caused. This shift changes and a potential difference is generated between the electrode layers.

在本發明實施例中,由於自在平行於圖4中所示發電元件4之電極層41a及41b之面的方向上施加壓縮力之狀態(上圖)變成如同一圖中所示之未施加壓縮之狀態(下圖),故在電極層41a與41b之間產生電位差,且可藉由以電力形式輸出此電位差變化來實現發電元件之作用。即,可將機械能轉換成電能。此外,可將多個元件配置在基板上,且可藉由串聯或并聯該多個元件來構造產生更大電量之發電器件。 In the embodiment of the present invention, since the state in which the compressive force is applied in the direction parallel to the faces of the electrode layers 41a and 41b of the power generating element 4 shown in Fig. 4 (upper image) becomes uncompressed as shown in the same figure In the state (below), a potential difference is generated between the electrode layers 41a and 41b, and the power generation element can be realized by outputting this potential difference change in the form of electric power. That is, mechanical energy can be converted into electrical energy. Further, a plurality of components may be disposed on the substrate, and a power generating device that generates a larger amount of electricity may be constructed by connecting the plurality of components in series or in parallel.

本發明之轉換器可在空氣、水、真空或有機溶劑中進行操作此外,本發明之轉換器可根據轉換器之使用環境來適宜地密封。對密封方法無具體限制,且此密封方法例示為使用樹脂材料或諸如此類密封。 The converter of the present invention can be operated in air, water, vacuum or an organic solvent. Further, the converter of the present invention can be suitably sealed in accordance with the environment in which the converter is used. The sealing method is not particularly limited, and this sealing method is exemplified by using a resin material or the like.

較佳地,本發明之轉換器具有藉由固化用於轉換器用途之可固 化有機聚矽氧烷組合物形成之聚矽氧彈性物部件。 Preferably, the converter of the present invention has a solid state for use in a converter by curing A polyoxyxene elastomer component formed from an organopolyoxane composition.

首先,將解釋可固化有機聚矽氧烷組合物之每一聚矽氧組份,[特性1]至[特性3]以及可選[特性4]及[特性5]。 First, each of the polyoxyn components of the curable organopolyoxane composition will be explained, [characteristic 1] to [characteristic 3] and optional [characteristic 4] and [characteristic 5].

[反應性有機聚矽氧烷] [Reactive Organic Polyoxane]

本發明之可固化有機聚矽氧烷組合物包括由通式MaMR bDcDR dTeTR fQg表示之反應性有機聚矽氧烷。在上文所提及之通式中,M表示三有機矽氧基,D表示二有機矽氧基,T表示單有機矽氧基,且Q係表示SiO4/2之矽氧基單元。MR、DR及TR係矽氧基單元,其中分別由M、D及T表示之矽氧基單元之一個R取代基團係能夠在縮合反應、加成反應、過氧化反應或光反應中進行固化反應之取代基團;但此基團較佳係能夠進行加成反應之基團。在該等基團中,考慮到高反應速率及低副反應,能夠進行固化反應之取代基團較佳係在矽氫化反應中有活性之基團,即含有矽原子鍵結之氫原子或脂肪族不飽和鍵之基團(例如具有2至20個碳原子之烯基或諸如此類)。此外,上文所提及之反應性有機聚矽氧烷之非R取代基團較佳係不參與加成反應之基團或為高介電官能基,如例示為烷基,例如甲基、乙基、丙基、丁基、己基或諸如此類;芳基,例如苯基、鄰甲苯基、對甲苯基、萘基、鹵代苯基或諸如此類;烷氧基;或諸如此類。自經濟學之角度來看,在該等基團中甲基較佳。反應性有機聚矽氧烷之特定實例包含三甲基矽氧基-雙分子鏈封端之二甲基矽氧烷-甲基氫矽氧烷共聚物、三甲基矽氧基-雙分子鏈封端之二甲基矽氧烷-甲基乙烯基矽氧烷共聚物、二甲基氫矽氧基-雙分子鏈封端之二甲基矽氧烷-甲基氫矽氧烷共聚物、二甲基乙烯基矽氧基-雙分子鏈封端之二甲基矽氧烷-甲基乙烯基矽氧烷共聚物、甲基矽氧烷-二甲基矽氧烷-甲基氫矽氧烷共聚物、甲基矽氧烷-二甲基矽氧烷-甲基乙烯基矽氧烷共聚物、二甲基氫官能化MQ樹脂、二甲基乙烯基官能化MQ樹脂或諸如此類。 The curable organopolyoxane composition of the present invention comprises a reactive organopolyoxane represented by the general formula M a M R b D c D R d T e T R f Q g . In the above-mentioned formula, M represents a triorganomethoxy group, D represents a diorganomethoxy group, T represents a monoorganomethoxy group, and Q represents a methoxy group of SiO 4/2 . M R , D R and T R are decyloxy units, wherein one R substituent group of the methoxy unit represented by M, D and T, respectively, can be subjected to a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction reaction. The substituent group in which the curing reaction is carried out; however, the group is preferably a group capable of undergoing an addition reaction. Among these groups, in view of a high reaction rate and a low side reaction, a substituent group capable of undergoing a curing reaction is preferably a group active in a hydrogenation reaction, that is, a hydrogen atom or a fat containing a ruthenium atom-bonded bond. a group of a group of unsaturations (for example, an alkenyl group having 2 to 20 carbon atoms or the like). Further, the non-R substituent group of the reactive organopolyoxyalkylene mentioned above is preferably a group which does not participate in the addition reaction or is a high dielectric functional group, as exemplified as an alkyl group such as a methyl group, Ethyl, propyl, butyl, hexyl or the like; aryl, such as phenyl, o-tolyl, p-tolyl, naphthyl, halophenyl or the like; alkoxy; or the like. From an economic point of view, the methyl group is preferred in such groups. Specific examples of the reactive organopolyoxyalkylene include a trimethyl methoxy-bi-molecular chain-terminated dimethyl methoxy oxane-methylhydroquinone copolymer, a trimethyl decyloxy-bi-molecular chain a blocked dimethyl methoxy alkane-methylvinyl fluorene copolymer, a dimethylhydroquinone-bi-molecular chain-terminated dimethyl methoxy oxane-methyl hydrazine copolymer, Dimethylvinyl methoxy-bi-molecular chain-terminated dimethyl methoxy oxane-methyl vinyl fluorene copolymer, methyl oxa oxide - dimethyl methoxy hydride - methyl hydrazine An alkane copolymer, a methyl oxane-dimethyl methoxyalkane-methylvinyl fluorene copolymer, a dimethyl hydrogen functional MQ resin, a dimethyl vinyl functional MQ resin or the like.

上文所提及之反應性有機聚矽氧烷之數量平均分子量(Mw)介於300至10,000範圍內。此外,儘管對在25℃下在10(s-1)剪切速率條件下使用配備有20mm直徑之錐板之流變計量測的黏度無具體限制,但此黏度較佳介於1mPa.s至10,000mPa.s範圍內,且尤佳介於5mPa.s至5,000mPa.s範圍內。 The reactive organic polyoxyalkylene mentioned above has a number average molecular weight (Mw) in the range of from 300 to 10,000. Further, although there is no particular limitation on the viscosity of the rheological measurement equipped with a 20 mm diameter cone plate at a shear rate of 10 (s -1 ) at 25 ° C, the viscosity is preferably between 1 mPa. s to 10,000mPa. Within the s range, and especially between 5mPa. s to 5,000mPa. Within the scope of s.

[特性1]:反應性有機聚矽氧烷之含量 [Characteristic 1]: Content of reactive organic polyoxane

當上文所提及之反應性有機聚矽氧烷(經形成以使(a+c)/(b+d+e+f+g)之值小於3)相對於可固化有機聚矽氧烷組合物中矽氧烷組份之總量之比例小於0.1重量%時,聚矽氧烷組份中之交聯點數過低,且因此固化反應後之機械強度及介電破壞強度不足。相反,超過25重量%之比例並不適宜,此乃因交聯點數過多,且因此固化後彈性較高,且斷裂伸長率較低。此比例較佳小於或等於10重量%。 When the reactive organopolysiloxane described above is formed such that the value of (a+c)/(b+d+e+f+g) is less than 3) relative to the curable organopolyoxane When the proportion of the total amount of the oxoxane component in the composition is less than 0.1% by weight, the number of crosslinking points in the polyoxyalkylene component is too low, and thus the mechanical strength and dielectric breakdown strength after the curing reaction are insufficient. On the contrary, a ratio of more than 25% by weight is not suitable because the number of crosslinking points is excessive, and thus the elasticity after curing is high, and the elongation at break is low. This ratio is preferably less than or equal to 10% by weight.

[特性2]:僅在分子的兩個末端具有能夠進行固化反應之基團之反應性有機聚矽氧烷 [Characteristic 2]: Reactive organopolyoxane having only a group capable of undergoing a curing reaction at both ends of the molecule

下文將解釋僅在兩個分子鏈末端具有能夠進行固化反應之基團之反應性有機聚矽氧烷。在此處,術語「能夠進行固化反應之基團」意指能夠用作縮合反應、加成反應、過氧化反應或光反應中之基團之基團。然而,出於與彼等上文所闡述相似之原因,此基團較佳能夠進行加成反應。在該等能夠進行加成反應之基團中,基團較佳在矽氫化反應中有活性,即該基團係含有矽原子鍵結之氫原子之基團或含有脂肪族不飽和鍵之基團(例如具有2至20個碳原子之烯基或諸如此類)。反應性有機聚矽氧烷之特定實例包含二甲基氫矽氧基-雙分子鏈封端之聚二甲基矽氧烷及二甲基乙烯基矽氧基-雙分子鏈封端之聚二甲基矽氧烷。為進一步適於材料特性(例如機械特性、介電特性、耐熱特性或諸如此類),該等聚合物之一部分甲基可經乙基、丙基、丁基、己基或苯基置換。 Reactive organopolyoxane having only a group capable of undergoing a curing reaction at the end of two molecular chains will be explained below. Here, the term "group capable of undergoing a curing reaction" means a group which can be used as a group in a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction. However, for reasons similar to those set forth above, this group is preferably capable of undergoing an addition reaction. In such groups capable of undergoing an addition reaction, the group is preferably active in a hydrogenation reaction, that is, the group contains a group of a hydrogen atom bonded to a halogen atom or a group containing an aliphatic unsaturated bond. a group (for example, an alkenyl group having 2 to 20 carbon atoms or the like). Specific examples of the reactive organopolyoxyalkylene include dimethylhydroquinoneoxy-bi-molecular chain-terminated polydimethyl methoxy oxane and dimethylvinyl fluorenyl-bi-molecular chain terminated poly Methyl decane. To further suit material properties such as mechanical properties, dielectric properties, heat resistance properties, or the like, a portion of the methyl groups of the polymers can be replaced with ethyl, propyl, butyl, hexyl or phenyl groups.

僅在兩個分子鏈末端具有能夠進行固化反應之基團之反應性有機聚矽氧烷的數量平均分子量(Mw)介於300至100,000範圍內。此外,儘管對在25℃下在10(s-1)剪切速率條件下使用配備有20mm直徑之錐板之流變計量測的黏度無具體限制,但此黏度較佳介於1mPa.s至100,000mPa.s範圍內,且尤佳介於5mPa.s至10,000mPa.s範圍內。 The number average molecular weight (Mw) of the reactive organopolyoxane having only a group capable of undergoing a curing reaction at the end of two molecular chains is in the range of 300 to 100,000. Further, although there is no particular limitation on the viscosity of the rheological measurement equipped with a 20 mm diameter cone plate at a shear rate of 10 (s -1 ) at 25 ° C, the viscosity is preferably between 1 mPa. s to 100,000mPa. Within the s range, and especially between 5mPa. s to 10,000mPa. Within the scope of s.

相對於可固化有機聚矽氧烷組合物中之總矽氧烷組份小於75重量%之僅在兩個分子鏈末端具有能夠進行固化反應之基團之此反應性有機聚矽氧烷的比例不適宜,此乃因可能無法達成高斷裂伸長率。相反,當此值超過99.9重量%時,參與交聯反應之分子之比例變低,且固化後機械強度及介電破壞強度不足。因此,超過99.9重量%之比例不適宜。 a proportion of the reactive organopolyoxane having only a group capable of undergoing a curing reaction at the end of two molecular chains with respect to less than 75% by weight of the total oxane component in the curable organopolyoxane composition Not suitable, because high elongation at break may not be achieved. On the contrary, when the value exceeds 99.9% by weight, the proportion of molecules participating in the crosslinking reaction becomes low, and the mechanical strength and dielectric breakdown strength after curing are insufficient. Therefore, a ratio of more than 99.9% by weight is not suitable.

[特性3]:兩種類型之反應性有機聚矽氧烷(S)及(L)之應用 [Characteristic 3]: Application of two types of reactive organopolyoxyalkylenes (S) and (L)

反應性有機聚矽氧烷(S)在該兩個能夠進行固化反應之基團之間之平均分子量小於10,000,其係在單一分子中具有至少兩個能夠進行固化反應之基團之反應性有機聚矽氧烷且用於本發明中。反應性有機聚矽氧烷(L)在該兩個能夠進行固化反應之基團之間之平均分子量大於或等於10,000且小於或等於150,000,其係在單一分子中具有至少兩個能夠進行固化反應之基團之反應性有機聚矽氧烷且用於本發明中。該等反應性有機聚矽氧烷分別作為短鏈非反應性聚合物部分及長鏈非反應性聚合物部分含於分子中。在此處,在僅在分子鏈的兩個末端具有反應性官能基之鏈型有機聚矽氧烷情形下,在該兩個能夠進行交聯反應之基團之間之分子量定義為非反應性聚矽氧烷部分(不包含兩個末端之矽氧基單元)之分子量。在多個能夠進行交聯反應之基團之間之分子量情形下,此分子量為最長部分之分子量。 The reactive organic polyoxyalkylene (S) has an average molecular weight of less than 10,000 between the two groups capable of undergoing a curing reaction, and is a reactive organic having at least two groups capable of undergoing a curing reaction in a single molecule. Polyoxyalkylenes are used in the present invention. The reactive organic polyoxyalkylene (L) has an average molecular weight between the two groups capable of undergoing a curing reaction of greater than or equal to 10,000 and less than or equal to 150,000, which has at least two capable of curing in a single molecule. The reactive organopolyoxane of the group is used in the present invention. The reactive organopolyoxanes are contained in the molecule as a short chain non-reactive polymer portion and a long chain non-reactive polymer portion, respectively. Here, in the case of a chain type organopolyoxane having only a reactive functional group at both ends of a molecular chain, the molecular weight between the two groups capable of undergoing a crosslinking reaction is defined as non-reactivity The molecular weight of the polyoxyalkylene moiety (which does not contain the two terminal methoxy units). In the case of a molecular weight between a plurality of groups capable of undergoing a crosslinking reaction, this molecular weight is the molecular weight of the longest portion.

在組份(S)與組份(L)以1:99至40:60之範圍一起用作反應性有機聚矽氧烷原材料時,可將不同鏈長度之部分引入聚矽氧鏈部分中,從而 構成藉由固化反應獲得之聚矽氧彈性物。以此方式,可減少所獲得聚矽氧聚合物之永久應變,且可減少機械能轉換損失。具體而言,當將本發明之聚矽氧彈性物用於轉換器之介電層中時,組份(S)與組份(L)之此組合應用具有提高能量轉換效率之實用優點。 When the component (S) and the component (L) are used together as a reactive organopolyoxane raw material in the range of 1:99 to 40:60, portions of different chain lengths may be introduced into the polyoxyxene chain moiety. thereby A polyoxyxene elastomer obtained by a curing reaction is formed. In this way, the permanent strain of the obtained polyoxynitride polymer can be reduced, and the mechanical energy conversion loss can be reduced. Specifically, when the polyoxyxene elastomer of the present invention is used in a dielectric layer of a converter, the combined use of the component (S) and the component (L) has a practical advantage of improving energy conversion efficiency.

如先前所提及,可使用能夠進行縮合反應、加成反應、過氧化反應或光反應之基團作為該等組份之能夠進行固化反應之基團。然而,此基團較佳為能夠進行加成反應之基團。在能夠進行加成反應之基團中,基團較佳為在矽氫化反應中有活性之基團,即含有矽原子鍵結之氫原子或脂肪族不飽和鍵之基團(例如具有2至20個碳原子之烯基或諸如此類)。反應性有機聚矽氧烷(S)及(L)之特定實例係經引用作為上文所提及之由MaMR bDcDR dTeTR fQg表示之反應性有機聚矽氧烷之實例及經引用作為上文所提及之僅在兩個分子鏈末端具有能夠進行固化反應之基團之反應性有機聚矽氧烷的實例。出於與上文所闡述相同之原因,一部分甲基可經乙基、丙基、丁基、己基或苯基置換。 As mentioned previously, a group capable of undergoing a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction may be used as a group capable of undergoing a curing reaction of the components. However, this group is preferably a group capable of undergoing an addition reaction. In the group capable of undergoing an addition reaction, the group is preferably a group active in a hydrogenation reaction, that is, a group containing a hydrogen atom bonded to a halogen atom or an aliphatic unsaturated bond (for example, having 2 to Alkenyl of 20 carbon atoms or the like). Specific examples of reactive organopolyoxyalkylenes (S) and (L) are cited as reactive organic compounds represented by M a M R b D c D R d T e T R f Q g as mentioned above. Examples of polyoxyalkylenes and examples cited as reactive organopolysiloxanes having the groups capable of undergoing a curing reaction at the ends of two molecular chains mentioned above. For the same reasons as explained above, a portion of the methyl group may be replaced by an ethyl group, a propyl group, a butyl group, a hexyl group or a phenyl group.

偏離1:99至40:60範圍之組份(S)對下文所闡述之組份(L)之摻和比(重量含量比)S:L之值因無法滿足所獲得固化物件之至少一種類型之特性而不適宜,該等特性包含高斷裂伸長率、高機械強度、高介電破壞強度及低彈性模數。 The ratio of the composition (S) deviating from the range of 1:99 to 40:60 to the composition (L) described below (weight ratio) S:L cannot satisfy the at least one type of the cured article obtained. The characteristics are unsuitable, and these characteristics include high elongation at break, high mechanical strength, high dielectric breakdown strength, and low modulus of elasticity.

聚矽氧烷中矽原子鍵結之氫原子對矽原子鍵結之不飽和烴基團(Vi)之摻和比(莫耳比)較佳介於0.5至3.0範圍內。當此摻和比偏離上文所提及之範圍時,在固化後因矽氫化反應而保留之殘留官能基可對固化物件之材料物理性質造成不利影響。 The blend ratio (mol ratio) of the hydrogen atom bonded to the ruthenium atom in the polyoxyalkylene to the unsaturated hydrocarbon group (Vi) bonded to the ruthenium atom is preferably in the range of 0.5 to 3.0. When the blend ratio deviates from the range mentioned above, the residual functional groups remaining after the curing due to the hydrogenation reaction may adversely affect the physical properties of the material of the cured article.

[特性4]固化反應後每單位重量之交聯點數 [Characteristic 4] Number of crosslinking points per unit weight after curing reaction

此外,本發明之用於轉換器之可固化有機聚矽氧烷組合物包括下文所闡述之(A)及(B)。固化反應後反應性聚矽氧烷每單位重量之交聯點數係基於以下各項藉由下文所列示之計算公式來定義:(A)組份 及(B)組份中每一組份之數量平均分子量、下文所闡述通式中ai至gi及aj至gj之值以及組合物中每一組份之含量。固化反應後反應性聚矽氧烷每單位重量之此交聯點數較佳介於0.5μmol/g至20μmol/g範圍內,且進一步較佳介於0.5μmol/g至10μmol/g範圍內。 Further, the curable organopolyoxane composition for a converter of the present invention includes (A) and (B) as explained below. The number of cross-linking points per unit weight of the reactive polyoxyalkylene after the curing reaction is defined by the following formulas based on the following formula: (A) component and (B) each component of the component The number average molecular weight, the values of a i to g i and a j to g j in the formulae described below, and the content of each component in the composition. The number of crosslinking points per unit weight of the reactive polyoxyalkylene after the curing reaction is preferably in the range of from 0.5 μmol/g to 20 μmol/g, and further preferably in the range of from 0.5 μmol/g to 10 μmol/g.

(A)包括一或多個組份之有機氫聚矽氧烷,其由通式MaiMH biDciDH diTeiTH fiQgi表示,具有介於300至15,000範圍內之數量平均分子量(Mw),且在單一分子中具有平均至少2個矽鍵結氫原子 (A) an organohydrogen polyoxyalkylene comprising one or more components represented by the formula M ai M H bi D ci D H di T ei T H fi Q gi having a range of from 300 to 15,000 a number average molecular weight (Mw) and an average of at least 2 矽 bonded hydrogen atoms in a single molecule

(B)包括一或多個組份之有機聚矽氧烷,其由通式MajMVi biDciDVi djTejTVi fjQgj表示,具有介於300至100,000範圍內之數量平均分子量(Mw),且在單一分子中具有平均至少2個烯基。 (B) an organopolyoxane comprising one or more components, represented by the formula M aj M Vi bi D ci D Vi dj T ej T Vi fj Q gj , having a quantity ranging from 300 to 100,000 It has an average molecular weight (Mw) and has an average of at least 2 alkenyl groups in a single molecule.

在上文所提及之通式內,M表示R3SiO1/2;D表示R2SiO2/2;T表示RSiO3/2;且Q係由SiO4/2表示之矽氧烷單元;R係不具脂肪族碳-碳雙鍵之單價有機基團;MH、DH及TH係矽氧烷單元,其中分別由M、D及T表示之矽氧烷單元之一個R基團經矽原子鍵結之氫原子置換;MVi、DVi及TVi係矽氧烷單元,其中分別由M、D及T表示之矽氧烷單元之一個R基團經具有2至20個碳原子之烯基置換;a係每單一分子之平均數;b係每單一分子之平均數;c係每單一分子之平均數;d係每單一分子之平均數;e係每單一分子之平均數;f係每單一分子之平均數;且g係每單一分子之平均數;i表示組份(A)之第i個組份;且j表示組份(B)之第j個組份。 In the above-mentioned formula, M represents R 3 SiO 1/2 ; D represents R 2 SiO 2/2 ; T represents RSiO 3/2 ; and Q is a siloxane unit represented by SiO 4/2 . R is a monovalent organic group having no aliphatic carbon-carbon double bond; M H , D H and T H is a oxoxane unit, wherein one R group of a oxoxane unit represented by M, D and T, respectively; Substitution of a hydrogen atom via a ruthenium atom; M Vi , D Vi and T Vi are oxoxane units, wherein one R group of the oxoxane unit represented by M, D and T, respectively, has 2 to 20 carbons Alkenyl substitution of atoms; a is the average of each single molecule; b is the average of each single molecule; c is the average of each single molecule; d is the average of each single molecule; e is the average of each single molecule f is the average number per single molecule; and g is the average number per single molecule; i is the ith component of component (A); and j is the jth component of component (B).

上文所提及之每單位重量之交聯點數係使用下文所列示之指數值來計算,該等指數係由針對以下各項之公式中之每一者來定義:(i)端基間反應機率之指數,(ii)反應組合物之交聯點數之指數,(iii)反應組合物中原材料莫耳計數之指數,及(iv)反應組合物分子量之指數: The number of cross-linking points per unit weight mentioned above is calculated using the index values listed below, which are defined by each of the formulas for: (i) end groups The index of the probability of reaction, (ii) the index of the number of crosslinking points of the reaction composition, (iii) the index of the molar count of the raw material in the reaction composition, and (iv) the index of the molecular weight of the reaction composition:

在此處,定義上文所提及指數中之每一者之公式列示於下文中: Here, the formula defining each of the above mentioned indices is listed below:

(i)端基間反應機率之指數係由下式表示。 (i) The index of the probability of reaction between the end groups is represented by the following formula.

(ii)反應組合物之交聯點數之指數係基於上文所提及之端基間反應機率之指數由下式表示。 (ii) The index of the number of crosslinking points of the reaction composition is represented by the following formula based on the index of the reaction rate between the end groups mentioned above.

然而,在反應組合物之交聯點數之指數的計算中,其中表示分子鏈中反應性基團之間之有機矽氧烷單元之平均數的(a+c)/(b+d+e+f+g)之值小於3之組份被視為起單一交聯點作用,且對於該組份,依照(b+d)=0及(e+f+g)=1實施計算。 However, in the calculation of the index of the number of crosslinking points of the reaction composition, (a+c)/(b+d+e) which represents the average number of organic oxirane units between the reactive groups in the molecular chain The component having a value of less than 3 of +f+g) is regarded as a single crosslinking point, and for this component, calculation is performed in accordance with (b+d)=0 and (e+f+g)=1.

(iii)反應組合物中原材料莫耳計數之指數係由下式表示。 (iii) The index of the raw material molar count in the reaction composition is represented by the following formula.

(iv)反應組合物分子量之指數係由下式表示。 (iv) The index of the molecular weight of the reaction composition is represented by the following formula.

在此處,αi係組份(A)之第i個組份之摻和量αw i(以重量計之量)除以組份(A)中所含有之矽鍵結氫原子數H(莫耳)與組份(B)中所含有之烯基數Vi(莫耳)之比率(γ=H(莫耳)/Vi(莫耳))的值,即αiw i/γ;βj表示組份(B)之第j個組份之摻和量(以重量計之量);Mwi表示組份(A)之第i個組份之數量平均分子量;且Mwj表示組份(B)之第j個組份之數量平均分子量。 Here, [alpha] i-based parts component (A) of the i-th component of the blended amount of the α w i (by weight of the amount) of the component divided by the number of bonds of silicon bound hydrogen atoms H (A) contained in the (Mohr) and the ratio of the alkenyl number Vi (mole) contained in the component (B) (γ = H (mole) / Vi (mole)), that is, α i = α w i / γ ; β j represents the blending amount (by weight) of the jth component of the component (B); M wi represents the number average molecular weight of the i-th component of the component (A); and M wj represents The number average molecular weight of the jth component of component (B).

[特性5]固化反應後交聯點間分子量 [Characteristic 5] Molecular weight between crosslinking points after curing reaction

此外,固化反應後反應性聚矽氧烷之交聯點間分子量係基於以下各項藉由下式來定義:(A)組份及(B)組份中每一組份之數量平均分子量、以下通式之ai至gi及aj至gj之值以及組合物中每一組份之濃度,其中固化反應後反應性聚矽氧烷之交聯點間此分子量較佳介於100,000至2,000,000範圍內,且進一步較佳介於200,000至2,000,000範圍內: Further, the molecular weight between the cross-linking points of the reactive polyoxyalkylene after the curing reaction is defined by the following formula: the number average molecular weight of each component of the component (A) and the component (B), The values of a i to g i and a j to g j of the following general formula and the concentration of each component in the composition, wherein the molecular weight between the crosslinking points of the reactive polyoxyalkylene after the curing reaction is preferably from 100,000 to Within 2,000,000, and further preferably in the range of 200,000 to 2,000,000:

(A)係包括一或多個組份之有機氫聚矽氧烷,其由通式MaiMH biDciDH diTeiTH fiQgi表示,具有介於300至15,000範圍內之數量平均分子量(Mw),且在單一分子中具有平均至少2個矽鍵結氫原子。 (A) is an organohydrogen polyoxyalkylene comprising one or more components represented by the formula M ai M H bi D ci D H di T ei T H fi Q gi having a range of from 300 to 15,000 The number average molecular weight (Mw) and has an average of at least 2 ruthenium-bonded hydrogen atoms in a single molecule.

(B)係包括一或多個組份之有機聚矽氧烷,其由通式MajMVi biDciDVi djTejTVi fjQgj表示,具有介於300至100,000範圍內之數量平均分子量(Mw),且在單一分子中具有平均至少2個烯基。 (B) is an organopolyoxane comprising one or more components, represented by the formula M aj M Vi bi D ci D Vi dj T ej T Vi fj Q gj , having a range of from 300 to 100,000 The number average molecular weight (Mw) and has an average of at least 2 alkenyl groups in a single molecule.

(C)係用於在上文所提及之組份(A)與組份(B)之間進行加成反應之觸媒。 (C) is a catalyst for carrying out an addition reaction between the component (A) and the component (B) mentioned above.

在上文所提及之通式內,M表示R3SiO1/2;D表示R2SiO2/2;T表示RSiO3/2;且Q係由SiO4/2表示之矽氧烷單元;R係不具脂肪族碳-碳 雙鍵之單價有機基團;MH、DH及TH係矽氧烷單元,其中分別由M、D及T表示之矽氧烷單元之一個R基團經矽原子鍵結之氫原子置換;MVi、DVi及TVi係矽氧烷單元,其中分別由M、D及T表示之矽氧烷單元之一個R基團經具有2至20個碳原子之烯基置換;a係每單一分子之平均數;b係每單一分子之平均數;c係每單一分子之平均數;d係每單一分子之平均數;e係每單一分子之平均數;f係每單一分子之平均數;且g係每單一分子之平均數;i表示組份(A)之第i個組份;且j表示組份(B)之第j個組份。 In the above-mentioned formula, M represents R 3 SiO 1/2 ; D represents R 2 SiO 2/2 ; T represents RSiO 3/2 ; and Q is a siloxane unit represented by SiO 4/2 . R is a monovalent organic group having no aliphatic carbon-carbon double bond; M H , D H and T H is a oxoxane unit, wherein one R group of a oxoxane unit represented by M, D and T, respectively; Substitution of a hydrogen atom via a ruthenium atom; M Vi , D Vi and T Vi are oxoxane units, wherein one R group of the oxoxane unit represented by M, D and T, respectively, has 2 to 20 carbons Alkenyl substitution of atoms; a is the average of each single molecule; b is the average of each single molecule; c is the average of each single molecule; d is the average of each single molecule; e is the average of each single molecule f is the average number per single molecule; and g is the average number per single molecule; i is the ith component of component (A); and j is the jth component of component (B).

上文所提及之交聯點間分子量係基於基於下文表示之針對以下各項之計算公式計算之指數值:(i)端基間反應機率之指數,(ii')反應組合物之有機矽氧烷鏈計數之指數,(iii)反應組合物中原材料莫耳計數之指數,及(iv)反應組合物分子量之指數: The cross-linking point molecular weight mentioned above is based on an index value calculated based on the calculation formula for the following items: (i) an index of the reaction rate between the end groups, and (ii') an organic hydrazine of the reaction composition. The index of the oxyalkylene chain count, (iii) the index of the raw material mole count in the reaction composition, and (iv) the index of the molecular weight of the reaction composition:

在此處,定義上文所提及指數中之每一者之公式列示於下文中: Here, the formula defining each of the above mentioned indices is listed below:

(i)端基間反應機率之指數係由下式表示。 (i) The index of the probability of reaction between the end groups is represented by the following formula.

(ii')反應組合物之有機矽氧烷鏈計數之指數係由下式表示。 (ii') The index of the organooxyne chain count of the reaction composition is represented by the following formula.

然而,在反應組合物之交聯點數之指數的計算中,表示分子鏈中之反應性基團之間之有機矽氧烷單元之平均數的(a+c)/(b+d+e+f+g)之值小於3之組份被視為起單一交聯點作用,且對於該組份之計算假設(d+2e+2f+3g+1)=0。 However, in the calculation of the index of the number of crosslinking points of the reaction composition, (a+c)/(b+d+e) representing the average of the organooxane units between the reactive groups in the molecular chain. A component having a value of less than 3 of +f+g) is regarded as a single cross-linking point, and the calculation assumption (d+2e+2f+3g+1)=0 for the component.

(iii)反應組合物中原材料莫耳計數之指數係由下式表示。 (iii) The index of the raw material molar count in the reaction composition is represented by the following formula.

(iv)反應組合物分子量之指數係由下式表示。 (iv) The index of the molecular weight of the reaction composition is represented by the following formula.

在上文所提及之公式中,αi係組份(A)之第i個組份之摻和量αw i(以重量計之量)除以組份(A)中所含有之矽鍵結氫原子數H(莫耳)與組份(B)中所含有之烯基數Vi(莫耳)之比率(γ=H(莫耳)/Vi(莫耳))的值,即αiw i/γ;βj表示組份(B)之第j個組份之摻和量(以重量計之量);Mwi表示組份(A)之第i個組份之數量平均分子量;且Mwj表示組份(B)之第j個組份之數量平均分子量。上文所提及之數量平均分子量(Mw)係藉由核磁共振(NMR)之量測測定之值。 In the formula mentioned above, [alpha] i-based parts component (A) of the i-th component of the blended amount of the α w i (the amount by weight) divided by the silicon component (A) contained in the The ratio of the number of bonded hydrogen atoms H (mole) to the number of alkenyl groups Vi (mole) contained in the component (B) (γ = H (mole) / Vi (mole)), that is, α iw i /γ; β j represents the blending amount of the jth component of component (B) (by weight); M wi represents the average number of the ith component of component (A) Molecular weight; and M wj represents the number average molecular weight of the jth component of component (B). The number average molecular weight (Mw) mentioned above is a value measured by nuclear magnetic resonance (NMR) measurement.

藉由分子設計以將有機聚矽氧烷固化後每單位重量之交聯點數與交聯點間分子量調節至基於此專利說明書中所闡述之公式之某些範 圍內,可能實施調節以使所獲得之聚矽氧彈性物固化物件具有適用於轉換器部件之電特性及機械性質。藉由該分子設計可獲得用於製造聚矽氧彈性物固化物件及聚矽氧彈性物之加成可固化有機聚矽氧烷組合物,該聚矽氧彈性物固化物件及聚矽氧彈性物適於作為用作以下各項之材料:具有極佳特性之介電材料、用於轉換器部件之介電材料、尤其介電彈性物、且進一步尤其轉換器部件。 Molecular design to adjust the molecular weight per unit weight and the molecular weight between cross-linking points after solidification of the organopolysiloxane to some of the formulas based on the formulae described in this patent specification Within the enclosure, adjustments may be made such that the obtained polyoxyelastomer cured article has electrical and mechanical properties suitable for the components of the converter. The addition curable organopolyoxane composition for producing a polyoxyxene elastomer cured article and a polyoxyxene elastomer can be obtained by the molecular design, and the polyoxyxene elastomer cured article and the polyoxyxene elastomer Suitable as a material for use as a dielectric material with excellent properties, a dielectric material for converter components, in particular a dielectric elastomer, and further particularly a converter component.

[固化劑(C)] [curing agent (C)]

本發明之用於轉換器之可固化有機聚矽氧烷組合物包括作為必需成份之固化劑(C)。 The curable organopolyoxane composition for a converter of the present invention comprises a curing agent (C) as an essential component.

組份(C)較佳為通常已知之矽氫化反應觸媒。對本發明中所使用之組份(C)無具體限制,只要組份(C)係能夠促進矽氫化反應之物質即可。此組份(C)例示為基於鉑之觸媒、基於銠之觸媒及基於鈀之觸媒。由於觸媒活性較高,故尤其引用鉑家族元素觸媒及鉑家族元素化合物觸媒作為組份(C)。在無具體限制之情況下,基於鉑之觸媒例示為鉑細粉、鉑黑、氯鉑酸、經醇改質之氯鉑酸;烯烴-鉑錯合物、鉑-羰基錯合物,例如雙-乙醯乙酸鉑、雙(乙醯基乙酸)鉑或諸如此類;氯鉑酸-烯基矽氧烷錯合物,例如氯鉑酸-二乙烯基四甲基二矽氧烷錯合物、氯鉑酸-乙烯基四甲基環四矽氧烷錯合物或諸如此類;鉑-烯基矽氧烷錯合物,例如鉑-二乙烯基四甲基二矽氧烷錯合物、鉑-四乙烯基四甲基環四矽氧烷錯合物或諸如此類;及氯鉑酸與乙炔醇之間之錯合物。由於對矽氫化反應之觸媒活性較高,故組份(C)之推薦實例為鉑-烯基矽氧烷錯合物,且尤其為鉑1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷錯合物。 Component (C) is preferably a generally known hydrogenation reaction catalyst. The component (C) used in the present invention is not particularly limited as long as the component (C) is a substance capable of promoting the hydrogenation reaction. This component (C) is exemplified as a platinum-based catalyst, a ruthenium-based catalyst, and a palladium-based catalyst. Since the catalytic activity is high, a platinum family element catalyst and a platinum family element compound catalyst are particularly cited as the component (C). The platinum-based catalyst is exemplified by platinum fine powder, platinum black, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin-platinum complex, platinum-carbonyl complex, for example, without specific limitation. Bis-acetonitrile platinum, bis(acetic acid) platinum or the like; chloroplatinic acid-alkenyl alkoxylate complex, such as chloroplatinic acid-divinyltetramethyldioxane complex, Chloroplatinic acid-vinyltetramethylcyclotetraoxane complex or the like; platinum-alkenyl alkoxylate complex, such as platinum-divinyltetramethyldioxane complex, platinum- a tetravinyltetramethylcyclotetraoxane complex or the like; and a complex between chloroplatinic acid and acetylene alcohol. Since the catalytic activity for the hydrogenation reaction is high, a preferred example of the component (C) is a platinum-alkenyl alkane complex, and in particular platinum 1,3-divinyl-1,1,3 , 3-tetramethyldioxane complex.

此外,為進一步改良鉑-烯基矽氧烷錯合物之穩定性,可將該等鉑-烯基矽氧烷錯合物溶解於諸如以下等有機矽氧烷寡聚物中:1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷、1,3-二烯丙基-1,1,3,3-四甲基二矽氧 烷、1,3-二乙烯基-1,3-二甲基-1,3-二苯基二矽氧烷、1,3-二乙烯基-1,1,3,3-四苯基二矽氧烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷或諸如此類之烯基矽氧烷寡聚物;或二甲基矽氧烷寡聚物;或諸如此類。具體而言,較佳使用溶於烯基矽氧烷寡聚物中之鉑-烯基矽氧烷錯合物。 Further, in order to further improve the stability of the platinum-alkenyl alkoxysilane complex, the platinum-alkenyl alkoxylate complex may be dissolved in an organic siloxane oxide oligomer such as: 1,3 -divinyl-1,1,3,3-tetramethyldioxane, 1,3-diallyl-1,1,3,3-tetramethyldioxine Alkane, 1,3-divinyl-1,3-dimethyl-1,3-diphenyldioxane, 1,3-divinyl-1,1,3,3-tetraphenyl a decane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetraoxane or the like alkenyl oxyalkylene oligomer; or dimethyloxane An alkane oligomer; or the like. Specifically, a platinum-alkenyl alkoxylate complex dissolved in an alkenyloxyalkane oligomer is preferably used.

在無具體限制之情況下,組份(C)之使用量可係能夠促進本發明組合物之聚矽氧烷組份之加成反應的任何量。相對於聚矽氧烷組份之總重量,組份(C)中所含有之鉑家族金屬元素(例如鉑)之濃度通常介於0.01ppm至500ppm範圍內,較佳介於0.1ppm至100ppm範圍內,且進一步較佳介於0.1ppm至50ppm範圍內。 The component (C) may be used in an amount which is capable of promoting the addition reaction of the polyoxyalkylene component of the composition of the present invention, without particular limitation. The concentration of the platinum group metal element (for example, platinum) contained in the component (C) is usually in the range of 0.01 ppm to 500 ppm, preferably in the range of 0.1 ppm to 100 ppm, based on the total weight of the polyoxyalkylene component. And further preferably in the range of 0.1 ppm to 50 ppm.

[介電無機細粒(D)] [Dielectric Inorganic Fine Particles (D)]

本發明之用於轉換器之可固化有機聚矽氧烷組合物之特徵在於含有以下物質作為必需成份:具有上文所提及特性之可固化有機聚矽氧烷組合物、固化劑及(D)在室溫下在1kHz下比介電常數大於或等於10之介電粒子。藉由在包括上文所提及之可固化有機聚矽氧烷之固化物件中支持介電無機細粒,轉換器所需要之物理特性及電特性二者皆得以滿足。 The curable organopolyoxane composition for a converter of the present invention is characterized by containing as an essential component: a curable organopolyoxane composition having the above-mentioned characteristics, a curing agent, and (D) A dielectric particle having a specific dielectric constant greater than or equal to 10 at 1 kHz at room temperature. By supporting the dielectric inorganic fine particles in the cured article comprising the curable organopolysiloxane described above, both the physical and electrical properties required for the converter are satisfied.

介電無機細粒可選自例如由下文所列示之式(D1)表示之金屬氧化物(D1)(在下文中有時縮寫為「金屬氧化物(D1)」):Ma naMb nbOnc(D1) The dielectric inorganic fine particles may be selected, for example, from the metal oxide (D1) represented by the formula (D1) listed below (hereinafter sometimes abbreviated as "metal oxide (D1)"): M a na M b nb O nc (D1)

(在該式中,Ma係週期表之第2族金屬;Mb係週期表之第4族金屬;na係介於0.9至1.1範圍內之數字;nb係介於0.9至1.1範圍內之數字;且nc係介於2.8至3.2範圍內之數字)。 (In the formula, M a train of periodic table Group 2 metal; a metal of Group 4 of the Periodic Table of the lines M b; Na-based number from the range from 0.9 to 1.1; Nb lines between the range of 0.9 to 1.1 Number; and nc is a number between 2.8 and 3.2).

金屬氧化物(D1)中之週期表第2族金屬Ma之較佳實例包含鈹(Be)、鎂(Mg)、鈣(Ca)、鍶(Sr)及鋇(Ba)。引用鈦(Ti)作為週期表第4族金屬Mb之較佳實例。在由式(X1)表示之金屬氧化物之粒子中,Ma及Mb各自可為單一元素或可為2種或更多種元素。 Preferred examples of the Group 2 metal M a of the periodic table in the metal oxide (D1) include beryllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba). A preferred example of the titanium (Ti) is cited as the Group 4 metal M b of the periodic table. In the particles of the metal oxide represented by the formula (X1), each of M a and M b may be a single element or may be two or more elements.

金屬氧化物(D1)之特定實例包含鈦酸鋇、鈦酸鈣及鈦酸鍶。 Specific examples of the metal oxide (D1) include barium titanate, calcium titanate, and barium titanate.

此外,介電無機細粒可選自例如由下式表示之金屬氧化物(在下文中可稱為「金屬氧化物(D2)」):Ma naMb’ nb’Onc(D2) Further, the dielectric inorganic fine particles may be selected, for example, from a metal oxide represented by the following formula (hereinafter may be referred to as "metal oxide (D2)"): M a na M b' nb' O nc (D2)

(在該式中,Ma係週期表之第2族金屬;Mb'係週期表之第5族金屬;na係介於0.9至1.1範圍內之數字;nb'係介於0.9至1.1範圍內之數字;且nc係介於2.8至3.2範圍內之數字)。 (In the formula, M a train of periodic table Group 2 metal; M b 'train of periodic table Group 5 metal; Na-based number from the range from 0.9 to 1.1; nb' line range between 0.9 to 1.1 The number within; and nc is a number between 2.8 and 3.2).

金屬氧化物(D2)中之週期表第2族金屬Ma之較佳實例包含鈹(Be)、鎂(Mg)、鈣(Ca)、鍶(Sr)及鋇(Ba)。週期表第5族金屬元素Mb'之較佳實例包含錫(Sn)、銻(Sb)、鋯(Zr)及銦(In)。在由式(X2)表示之金屬氧化物之粒子中,Ma及Mb'各自可為單一類型之元素或可為2種或更多種元素。 Preferred examples of the Group 2 metal M a of the periodic table in the metal oxide (D2) include beryllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba). Preferred examples of the Group 5 metal element M b ' of the periodic table include tin (Sn), bismuth (Sb), zirconium (Zr), and indium (In). In the particles of the metal oxide represented by the formula (X2), each of M a and M b ' may be a single type of element or may be two or more elements.

金屬氧化物(D2)之特定實例包含錫酸鎂、錫酸鈣、錫酸鍶、錫酸鋇、銻酸鎂、銻酸鈣、銻酸鍶、銻酸鋇、鋯酸鎂、鋯酸鈣、鋯酸鍶、鋯酸鋇、銦酸鎂、銦酸鈣、銦酸鍶、銦酸鋇或諸如此類。 Specific examples of the metal oxide (D2) include magnesium stannate, calcium stannate, barium stannate, barium stannate, magnesium citrate, calcium citrate, barium strontium citrate, barium strontium silicate, magnesium zirconate, calcium zirconate, Barium zirconate, barium zirconate, magnesium indium, calcium indium, barium indium, barium indium or the like.

此外,在與該等金屬氧化物粒子之組合中,可允許使用其他金屬氧化物之粒子,例如鋯鈦酸鉛、鈦酸鋅、鈦酸鉛、氧化鈦或諸如此類(尤其除先前所列示之彼等以外之氧化鈦複合氧化物)。此外,可使用包括不同於該等實例之金屬元素之固溶體作為介電無機細粒(D)。 在此情形下,其他金屬元素例示為La(鑭)、Bi(鉍)、Nd(釹)、Pr(鐠)或諸如此類。 Furthermore, in combination with such metal oxide particles, particles of other metal oxides may be permitted, such as lead zirconate titanate, zinc titanate, lead titanate, titanium oxide or the like (especially in addition to those previously listed) Titanium oxide composite oxides other than those). Further, a solid solution including a metal element different from the above examples may be used as the dielectric inorganic fine particles (D). In this case, other metal elements are exemplified as La (镧), Bi (铋), Nd (钕), Pr (鐠), or the like.

在該等無機細粒中,介電無機細粒(D)之較佳實例包含一或多種類型之選自由以下組成之群之無機細粒:氧化鈦、鈦酸鋇、鈦酸鍶、鋯鈦酸鉛及鈦酸鋇,以及其中鈦酸鋇之鋇及鈦位置部分經鹼土金屬(例如鈣或鍶)、鋯或稀土金屬(例如釔、釹、釤或鏑)置換之複合金屬氧化物。氧化鈦、鈦酸鋇、鈦酸鍶以及其中鈦酸鋇及鋯酸鋇之鋇位置部分經鈣置換之複合金屬氧化物更佳,且氧化鈦及鈦酸鋇最佳。 Among the inorganic fine particles, preferred examples of the dielectric inorganic fine particles (D) include one or more types of inorganic fine particles selected from the group consisting of titanium oxide, barium titanate, barium titanate, and zirconium titanium. Lead acid and barium titanate, and composite metal oxides in which the barium and barium titanate portions are replaced by an alkaline earth metal such as calcium or barium, zirconium or a rare earth metal such as lanthanum, cerium, lanthanum or cerium. Titanium oxide, barium titanate, barium titanate, and a composite metal oxide in which the barium strontium titanate and barium zirconate are partially replaced by calcium, and titanium oxide and barium titanate are preferred.

對介電無機細粒(D)之形態無具體限制,且可使用任何形態,例如球狀、扁平狀、針狀、纖維狀或諸如此類。對無機細粒之粒子直徑無具體限制,且若藉由雷射繞射方法來量測球狀細粒,則例如體積平均粒子直徑可介於例如0.01μm至1.0μm範圍內。自模製處理能力及成膜能力之角度來看,平均粒子直徑較佳介於0.1μm至5μm範圍內。若無機細粒係其中形態為扁平狀、針狀、纖維狀或諸如此類之各向異性細粒,則儘管對該等細粒之縱橫比無限制,但該縱橫比通常可大於或等於5。 The form of the dielectric inorganic fine particles (D) is not particularly limited, and any form such as a spherical shape, a flat shape, a needle shape, a fibrous shape or the like can be used. The particle diameter of the inorganic fine particles is not particularly limited, and if the spherical fine particles are measured by a laser diffraction method, for example, the volume average particle diameter may be, for example, in the range of 0.01 μm to 1.0 μm. The average particle diameter is preferably in the range of from 0.1 μm to 5 μm from the viewpoint of molding processing ability and film forming ability. If the inorganic fine particles are anisotropic fine particles in which the form is flat, needle-like, fibrous or the like, the aspect ratio may be usually greater than or equal to 5 although the aspect ratio of the fine particles is not limited.

對介電無機細粒之粒徑分佈無具體限制,且介電無機細粒可為單分散細粒,或另一選擇為,可藉由降低細粒之間之空隙分率以較高密度填充來產生粒子直徑分佈,以改良機械強度。作為粒子直徑分佈之量度,藉由雷射光繞射方法量測之累積粒子直徑分佈曲線之90%累積面積(D90)下之粒子直徑對10%累積面積(D10)下粒子直徑的比率(D90/D10)較佳大於或等於2。此外,對粒子直徑分佈形狀(粒子直徑與粒子濃度之間之關係)無限制。可具有所謂的高原型分佈或為多峰(即雙峰(即具有兩個山形之分佈)、三峰或諸如此類)之粒子直徑分佈。 The particle size distribution of the dielectric inorganic fine particles is not particularly limited, and the dielectric inorganic fine particles may be monodisperse fine particles, or alternatively, may be filled at a higher density by reducing the void fraction between the fine particles. To produce a particle diameter distribution to improve mechanical strength. As a measure of the particle diameter distribution, the ratio of the particle diameter under the 90% cumulative area (D 90 ) of the cumulative particle diameter distribution curve measured by the laser light diffraction method to the particle diameter under the 10% cumulative area (D 10 ) ( D 90 /D 10 ) is preferably greater than or equal to 2. Further, there is no limitation on the particle diameter distribution shape (the relationship between the particle diameter and the particle concentration). There may be a so-called high prototype distribution or a particle diameter distribution that is multimodal (i.e., bimodal (i.e., having two mountain-shaped distributions), three peaks, or the like).

為製造本發明中所使用之介電無機細粒之諸如上文所述粒徑分佈之粒徑分佈,可採用多種方法,例如組合使用兩種或更多種類型之 具有不同平均直徑或粒徑分佈之細粒,摻和藉由篩分或諸如此類獲得之多種粒子直徑分率之粒子以產生期望粒徑分佈,或諸如此類。 In order to produce a particle size distribution of a particle size distribution such as the above-described dielectric inorganic fine particles used in the present invention, various methods may be employed, for example, two or more types are used in combination. Fine particles having different average diameters or particle size distributions, doped with particles of various particle diameter fractions obtained by sieving or the like to produce a desired particle size distribution, or the like.

此外,該等介電無機細粒可使用下文所闡述多種類型之表面處理劑來處理。 Furthermore, the dielectric inorganic fine particles can be treated using various types of surface treatment agents as set forth below.

考慮到所獲得固化物件之機械特性及介電特性,本發明之用於轉換器之可固化有機聚矽氧烷組合物中介電無機細粒之摻和量(負載分率)相對於組合物之總體積可大於或等於10%,較佳大於或等於15%,且進一步較佳大於或等於20%。此外,此摻和量相對於組合物之總體積較佳小於或等於80%,且進一步較佳小於或等於70%。 Considering the mechanical properties and dielectric properties of the cured article obtained, the blending amount (load fraction) of the dielectric inorganic fine particles of the curable organopolyoxane composition for a converter of the present invention is relative to the composition. The total volume may be greater than or equal to 10%, preferably greater than or equal to 15%, and further preferably greater than or equal to 20%. Further, the blending amount is preferably less than or equal to 80%, and further preferably less than or equal to 70%, relative to the total volume of the composition.

作為本發明之用於轉換器之可固化有機聚矽氧烷組合物的較佳實施例,引用包括以下各項作為必需成份之組合物:(A1)至少一種類型之有機氫聚矽氧烷,其在兩個分子末端具有矽原子鍵結之氫原子且具有0.01重量%至1.0重量%之氫原子重量含量,(A2)至少一種類型之有機氫聚矽氧烷,其在單一分子中具有至少3個矽原子鍵結之氫原子且具有0.03重量%至2.0重量%之氫原子重量含量,(B)至少一種類型之有機聚矽氧烷,其在單一分子中具有至少2個烯基且具有0.05重量%至0.5重量%之烯基重量含量,(C1)矽氫化反應觸媒,及(D)介電無機細粒,其具有在室溫下在1kHz下大於或等於10之比介電常數。 As a preferred embodiment of the curable organopolyoxane composition for a converter of the present invention, a composition comprising the following as an essential component is cited: (A1) at least one type of organohydrogenpolyoxane, It has a hydrogen atom bonded to a ruthenium atom at two molecular ends and has a hydrogen atom weight content of 0.01% by weight to 1.0% by weight, (A2) at least one type of organohydrogen polyoxyalkylene having at least one molecule in a single molecule 3 helium atom-bonded hydrogen atoms and having a hydrogen atom weight content of 0.03 wt% to 2.0 wt%, (B) at least one type of organopolyoxane having at least 2 alkenyl groups in a single molecule and having 0.05% by weight to 0.5% by weight of alkenyl weight content, (C1) hydrazine hydrogenation reaction catalyst, and (D) dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10 at 1 kHz at room temperature .

在此處,(A1)較佳為二甲基氫矽氧基-雙分子鏈封端之聚二甲基矽氧烷。(A2)之較佳實例包含三甲基矽氧基-雙分子鏈封端之二甲基矽氧烷-甲基氫矽氧烷共聚物及二甲基氫矽氧基-雙分子鏈封端之二甲基矽氧烷-甲基氫矽氧烷共聚物。另一方面,(B)組份例示為二甲基乙烯基矽氧基-雙分子鏈封端之聚二甲基矽氧烷。為進一步最佳化轉換器材料特性(例如機械特性、介電特性、耐熱性或諸如此類),可用乙基、丙基、丁基、己基或苯基來置換聚合物之一部分甲基。 Here, (A1) is preferably a dimethylhydroquinone-bi-molecular chain-terminated polydimethyloxane. Preferred examples of (A2) include a trimethyl decyloxy-bi-molecular chain-terminated dimethyl methoxy oxane-methylhydroquinone copolymer and a dimethylhydroquinone-bi-molecular chain termination Dimethyloxane-methylhydroquinoxane copolymer. On the other hand, the component (B) is exemplified by a dimethylvinyl methoxy-bi-molecular chain-terminated polydimethyl siloxane. To further optimize converter material properties (eg, mechanical properties, dielectric properties, heat resistance, or the like), one or more of the methyl groups of the polymer may be replaced with ethyl, propyl, butyl, hexyl or phenyl groups.

對(A1)、(A2)及(B)之分子量無具體限制,只要氫原子之重量含量及烯基之重量含量在上文所提及之範圍內即可。然而,矽氧烷單元數較佳為5至1,500。 The molecular weights of (A1), (A2) and (B) are not particularly limited as long as the weight content of the hydrogen atom and the weight content of the alkenyl group are within the ranges mentioned above. However, the number of units of the oxane is preferably from 5 to 1,500.

本發明之可固化有機聚矽氧烷組合物係用於轉換器之可固化有機聚矽氧烷組合物,且本發明之可固化有機聚矽氧烷組合物可進一步提供有下文所闡述之特性。 The curable organopolyoxane composition of the present invention is used in a curable organopolyoxane composition of a converter, and the curable organopolyoxane composition of the present invention can be further provided with the characteristics set forth below. .

[其他無機粒子(E)] [Other inorganic particles (E)]

本發明之可固化有機聚矽氧烷組合物可進一步包括一或多種類型之選自由以下組成之群之無機粒子(E):導電無機粒子、絕緣無機粒子及增強無機粒子。 The curable organopolyoxane composition of the present invention may further comprise one or more types of inorganic particles (E) selected from the group consisting of conductive inorganic particles, insulating inorganic particles, and reinforcing inorganic particles.

對所使用之導電無機粒子無具體限制,只要導電無機粒子賦予導電性即可,且可使用任何形態,例如粒子形、薄片形及纖維狀(包含鬚晶)。導電無機粒子之特定實例包含:導電碳,例如導電碳黑、石墨、單層碳奈米管、雙層碳奈米管、多層碳奈米管、富勒烯(fullerene)、富勒烯囊封之金屬、碳奈米纖維、氣相生長之單長度碳(VGCF)、碳微線圈或諸如此類;及金屬粉末,例如鉑、金、銀、銅、鎳、錫、鋅、鐵、鋁或諸如此類之粉末;以及經塗覆顏料,例如銻摻雜氧化錫、磷摻雜氧化錫、使用錫/銻氧化物、氧化錫、氧化銦、氧化銻、銻酸鋅、碳及石墨表面處理之針狀氧化鈦或經氧化錫或諸如此類表面處理之碳鬚晶;經至少一種類型之導電氧化物(例如錫摻雜氧化銦(ITO)、氟摻雜氧化錫(FTO)、磷摻雜氧化錫及磷摻雜氧化鎳)塗覆之顏料;具有導電性且在氧化鈦粒子表面中含有氧化錫及磷之顏料;視情況使用下文所闡述各種類型之表面處理劑對該等導電無機粒子進行表面處理。該等導電無機粒子可以一種類型或以2種或更多種類型之組合來使用。 The conductive inorganic particles to be used are not particularly limited as long as the conductive inorganic particles impart conductivity, and any form such as a particle shape, a flake shape, and a fiber shape (including whiskers) can be used. Specific examples of conductive inorganic particles include: conductive carbon, such as conductive carbon black, graphite, single-layer carbon nanotubes, double-layer carbon nanotubes, multilayer carbon nanotubes, fullerene, fullerene encapsulation Metal, carbon nanofibers, vapor grown single length carbon (VGCF), carbon microcoils or the like; and metal powders such as platinum, gold, silver, copper, nickel, tin, zinc, iron, aluminum or the like Powder; and coated pigments such as antimony doped tin oxide, phosphorus doped tin oxide, tin/bismuth oxide, tin oxide, indium oxide, antimony oxide, zinc antimonate, carbon and graphite surface treated acicular oxidation Titanium or tin oxide or such surface treated carbon whisker; at least one type of conductive oxide (eg tin doped indium oxide (ITO), fluorine doped tin oxide (FTO), phosphorus doped tin oxide and phosphorus doped Nickel oxide coated pigment; a pigment having conductivity and containing tin oxide and phosphorus in the surface of the titanium oxide particles; the conductive inorganic particles are surface-treated as appropriate using various types of surface treatment agents as described below. The conductive inorganic particles may be used in one type or in a combination of two or more types.

此外,導電無機細粒可係纖維,例如玻璃纖維、二氧化矽氧化 鋁纖維、氧化鋁纖維、碳纖維或諸如此類;或針狀增強材料,例如硼酸鋁鬚晶、鈦酸鉀鬚晶或諸如此類;或無機填充劑材料,例如玻璃珠、滑石、雲母、石墨、矽灰石、白雲石或諸如此類,該等細粒之表面已經導電物質(例如金屬或諸如此類)塗覆。 In addition, the conductive inorganic fine particles may be fibers, such as glass fibers, cerium oxide. Aluminum fiber, alumina fiber, carbon fiber or the like; or needle-like reinforcing material such as aluminum borate whisker, potassium titanate whisker or the like; or inorganic filler material such as glass beads, talc, mica, graphite, ash stone The dolomite or the like, the surfaces of the fine particles have been coated with a conductive substance such as a metal or the like.

藉由將導電無機粒子摻和至組合物中可增加聚矽氧烷固化物件之比介電常數。相對於可固化有機聚矽氧烷組合物,該等導電無機粒子之摻和量較佳介於0.01重量%至10重量%範圍內,且進一步較佳介於0.05重量%至5重量%範圍內。當摻和量偏離上文所提及之較佳範圍時,並不獲得摻和效應,或可能減弱固化物件之介電破壞強度。 The specific dielectric constant of the polyoxyalkylene cured article can be increased by blending the conductive inorganic particles into the composition. The amount of the conductive inorganic particles blended is preferably in the range of 0.01% by weight to 10% by weight, and more preferably in the range of 0.05% by weight to 5% by weight, based on the curable organopolyoxane composition. When the blending amount deviates from the above-mentioned preferred range, the blending effect is not obtained, or the dielectric breakdown strength of the cured article may be weakened.

本發明中所使用之絕緣無機粒子可係通常已知之任何絕緣無機材料。即,可在無限制的情況下使用體積電阻值為1010歐姆.公分(Ohm.cm)至1019歐姆.公分之任何無機材料之粒子,且可使用任何形態,例如微粒狀、薄片狀及纖維狀(包含鬚晶)。較佳特定實例包含陶瓷之球狀粒子、扁平狀粒子及纖維;金屬矽酸鹽、例如氧化鋁、雲母及滑石或諸如此類之粒子;及石英、玻璃或諸如此類。此外,該等絕緣無機粒子可使用下文所闡述各種類型之表面處理劑來進行表面處理。該等導電無機粒子可以一種類型或以2種或更多種類型之組合來使用。 The insulating inorganic particles used in the present invention may be any insulating inorganic material generally known. That is, the volume resistance value can be 10 10 ohms without limitation. Centimeters (Ohm.cm) to 10 19 ohms. Any of the inorganic material particles may be used in any form, such as particulate, flake, and fibrous (including whiskers). Preferred specific examples include ceramic spherical particles, flat particles and fibers; metal silicates such as alumina, mica and talc or the like; and quartz, glass or the like. Further, the insulating inorganic particles may be subjected to surface treatment using various types of surface treating agents described below. The conductive inorganic particles may be used in one type or in a combination of two or more types.

藉由將絕緣無機粒子摻和至組合物中可增加聚矽氧烷固化物件之機械強度及介電破壞強度,且有時可觀察到比介電常數增加。相對於可固化有機聚矽氧烷組合物,該等絕緣無機粒子之摻和量較佳介於0.1重量%至20重量%範圍內,且進一步較佳介於0.1重量%至5重量%範圍內。當絕緣無機粒子之摻和量偏離上文所提及之較佳範圍時,並不獲得摻和效應,或可能減弱固化物件之機械強度。 The mechanical strength and dielectric breakdown strength of the cured material of the polyoxyalkylene oxide can be increased by blending the insulating inorganic particles into the composition, and sometimes the specific dielectric constant is observed to increase. The blending amount of the insulating inorganic particles is preferably in the range of 0.1% by weight to 20% by weight, and further preferably in the range of 0.1% by weight to 5% by weight based on the curable organopolyoxane composition. When the blending amount of the insulating inorganic particles deviates from the above-mentioned preferred range, the blending effect is not obtained, or the mechanical strength of the cured article may be weakened.

本發明中所使用之增強無機粒子例示為發煙二氧化矽、濕型二氧化矽、矽粉、碳酸鈣、矽藻土、細石英粉、各種類型之非氧化鋁金 屬氧化物粉末、玻璃纖維、碳纖維或諸如此類。此外,該增強無機粒子可在使用下文所闡述之各種類型之表面處理劑處理後使用。在此處,儘管對增強無機粒子之粒子直徑無限制,但自改良機械強度之角度來看,比表面積較佳大於或等於50m2/g且小於或等於300m2/g,發煙二氧化矽尤佳。此外,自改良分散性之角度來看,較佳使用下文所闡述之二氧化矽偶合劑對發煙二氧化矽進行表面處理。然而,當(A)可固化有機聚矽氧烷組合物係加成可固化型有機聚矽氧烷組合物時,不使用經矽氮烷表面處理之發煙二氧化矽作為增強無機粒子。該等增強無機粒子可以單一類型使用,或可以2種或更多種類型之組合使用。 The reinforcing inorganic particles used in the present invention are exemplified by fuming cerium oxide, wet cerium oxide, cerium powder, calcium carbonate, diatomaceous earth, fine quartz powder, various types of non-alumina metal oxide powder, and glass fiber. , carbon fiber or the like. Further, the reinforced inorganic particles can be used after being treated with various types of surface treating agents set forth below. Here, although there is no limitation on the particle diameter of the reinforcing inorganic particles, the specific surface area is preferably greater than or equal to 50 m 2 /g and less than or equal to 300 m 2 /g from the viewpoint of improved mechanical strength, fuming cerium oxide Especially good. Further, from the viewpoint of improving the dispersibility, it is preferred to surface-treat the fumed cerium oxide using the cerium oxide coupling agent described below. However, when the (A) curable organopolyoxane composition is added to the curable organopolyoxane composition, the decazane surface treated fumed cerium oxide is not used as the reinforcing inorganic particles. The reinforcing inorganic particles may be used in a single type or may be used in combination of two or more types.

藉由將增強無機粒子摻和至組合物中可增加聚矽氧烷固化物件之機械強度及介電破壞強度。相對於可固化有機聚矽氧烷組合物,該等增強無機粒子之摻和量較佳介於0.1重量%至30重量%範圍內,且進一步較佳介於0.1重量%至10重量%範圍內。當摻和量偏離上文所提及之較佳範圍時,並不獲得無機粒子之摻和效應,或可固化有機聚矽氧烷組合物之模製可處理性可降低。 The mechanical strength and dielectric breakdown strength of the polyoxyalkylene cured article can be increased by blending the reinforcing inorganic particles into the composition. The blending amount of the reinforcing inorganic particles is preferably in the range of from 0.1% by weight to 30% by weight, and further preferably in the range of from 0.1% by weight to 10% by weight, based on the curable organopolyoxane composition. When the blending amount deviates from the above-mentioned preferred range, the blending effect of the inorganic particles is not obtained, or the mold processability of the curable organopolyoxane composition can be lowered.

本發明之可固化有機聚矽氧烷組合物可進一步包括導熱無機粒子。導熱無機粒子例示為金屬氧化物粒子,例如氧化鎂、氧化鋅、氧化鎳、氧化釩、氧化銅、氧化鐵、氧化銀或諸如此類;及無機化合物粒子,例如氮化鋁、氮化硼、碳化矽、氮化矽、碳化硼、碳化鈦、金剛石、金剛石樣碳或諸如此類。氧化鋅、氮化硼、碳化矽及氮化矽較佳。藉由將該等導熱無機粒子摻和至組合物中可增加聚矽氧烷固化物件之導熱性。相對於可固化有機聚矽氧烷組合物,該等增強無機粒子之摻和量較佳介於0.1重量%至30重量%範圍內。 The curable organopolyoxane composition of the present invention may further comprise thermally conductive inorganic particles. The thermally conductive inorganic particles are exemplified by metal oxide particles such as magnesium oxide, zinc oxide, nickel oxide, vanadium oxide, copper oxide, iron oxide, silver oxide or the like; and inorganic compound particles such as aluminum nitride, boron nitride, tantalum carbide , tantalum nitride, boron carbide, titanium carbide, diamond, diamond-like carbon or the like. Zinc oxide, boron nitride, tantalum carbide and tantalum nitride are preferred. The thermal conductivity of the polyoxyalkylene cured article can be increased by blending the thermally conductive inorganic particles into the composition. The blending amount of the reinforcing inorganic particles is preferably in the range of from 0.1% by weight to 30% by weight based on the curable organopolyoxane composition.

[無機粒子或諸如此類之表面處理] [Surface treatment of inorganic particles or the like]

然而,可藉由使用至少一種類型之表面處理劑使部分量或全部 量之上文所提及用於本發明可固化有機聚矽氧烷組合物中之介電無機細粒(D)及至少一種類型之無機粒子(E)經歷表面處理。對表面處理之類型無具體限制,且該表面處理例示為親水化處理及疏水化處理。疏水化處理較佳。當使用已經歷疏水化處理之無機粒子時,可增加有機聚矽氧烷組合物中無機粒子之負載度。此外,組合物之黏度增加受阻抑,且模製可處理性有所改良。 However, partial or total can be achieved by using at least one type of surface treatment agent The above-mentioned dielectric inorganic fine particles (D) and at least one type of inorganic particles (E) used in the curable organopolyoxane composition of the present invention are subjected to surface treatment. The type of the surface treatment is not particularly limited, and the surface treatment is exemplified by a hydrophilization treatment and a hydrophobizing treatment. Hydrophobization treatment is preferred. When the inorganic particles which have been subjected to the hydrophobization treatment are used, the degree of loading of the inorganic particles in the organopolyoxane composition can be increased. In addition, the viscosity increase of the composition is suppressed, and the mold processability is improved.

上文所提及之表面處理可藉由使用表面處理劑處理(或塗覆處理)無機粒子來實施。用於疏水化之表面處理劑例示為至少一種類型之選自由以下組成之群之表面處理劑:有機鈦化合物、有機矽化合物、有機鋯化合物、有機鋁化合物及有機磷化合物。表面處理劑可以單一類型使用或可以2種或更多種類型之組合使用。 The surface treatment mentioned above can be carried out by treating (or coating) the inorganic particles with a surface treating agent. The surface treatment agent for hydrophobization is exemplified by at least one type of surface treatment agent selected from the group consisting of an organotitanium compound, an organic cerium compound, an organozirconium compound, an organoaluminum compound, and an organophosphorus compound. The surface treatment agent may be used in a single type or may be used in a combination of two or more types.

有機鈦化合物例示為諸如以下等偶合劑:烷氧基鈦、鈦螯合物、丙烯酸鈦或諸如此類。該等化合物中之較佳偶合劑例示為烷氧基鈦化合物,例如鈦酸四異丙基酯或諸如此類;及鈦螯合物,例如四異丙基雙(二辛基磷酸酯)鈦酸酯或諸如此類。 The organotitanium compound is exemplified by a coupling agent such as titanium alkoxide, titanium chelate, titanium acrylate or the like. Preferred coupling agents in such compounds are exemplified by titanium alkoxide compounds such as tetraisopropyl titanate or the like; and titanium chelates such as tetraisopropylbis(dioctyl phosphate) titanate or And so on.

有機矽化合物例示為低分子量有機矽化合物,例如矽烷、矽氮烷、矽氧烷或諸如此類;及有機矽聚合物或寡聚物,例如聚矽氧烷、聚碳矽氧烷或諸如此類。較佳矽烷例示為所謂的矽烷偶合劑。該等矽烷偶合劑之代表性實例包含烷基三烷氧基矽烷(例如甲基三甲氧基矽烷、乙烯基三甲氧基矽烷、己基三甲氧基矽烷、辛基三甲氧基矽烷或諸如此類)、含有有機官能基之三烷氧基矽烷(例如縮水甘油氧基丙基三甲氧基矽烷、環氧基環己基乙基三甲氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷、胺基丙基三甲氧基矽烷或諸如此類)。較佳矽氧烷及聚矽氧烷包含六甲基二矽氧烷、1,3-二己基-四甲基二矽氧烷、三烷氧基矽基單封端聚二甲基矽氧烷、三烷氧基矽基單封端二甲基乙烯基單封端聚二甲基矽氧烷、三烷氧基矽基單封端有機官能基單封端聚二 甲基矽氧烷、三烷氧基矽基雙封端聚二甲基矽氧烷、有機官能基雙封端聚二甲基矽氧烷或諸如此類。當使用矽氧烷時,矽氧烷鍵數n較佳介於2至150範圍內。較佳矽氮烷例示為六甲基二矽氮烷、1,3-二己基-四甲基二矽氮烷或諸如此類。較佳聚碳矽氧烷例示為在聚合物主鏈中具有Si-C-C-Si鍵之聚合物。 The organic ruthenium compound is exemplified as a low molecular weight organic ruthenium compound such as decane, decane, decane or the like; and an organic ruthenium polymer or oligomer such as polyoxyalkylene, polycarbazane or the like. Preferred decanes are exemplified by the so-called decane coupling agents. Representative examples of such decane coupling agents include alkyl trialkoxy decanes (e.g., methyl trimethoxy decane, vinyl trimethoxy decane, hexyl trimethoxy decane, octyl trimethoxy decane, or the like), containing An organofunctional trialkoxysilane (for example, glycidoxypropyltrimethoxydecane, epoxycyclohexylethyltrimethoxydecane, methacryloxypropyltrimethoxydecane, aminylpropyl) Trimethoxy decane or the like). Preferably, the decane and the polyoxyalkylene comprise hexamethyldioxane, 1,3-dihexyl-tetramethyldioxane, a trialkoxyfluorenyl mono-terminated polydimethyloxane , trialkoxyfluorenyl mono-terminated dimethylvinyl single-terminated polydimethyl methoxy olefin, trialkoxy fluorenyl mono-terminated organic functional group single-end poly 2 Methyl methoxy alkane, trialkoxy fluorenyl double-terminated polydimethyl siloxane, organic functional double-terminated polydimethyl methoxy alkane or the like. When a decane is used, the number of decane bonds n is preferably in the range of 2 to 150. Preferred decazins are exemplified by hexamethyldioxane, 1,3-dihexyl-tetramethyldiazepine or the like. Preferred polycarbomethoxyanes are exemplified as polymers having Si-C-C-Si linkages in the polymer backbone.

有機鋯化合物例示為烷氧基鋯化合物(例如四異丙氧基鋯或諸如此類)及鋯螯合物。 The organic zirconium compound is exemplified by an alkoxy zirconium compound (e.g., tetraisopropoxy zirconium or the like) and a zirconium chelate.

有機鋁化合物例示為烷氧基鋁及鋁螯合物。 The organoaluminum compound is exemplified by aluminum alkoxide and aluminum chelate.

有機磷化合物例示為亞磷酸酯、磷酸酯及磷酸螯合物。 The organophosphorus compound is exemplified by a phosphite, a phosphate, and a phosphoric acid chelate.

在該等表面處理劑中,有機矽化合物較佳。在該等有機矽化合物中,矽烷、矽氧烷及聚矽氧烷較佳。如先前所闡述,使用烷基三烷氧基矽烷及三烷氧基矽基單封端聚二甲基矽氧烷最佳。 Among these surface treatment agents, an organic ruthenium compound is preferred. Among these organic ruthenium compounds, decane, decane and polyoxane are preferred. As stated previously, the use of alkyltrialkoxydecane and trialkoxyfluorenyl monocapped polydimethyloxane is preferred.

表面處理劑對上文所提及無機粒子之總量之比率較佳在大於或等於0.1重量%且小於或等於10重量%範圍內,且此範圍進一步較佳大於或等於0.3重量%且小於或等於5重量%。此外,處理濃度係所進給無機粒子對所進給處理劑之比率(重量比),且較佳在處理後移除過量處理劑。 The ratio of the surface treating agent to the total amount of the inorganic particles mentioned above is preferably in the range of 0.1% by weight or more and 10% by weight or less, and the range is further preferably greater than or equal to 0.3% by weight and less than or Equal to 5% by weight. Further, the treatment concentration is a ratio (weight ratio) of the fed inorganic particles to the fed treatment agent, and it is preferred to remove the excess treatment agent after the treatment.

[添加劑(F)] [Additive (F)]

本發明之可固化有機聚矽氧烷組合物可進一步包括用於改良脫模性或絕緣破壞特性之添加劑(F)。可有利地使用藉由將此聚矽氧烷組合物固化為薄片獲得之電活性聚矽氧彈性物片作為構成轉換器之電活性膜(介電層或電極層)。然而,在聚矽氧彈性物片在薄膜模製期間之脫模性較差時,且尤其在以高速製造介電膜時,介電膜可因脫模而受損。然而,本發明之用於轉換器之可固化有機聚矽氧烷組合物具有極佳脫模特性,且因此該可固化有機聚矽氧烷組合物之有利之處在於可在不使膜受損的情況下改良膜之製造速度。此添加劑進一步改良本 發明可固化有機聚矽氧烷組合物之該等特徵,且此添加劑可以單一類型或以2種或更多種類型之組合使用。另一方面,根據添加劑之名稱,使用改良絕緣破壞特性之添加劑來改良聚矽氧彈性物片之介電破壞強度。 The curable organopolyoxane composition of the present invention may further comprise an additive (F) for improving mold release property or dielectric breakdown property. An electroactive polysiloxane elastomer sheet obtained by curing the polyoxyalkylene composition into a sheet can be advantageously used as an electroactive film (dielectric layer or electrode layer) constituting the converter. However, when the release sheet of the polyoxyelastomer sheet during film molding is inferior, and especially when the dielectric film is manufactured at a high speed, the dielectric film may be damaged by demolding. However, the curable organopolyoxane composition for a converter of the present invention has excellent release properties, and thus the curable organopolyoxane composition is advantageous in that it does not damage the film. In the case of the improvement of the manufacturing speed of the film. This additive is further improved These features of the curable organopolyoxane composition are invented, and the additives may be used in a single type or in a combination of two or more types. On the other hand, the dielectric breakdown strength of the polyoxyxene elastomer sheet is improved by using an additive which improves the dielectric breakdown characteristics according to the name of the additive.

能夠使用之脫模改良添加劑(即脫模劑)例示為羧酸型脫模劑、酯型脫模劑、醚型脫模劑、酮型脫模劑、醇型脫模劑或諸如此類。該等脫模劑可以單一類型單獨使用或可以2種或更多種類型之組合使用。此外,儘管上文所提及之脫模劑不含矽原子,但亦可使用含有矽原子之脫模劑,或可使用該等脫模劑之混合物。 The release improving additive (i.e., mold release agent) which can be used is exemplified as a carboxylic acid type release agent, an ester type release agent, an ether type release agent, a ketone type release agent, an alcohol type release agent or the like. These release agents may be used singly in a single type or in combination of two or more types. Further, although the above-mentioned release agent does not contain a halogen atom, a release agent containing a halogen atom may be used, or a mixture of the release agents may be used.

不含矽原子之脫模劑可選自例如由以下組成之群:飽和或不飽和脂肪羧酸,例如棕櫚酸、硬脂酸或諸如此類;該等脂肪羧酸之鹼金屬鹽(例如硬脂酸鈉、硬脂酸鎂、硬脂酸鈣或諸如此類);脂肪羧酸與醇之酯(例如硬脂酸2-乙基己基酯、甘油三硬脂酸酯、新戊四醇單硬脂酸酯或諸如此類)、脂肪族烴(液體石蠟、石蠟或諸如此類)、醚(二硬脂基醚或諸如此類)、酮(二硬脂基酮或諸如此類)、高碳數醇(2-十六烷基十八醇或諸如此類)及該等化合物之混合物。 The release agent containing no halogen atoms may be selected, for example, from the group consisting of saturated or unsaturated aliphatic carboxylic acids such as palmitic acid, stearic acid or the like; alkali metal salts of such fatty carboxylic acids (for example, stearic acid) Sodium, magnesium stearate, calcium stearate or the like); esters of fatty carboxylic acids with alcohols (eg 2-ethylhexyl stearate, glyceryl tristearate, pentaerythritol monostearate) Or the like), an aliphatic hydrocarbon (liquid paraffin, paraffin or the like), an ether (distearyl ether or the like), a ketone (distearyl ketone or the like), a high carbon number alcohol (2-hexadecyl 10) Octaol or the like) and mixtures of such compounds.

含有矽原子之脫模劑較佳為不可固化聚矽氧型脫模劑。該等聚矽氧型脫模劑之特定實例包含非有機改質聚矽氧油,例如聚二甲基矽氧烷、聚甲基苯基矽氧烷、聚(二甲基矽氧烷-甲基苯基矽氧烷)共聚物、聚(二甲基矽氧烷-甲基(3,3,3-三氟丙基)矽氧烷共聚物或諸如此類;及改質聚矽氧油,例如胺基改質聚矽氧、胺基聚醚改質聚矽氧、環氧基改質聚矽氧、羧基改質聚矽氧、聚氧基伸烷基改質聚矽氧或諸如此類。該等含有矽原子之脫模劑可具有任何結構,例如直鏈、部分具支鏈之直鏈或環狀結構。此外,對該等矽油在25℃下之黏度無具體限制。此黏度較佳介於10mPa.s至100,000mPa.s範圍內,且進一步較佳介於50mPa.s至10,000mPa.s範圍內。 The release agent containing a ruthenium atom is preferably a non-curable polyfluorene type release agent. Specific examples of such polyoxotype release agents include non-organic modified polyoxyxides such as polydimethylsiloxane, polymethylphenyloxane, poly(dimethyloxane-A) Phenyl phenyl oxyalkylene) copolymer, poly(dimethyl methoxy oxane-methyl (3,3,3-trifluoropropyl) decane copolymer or the like; and modified polyoxyl oil, for example Amine-modified polyfluorene oxide, amino polyether modified polyfluorene oxide, epoxy modified polyoxymethylene, carboxyl modified polyoxyl, polyoxyalkylene modified polyoxyl or the like. The release agent of the ruthenium atom may have any structure, such as a linear or partially branched linear or cyclic structure. Further, the viscosity of the eucalyptus oil at 25 ° C is not particularly limited. The viscosity is preferably between 10 mPa. s is in the range of 100,000 mPa.s, and further preferably in the range of 50 mPa.s to 10,000 mPa.s.

儘管對脫模改良添加劑相對於可固化有機聚矽氧烷之總量之摻和量無具體限制,但此量較佳在大於或等於0.1重量%且小於或等於30重量%範圍內。 Although the blending amount of the demolding improving additive relative to the total amount of the curable organopolyoxane is not particularly limited, the amount is preferably in the range of 0.1% by weight or more and 30% by weight or less.

另一方面,絕緣破壞特性改良劑較佳為電絕緣改良劑。絕緣破壞特性改良劑例示為鋁或鎂氫氧化物或鹽、黏土礦物及該等物質之混合物。特定而言,絕緣破壞特性改良劑可選自由以下組成之群:矽酸鋁、硫酸鋁、氫氧化鋁、氫氧化鎂、煅燒黏土、蒙脫石、水滑石、滑石及該等試劑之混合物。此外,在可能需要時,可藉由上文所提及之表面處理方法對此絕緣改良劑進行表面處理。 On the other hand, the dielectric breakdown property improver is preferably an electrical insulation improver. The dielectric breakdown property improver is exemplified by aluminum or magnesium hydroxide or a salt, a clay mineral, and a mixture of such materials. In particular, the dielectric breakdown property modifier may be selected from the group consisting of aluminum citrate, aluminum sulfate, aluminum hydroxide, magnesium hydroxide, calcined clay, montmorillonite, hydrotalcite, talc, and mixtures of such agents. Further, the insulation modifier may be surface-treated by the surface treatment method mentioned above as may be required.

對此絕緣改良劑之摻和量無具體限制。相對於可固化有機聚矽氧烷之總量,此摻和量較佳在大於或等於0.1重量%且小於或等於30重量%範圍內。 The blending amount of the insulating improver is not specifically limited. The blending amount is preferably in the range of 0.1% by weight or more and 30% by weight or less based on the total amount of the curable organopolyoxane.

本發明之可固化有機聚矽氧烷組合物可包括不同於上文所提及之反應性有機聚矽氧烷之具有介電官能基之另一有機聚矽氧烷。 The curable organopolyoxane composition of the present invention may comprise another organopolyoxane having a dielectric functional group other than the reactive organopolyoxyalkylene mentioned above.

[固化機制] [Curing mechanism]

以相同方式,本發明之可固化有機聚矽氧烷組合物可進一步包括在分子中具有高介電官能基及至少一個能夠進行縮合固化反應、加成固化反應、過氧化固化反應或光固化反應之基團之化合物。藉由上文所提及之固化反應將此高介電官能基引入所獲得之固化物件(即電活性聚矽氧彈性物)中。 In the same manner, the curable organopolyoxane composition of the present invention may further comprise a high dielectric functional group in the molecule and at least one capable of undergoing a condensation curing reaction, an addition curing reaction, a peroxidation curing reaction or a photocuring reaction. a compound of the group. This high dielectric functional group is introduced into the obtained cured article (i.e., electroactive polyoxoelastomer) by the curing reaction mentioned above.

[高介電官能基之引入] [Introduction of high dielectric functional groups]

對於本發明之可固化有機聚矽氧烷組合物,上文所提及之反應性有機聚矽氧烷之一部分或全部可為進一步具有高介電官能基之反應性有機聚矽氧烷。 For the curable organopolyoxane composition of the present invention, part or all of the reactive organopolyoxane mentioned above may be a reactive organopolyoxane further having a high dielectric functional group.

若將藉由固化本發明之用於轉換器之可固化有機聚矽氧烷組合物獲得之電活性聚矽氧彈性物用於介電層,則介電層之比介電常數較 佳較高,且可引入高介電官能基以改良彈性物之比介電常數。 If the electroactive polyxene oxide obtained by curing the curable organopolyoxane composition for a converter of the present invention is used for a dielectric layer, the specific dielectric constant of the dielectric layer is higher. It is preferably higher and a high dielectric functional group can be introduced to improve the specific dielectric constant of the elastomer.

特定而言,可藉由例如以下方法增加可固化有機聚矽氧烷組合物及藉由固化可固化有機聚矽氧烷組合物獲得之固化電活性聚矽氧彈性物之介電性質:向可固化有機聚矽氧烷組合物中添加賦予高介電性質之組份,將高介電基團引入構成可固化有機聚矽氧烷組合物之有機聚矽氧烷組份中,或該等方法之組合。該等特定實施例及能夠引入之高介電官能基將於下文中予以解釋。 In particular, the dielectric properties of the curable organopolyoxane composition and the cured electroactive polyoxoelastomer obtained by curing the curable organopolyoxane composition can be increased by, for example, the following method: Adding a component imparting high dielectric properties to the cured organopolyoxane composition, introducing a high dielectric group into the organopolyoxane component constituting the curable organopolyoxane composition, or the methods The combination. These particular embodiments and the high dielectric functional groups that can be introduced are explained below.

在第一實施例中,用於轉換器之可固化有機聚矽氧烷組合物係自包括具有高介電基團之有機矽化合物之可固化有機聚矽氧烷組合物形成。在此可固化組合物中,可固化組合物中所含有之部分或全部反應性有機聚矽氧烷係進一步具有高介電官能基之反應性有機聚矽氧烷,且藉由固化獲得之電活性聚矽氧彈性物之比介電常數有所增加。 In a first embodiment, the curable organopolyoxane composition for a converter is formed from a curable organopolyoxane composition comprising an organic cerium compound having a high dielectric group. In the curable composition, a part or all of the reactive organopolyoxane contained in the curable composition further has a reactive organic polyoxane having a high dielectric functional group, and the electricity obtained by curing The specific dielectric constant of the reactive polyoxyelastomer is increased.

在第二實施例中,將具有高介電基團之有機矽化合物添加至可固化有機聚矽氧烷組合物中,且固化混合物以獲得比介電常數增加之電活性聚矽氧彈性物。具有高介電基團之有機矽化合物可與此可固化組合物中用於固化之組份分開添加。 In the second embodiment, an organic cerium compound having a high dielectric group is added to the curable organopolyoxane composition, and the mixture is cured to obtain an electroactive polyoxyxene elastomer having a higher specific dielectric constant. An organic cerium compound having a high dielectric group can be added separately from the component for curing in the curable composition.

在第三實施例中,將具有高介電基團及與可固化組合物中所含有之反應性有機聚矽氧烷反應之官能基的有機化合物添加至可固化有機聚矽氧烷組合物中,由此增加藉由固化獲得之電活性聚矽氧彈性物之比介電常數。由於有機化合物之與此可固化組合物中之反應性有機聚矽氧烷反應之官能基,在該有機化合物與該有機聚矽氧烷之間形成鍵,由此將高介電基團引入藉由固化獲得之電活性聚矽氧彈性物中。 In a third embodiment, an organic compound having a high dielectric group and a functional group reactive with a reactive organopolyoxyalkylene contained in the curable composition is added to the curable organopolyoxane composition. Thereby increasing the specific dielectric constant of the electroactive polysiloxane elastomer obtained by curing. Due to the functional group of the organic compound reacting with the reactive organopolyoxane in the curable composition, a bond is formed between the organic compound and the organopolyoxane, thereby introducing a high dielectric group An electroactive polyoxyelastomer obtained by curing.

在本發明之第四實施例中,將可與可固化有機聚矽氧烷組合物混溶且具有高介電基團之有機化合物添加至可固化有機聚矽氧烷組合物中,且因此增加藉由固化獲得之電活性聚矽氧彈性物之比介電常數。由於此可固化組合物中有機化合物與有機聚矽氧烷之間之可混溶 性,將具有該等高介電基團之有機化合物納入藉由固化獲得之電活性聚矽氧彈性物之基質中。 In a fourth embodiment of the present invention, an organic compound miscible with a curable organopolyoxane composition and having a high dielectric group is added to the curable organopolyoxane composition, and thus increased The specific dielectric constant of the electroactive polysiloxane elastomer obtained by curing. Due to the miscibility between the organic compound and the organopolyoxane in the curable composition An organic compound having the same high dielectric group is incorporated into a matrix of an electroactive polyoxyelastomer obtained by curing.

對本發明中之高介電基團無具體限制,且高介電基團可係與不含該基團時之介電性質相比,能夠增加藉由固化本發明之可固化有機聚矽氧烷組合物獲得之所獲得固化物件之介電性質之任何基團。在不受限制的情況下,本發明中所使用高介電基團之實例列示於下文中。 The high dielectric group in the present invention is not particularly limited, and the high dielectric group can be added to cure the curable organopolyoxane of the present invention by comparison with the dielectric properties in the absence of the group. Any group from which the composition obtains the dielectric properties of the cured article obtained. Examples of high dielectric groups used in the present invention are listed below without limitation.

a)鹵素原子及含有鹵素原子之基團 a) a halogen atom and a group containing a halogen atom

對鹵素原子無具體限制,且鹵素原子例示為氟原子及氯原子。可選擇含有鹵素原子之基團作為具有一或多個一或多種類型之選自氟原子及氯原子之原子之有機基團,如例示為鹵代烷基、鹵代芳基及鹵代芳基烷基。含有鹵素之有機基團之特定實例包含(但不限於)氯甲基、3-氯丙基、3,3,3-三氟丙基及全氟烷基。藉由引入該等基團,亦可預期改良本發明固化物件及自組合物獲得之固化物件之脫模能力。 The halogen atom is not particularly limited, and the halogen atom is exemplified by a fluorine atom and a chlorine atom. A group containing a halogen atom may be selected as the organic group having one or more types of atoms selected from a fluorine atom and a chlorine atom, as exemplified as a halogenated alkyl group, a halogenated aryl group and a halogenated arylalkyl group. . Specific examples of halogen-containing organic groups include, but are not limited to, chloromethyl, 3-chloropropyl, 3,3,3-trifluoropropyl, and perfluoroalkyl. By introducing such groups, it is also expected to improve the mold release ability of the cured article of the present invention and the cured article obtained from the composition.

b)含有氮原子之基團 b) a group containing a nitrogen atom

含有氮原子之基團例示為硝基、氰基(例如氰基丙基及氰基乙基)、醯胺基、亞胺基、脲基、硫脲基及異氰酸酯基團。 The group containing a nitrogen atom is exemplified by a nitro group, a cyano group (for example, a cyanopropyl group and a cyanoethyl group), a decylamino group, an imido group, a urea group, a thiourea group, and an isocyanate group.

c)含有氧原子之基團 c) a group containing an oxygen atom

含有氧原子之基團例示為醚基、羰基及酯基。 The group containing an oxygen atom is exemplified by an ether group, a carbonyl group, and an ester group.

d)雜環基團 d) heterocyclic groups

雜環基團例示為咪唑基團、吡啶基團、呋喃基團、吡喃基團、噻吩基團、酞青素基團及該等基團之複合物。 The heterocyclic group is exemplified by an imidazole group, a pyridyl group, a furan group, a pyran group, a thiophene group, an anthraquinone group, and a complex of such groups.

e)含硼基團 e) boron-containing groups

含硼基團例示為硼酸酯基團及硼酸鹽基團。 Boron-containing groups are exemplified as borate groups and borate groups.

f)含磷基團 f) phosphorus-containing groups

含磷基團例示為膦基團、膦氧化物基團、膦酸酯基團、亞磷酸酯基團及磷酸酯基團。 Phosphorus-containing groups are exemplified by phosphine groups, phosphine oxide groups, phosphonate groups, phosphite groups, and phosphate groups.

g)含硫基團 g) sulfur-containing groups

含硫基團例示為硫醇基團、硫醚基團、亞碸基團、碸基團、硫酮基團、磺酸酯基團及磺醯胺基團。 Sulfur-containing groups are exemplified by thiol groups, thioether groups, anthracene groups, anthracene groups, thioketone groups, sulfonate groups, and sulfonamide groups.

[其他可選成份:固化阻滯劑或諸如此類] [Other optional ingredients: curing retarders or the like]

本發明之用於轉換器之可固化有機聚矽氧烷組合物可包括通常摻和於有機聚矽氧烷組合物中之添加劑。只要不損害本發明之用於轉換器之可固化有機聚矽氧烷組合物之目標,可摻和任何添加劑,例如固化阻滯劑(固化阻抑劑)、阻燃劑、耐熱改良劑、著色劑、溶劑或諸如此類。若可固化有機聚矽氧烷組合物係加成反應可固化型有機聚矽氧烷組合物,則固化阻滯劑(固化阻抑劑)例示為(但不限於)炔烴醇,例如2-甲基-3-丁炔-2-醇、3,5-二甲基-1-己炔-3-醇、2-苯基-3-丁炔-2-醇或諸如此類;烯炔化合物,例如3-甲基-3-戊烯-1-炔、3,5-二甲基-3-己烯-1-炔或諸如此類;及苯并三唑。相對於總組合物(基於重量),固化阻滯劑(固化阻抑劑)之所使用濃度較佳介於1ppm至50,000ppm範圍內。 The curable organopolyoxane composition for a converter of the present invention may comprise an additive typically incorporated into an organopolyoxane composition. Any additive such as a curing retarder (curing inhibitor), a flame retardant, a heat resistance improver, and coloring may be blended as long as the object of the curable organopolyoxane composition for a converter of the present invention is not impaired. Agent, solvent or the like. If the curable organopolyoxane composition is an addition reaction curable organopolyoxane composition, the curing retarder (curing inhibitor) is exemplified by, but not limited to, an alkyne alcohol, such as 2- Methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 2-phenyl-3-butyn-2-ol or the like; an enyne compound, for example 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexene-1-yne or the like; and benzotriazole. The concentration of the curing retarder (curing inhibitor) is preferably in the range of from 1 ppm to 50,000 ppm with respect to the total composition (by weight).

[雜合物類型] [Hybrid type]

只要不損害本發明之目標,可藉由組合本發明之用於轉換器之可固化有機聚矽氧烷組合物與除該有機聚矽氧烷外之聚合物來進行雜合。藉由將有機聚矽氧烷與介電常數高於有機聚矽氧烷之聚合物雜合,可增加本發明組合物及自該組合物獲得之固化物件之介電常數。雜合涵蓋有機聚矽氧烷與非有機聚矽氧烷聚合物之所謂的聚合物摻和及藉由將有機聚矽氧烷與其他聚合物鍵結在一起(即所謂的共聚合)形成熔接聚合物。 Hybridization can be carried out by combining the curable organopolyoxane composition for a converter of the present invention with a polymer other than the organopolysiloxane, as long as the object of the present invention is not impaired. By mixing the organopolyoxane with a polymer having a higher dielectric constant than the organopolyoxane, the dielectric constant of the composition of the present invention and the cured article obtained from the composition can be increased. Hybrids encompass so-called polymer blending of organopolyoxyalkylenes with non-organic polyoxyalkylene polymers and by fusion of organic polyoxyalkylenes with other polymers (so-called copolymerization) polymer.

本發明之可固化有機聚矽氧烷組合物可為縮合可固化、加成可固化、過氧化可固化或光可固化有機聚矽氧烷組合物,但加成可固化有機聚矽氧烷組合物較佳。此可固化系統中可進一步包含藉由將上文 所提及之介電官能基添加至丙烯酸基團、甲基丙烯酸基團、環氧基團或硫醇基團之方法來引入有機聚矽氧烷分子鏈。除加成固化反應外,藉由使用此光可固化部分或電子束可固化部分,亦可使用光固化反應或電子束固化反應。若使用該等組合反應,則可將能夠藉由光或電子束固化之稱為單體及/或寡聚物之化合物(例如(甲基)丙烯酸酯及多官能基(甲基)丙烯酸酯化合物)進一步添加至上文所提及之可固化組合物中。此外,可添加所謂的光敏劑。 The curable organopolyoxane composition of the present invention may be a condensation curable, addition curable, peroxide curable or photocurable organopolyoxane composition, but an addition curable organopolyoxane combination The material is preferred. This curable system can be further included by The method of adding a dielectric functional group to an acrylic group, a methacrylic group, an epoxy group or a thiol group to introduce an organic polyoxyalkylene molecular chain. In addition to the addition curing reaction, a photocuring reaction or an electron beam curing reaction may also be used by using the photocurable portion or the electron beam curable portion. When such a combination reaction is used, a compound called a monomer and/or an oligomer (for example, a (meth) acrylate and a polyfunctional (meth) acrylate compound which can be cured by light or electron beam can be used. Further added to the curable composition mentioned above. Further, a so-called photosensitizer can be added.

[機械性質] [Mechanical properties]

當將作為藉由固化本發明之可固化有機聚矽氧烷組合物獲得之此轉換器部件之介電聚矽氧彈性物熱模製成厚度為2.0mm之片時,則可具有下文所列示之如基於JIS K 6249量測之機械性質。然而,根據此介電聚矽氧彈性物之應用及其他所需電特性,可使用機械性質超出該等機械性質範圍之介電聚矽氧彈性物。 When a dielectric polyoxyelastomer as a component of the converter obtained by curing the curable organopolyoxane composition of the present invention is thermoformed into a sheet having a thickness of 2.0 mm, it may have the following It is shown as a mechanical property based on the measurement of JIS K 6249. However, depending on the application of the dielectric polyoxyelastomer and other desired electrical properties, dielectric polyoxyelastomers having mechanical properties outside the range of such mechanical properties may be used.

(1)室溫下之楊氏模數(MPa)可設定在介於0.1MPa至10MPa範圍內,且尤佳範圍為0.1MPa至2.5Mpa。 (1) The Young's modulus (MPa) at room temperature can be set in the range of 0.1 MPa to 10 MPa, and particularly preferably in the range of 0.1 MPa to 2.5 MPa.

(2)室溫下之撕裂強度(N/mm)可設定為大於或等於1N/mm,且尤佳在大於或等於2N/mm範圍內。 (2) The tear strength (N/mm) at room temperature may be set to be greater than or equal to 1 N/mm, and particularly preferably greater than or equal to 2 N/mm.

(3)室溫下之撕裂強度(MPa)可設定為大於或等於1MPa,且尤佳在大於或等於2MPa範圍內。 (3) The tear strength (MPa) at room temperature may be set to be greater than or equal to 1 MPa, and particularly preferably greater than or equal to 2 MPa.

(4)斷裂伸長率(%)可設定為大於或等於100%,且自轉換器位移量之角度來看,尤佳介於200%至1,000%範圍內。 (4) The elongation at break (%) may be set to be greater than or equal to 100%, and is particularly preferably in the range of 200% to 1,000% from the viewpoint of the displacement amount of the transducer.

[介電特性] [Dielectric characteristics]

作為藉由固化本發明之可固化有機聚矽氧烷組合物獲得之此轉換器部件之介電聚矽氧彈性物具有下文所列示之介電特性。具體而言,本發明之一重要特性在於,除了藉助本發明組合物獲得諸如上文所闡述彼等之機械特性外,該組合物在低頻區中顯示極佳比介電常 數。 The dielectric polyoxyelastomer as the converter component obtained by curing the curable organopolyoxane composition of the present invention has the dielectric properties listed below. In particular, an important feature of the present invention is that, in addition to obtaining the mechanical properties such as those set forth above by means of the compositions of the present invention, the composition exhibits excellent specific dielectric properties in the low frequency region. number.

(1)當將可固化有機聚矽氧烷組合物熱模製成厚度為0.07mm之片時,介電破壞強度(V/μm)可設定為大於或等於20V/μm。儘管較佳介電破壞強度將根據轉換器之應用而變化,但介電破壞強度尤佳在大於或等於30V/μm範圍內。 (1) When the curable organopolyoxane composition is thermoformed into a sheet having a thickness of 0.07 mm, the dielectric breakdown strength (V/μm) can be set to be greater than or equal to 20 V/μm. Although the preferred dielectric breakdown strength will vary depending on the application of the converter, the dielectric breakdown strength is particularly preferably in the range of greater than or equal to 30 V/μm.

(2)當將可固化有機聚矽氧烷組合物熱模製成厚度為1mm之片時,在1MHz量測頻率及23℃量測溫度下量測之比介電常數可設定為大於或等於3.0。儘管較佳比介電常數將根據介電層之所需形式及轉換器之類型而變化,但在上文所提及之量測條件下比介電常數之尤佳範圍大於或等於5.0。 (2) When the curable organopolyoxane composition is hot molded into a sheet having a thickness of 1 mm, the specific dielectric constant measured at a measurement frequency of 1 MHz and a measurement temperature of 23 ° C may be set to be greater than or equal to 3.0. Although the preferred specific dielectric constant will vary depending on the desired form of the dielectric layer and the type of converter, a preferred range of specific dielectric constants under the above-described measurement conditions is greater than or equal to 5.0.

[製造方法] [Production method]

本發明之可固化有機聚矽氧烷組合物可藉由以下方式來製造:將可固化有機聚矽氧烷組份、固化觸媒、在室溫下在1kHz下比介電常數大於或等於10之介電無機細粒及視情況至少一種類型之無機粒子及其他添加劑添加至擠出機或捏合機(例如至少一種類型之選自由以下組成之群之機械構件:雙軸擠出機、雙軸捏合機及單葉型擠出機)中,且然後捏合混合物。具體而言,藉由使用自由體積為至少5,000(L/h)之雙軸擠出機來捏合反應性有機聚矽氧烷組份、介電無機細粒及表面處理劑,本發明可形成包括高濃度(例如至少80重量%)填充劑之矽橡膠複合物(母料)。然後較佳添加並捏合其他反應性有機聚矽氧烷組份、固化觸媒及其他組份以製造可固化有機聚矽氧烷組合物。 The curable organopolyoxane composition of the present invention can be produced by curing a curable organopolyoxane component, a curing catalyst, and having a specific dielectric constant greater than or equal to 10 at room temperature at 1 kHz. The dielectric inorganic fine particles and optionally at least one type of inorganic particles and other additives are added to an extruder or a kneader (for example, at least one type of mechanical member selected from the group consisting of: a twin screw extruder, a twin shaft In a kneader and a single blade extruder, and then kneading the mixture. Specifically, the present invention can be formed by kneading a reactive organopolyoxane component, a dielectric inorganic fine particle, and a surface treatment agent using a twin-screw extruder having a free volume of at least 5,000 (L/h). A high concentration (eg, at least 80% by weight) filler rubber composite (masterbatch). The other reactive organopolyoxane component, curing catalyst and other components are then preferably added and kneaded to produce a curable organopolyoxane composition.

介電無機細粒在藉由上文所提及之製造方法獲得之用於轉換器之可固化有機聚矽氧烷組合物的可固化有機聚矽氧烷組合物中以高密度充分分散,且因此可製造具有良好電特性及機械特性之轉換器部件。此外,可在製造轉換器部件期間獲得均勻膜狀固化物件,所獲得膜狀固化物件之電特性及機械特性極佳,且用於層壓或諸如此類之處 置能力極佳。 The dielectric inorganic fine particles are sufficiently dispersed at a high density in the curable organopolyoxane composition of the curable organopolyoxane composition for a converter obtained by the above-mentioned production method, and Therefore, a converter component having good electrical characteristics and mechanical characteristics can be manufactured. In addition, a uniform film-like cured article can be obtained during the manufacture of the transducer member, and the obtained film-like cured article is excellent in electrical and mechanical properties, and is used for lamination or the like. Excellent ability to set.

在上文所提及之捏合製程中,對不含硫化劑(固化觸媒)之聚矽氧橡膠化合物(母料)形成期間之溫度無具體限制。然而,將此溫度設定在介於40℃至200℃範圍內,且可設定在介於100℃至180℃範圍內。在使用雙軸擠出機或諸如此類之連續製程中,處理期間之滯留時間可設定為約30秒至5分鐘。 In the kneading process mentioned above, the temperature during formation of the polyoxyxene rubber compound (masterbatch) containing no vulcanizing agent (curing catalyst) is not specifically limited. However, this temperature is set in the range of 40 ° C to 200 ° C and can be set in the range of 100 ° C to 180 ° C. In a continuous process using a twin screw extruder or the like, the residence time during the treatment can be set to about 30 seconds to 5 minutes.

[本發明之用於轉換器之可固化有機聚矽氧烷組合物之應用] [Application of Curable Organic Polyoxane Composition for Converters of the Invention]

由於藉由固化或半固化本發明之可固化有機聚矽氧烷組合物獲得之電活性聚矽氧彈性物之介電特性及機械特性,故其可尤其有利地用作選自由以下組成之群之轉換器部件:人工肌肉、致動器、感測器及發電元件。 Since the dielectric properties and mechanical properties of the electroactive polyoxoelastomer obtained by curing or semi-curing the curable organopolyoxane composition of the present invention, it can be particularly advantageously used as a group selected from the group consisting of Converter components: artificial muscles, actuators, sensors and power generation components.

本發明之用於轉換器之可固化有機聚矽氧烷組合物可適宜地用於製造轉換器。本發明之用於轉換器之可固化有機聚矽氧烷組合物可包括所謂的B階材料而非僅包括未固化之可固化組合物,該B階材料呈反應性有機聚矽氧烷部分反應且未完全固化之狀態。本發明之B階材料例示為呈凝膠狀或具有流動性之狀態之材料。因此,本發明之實施例亦包括呈以下狀態之部件:其中用於轉換器之可固化有機聚矽氧烷組合物之固化反應已進行了一部分,且其中轉換器部件呈凝膠狀或流體狀態。此外,呈此半固化狀態類型之轉換器部件較佳由堆疊層之薄膜狀聚矽氧彈性物構成。 The curable organopolyoxane composition for a converter of the present invention can be suitably used to manufacture a converter. The curable organopolyoxane composition for a converter of the present invention may comprise a so-called B-stage material rather than only an uncured curable composition which is partially reactive with a reactive organopolyoxane. And not fully cured. The material of the B-stage of the present invention is exemplified as a material which is in the form of a gel or a fluid. Accordingly, embodiments of the present invention also include components in which the curing reaction of the curable organopolyoxane composition for the converter has been carried out in part, and wherein the converter member is in a gel or fluid state . Further, the converter member of the semi-cured state type is preferably composed of a film-like polyoxylene of a stacked layer.

實例 Instance

為體現本發明,現將給出實用實例及參考實例。然而應理解,該等實用實例並不限制本發明之範疇。此外,在下文中「%」表示重量百分率。 In order to embody the invention, practical examples and reference examples will now be given. However, it should be understood that such practical examples do not limit the scope of the invention. Further, "%" below indicates a weight percentage.

實用實例:轉換器之製備 Practical example: preparation of the converter

如下列參考實例中所顯示,製備其固化本體之物理性質不同之 可固化聚矽氧彈性物組合物或其調配物。調配物及於單層中量測之物理性質顯示於表1中。 As shown in the following reference examples, the physical properties of the cured body prepared are different. A curable polyoxyxene elastomer composition or a formulation thereof. The physical properties of the formulations and measurements in a single layer are shown in Table 1.

如表1中所顯示,提供具有極佳機械特性(如由斷裂伸長率表示)及介電特性(如由介電常數表示)之聚矽氧彈性物。此外,藉由最佳化交聯結構及無機細粒,可根據期望轉換器應用來設計材料。具體而言,如圖5中所展示,自本發明之可固化有機聚矽氧烷組合物獲得之聚矽氧彈性物即使在低電壓區仍獲得高介電性質。 As shown in Table 1, a polyoxyxene elastomer having excellent mechanical properties (e.g., expressed by elongation at break) and dielectric properties (e.g., expressed by dielectric constant) is provided. In addition, by optimizing the crosslinked structure and inorganic fine particles, materials can be designed according to the desired converter application. Specifically, as shown in FIG. 5, the polyoxyxene elastomer obtained from the curable organopolyoxane composition of the present invention achieves high dielectric properties even in a low voltage region.

本發明之轉換器係藉由將兩個或更多個聚矽氧彈性物堆疊成轉換器之作為整體之介電層並形成電極層來製備。此外,藉由堆疊兩個或更多個介電細粒或導電細粒含量不同之聚矽氧彈性物,可在作為整體之堆疊層中形成介電細粒或導電細粒之濃度梯度。相似地,藉由堆疊兩個或更多個電特性或機械強度不同之聚矽氧彈性物,可設計並形成轉換器之具有多種物理性質之多層部件。 The converter of the present invention is prepared by stacking two or more polyoxyelastomers into a dielectric layer of the converter as a whole and forming an electrode layer. Further, by stacking two or more dielectric fine particles or polyelectron oxides having different contents of conductive fine particles, a concentration gradient of dielectric fine particles or conductive fine particles can be formed in the stacked layer as a whole. Similarly, by stacking two or more polyoxyelastomers having different electrical or mechanical strengths, multilayer components of the converter having a variety of physical properties can be designed and formed.

此外,不論參考實例中之評估方法,可利用期望厚度大小或固化方法形成轉換器之期望多層部件。 Further, regardless of the evaluation method in the reference example, the desired multilayer size of the converter can be formed using a desired thickness size or curing method.

參考實例1 Reference example 1

向14.22%之在25℃下黏度為2,000mPa.s且兩個末端經二甲基乙烯基矽氧基封端之二甲基聚矽氧烷(B2)(乙烯基含量為0.23%)添加85.35%之平均粒子直徑為1.0μm之球狀鈦酸鋇(由Fuji Titanium Industry有限公司製造,HPBT-1B)、0.356%三甲氧基矽基單封端二甲基乙烯基單封端聚矽氧烷(平均聚合度=25)及0.071% 1,1,3-三甲基-3,3-二苯基-1-羧基癸基二矽氧烷。使用Ross混合器均勻混合後,在150℃下將混合物進一步加熱且混合30分鐘以獲得聚矽氧彈性物基質。 The viscosity to 14.22% at 25 ° C is 2,000 mPa. And spheroidal titanium having an average particle diameter of 1.0 μm added with 85.35% of dimethylpolyoxyalkylene (B 2 ) (vinyl content of 0.23%) at both ends via dimethylvinyloxyl-terminated Acid bismuth (manufactured by Fuji Titanium Industry Co., Ltd., HPBT-1B), 0.356% trimethoxydecyl mono-terminated dimethylvinyl monocapped polyoxyalkylene (average degree of polymerization = 25) and 0.071% 1,3-Trimethyl-3,3-diphenyl-1-carboxyindenyldioxane. After uniformly mixing using a Ross mixer, the mixture was further heated and mixed at 150 ° C for 30 minutes to obtain a polyoxyxene elastomer matrix.

以表1中所表示之摻和比向此聚矽氧彈性物中添加溶於二甲基乙烯基矽氧基雙封端甲基聚矽氧烷中之二甲基聚矽氧烷(B2)、二甲基氫 矽氧基-雙分子鏈封端之聚二甲基矽氧烷(A11,SiH含量=0.155%)、三甲基矽氧基-雙分子鏈封端之二甲基矽氧烷-甲基氫矽氧烷共聚物(A22,SiH含量為0.83%)、0.67%(以鉑計)之1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷錯合物之鉑錯合物以及作為反應控制劑之四甲基四乙烯基環四矽氧烷。將混合物混合直至均勻(約10分鐘)以獲得聚矽氧彈性物組合物。在此處,此聚矽氧彈性物組合物中之所有SiH官能基對所有乙烯基之莫耳比(SiH基團/乙烯基)為1.3。 To the polyoxyxene elastomer, dimethylpolysiloxane (B 2 ) dissolved in dimethylvinyl decyl double-terminated methyl polyoxyalkylene was added to the polyoxyether elastomer shown in Table 1. , dimethylhydroquinone-bi-molecular chain-terminated polydimethyloxane (A 11 , SiH content = 0.155%), trimethyl decyloxy-bi-molecular chain terminated dimethyl a decane-methylhydroquinone copolymer (A 22 , SiH content of 0.83%), 0.67% (in terms of platinum) of 1,3-divinyl-1,1,3,3-tetramethyl A platinum complex of a dioxane complex and a tetramethyltetravinylcyclotetraoxane as a reaction control agent. The mixture was mixed until homogeneous (about 10 minutes) to obtain a polyoxyxene elastomer composition. Here, the molar ratio of all SiH functional groups to all vinyl groups (SiH groups/vinyl groups) in the polyoxyxene elastomer composition was 1.3.

在此處,當反應性有機聚矽氧烷表示為MaMR bDcDR dTeTR fQg時,具有(a+c)/(b+d+e+f+g)之值之有機聚矽氧烷相對於可固化有機聚矽氧烷組合物中之全部矽氧烷組份之重量分率(X)小於3(即X=0.7%)。雙分子鏈封端之反應性有機聚矽氧烷相對於可固化有機聚矽氧烷組合物中矽氧烷組份之總量之重量分率(Y)為99.3%。反應性有機聚矽氧烷(S)(其在單一分子中具有至少2個能夠進行固化反應之基團,且在2個能夠進行固化反應之基團之間具有小於10,000之平均分子量)對反應性有機聚矽氧烷(L)(其在單一分子中具有至少2個能夠進行固化反應之基團,且在2個能夠進行固化反應之基團之間具有大於或等於10,000且小於或等於150,000之平均分子量)之摻和比(重量比S/L)為5.7/94.3。 Here, when the reactive organopolyoxane is represented by M a M R b D c D R d T e T R f Q g , it has (a+c)/(b+d+e+f+g The weight fraction (X) of the organopolyoxane relative to the total oxane component of the curable organopolyoxane composition is less than 3 (i.e., X = 0.7%). The weight fraction (Y) of the bimolecular chain-terminated reactive organopolyoxane relative to the total amount of the oxoxane component of the curable organopolyoxane composition was 99.3%. Reactive organopolyoxane (S) having at least 2 groups capable of undergoing a curing reaction in a single molecule and having an average molecular weight of less than 10,000 between two groups capable of undergoing a curing reaction An organopolysiloxane (L) having at least 2 groups capable of undergoing a curing reaction in a single molecule and having greater than or equal to 10,000 and less than or equal to 150,000 between two groups capable of undergoing a curing reaction The blending ratio (weight ratio S/L) of the average molecular weight) was 5.7/94.3.

另一方面,基於上文所提及聚有機矽氧烷原材料之化學結構、矽鍵結氫原子之含量、烯基之含量及數量平均分子量,每單位重量之交聯點數(J值)經計算為1.9μmol/g,且交聯點間分子量(K值)經計算為約898,000。 On the other hand, based on the chemical structure of the polyorganosiloxane raw material mentioned above, the content of the hydrazine-bonded hydrogen atom, the content of the alkenyl group, and the number average molecular weight, the number of crosslinking points per unit weight (J value) is It was calculated to be 1.9 μmol/g, and the molecular weight (K value) between the crosslinking points was calculated to be about 898,000.

在150℃下將此聚矽氧彈性物組合物加壓固化15分鐘,且然後在150℃下在爐中後固化60分鐘。基於JIS K 6249,量測所獲得固化物件之楊氏模數、抗拉強度、斷裂伸長率及撕裂強度。為量測機械強度,製造厚度為2mm之片。基於JIS K 6253量測6mm厚片之硬度計A硬 度。 The polyoxyxene elastomer composition was press cured at 150 ° C for 15 minutes and then post cured in an oven at 150 ° C for 60 minutes. The Young's modulus, tensile strength, elongation at break, and tear strength of the obtained cured article were measured based on JIS K 6249. To measure the mechanical strength, a sheet having a thickness of 2 mm was produced. Hardness test A hard based on JIS K 6253 measuring 6mm thick sheet degree.

此外,在150℃下將此聚矽氧彈性物組合物加壓固化15分鐘以製造0.07mm厚片,且使用由Soken Electric有限公司製造之電絕緣破壞電壓油測試儀(即PORTATEST 100A-2)量測絕緣破壞強度。以相同方式,在150℃下將矽彈性物組合物加壓固化15分鐘以製造厚度為1mm之片。在23℃之溫度及1MHz量測頻率條件下使用由Ando Electric有限公司製造之TR-1100介電常數-正切量測器件來量測比介電常數。結果展示於表1中。 Further, the polyoxyxene elastomer composition was press-cured at 150 ° C for 15 minutes to manufacture a 0.07 mm thick sheet, and an electrical insulation breakdown voltage oil tester (ie, PORTATEST 100A-2) manufactured by Soken Electric Co., Ltd. was used. Measure the dielectric breakdown strength. In the same manner, the ruthenium elastomer composition was press-cured at 150 ° C for 15 minutes to produce a sheet having a thickness of 1 mm. The specific dielectric constant was measured using a TR-1100 dielectric constant-tangent measuring device manufactured by Ando Electric Co., Ltd. at a temperature of 23 ° C and a measurement frequency of 1 MHz. The results are shown in Table 1.

參考實例2至33及比較參考實例1至3 Reference Examples 2 to 33 and Comparative Reference Examples 1 to 3

實施與參考實例1相同之程序,只是改變交聯劑A及聚合物B之添加量及化學結構,或在可能需要時使用表1中所列示之細粒,以獲得聚矽氧橡膠組合物。以相同方式計算上文所提及之X、Y、S/L、J及K值。以相同方式加熱並固化所獲得之組合物,且評估機械強度及電特性。該等結果展示於表1中。此外,在該表中,上文未闡述之交聯劑及聚合物之化學結構如下。 The same procedure as in Reference Example 1 was carried out except that the addition amount and chemical structure of the crosslinking agent A and the polymer B were changed, or the fine particles listed in Table 1 were used as necessary to obtain a polyoxyethylene rubber composition. . The X, Y, S/L, J and K values mentioned above were calculated in the same manner. The obtained composition was heated and cured in the same manner, and mechanical strength and electrical properties were evaluated. These results are shown in Table 1. Further, in the table, the chemical structures of the crosslinking agent and the polymer not described above are as follows.

B1:二甲基乙烯基雙封端聚二甲基矽氧烷 B 1 : dimethyl vinyl double-terminated polydimethyl decane

B3:二甲基乙烯基雙封端二甲基甲基全氟烷基矽氧烷共聚物 B 3 : dimethylvinyl double-terminated dimethylmethylperfluoroalkyl fluorene copolymer

B4:MQ樹脂 B 4 : MQ resin

B5、B6:乙烯基官能化MQ樹脂 B 5 , B 6 : vinyl functionalized MQ resin

A12:二甲基氫雙封端聚二甲基矽氧烷 A 12 : Dimethyl hydrogen double-terminated polydimethyl decane

A21-A24:三甲基矽基雙封端二甲基甲基氫矽氧烷共聚物 A 21 -A 24 : Trimethyl decyl double-terminated dimethyl methyl hydroquinone copolymer

A25:二甲基氫官能化MQ樹脂 A 25 : Dimethyl hydrogen functionalized MQ resin

(F)反應控制劑:四甲基四乙烯基環四矽氧烷 (F) Reaction Control Agent: Tetramethyltetravinylcyclotetraoxane

(C)Pt觸媒:鉑1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷錯合物 (C) Pt catalyst: platinum 1,3-divinyl-1,1,3,3-tetramethyldioxane complex

「固化聚矽氧彈性物薄膜之機電測試」 "Electromechanical Testing of Cured Polyoxo Elastomer Films" (參考實例23對比較實例4) (Refer to Example 23 for Comparative Example 4)

使用由碳黑及聚矽氧油構成之電極糊劑([阿斯伯裏(Asbury)導電碳級5303]/[Dow Corning FS1265氟聚矽氧油]=1/7(w/w))對基於本發明之固化薄膜(實例編號23)施加刷塗。界定活性EAP區域之電極施加(圓)之直徑介於10mm至20mm範圍內。使用由SRI international公司構造之Dow Corning機電測試儀實施機電測試以分析電場與厚度應變之間之關係。量測條件如下。 An electrode paste composed of carbon black and polyoxygenated oil ([Asbury conductive carbon grade 5303]/[Dow Corning FS1265 fluoropolyanhydride]=1/7 (w/w)) was used. A brush is applied based on the cured film of the present invention (Example No. 23). The electrode application (circle) defining the active EAP region has a diameter ranging from 10 mm to 20 mm. An electromechanical test was performed using a Dow Corning electromechanical tester constructed by SRI International to analyze the relationship between electric field and thickness strain. The measurement conditions are as follows.

1)溫度及濕度:在21℃-23℃下,且相對濕度為35%-52% 1) Temperature and humidity: at 21 ° C - 23 ° C, and the relative humidity is 35% - 52%

2)初始膜厚度:67μm 2) Initial film thickness: 67 μm

3)雙軸預拉伸:25% 3) Biaxial pre-stretching: 25%

4)雙軸拉伸後之膜厚度:43μm 4) Film thickness after biaxial stretching: 43 μm

5)電壓模式為0.5Hz方波型。在「0」伏特(volt)對測試電壓條件下,電極圓直徑之變化界定致動徑向應變。厚度應變因聚矽氧樣品之不可壓縮性而與徑向應變相關。電場定義為測試電壓除以「最終」膜厚度(再拉伸並致動後之膜厚度) 5) The voltage mode is a 0.5 Hz square wave type. The change in the diameter of the electrode circle defines the actuating radial strain at "0" volt versus test voltage. The thickness strain is related to the radial strain due to the incompressibility of the polyxmethylene sample. The electric field is defined as the test voltage divided by the "final" film thickness (film thickness after re-stretching and actuation)

隨電場(V/μm)變化之厚度應變(%)與作為對照材料的Sylgard 186(比較參考實例編號4)一起繪示於圖5中。 The thickness strain (%) which varies with the electric field (V/μm) is shown in Fig. 5 together with Sylgard 186 (Comparative Reference Example No. 4) as a control material.

圖5. 參考實例編號23及比較參考實例編號4之隨電場(V/μm)變化之厚度應變(%)。 Figure 5. Thickness strain (%) as a function of electric field (V/μm) with reference example number 23 and comparative reference example number 4.

1‧‧‧致動器 1‧‧‧Actuator

10a‧‧‧介電層 10a‧‧‧ dielectric layer

10b‧‧‧介電層 10b‧‧‧ dielectric layer

11a‧‧‧電極層 11a‧‧‧electrode layer

11b‧‧‧電極層 11b‧‧‧electrode layer

12‧‧‧導線 12‧‧‧ wire

13‧‧‧電源 13‧‧‧Power supply

Claims (16)

一種轉換器,其具有兩個或更多個含有有機聚矽氧烷之層。 A converter having two or more layers containing an organopolyoxane. 如請求項1之轉換器,其中該兩個或更多個含有有機聚矽氧烷之層係藉由固化兩種或更多種其固化本體之電特性或機械強度不同之可固化有機聚矽氧烷組合物獲得之聚矽氧彈性物層。 The converter of claim 1, wherein the two or more layers containing the organopolyoxane are curable organic polycondensation by curing two or more of their cured bodies having different electrical or mechanical strengths The polyoxyxene elastomer layer obtained from the oxyalkylene composition. 如請求項1或2之轉換器,其中該兩個或更多個含有有機聚矽氧烷之層係作為整體之介電層,且係由藉由固化兩種或更多種其固化本體之該等電特性或該機械強度不同之可固化有機聚矽氧烷組合物獲得之堆疊聚矽氧彈性物層組成。 The converter of claim 1 or 2, wherein the two or more layers containing the organopolyoxane are as a unitary dielectric layer and are cured by curing two or more of them The isoelectric properties or the stacked polyoxyxene elastomer layer obtained by the curable organopolyoxane composition having different mechanical strengths. 如請求項1至3中任一項之轉換器,其中該兩個或更多個層在作為整體之該等層中在其厚度方向上具有成份或官能基之濃度梯度。 The converter of any one of claims 1 to 3, wherein the two or more layers have a concentration gradient of a component or a functional group in a thickness direction thereof in the layers as a whole. 如請求項3之轉換器,其中成份或官能基之該濃度梯度係至少一種選自由以下組成之群之濃度梯度:一或多個有機聚矽氧烷之官能基含量、一或多種填充劑之含量、一或多種絕緣添加劑之含量及一或多種脫除添加劑之含量。 The converter of claim 3, wherein the concentration gradient of the component or functional group is at least one concentration gradient selected from the group consisting of: a functional group content of one or more organopolyoxanes, one or more fillers The content, the amount of one or more insulating additives, and the amount of one or more removal additives. 如請求項1至5中任一項之轉換器,其中兩個或更多個含有有機聚矽氧烷之層中之至少一者係藉由固化用於轉換器用途之可固化有機聚矽氧烷組合物形成之聚矽氧彈性物層,該可固化有機聚矽氧烷組合物包括:(A+B)滿足以下[特性1]、[特性2]及[特性3]之可固化有機聚矽氧烷組合物:[特性1]含有有機聚矽氧烷,其係由通式MaMR bDcDR dTeTR fQg表示之反應性有機聚矽氧烷,且其中(a+c)/(b+d+e+f+g)之值小於3,相對於該可固化有機聚矽氧烷組合物中之全部有機聚 矽氧烷組份,濃度範圍大於或等於0.1重量%且小於或等於25重量%,(在該通式中,M表示三有機矽氧基單元;D表示二有機矽氧基單元;T表示單有機矽氧基單元,Q表示由SiO4/2表示之矽氧基單元;MR、DR及TR各自係具有能夠進行固化反應之取代基團R之矽氧基單元,該固化反應係如一種選自由以下組成之群之類型:縮合反應、加成反應、過氧化反應及光反應);[特性2]相對於該可固化有機聚矽氧烷組合物中之總矽氧烷組份,含有大於或等於75重量%且小於或等於99.9重量%之反應性有機聚矽氧烷,該反應性有機聚矽氧烷僅在兩個分子末端具有能夠在縮合反應、加成反應、過氧化反應或光反應中進行固化反應之基團;[特性3]包括:(S)反應性有機聚矽氧烷其在單一分子中具有至少兩個能夠進行如一種選自由以下組成之群之類型之固化反應的基團:縮合反應、加成反應、過氧化反應及光反應,該反應性有機聚矽氧烷在該2個能夠進行該固化反應之基團之間具有小於10,000之平均分子量;(L)反應性有機聚矽氧烷,其在單一分子中具有至少兩個能夠進行如一種選自由以下組成之群之類型之固化反應的基團:縮合反應、加成反應、過氧化反應及光反應,該反應性有機聚矽氧烷在該2個能夠進行該固化反應之基團之間具有大於或等於10,000且小於或等於150,000之平均分子量;該組份(S)對該組份(L)之摻和比(重量比)介於1:99至40:60範圍內;(C)用於該可固化有機聚矽氧烷組合物之固化劑;及(D)介電無機細粒,其具有在室溫下在1kHz下大於或等於10之比介電常數。 The converter of any one of claims 1 to 5, wherein at least one of the two or more organic polyoxane-containing layers is cured by curing the organic polyfluorene used for the converter The polyoxyxene elastomer layer formed by the alkane composition, the curable organopolyoxane composition comprising: (A+B) curable organic poly group satisfying the following [characteristic 1], [characteristic 2], and [characteristic 3] A siloxane composition: [Characteristic 1] contains an organopolyoxane which is a reactive organopolyoxane represented by the formula M a M R b D c D R d T e T R f Q g , and Wherein the value of (a+c)/(b+d+e+f+g) is less than 3, and the concentration range is greater than or equal to the total organopolyoxane component of the curable organopolyoxane composition Equivalent to 0.1% by weight and less than or equal to 25% by weight, (in the formula, M represents a triorganomethoxy unit; D represents a diorganomethoxy unit; T represents a monoorganomethoxy unit, and Q represents SiO a methoxy group represented by 4/2 ; each of M R , D R and T R is a methoxy group having a substituent group R capable of undergoing a curing reaction, and the curing reaction is, for example, a group selected from the group consisting of Type: condensation reaction, addition reaction, peroxidation reaction, and photoreaction); [characteristic 2] contains greater than or equal to 75% by weight relative to the total oxetane component of the curable organopolyoxane composition a reactive organic polyoxane having less than or equal to 99.9% by weight, the reactive organopolyoxyalkylene having a curing reaction in a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction at only two molecular terminals a group; [characteristic 3] includes: (S) a reactive organopolyoxane having at least two groups capable of undergoing a curing reaction such as a group selected from the group consisting of a condensation reaction in a single molecule: a condensation reaction, An addition reaction, a peroxidation reaction, and a photoreaction, the reactive organopolyoxane having an average molecular weight of less than 10,000 between the two groups capable of undergoing the curing reaction; (L) a reactive organopolyoxane a group having at least two curing reactions in a single molecule capable of performing, for example, a type selected from the group consisting of a condensation reaction, an addition reaction, a peroxidation reaction, and a photoreaction, the reactive organic polyoxygen alkyl Having an average molecular weight of greater than or equal to 10,000 and less than or equal to 150,000 between the two groups capable of performing the curing reaction; the blending ratio (weight ratio) of the component (S) to the component (L) In the range of 1:99 to 40:60; (C) a curing agent for the curable organopolyoxane composition; and (D) a dielectric inorganic fine particle having a larger than 1 kHz at room temperature Or equal to the dielectric constant of 10. 如請求項1至6中任一項之轉換器,其中兩個或更多個含有有機聚矽氧烷之層中之至少一者係藉由固化用於轉換器用途之可固化有機聚矽氧烷組合物形成之聚矽氧彈性物層,該可固化有機聚矽氧烷組合物包括以下各項作為必需成份:(A1)至少一種類型之有機氫聚矽氧烷,其在兩個分子末端具有矽原子鍵結之氫原子,氫原子之重量分率為0.1重量%至1.0重量%;(A2)至少一種類型之有機氫聚矽氧烷,其在單一分子中具有至少3個矽原子鍵結之氫原子,氫原子之重量分率為0.03重量%至2.0重量%;(B)至少一種類型之有機聚矽氧烷,其在單一分子中具有至少2個烯基,該等烯基之重量分率為0.05重量%至0.5重量%;(C1)矽氫化反應觸媒;及(D)介電無機細粒,其具有在室溫下在1kHz下大於或等於10之比介電常數。 The converter of any one of claims 1 to 6, wherein at least one of the two or more organic polyoxane-containing layers is cured by curing the organic polyfluorene used for the converter A polyoxyxene elastomer layer formed from an alkane composition, the curable organopolyoxane composition comprising as an essential component: (A1) at least one type of organohydrogen polyoxyalkylene at the end of two molecules a hydrogen atom having a ruthenium atom bonded, the hydrogen atom having a weight fraction of 0.1% by weight to 1.0% by weight; (A2) at least one type of organic hydrogen polyoxyalkylene having at least 3 ruthenium atom bonds in a single molecule The hydrogen atom of the junction, the hydrogen atom having a weight fraction of 0.03 wt% to 2.0 wt%; (B) at least one type of organopolyoxane having at least 2 alkenyl groups in a single molecule, the alkenyl group The weight fraction is 0.05% by weight to 0.5% by weight; (C1) a hydrogenation reaction catalyst; and (D) a dielectric inorganic fine particle having a dielectric constant of greater than or equal to 10 at 1 kHz at room temperature. 如請求項1至7中任一項之轉換器,其中兩個或更多個含有有機聚矽氧烷之層中之至少一者係包括(E)至少一種類型之無機細粒的聚矽氧彈性物層,該至少一種類型之無機細粒係選自由以下組成之群:導電無機粒子、絕緣無機粒子及增強無機粒子。 The converter of any one of claims 1 to 7, wherein at least one of the two or more layers containing the organopolyoxane comprises (E) at least one type of inorganic fine particles of polyoxyl The elastomer layer, the at least one type of inorganic fine particles is selected from the group consisting of conductive inorganic particles, insulating inorganic particles, and reinforcing inorganic particles. 如請求項1至8中任一項之轉換器,其中兩個或更多個含有有機聚矽氧烷之層中之至少一者係包括一或多個細粒之聚矽氧彈性物層,該一或多個細粒之表面經一或多種類型之表面處理劑處理,且該粒子係以下中之至少一者:(D)具有在室溫下在1kHz下大於或等於10之比介電常數之介電無機細粒及(E)至少一種類型之選自由以下組成之群之無機粒子:導電無機粒子、絕緣無機粒子及增強無機粒子。 The converter of any one of claims 1 to 8, wherein at least one of the two or more organic polyoxane-containing layers comprises one or more fine particles of a polyoxyxene elastomer layer, The surface of the one or more fine particles is treated with one or more types of surface treatment agents, and the particles are at least one of: (D) having a dielectric ratio greater than or equal to 10 at 1 kHz at room temperature The constant dielectric inorganic fine particles and (E) at least one type of inorganic particles selected from the group consisting of conductive inorganic particles, insulating inorganic particles, and reinforcing inorganic particles. 如請求項1至9中任一項之轉換器,其中兩個或更多個含有有機聚矽氧烷之層中之至少一者係包括(F)用於改良脫模性或絕緣破壞特性之添加劑之聚矽氧彈性物層。 The converter according to any one of claims 1 to 9, wherein at least one of the two or more layers containing the organopolyoxane comprises (F) for improving mold release property or dielectric breakdown property. A layer of polyoxyxene elastomer of the additive. 如請求項1至10中任一項之轉換器,其中兩個或更多個含有有機聚矽氧烷之層中之至少一者係具有高介電官能基之聚矽氧彈性物層。 The converter of any one of claims 1 to 10, wherein at least one of the two or more layers containing the organopolyoxane is a polyoxyxene elastomer layer having a high dielectric functional group. 一種如請求項1至11中任一項之轉換器之製造方法,其包括以下步驟:將兩種或更多種其固化本體之電特性或機械強度不同之可固化有機聚矽氧烷組合物中之一種可固化有機聚矽氧烷組合物塗覆於基板上,及將該塗層固化成固化聚矽氧彈性物層,然後將其他可固化有機聚矽氧烷組合物進一步塗覆在該同一固化層上,且固化該塗層。 A method of manufacturing a transducer according to any one of claims 1 to 11, comprising the steps of: curing two or more curable organopolyoxane compositions having different electrical or mechanical strengths of the cured body One of the curable organopolyoxane compositions is coated on the substrate, and the coating is cured into a cured polyoxyxene elastomer layer, and then the other curable organopolyoxane composition is further coated thereon. The same cured layer is cured and the coating is cured. 一種如請求項1至11中任一項之轉換器之製造方法,其包括以下步驟:將兩種或更多種其固化本體之電特性或機械強度不同之可固化有機聚矽氧烷組合物中之一種可固化有機聚矽氧烷組合物塗覆於基板上,然後將其他可固化有機聚矽氧烷組合物進一步塗覆在該同一塗覆層上,且固化該堆疊的兩個或更多個不同塗覆層。 A method of manufacturing a transducer according to any one of claims 1 to 11, comprising the steps of: curing two or more curable organopolyoxane compositions having different electrical or mechanical strengths of the cured body One of the curable organopolyoxane compositions is applied to the substrate, and then the other curable organopolyoxyalkylene composition is further coated on the same coating layer, and two or more of the stack are cured. Multiple different coating layers. 如請求項12或13之轉換器製造方法,其中該可固化有機聚矽氧烷組合物係藉由模具塗覆來塗覆。 The converter manufacturing method of claim 12 or 13, wherein the curable organopolyoxane composition is applied by die coating. 如請求項12至14中任一項之轉換器製造方法,其中形成含有有機聚矽氧烷之介電層作為該兩個或更多個層,且然後在其至少一側上形成電極層。 The converter manufacturing method according to any one of claims 12 to 14, wherein a dielectric layer containing an organopolysiloxane is formed as the two or more layers, and then an electrode layer is formed on at least one side thereof. 如請求項12至14中任一項之轉換器製造方法,其中一次形成含有有機聚矽氧烷之介電層及電極層作為該兩個或更多個層。 The converter manufacturing method according to any one of claims 12 to 14, wherein a dielectric layer containing an organopolysiloxane and an electrode layer are formed at a time as the two or more layers.
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