TW201131975A - Vibrating reed, vibrator, oscillator, and electronic device - Google Patents

Vibrating reed, vibrator, oscillator, and electronic device Download PDF

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Publication number
TW201131975A
TW201131975A TW99131507A TW99131507A TW201131975A TW 201131975 A TW201131975 A TW 201131975A TW 99131507 A TW99131507 A TW 99131507A TW 99131507 A TW99131507 A TW 99131507A TW 201131975 A TW201131975 A TW 201131975A
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Taiwan
Prior art keywords
vibrating
arm
support
vibrating arm
vibration
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Application number
TW99131507A
Other languages
Chinese (zh)
Inventor
Akinori Yamada
Shuhei Yoshida
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Seiko Epson Corp
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Priority claimed from JP2010068997A external-priority patent/JP5703576B2/en
Priority claimed from JP2010159503A external-priority patent/JP5565158B2/en
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201131975A publication Critical patent/TW201131975A/en

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Abstract

A vibrating reed includes: a base; at least one vibrating arm extending from the base; at least one support arm extending from the base, and at least a part of which extends in parallel to the vibrating arm; and at least one receiving section formed of a part of the support arm, the part extending to have a shape of a projection so that a distance from the vibrating arm is reduced.

Description

201131975 六、發明說明: 【發明所屬之技術領域】 本發明例如係關於一種包含壓電體材料之壓電振動片等 之振動片、振動體、振盪器、及使用其等之電子機器。 【先前技術】 先前’以彎曲振動模式或其他振動模式振動之振動片, 例如廣泛使用如下之音又型壓電振動片:自包含水晶等壓 電體材料之基材之基部起使一對振動臂平行延伸,且使該 振動臂朝在水平方向相互接近或離開之方向振動。安裝有 具備此種振動片之振動元件之各種產品,例如HDD(hard disk drive,硬碟驅動器)、行動電腦、或ic(integ加以 circuit ’積體電路)卡等小型資訊機器、行動電話、汽車電 ^或傳呼系統等行動通信機器或振動陀螺感測器等之小 3L化日益進展’隨此’振動元件及收容於該振動元件中之 振動片之小型化之要求進一步提高。 又,作為小型化以外之課題可列舉如下:於使振動片之 振動臂激振時’其振動能量會產生損耗,從而CUCrysW Impedance ’晶體阻抗)值增大或Q值降低等導致振動片之 月b下降g)此,為了既實現振動片之小型化又可防止戋 降低振動能量之損耗’先前以來進行了各種各樣之研究。 :列如眾所周知有於振動臂之主面設置有長槽,並且於振動 伸之基。p之兩個側部形成有切口部或特^罙度之切口 (切槽)之音又型晶體振動片(例如參照專利文獻… 參…圖式對專利文獻!所記載之音又型晶體振動片進行 150337.doc 201131975 具:說明。圖8係模式性地表示作為先前之振動片之一例 之θ又型晶體振動片之平面圖。 於圖8中’音叉型晶體振動片1〇〇包括由 部⑵、以及自該基部121之—端部分起相互平行延^之二 對振動臂i 2 2。各振動臂! 2 2具有該振動臂ι 2 2之兩個主面 及連接上述兩個主面之兩個側面,此外,各振動臂⑽l 著該振動臂122之長邊方向設置有於兩個主面之至少一方 主面具有開口部而形成之有底長槽126。再者,雖未圖 示’但於包含長槽m之區域中設置有用以使振動臂122振 動之激振電極。 又,在與基部121之延伸有振動臂122之一端側正交之方 向之另-端側(兩邊),以於基部121之兩個主面呈現出内縮 形狀之方式沿著一條直線於對向方向上形成有一對切口 H1A、141B。基部121包括:隔著一對切口 141八、ΐ4ΐβ而 位於兩側之第1部分l21a及第2部分121b ;及於一對切口 ΜΙΑ、!41B之間連接第!部分121a及第2部分uib之連接 部分121c。第2部分12 lb中設置有未圖示之外部連接電極 以供與例如封裝體等之外部基板電性連接。音又型晶體振 動片100係將基部12 1之第2部分1 2 1 b設為固定部,從而與 例如封裝體等之外部基板既可實現電性連接又可接合•固 定。 此種音又型晶體振動片1〇〇於各振動臂122中設置有長样 126 ’藉此振動臂122容易活動從而有效地振動,故具有振 動損耗降低且可將CI值抑制得較低之特性。 150337.doc 201131975 又,於振動臂122之振動亦包含垂直方向之成分之情形 時,藉由設置於基部121之一對切口 141A、141B,而阻斷 各振動臂122之振動之傳遞,因此振動經由基部I]!傳遞至 外部之所謂振動洩漏受到抑制,從而發揮著防止CI值提高 之效果’並且防止各振動臂122間之CI值之不均。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開2002-280870號公報 【發明内容】 [發明所欲解決之問題] 然而,於專利文獻1所記載之音又型晶體振動片1〇〇中, 存在有可能會因形成於基部121之切口 141A、141B導致基 部121之剛性下降從而抗衝擊性下降之問題。 具體而言,於圖8所示之音叉型晶體振動片1〇〇中若對 激振電極施加特定之驅動電壓,則各振動臂122會朝在圖 中箭頭所示之水平方向相互接近或離開之方向振動。當於 二忒振動方向相同之方向上振動臂1 22大幅移位所帶來之 衝擊施加至音又型晶體振動片⑽時,於基部⑵側局部性 地產=較大之應力。亦即,若將基部121之第2部分12崎 為固疋端且各振動臂122之前端側大幅移位,則應力會集 中於一對切σ141Α、141B中振動f 122移位之方向之相反 ' 141A或切口 1418之前端部142A或前端部142B。 尤其’於為水晶之情形時相對於拉伸應力之機械強度較 弱,因此,例如當振動臂122於圖中箭頭之+χ方向(左方 150337.doc 201131975[Technical Field] The present invention relates to, for example, a vibrating piece such as a piezoelectric vibrating piece including a piezoelectric material, a vibrating body, an oscillator, and an electronic apparatus using the same. [Prior Art] Previously, a vibrating piece that vibrates in a bending vibration mode or other vibration mode, for example, a piezoelectric vibrating piece of the following type is widely used: a pair of vibrations are made from the base of a substrate including a piezoelectric material such as a crystal. The arms extend in parallel and cause the vibrating arms to vibrate in a direction approaching or departing from each other in the horizontal direction. Various products such as HDD (hard disk drive), mobile computer, or ic (integ plus circuit 'integrated circuit) card, such as HDD (hard disk drive), mobile phone, and car, are installed. The demand for miniaturization of the mobile communication device, such as a mobile communication device or a vibrating gyro sensor, is increasing, and the requirements for miniaturization of the vibrating element and the vibrating piece accommodated in the vibrating element are further improved. In addition, as a problem other than miniaturization, when the vibrating arm of the vibrating piece is excited, the vibration energy is lost, and the value of the CUCrysW Impedance 'crystal impedance is increased or the Q value is lowered. b) g) In order to achieve both the miniaturization of the vibrating piece and the reduction of the vibration energy loss, a variety of studies have been conducted. : As is well known, there is a long groove provided on the main surface of the vibrating arm, and the base is vibrated. A sound-type crystal vibrating piece having a notch portion or a slit (cutting groove) is formed on both side portions of p (for example, refer to the patent document... The sheet is performed 150337.doc 201131975: Description: Fig. 8 is a plan view schematically showing a θ-type crystal vibrating piece as an example of the prior vibrating piece. In Fig. 8, the 'tuning fork type crystal vibrating piece 1' includes a part (2) and two pairs of vibrating arms i 2 2 extending parallel to each other from the end portion of the base portion 121. Each vibrating arm! 2 2 has two main faces of the vibrating arm ι 2 2 and connecting the two main faces In addition, each of the vibrating arms (10) is provided with a bottomed long groove 126 formed by opening at least one of the main surfaces of the two main faces in the longitudinal direction of the vibrating arm 122. In the region including the long groove m, an excitation electrode for vibrating the vibrating arm 122 is provided. Further, on the other end side in the direction orthogonal to the one end side of the base portion 121 where the vibrating arm 122 is extended (both sides) ), so that the two main faces of the base 121 exhibit a shape of a contraction shape A pair of slits H1A, 141B are formed along a straight line in the opposing direction. The base portion 121 includes a first portion 11a and a second portion 121b which are located on both sides with a pair of slits 141, ΐ4ΐβ, and a pair of slits The connection portion 121c of the second portion and the second portion uib is connected between the first portion and the second portion uib. The second portion 12b is provided with an external connection electrode (not shown) for electrically connecting to an external substrate such as a package. The acoustic-type crystal resonator element 100 has the second portion 1 2 1 b of the base portion 12 1 as a fixed portion, so that an external connection such as a package can be electrically connected and fixed and fixed. The crystal vibrating piece 1 is provided with a long sample 126' in each of the vibrating arms 122. Thereby, the vibrating arm 122 is easily moved to vibrate effectively, so that the vibration loss is reduced and the CI value can be suppressed to a low level. Doc 201131975 Further, when the vibration of the vibrating arm 122 also includes a component in the vertical direction, the vibration of each of the vibrating arms 122 is blocked by the pair of slits 141A and 141B provided in the base portion 121, so that the vibration passes through the base portion. I]! The so-called vibration leakage to the outside is suppressed, and the effect of preventing the increase of the CI value is exhibited, and the CI value between the respective vibrating arms 122 is prevented from being uneven. [Prior Art Document] [Patent Document] [Patent Document 1] [Problem to be Solved by the Invention] However, in the acoustic-type crystal vibrating piece 1 described in Patent Document 1, there is a possibility that it is formed in the base portion 121. The slits 141A, 141B cause a problem that the rigidity of the base portion 121 is lowered to deteriorate the impact resistance. Specifically, when a specific driving voltage is applied to the excitation electrode in the tuning-fork type crystal vibrating piece 1A shown in FIG. 8, each of the vibrating arms 122 approaches or leaves each other in the horizontal direction indicated by the arrow in the figure. The direction of vibration. When the impact caused by the large displacement of the vibrating arm 1 22 in the direction in which the vibration directions of the two turns are applied to the acoustic-type crystal vibrating piece (10), the local property on the base (2) side is a large stress. That is, if the second portion 12 of the base portion 121 is fixed at the solid end and the front end side of each of the vibrating arms 122 is largely displaced, the stress concentrates on the opposite direction of the displacement of the vibration f 122 in the pair of cut σ 141 Α, 141B. '141A or slit 1418 front end 142A or front end 142B. In particular, the mechanical strength with respect to the tensile stress is weak in the case of the crystal, and therefore, for example, when the vibrating arm 122 is in the direction of the arrow + 图 in the figure (left side 150337.doc 201131975

向)大幅移位所帶來之衝擊施加至A g i晶體振動片100 時,會對基部121之圖中-X方向(右方 向)之切口〗41B之前 端部142B施加較大之拉伸應力,從 者會破損。 彳可能會產生龜裂或 [解決問題之技術手段] 本發明係為了解決上述課題之至少— —4分而完成去,苴 可作為以下之形態或適用例而實現。 八 [適用例1]本適用例之振動片之特徵在於包括 振動臂,其自上述基部延伸; ° 0 , 符# ’其自上述基部延 申,且至 >、一部分與上述振動臂 J月卞仃而延伸;以„古 部,其係使上述支持臂之一部分以盥 ^ ^ ^ /、上述振動臂之間隔變 乍之方式延伸成突起狀而形成。 根據該構成,支持臂之一部分延伸而得之突 部係以與振動臂之間隔變窄之方 7 施加有衝擊而導致振動臂超 於對振動片等 時,振動臂之前端側之移位由圍移位 .E , 又不0丨限制,因此可抑制施 加至振動臂之與基部之連接 立止岛 丨之應力增大,從而可防止 產生龜裂或破損等不良情況。 [適用例2]如上述適用例 設晋於益山“ ·動片’其令上述支承部係 私曰夕αΡ對上述振動臂所施加之電場而產生之上 述振動臂之振動之振幅範 振幅範圍而移位之情… 在述振動臂超過上述 月开7㈠上述振動臂所接觸之位置。 根據該構成,於對择叙y你 過通叙夕拓Α ^衝擊而導致振動臂超 、通爷振動之振幅範圍而移位時,振動臂之前端側之移位 150337.doc 201131975 由支承部限制,因此可抑制施加至振動臂之與基部之連接 根部之應力增大,從而可防止產生龜裂或破損等不良情 況。 [適用例3]如上述適用例之振動片,其中上述支承部係 設置於上述支持臂之前端側。 “ 根據該構成,於對振動片等施加有衝擊而導致振動臂超 過通常振動之振幅範圍而移位時,振動臂之前端側之移位 由支承部限制,因此可抑制施加至振動臂之與基部之連接 根部之應力增大,從而可防止產生龜裂或破損等不良情 況。而且,包括在前端具有支承部之支持臂,因此使用該 支持部使振動片與封裝體等之外部接合,由此可於使振動 臂與基部浮動之狀態下保持於外部,因此可防止因振動臂 之振動傳遞至基部而心,或者多餘之振動經由基部傳遞 至振動臂之情況而導致振動特性變得不穩定。因此,可提 供具有穩定之振動特性’並且具備優異之抗衝擊性之振動 片° [適用例4]如上述適用例之振動片,其中上述支承部於 上述支持臂設置有複數個,且構成為可藉由上述振動臂之 上述彎曲變形而與上述据勒登夕且ώ 述搌動#之長度方向之複數個位置接 觸。 根據該構成,於振動臂產生彎曲變形之情形時,構成3 振動臂於複數個位置與設置於支持臂之複數個支承部名 觸。藉此’於振動臂與支承部接觸時,可防止或緩和制 動臂局部性地施加衝擊。 150337.doc 201131975 [適用例5]如上述適用例之振動片,其中上述振動臂具 有兩個主面及連接上述兩個主面且在上述振動臂之長度方 向上延伸的兩個側面,且上述振動臂沿著上述振動臂之上 述長度方向更設有於上述兩個主面中之至少一方之主面具 有開口部之有底長槽,且上述支承部配置為當上述振動臂 超過上述通常之振動之上述振幅範圍而移位且上述振動臂 接觸於上述支承部時,上述支承部之與上述振動臂抵接之 部分係比形成有上述長槽之區域更靠前端側。 根據該構成,藉由長槽使振動臂容易活動而有效地振 動,藉此抑制CI值增大,並且藉由支承部而限制振動臂移 位時之振動臂之與支承部之抵接部分配置為位於比形成有 振動臂之長槽之區域更靠前端側之剛性高 動臂之破損得到抑制。 振 [適用例6]如上述適用例之振動片,其中於上述振動臂 之前端側設置有寬度比上述振動臂之上述基部侧更寬之重 量部,且該振動片㈣置為當上述振㈣產生超過上述通 常之振動之上述振幅範圍之移位而接觸於上述支承部時, 上述支承部之與上述振動f抵接之部分係接觸於上 部。 4 $里 根據該構成,振動眢$ f A5 、, 搌動’之寬幅部且具有高強度之重量部之When the impact caused by the large shift is applied to the A gi crystal vibrating piece 100, a large tensile stress is applied to the end portion 142B before the slit 41 in the -X direction (right direction) in the figure of the base portion 121, The person will be damaged.彳 There may be cracks or [Technical means for solving the problem] The present invention has been made to solve at least four points of the above problems, and can be realized as the following aspects or application examples. [Applicable Example 1] The vibrating piece of this application example is characterized in that it includes a vibrating arm which extends from the base portion; ° 0 , a symbol # ' which extends from the base portion, and to > a part of the vibrating arm J month Extending the ; ; 以 „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ When the protruding portion is subjected to an impact by the side 7 narrowed by the interval between the vibrating arms, and the vibrating arm exceeds the vibrating piece or the like, the displacement of the front end side of the vibrating arm is shifted by the circumference. E, and not 0. Since the enthalpy is restricted, it is possible to suppress an increase in the stress applied to the erecting islands of the vibrating arm and the base, thereby preventing occurrence of defects such as cracks or breakage. [Applicable Example 2] The application example is as follows: · The moving piece' is such that the support portion is displaced by the amplitude range of the vibration of the vibrating arm generated by the electric field applied by the vibrating arm, and the vibrating arm exceeds the monthly opening 7 (1) The above vibration arm is connected The position. According to this configuration, the displacement of the front end side of the vibrating arm is shifted when the amplitude of the vibrating arm is shifted by the amplitude of the vibrating arm and the vibration amplitude of the vibrating arm, and the displacement is 150337.doc 201131975 by the supporting portion Since it is limited, it is possible to suppress an increase in stress applied to the connecting root portion of the vibrating arm and the base portion, thereby preventing occurrence of defects such as cracks or breakage. [Aspect 3] The vibrating piece according to the above application example, wherein the support portion is provided on a front end side of the support arm. According to this configuration, when an impact is applied to the vibrating piece or the like and the vibrating arm is displaced beyond the amplitude range of the normal vibration, the displacement of the front end side of the vibrating arm is restricted by the support portion, so that the application to the vibrating arm can be suppressed. The stress at the base of the base portion is increased to prevent problems such as cracking or breakage. Further, since the support arm having the support portion at the tip end is included, the support portion is used to bond the vibrating piece to the outside of the package or the like. This can be kept externally in a state where the vibrating arm and the base are floated, so that it is possible to prevent the vibration characteristic from becoming unstable due to the vibration transmitted from the vibrating arm to the base or the excess vibration transmitted to the vibrating arm via the base. Therefore, it is possible to provide a vibrating piece having stable vibration characteristics and having excellent impact resistance. [Application 4] The vibrating piece according to the above application example, wherein the support portion is provided in the support arm in plural, and is configured In order to be able to perform the above-described bending deformation of the vibrating arm, and the plurality of positions in the longitudinal direction of the swaying According to this configuration, when the vibrating arm is bent and deformed, the three vibrating arms are formed at a plurality of positions and a plurality of support portions provided on the support arm. Thus, when the vibrating arm is in contact with the support portion, [Aspect 5] The vibrating piece according to the above application example, wherein the vibrating arm has two main faces and connects the two main faces and is in the vibrating arm And two side surfaces extending in the longitudinal direction, and the vibrating arm further has a bottomed long groove having an opening on a main surface of at least one of the two main surfaces along the longitudinal direction of the vibrating arm, and the support The portion is arranged such that when the vibrating arm is displaced beyond the amplitude range of the normal vibration and the vibrating arm is in contact with the support portion, a portion of the support portion that abuts against the vibrating arm is formed with the long groove According to this configuration, the vibrating arm is easily moved by the long groove to effectively vibrate, thereby suppressing an increase in the CI value and being restricted by the support portion. When the vibrating arm is displaced, the abutting portion of the vibrating arm and the supporting portion is disposed so as to be located at a distal end side of the region in which the long arm of the vibrating arm is formed, and the damage is suppressed. [Applied Example 6] In the vibrating piece according to the above aspect of the present invention, a weight portion having a width wider than the base portion side of the vibrating arm is provided on a front end side of the vibrating arm, and the vibrating piece (4) is disposed such that the vibrating piece (four) generates a vibration exceeding the normal vibration. When the amplitude range is displaced and contacts the support portion, the portion of the support portion that abuts against the vibration f is in contact with the upper portion. According to this configuration, the vibration 眢$f A5 , and the width of the turbulence Width and high strength weight

側面成為與支承部抿接之A —P抵接之#分,因此既可抑制振動臂之損 傷又可提咼振動片之抗衝擊性。 、 [適用例7]如上述適用例之 W A h '+· i ^ * 動片,,、中s亥振動片係配 置為上述支承部之上述抵接部分會與上述振動臂之上述重 I50337.doc 201131975 量部之側面進行面接觸。 例如’既可防止如藉由重量部所 〃战之振動臀 置為與支承部之抵接部分接觸之情 角#配 1月啦時,因角邱 之壓力集中從而導致角部或支承部之— °使衝擊 高振動片之抗衝擊性。 。为破損,又可提 [適用例8]如上述適用例之振動片 '、中上述支持臂多 有比上述振動臂之上述兩個側面間 、 •^見度竑細之部分Since the side surface becomes the point A of the A-P abutting on the support portion, it is possible to suppress the damage of the vibrating arm and improve the impact resistance of the vibrating piece. [Applicable Example 7] The WA h '+· i ^ * moving piece according to the above-described application example, wherein the middle s-vibrating piece is disposed such that the abutting portion of the support portion and the above-mentioned weight of the vibrating arm are I50337. Doc 201131975 Face contact on the side of the volume. For example, it is possible to prevent the vibration hips that are struck by the weight portion from being in contact with the abutting portion of the support portion. When the month is used, the pressure of the angle is concentrated to cause the corner portion or the support portion. — ° The impact resistance of the high vibration diaphragm is impacted. . In the case of the vibration of the above-mentioned application example, the above-mentioned support arm has a portion which is thinner than the above-mentioned two sides of the above-mentioned vibrating arm.

度更細的部分。 刀之S 根據該構成’支持臂比振動臂更容易彎曲,由此於振動 臂碰撞支持臂之支承部時施加至振動臂之損傷得到緩和, 因此可提供防止振動臂之破損且抗衝擊性高之振動片。 [適用例9]如上述適用例之振動片,其中上述支承部之 寬度形成為比上述支持臂之上述基部側之寬度更小。 根據該構成,相對於支持臂之基部側,具有支承部之支 持臂之前端側變得容易彎曲,由此於振動臂碰撞支持臂之 支承部時施加至振動臂之損傷得到緩和,因此可用於防止 振動臂破損且提尚振動片之抗衝擊性。 [適用例10]如上述適用例之振動片,其係藉由壓電體材 料所形成之壓電振動片。 根據該構成’可提供抗衝擊性高且具備優異之振動特性 之晶體振動片等壓電振動片。 [適用例11]如上述適用例之振動片,其中使用水晶作為 上述壓電體材料’上述基部具有一對切口,該一對切口係 设置為在沿著由上述水晶之X軸、γ軸、及Z轴所構成之正 150337.doc •10· 201131975 2座標系中之x軸方向的-條直線之對向方向上,該基部 之兩個主面呈現出内縮之形狀,上述振動臂自上述基部之 Y轴方向之-端部起在γ轴方向上延伸,且於至少上述振 動臂之+X側設置有具有上述支承部之上述支持臂。 水晶係廣泛用作壓電振動片之壓電體材料者’如上述構 成般,沿著結晶轴之正交座標系中之x轴方向藉由触刻形 成切口時,因相對於水晶之結晶轴之触刻異向性,於自x 側進行切口加工而形成之切口之内壁之前端部(角部 成產生不期望之孔部或姓刻殘留部之所謂飛邊部。該切: 之飛邊部於對振動片施加有衝擊時會導致產生龜裂或折 斷,尤其’於拉伸應力施加至飛邊部時引起強度顯著劣 化。 根據上述適用例之構成,藉由水晶而形成之振動片構成 為如下:支持臂自產生飛邊部之-x方向之切口之相反側 (+X方向)的基部之端部起延伸,且於該支持臂之前端側具 備支承部。藉此,形成有限制在對飛邊部施加拉伸應力之 方向移位之振動臂之活動的支承部’因此尤其可對抗衝擊 性弱之移位方向提高抗衝擊性。x,於設為僅自基部之一 方之端部起形成具有支承部之支持臂之情形時,與亦自另 一方之端部起形成支持臂,進而於該支持臂形成支承部之 情形時相比’可實現振動片之小型化。 八二適用例12]如上述適用例之振動片其中於上述抵接部 为設置有衝擊緩衝構件。 根據該構成,;^ ± 3 , 、支承。卩碰撞振動臂時藉由衝擊緩衝構件 I50337.doc 201131975 而緩和衝擊,因此可抑制振動臂缺損或破損。 [適用刺本適用例之振動體之特徵在:包括…〔 適用例之任一項之振動片;以及封裝體,其收容^^ 片0 根據該構成,由於包括上述適用例所記載之 ^可提供具有敎之振動特性,並且抗衝㈣高之振動 [適用例14]本適用例之振堡器之特 適用例之任-項之振動片;電路元件,其具=上= 片振盪之振盪電路;以及封f體, 述振動 述電路元件。 ^ 及上 根據該構成,由一於包括上述適用例所記載之振動片,因 此可提供具有穩定之振動特性, 體。 卫且抗衝擊性高之振動 [適用詞本適用例之電子機器之特徵 適用例之任一項之振動片、如上述適用例之振動體= 上述適用例之振盪器之任—者。 次如 根據該構成,可提供特性穩定並且確保 機器振動特性。 』早丨王疋電子 [適用例16]本適用例之振動 振動f,其係自上述基部之_端;=於包括:基部,· 其係自上述基部之另-端部分…持臂, 振動臂平行延伸,·且該振動片具有 Z部分與上述 係配置於上述支持臂冑’該支承部 則之支承部,配置於上述振動 I50337.doc -12. 201131975 #之通常之振動之振幅範圍外,且配置於上述振動臂超過 上述通㊉之振動之上述振幅範圍而移位時上述振動臂所接 觸之位置。 根據該構成’於對振動片施加有衝擊等而導致振動臂超 過通常之振動之振幅範圍而移位時,振動臂之前端側之移 位由支承αΡ限制’因此可抑制施加至振動臂之與基部連接 根部之應力增大,且可防止產生龜裂或破損等不良情況。 而且,包括前端具有支承部之支持臂,因此使用該支持部 將振動片與封裝體等之外部接合,藉此可於使振動臂與基 部浮動之狀態下保持於外部,因此可防止由於振動臂之振 動傳遞至基部而漏’或多餘之振動經由基部傳遞至振動 臂而導致振動特性不敎。因此,可提供具有穩定之振動 特性,並且具備優異之抗衝擊性之振動片。 【實施方式】 以下,一面參照圖式一面對使本發明之振動片具體化之 實施形態進行說明。 (第1實施形態) 圖1係模式性地說明自一方之主面側觀察作為第丨實施形 態之振動片之晶體振動片之平面圖。又,圖2係模式性地 說明晶體振動片之各部分之剖面之圖,圖2(a)係圖 線剖面圖,圖2(b)係圖1之c-c線剖面圖,圖2(c)係圖i2b_b 線剖面圖。 本例中,以使用水晶作為壓電體材料之例進行說明。 於圖1中,晶體振動片20係包含水晶之壓電振動片。 】50337.doc ]3 201131975 又,作為構成本實施㈣之晶體振動片2〇之水晶之原形的 水晶晶圓(水晶基材)係使用將在由x軸、¥軸、及z軸所構 成之正交座標系中,以z軸為中心順時針旋轉〇度〜5度之範 圍而切出之水晶z板切斷研磨加工為特定厚度所獲得者。 本實施形態之晶體振動片20具有所以又型t外形而形 成,即包括藉由對該水晶z板進行加工而形成之基部21, 及自該基部21之一端側(圖中上端側)雙分叉並相互平行地 延伸之一對振動臂22。 基部2】中以其兩個主面呈現出内縮之形狀之方式沿著一 條直線於對向方向形成有一對切口 4〖A、4丨B。基部2 ^包 括隔著一對切口 41A、41B而位於兩側之第i部分2u及第2 部分2ib,以及於一對切口41八、41β之間連接第i部分21& 及第2部分21b之連接部分21e。 於本實施形態之晶體振動片20中,藉由該等切口41八、 而阻斷各振動臂22之振動之傳遞,因此可抑制振動經 由基部2丨或下述之支持臂30而傳遞至外部之所謂振動洩 漏,可防止CI值上升。 再者,一對切口 UA、41Β之寬度(連接部分2ic之寬度) 既可小於與一對振動臂22對向之側面之間隔,亦可大於與 一對振動臂22對向之側面之間隔,又,一對切口 Μ a ” 41B之寬度(連接部分21c之寬度)既可 相互朝向相反方向之側面之距離,亦 之相互朝向相反方向之侧面之距離。 小於一對振動臂22之 可大於一對振動臂22 一對振動臂22自基部21之第i部分2la起於兩個主面(紙 150337.doc -14· 201131975 面上近前與内側之面)平行而延伸。又,各振動臂22具有 上述兩個主面與於兩側連接該兩個主面之兩個側面。 又’於各振動臂22之前端侧分別設置有寬度比振動臂22 之基部21側更寬之重量部29。如此,各振動臂22之前端部 分之重量部29發揮重量部之功能,由此無需增大振動臂22 之長度即可降低頻率。 再者’本實施形態之振動臂22圖示了重量部29以外之部 分具有固定寬度之構成,但不限定於此,亦可為使振動臂 22之主要部分(與重量部29不同之部分)朝向前端變細之形 狀。例如’藉由形成自振動臂22之基部21側朝向前端變細 之錐形,可使振動臂22容易振動。 如圖1所示’於各振動臂22之一方之主面沿著各自之長 度方向分別設置有一條有底長槽26a。又,如圖2(a)所示, 亦於振動臂22之另一方之主面,沿著振動臂22之長度方向 设置有一條長槽26b。 藉由該設置於各振動臂22之長槽26a、26b,而使振動臂 22變得容易活動而有效率地振動,由此可降低CI值。 再者,於圖1所示之本實施形態之振動臂22中,長槽 26a(及26b)係形成至其等之一端側(振動臂22之前端側)比 與振動臂22之重量部29之邊界更靠前端側(重量部29側)之 位置。如此一來’振動臂22振動時所產生之應力集中之區 域分散於振動臂22之延長方向,因此可避免應力集中於振 動臂22之重量部29之連接根部而導致破損等不良情況。 與此相反,亦可構成為使長槽26a、26b之一端側(振動 150337.doc •15· 201131975 臂22之前端側)形成至比與振動臂22之重量部29之邊界更 靠基部21側之位置,藉此亦具有所獲得之效果。亦即,振 動臂22振動時所產生之應力集中之區域分散於振動臂22之 延長方向’藉此可避免應力集中於振動臂22之重量部29之 連接根部而導致破損等不良情況,並且各振動臂22中之重 量部29之質量附加效果增加,因此無需使晶體振動片20之 尺寸增大即可實現低頻化。 然而’於各振動臂22中’若為即便於將長槽26a、26b之 一端側(振動臂22之前端側)設置為位於與振動臂22之重量 邛29之邊界的情形時,亦不會因向振動臂之重量部μ之 ^接根部之應力集中而產生破損等的情形,例如若為振動 臂22具有可具備充分剛性之程度之寬度之情形,或形成自 振動臂22之基部21側朝向重量部29而寬度變寬之形狀(例 如錐形形狀等)之情形等,則亦可將長槽26a、2讣之一端 側(振動臂22之前端側)設置為位於與振動臂22之重量部29 之邊界。 晶體振動片20具有自基部2】之第2部分21b延伸之一對支 持# 30〇 —對支持臂3〇自與一對振動臂22從基部2 1起延伸 之方向交又之方向之兩個端部,分別相互向相反方向延 伸,並於彎曲部31向—對振動f22之延伸方向-曲後進一 步延伸。藉由如此彎曲而使支持臂3〇小型化。支持臂洲 如係用於與封裝體(未圖示)等外部基板之安裝之部分,藉 由經由接著劑等而接著•固定圖中所例示之固定部39虚外 部基板之固定部’由此安裝於外部基板。藉由如此,於安 150337.doc -16· 201131975 裝於外部基板上之晶體振動片20中,可將振動臂22及基部 2 1設為浮動狀態。 如圖2所示,於各振動臂22之包含各長槽26&、2讣之表 面形成有激振電極44,及於包含兩個側面之各個之表面形 成有激振電極43(®i中省略圖示)。於一方之振動臂22中, 對激振電極43、44間施加電壓而使振動臂22之兩個側面伸 縮,由此使振動臂22振動。激振電極43、44可藉由如下方 式而形成:蝕刻水晶而形成包含晶體振動片2〇之長槽 26a、26b之外形後,例如將鎳(Ni)或鉻(Cr)設為基底層, :上藉由蒸鑛或減鍍而形成包含例如金(Au)之電極層, 其後使用光微影進行圖案化。此處,眾所周知鉻與水晶之 畨著性高,又,金之電阻低且難以氧化。 於各支持臂30之前端側設置有與振動臂22之振動方向相 同之方向之厚度變窄之部分,於其一部分以支持臂3〇與振 動I 22之間隔變窄之方式而設置有朝向振動臂彎曲形成 之支承部35。換言之,支承部35成為支持臂3〇之一部分自 支持臂30之延伸方向朝向振動臂22之呈突起狀形成之凸 邛。忒支承部35配置於所鄰接之振動臂22之通常之振動之 振幅範圍夕卜’且配置於所鄰接之振動㈣產生超過通常之 振幅圍特定量之移位的情形時會抵接該振動臂22之位 置再者,所謂上述振動臂22之通常之振動之振幅範圍, 係私藉由對晶體振動片2〇之激振電極43、44施加驅動電壓 (電場)而以特定之共振頻率振動之振動臂22的振幅最大之 月升y時之振動臂22之振動區域。亦即,配置為即便於以特 150337.doc -17- 201131975 疋共振頻率振動之振動臂22之振幅最大時所鄰接之振動臂 22與支持臂30之支承部35亦不接觸。又,所謂振動臂。產 生超過通常之振幅範圍特定量之移位之情形時,係指因落 下等對晶體振動片20施加衝擊而導致振動臂22大幅移位之 情形等。 於圖1所示之晶體振動片20中,各支持臂30係具有寬度 比所鄰接之振動臂22之兩個側面間之寬度最細的部分更細 之部分而形成。 又,於支持臂30中,支承部35及支承部35之基部2ι側之 寬度形成為比支持臂30之基部21侧之寬度更小。 若詳細敍述,則於圖丨中,自基部21起向相互相反方向 延伸且於彎曲部3 1彎曲並向與振動臂22平行之方向延伸之 一對支持臂30,具有在基部21側寬度比較寬之寬幅部^ , 於該寬幅部32之前端側形成有寬度變窄之窄幅部33,該窄 幅部33之更前端側成為支承部35 ^亦即,圖2(b)所示之支 持臂30之窄幅部33之寬度t2與圖2(c)所示之支持臂之寬 幅部32之寬度t3成為t2<t3之關係。再者,支持臂3〇之寬幅 部32及窄幅部33之各自如本實施形態般剖面不為方形,例 如於設置有有底之槽之情形時或具有相對於剖面之假想中 心線非線對稱之剖面形狀之情形時等,圖2(b)所示之支持 臂30之窄幅部33之剖面面積S2與圖2(c)所示之支持臂川之 寬幅部32之剖面面積S3亦可為82<§3之關係。 又,圖2(a)所示之振動臂22之兩個側面間之寬度η與支 持臂30之同-方向的寬度之關係,至少與圖叫所示之支 I50337.doc -18· 201131975 持臂30之窄幅部33之寬度t2為tl>t2之關係。進而,本實施 形態中,振動臂22之寬度tl與圖2(c)所示之支持臂3〇之寬 幅部32之寬度t3亦為tl>t3之關係。再者,圖2(a)所示之振 動臂22之剖面面積S1與至少圖2(b)所示之支持臂3〇之窄幅 部33之剖面面積S2為S1>S2之關係。進而,振動臂22之立tj 面面積S1與圖2(c)所示之支持臂30之寬幅部32之剖面面積 S3亦可為S1>S3之關係。 如此,於晶體振動片20中,各支持臂3〇係具有比所鄰接 之振動臂22之兩個側面間之寬度最細的部分之寬度更細之 窄幅部33(及寬幅部32)而形成,由此支持臂3〇呈現比振動 臂22更容易弯曲之彈性。藉此,當振動臂22於支持臂儿側 大幅移位而碰撞支承部35時對振動臂22所造成之損傷減 輕,因此既可防止振動臂22之破損又可限制振動臂22過度 移位而提高晶體振動片20之抗衝擊性。 又,支承部35及支承部35之基部21側之窄幅部33之寬度 t2形成為比支持臂30之基部21側之寬幅部之寬度u更 小,藉此里現相對於支持臂30之基部21側(寬幅部32&側), 具有支承部35之支持臂30之前端側(窄幅部”側)容易彎曲 之彈性,因此振動臂22於支持臂30側大幅移位而碰撞支承 部?時對振動臂22所造成之損傷減輕,以供防止振動臂η 破損且提高晶體振動片2 〇之抗衝擊性。 又’本實施形態中,各支持臂3〇之寬度變窄之窄幅部33 於前端側向接近所鄰接之振動f22之方向㈣,進而以於 前端側與所鄰接之振動臂22平行之方式脊曲而形成支承部 150337.doc -19- 201131975 35 ° 進而’本實施形態中,於比支持臂3〇之支承部35更靠前 端側,形成有向與所鄰接之振動臂22離開之方向彎曲之折 返部35a,使包含支持臂3〇之最前端部之角部之折返部35a 與振動臂22不抵接,藉此防止支持臂3〇或振動臂^產生缺 損或破損。 再者,於上述之具有支承部35之支持臂3〇之構成中將 晶體振動片20固定於封裝體等外部基板之固定部39係配置 於支持臂30之寬幅部32、且比支承部35更靠基部21側。藉 此,可實現將固定部39作為支點既緩和衝擊又限制振動臂 2 2之移位之支承部3 5。 進而,一面參照圖1及圖3 , —面對晶體振動片2〇中之支 承部3 5之配置進行說明。此處,新參照之圖3係模式性地 說明振動臂22之與支持臂30之支承部35之抵接部分之配置 的圖,且係自圖1之箭頭E方向觀察一方之振動臂22之側面 的一部分之部分放大圖。 於圖1及圖3所示之晶體振動片2〇中,當振動臂22於所鄰 接之支持臂30側大幅移位而接觸於支持臂3〇之支承部35 時,以支承部35之與振動臂22之抵接部分成為如下所示之 位置之方式配置支承部3 5。 亦即’支持臂30之支承部35配置為當振動臂22大幅移位 時’位於比形成有長槽26a、26b之區域更靠前端側。藉 此’配置為當振動臂22產生較大移位而接觸於所鄰接之支 持臂30之支承部35時,振動臂22與支承部35之抵接部分係 150337.doc •20· 201131975 位於比形成有長槽26a、26b之區域更靠前端側之剛性高之 部分,因此發揮既防止振動臂22破損等不良情況又提高晶 體振動片2 0之抗衝擊性之效果。 .又,支持臂30之支承部35配置於當振㈣以幅移位時 與振動臂22之前端側之寬幅部即重量部29接觸之位置。進 而,支承部35配置為與振動臂22之重量部”之兩個側面中 之支承部35側之側面進行面接觸。換言之,於晶體振動片 2〇中,支持臂30之支承部35避開振動臂22之重量部29之一 端所形成之角部27而配置。藉此,振動臂22之寬幅部且具 有高強度之重量部29之側面與支承部35進行面接觸,因此 振動臂22之損傷得以抑制。又,藉由避開角部”配置,既 可防止在由重量部29所形成之振動臂22之角部27配置為與 支承部35之抵接部分接觸時,角部27或支承部35之一部分 因接觸而破損之情況,又可使晶體振動片2〇之抗衝擊性提 南0 進而,於本實施形態之晶體振動片2〇中,於支承部乃之 成為與所鄰接之振動臂22之抵接部分之面設置有衝擊緩衝 構件38。較理想的是,衝擊緩衝構件38係由在振動臂22大 中田移位而接觸於支承部3 5時可緩和其衝擊之材料所構成, 且以與振動臂22之抵接部分既確保儘量大之接觸面積又進 仃面接觸之方式,與振動臂22之成為抵接部分之面平行且 具有固定面積而設置。 作為衝擊緩衝構件38所使用之材料,可使用橡膠或樹脂 等彈性尚之構件,但不限定於其等,亦可使用例如金等比 150337.doc -21 - 201131975 較軟之金屬膜。於藉由金屬膜而形成衝擊緩衝構件38之情 浴時,例如,藉由晶體振動片20之激振電極43、44(參照 圖2(a))等之電極形成步驟而同時形成,藉此無需增加製造 步驟即可設置衝擊緩衝構件38。 如此,於支承部35之與所鄰接之振動臂22之抵接部分設 置衝擊緩衝構件38,藉此可緩和振動臂22碰撞支承部…夺 之衝擊,從而可抑制振動臂22或支持臂3〇之支承扣缺損 或破損。 ' 如以上所說明般,根據上述實施形態之晶體振動片20, 藉由具備切口41八、41B、長槽26a、⑽、重量部巧等, 而抑制振m CI值之上彳、或⑽之下%,並且具備 在因晶體振動片20之落下等衝擊而導致振動臂22產生大幅 移位時既緩和衝擊又限制振動臂22之移位之支承部35,因田A finer part. According to this configuration, the support arm is more easily bent than the vibrating arm, so that the damage applied to the vibrating arm when the vibrating arm collides with the support portion of the support arm is alleviated, so that the vibration arm can be prevented from being damaged and the impact resistance is high. The vibrating piece. [Aspect 9] The vibrating piece according to the above application example, wherein the width of the support portion is formed to be smaller than a width of the base portion side of the support arm. According to this configuration, the front end side of the support arm having the support portion is easily bent with respect to the base portion side of the support arm, whereby the damage applied to the vibrating arm when the vibrating arm collides with the support portion of the support arm is alleviated, so that it can be used for Prevent the vibration arm from being damaged and improve the impact resistance of the vibrating piece. [Application Example 10] The vibrating piece according to the above application example is a piezoelectric vibrating piece formed of a piezoelectric material. According to this configuration, a piezoelectric vibrating piece such as a crystal resonator piece having high impact resistance and excellent vibration characteristics can be provided. [Aspect 11] The vibrating piece according to the above application example, wherein the crystal is used as the piezoelectric material, the base portion has a pair of slits which are disposed along the X-axis and the γ-axis of the crystal, And the Z-axis consists of the positive 150337.doc •10·201131975 in the direction of the x-axis direction of the two coordinate system in the opposite direction, the two main faces of the base show a retracted shape, the above-mentioned vibrating arm The end portion of the base portion in the Y-axis direction extends in the γ-axis direction, and the support arm having the support portion is provided on at least the +X side of the vibrating arm. The crystal system is widely used as a piezoelectric material of a piezoelectric vibrating piece. As described above, when a slit is formed by contact in the x-axis direction in the orthogonal coordinate system of the crystal axis, the crystal axis is relative to the crystal. The anisotropy of the inner wall of the slit formed by the slit processing from the x side (the corner portion is a so-called flash portion that generates an undesired hole portion or a residual portion of the last name. The cut: the flash edge When an impact is applied to the vibrating piece, cracking or breakage may occur, and in particular, the tensile stress may be significantly deteriorated when applied to the burr portion. According to the configuration of the above-described application example, the vibrating piece formed by the crystal is formed. The support arm extends from the end of the base on the opposite side (+X direction) of the slit in the x-direction of the burr portion, and has a support portion on the front end side of the support arm. The movable support portion of the vibrating arm displaced in the direction in which the tensile stress is applied to the burr portion is particularly resistant to impact resistance in the direction of displacement with weak impact. x is set to be only one end of the base. Part with a support In the case of supporting the arm, the support arm is formed from the other end, and the support arm is formed as compared with the case where the support arm is formed. The vibration plate can be miniaturized. The application example 12 is as described above. In the vibrating piece of the example, the impact absorbing member is provided on the abutting portion. According to this configuration, the yoke is supported by the shock absorbing member I50337.doc 201131975, thereby suppressing the shock. The vibrating arm is damaged or damaged. [Applicable to the vibrating body of the application example of the present invention: includes: [the vibrating piece of any one of the applicable examples; and the package, the housing of the package 0 according to the composition, The vibrations described in the example can provide the vibration characteristics of the crucible and the vibration of the impact (four) high [Applicable Example 14] The vibrating piece of any of the special examples of the vibrating device of this application example; the circuit component, which has = The upper oscillating circuit oscillating circuit and the squirting body are described as vibration circuit elements. ^ According to the configuration, the vibration piece described in the above application example is provided, thereby providing stable vibration characteristics. Vibration of the vibration-resistant vibration of the electronic device according to the application example of the present invention, the vibrating body of the above-described application example, the oscillator of the above-mentioned application example According to this configuration, the characteristics can be stabilized and the vibration characteristics of the machine can be ensured. 』 丨 丨 疋 疋 [ [Application 16] The vibration vibration f of this application example is from the _ end of the base; And the other end portion of the base portion holds the arm, and the vibrating arm extends in parallel, and the vibrating piece has a Z portion and a support portion disposed on the support arm 胄 'the support portion, and is disposed on the support portion Vibration I50337.doc -12. 201131975 #Outside the amplitude range of the normal vibration, and disposed at a position where the vibrating arm is displaced when the vibrating arm exceeds the amplitude range of the vibration of the tenth. According to this configuration, when an impact is applied to the vibrating piece and the vibrating arm is displaced beyond the amplitude range of the normal vibration, the displacement of the front end side of the vibrating arm is restricted by the support αΡ, thereby suppressing the application to the vibrating arm. The stress at the base connecting the root portion is increased, and problems such as cracking or breakage are prevented. Further, since the support arm having the support portion at the front end is included, the vibrating piece is bonded to the outside of the package or the like by the support portion, whereby the vibrating arm can be held outside while floating the base portion, thereby preventing the vibration arm from being vibrated. The vibration is transmitted to the base and the leakage or excess vibration is transmitted to the vibrating arm via the base, resulting in a vibration characteristic. Therefore, it is possible to provide a vibrating piece having stable vibration characteristics and excellent impact resistance. [Embodiment] Hereinafter, an embodiment in which a vibrating piece of the present invention is embodied will be described with reference to the drawings. (First Embodiment) Fig. 1 is a plan view schematically showing a crystal resonator piece as a diaphragm of a second embodiment viewed from one main surface side. 2 is a view schematically showing a cross section of each portion of the crystal resonator piece, FIG. 2(a) is a cross-sectional view of the line, FIG. 2(b) is a cross-sectional view taken along line cc of FIG. 1, and FIG. 2(c) Figure i2b_b line profile. In this example, an example in which crystal is used as the piezoelectric material will be described. In Fig. 1, the crystal resonator piece 20 is a piezoelectric vibrating piece containing crystal. 50337.doc ]3 201131975 The crystal wafer (crystal substrate) which is the original shape of the crystal constituting the crystal resonator element 2 of the present embodiment (4) is composed of an x-axis, a ¥-axis, and a z-axis. In the orthogonal coordinate system, the crystal z-cut plate cut out by the clockwise rotation of the range of ~5 degrees from the z-axis is cut to a specific thickness. The crystal resonator element 20 of the present embodiment has a shape t-shaped, that is, includes a base portion 21 formed by processing the crystal z-plate, and a double point from one end side (upper end side in the figure) of the base portion 21 The forks and the pair of vibrating arms 22 extend in parallel with each other. In the base portion 2, a pair of slits 4, A, 4, B, are formed along the straight line in such a manner that the two main faces thereof are in the shape of a contraction. The base portion 2^ includes an i-th portion 2u and a second portion 2ib which are located on both sides with a pair of slits 41A, 41B, and connects the i-th portion 21 & and the second portion 21b between the pair of slits 41, 41β. The connecting portion 21e. In the crystal resonator element 20 of the present embodiment, the transmission of the vibration of each of the vibrating arms 22 is blocked by the slits 41, so that vibration can be suppressed from being transmitted to the outside via the base 2丨 or the support arm 30 described below. The so-called vibration leakage prevents the CI value from rising. Furthermore, the width of the pair of slits UA, 41A (the width of the connecting portion 2ic) may be smaller than the distance between the side faces of the pair of vibrating arms 22, or may be larger than the distance from the side opposite to the pair of vibrating arms 22. Further, the width of the pair of slits a ” 41B (the width of the connecting portion 21c) may be the distance from the side faces in the opposite directions to each other, and the distance from the side faces facing the opposite directions. The length of the pair of vibrating arms 22 may be larger than one. The pair of vibrating arms 22 of the vibrating arm 22 extend from the i-th portion 2a1 of the base portion 21 in parallel with the two main faces (the front side and the inner side of the paper 150337.doc -14·201131975). Further, each vibrating arm 22 The two main faces are provided with two side faces connecting the two main faces on both sides. Further, a weight portion 29 having a width wider than the base portion 21 side of the vibrating arm 22 is provided on each of the front end sides of the vibrating arms 22. In this manner, the weight portion 29 of the front end portion of each of the vibrating arms 22 functions as a weight portion, whereby the frequency can be reduced without increasing the length of the vibrating arm 22. Further, the vibrating arm 22 of the present embodiment shows the weight portion 29 The outside part has a fixed width The configuration is not limited thereto, and the main portion of the vibrating arm 22 (portion different from the weight portion 29) may be tapered toward the distal end. For example, "the side portion 21 from the base portion 21 of the vibrating arm 22 is formed toward the front end. The tapered taper allows the vibrating arm 22 to easily vibrate. As shown in Fig. 1, the main surface of one of the vibrating arms 22 is provided with a bottomed long groove 26a along the respective longitudinal directions. As shown in FIG. 2(a), a long groove 26b is also provided along the longitudinal direction of the vibrating arm 22 on the other main surface of the vibrating arm 22. By the long grooves 26a and 26b provided in the vibrating arms 22, Further, the vibrating arm 22 is easily moved and efficiently vibrated, whereby the CI value can be lowered. Further, in the vibrating arm 22 of the embodiment shown in Fig. 1, the long grooves 26a (and 26b) are formed to One end side (the front end side of the vibrating arm 22) is located closer to the front end side (the weight portion 29 side) than the boundary of the weight portion 29 of the vibrating arm 22. Thus, the stress generated when the vibrating arm 22 vibrates The concentrated area is dispersed in the extending direction of the vibrating arm 22, so that stress concentration can be avoided The weight portion 29 of the boom 22 is connected to the root portion to cause damage such as breakage. Conversely, the one end side of the long grooves 26a and 26b (vibration 150337.doc •15·201131975 front end side of the arm 22) may be formed. The position is closer to the base 21 side than the boundary of the weight portion 29 of the vibrating arm 22, whereby the effect obtained is also obtained. That is, the region where the stress is concentrated when the vibrating arm 22 vibrates is dispersed in the vibrating arm 22. By extending the direction, it is possible to prevent stress from being concentrated on the joint root portion of the weight portion 29 of the vibrating arm 22, resulting in damage such as breakage, and the mass addition effect of the weight portion 29 in each of the vibrating arms 22 is increased, so that it is not necessary to make the crystal vibrating piece 20 The size is increased to achieve low frequency. However, the 'in each of the vibrating arms 22' does not occur even if one end side of the long grooves 26a and 26b (the front end side of the vibrating arm 22) is disposed at the boundary with the weight 邛 29 of the vibrating arm 22. When the stress is concentrated on the root portion of the weight portion of the vibrating arm, damage may occur, for example, if the vibrating arm 22 has a width that can be sufficiently rigid, or the base portion 21 side of the vibrating arm 22 is formed. In the case of a shape in which the width is widened toward the weight portion 29 (for example, a tapered shape or the like), one end side of the long grooves 26a and 2 (the front end side of the vibrating arm 22) may be disposed to be located with the vibrating arm 22 The boundary of the weight portion 29. The crystal vibrating piece 20 has one pair extending from the second portion 21b of the base portion 2b to support #30〇-the two opposite directions of the support arm 3's from the direction in which the pair of vibrating arms 22 extend from the base portion 2 1 The end portions extend in opposite directions from each other, and further extend in the direction in which the curved portion 31 extends in the direction of the vibration f22. The support arm 3 is miniaturized by bending in this way. The support arm is used for mounting a portion of an external substrate such as a package (not shown), and the fixing portion 39 of the dummy external substrate exemplified in the figure is fixed by an adhesive or the like. Mounted on an external substrate. Thus, in the crystal resonator element 20 mounted on the external substrate, Yu An 150337.doc -16·201131975, the vibrating arm 22 and the base portion 21 can be placed in a floating state. As shown in FIG. 2, an excitation electrode 44 is formed on each surface of each of the vibrating arms 22 including the long grooves 26 & 2, and an excitation electrode 43 is formed on a surface including each of the two side faces (®i Omit the illustration). In one of the vibrating arms 22, a voltage is applied between the excitation electrodes 43, 44 to contract the two side faces of the vibrating arm 22, thereby vibrating the vibrating arm 22. The excitation electrodes 43 and 44 can be formed by etching a crystal to form a long groove 26a, 26b including the crystal resonator piece 2, and then forming nickel (Ni) or chromium (Cr) as a base layer, for example. An electrode layer containing, for example, gold (Au) is formed by steaming or deplating, and then patterned using photolithography. Here, it is known that chromium and crystal are highly entangled, and gold has low electrical resistance and is difficult to oxidize. A portion where the thickness is narrowed in the same direction as the vibration direction of the vibrating arm 22 is provided on the front end side of each of the support arms 30, and a part of the support arm 30 is provided with a direction-oriented vibration so that the interval between the support arm 3〇 and the vibration I22 is narrowed. The support portion 35 is formed by bending the arm. In other words, the support portion 35 becomes a projection in which a part of the support arm 3 is formed in a protruding shape from the extending direction of the support arm 30 toward the vibrating arm 22. The dam support portion 35 is disposed in the amplitude range of the normal vibration of the adjacent vibrating arm 22, and is disposed when the adjacent vibration (4) is displaced beyond the normal amplitude by a specific amount. In addition, the amplitude range of the normal vibration of the vibrating arm 22 is oscillated by a specific resonance frequency by applying a driving voltage (electric field) to the excitation electrodes 43 and 44 of the crystal resonator element 2 The vibration region of the vibrating arm 22 when the amplitude of the vibrating arm 22 is maximum is increased by y. That is, the vibrating arm 22 adjacent to the support arm 35 of the support arm 30 is not in contact even when the amplitude of the vibrating arm 22 vibrating at the resonance frequency of the special 150337.doc -17-201131975 is maximum. Also, the vibrating arm. When a displacement exceeding a certain amount in the normal amplitude range is generated, it means a case where the vibrating arm 22 is largely displaced due to an impact applied to the crystal resonator piece 20 by dropping or the like. In the crystal resonator element 20 shown in Fig. 1, each of the support arms 30 has a portion having a width smaller than a portion having the smallest width between the two side faces of the adjacent vibrating arms 22. Further, in the support arm 30, the width of the base portion 2i side of the support portion 35 and the support portion 35 is formed to be smaller than the width of the base portion 21 side of the support arm 30. As will be described in detail, in the drawing, the pair of support arms 30 extending from the base portion 21 in opposite directions and extending in the curved portion 31 and extending in the direction parallel to the vibrating arm 22 have a width on the side of the base portion 21 The wide portion of the wide portion is formed with a narrow portion 33 having a narrowed width on the front end side of the wide portion 32, and the front end side of the narrow portion 33 serves as a support portion 35. That is, as shown in Fig. 2(b) The width t2 of the narrow portion 33 of the support arm 30 and the width t3 of the wide portion 32 of the support arm shown in Fig. 2(c) are in the relationship of t2 < t3. Further, each of the wide portion 32 and the narrow portion 33 of the support arm 3〇 is not square in cross section as in the present embodiment, for example, when a groove having a bottom is provided or has an imaginary center line with respect to the cross section. In the case of a line-symmetric cross-sectional shape, the cross-sectional area S2 of the narrow portion 33 of the support arm 30 shown in Fig. 2(b) and the cross-sectional area of the wide portion 32 of the support arm shown in Fig. 2(c) S3 can also be a relationship of 82 < § 3. Further, the relationship between the width η between the two side faces of the vibrating arm 22 shown in Fig. 2(a) and the width in the same direction of the support arm 30 is at least as shown in Fig. I50337.doc -18·201131975 The width t2 of the narrow portion 33 of the arm 30 is tl > t2. Further, in the present embodiment, the width t1 of the vibrating arm 22 and the width t3 of the wide portion 32 of the support arm 3'' shown in Fig. 2(c) are also in the relationship of t1 > t3. Further, the cross-sectional area S1 of the vibrating arm 22 shown in Fig. 2(a) and the cross-sectional area S2 of the narrow portion 33 of the supporting arm 3'' shown at least in Fig. 2(b) are S1 > S2. Further, the vertical tj surface area S1 of the vibrating arm 22 and the cross-sectional area S3 of the wide portion 32 of the support arm 30 shown in Fig. 2(c) may be in the relationship of S1 > S3. As described above, in the crystal resonator element 20, each of the support arms 3 has a narrow portion 33 (and a wide portion 32) which is thinner than the width of the portion having the narrowest width between the two side faces of the adjacent vibrating arms 22. Formed thereby, the support arm 3〇 exhibits elasticity that is easier to bend than the vibrating arm 22. Thereby, when the vibrating arm 22 is largely displaced on the support arm side and collides with the support portion 35, the damage to the vibrating arm 22 is alleviated, so that the damage of the vibrating arm 22 can be prevented and the vibrating arm 22 can be restricted from being excessively displaced. The impact resistance of the crystal resonator piece 20 is improved. Further, the width t2 of the narrow portion 33 on the side of the base portion 21 of the support portion 35 and the support portion 35 is formed to be smaller than the width u of the wide portion on the side of the base portion 21 of the support arm 30, thereby being relative to the support arm 30. The side of the base portion 21 (the wide portion 32 & side) has elasticity that is easily bent on the front end side (narrow portion side) of the support arm 30 of the support portion 35, so that the vibrating arm 22 is largely displaced on the side of the support arm 30 to collide When the support portion is in time, the damage to the vibrating arm 22 is reduced to prevent the vibration arm η from being damaged and the impact resistance of the crystal vibrating piece 2 is improved. In the present embodiment, the width of each support arm 3 is narrowed. The narrow portion 33 is closer to the direction of the adjacent vibration f22 (four) at the front end side, and is further curved to form a support portion 150337.doc -19-201131975 35 ° in the manner that the front end side is parallel to the adjacent vibrating arm 22 In the present embodiment, a folded portion 35a that is bent in a direction away from the adjacent vibrating arm 22 is formed on the distal end side of the support portion 35 of the support arm 3A, and the distal end portion including the support arm 3〇 is formed. The corner portion 35a does not abut against the vibrating arm 22, thereby In the configuration of the support arm 3A having the support portion 35 described above, the crystal resonator element 20 is fixed to the fixing portion 39 of the external substrate such as the package, and the fixing portion 39 is disposed. The wide portion 32 of the support arm 30 is closer to the base portion 21 than the support portion 35. Thereby, the support portion 35 which mitigates the impact with the fixed portion 39 as a fulcrum and limits the displacement of the vibrating arm 2 2 can be realized. Further, the arrangement of the support portion 35 in the crystal vibrating piece 2A will be described with reference to Figs. 1 and 3. Here, Fig. 3, which is newly referred to, schematically illustrates the support arm 30 of the vibrating arm 22. The arrangement of the abutting portions of the support portions 35 is a partial enlarged view of a part of the side surface of the vibrating arm 22 viewed from the direction of the arrow E in Fig. 1. The crystal vibrating piece 2 shown in Figs. 1 and 3 In the middle, when the vibrating arm 22 is largely displaced from the adjacent support arm 30 side and comes into contact with the support portion 35 of the support arm 3, the abutting portion of the support portion 35 with the vibrating arm 22 is as shown below. In this way, the support portion 35 is arranged. That is, the support portion 35 of the support arm 30 is provided. To be located closer to the front end than the region in which the long grooves 26a, 26b are formed when the vibrating arm 22 is largely displaced. This is configured to contact the adjacent support arm 30 when the vibrating arm 22 is displaced greatly. In the support portion 35, the abutting portion of the vibrating arm 22 and the support portion 35 is 150337.doc • 20· 201131975, which is located at a portion higher than the region on the front end side of the region in which the long grooves 26a and 26b are formed, thereby preventing vibration The damage of the arm 22 is increased, and the impact resistance of the crystal vibrating piece 20 is improved. Further, the support portion 35 of the support arm 30 is disposed at a width of the front end side of the vibrating arm 22 when the vibration (four) is displaced by the width. The portion where the weight portion 29 contacts. Further, the support portion 35 is disposed in surface contact with the side surface on the side of the support portion 35 of the two side faces of the weight portion of the vibrating arm 22. In other words, in the crystal resonator piece 2, the support portion 35 of the support arm 30 is avoided. The corner portion 27 formed at one end of the weight portion 29 of the vibrating arm 22 is disposed. Thereby, the side portion of the wide portion of the vibrating arm 22 and having the high strength portion 29 is in surface contact with the support portion 35, and thus the vibrating arm 22 The damage is suppressed. Further, by avoiding the corner portion arrangement, it is possible to prevent the corner portion 27 from being in contact with the abutting portion of the support portion 35 when the corner portion 27 of the vibrating arm 22 formed by the weight portion 29 is disposed. In the case where one of the support portions 35 is broken by contact, the impact resistance of the crystal resonator element 2 can be increased. Further, in the crystal resonator element 2 of the present embodiment, the support portion is formed in the support portion. An impact cushioning member 38 is provided on the surface of the abutting portion of the adjacent vibrating arm 22. Preferably, the shock absorbing member 38 is formed of a material that can relax the impact when the vibrating arm 22 is displaced by the middle field and contacts the support portion 35, and the contact portion with the vibrating arm 22 is ensured to be as large as possible. The contact area is in contact with the surface contact, and is disposed in parallel with the surface of the vibrating arm 22 which is abutting portion and has a fixed area. As the material used for the impact buffer member 38, a member such as rubber or resin which is elastic may be used. However, it is not limited thereto, and a metal film such as gold or the like which is softer than 150337.doc -21 - 201131975 may be used. In the case where the shock absorbing member 38 is formed by the metal film, for example, it is simultaneously formed by the electrode forming steps of the excitation electrodes 43 and 44 (see FIG. 2(a)) of the crystal resonator element 20, whereby The impact cushioning member 38 can be provided without adding a manufacturing step. In this way, the shock absorbing member 38 is provided on the abutting portion of the support portion 35 and the adjacent vibrating arm 22, whereby the vibration arm 22 can be relaxed against the support portion, so that the vibrating arm 22 or the support arm 3 can be restrained. The support buckle is missing or damaged. As described above, the crystal resonator element 20 according to the above embodiment is provided with the slits 41, 41B, the long grooves 26a, (10), the weight portion, etc., thereby suppressing the vibration m CI value above 彳, or (10) The lower portion is provided with a support portion 35 that both moderates the shock and restricts the displacement of the vibrating arm 22 when the vibrating arm 22 is largely displaced by the impact of the crystal vibrating piece 20 or the like.

此可提供具有穩定之振動特性,並且抗衝擊性高之晶體振 動片20。 S X 作為上述實施形態中所說明之振動片之晶體振動片 2〇(壓電振動片)亦可設為以下變形例來實施。 (第1實施形態之變形例) 上述實施形態中,對在一對振動臂22之兩側設置具有支 承部35之支持臂30之構成之晶體振動片2〇進行了說明。但 並不限定於此’就支承部而言’若考慮構成晶體振動片之 水晶材料(壓電體材料)之結晶軸方向,則可藉由在振動臂 之振動方向之任一側配置支承部而實現抗衝擊性之提高。 圖4係模式性地說明僅於振動臂之振動方向之單側配置 150337.doc -22- 201131975 具有支承部之支持臂之晶體振動片之變形例之平面圖。於 說明本變形例之圖4中,關於與上述實施形態相同之構成 附加相同符號並省略說明。 於圖4中’晶體振動片50包含將水晶z板切斷研磨加工為 特定厚度而獲得之水晶基材,其包括基部2丨、以及自該基 部2 1之一端側(圖中朝上(γ _方向)之端側)雙分叉並相互平 行而延伸之一對振動臂22。於基部21形成有—對切口 41A、41B,該一對切口 41A、41B係設置為在沿著由上述 水晶之X軸、Y軸、及Z軸所構成之正交座標系中之χ軸方 向的一條直線之對向方向上,該基部21之兩個主面呈現出 内縮之形狀,基部21包括隔著一對切口 41Α、仙而位於 兩側之第1部分213及第2部分21b,以及於一對士刀口 41八、 41Β間連接第丨部分21a及第2部分21b之連接部分门〇。 一對振動臂22於前端側分別設置有寬幅部即重量部”。 又,於各振動臂22之主面,沿著各自之再 曰t長度方向分別設置 有一條有底長槽26a。又雖未圖示,彳 彳—於包含各振動臂22 之各長槽26a、及兩個側面之各個 & U之表面形成有激振電 7^ 〇 晶體振動片50具有自基部21之第2部分叫延伸之 =:、Mb。各支持臂I鳩自與-對振動臂22從基部 二T交又之方向之兩個端部起分別相互向相反方 向延伸,並於彎曲部31、31b向一對 弯曲後進-步延伸。 振動臂22延伸之方向This provides the crystal vibration piece 20 having stable vibration characteristics and high impact resistance. The crystal resonator element 2 (piezoelectric vibrating piece) of the resonator element described in the above embodiment may be implemented as the following modification. (Modification of the first embodiment) In the above embodiment, the crystal resonator element 2 of the configuration in which the support arm 30 having the support portion 35 is provided on both sides of the pair of vibrating arms 22 has been described. However, the present invention is not limited to the case where the crystal axis direction of the crystal material (piezoelectric material) constituting the crystal resonator piece is considered, and the support portion can be disposed on either side of the vibration direction of the vibrating arm. And to achieve an improvement in impact resistance. Fig. 4 is a plan view schematically showing a modification of the crystal vibrating piece having the support arm of the support portion, which is arranged only on one side of the vibration direction of the vibrating arm 150337.doc -22- 201131975. In the embodiment of the present invention, the same components as those of the above-described embodiment are denoted by the same reference numerals, and their description will be omitted. In FIG. 4, the crystal vibrating piece 50 includes a crystal substrate obtained by cutting and polishing a crystal z-plate into a specific thickness, which includes a base portion 2'' and a side end side from the base portion 21 (in the figure upwards (γ The end side of the _direction) is bifurcated and parallel to each other to extend one of the pair of vibrating arms 22. A pair of slits 41A, 41B are formed in the base portion 21, and the pair of slits 41A, 41B are disposed along the χ-axis direction in the orthogonal coordinate system formed by the X-axis, the Y-axis, and the Z-axis of the crystal. In the opposite direction of a straight line, the two main faces of the base portion 21 are in a retracted shape, and the base portion 21 includes a first portion 213 and a second portion 21b which are located on both sides via a pair of slits 41, sin, And connecting the connection portion thresholds of the second portion 21a and the second portion 21b between the pair of knife edges 41, 41, and 41. The pair of vibrating arms 22 are respectively provided with a wide portion, that is, a weight portion, on the front end side. Further, on the main surface of each of the vibrating arms 22, a bottomed long groove 26a is provided along each of the longitudinal direction of each of the vibrating arms 22. Although not shown, the surface of each of the long grooves 26a and the two side faces of each of the vibrating arms 22 is formed with an excitation electric current. The crystal vibrating piece 50 has the second portion from the base portion 21. The part is called extension =:, Mb. Each of the support arms I 鸠 and - the two ends of the vibrating arm 22 from the direction of the base two T intersections extend in opposite directions to each other, and are directed to the curved portions 31, 31b. a pair of bending and backward-step extension. The direction in which the vibrating arm 22 extends

該—對支持臂3〇、勘中,從自水晶之正交座標系中之-X 150337.doc •23· 201131975 方向切開而形成之切口 41B之相反側之基部21的端部(+X 側)延伸之一方之支持臂30於前端側具有支承部35。相對 於此,自水晶之上述正交座標系中之-X方向之切口 41B側 之基部21之端部延伸之另一方之支持臂30b係比具有上述 支承部35之一方之支持臂30更短者,且不具有支承部而具 有固定部39。 於由水晶Z板所形成之晶體振動片50中,當藉由蝕刻而 形成自基部2 1之X軸方向之兩個方向切開所形成之一對切 口 41A、41B中、沿著結晶軸之正交座標系中之_χ方向之 切口 41B時,因水晶Z板之蝕刻異向性,而導致於切口 41B 之内壁之前端部(角部)42B形成產生不期望之孔部或蝕刻 殘留部之所謂飛邊部。該切口 41B所產生之飛邊部係於因 落下等而對晶體振動片50施加有衝擊時可導致產生龜裂戍 折斷’尤其’於對飛邊部施加拉伸應力時,亦即,當振動 臂22於+X方向大幅移位時,導致強度顯著劣化。 根據本變形例之晶體振動片50之構成而成為如下構成: 自產生飛邊部之-X方向之切口之相反側的基部21之端部 (+X方向)延伸之一方之支持臂30之前端側具備支承部35, 而另一方之支持臂30b係具有發揮作為晶體振動片5〇之支 持構造之功能的固定部39,短於一方之支持臂3〇,且於前 端側不具有支承部。藉此,當振動臂22於對飛邊部施加拉 伸應力之方向即+X方向大幅移位時,該振動臂22之移位受 到支承部35限制,從而可防止於抗衝擊性特別弱之飛邊= 產生龜裂或折斷。 150337.doc •24· 201131975 此處,與形成有飛邊部之_又側之切口 41B成對之切口 41A之内壁之角部42A未產生飛邊部且亦難以引起強产下 降’故在配置於基部21之】側之另一方之支持臂地:可 不設置支承部,支持臂3〇15之長度亦可較短。因此,與在 振動臂22之兩側配置具有支承部35之支持臂%之構成相 比,可形成小型且抗衝擊性優異之晶體振動片5〇。 以上’對由發明者所完成之本發明之實施形態進行了具 體說明|發明並不限定於上述實施形態,彳於不脫離 其主旨之範圍内施加各種變更。 明 洩 但 例如,上述實施形態及變形例中,作為顯著發揮本發 之效果之實施形態’說明了在基部21設置具有抑制振動 漏效果之切口 41A、41B之構成之晶體振動片2〇、5〇。 並不限定於此,於基部未設置有切口之構成中,例如於美 部之與振動臂之振動方向相同之方向之寬度狹窄且㈣ς 小之振動片中,亦可實現抗衝擊性之提高。 又,上述實施形態及變形例中,以包括具有長槽、 26b及重量部29之振動臂22之晶體振動片2〇、“作為一例 進行了說明’但是即便為不具有其等之構成之振動片亦 可獲得本發明之效果。 又,上述實施形態及變形例中,說明了在包括支承部” 之支持臂3G中,於支承部35之與振動f 22之抵接部分設置 有衝擊緩衝構件38之構成。但不限定於此,即 衝擊緩衝構件38之構成,與不具有支承部35之構成之振動 片相比亦具有提高抗衝擊性之效果。 150337.doc •25· 201131975 入 關於 支持臂30之支承部35之更前端側所設置之折返 部35a,亦可為不設置其之構成。 又,上述實施形‘態中,U弯曲振動模式之晶體振動片2〇 作為-例進行了說明。但不限定於此,於扭曲振動模 剪斷模式等彎曲振動模式以外之振動模式之振動片中,藉 由具備本發明之特徵性構成亦可獲得與上述實施形態及^ 开v例相同之提高抗衝擊性等之效果。 又,上述實施形態及變形例中,說明了2根振動臂別 基部21起相互平行延伸而形成之所謂音又型之晶體振動片 2〇、5〇中之本發明的實施形態或變形例。但不限定於此, 即便係僅由具有成為固定端之基部之Η艮振動臂所構成之 所谓梁型振動片等,又,即便係具有3根以上振動臂之振 動片’均可獲4與上述實施形態及變形例相同之效果。 上述實施形態及變形例中,對包含作為㈣體材料之一 之水晶之晶體振動片20、50進行了說明,但不限定於此, 亦可由鈕酸鋰、鈮酸鋰箄泱a 、 文經寺水日日以外之壓電體材料所構成。 進而’即便係包含磨電體姑4泣I、/ aL , ^ ^體材#以外之例如石夕半導體之振動 ,亦可獲得與上述實施形態及變形例相同之效果。 上述實施形態及變形例中所說明之晶體振動啊 適用於元件或Μ電元件以外之各種電子零件。尤盆, :封裝體内上述晶體振動片2〇、5〇中任一壓電振動片係以 2持臂30作為固定部而接合,進而至少組入有使該晶體 振動片20、50振盪之振盪雷政士 盈11路70件所構成之振盪器之cm 上升、Q值下降、或振動泡漏理 灵漏侍以抑制而實現高性能化, I50337.doc •26· 201131975 並且可實現小型化 (第2實施形態) 其次,對作為第2實施形態之振動片之晶體振 / 說明。圖5係表示第2實施形態之晶體振動片仃 •fcV、 丁阳圖。 ;以下所說明之第2實施形態之晶體振動 % ^ ’ T ’以斑卜 述實施形態不同之方面為中心進行說明,對於相同之事 則省略其說明。 爭貝 本實施形態之晶體振動片7〇中設置有自基部77之端部延 伸之2個振動臂78、乃及⑼⑽)支持臂(外側臂部⑽、 MB’該!對(2個)支持臂鳩、75Β係相對於振動臂μ、乃 而於Χ軸方向之兩外側,設置為與振動臂78、79平行。2個 振動臂78、79中’設置有於各自之主面具有開口部之有底 長槽72、73。2個支持臂74Β、75Β自基部77分別向γ轴方 向延伸,並且於X軸方向並列設置。 本實施形態中,支持臂74Β、75Β設定為前端部對向於 振動臂78、79之前端部之長度。 又’支持臂74Β、75Β相互之離開距離係前端側寬於基 端侧。 又’於支持臂74Β之前端部設置有具有衝擊吸收性之支 承部(缓衝部)241Β,於支持臂74Β之中途亦設置有具有衝 擊吸收性之支承部(緩衝部)242Β。同樣地,於支持臂75Β 之前端部設置有具有衝擊吸收性之支承部(緩衝部)25 1Β ’ 於支持臂75Β之中途亦設置有具有衝擊吸收性之支承部(緩 衝部)252Β。 150337.doc •27. 201131975 支承部(緩衝部)241B、2俄係以使以寺臂74b之寬产尺 寸變大之方式形成,以便使支持f 74B與振動㈣之間隔 變窄。換言之,支承部(緩衝部)241B、242b係自支持臂 74B朝向振動臂78而形成為自支持f 74b呈突起狀設置之 凸部。同㈣,支承部(緩衝部)251B、2训係以使支持臂 75B之寬度尺寸變大之方式形成,以便使支持臂抑與振 動臂79之間隔變窄。換言之,支承部(緩衝部)25ΐβ、 係自支持臂75B朝向振動臂79而形成為自支持臂75β呈突 起狀設置之凸部。再者,本例之支承部(緩衝部)24ΐβ、 242B、251B、252B為朝向與自上述支持臂74b、抑朝向 振動臂78、79之方向相反之方向亦設置有凸部之構成但 如上所述,亦可為僅於自支持臂746、75B朝向振動臂 78、79之方向設置有凸部之構成。 此處,支持臂74B、75B之前端部分之支承部(緩衝部) 241B、251B及中途部分之支承部242B ' 252B係相對於各 振動臂78、79離開而設置,且構成當各振動臂78、乃於又 軸方向彎曲變形時,接觸於振動臂78、79中之至少i個振 動臂而阻止(限制)其進一步之彎曲變形之阻止部(限制 部)。 換言之,就支承部241B、251B、242B、252B而古,支 承部241B ' 251B、242B、252B配置於所鄰接之振動臂 78、79之通常之振動之振幅範圍外,且設置於當所鄰接之 振動臂78、79產生超過通常之振幅範圍特定量之移位時會 抵接該振動臂78、79之位置。 150337.doc -28- 201131975 再者,所明上述振動臂78、79 與上述實施形態柄同,係m通…辰動之振幅範圍 場)而以特定之共振頻率据 助(電 . 、動之振動臂78、79之振幅最大 時之振動臂78、79的振動F # 〈娠、敢大 一 u 域。亦即,配置為即便於以特 定共振頻率振動之振動臂78 更於以特 ,,._ y之振幅最大時,所鄰接之 振動臂78、79與支承部241 鄰接之 觸。 251B、242B、252B亦不接 支持臂74B之前端部所設 直之支承部241B之振動臂78側 之部分2411B,於振動劈78&gt;^ + 向支持臂74B側超過通常之振 動之振幅範圍而產生χ軸方 疋琴曲變形時會與振動臂78 接觸。與此同時,支持臂74β &lt; r逑所设置之支承部242Β 之振動臂78側之部分242 1 R,# _ι 於振動臂78向支持臂74B側 產生X軸方向之變曲變形時會與振動臂π接觸。 同樣地’支持臂75B之前端部所設置之支承部測之振 動臂79側之部分2511B,於# 、振動濛79向支持臂75B側超過 通常之振動之振幅範圍而產生X軸方向之彎曲變形時會與 振動臂79接觸。與此同肖’支持臂75B之中途所設置之支 承部助之振動臂79側之部分说ib,於振動臂79向支持 臂75B側產生X軸方向之彎曲變形時會與振動臂乃接觸。 此支持 #74B、75B 之部分 24iib、2421B、2511B、 2521B(阻止部)構成為藉由如上所述之振動臂π、79之彎 曲變形而與振動臂78、79之長度方向之複數個位置接觸。 藉此’於振動臂78、79與支持臂74β、75β之部分24uB、 2421B、25UB、2521B(阻止部)接觸時,可防止或緩和對 150337.doc -29- 201131975 振動臂78、79局部性地施加衝擊。 又’支持臂74β、75B之中途(阻止部)之部分2421B ' 2521B分別形成向振動臂78 ' 79側凸出之彎曲凸面。因 此,支持臂74B之中途(阻止部)之部分2421B藉由如上所述 之振動臂28之彎曲變形而與振動臂78進行面接觸。同樣 地,支持臂75B之中途(阻止部)之部分2521B藉由如上所述 之振動臂79之彎曲變形而與振動臂79進行面接觸。藉此, 於振動臂78、79與支持臂74B、75B之中途(阻止部)之部分 2421B、2521B接觸時,可防止或缓和對振動臂78、79局 部性地施加衝擊。 根據以上所說明之第2實施形態,發揮與上述第1實施形 態相同之效果。 (第3實施形態) 其次’作為第3實施形態,對包括作為上述實施形態中 所說明之振動片之晶體振動片之振動體進行說明。 圖6係表示第3實施形態之振動體之概略構成之模式圖, 圖6(a)係平面圖’圖6(b)係圖6(a)之f_f線之剖面圖。再 者’本實施形態中,表示使用作為上述第1實施形態中所 說明之振動片之晶體振動片2〇作為一例之構成並進行說 明。 如圖6所示’作為振動體之晶體振動體5包括第1實施形 態之晶體振動片20及收容晶體振動片20之封裝體80。封裝 體so包括封裝體基座81、無縫環82、蓋體85等。封裝體基 座81以可收容晶體振動片20之方式而形成有凹部,於其凹 150337.doc •30· 201131975 部之2個部位設置有與晶體振動片2〇之未圖示之安裝電極 連接之連接墊88。連接墊88構成為連接於封裝體基座81内 之配線,可與封裝體基座81之外周部所設置之外部連接端 子83導通。 於封裝體基座81之凹部之周圍設置有無縫環82。進而, 於封裝體基座81之底部設置有貫通孔86 ^晶體振動片2〇經 由導電性接著劑84而接著固定於封裝體基座81之連接墊 88。而且,封裝體8〇係將覆蓋封裝體基座81之凹部之蓋體 85與無縫環82無縫焊接。封裝體基座81之貫通孔%中填充 有包含金屬材料等之密封材87。該密封材87於減壓氣體環 境中熔融後固化而氣密地密封貫通孔86,以使封裝體基座 81内可保持減壓狀態。晶體振動體5中,藉由經由外部連 接端子83之來自外部之驅動信號而使晶體振動片2〇激振, 並以特定頻率(例如,32 kHz)振盪(共振)。 如上所述,由於晶體振動體5包括上述實施形態中所說 明之晶體振動片20,因此可提供具有穩定之振動特性並且 抗衝擊性高之晶體振動體5。 再者,晶體振動體5即便使用其他形態之振動片例如晶 體振動片70來代替晶體振動片20,亦可獲得相同之效果。 又,本實施形態中,以將晶體振動片2〇固定於設置在2 個部位之連接墊88之構成進行了說明,但連接墊88不限定 於2個部位’亦可設置所期望之數量,且與晶體振動片2〇 之連接亦可於所期望之連接部位進行。 (第4實施形態) 150337.doc -31 - 201131975 其次,作為第4實施形態,對包括作為上述所說明之振 動片之晶體振動片之振盪器進行說明。 、 圖7係表示第4實施形態之振盪器之概略構成之模式圖, 圖7(a)係平面圖,圖7(b)係圖7(a)之G_G線之剖面圖。再 者,本實施形態中,表示使用作為上述第丨實施形態中所 說明之振動片《晶體振動片2〇作$ 一例之構成並進行說 明。 ° 作為振盪器之晶體振盪器6構成為在上述晶體振動體5之 構成中還包括電路元件。再者,對於與晶體振動體5共用 之部分附加相同符號並省略詳細說明。 如圖7所示,晶體振盪器6包括:第丨實施形態之晶體振 動片20 $具有使晶體振動片2〇振遺之振盡電路之電路 元件之1C晶片91 ;以及收容晶體振動片2〇及1(:晶片91之封 裝體80。IC晶片91固定於封裝體基座81之底部,藉由金線 等金屬導線92而與其他配線連接。晶體振盪器6中,藉由 來自1C晶片91之振盪電路之驅動信號而使晶體振動片2〇激 振’並以特定頻率(例如’ 32 kHz)振盛(共振)。 如上所述,由於晶體振盪器6包括上述實施形態中所說 明之晶體振動片20,因此可提供具有穩定之振動特性,並 且抗衝擊性高之晶體振盈器6。 再者,晶體振盪器6即便使用晶體振動片7〇來代替晶體 振動片20’亦可獲得相同之效果。 又,本實施形態中,以將晶體振動片20固定於設置在2 個部位之連接墊88之構成進行了說明,但連接墊88不限定 150337.doc •32· 201131975 於2個部位,亦可設置所期望之數量,且與晶體振動片2〇 之連接亦可於所期望之連接部位進行。 [產業上之可利用性] 作為上述振動片之晶體振動片20、70包括支承部,該支 承部於因^下等衝擊而導致振動臂產生大幅移位時,既緩 和衝擊又限制振動臂之移位,因此既可確保抗衝擊性又可 維持穩定之振動特性。 因此,將該晶體振動片2G、7G封裝體化而成之晶體振動 體^或晶體振mi|6可作為^時元件等廣泛用於數位行 動電逢、個人電腦、電子鐘、錄影機、電視等電子機器 中。而且’可較佳地用於該等電子機器之小型化等,尤其 適用於需要抗衝擊性之行動機器等。 【圖式簡單說明】 A系杈式陡地°兒明自-方之主面側觀察作為第1實施形 態之振動片之晶體振動片之平面圖。 圖2係模式性地說明晶體振動片之各部分之剖面之圖, 圖2U)係圖1之a-a線剖面圖,圖 m 圖2(b)係圖1之c-c線剖面圖, 圖2(c)係圖1之b-b線剖面圖。 圖3係自圖i之箭頭E之方向觀察振動臂之側面之一部分 之部分放大圖。 :4係模式性地說明作為振動片之晶體振動片之變形例 之平面圖。 =5係模式性地說明作為第2實施形態之振動片之晶體振 動片之平面圖。 150337.doc -33- 201131975 圖6係表示第3實施形態之振動體之概略構成之模式圖, 圖6(a)係平面圖,圖6(b)係圖6(a)iF_F線之剖面圖。 圖7係表示第4實施形態之振盪器之概略構成之模式圖, 圖7(a)係平面圖,圖7(b)係圖7(a)之G_G線之剖面圖。 圖8係模式性地表示作為先前之振動片之音叉型晶體掘 動片之平面圖》 【主要元件符號說明】 5 6 20、50 21 、 77 、 121 21a 、 121a 21b 、 121b 21c 、 121c 22、78、79 ' 122 26a、26b、72 ' 73、126 27 29The end portion of the base portion 21 on the opposite side of the slit 41B formed by cutting from the direction of -X 150337.doc •23·201131975 in the orthogonal coordinate system of the crystal (+X side) The support arm 30 of one of the extensions has a support portion 35 on the front end side. On the other hand, the other support arm 30b extending from the end portion of the base portion 21 on the slit 41B side in the -X direction in the orthogonal coordinate system of the crystal is shorter than the support arm 30 having one of the support portions 35. The holder has a fixing portion 39 without a support portion. In the crystal resonator piece 50 formed of the crystal Z plate, when formed by etching in two directions of the X-axis direction of the base portion 2, the pair of slits 41A, 41B are formed along the crystal axis. When the slit 41B in the χ direction is intersected, the etching anisotropy of the crystal Z plate causes the front end portion (corner portion) 42B of the inner wall of the slit 41B to form an undesired hole portion or an etch residue portion. The so-called flash side. The burr portion generated by the slit 41B may cause cracking and rupture when an impact is applied to the crystal resonator piece 50 due to dropping or the like, particularly when a tensile stress is applied to the burr portion, that is, when the vibration is applied. When the arm 22 is largely displaced in the +X direction, the strength is significantly deteriorated. According to the configuration of the crystal resonator element 50 of the present modification, the front end of the support arm 30 extending from the end portion (+X direction) of the base portion 21 on the opposite side to the slit in the X direction of the burr portion is formed. The support portion 35 is provided on the side, and the other support arm 30b has a fixing portion 39 that functions as a support structure for the crystal resonator piece 5, and is shorter than one of the support arms 3'' and has no support portion on the distal end side. Thereby, when the vibrating arm 22 is largely displaced in the direction in which the tensile stress is applied to the burr portion, that is, in the +X direction, the displacement of the vibrating arm 22 is restricted by the support portion 35, thereby preventing the impact resistance from being particularly weak. Flashing edge = cracking or breaking. 150337.doc •24·201131975 Here, the corner portion 42A of the inner wall of the slit 41A which is formed with the slit 41B on the side of the burr portion is not formed with a burr portion, and it is also difficult to cause a strong yield drop. The other support arm on the side of the base 21: the support portion may not be provided, and the length of the support arm 3〇15 may be short. Therefore, compared with the configuration in which the support arm % having the support portion 35 is disposed on both sides of the vibrating arm 22, the crystal resonator piece 5 which is small in size and excellent in impact resistance can be formed. The present invention has been described in detail with reference to the embodiments of the present invention. The invention is not limited to the embodiments described above, and various modifications may be made without departing from the spirit and scope of the invention. In the above-described embodiments and modifications, for example, the crystal vibrating piece 2, 5 having the configuration in which the slits 41A and 41B for suppressing the vibration leakage effect are provided in the base portion 21 is described as an embodiment in which the effects of the present invention are remarkably exhibited. Hey. The present invention is not limited to this. In the configuration in which the base portion is not provided with a slit, for example, in the vibrating piece having a narrow width in the same direction as the vibration direction of the vibrating arm and (4) small, the impact resistance can be improved. In the above-described embodiments and modifications, the crystal resonator element 2A including the vibrating arm 22 having the long groove 26b and the weight portion 29 is described as an example, but the vibration is not provided. Further, in the above-described embodiments and modifications, it is explained that in the support arm 3G including the support portion, an impact buffer member is provided at abutment portion of the support portion 35 with the vibration f22. The composition of 38. However, the configuration of the shock absorbing member 38 is also improved in impact resistance as compared with the vibration piece having no configuration of the support portion 35. 150337.doc •25· 201131975 The folding portion 35a provided on the distal end side of the support portion 35 of the support arm 30 may be configured not to be provided. Further, in the above-described embodiment, the crystal vibrating piece 2 of the U bending vibration mode has been described as an example. However, the present invention is not limited thereto, and the vibration mode of the vibration mode other than the bending vibration mode such as the twisting vibration mode is not the same as the above-described embodiment and the above-described embodiment. Impact resistance and the like. Further, in the above-described embodiments and modifications, the embodiment or the modification of the present invention in which the two vibrating arm base portions 21 are formed to extend in parallel with each other and which are formed in parallel with each other. However, the present invention is not limited to this, and even if it is a so-called beam-type vibrating piece composed of a vibrating arm having a base portion that is a fixed end, even a vibrating piece having three or more vibrating arms can obtain 4 The same effects as those of the above embodiments and modifications. In the above-described embodiments and modifications, the crystal resonator plates 20 and 50 including the crystal material which is one of the (four) body materials have been described. However, the present invention is not limited thereto, and lithium niobate, lithium niobate 箄泱a, and wenjing temple may be used. It is composed of piezoelectric materials other than water. Further, even if the vibration of, for example, Shishi Semiconductor, other than the body of the electric body, I, / aL, ^ ^, is used, the same effects as those of the above-described embodiment and modification can be obtained. The crystal vibrations described in the above embodiments and modifications are applicable to various electronic components other than components or piezoelectric elements. In the package, any one of the crystal vibrating reeds 2 〇 and 5 封装 in the package is joined by the holding arm 30 as a fixing portion, and at least the crystal vibrating pieces 20 and 50 are oscillated. The oscillation of the oscillator consisting of 70 pieces of Lei Zhengshi Ying 11 is increased, the Q value is decreased, or the vibrating bubble leaks to suppress the high performance. I50337.doc •26· 201131975 and can be miniaturized (Second Embodiment) Next, a crystal oscillation/description of the vibrating piece according to the second embodiment will be described. Fig. 5 is a view showing a crystal resonator piece ffcV and a Dingyang diagram according to the second embodiment. The crystal vibration % ^ ' T ' of the second embodiment described below will be mainly described with respect to the aspects of the embodiment, and the description of the same matters will be omitted. The crystal vibrating piece 7A of the embodiment of the present invention is provided with two vibrating arms 78 and (9) (10)) supporting arms extending from the end of the base portion 77 (the outer arm portions (10), MB's; the pair (two) support The arm 鸠 and the 75 Β are provided in parallel with the vibrating arms 78 and 79 with respect to the vibrating arm μ and the outer sides in the z-axis direction. The two vibrating arms 78 and 79 are provided with openings on the respective main faces. The bottomed long grooves 72 and 73. The two support arms 74A and 75b extend from the base portion 77 in the γ-axis direction and are arranged side by side in the X-axis direction. In the present embodiment, the support arms 74A and 75B are set to face end portions. The length of the end portions of the vibrating arms 78, 79. The distance between the support arms 74, 75, and the front end is wider than the base end side. Further, the end portion of the support arm 74 is provided with a shock absorbing support portion. (buffer portion) 241A, a support portion (buffer portion) 242b having impact absorption is provided in the middle of the support arm 74. Similarly, a support portion having shock absorption is provided at the end portion before the support arm 75A (buffer) Department) 25 1Β 'on the support arm 75Β A support portion (buffer portion) 252 具有 having a shock absorbing property is also provided. 150337.doc • 27.3. 201131975 The support portions (buffer portions) 241B and 2 are formed in such a manner that the width of the temple arm 74b is increased. In order to narrow the interval between the support f 74B and the vibration (four), in other words, the support portions (buffer portions) 241B and 242b are formed from the support arm 74B toward the vibrating arm 78 so as to be convex portions provided in a projecting shape from the support f 74b. (4) The support portions (buffer portions) 251B and 2 are formed such that the width of the support arm 75B is increased to narrow the distance between the support arm and the vibrating arm 79. In other words, the support portion (buffer portion) 25 ΐ β The support arm 75B is formed as a convex portion provided in a protruding shape from the support arm 75β toward the vibrating arm 79. Further, the support portions (buffer portions) 24ΐβ, 242B, 251B, and 252B of the present example are oriented and supported from the above. The arm 74b is also provided with a convex portion in a direction opposite to the direction in which the vibrating arms 78 and 79 are opposite to each other. However, as described above, the convex portion may be provided only in the direction from the support arms 746 and 75B toward the vibrating arms 78 and 79. The composition of The support portions (buffer portions) 241B and 251B at the front end portions of the arms 74B and 75B and the support portions 242B' 252B at the intermediate portion are provided apart from the respective vibration arms 78 and 79, and are configured as the respective vibration arms 78. When the axial direction is bent and deformed, at least i of the vibrating arms 78, 79 are contacted to block (limit) the further bending deformation preventing portion (restricting portion). In other words, the supporting portions 241B, 251B, 242B, 252B In ancient times, the support portions 241B' 251B, 242B, and 252B are disposed outside the amplitude range of the normal vibration of the adjacent vibrating arms 78, 79, and are disposed when the adjacent vibrating arms 78, 79 generate a range exceeding the normal amplitude range. When the amount is shifted, the position of the vibrating arms 78, 79 is abutted. 150337.doc -28- 201131975 Furthermore, it is clear that the above-mentioned vibrating arms 78 and 79 are the same as the above-described embodiment, and are in the range of the amplitude range of the m-passing movement, and are assisted by a specific resonance frequency (electricity, movement When the amplitudes of the vibrating arms 78 and 79 are the largest, the vibrations of the vibrating arms 78 and 79 are F # <pregnant, dare and large u. That is, even if the vibrating arm 78 vibrating at a specific resonance frequency is more special, When the amplitude of _y is the largest, the adjacent vibrating arms 78 and 79 are in contact with the support portion 241. The 251B, 242B, and 252B are also not connected to the vibrating arm 78 side of the straight support portion 241B provided at the front end of the support arm 74B. The portion 2411B is in contact with the vibrating arm 78 when the vibrating jaw 78&gt;^ + exceeds the amplitude range of the normal vibration to the support arm 74B side, and the vibrating arm 78 is in contact with the vibrating arm 78. At the same time, the support arm 74β &lt; r逑The portion 242 1 R,# _ of the side of the vibrating arm 78 provided on the support portion 242 会 is in contact with the vibrating arm π when the vibrating arm 78 is deformed in the X-axis direction toward the support arm 74B side. Similarly, the support arm 75B a portion of the vibrating arm 79 side 2511B measured by the support portion provided at the front end portion, When the vibration arm 79 reaches the amplitude range of the normal vibration and the bending deformation in the X-axis direction occurs, the vibration arm 79 comes into contact with the vibrating arm 79. This is the same as the support portion provided in the middle of the support arm 75B. The portion on the side of the vibrating arm 79 is ib, and is in contact with the vibrating arm when the vibrating arm 79 is bent in the X-axis direction toward the support arm 75B side. This supports portions 24iib, 2421B, 2511B, 2521B of #74B, 75B (blocking) The portion is brought into contact with a plurality of positions in the longitudinal direction of the vibrating arms 78 and 79 by the bending deformation of the vibrating arms π and 79 as described above. Thereby, the vibrating arms 78 and 79 and the supporting arms 74β and 75β are used. When the 24uB, 2421B, 25UB, and 2521B (blocking portions) are in contact, the impact of the vibration arms 78, 79 on the 150337.doc -29-201131975 can be prevented or alleviated. Also, the support arms 74β and 75B are halfway (the blocking portion) The portion 2421B ' 2521B respectively forms a curved convex surface that protrudes toward the side of the vibrating arm 78 ' 79. Therefore, the portion 2421B of the middle of the support arm 74B (the blocking portion) is vibrated by the bending deformation of the vibrating arm 28 as described above. Arm 78 is face-to-face Similarly, the portion 2521B of the middle of the support arm 75B (blocking portion) is in surface contact with the vibrating arm 79 by the bending deformation of the vibrating arm 79 as described above. Thereby, the vibrating arms 78, 79 and the supporting arm 74B When the portions 2421B and 2521B of the middle of the 75B (blocking portion) are in contact with each other, the vibration of the vibrating arms 78 and 79 can be prevented or alleviated from being locally applied. According to the second embodiment described above, the same effects as those of the first embodiment described above are exerted. (Third Embodiment) Next, a vibrating body including a crystal resonator piece as the resonator element described in the above embodiment will be described as a third embodiment. Fig. 6 is a schematic view showing a schematic configuration of a vibrating body according to a third embodiment, and Fig. 6(a) is a plan view. Fig. 6(b) is a cross-sectional view taken along line f_f of Fig. 6(a). In the present embodiment, a configuration in which the crystal resonator element 2A as the resonator element described in the first embodiment is used as an example will be described. As shown in Fig. 6, the crystal vibrating body 5 as the vibrating body includes the crystal vibrating piece 20 of the first embodiment and the package 80 for accommodating the crystal vibrating piece 20. The package body includes a package base 81, a seamless ring 82, a cover 85, and the like. The package base 81 is formed with a recessed portion so as to accommodate the crystal resonator element 20, and is provided with a mounting electrode (not shown) of the crystal resonator element 2 at two portions of the recess 150337.doc • 30·201131975. The connection pad 88. The connection pad 88 is formed to be connected to the wiring in the package base 81, and is electrically connected to the external connection terminal 83 provided on the outer peripheral portion of the package base 81. A seamless ring 82 is provided around the recess of the package base 81. Further, a through hole 86 is formed in the bottom of the package base 81. The crystal resonator element 2 is bonded to the connection pad 88 of the package base 81 via the conductive adhesive 84. Further, the package 8 is formed by seamlessly bonding the cover 85 covering the recess of the package base 81 to the seamless ring 82. The through hole % of the package base 81 is filled with a sealing material 87 containing a metal material or the like. The sealing material 87 is melted in a reduced-pressure gas atmosphere and solidified to hermetically seal the through-holes 86 so that the inside of the package base 81 can be maintained in a reduced pressure state. In the crystal resonator 5, the crystal resonator element 2 is excited by a drive signal from the outside via the external connection terminal 83, and is oscillated (resonant) at a specific frequency (for example, 32 kHz). As described above, since the crystal vibrating body 5 includes the crystal vibrating piece 20 described in the above embodiment, the crystal vibrating body 5 having stable vibration characteristics and high impact resistance can be provided. Further, the crystal vibrating body 5 can obtain the same effect even if a vibrating piece of another form such as the crystal vibrating piece 70 is used instead of the crystal vibrating piece 20. Further, in the present embodiment, the configuration in which the crystal resonator element 2 is fixed to the connection pads 88 provided at two locations has been described. However, the connection pad 88 is not limited to two locations' and may be provided in a desired number. The connection to the crystal resonator piece 2 can also be performed at a desired connection portion. (Fourth Embodiment) 150337.doc -31 - 201131975 Next, as a fourth embodiment, an oscillator including a crystal resonator piece as the above-described diaphragm will be described. Fig. 7 is a schematic view showing a schematic configuration of an oscillator according to a fourth embodiment, Fig. 7(a) is a plan view, and Fig. 7(b) is a cross-sectional view taken along line G_G of Fig. 7(a). In the present embodiment, a description will be given of a configuration in which the vibrating piece "crystal vibrating piece 2" described in the above-described third embodiment is used as an example. The crystal oscillator 6 as an oscillator is configured to include a circuit element in the configuration of the crystal resonator 5 described above. The same components as those of the crystal vibrating body 5 will be denoted by the same reference numerals and will not be described in detail. As shown in Fig. 7, the crystal oscillator 6 includes a crystal resonator element 20 of the first embodiment, a 1C chip 91 having circuit elements for vibrating the crystal resonator element 2, and a crystal resonator piece 2; And 1 (: the package 80 of the wafer 91. The IC chip 91 is fixed to the bottom of the package base 81, and is connected to other wirings by a metal wire 92 such as a gold wire. In the crystal oscillator 6, by the chip from the 1C 91 The crystal oscillator 2 is excited by the drive signal of the oscillation circuit and is oscillated (resonant) at a specific frequency (for example, '32 kHz). As described above, the crystal oscillator 6 includes the crystal described in the above embodiment. The vibrating piece 20 can provide a crystal vibrator 6 having stable vibration characteristics and high impact resistance. Further, the crystal oscillator 6 can obtain the same even if the crystal vibrating piece 7 is used instead of the crystal vibrating piece 20'. Further, in the present embodiment, the configuration in which the crystal resonator element 20 is fixed to the connection pads 88 provided at two locations has been described. However, the connection pad 88 is not limited to 150337.doc •32·201131975 in two locations. ,also The desired amount is set, and the connection to the crystal resonator element 2 is also performed at a desired connection portion. [Industrial Applicability] The crystal resonator piece 20, 70 as the above-mentioned vibration piece includes a support portion, and the support When the vibrating arm is largely displaced due to the impact of the lower arm, the shock is both moderated and the displacement of the vibrating arm is restricted, so that the impact resistance and the stable vibration characteristics can be ensured. Therefore, the crystal vibrating piece is maintained. 2G, 7G packaged crystal vibrating body ^ or crystal oscillator mi|6 can be widely used as digital components, such as digital mobile devices, personal computers, electronic clocks, video recorders, televisions and other electronic devices. It can be preferably used for miniaturization of these electronic devices, etc., and is particularly suitable for use in an action machine that requires impact resistance, etc. [Simplified description of the drawing] A-type 杈-type steeply ° 明 明 observe from the main side of the side Fig. 2 is a plan view schematically showing a cross section of each portion of the crystal vibrating piece, Fig. 2U) is a cross-sectional view taken along line aa of Fig. 1, and Fig. 2 Fig. 2 b) is the line cc of Figure 1 FIG, b-b line cross-sectional view of FIG. 1 (c) of FIG. 2 lines. Fig. 3 is a partially enlarged view showing a portion of the side of the vibrating arm viewed from the direction of the arrow E of Fig. i. Fig. 4 is a plan view schematically showing a modification of the crystal resonator piece as a vibrating piece. =5 is a plan view schematically showing a crystal oscillation piece as the resonator element of the second embodiment. Fig. 6 is a schematic view showing a schematic configuration of a vibrating body according to a third embodiment, Fig. 6(a) is a plan view, and Fig. 6(b) is a cross-sectional view taken along line iF_F of Fig. 6(a). Fig. 7 is a schematic view showing a schematic configuration of an oscillator according to a fourth embodiment, Fig. 7(a) is a plan view, and Fig. 7(b) is a cross-sectional view taken along line G_G of Fig. 7(a). Fig. 8 is a plan view schematically showing a tuning fork type crystal boring piece as a prior vibrating piece. [Explanation of main components] 5 6 20, 50 21 , 77 , 121 21a , 121a 21b , 121b 21c , 121c 22 , 78 , 79 ' 122 26a, 26b, 72 ' 73, 126 27 29

30 、 30b 、 74B 、 75B 31 、 31b 32 3330, 30b, 74B, 75B 31, 31b 32 33

35、241B、242B、251B、 252B 晶體振動體 晶體振邊器 作為振動片之晶體振動片 基部 第1部分 第2部分 連接部分 振動臂 長槽 角部 重量部 支持臂 彎曲部 寬幅部 窄幅部 支承部 150337.doc -34- 201131975 35a 38 39 41A、41B、141A、141B 42A、42B、142A、142B 43 ' 44 80 81 82 83 84 85 86 87 88 91 92 10035, 241B, 242B, 251B, 252B crystal vibrating body crystal vibrator as crystal vibrating piece base part 1 part 2 connecting part vibrating arm long groove corner part weight support arm bending part wide part narrow part Supporting portion 150337.doc -34- 201131975 35a 38 39 41A, 41B, 141A, 141B 42A, 42B, 142A, 142B 43 ' 44 80 81 82 83 84 85 86 87 88 91 92 100

2411B 、 2421B 、 2511B 、 2521B SI ' S2 ' S3 tl、t2、t3 折返部 衝擊緩衝構件 固定部 切σ (切口之)前端部 激振電極 封裝體 封裝體基座 無縫環 外部連接端子 導電性接著劑 蓋體 貫通孔 密封材 連接墊 1C晶片 金屬導線 作為先前之振動片&gt; ή 型晶體振動片 支持臂74Β、75Β之部分 剖面面積 寬度 150337.doc -35-2411B, 2421B, 2511B, 2521B SI 'S2 ' S3 tl, t2, t3 Folding section Shock absorbing member fixing section σ (notched) front end excitation electrode package package base pedestal seamless ring external connection terminal conductivity Agent cover through-hole sealing material connection pad 1C wafer metal wire as the previous vibration piece> 部分 type crystal resonator piece support arm 74Β, 75Β partial cross-sectional area width 150337.doc -35-

Claims (1)

201131975 七、申請專利範圍: 種振動片,其特徵在於包括: 基部; 振動#,其係自上述基部延伸; 持’’其係自上述基部延伸’且至少一部分 振動臂平行而延伸;以及 、述 二:邛,其係使上述支持臂之一部分以與上述振動臂 日1隔變窄之方式延伸成突起狀而形成。 2‘如叫求項1之振動片’其中上述支承部係設置於藉由自 外部對上述振動臂所施加之電場而產生之上述振動臂之 振動之振幅範圍外,且在上述振動臂超過上述振幅範圍 而移位之情形時上述振動臂所接觸之位置。 3·如》月求項1或2之振動片,其中上述支承部係設 支持臂之前端側。 、边 4. 如請求項1或2之振動片’其中上述支承部於上述支持臂 設置有複數個,且構成為可藉由上述振動臂之上述彎曲 變形而與上述振動臂之長度方向之複數個位置接觸。 5. 如請求们至4中任一項之振動片’其中上述振動臂具有 兩個主面及連接上述兩個主面且在上述振動臂之長度方 向上延伸的兩個側面,且 上述振動臂沿著上述振動臂之上述長度方向更設有於 上述兩個主面令之至少一方之主面具有開口部之有底長 槽,且 上述支承部配置為當上述振動臂超過上述通常之振動 150337.doc 201131975 之上述振幅範圍而移位且上述振動臂接觸於上述支承部 時,上述支承部之與上述振動臂抵接之部分係比形成有 上述長槽之區域更靠前端側。 6. 如明求項1至5中任一項之振動片,其中於上述振動臂之 前端側設置有寬度比上述振動臂之上述基部側更寬之重 量部,且 該振動片係配置為當上述振動臂產生超過上述通常之 振動之上述振幅範圍之移位而接觸於上述支承部時,上 述支承部之與上述振動臂抵接之部分係接觸於上述重量 部。 7. 如請求項6之振動片,其中該振動片係配置為上述支承 部之上述抵接部分會與上述振動臂之上述重量部之側面 進行面接觸。 8. 如請求項1至7中任一項之振動片,其中上述支持臂具有 比上述振動臂之上述兩個側面間之寬度最細之部分之寬 度更細的部分。 9. 如請求項丨至8中任一項之振動片,其中上述支承部之寬 度形成為比上述支持臂之上述基部側之寬度更小。 10. 如請求項丨至9中任一項之振動片,其係藉由壓電體材料 所形成之壓電振動片。 11·如睛求項10之振動片,其中使用水晶作為上述壓電體材 料, 上述基部具有一對切口,該一對切口係設置為在沿著 由上述水晶之X軸、γ軸、及2軸所構成之正交座標系中 150337.doc 201131975 之X軸方向的一條直線之對 门万向上,該基部之兩個主 面呈現出内縮之形狀, 上述振動臂自上述基部之γ轴 向上延伸,且 方向之-端部起在γ軸方 於至少上述振動臂之+乂側設 述支持臂。 -置有具有上述支承部之上 12 13. 14. 15. •如請求項1至1!中任一項之振動 分設置有衝擊緩衝構件。 、中於上述抵接部 一種振動體,其特徵在於包括: 如請求項1至12中任-項之振動片;以及 封裝體,其收容上述振動片。 一種振盪器,其特徵在於包括: 如。月求項1至1 2中任一項之振動片; 電路7L件,其具備使上述振動片振盪 封裝體,其收容上述振動片及上述電路^電路;以及 -種電子機器’其特徵在於包括如請求:。一 項之振動片、如請求項13之振動體 12中任- 盪器之任—者。 乂如h求項14之振 150337.doc201131975 VII. Patent application scope: a vibrating piece, characterized in that: a base portion; a vibration #, which extends from the base portion; a ''the system extends from the base portion' and at least a part of the vibrating arms extend in parallel; and Two: 邛, which is formed by extending one of the support arms to a protrusion shape so as to become narrower than the vibration arm. 2' wherein the vibrating piece of the item 1 is disposed outside the amplitude range of the vibration of the vibrating arm generated by an electric field applied to the vibrating arm from the outside, and the vibrating arm exceeds the above The position where the above-mentioned vibrating arm contacts when the amplitude range is shifted. 3. The vibrating piece according to the item 1 or 2, wherein the support portion is provided with a front end side of the support arm. The vibrating piece according to claim 1 or 2, wherein the support portion is provided in the plurality of support arms, and is configured to be plural in a longitudinal direction of the vibrating arm by the bending deformation of the vibrating arm Location contact. 5. The vibrating piece according to any one of the preceding claims, wherein the vibrating arm has two main faces and two sides connecting the two main faces and extending in the longitudinal direction of the vibrating arm, and the vibrating arm Further, the longitudinal direction of the vibrating arm is further provided with a bottomed long groove having an opening on at least one of the two main faces, and the support portion is disposed such that the vibrating arm exceeds the normal vibration 150337 When the amplitude range of the .doc 201131975 is displaced and the vibrating arm is in contact with the support portion, the portion of the support portion that abuts against the vibrating arm is closer to the distal end than the region where the long groove is formed. 6. The vibrating piece according to any one of claims 1 to 5, wherein a weight portion wider than a width of the base portion of the vibrating arm is provided on a front end side of the vibrating arm, and the vibrating piece is configured to be When the vibrating arm is displaced beyond the amplitude range of the normal vibration and comes into contact with the support portion, a portion of the support portion that abuts against the vibrating arm comes into contact with the weight portion. 7. The vibrating piece according to claim 6, wherein the vibrating piece is disposed such that the abutting portion of the support portion is in surface contact with a side surface of the weight portion of the vibrating arm. 8. The vibrating piece according to any one of claims 1 to 7, wherein the support arm has a portion which is thinner than a portion of the thinnest portion between the two side faces of the vibrating arm. 9. The vibrating piece according to any one of the preceding claims, wherein the width of the support portion is formed to be smaller than a width of the base portion side of the support arm. 10. The vibrating piece according to any one of claims 9 to 9, which is a piezoelectric vibrating piece formed of a piezoelectric material. 11. The vibrating piece of claim 10, wherein crystal is used as the piezoelectric material, the base has a pair of slits disposed along the X-axis, the γ-axis, and the In the orthogonal coordinate system formed by the shaft 150337.doc 201131975, the straight line of the X-axis direction is upward, and the two main faces of the base exhibit a retracted shape, and the vibrating arm is from the γ-axis of the base. The upper end is extended, and the end portion of the direction is provided with a support arm on the 乂-axis side of at least the side of the vibrating arm. - provided with the above support portion 12 13. 14. 15. 15. The vibration component according to any one of claims 1 to 1! is provided with an impact buffer member. The vibrating body of the above-mentioned abutting portion, comprising: the vibrating piece according to any one of claims 1 to 12; and a package that accommodates the vibrating piece. An oscillator characterized by: The vibrating piece according to any one of items 1 to 2, wherein the circuit 7L is provided with the vibrating piece oscillating package, the vibrating piece and the circuit, and the electronic device are characterized in that As requested: A vibrating piece, such as any of the vibrating bodies 12 of claim 13. For example, h seeks the vibration of item 14 150337.doc
TW99131507A 2009-09-18 2010-09-16 Vibrating reed, vibrator, oscillator, and electronic device TW201131975A (en)

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JP2010068997A JP5703576B2 (en) 2010-03-24 2010-03-24 Vibration device
JP2010159503A JP5565158B2 (en) 2009-09-18 2010-07-14 Vibrating piece, vibrator, oscillator, and electronic device

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JP2018179575A (en) * 2017-04-05 2018-11-15 セイコーエプソン株式会社 Physical quantity sensor, electronic apparatus, and mobile entity

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JP3951058B2 (en) * 2003-08-19 2007-08-01 セイコーエプソン株式会社 Tuning fork type piezoelectric vibrating piece
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JP2008301021A (en) * 2007-05-30 2008-12-11 Epson Toyocom Corp Tuning fork type oscillating piece and tuning fork type vibrator
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