201230895 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種電子元件及其製造方法’特別是指一種包 括電路板及沿所述電路板一端緣插入的電子元件的電子元件 及其製造方法。 【先前技術】 為了降低主板南度’目前一些電子元件中，將電子元件 (如電連接器）沿電路板一端緣插入且焊接於所述電路板表 面。組裝前，所述電路板表面會在對應所述電子元件端子配 合位置印刷錫膏。組裝時，所述電子元件與所述電路板相互 插入，這時所述電子元件端子會分別頂推所述電路板上的所 述錫膏，使所述錫膏被刮掉，焊接點錫膏量過少而造成焊接 不良，或相鄰錫膏接觸造成短路，影響所述電子元件的正常 運作。 因此’有必要設計一種新電子元件及其製造方法，以克 服上述問題。 【發明内容】 本發明的目的在於提供一種使焊接點錫膏量不會過少且 相鄰錫膏不會接觸的電子元件及其製造方法。 為了達到上述目的，本發明電子元件包括一電路板，其 至；一表面在靠近一端緣處設有一焊墊，且在所述焊墊與所 201230895 述端緣之間設有一凹陷；以及一電子元件，包括一絕緣本體 以及多個固定於所述絕緣本體的端子，每一所述端子對應所 述凹陷與所述谭墊分別設有一突出部與一焊接部，所述突出 部與焊接部的高度使所述電子元件沿所述端緣插入過程中， 所述突出部先被所述電路板撐開，從而帶動所述焊接部往外 偏折，使其位於所述焊墊上對應設置的錫膏的外側，且使當 插入至預定位置所述突出部進入所述凹陷内時，所述端子焊 Φ 接部回復至與所述錫膏接觸。 與現有技術相比，本發明電子元件端子不會頂推到所述 錫膏，故既能保證錫量夠多而焊接良好，又能保證相鄰錫膏 不會接觸而避免短路現象的發生。 故，所述電路板上下表面均設有所述焊墊，對應所述電子 元件的所述焊接部排成兩排，分別是上下表面的所述焊塾配 合。這能提向焊接點密度，有利於電子元件的小型化。 • 然，每一表面的所述焊墊為多個，每一所述焊墊對應設 有一所述凹陷。這有利於保持所述電路板的強度。 每一表面的所述焊墊為多個，所述凹陷為長條形，對應 同一表面上的所有所述焊墊。這能方便電路板的加工。 所述電路板在所述端緣與所述焊塾之間設有一通槽，所 述通槽開Π形成所述賴。通槽結構能方便電路板的加工。 本發明還提供-種電子元件的製造方法，包括如下步 驟：提供-電路板，其至少—表面在靠近—端緣處設有一焊 201230895 墊，且在所述焊墊與所述端緣之間設有一凹陷；提供一錫膏， 對應設置於所述焊塾上；提供一電子元件，包括一絕緣本體 以及多個固定於所述絕緣本體的端子，每一所述端子對應所 述凹陷與所述焊墊分別設有一突出部與一焊接部；將所述電 子元件沿所述端緣插入所述電路板，在此過程中，所述突出 部先被所述電路板#開，從而帶動所述焊接部往外偏折，使 其不與對應所述錫膏接觸，當插人至預定位置時，所述突出 部進入所述凹陷内’所述端子焊接部回復至與所述錫膏接 觸；以及加熱’使所述錫纽化，將所述焊接部與所述焊墊 電性連接。與财技術概，本發明電子元件軒不會頂推 到所述錫膏’故既能麟錫量夠多轉接良好，又能保證相 鄰錫膏不會接觸而避免短路現象的發生。 故，所述電路板上下表面均設有所述焊墊，對應所述電 子元件的所述焊接部排成兩排，分別是上下表面的所述焊塾 配合。這能提高焊接點贿，有觀f子元件的小型化。 又所述電路板在所述端緣與所述焊塾之間設有一通 槽，所述通槽開Π形成所述凹陷。這能方便電路板的加工。 【實施方式】 為便於更好_解本發_目的、結構、舰以及功效 等現、，σ。附圖和具體實施方式對本發明電子元件及其製造 方法作進一步說明。 201230895 如第一圖至第三圖，電子元件包括一電路板丨與一電子 元件3。 所述電路板1在其上下表面靠近一端緣處設有多個焊墊 13 (在其他實施例中，所述焊墊13可能只有一個），且在所 述：塾13與所述端緣之間設有一長條形通槽I〗，所述通槽 11對應所有所述焊墊13 (在本實施例中，為所述通槽丨丨的 寬度大於或等於所有所述料13的寬度）。因本實施例為上201230895 6. Technical Field of the Invention The present invention relates to an electronic component and a method of manufacturing the same, and more particularly to an electronic component including a circuit board and electronic components inserted along one end edge of the circuit board, and a method of manufacturing the same . [Prior Art] In order to reduce the south degree of the motherboard, in some electronic components, electronic components (such as electrical connectors) are inserted along the one end edge of the circuit board and soldered to the surface of the circuit board. Before assembly, the surface of the board will print solder paste at a position corresponding to the terminal of the electronic component. When assembled, the electronic component and the circuit board are inserted into each other, and the electronic component terminal pushes the solder paste on the circuit board respectively, so that the solder paste is scraped off, and the solder paste amount is soldered. Too little to cause poor soldering, or a short circuit caused by adjacent solder paste contacts, affecting the normal operation of the electronic components. Therefore, it is necessary to design a new electronic component and its manufacturing method to overcome the above problems. SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component in which the amount of solder paste at a solder joint is not excessively small and which is not in contact with adjacent solder paste, and a method of manufacturing the same. In order to achieve the above object, the electronic component of the present invention comprises a circuit board, wherein a surface is provided with a solder pad near the one end edge, and a recess is formed between the solder pad and the end edge of the 201230895; and an electron The component includes an insulating body and a plurality of terminals fixed to the insulating body, and each of the terminals is respectively provided with a protruding portion and a soldering portion corresponding to the recess and the soldering pad, and the protruding portion and the soldering portion The height is such that the electronic component is inserted into the edge of the edge, and the protruding portion is first opened by the circuit board, thereby driving the soldering portion to be deflected outwardly so as to be located on the solder pad corresponding to the solder paste. The outer side, and the terminal solder joint is returned to contact with the solder paste when the protrusion enters the recess into the predetermined position. Compared with the prior art, the terminal of the electronic component of the present invention does not push up to the solder paste, so that the amount of tin can be ensured enough and the soldering is good, and the adjacent solder paste can be prevented from contacting and the short circuit phenomenon can be avoided. Therefore, the soldering pads are disposed on the lower surface of the circuit board, and the soldering portions corresponding to the electronic components are arranged in two rows, which are the solder joints of the upper and lower surfaces, respectively. This can increase the density of the solder joints and facilitate the miniaturization of electronic components. • The number of the pads on each surface is plural, and each of the pads is correspondingly provided with the recess. This is advantageous in maintaining the strength of the board. There are a plurality of the pads on each surface, and the recesses are elongated, corresponding to all of the pads on the same surface. This can facilitate the processing of the board. The circuit board is provided with a through slot between the end edge and the soldering pad, and the through slot opens to form the ridge. The channel structure can facilitate the processing of the circuit board. The present invention also provides a method of manufacturing an electronic component, comprising the steps of: providing a circuit board having at least a surface at a near end edge provided with a solder 201230895 pad, and between the pad and the end edge Providing a recess; providing a solder paste correspondingly disposed on the soldering iron; providing an electronic component, including an insulating body and a plurality of terminals fixed to the insulating body, each of the terminals corresponding to the recess and the The solder pads are respectively provided with a protruding portion and a soldering portion; the electronic component is inserted into the circuit board along the end edge, in the process, the protruding portion is first opened by the circuit board #, thereby driving The soldering portion is deflected outwardly so as not to be in contact with the corresponding solder paste, and when inserted into a predetermined position, the protruding portion enters the recess, and the terminal soldering portion returns to contact with the solder paste; And heating to cause the tin to be electrically connected, and the soldering portion is electrically connected to the solder pad. In terms of financial technology, the electronic component of the present invention does not push up the solder paste, so that the amount of the tin solder can be transferred well enough, and the adjacent solder paste can be prevented from contacting and avoiding the occurrence of a short circuit phenomenon. Therefore, the soldering pads are disposed on the lower surface of the circuit board, and the soldering portions corresponding to the electronic components are arranged in two rows, which are the solder joints of the upper and lower surfaces, respectively. This can improve the soldering of bribes and the miniaturization of the sub-components. Further, the circuit board is provided with a through slot between the end edge and the soldering pad, and the through slot opens to form the recess. This can facilitate the processing of the board. [Embodiment] In order to facilitate the better _ the purpose of the hair _ purpose, structure, ship and efficiency, σ. The drawings and specific embodiments further illustrate the electronic components of the present invention and methods of making the same. 201230895 As shown in the first to third figures, the electronic component includes a circuit board and an electronic component 3. The circuit board 1 is provided with a plurality of solder pads 13 at its upper and lower surfaces near one end edge (in other embodiments, the solder pads 13 may have only one), and in the case: the crucible 13 and the end edge There is a long strip-shaped through slot I, the through slot 11 corresponding to all the pads 13 (in the embodiment, the width of the through slot is greater than or equal to the width of all the materials 13) . Because this embodiment is
下表面均焊接的結構，故其上下表面均設所述焊墊13，若只 有-表面焊接時’則只需在此表面設焊墊。所述通槽^的設 置疋為了在其開口處形成凹陷15 (如第四圖，其作用容後詳 述）故也了以直接在所述電路板1表面直接設置凹陷15，但 設置所述通槽11能方便所述電路板丨的加工。所述通槽n 為長條形也是為了方便加工，但根據具體情況，也可設多個 通槽（如第七圖）《其他形式的凹陷，每—所述焊塾13對應 -所述凹陷15。設多個凹陷而非—個，可以保持所述電路板 1的強度。 ㈣电于讀3為電連接器’ 一端焊接於所述電路板丄， 另-端與對接電子元件（圖未示）相連接。當然，所述電子元Since the lower surface is welded, the pad 13 is provided on the upper and lower surfaces, and if only the surface is soldered, it is only necessary to provide a pad on the surface. The arrangement of the through grooves is such that a recess 15 is formed at the opening thereof (as shown in the fourth figure, which is detailed later), so that the recess 15 is directly provided directly on the surface of the circuit board 1, but the arrangement is The through slot 11 can facilitate the processing of the circuit board. The through-groove n is elongated and is also convenient for processing. However, depending on the specific situation, a plurality of through grooves (such as the seventh figure) may be provided (other forms of depressions, each - the weldment 13 corresponds to the depression) 15. By providing a plurality of depressions instead of one, the strength of the circuit board 1 can be maintained. (4) Electrical reading 3 is an electrical connector' One end is soldered to the circuit board 丄, and the other end is connected to a docking electronic component (not shown). Of course, the electronic element
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件也不限於所述電連接器，還可為晶片模組、⑽（發光二極 體）等等其他元件。 X 所述電連翻3包括-概捕31、固定於崎絕緣构 31的多個端子33，以及包覆於所述絕緣本體31的殼體奶。 201230895 所述絕緣本體31包括一基部311以及由所述基部311向 前延伸形成的舌板313，且設有兩排由所述基部311後端向前 分別延伸至所述舌板313上下表面的端子收容槽gib。 所述端子33排列成上下兩排（如果只需焊接於所述電路 板1 一表面時’則只需排列成一排），分別對應所述端子收容 槽315。每一所述端子33包括與所述基部311固定的固定部 331，由所述固定部331向前延伸形成的對接部333，以及由所 述固定部331向後延伸形成且位於所述固定部331後端的焊接 部335。組裝後，所述對接部333收容於所述舌板313中且至 少部分露出所述舌板313外，以與所述對接電子元件對接(如 第五圖與第六圖）。每-所述焊接部335末端設有一朝内的突 出部337 ’所述突出部337與焊接部335的位置分別與所述電 路板1上的凹陷15與焊墊13相對應。所述突出部337與焊接 部335的高度使所述電子元件3沿所述端緣插入過程中，所述 犬出部337先被所述電路板1禮開，從而帶動所述焊接部335 往外偏折’使其位於所述焊墊13上對應設置的錫膏5的外側， 且使當插入至預定位置所述突出部337進入所述凹陷15内 時，所述端子焊接部335回復至與所述錫膏5接觸。 所述電子元件的製造方法包括五個步驟，現分別描述如 下。 第一步驟：提供上述電路板1。 第二步驟：提供多個錫膏5，對應設置於所述焊墊13上。 第二步驟：提供上述電子元件3。 第四步驟.將所職子元件3沿所述魏插人所述電路板 1，在此過程中’所述突出部337先被所述電 路板1撐開，從而帶動所述焊接部335往外偏 折，使其不與對應所述錫膏5接觸（如第五 圖），當插入至預定位置時，所述突出部337 進入所述凹陷15内’所述端子焊接部335回 復至與所述錫膏5接觸（如第六圖）。 第五步驟：域紋將它嫩進加歸巾），使所述錫 膏5熔化，將所述端子焊接部3邪分別與相應 的焊墊13相連接。 以上步驟不—定要依序進行，比如第三步驟可以先進 行’然後再進行其他步驟。這—部分本領域的技術人員因 可通過以上描述而得知，在此就不再贅述。 因所述電子元件3沿所述端緣插入過程中，所述突出 4 337先被所述電路板1撐開，從而帶動所述焊接部335 往外偏折，使其位_述烊墊13上對應設置的錫膏5的 外側’故不會頂推到所述錫膏5，故既能保證錫量夠多而 焊接良好，又能保證相鄰錫膏不會接觸而避免短路現象的 發生。 以上詳細說明僅為本發明之較佳實施例的說明，非因 此局限本發明的專利範圍，所以，凡運用本創作說明書及 201230895 圍Z内各所為的等效技術變化，均包含於本發明的專利範 【圖式簡單說明】 :圖為本翻第—實關電子元件的立體分解圖； 第一圖為第一圖所示電子元件的立體組合圖； 圖為第—騎*電子元件肢的立體組合圖； 第四圖為第一圖所示電子元件在電路板與電子元件插入前 的剖视圖； 第五圖為第-圖所示電子元件在電路板與電子元件剛插入 時的剖視圖； 第六圖為第一圖所示電子元件在電路板與電子元件插入至 預定位置時的剖視圖； 第七圖為本發明另—實施例電子元件中電路板的立體圖。 【主要元件符號說明】 1 ： 電路板 13 焊墊 3 ： 電子元件 311 :基部 315 :端子收容槽 331 :固定部 335 :焊接部 11 :通槽 15 :凹陷 31 :絕緣本體 313 :舌板 33 :端子 333 :對接部 337 :凸出部 201230895The member is not limited to the electrical connector, and may be a chip module, (10) (light emitting diode), or the like. X The electrical connection 3 includes an -trap 31, a plurality of terminals 33 fixed to the sacrificial insulation 31, and a casing milk coated on the insulative housing 31. 201230895 The insulative housing 31 includes a base portion 311 and a tongue plate 313 extending forwardly from the base portion 311, and two rows are provided from the rear end of the base portion 311 to the upper and lower surfaces of the tongue plate 313, respectively. Terminal receiving groove gib. The terminals 33 are arranged in two rows (if only one surface is to be soldered to the surface of the circuit board 1), and only need to be arranged in a row, corresponding to the terminal receiving grooves 315, respectively. Each of the terminals 33 includes a fixing portion 331 fixed to the base portion 311, an abutting portion 333 formed by the fixing portion 331 extending forward, and a rearward extending portion of the fixing portion 331 and located at the fixing portion 331 A welded portion 335 at the rear end. After assembly, the abutting portion 333 is received in the tongue 313 and at least partially exposed outside the tongue 313 to interface with the docking electronic component (such as the fifth and sixth figures). Each of the ends of the welded portion 335 is provided with an inwardly projecting portion 337'. The positions of the protruding portion 337 and the welded portion 335 correspond to the recess 15 on the circuit board 1 and the pad 13, respectively. The height of the protruding portion 337 and the soldering portion 335 causes the electronic component 3 to be inserted along the end edge, and the dog-out portion 337 is first opened by the circuit board 1 to drive the soldering portion 335 outward. The deflection is made to be located outside the correspondingly disposed solder paste 5 on the pad 13, and when the protrusion 337 is inserted into the recess 15 when inserted into a predetermined position, the terminal soldering portion 335 is restored to The solder paste 5 is in contact. The method of manufacturing the electronic component includes five steps, which are respectively described below. First step: providing the above circuit board 1. The second step: providing a plurality of solder pastes 5 correspondingly disposed on the solder pads 13. Second step: providing the above electronic component 3. In a fourth step, the sub-element 3 is inserted into the circuit board 1 along the WE, in which the protrusion 337 is first opened by the circuit board 1 to drive the soldering portion 335 outward. Deflection so that it does not contact the corresponding solder paste 5 (as shown in the fifth figure), when inserted into a predetermined position, the protrusion 337 enters the recess 15 and the terminal soldering portion 335 returns to the same Said solder paste 5 contact (as shown in the sixth figure). The fifth step: the domain pattern presses it into the towel, and the solder paste 5 is melted, and the terminal soldering portions 3 are respectively connected to the corresponding pads 13. The above steps are not - must be carried out in order, for example, the third step can be advanced ‘and then other steps. This will be understood by those skilled in the art from the above description, and will not be repeated here. Because the electronic component 3 is inserted into the edge of the edge, the protrusion 4 337 is first opened by the circuit board 1 to drive the soldering portion 335 to be deflected outwardly to make it stand on the pad 13 Correspondingly, the outer side of the solder paste 5 is not pushed up to the solder paste 5, so that the amount of tin can be ensured enough and the soldering is good, and the adjacent solder paste can be prevented from coming into contact to avoid the occurrence of a short circuit phenomenon. The above detailed description is only illustrative of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalent technical changes of the present invention and the equivalents of the present invention are included in the present invention. Patent model [simple description of the drawing]: The figure is a three-dimensional exploded view of the electronic component of the first-off; the first figure is a three-dimensional combination of the electronic components shown in the first figure; The fourth figure is a cross-sectional view of the electronic component shown in the first figure before the circuit board and the electronic component are inserted; and the fifth figure is a cross-sectional view of the electronic component shown in the first figure when the circuit board and the electronic component are just inserted. FIG. 6 is a cross-sectional view showing the electronic component shown in the first figure when the circuit board and the electronic component are inserted into a predetermined position; and FIG. 7 is a perspective view of the circuit board in the electronic component according to another embodiment of the present invention. [Description of main component symbols] 1 : Circuit board 13 Pad 3 : Electronic component 311 : Base 315 : Terminal receiving groove 331 : Fixing portion 335 : Weld portion 11 : Through groove 15 : recess 31 : Insulating body 313 : tongue plate 33 : Terminal 333: abutting portion 337: protruding portion 201230895