TW201419564A - Method of manufacturing sensor unit - Google Patents

Abstract

The instant disclosure relates to a method of manufacturing sensor unit, comprising the following steps: A substrate is provided. A plurality of emitters and a plurality of detectors are attached to the substrate to define a plurality of sensor areas. The emitters and the detectors electrical connect with the substrate through wire bonding. A first molding process is proceeding to form a plurality of packages structures. The packages structure is corresponding to the sensor area, the packages structure covers the emitter and the detector. A top sheet is provided. The top sheet has a plurality of geometry of the openings. A second molding process is proceeding. The top sheet is disposed on the packages structures and through inject mold to form an isolation layer. The isolation layer is between the top sheet and the substrate, and the isolation layer is surrounding the packages structures. The last, a singulation process is proceeding to separate the sensor areas.

Description

Method of manufacturing inductor unit

The present invention relates to a method of fabricating an inductor unit, and more particularly to a method of fabricating an inductor unit formed by a two-mold molding process using a package top plate.

With the development of electronic products, many types of input devices are currently available for operation within electronic systems, such as buttons or buttons, mice, trackballs, touch screens, and the like. Recently, touch screen applications have become more and more popular. The touch screen may include a touch panel, which may be a transparent panel with a touch-sensitive surface so that the work surface covers the viewable area of the display screen. The touch screen allows the user to select and move the cursor by touching the display screen with a finger or a stylus, and to achieve an operation according to the touch event. Infrared light proximity sensors (IR proximity sensors) are widely used in handheld communication devices to detect the distance between the user's face and the display screen, thereby achieving operational control. The proximity sensor can be applied to handheld products, such as when the user does not use the screen function, the screen will automatically lock to extend battery life, or the touch panel can be automatically placed when the user's head is close to the screen. Lock the screen function to avoid interrupting the conversation by accidentally touching the keyboard during the call. In addition, the long-distance proximity sensor can detect whether an object with a distance of about 20 to 80 cm is close to each other, and can automatically turn off the power function when the user leaves, and can be applied to related products such as a display.

The proximity sensor has a signal emitter and a signal detector. In order to avoid the cross-talk of the signal, the prior proximity sensor structure is first After the package material encapsulates the signal transmitter and the signal detector, the metal frame is engaged with the package structure, and the metal frame is used to form a barrier structure with signal isolation. However, the above structure has the following defects: the fabrication and structure of the metal frame has its complexity; and the package structure needs to be glued, and the metal frame is fixed by means of adhesive. However, the coating of the adhesive is difficult to control, and the amount of glue will be too much. The problem of overflowing the glue; the amount of glue is too small, the metal frame is not well fixed, and it is easy to fall off or displace, which will result in poor signal isolation.

Furthermore, in the trend of shrinking the size of the components, the metal frame and the package structure must have a relatively high precision, so that they can be connected to each other to form a sensor unit with high isolation effect, so that the difficulty of the process is greatly improved, and the product is The yield cannot be effectively improved.

The object of the present invention is to provide a method for manufacturing an inductor unit, which is formed by two molding processes and using a package top plate to form a package structure and an isolated signal emission for protecting a signal transmitter and a signal detector. The isolation layer between the device and the signal detector forms a stable and highly accurate signal isolation structure.

The invention provides a method for manufacturing an inductor unit, which comprises the steps of: providing a substrate, attaching a plurality of signal transmitters and a plurality of signal detectors to the substrate, each signal transmitter and corresponding signal detector The detector defines a sensor area. Then, the signal transmitter and the signal detector of each sensor region are electrically connected to the substrate via wire bonding. Thereafter, a first molding process is performed to form a plurality of package structures on the substrate, and each package structure corresponds to an inductor region to encapsulate the signal emitter and the signal detector. mention For a package top plate, the package top plate has a plurality of geometric openings, and the openings correspond to the signal emitters and signal detectors of each of the sensor regions. Next, a second molding process is performed, and the package top plate is disposed on the package structures and through the injection molding step to form an isolation layer between the package top plate and the substrate, and the isolation layer covers the package structures. Four weeks, finally, a dicing process is performed to divide each of the sensor regions.

In summary, the present invention is low in the cost of mold manufacturing and does not require the use of assembled equipment, so that a cost-saving effect can be achieved compared to conventional techniques. The sensor unit manufactured by the invention has a high-precision coating and signal isolation structure, so that the sensor unit has low crosstalk interference and has better reliability. The two-molded structure can be stably combined, that is, the invention has a high fixed state in structure, is not easy to cause the problem of structural shedding, and is more reliable in ensuring product reliability.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

The invention provides a method for manufacturing an inductor unit, which is capable of achieving package and isolation of components of an inductor unit through two molding processes and using a process of packaging a top plate, which has the effect of reducing process cost, and The manufacturing method includes the following steps: Please refer to FIG. 1 , FIG. 1 shows the substrate 10 of the method for manufacturing the sensor unit 1 of the present invention having a signal transmitter 111 and a signal detector. A perspective view of 112. First, provide a substrate 10, and provide more a signal transmitter 111 and a plurality of signal detectors 112, and a plurality of signal transmitters 111 and a plurality of signal detectors 112 are attached to the substrate 10, and each of the signal transmitters 111 and the corresponding signal detectors The combination of detectors 112 will define a sensor region 11. The manner in which the signal transmitters 111 and the signal detectors 112 are attached to the substrate 10 is fixed on the substrate 10 by means of die attaching, or may be prior to the substrate. The step of dispensing or attaching the tape is performed on the 10, and the signal transmitter 111 and the signal detectors 112 are accurately placed in a predetermined position, and then fixed to the substrate 10 through adhesive or tape. It also includes the use of Plasma Cleaning to remove excess impurities and a clean surface. The signal transmitter 111 can be a light emitting diode, and the signal detector 112 can be an integrated Ambient and Proximity Sensor or a Proximity Sensor. The types of the transmitter 111 and the signal detector 112 are not limited to the above.

Please refer to FIG. 2, which is a perspective view of the method for manufacturing the inductor unit 1 of the present invention. The signal transmitter 111 and the signal detector 112 of each of the sensor regions 11 are electrically connected to the substrate 10 by wire bonding. The signal transmitter 111 and the signal detector 112 are connected by wire bonding to the pads of the signal transmitters 111 and the signal detectors 112. The other ends of the wires 113 are respectively soldered to the substrate 10 of the corresponding inductor region 11. The wires 113 used may be fine copper wires or wires 113 of other metals. Used wire 113 is not limited so that it forms a circuit loop. Then, it is checked whether there is an abnormality, such as poor contact of the wire 113 or breakage of the wire 113 to ensure the quality of the product, and then plasma cleaning to remove excess impurities.

Please refer to FIG. 3 , which is a perspective view of the molded package structure 12 of the method for manufacturing the inductor unit 1 of the present invention on the substrate 10 . Performing a first molding process to form a plurality of package structures 12 on the substrate 10, each package structure 12 corresponding to a sensor region 11 for encapsulating the signal emitter 111 and the signal detector 112. The material of the package structure 12 may be a light transmissive encapsulation material or an encapsulation material that can penetrate infrared light. In more detail, the first molding process is performed by a first mold (not shown) through a step of injection molding to form a plurality of package structures 12 on the substrate 10, in this step, The package material to be used is injected onto the substrate 10 through the first rubber channel 13 (Runner), and then subjected to a curing process to form the package structure 12 on the substrate 10, thereby covering the signal emitter 111 on the substrate 10 and The signal detector 112, and such that each package structure 12 corresponds to each of the sensor regions 11.

Therefore, the encapsulation material used in the step of the molding process must be such that the optical signal emitted by the signal transmitter 111 and the optical signal to be received by the signal detector 112 can be worn. Through, to avoid affecting the operation of the sensor unit 1. For example, the signal detector 112 is an integrated distance and ambient light sensing component, the packaging material is a light transmissive packaging material (such as a clear molded material), or the signal detector 112 is a single Functional distance sensing element, the package material is a package that allows infrared light to penetrate The material, in other words, the invention does not limit the material of the package structure 12, but the material of the package structure 12 must be selected according to the specifications of the signal transmitter 111 and the signal detector 112 to avoid the characteristics of the inductor unit 1 caused by the package structure 12. decline. Furthermore, the package structure 12 can be corresponding to the signal emitter 111 or the signal detector 112 to form a convex package, so that the signal transmitter 111 sends out a signal and the signal detector 112 receives the signal. Thereafter, it further includes removing the first rubber lane 13 on the substrate 10 and then using plasma cleaning to remove excess impurities.

Please refer to FIG. 4 , which is a perspective view of the package top plate 14 of the method for manufacturing the inductor unit 1 of the present invention. A package top plate 14 is provided. The package top plate 14 has a plurality of geometric openings, and the openings are respectively a signal transmitter 111 and a signal detector 112 for corresponding to each of the sensor regions 11. In more detail, the openings may be the emission openings 141 of the corresponding signal transmitter 111, and may be the receiving openings 142 of the corresponding signal detector 112, and may also be used in the second molding process. A glue injection opening 143 is injected into the colloid. In the present embodiment, since the signal emitters 111 of each of the inductor regions 11 are one, the number of the emission apertures 141 corresponding to each of the inductor regions 11 may be one. In addition, since the signal detector 112 can be an integrated distance and ambient light source sensing component or a distance sensing component, the receiving opening 142 corresponding to each of the sensor regions 11 can be one or two. The preferred geometry of the emission opening 141 and the receiving opening 142 may be circular to obtain a good function of transmitting and receiving signals. However, the geometry of the emission opening 141 and the receiving opening 142 is not limited. The preferred geometry on the glue injection opening 143 can be square to achieve good injection and bonding effects, however the geometry of the injection opening 143 is not It is limited and the quantity is not limited.

The manner in which the openings in the package top plate 14 are formed may be formed by stamping, laser cutting or casting. However, the manner in which the openings are formed is not limited to the above. The material of the package top plate 14 may be metal or plastic, and the color of the plastic is preferably dark or black. Further, the material of the package top plate 14 may be aluminum, iron (for example, SUS steel), epoxy resin (Epoxy), Polyetheretherketone (PEEK), Polyphenylene Sulfide (PPS) or IR blocking acrylic, etc., however, the material of the package top plate 14 is not limited to the above.

5 and FIG. 6 , FIG. 5 is a perspective view showing the package top plate 14 of the inductor unit 1 of the present invention disposed on the package structure 12 , and FIG. 6 is the inductor unit 1 of the present invention. A schematic view of the manufacturing process for a second molding process. Performing a second molding process, the package top plate 14 is disposed on the package structures 12 and through an injection molding step to form an isolation layer 16 between the package top plate 14 and the substrate 10, the isolation layer 16 covers the periphery of the package structures 12. In more detail, the package top plate 14 and the substrate 10 may be first placed in a second mold (not shown), and then the second mold (not shown) is closed to perform injection molding, and an isolation layer may be formed. The material of the 16 is injected between the substrate 10 and the package top plate 14 via the second adhesive channel 15 and then cured to form the isolation layer 16 , wherein the isolation layer 16 is made of an insulating material capable of isolating infrared light, that is, isolating. The layer 16 can be regarded as an IR barrier, and then includes removing the second glue channel 15. In a specific embodiment, the isolation layer 16 is formed into an encapsulating material capable of isolating infrared light through an injection molding step. The type and the injected colloid will enter the glue injection opening 143 of the package top plate 14 to achieve the effect of the insulation layer 16 being tightly coupled to the package top plate 14. In addition, since the package top plate 14 is provided with a transmitting opening 141 corresponding to the signal transmitter 111 and a receiving opening 142 corresponding to the signal detector 112, the glue does not cover the signal transmitter 111 and the signal during the injection molding step. The package structure 12 of the detector 112 passes through the transmitting opening 141 and the receiving opening 142 to enable the signal of the signal transmitter 111 and the signal detector 112 to be emitted and received. In addition, the isolation layer 16 is used to isolate the signal transmitter 111 and the signal detector 112 of each of the sensor units 1 to avoid cross-talk of signals between the two components. In addition, different types of sensor units 1 can also be designed by changing the geometric design of the package top plate 14.

Please refer to FIG. 7. FIG. 7 is a perspective view showing the dicing process of the method for manufacturing the inductor unit 1 of the present invention. After the second molding process is completed, a dicing process can be performed to divide each of the inductor regions 11. In this step, the cutting is performed by a thin saw blade or by laser cutting, which is cut along the cutting path 17 defined between each of the two inductor regions 11, in other words, the cutting path 17 is surrounded by each Sensor area 11. After the cutting, a single inductor region 11 is formed, which is the inductor unit 1 of the present invention.

Please refer to FIG. 8 to FIG. 11. FIG. 8 and FIG. 9 are schematic perspective views of the inductor unit 1 of the present invention, and FIGS. 10 and 11 are schematic cross-sectional views of the inductor unit 1 of the present invention. After the manufacturing process of the sensor unit 1 is performed, the structure of the sensor unit 1 includes a substrate 10 having a signal transmitter 111 and a signal detector 112, and a signal transmitter. 111 and signal detector 112 points It is not electrically connected to the substrate 10 by wire bonding or the like. A package structure 12 is disposed on the substrate 10 to be wrapped around the signal transmitter 111 and the signal detector 112. The package structure 12 can be selected according to the specifications of the signal transmitter 111 and the signal detector 112. The detector 112 is an integrated distance and ambient light sensing component, the packaging material is a light transmissive packaging material, or the signal detector 112 is a single function distance sensing component, and the packaging material is It is a packaging material that allows infrared light to penetrate. An isolation layer 16 is disposed between the package top plate 14 and the substrate 10. The isolation layer 16 covers the periphery of the package structures 12. The material of the isolation layer 16 can be an insulating material that can be insulated from the infrared light, that is, the isolation layer 16 can be regarded as an infrared light blocking structure, so that the signal of the signal transmitter 111 and the signal detector 112 does not interfere. a package top plate 14 having a plurality of geometric openings thereon, the openings may be the emission openings 141 of the corresponding signal transmitter 111, and may be the receiving openings 142 of the corresponding signal detector 112, and A glue injection opening 143 is injected into the colloid. In addition, the lower surface of the substrate 10, that is, the side of the signal transmitter 111 and the signal detector 112, is further provided with a plurality of connection points 18, such as a conductive metal pad, and the connection point 18 can be electrically connected to the signal. The transmitter 111 and the signal detector 112 are used to transmit control signals and power.

In summary, the present invention has the following advantages:

1. The present invention is low in the cost of mold manufacturing and does not require the use of assembled equipment, so that a cost-saving effect can be achieved compared to conventional techniques.

2. The sensor unit manufactured by the invention has a high-precision coating and signal isolation structure, so that the sensor unit has low crosstalk interference. And has better reliability.

3. The above two molded structure can be stably combined. In other words, the structure of the present invention has a high fixed state, which is not easy to cause the problem of structural shedding, and also ensures the reliability of the product.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalents of the present invention and the equivalents of the drawings are all included in the present invention. Within the scope of protection, it is given to Chen Ming.

1‧‧‧ sensor unit

10‧‧‧Substrate

11‧‧‧ sensor area

111‧‧‧Signal transmitter

112‧‧‧Signal Detector

113‧‧‧Wire

12‧‧‧Package structure

13‧‧‧First gel lane

14‧‧‧Package top plate

141‧‧‧ Launch opening

142‧‧‧ Receiving openings

143‧‧‧Glue injection hole

15‧‧‧Second rubber channel

16‧‧‧Isolation

17‧‧‧Cut Road

18‧‧‧ Connection point

1 is a perspective view of a substrate having a signal transmitter and a signal detector according to a method of manufacturing an inductor unit of the present invention.

2 is a perspective view showing the wire bonding of the method of manufacturing the inductor unit of the present invention.

3 is a schematic perspective view of a molded package structure of a method of manufacturing an inductor unit of the present invention on a substrate.

4 is a perspective view of a package top plate of a method of manufacturing an inductor unit of the present invention.

FIG. 5 is a perspective view showing the package top plate of the method for manufacturing the inductor unit of the present invention disposed on the package structures.

Fig. 6 is a perspective view showing the second molding process of the method for manufacturing the inductor unit of the present invention.

Fig. 7 is a perspective view showing the dicing process of the method of manufacturing the inductor unit of the present invention.

Figure 8 is a perspective view showing the combination of the inductor unit of the present invention.

Figure 9 is an exploded perspective view of the inductor unit of the present invention.

Figure 10 is a schematic cross-sectional perspective view of the inductor unit of the present invention.

Figure 11 is a schematic cross-sectional view showing the inductor unit of the present invention.

1‧‧‧ sensor unit

10‧‧‧Substrate

11‧‧‧ sensor area

111‧‧‧Signal transmitter

112‧‧‧Signal Detector

12‧‧‧Package structure

14‧‧‧Package top plate

141‧‧‧ Launch opening

142‧‧‧ Receiving openings

143‧‧‧Glue injection hole

16‧‧‧Isolation

Claims (10)

A method for manufacturing a sensor unit, comprising the steps of: providing a substrate, attaching a plurality of signal transmitters and a plurality of signal detectors to the substrate, each signal transmitter and a corresponding signal detector The combination defines a sensor area; the signal transmitter and the signal detector of each sensor area are electrically connected to the substrate by wire bonding; the first molding process is performed to Forming a plurality of package structures on the substrate, and each package structure corresponds to an inductor region to cover the signal emitter and the signal detector; providing a package top plate having a plurality of geometric figures on the package top plate Openings for respectively corresponding to the signal emitter and the signal detector of each sensor region; performing a second molding process, and placing the package top plate on the package structures Forming an isolation layer between the top plate of the package and the substrate through an injection molding step, the isolation layer covering the periphery of the package structures; and performing a crystal cutting process to divide Each of the sensor area. The method of manufacturing the sensor unit of claim 1, wherein the attaching the plurality of signal emitters and the plurality of signal detectors to the substrate is fixed on the substrate by a method of bonding the wafers. . The method of manufacturing the sensor unit of claim 1, wherein the signal emitter is a light emitting diode, and the signal detector is an integrated distance and ambient light source sensing component and a distance sensing component. One of them. A method of manufacturing an inductor unit according to claim 1, The wire bonding method is firstly soldered to the signal emitters and the signal detectors through a plurality of wires, and then the wires are respectively soldered to the substrates of the corresponding sensor regions, so that Form a circuit loop. The method of manufacturing the inductor unit of claim 1, wherein the package structure is made of one of a light transmissive encapsulating material and an encapsulating material that allows infrared light to pass through. The method of manufacturing the sensor unit of claim 1, wherein the openings on the top plate of the package are a plurality of emission openings, a plurality of receiving openings, and a plurality of injection openings. The method of manufacturing the inductor unit according to claim 1, wherein the openings of the package top plate are formed by stamping, laser cutting or casting. The method of manufacturing the inductor unit according to claim 1, wherein the package top plate is made of one of metal and plastic. The method of manufacturing the inductor unit of claim 1, wherein the spacer layer is made of an insulating material that can block infrared light. The method of manufacturing the inductor unit according to claim 1, wherein the performing the dicing process is cutting along a scribe line defined between each of the two inductor regions, and the cutting is performed by using a thin saw blade. Cut or use laser cutting.