201232237 [0001] [0002] ❹ [0003] [0004]Ο 發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置及組合，尤指一種電腦機箱中 之散熱裝置及組合。 [先前技術] 隨著記憶體傳輸速率之不斷提高，當前中央處理器插孔 與記憶體插槽之間之佈線距離亦越來越短，習知之電腦 散熱系統於中央處理器上直接安裝一正吹對稱式散熱裝 置為其散熱，於不改變正吹對稱式散熱裝置之尺寸和散 熱效率之前提下，正吹對稱式散熱裝置於安裝過程中容 易與安裝於中央處理器一侧之記憶體插槽產生干涉。 【發明内容】 鑒於以上内容，有必要提供一種可避免散熱裝置於安裝 過程中與安裝於中央處理器一側之記憶體插槽產生干涉 之散熱裝置及組合。 一種散熱裝置，包括一用以同發熱元件熱接觸之接觸部 及自該接觸部向四周延伸出之一第一支撐肋、一第二支 撐肋、一第三支撐肋及一第四支撐肋，相鄰兩支撐肋之 間延伸出複數散熱片，該接觸部到位於相鄰之第一、第 二支撐肋之間之散熱片邊緣之距離為第一距離，該接觸 部到位於相鄰之第三、第四支撐肋之間之散熱片邊緣之 距離為第二距離，該第一距離小於第二距離，該接觸部 之第一、第二支撐肋與第三、第四支撐肋相對。 一種散熱裝置組合，包括一散熱裝置及一電腦主機板， 該散熱裝置包括一接觸部及自該接觸部向四周延伸出之 100103209 表單編號Α0101 第3頁/共13頁 1002005690-0 [0005] 201232237 一第一支撐肋、一第二支撐肋、一第三支撐助及一第四 支撐肋，相鄰兩支撐肋之間延伸出複數散熱片，該接觸 部與電腦主機板上之一第一發熱元件熱接觸，該電腦主 機板上臨近該第一發熱元件裝設一第二發熱元件，該接 觸部上相鄰之第一、第二支撐肋之間之散熱片邊緣鄰近 該第二發熱元件，該接觸部到位於相鄰之第一、第二支 撐肋之間之散熱片邊緣之距離為第一距離，該接觸部到 第二發熱元件之距離大於該第一距離。 [0006] 與習知技術相比，上述散熱裝置及組合中該接觸部到第 二發熱元件之距離大於該接觸部到位於相鄰之第一、第 二支撐肋之間之散熱片邊緣之距離，使得該接觸部到位 於相鄰之第一、第二支撐肋之間之散熱片邊緣之距離被 減小。 【實施方式】 [0007] 請參閱圖1，本發明散熱裝置之一較佳實施例包括一用以 同發熱元件熱接觸之接觸部10及自該接觸部10向四周延 伸出之一第一支撐肋11、一第二支撐肋12、一第三支撐 肋13及一第四支撐肋14。相鄰兩支撐肋之間延伸出複數 散熱片15。該接觸部10到位於相鄰之第一、第二支撐肋 11、12之間之散熱片15邊緣之距離為第一距離，該接觸 部10到位於相鄰之第三、第四支撐肋13、14之間之散熱 片15邊緣之距離為第二距離。該第一距離小於第二距離 ，該接觸部10之第一、第二支撐肋11、12與第三、第四 支撐肋13、14相對。該接觸部10到位於相鄰之第一、第 三支撐肋11、13之間之散熱片15邊緣之距離為第三距離 100103209 表單編號A0101 第4頁/共13頁 1002005690-0 201232237 [0008] Ο [0009] ❹ [0010] ’該接觸部10到位於相鄰之第二、第四支撐肋12、14之 間之散熱片15邊緣之距離為第四距離。該第三距離等於 第四距離’該接觸部1〇之第一、第三支撐肋11 ' 13與第 二、第四支撐肋12、14相對。 每一支撐肋上設有一支腳16。位於相鄰之第一、第二支 樓肋11、12上之兩支腳16之間之距離為第五距離，位於 相鄰之第一、第三支撐肋11、13上之兩支腳16之間之距 離為第六距離。該第五距離大於第六距離。位於相鄰之 第三、第四支撐肋13、14上之兩支腳16之間之距離等於 該第五距離’位於相鄰之第二、第四支撐肋12、14上之 兩支腳16之間之距離等於該第六距離》 請參閱圖2 ’該散熱裝置安裝於一電腦主機板20上，該接 觸部10之底部與電腦主機板2〇上之一第一發熱元件21熱 接觸，用以將來自該第一發熱元件21之熱量導至該散熱 片15。該電腦主機板20上臨近磷第一發熱元件21裝設一 「： .丨:“..’〆... 第二發熱元件22。該接觸部1〇到第二發熱元件22之距離 大於該第一距離。於本發明較佳實施例中，該第一發熱 元件21為中央處理器，該第二發熱元件22為記憶體。該 接觸部10之底部呈圓形，該散熱片15構成一圓柱形之散 熱器’該接觸部10之底部圓心與該散熱器之底部圓心不 重合。 請參閱圖3，安裝時，將該接觸部10與第一發熱元件21相 接觸，使得該接觸部10到第二發熱元件22之距離大於該 接觸部10到位於相鄰之第一、第二支撐肋11、12之間之 散熱片15邊緣之距離。然後藉由複數螺釘穿過相應之支 100103209 表單編號Α0101 第5頁/共13頁 1002005690-0 201232237 腳16上之螺孔將該散熱裝置固定於電腦主機板20上。此 時由於該接觸部10到位於相鄰之第一、第二支撐肋11、 12之間之散熱片15邊緣之距離被減小了，因此於安裝過 程中該散熱裝置不會與第二發熱元件22產生干涉。同時 由於該第三距離等於第四距離，位於相鄰之第一、第三 支撐肋11、13之間之散熱片15和位於相鄰之第二、第四 支撐肋12、14之間之散熱片15仍關於該接觸部10之底部 圓心和該散熱器之底部圓心連線呈軸對稱，因此該散熱 裝置安裝於電腦主機板20上時其受力仍然可保持平衡， 不會對該電腦主機板20產生額外之壓力。 [0011] 本發明散熱裝置及組合中該接觸部1 0到第二發熱元件22 之距離大於該接觸部10到位於相鄰之第一、第二支撐肋 11、12之間之散熱片15邊緣之距離，使得該接觸部10到 位於相鄰之第一、第二支撐肋11、12之間之散熱片15邊 緣之距離被減小，有效避免了散熱裝置於安裝過程中與 安裝於中央處理器下方之記憶體產生干涉。 [0012] 綜上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0013] 圖1係本發明散熱裝置較佳實施方式之結構示意圖。 [0014] 圖2係本發明散熱裝置較佳實施方式與一電腦主機板之分 解圖。 表單編號A0101 100103209 第6頁/共13頁 1002005690-0 201232237 [0015] 圖3係本發明散熱裝置較佳實施方式與一電腦主機板之組 裝圖。 【主要元件符號說明】 [0016] 接觸部：10 [0017] 第一支撐肋：11 [0018] 第二支撐肋：12 [0019] 第三支撐肋：13 [0020] 第四支撐肋：14 [0021] 散熱片：15 [0022] 支腳：16 [0023] 電腦主機板：20 [0024] 第一發熱元件：21 [0025] 第二發熱元件：22 ❹ 100103209 表單編號A0101 第7頁/共13頁 1002005690-0201232237 [0001] [0001] [0002] [0003] [Technical Field] The present invention relates to a heat sink and a combination thereof, and more particularly to a heat sink and a combination in a computer case. [Prior Art] As the memory transfer rate continues to increase, the wiring distance between the current CPU jack and the memory slot is also shorter and shorter, and the conventional computer cooling system is directly mounted on the central processing unit. The blow-symmetrical heat sink is used for heat dissipation, and the positive-blow symmetrical heat sink is easily inserted into the memory of the central processor side during installation without changing the size and heat dissipation efficiency of the forward-blown symmetrical heat sink. The groove creates interference. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink and a combination that can prevent the heat sink from interfering with a memory slot mounted on the central processor side during installation. A heat dissipating device includes a contact portion for thermal contact with a heat generating component and a first support rib, a second support rib, a third support rib and a fourth support rib extending from the contact portion A plurality of fins are extended between the adjacent two supporting ribs, and the distance from the contact portion to the edge of the fin between the adjacent first and second supporting ribs is a first distance, and the contact portion is located adjacent to the first 3. The distance between the edges of the fins between the fourth supporting ribs is a second distance. The first distance is smaller than the second distance. The first and second supporting ribs of the contact portion are opposite to the third and fourth supporting ribs. A heat sink assembly comprising a heat sink and a computer motherboard, the heat sink comprising a contact portion and a 100103209 extending from the contact portion to the periphery. Form number Α 0101 Page 3 / Total 13 pages 1002005690-0 [0005] 201232237 a first support rib, a second support rib, a third support and a fourth support rib, and a plurality of fins extending between the adjacent support ribs, the contact portion and a first heat on the computer motherboard The second heat generating component is disposed on the computer main board adjacent to the first heat generating component, and the edge of the heat sink between the adjacent first and second supporting ribs on the contact portion is adjacent to the second heat generating component. The distance from the contact portion to the edge of the fin between the adjacent first and second support ribs is a first distance, and the distance from the contact portion to the second heat generating component is greater than the first distance. [0006] Compared with the prior art, the distance between the contact portion and the second heat generating component in the heat dissipating device and the combination is greater than the distance from the contact portion to the edge of the heat sink between the adjacent first and second support ribs. The distance from the contact portion to the edge of the fin between the adjacent first and second support ribs is reduced. [0007] Referring to FIG. 1, a preferred embodiment of a heat sink of the present invention includes a contact portion 10 for thermal contact with a heat generating component and a first support extending from the contact portion 10 to the periphery. The rib 11 , a second support rib 12 , a third support rib 13 and a fourth support rib 14 . A plurality of fins 15 extend between adjacent support ribs. The distance from the contact portion 10 to the edge of the fin 15 between the adjacent first and second support ribs 11 and 12 is a first distance, and the contact portion 10 is located adjacent to the third and fourth support ribs 13 The distance between the edges of the fins 15 between 14 is a second distance. The first distance is smaller than the second distance, and the first and second support ribs 11, 12 of the contact portion 10 are opposed to the third and fourth support ribs 13, 14. The distance from the contact portion 10 to the edge of the heat sink 15 between the adjacent first and third support ribs 11 and 13 is the third distance 100103209. Form No. A0101 Page 4 / Total 13 pages 1002005690-0 201232237 [0008] 0009 [0010] The distance between the contact portion 10 and the edge of the fin 15 between the adjacent second and fourth support ribs 12, 14 is a fourth distance. The third distance is equal to the fourth distance. The first and third support ribs 11' 13 of the contact portion 1 are opposed to the second and fourth support ribs 12, 14. A foot 16 is provided on each support rib. The distance between the two legs 16 on the adjacent first and second branch ribs 11, 12 is a fifth distance, and the two legs 16 on the adjacent first and third support ribs 11, 13 The distance between them is the sixth distance. The fifth distance is greater than the sixth distance. The distance between the two legs 16 on the adjacent third and fourth support ribs 13, 14 is equal to the fifth distance 'the two legs 16 on the adjacent second and fourth support ribs 12, 14. The distance between the two is equal to the sixth distance. Please refer to FIG. 2 'The heat sink is mounted on a computer motherboard 20, and the bottom of the contact portion 10 is in thermal contact with one of the first heating elements 21 on the computer motherboard 2 The heat from the first heating element 21 is guided to the heat sink 15. The first heating element 22 is mounted on the computer motherboard 20 adjacent to the phosphorous first heating element 21 by ":.": ".." The distance from the contact portion 1 to the second heat generating element 22 is greater than the first distance. In a preferred embodiment of the invention, the first heat generating component 21 is a central processing unit and the second heat generating component 22 is a memory. The bottom of the contact portion 10 is circular, and the heat sink 15 constitutes a cylindrical heat sink. The center of the bottom of the contact portion 10 does not coincide with the center of the bottom of the heat sink. Referring to FIG. 3, during installation, the contact portion 10 is in contact with the first heating element 21 such that the distance from the contact portion 10 to the second heating element 22 is greater than the contact portion 10 to the adjacent first and second portions. The distance between the edges of the fins 15 between the support ribs 11, 12. Then, the heat sink is fixed to the computer motherboard 20 by a plurality of screws passing through the corresponding branch 100103209 Form No. Α0101 Page 5 of 13 1002005690-0 201232237. At this time, since the distance between the contact portion 10 and the edge of the heat sink 15 between the adjacent first and second support ribs 11 and 12 is reduced, the heat sink does not with the second heat during the mounting process. Element 22 produces interference. At the same time, since the third distance is equal to the fourth distance, the heat sink 15 between the adjacent first and third support ribs 11 and 13 and the heat dissipation between the adjacent second and fourth support ribs 12 and 14 The sheet 15 is still axisymmetric about the center of the bottom of the contact portion 10 and the center line of the bottom of the heat sink. Therefore, when the heat sink is mounted on the computer motherboard 20, the force is still balanced, and the host computer is not balanced. Plate 20 creates additional pressure. [0011] The distance between the contact portion 10 and the second heat generating component 22 in the heat sink and the combination of the present invention is greater than the edge of the heat sink 15 between the contact portion 10 and the adjacent first and second support ribs 11 and 12. The distance between the contact portion 10 and the edge of the heat sink 15 between the adjacent first and second support ribs 11 and 12 is reduced, thereby effectively preventing the heat sink from being installed in the central processing during installation. The memory below the device creates interference. [0012] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1 is a schematic structural view of a preferred embodiment of a heat sink according to the present invention. 2 is an exploded view of a preferred embodiment of a heat sink device of the present invention and a computer motherboard. Form No. A0101 100103209 Page 6 of 13 1002005690-0 201232237 [0015] FIG. 3 is a assembled view of a preferred embodiment of a heat sink device of the present invention and a computer motherboard. [Main component symbol description] [0016] Contact portion: 10 [0017] First support rib: 11 [0018] Second support rib: 12 [0019] Third support rib: 13 [0020] Fourth support rib: 14 [ 0021] Heat sink: 15 [0022] Feet: 16 [0023] Computer motherboard: 20 [0024] First heating element: 21 [0025] Second heating element: 22 ❹ 100103209 Form number A0101 Page 7 of 13 Page 1002005690-0