TW200927431A - A double-molded insert molding product and an electronic device using the double-molded insert molding product - Google Patents

Abstract

A double-molded insert molding product 2 wherein a first molding member 11 and a second molding member 12 are formed on both surfaces of a conductive film member 20 which has a transparent conductive film layer 15 on the surface of a support film 14. The first molding member 11 and the second molding member 12 are formed so as to cover the conductive film member 20. Either the first molding member 11 or the second molding member 12, which is in contact with the transparent conductive film layer 15, has a notched part 18a for exposing the transparent conductive film layer 15 of the conductive film member 20 to an outside.

Description

200927431 IX. Description of invention:

Field of the Invention 5 10 15 ❹ 20 The present invention relates to a double-formed insert molding mainly used for flipping a mobile phone or a personal electric appliance and forming a mesh-like conductive pattern, and an electronic machine using the molded article. [Background of the Invention] The present invention relates to a plastic sheet in which a thermoplastic resin film having a conductive layer formed thereon and a thermoplastic resin are in-line molded to have an additional function such as electromagnetic wave shielding properties, and a method for producing the same, and Patent Document 1 is known ( The person disclosed in Japanese Laid-Open Patent Publication No. 2003-298280. The plastic plate has a structure in which a thermoplastic resin film having a conductive layer on its surface is disposed at the bottom of the mold for molding, and a conductive layer is formed above, and a thermoplastic resin is introduced thereon in a molten state. After curing, the resin molded body composed of the thermoplastic resin and the thermoplastic resin film having substantially the same area as the resin molded body are integrated. C DISCLOSURE OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION However, the plastic sheet disclosed in the above-mentioned Patent Document 1 is a state in which a thermoplastic resin and a thermoplastic resin film are simply bonded, for example, by shrinkage after forming. The resin molded body composed of the thermoplastic resin and the thermoplastic film having substantially the same area as the resin molded body have a dimensional change of 5 200927431 degrees. The embedded molded article may have warpage, or the thermoplasticity may be caused by the strain. The resin molded body composed of the resin and the thermoplastic film having substantially the same area as the resin molded body or the conductive layer and the thermoplastic resin film are peeled off. Further, since the plastic sheet disclosed in the above-mentioned Patent Document 1 is in a state in which the conductive layer is coated between the thermoplastic resin and the thermoplastic resin film, the charged layer cannot be electrically discharged to the outside when used for electromagnetic wave shielding or the like. . Therefore, the object of the present invention is to provide a method for suppressing the occurrence of warpage when the conductive ten-film is double-formed by the inner forming, and simultaneously discharging the charged layer to the outside when used for electromagnetic wave shielding or the like. Forming an in-line molded article, and an electronic machine using a double-formed in-line molded article. Means for Solving the Problems In order to solve the above-mentioned technical problems, the present invention provides a double-15-shaped in-line molded article of the following construction. According to the aspect of the present invention, there is provided a double-formed inner molded article comprising: a conductive film having a bright support film and a fluoroscopic conductive neck disposed on the surface of the aforementioned surface;

The first molded body is formed on the surface of the conductive film and covers the other side; the second molded body is formed on the other surface of the conductive film, the other side; and the conductive film layer In the exposed portion, the molded body that is in contact with the conductive film from the (four) first molded body and the second molded body is exposed to the outside. In the present invention, the double molding refers to a method of manufacturing a resin molded body by using a plurality of molds different from each other in a cavity shape 6 200927431, and discharging the molten resin into a plurality of times, and The resin molded body to be produced is referred to as a first molded body and a second molded body. When the first molded body formed by the primary molding die is inserted into the secondary molding die, the secondary molding is performed, and any of the following methods is performed. In the present invention, the method includes The method of both parties. First, in the first method, in the mold for primary molding and the mold for secondary molding, the mold of either combination is made into a common mold, and the other is used as an exchange mold. In this case, the first one is formed. The form is held in the state of the common mold of the primary molding die, and the other die 10 is exchanged for the secondary molding die. In the second method, the common mold is not used in the primary molding die and the secondary molding die. In this case, the first molded body is taken out from the primary molding die, and the secondary molding is performed after the secondary molding die is inserted. . According to a second aspect of the present invention, there is provided a double-molded inner 15 Φ insert molded article according to the first aspect, wherein the exposed portion of the conductive film layer includes a notch portion formed in contact with the conductive film layer And a circuit piece, which is connected to the connection terminal by a portion of the conductive film layer exposed to the outside by the cutout portion. According to a third aspect of the present invention, there is provided a double-formed inner 20 molded article according to the first aspect, wherein the conductive film includes a body portion and a rectangular portion partially protruding from one end edge of the body portion, and the foregoing The first molded body and the second molded system are formed so as to cover the main body portion of the conductive film, and the rectangular portion that is not covered by the first molded body or the second molded body is configured such that the conductive film layer faces The first molded body or the exposed portion of the conductive film layer exposed outside the second molded body of the second 7 200927431. According to a fourth aspect of the present invention, there is provided a double-molded in-line molded article of the third aspect, wherein the exposed portion of the conductive film layer includes: the rectangular portion; and the circuit sheet is formed by the rectangular portion The connection terminal of one of the aforementioned conductive film layers is exposed outside. According to a fifth aspect of the present invention, there is provided a double-molded in-line molded article according to the first aspect, wherein the exposed portion of the conductive film layer is composed of a circuit sheet, and the circuit sheet is bonded to the conductive film of the conductive film. One of the connection terminals of the layer is connected, and the first molded body and the second molding system arrangement 10 completely cover the conductive film, and one of the circuit pieces is formed toward the first molded body and the second molded body. The outside of the body is exposed. According to a sixth aspect of the present invention, there is provided a double-molded in-line molded article according to the first aspect, wherein the support film comprises: a body portion; and a strip portion projecting from one of the end edges of the body portion, and The circuit pattern portion connected to the conductive film layer of the first fifteenth surface is provided on the surface, and the first molded body and the second molding system are formed to cover the main body portion of the support film, and at least a part of the strip portion It is exposed to the outside of the first molded body or the second molded body, and constitutes the exposed portion of the conductive film layer. According to a seventh aspect of the present invention, there is provided a double-formed in-line molded article of any of the first aspect to the sixth aspect, wherein the conductive film layer of the conductive film is a metal film layer The metal film layer has a mesh structure composed of an extremely thin strip of substantially equal width. According to an eighth aspect of the present invention, there is provided a double-molded in-line molded article according to the seventh aspect, wherein the bandwidth of the ultrafine tape is 30 μm or less. According to a ninth aspect of the present invention, there is provided a double-molded insert molding product according to any one of the first aspect to the eighth aspect, wherein the first molded body and the second molding system are formed of a transparent resin . According to a tenth aspect of the present invention, an electronic apparatus is provided which is formed by hinges formed by a double-shaped insert molding product of any one of the first aspect to the ninth aspect. The mover can be moved between a closed state that overlaps the display and an open state that is remote from the display. According to the present invention, the first molded body and the second molded system are formed so as to cover the conductive film on both surfaces of the conductive film 10, so that the resin molded body formed by injection molding can be mutually canceled. Shrinkage, as a result, prevents distortion of the double-formed in-line molded article. Further, in the present invention, the conductive film layer which is provided on the surface of the conductive film and which can be seen through the conductive film layer can be exposed to the outside by forming a notch portion or the like as an example of the exposed portion of the conductive film layer. The circuit piece or the like is connected to a portion exposed to the outside by the cutout portion or the like, and the conductive film layer of the conductive film is electrically connected to an external circuit, and is used as an antenna of an electronic device or a capacitance switch, and is used for electromagnetic wave shielding. Isochronously, the charged film layer can be electrically discharged to the outside via a circuit chip. In the fifth aspect of the present invention, the conductive film layer exposed portion is formed by the above-mentioned circuit sheet. By way of example, even when the switch of the flip cover is operated, it is possible to prevent disconnection or the like. Further, in the seventh aspect of the present invention, the transparent conductive film layer uses a metal film 9 200927431 layer having a mesh structure composed of a very thin strip of a substantially equal width, whereby, by way of example, When used in a flip cover or the like, the metal film layer is not easily identifiable, and the transparency of the micro-molded article in the double forming can be ensured as a whole. BRIEF DESCRIPTION OF THE DRAWINGS 5 The foregoing and other objects and features of the present invention can be As will be apparent from the following description in conjunction with the preferred embodiment, in the drawings, Fig. 1A shows the appearance of an electronic device for use as a flip cover for a double-integrated molded article according to an embodiment of the present invention. Structure 1; Figure 1B shows an external structural perspective view of the above-described electronic device in which the double 10-shaped insert molding product according to the above-described embodiment of the present invention is used as the flip cover; Fig. 2 shows the first FIG. FIG. 3 is a cross-sectional view of the flip cover along the line III-III of FIG. 2; FIG. 4A is shown in the aforementioned flip cover. An enlarged cross-sectional view showing an example of a structure in which one end of a conductive film is covered by a first molded body and a second molded body; and FIG. 4B is a view showing that the first molded body and the second molded body are covered with conductivity in the flip cover; An enlarged cross-sectional view of another example of the structure of one end of the film; FIG. 4C shows another example of the structure in which the first molded body and the second molded second body are covered with the end of the conductive film in the flip cover; FIG. 5A is a partially enlarged perspective view of a flip cover according to a modification of the foregoing embodiment of the present invention; FIG. 5B is a cross-sectional view taken along line VB-VB of FIG. 5A. 200927431 5 ❿ 10 15 ❿ 20 FIG. 6A is a partial perspective view showing another modification of the flip cover shown in FIG. 2; FIG. 6B is a partial perspective view showing another modification of the flip cover shown in FIG. 2; 7A is a cross-sectional view showing another modification of the flip cover shown in FIG. 2; FIG. 7B is a partial perspective view of the flip cover shown in FIG. 7A; and FIG. 8 is a view showing the aforementioned flip cover relating to the foregoing embodiment. A structural plan view of a conductive film used in the present invention; 9A is an enlarged view showing a part of a metal film layer mesh pattern of the conductive film used in the flip cover of the embodiment, and FIG. 9B is a view showing the aforementioned use in the flip cover of the above embodiment. An enlarged view of a part of another example of the mesh pattern of the metal film layer of the conductive film; FIG. 9C is a view showing another mesh pattern of the metal film layer of the conductive film used in the flip cover of the embodiment. FIG. 9D is an enlarged view showing a part of another example of the metal film layer mesh pattern of the conductive film used in the flip cover of the embodiment; 10A is a program diagram showing the manufacture of the flip cover shown in FIG. 7A; FIG. 10B is a program diagram showing a procedure following the 10A diagram; 11 200927431 10C is a program diagram showing the procedure following the 10B diagram; The 10D drawing shows the program diagram of the program following the 10Cth chart; the 10E drawing shows the program diagram of the program following the 10th figure; the 10F figure shows the following 10E Program diagram of the program; 5 FIG. 11A is a program diagram showing a method for manufacturing a flip cover according to a modification of the above-described flip cover manufacturing method of FIGS. 10A to 10F; FIG. 11B is a program diagram showing a procedure subsequent to FIG. 11A; The 11C chart shows the program diagram of the program following the 11B chart;

11D is a program diagram showing a program following the 11Cth chart; Q 10 11E is a program diagram showing a program following the 11th figure; 11F is a program diagram showing a program following the 11E chart; The program diagram showing the program following the 11th F1; - the 12A diagram showing the procedure for manufacturing the flip cover shown in Figs. 5A, 6A, and 6B, and the 15B diagram showing the procedure for continuing the program of Fig. 12A. Figure 12C is a program diagram showing the program following Fig. 12B; Fig. 12D is a program diagram showing the program following Fig. 12C; Ο Fig. 12E is a program diagram showing the procedure following Fig. 12D; The figure shows a program diagram of the program following FIG. 12E; - 20th Fig. 12G shows a program diagram of the program following Fig. 12F; - Fig. 13A shows the conductive film used in the above flip cover of the above embodiment. Figure 13B is a cross-sectional view of the flip cover having the above-described modification of Fig. 13A; 12 200927431 5 Figure 14 shows a program diagram for manufacturing the above-mentioned flip cover shown in Fig. 3; The process of displaying the program following the 14th chart Sequence diagram; Figure 14C shows the program diagram of the program following the 14th diagram; Figure 14D shows the program diagram of the program following the 14C diagram; Figure 14 shows the program diagram of the program following the 14D diagram; The figure shows a program diagram of the procedure following the 14th drawing; the 15th drawing shows the program diagram of the method of manufacturing the flip cover of the modification of the above-described flip manufacturing method of the 14th to 14th drawings; ❹ the 15th drawing shows the continuation of the 15th drawing Program diagram of the program; 10 Figure 15C shows the program diagram of the program following the 15th diagram; Figure 15D shows the program diagram of the program following the 15C diagram; Figure 15 shows the program diagram of the program following the 15D diagram 15F is a program diagram showing the procedure of the 15th diagram; 15G is a program diagram showing the procedure of the 15Fth diagram; 15Fig. 16 is a modification showing the method of manufacturing the flip cover of the 14th to 14th diagrams; The program diagram of the clamshell manufacturing method; Φ the 16th drawing shows the program diagram of the program following the 16th drawing; the 16C figure shows the program diagram of the program following the 16th drawing; the 16D figure shows the program following the 16Cth drawing Program diagram; . 20 Figure 16 shows the program diagram of the program following the 16D diagram; Figure 16F shows the program diagram of the program following the 16th diagram; Figure 16G shows the program diagram of the program following the 16F diagram . [Embodiment 3] Best Mode for Carrying Out the Invention 13 200927431 Before the description of the present invention is continued, the same reference numerals are attached to the same parts in the drawings. Hereinafter, an electronic device in which a double-formed insert molding product according to an embodiment of the present invention is used as a flip cover will be described with reference to the drawings. 5A1 and 1B are perspective views showing an external structure of an electronic device in which a double-molded in-line molded article according to an embodiment of the present invention is used as a flip cover, and FIG. 1A shows a state in which the flip is opened, and FIG. The status of the flip closed is displayed. For example, the electronic device of the present embodiment can be used as a pDA (Personal Digital Assistant), and the electronic device i is configured as a roughly rectangular flip-shaped cover 2 of a double-formed in-line molded article by a hinge key. The portion 4 is hingedly coupled to the upper end of the substantially rectangular parallelepiped electronic machine body 3, and by using the hinge portion 4, the flip cover 2 can be opened relative to the electronic machine body 3 as shown in FIG. As shown in the figure, the switch is switched between the closed state of the electric 15 submachine body 3 laminated. The display 5 of the liquid crystal or the like and the operation button 6 are disposed on the surface 3a of the electronic machine body 3. When the flip cover 2 is opened, the display 5 and the operation slave 6 are exposed to the outside, so that the flip cover 2 can be opened. In the state, the operation button 6 and the like are directly pressed to operate. 2 〇 And as will be described later, since the flip cover 2 is itself fluoroscopic, the liquid crystal display 5 and the operation button 6 can be recognized from the flip cover 2 as shown in Fig. 1B. Further, as will be described later, in the flip cover 2, the fine mesh-like metal film layer 15 (see FIG. 3) is provided to be covered with a transparent synthetic resin, and the flip cover 2 can be made into a capacitance switch or The communication antenna or the like is used for 14 200927431, and the structure for this purpose will be described later. 5 10 15 鬌 20 Fig. 2 is a perspective view showing the appearance of the flip cover 2 used in the electronic machine of Fig. The flip cover 2 includes a see-through plate portion 1A and a circuit piece 16 connected to the plate portion 1B, and the circuit board 16 has a structure in which the flip cover 2 described later is electrostatically formed by printing or the like. When the capacitor switch is used, a circuit pattern is arranged on the flexible or rigid substrate for guiding the electrode of the switch to the outside of the flip cover 2. 3. The 1C wafer 21 for performing information calculation, such as when the flip cover 2 of the present embodiment is used as a capacitance switch, may be mounted on the circuit board 16, and the 1C chip for the electrostatic capacitance switch may be provided by the circuit board 16. 21, the distance between the metal film layer 15 of the information input portion and the "wafer 21 can be shortened, and the noise is not easily obtained, and the space of the electronic device body 3 can be eliminated by setting the installation space of the ic wafer 21 on the flip side" The setting space. Fig. 3 is a cross-sectional view of the flip cover 2 along the line in Fig. 2. In Fig. 3, in order to easily understand the cross-sectional structure of the flip cover 2, the thickness dimension of the flip cover 2 is enlarged with respect to Fig. 2. The flip cover 2 is a molded article produced by double insert molding as will be described later, and the first molded body u and the second molded body 12 are provided on both surfaces of the conductive film 13 of the conductive (IV) film structure. The conductive film member 20 is formed of conductive material _13 and the circuit board 16 and the conductive film η includes a main body portion 13a, which is formed into a substantially rectangular shape, and a small piece portion ι3ρ from the main body portion 13a. Further, the circuit board 16 is connected to the small portion of the conductive film 13, that is, the small portion uP and the circuit board 16 have a rectangular conductive film protruding from the rectangular body portion na. Construction. Here, an example of the exposed portion of the conductive film layer may be formed by the small portion i3p itself 15 200927431 or the small portion 13P and the circuit sheet I6. The adhesion between the small portion 13P of the conductive film 13 and the circuit M6 is performed using the conductive adhesive 17'. However, other subsequent methods may be used. 5 The electroconductive film 13 is a laminated structure of the transparent support film 14 and the metal film layer 15 provided on the surface of the support film 14 as a conductive layer. Specifically, the conductive film 13 has a substantially rectangular body portion 13 & Each of the small portions 13p is provided with a transparent support crucible 14 having the same shape and a metal film layer 15 having the same shape as the conductive layer on the surface of the support film 14. In the small portion I3p of the metal film layer 15 integrally formed from the body 10 portion 13 & to the small portion 13P, the metal film layer 15 of the circuit piece 16 and the small portion 13p is transmitted through the conductive adhesive 17 as described above. Electrically connected and then. The detailed conductive film 13 will be described later. The flip cover 2 of the above configuration is provided with a conductive layer formed by the metal film layer 15 inside. Further, since the metal film layer 15 is electrically connected to the circuit piece 16 outside the flip cover 2, the metal film layer 15 has As the function of the antenna and the electrostatic switch, the electrified layer can be electrically discharged to the outside. Further, since the first molded body u and the second molded body 12 which are formed integrally with the conductive film member 20 are provided on both surfaces of the conductive film 13, they can be mutually canceled and formed by injection molding. The resin molded body is contracted specifically, and as a result, deformation of the flip cover 2 due to shrinkage after forming can be prevented. It is preferable that the first molded body 11 and the second molded body 12 have substantially the same shrinkage ratio in the surrounding environment such as high temperature and high humidity, and it is preferable that the first molded body 11 and the second molded body 12 are made of the same synthetic resin. High temperature and high humidity, etc. 200927431 The shrinkage rate of the surrounding environment is the same. When the difference in the amount of shrinkage between the first molded body 11 and the second molded article 12 is too large, the flap 2 is warped or the like. Therefore, the first molded body 11 and the second molded body 12 are preferably selected or thicknessed. The design of 'etc.' makes the shrinkage ratio roughly the same. 5 ❹ 10 15 φ 20 The first molded body 11 and the second molded body 12 are disposed so as to cover the conductive film 13 of the conductive film member 20 over substantially all areas, and completely cover the body portion of the conductive film 13 The end portion of the 13a is formed in a state in which only the small portion 13p protruding from the main body portion 13a of the conductive film 13 is protruded toward the outside of the flip cover 2. In addition, in the third figure, the first molded body η and the second molded body 12 have substantially the same thickness dimension, and the conductive film 13 is disposed at the intermediate position between the two. However, the first molded body u and the second molded body The positional relationship between the molded body 12 and the conductive film 13 is not limited to the above configuration. 4th to 4th (the figure shows a partially enlarged cross-sectional view showing the state in which the end of the conductive film 13 is covered by the first molded body 11 and the second molded body 12, and FIG. 4A is a partial view of FIG. In the enlarged view, the conductive film 13 is placed in a state in which the boundary between the second molded body u and the second molded body 12 is divided, and the conductive film 13 is buried in the second molded body 12 in the fourth embodiment. The structure of the first molded body 11 and the second molded body 12 and the surface of the conductive film 13 are formed at substantially the same level, and the end portion 11 & The conductive film 13 has a structure in which the coating structure of the conductive film 13 is different from that of the molded body u and the second molded body 12, which are described later. Fig. 5A is a view showing a flip cover 17 200927431 2a of a modification of the flip cover 2 shown in Fig. 2. The conductive film member 2 used in the modification is made of a rectangular conductive The film 13 and the circuit board 16 which is connected to the conductive film 13 and protrude from one side of the conductive film π, and can be formed on the conductive film member The protruding portion of the conductive crucible 13 is connected to the external terminal of the flip cover 2a. 5 The flip cover 2a shown in Fig. 5A is notched throughout the entire resin molded body, and the slit 18a is formed and formed into a drop i8d. In the present specification, the term "cut" means that the area of any one of the j-shaped molded body 11 and the second molded body 12 provided on both surfaces of the conductive film member 2 is smaller than the other, and the two are not As shown in Fig. 5B, the slit 18a as an example of the exposed portion or the slit portion of the conductive film layer of the present invention is formed by molding the first molded body 11 into the second molded body 12 and the conductive film 13 As a result of the small formation, the resulting gap 18d constitutes a state in which the metal film layer 15 of the conductive film 13 is exposed to the outer surface side of the flip cover 2 & 15. The metal film layer of the conductive film 13 exposed to the outer surface side by the slit 18a The circuit board 16 is connected through the conductive adhesive 17, and the conductive film layer can be formed by the slit 18a - the circuit board 16 or the like. The metal film layer 15 can be electrically connected to an external circuit, and can be used as an antenna. Two 1 electric capacitor switch is used. The metal film layer 15 of the slit 18a and the like and the connecting portion of the circuit 2 are preferably shielded from the outside by other structures such as the chain portion 4 when the flip cover 2a is incorporated in the electronic device. Fig. 6A shows the second figure Another modified example of the flip cover 2 shown is a rotten cover 2b. #件2〇 "In the flip cover of the modification, the conductive film structure used is the same as the modification shown in Fig. 5A. The rectangular conductive film 13 and the conductive crucible 13 are connected to form a circuit 200927431 which protrudes from one side of the conductive film 13, and the external terminal of the flip cover can be connected to the protruding portion. 5 10 15 ❹ 20 The flip cover 2b shown in Figure 6A will be the first! A portion of one end of the formed body u is slit and formed into a slit 18b, and a drop I8e is formed at the slit i8b. An example of the slit 18b as another example of the exposed portion or the slit portion of the conductive film layer of the present invention is the same as the above-described modification, and the second molded body u is formed to be smaller than the second molded body 12 and the conductive film 13. As a result, the slit 18b constitutes a state in which the metal film layer 15 of the conductive film 13 is exposed to the outer surface side of the flip cover. The metal film layer 15 of the conductive film 13 exposed to the outside by the slit 18b is connected to the circuit, and the second electrode (10) and the circuit sheet _ can be formed as an example of the exposed portion of the conductive film layer. Fig. 6B is a view showing a flip cover 2c of another modification of the flip cover 2 shown in Fig. 2. In the flip cover 2 of the modification, the conductive film member 20 used is the same as the modification shown in FIG. 5A, and the rectangular conductive film 13 is connected to the conductive film 13 to be self-conducting. A circuit board 16 projecting from one side of the film 13 is formed, and the external terminal of the flip cover can be connected to the protruding portion. The flip cover 2C shown in FIG. 6B is formed on one side surface as a conductive film layer exposed portion of the present invention or Another blind hole (blind hole) 18c of another example of the notch portion, and the blind hole 8c is a slit of another example of the exposed portion or the notched portion of the conductive film layer of the present invention. The metal film layer 15 of the conductive film member is exposed on the bottom surface of the hole 18c, and the blind hole is formed in the same manner as the above-described modification, and the shape of the cavity when the first molded body 11 is formed can be set as "f" The hole 18 is formed by connecting the metal film layer 15 of the conductive film 13 to the circuit board 16' and constituting the exposed portion of the conductive film layer by the blind hole 18e and the circuit chip. 19 200927431 Fig. 7A shows the relevant Fig. 2 is a view showing a flip cover 2d of another modification of the flip cover 2. In the flip cover 2d of the modification, the conductive film member 2 is used in the same manner as the above-described modification, and the rectangular conductive film 13 and the circuit which is connected to the conductive crucible 13 to protrude from one side of the conductive film 13 are provided. As shown in Fig. 7B, the flip cover 2d shown in Fig. 7A is configured such that the circuit sheet 16 constituting the conductive film member 20 is embedded in the first molded body 11, and the circuit One of the sheets 16 is surrounded by the outside of the flip cover 2d. The flip cover 2d of this configuration can be preliminarily mounted on the conductive film 13 by the formation of the first molded body 11 and/or the second molded body 1210. The conductive film member 20 in a state is inserted into a molding die and is manufactured by insert molding. In this case, since the conductive film 13 and the subsequent portion of the circuit board 16 are present inside the inner molded article, protection is possible, and The reliability of the conductive film member 20 can be improved by the use of the circuit board 16 to form the exposed portion of the conductive film layer. For example, even when the flipping operation of the flip cover is performed, it is possible to prevent disconnection or the like. Another 'in Figure 7A' However, it is revealed that the first molded body 11 enters the portion of the circuit piece 16 protruding from the conductive film 13 at the time of injection molding (symbol 11c in the drawing). However, the circuit sheet 16 is actually caused by the injection pressure at the time of injection molding. The circuit board 16 may be in a flexed state (see FIG. 11F). The flip cover 2d of this structure is formed by the peripheral edge portion Ub and the periphery of the first molded body 11 and the second molded body 12. The portion 12b, the peripheral portion He, and the peripheral portion 12c cover the conductive film 13 constituting the conductive film member 20 over the entire circumference, so that the conductive material 200927431 5 e 10 15 Lu 20 I·film 13το王不向, Bu Zou exposed Therefore, since the metal film layer 置于 placed on the surface of the conductive film is not directly touched by the cover 4, the metal film layer 15 is not damaged, and even if it has a very thin band as described later, The fly-like metal material 丨5, also * will damage the antenna or electrostatic capacitance switch: the electrode, and will not cause deterioration of these functions. Next, the conductive film 13 constituting the conductive film member 20 will be described with reference to Fig. 8. Alternatively, the cross-sectional shape of the flip cover formed by using the material-electric ribs can be made into 3' 5B, 7AS| or the like. As described above, the conductive film (10) has a transparent film of the structure of the metal film layer μ which is transparent to the surface layer of the surface layer of _(four)_$14, and the conductive film 13 is compliant with the support film 14 and The metal film layer 15 is formed in a rectangular shape. However, a small portion 13p (see FIG. 2) for connecting the circuit board 16 may be formed so as to protrude from one of the rectangular end edges of the conductive film ο. Further, in Fig. 8, the metal film layer 15 is provided in a state in which the circuit pattern portion (connection terminal) 15a for connecting the circuit board 16 protrudes from one side of the rectangular body portion 15d, and the circuit pattern portion can be provided by the circuit pattern portion. The (connection terminal) 15a is connected to the circuit board 16 and constitutes an example of the exposed portion of the conductive film layer. However, other shapes may be employed. Further, the mesh line of the metal film layer 15 in Fig. 8 is only added to clearly indicate the field of the metal film layer 15, and does not refer to the mesh described later. As the support film 14, a resin sheet such as a polypropylene resin, a polyethylene resin, a polyacryl resin, a polyester resin, a polyacryl resin, or a polyvinyl chloride resin can be used. Further, for example, a support film The specific thickness dimension of 14 can be made 120 μm. In the present embodiment, the metal dielectric layer 15 having a function as a conductive layer is formed on the surface of the support film 14 and is fluoroscopically 21 200927431. The metal is formed into various metals such as ingot, complex, gold, silver, copper or zinc. a mesh-shaped metal thin film layer ' Alternatively, a transparent conductive film may be provided on the surface of the support film 14 to replace the metal film layer 15 of the mesh structure. In this case, for example, an indium oxide is formed on substantially the entire surface 5. Or a transparent metal oxide such as tin oxide, indium tin oxide or zinc oxide; or a conductive polymer such as polyaniline, polypyrrole or polyacetylene formed substantially uniformly. The metal film layer 15 is a mesh-shaped (mesh structure) metal 10 film made of an opaque metal having a surface resistance value of 1 Ω/cm 2 or less according to the four-terminal method, and may be appropriately formed in order to set the surface resistance value to the above numerical range. The material or thickness to be used is selected, for example, the thickness of the metal film layer 15 can be made 12 μm, and if the surface resistance value is in the above numerical range, even if a resin composition having a large thickness exists on the surface of the metal film layer 15 The sensitivity of the electrostatic capacitance switch or the communication antenna can be improved, and the input mechanism can be prevented from being mistaken for 15 movements. Further, the metal film layer 15 can be formed by a single metal film, or by It consists of a plurality of metal films. The mesh shape of the metal film layer 15 is formed by the extremely thin strip 15j of a substantially equal width, and the light is transmitted through the opening portion of the mesh 15i, and the light in the mesh 15i By transmission, even if the conductive layer 20 of the conductive film 13 does not use a conductive conductive layer made of a transparent material such as IT0, the light transmittance of the electrode can be ensured by the metal film layer 15. If the display 5 or the operation button 6 is in the state in which the flip cover 2 is closed, the ultrafine strip 15j constituting the mesh 15i of the metal ruthenium layer 15 should preferably have a bandwidth of 5 〇μπι or less, and is preferably a teacher. The above-mentioned ultrafine ribbon is formed to have a transmittance of 5〇% or more, and more preferably 22 200927431, the bandwidth of the ultrafine strip 15j is 30 μm or less, and the transmittance is 70% or more, because the bandwidth is thicker than 3〇μτη. The display itself can recognize the bandwidth itself and may hinder the recognition of the display 5, and the 'right transmittance is less than 70%, then the display 5 will appear darker and lower the visibility when viewing the display 5 while the flip 2 is closed. . Here, the term "transmission rate refers to the total light transmittance" of all the wavelengths of light from a light source having a specific color temperature passing through the sample surface, and the transmittance of the aforementioned mesh is made using Nippon Electric Co., Ltd. The spectrophotometer (Model NDH2000) manufactured by Industrial Co., Ltd. was measured, but the transmittance in the air layer was 100%. 10 The shape of the mesh 15i is preferably formed by a polygonal shape, and a non-polygonal shape is provided. For example, the opening of the circular or elliptical mesh 15i is evenly arranged and arranged in a dense manner. The thick band part also forms part of the thick band. Therefore, the thick band is conspicuous and is the main reason for reducing the light transmittance. Further, in the triangular, quadrangular, and hexagonal patterns, 15 may be formed by a plurality of combinations of one or more of the patterns, however, the rule is to standardize the comparison of the metal film layers of the mesh formed by one pattern. Not easy to become conspicuous. 9A, 9B, and 9C are enlarged views showing a portion of the mesh 15i impurity tape 15j constituting the metal film layer 15, and the 9A, 9B, and 9C drawings are respectively enlarged. FIG. 2 shows the mesh 15i and the mesh 151. The extremely thin band 15′′, and the w system represents the bandwidth of the extremely thin band I5j. The mesh pattern shown in Fig. 9A is such that the rectangular mesh 丨 5 丨 constitutes a core and is arranged in succession in the direction of the right parent. The mesh pattern shown in Fig. 9B is a hexagonal mesh 15i as a core and 6 朝 towards each other. In the case of the next arrangement, the mesh pattern shown in Fig. 9C is formed by arranging the ladder-shaped mesh 15i as a core and two-way orthogonally.

According to the mesh pattern, for example, a rectangular mesh (5) constitutes a core and a contiguous person has a square shape, a full eye 151 constitutes a core and a successor; a ladder-shaped mesh (5) constitutes a h ^ and a successor, wherein, in particular, a square mesh (5) It is preferable that the mesh pattern constituting the core and the connector is less likely to be recognized as a stripe shape than the mesh (5) of other polygonal shapes (refer to the second paste). That is, when the mesh of the mesh is formed in a pattern of cores and regularly connected, the connecting direction along the core (the opening of the mesh (5)) may have a thin strip 15j looking at 10 to form successive stripes. The tendency of the shape, for example, when the hexagonal mesh (5) constitutes the core ~, because the line of the extremely thin strip (5) along its connecting direction constitutes a mineral tooth shape, only the amplitude portion of the coarse tooth profile is seen, As a result, the ultra-fine tapes will appear to be in an expanded state, and in this respect, when the square mesh 1 constitutes a core and a successor, since the extremely fine (four) 'straight along the connecting direction does not appear to be thicker than the original bandwidth, It is not easy to recognize its existence, and the mesh pattern is not easy to become conspicuous.

Further, when the rectangular mesh 15i constitutes a core and is connected (see FIG. 9A), since the distance between the longitudinal direction and the short-side direction of the rectangle is different, the pitch is compared with the longitudinal direction when viewing the whole. The short short side direction will appear deeper, which will form a stripe shape and appear looming. However, when the square mesh 15i constitutes a core and the follower is not, such a stripe does not appear and is not easily conspicuous. In addition, the square of the mesh l5i is not limited to a square with a full angular shape, and includes a bevel that cuts each corner. Further, if the film thickness of the metal film layer 15 is set to be wider than the film thickness of the W// film thickness, the mesh pattern can be easily formed with a high precision. Further, as the metal material constituting the metal film layer 15, a conductive metal material such as silver, _, aluminum, gold, nickel, stainless steel or brass can be widely used. The metal film layer 15 can be formed by patterning a metal film formed into a comprehensive shape on the surface of the support film 14 by using a vacuum evaporation method, a money-saving method, a 5-ion ion method, or an electric ore method. Gold having a mesh pattern = film layer 15' By way of example, a photoresist film is formed on the metal film, and the photomask is used to carry in (four) light, and developed with a developing solution, whereby an anti-surname film having a predetermined pattern is formed. Or, by means of screen printing, gravure printing or inkjet, etc., H) printing a predetermined mesh pattern on the metal medium, and then removing the overall shape of the metal film by the surname liquid is not resisted by (4) The 7-knife of the covered part, and then 'by removing the anti-pure' can obtain the metal film layer 15 with the predetermined mesh pattern. In addition, the conductive film member 2 described so far will be different The conductive film 13 and the circuit board 16 which are prepared are electrically connected, and then 17 is added. However, as shown in FIGS. 13A and 13B, the conductive film can also be formed by the support film Μ and the metal film layer 丨5. a member 鸠, and the support film Μ includes a body portion 14a configured to The rectangular portion; and the strip portion 14b protrude from one of the sides of the main body portion 14a and has a rectangular shape, and the metal film layer 2〇15 includes a metal film layer main portion and is provided on the support film 14 The surface of the main body portion 14a and the circuit pattern portion 15b are provided on the surface of the strip portion, and are connected to the metal film layer main portion 15c, and have functions as the circuit board 16. The circuit pattern portion 15b and the strip portion 4b constitute an example of the exposed portion of the conductive film layer of the present invention. According to this configuration, the circuit portion 25b of the circuit diagram 25 200927431 and the external circuit of the flip cover 2 can be connected. The circuit board i6 is not required, and as a result, the reliability of the wire breakage of the conductive film member 20b can be improved by not following the conductive film I3 and the circuit board I6. Next, a description will be given of a method of manufacturing the flip cover 25 of the present embodiment by in-line molding. Figs. 10A to 10F show a flip-flop (four) program diagram shown in the drawing f7B. In the manufacturing method shown in FIGS. 1A to 10F, the first mold 100 and the first mold 100 are used, and the first mold 1 is formed by the fixed mold 11 and the movable mold (3). The fixed mold 11〇 and the movable mold 22〇 are configured, and the ❹ 1〇 structure can be commonly switched. The fixed mold 11G used in the i-th mold 1 and the second mold 2 is a total of four, and each of the secret 12G and the secret lake 2 is combined with the common fixed mold 110, thereby constituting the first mold 100. The conductive film member 2 of the second mold '200 〇 10A to 10F is used by connecting the circuit board 16 to the metal film layer 15 of the conductive 15眭骐13, and the conductive 眭骐 member 20 is further provided. It is disposed in the cavity U1 of the fixed die 11A of the first die 1 (refer to FIG. 10A). At this time, the conductive film member 2 is preferably formed as the metal film layer 15 toward the fixed die 11 of the first die 100. The direction of the cavity ln side of the crucible is exposed, and the cavity is used to form the first formed body U. With this arrangement, the metal film layer 20 15 does not come into contact with the mold surface of the movable mold 12, and does not damage the metal film layer - 15, and a circuit is provided at a position where the fixed mold 110 is provided with the circuit film 16. The recessed portion 111b is accommodated so that a strong clamping force is not applied to the circuit film 16. When the conductive film member 20 is placed in the cavity ill of the fixed mold 11 ,, the circuit board 16 is placed in a state outside the cavity Hi, and at this time, in order to prevent the displacement of the conductive film member 20 for 26 200927431, The movable mold 12 is provided with a conductive recessed inner recess #12, and the conductive film member 吸引 is sucked from the outside of the movable mold 12G by the suction hole 123, and is fixed to the movable mold (10). 5 Ο 10 15 10 20 ... If the positioning of the conductive film member 2 固定 toward the fixed mold 11 〇 and the movable mold 12 结束 is completed, the fixed mold 11G and the movable mold 12 () are clamped and used to open The first molten material is melted from the fixed mold 11 and the molten resin is injected into the cavity 111 of the solid mold 110 (see FIG. 10B), and the molten resin is applied to the mold of the solid mold 110. The inside of the groove 111 is solidified to form a __-formed body 5〇, and the primary molded body 50 and the conductive film member 20 are integrated. Then, the suction from the suction hole 123 in the movable mold 120 is stopped, and the movable mold 12 is moved relative to the fixed mold 11 toward the direction away from the fixed mold 11 and the mold is opened. At this time, it is disposed on the fixed mold 11 The primary molded body 5〇 of the resin connection in the injection gate 112 is left on the side of the fixed mold 11, and the conductive film member 20 is formed by stopping the suction while the primary molded body 5 is integrally formed with the conductive film member 20. The movable mold 120 is detached from the movable mold 120 and moved to the side of the primary molded body 50 (see Fig. 10C). Next, with respect to the fixed mold 110, the movable mold 220 of the second mold 200 is placed at the opposite position, and the movable mold 220 of the second mold 2 is provided with a mold groove 221 for molding the second molded body 12, and The conductive film member 2 is disposed such that the support film 14 of the conductive film member 20 is exposed toward the cavity 221 side of the movable mold 220 of the second mold 200 of the secondary molding die, and one portion of the circuit board 16 is disposed. In the outside of the cavity 221 (see the i-th diagram), in this state, the movable mold 220 is moved in the direction of contact with the fixed mold 11 , and the second mold 2 is clamped, and then the movable mold is movable. The injection gate 222 of the mold 220 ejects the molten resin for molding the second 27 200927431 formed body 12 into the cavity 221 of the movable mold 22 (refer to FIG. 10E), and the molten resin is attached to the cavity 221 of the movable mold 22〇. The secondary molded body 60 is formed by internal solidification, and the secondary molded body 6〇 is integrated with the primary molded body 5〇 and the conductive film member 20. 5, the second mold 200 is opened, and the movable mold 220 is moved away from the fixed mold 110, and the flip cover 2d which is an in-line molded product is taken out from the second mold 200, thereby being manufactured as an insert molding. The flip cover 2d of the product constitutes a state in which the conductive film 13 is covered by the primary molded body 5〇 and the secondary molded body 6〇, and on the other hand, the circuit sheet 16 is partially extended to the primary molded body 5〇. 0 10 is external to the secondary formed body 60. Further, the primary molded body 50 is the first molded body 11 and the primary molded body 60 is the second molded body 12. Further, in the drawings 10A to 10F, when the conductive film member 2 is placed in the cavity 111 of the fixed mold 110 of the first mold 100, the metal film layer 15 is formed as a fixed mold 110 toward the first mold 100. In the direction in which the side of the cavity 111 is exposed, the 15 may be disposed in the opposite direction. In this case, the recess for the circuit piece is provided on the side of the movable mold 120. Next, the 11A to 11G drawings are diagrams relating to the modifications of the i 〇A to l〇F diagrams, and are other program diagrams showing the manufacture of the flip cover 2d shown in Fig. 7B. In the manufacturing method shown in Figs. 11A to 11G, the first mold 1 and the second mold - 20 200 are used, and the first mold 1 is composed of a fixed mold 11 and a movable mold 12, and the second mold is used. 200 is formed by the fixed mold 210 and the movable mold 220, and is configured to be switchable in common. In the 11A to 11C and 11E to 11F drawings, the member-based conductive film 13 in the first mold 1 is inserted, and the circuit sheet 28 200927431 π is not mounted on the conductive film 13 by using the same. The conductive film 13 of the structure does not need to be finely positioned for the circuit board 16 with respect to the mold 100 and the second mold 200. First, the conductive film 13 is placed in the fixed mold cavity m of the first mold (10) (see FIG. 11A). At this time, the support film 5 of the conductive film u is formed as the fixed mold 11 of the first mold 100. In the direction in which the cavity iu side of the crucible is exposed, by the arrangement, the conductive film I3 which is formed by the primary molded body 5 obtained by the first mold 1 can be used to move the metal film layer ls toward the movable mold (four) side. Out. In addition, at this time, in order to prevent the displacement of the conductive film 13, the conductive film housing recessed portion (2) is provided in the movable mold 120, and the conductive film 13 is attracted from the outside of the movable mold 120 by the suction hole 123. And fixing the position on the movable mold 120. When the conductive film 13 is finished, the mold is fixed. And positioning in the movable mold 12〇, the fixed mold 110 and the movable mold 2〇 are clamped, and the molten resin for forming the first molded body 11 is fixed from the fixed gate 11丨 of the fixed mold 11〇. The mold 111 of the mold 15 is ejected (see FIG. 11B), and the molten resin is solidified in the cavity 111 of the fixed mold 110 to form the primary molded body 50, and the primary molded body 50 and the conductive film 13 are integrated. Then, the suction from the suction hole 123 in the movable mold 120 is stopped, and the movable mold 120 is moved in a direction away from the fixed mold 11 相对 relative to the fixed mold 110 to perform mold opening 'this time' and the fixed mold 110 The primary molded body 50 to which the resin is connected in the injection gate 112 is left on the side of the fixed mold 110, and since the primary molded body 50 and the conductive film 13 are integrally formed by stopping the suction, the conductive crucible 13 is separated from the movable mold 120 and Move to the side of the primary molded body 5 (see Figure UC). 29 200927431 Next, the self-fixed mold takes the electrical film 13 and the secondary molded body 5〇, and the circuit sheet 16 is attached to the conductive film 13, and the conductive film 13 is formed to expose the metal film layer 15. Further, the prepreg portion of the metal film layer 15 is bonded to the circuit board 16 by using the conductive adhesive 17 or the like (see FIG. 11). 5 λ times 'the conductive film 13 and the primary molded body 50 with the circuit board 16 are positioned in the fixed mold 210 of the second mold 200. At this time, the primary molded body 5 is inserted into the cavity 211 of the fixed mold 210. Then, the second mold 2 is fixed. The mold 210 and the movable mold 220 are positioned at opposite positions. The movable mold 220 of the second mold 2 is provided with a cavity 221 for molding the second molded body 12, and the conductive film 13 and the primary molded body 50 of the circuit piece 16 are embedded in the second mold. In the case of the solid mold 210 of 200, the metal film layer 15 of the conductive film 13 is exposed toward the cavity 221 side of the movable mold 220 of the secondary molding die, and constitutes one of the circuit pieces 丨 6. The portion is disposed in the cavity 221 The state outside (see Figure 11). Further, the circuit board housing recess 15 221b' is provided at a position where the movable mold 220 is disposed with the circuit board 16 so that a strong clamping force is not applied to the circuit board 16, and then the movable mold 220 is brought into contact with the fixed mold 210. Moving in the direction, the second mold 2 is clamped, and then the molten resin for molding the second tantalum molded body 12 is ejected from the mold opening 221 of the movable mold 220 from the injection gate 222 of the movable mold 220 ( Referring to FIG. 11F, at this time, the circuit board 16 is pressed against the surface of the fixed mold 210 by the injection pressure of the molten resin for molding the second molded body 12 to constitute a flexed state. The molten resin is solidified in the cavity 221 of the movable mold 220 to form the secondary molded body 60, and the secondary molded body 60 is integrated with the primary molded body 50 and the conductive film member 20. Then, the second mold 200 is opened, and the movable mold 220 is moved away from the fixed mold 210 in the direction of 30 200927431, and the flip cover 2d which is taken out as the insert molded product from the second mold 200 is manufactured as an inlay. The flip cover 2d of the molded article is configured to cover the conductive film 13 by the primary molded body 50 and the secondary molded body 60, and on the other hand, the circuit sheet 16 is partially extended to the primary molded body 5〇5 and The exterior of the secondary formed body 60. Further, the primary molded body 50 is the first molded body 11 and the secondary molded body 60 is the second molded body 12. Further, in the method of FIGS. 11A to 11G, the conductive film 13 and the primary molded body 50 are taken out from the fixed mold 110, and after the circuit board 16 is attached to the conductive film 13 Φ, it is fitted into the fixed mold 21 of the second mold 200 ( Referring to Figures 11D and 11E), 10 is not limited to this embodiment. In other words, the first mold 100 and the fixed mold 110 used in the second mold 200 may be formed into a common mold, and the second mold 1 and the movable mold 120 and the movable mold 220 of the second mold 200 may be fixed together. The mold 11 is combined to form the first mold 100 and the second mold 200, respectively, and the conductive film 13 and the first molded body u are not taken out from the fixed mold 110, and the body 50 is fitted and fixed in the primary molding 15 The circuit board 16 is followed by the conductive film 13 in a state where the cavity of the mold 110 is 1 。. ® Next, the 12A to UG diagram is a modification of the 10A to 10F drawings, and is a program diagram showing the manufacture of the flip cover 2a shown in Fig. 5A. In addition, when the flip cover 2b and the flip cover 2c shown in FIGS. 6A and 6B are manufactured, they can be manufactured by the same procedure as those of the 12A to 12 (}-20, but at this time, the cavity is provided in the fixed mold 110. The 111 system is configured to form the shape of the slit 18b and the blind hole 18. The manufacturing method shown in Figs. 12A to 12G utilizes the second die 1 and the second die 200, and the second die 100 is fixed by the die. 11〇 and the movable mold 12〇^, the second mold 200 is constituted by the fixed mold 110 and the movable mold 22, 31 200927431 and can be collectively opened and closed. The first mold 100 and the second mold 200 are used. The fixed mold 110 is a common mold, and each of the movable mold 120 and the movable mold 22 is combined with the common solid mold 110, thereby constituting the second mold 100 and the second mold 200. 5 The method of FIGS. 12A to 12G In the case, the member inserted into the mold is the conductive film 13, and the circuit film 16 is not mounted on the conductive crucible 13, and by using the conductive film 13 having such a structure, it is not necessary to be the first mold and the first (2) The mold 200 performs fine positioning or the like for the circuit board 16. First, the conductive film 13 is placed on the first mold 1 In the f10 cavity 111 of the fixed mold of the crucible (refer to Fig. 12A), the cavity U1 provided in the fixed mold 11 is formed into a shape for forming the slit 18a, and the slit is formed on the primary molded body 5 18a, the conductive film 13 is partially disposed outside the cavity U1. _ Further, the direction in which the conductive film 13 is disposed is formed such that the metal film layer 15 is exposed toward the cavity lu side of the fixed mold 110 of the second die 1 In the direction, the in-line molded article obtained by the double-shaped forming can be made to have the metal film layer 15 by the slit 18a of the primary molded body 5 formed by the cavity 111 of the fixed mold 110. In addition, at this time, in order to prevent the conductive film 13 from being misaligned, the conductive film housing recess 12 is provided in the movable mold 120, and the conductive hole 120 is attracted to attract the conductive material from the outside of the movable mold 120. The film 13 and 20 are fixed to the movable mold 120. If the positioning of the conductive film 13 toward the fixed mold 11 and the movable mold 12 is completed, the fixed mold 110 and the movable mold 120 are clamped and used. Forming the molten resin of the first molded body π from the injection gate 112 toward The molding die 11 is projected in the cavity ill (see FIG. 12B), and the molten resin is cured in the cavity 32 200927431 111 of the fixed die to form the primary molded body 50, and the primary molded body 50 and the conductive film 13 are formed. Then, the suction of the self-suction hole 23 in the movable mold 120 is stopped, and the movable mold 12 is moved 5 in a direction away from the fixed mold 110 with respect to the fixed mold 110, and the mold opening is performed at this time. The primary molded body 5〇 of the resin connection in the injection gate 112 of the fixed mold 110 is left on the side of the fixed mold 110, and the primary molded body 50 and the conductive film 13 are simultaneously formed by the stop suction, so that the conductive film is formed. 13 will be separated from the movable mold 12〇 and moved to the side of the primary molded body 5 (refer to Fig. 12C). 10 Next, with respect to the fixed mold 110, the movable mold 220 of the second mold 200 is placed at the opposite position, and the mold cavity 221 for forming the second molded body 2 is provided on the movable mold 220 of the second mold 200. Further, the conductive film 13 is disposed such that the support film 14 of the conductive film 13 is exposed toward the cavity 221 side of the movable mold 220, and one portion of the conductive film 13 is disposed outside the cavity 221 (see FIG. 12D). In this state, the movable mold 220 is moved in the direction in contact with the fixed mold 11A, and the second mold 200 is clamped, and then the output gate 222 from the movable mold 22 is used to form the second molded body. The molten resin of 12 is ejected into the cavity 221 of the movable mold 220 (see FIG. 12E), and the molten resin is solidified in the cavity 221 of the movable mold 220 to form a secondary formed body 6〇, and the secondary formed body 6〇 The 20-body 50 and the conductive film member 20 are integrated with the primary body. Then, the second mold 200 is opened, and the movable mold 220 is moved away from the fixed mold 110, and the flip cover 2a which is an insert molded product is taken out from the second mold 200 (see FIG. 12F). The flip cover 2a which is manufactured as an inner molded product has a state in which the conductive film i3 is covered by the primary molded body 5 and the secondary molded body 33 200927431 60, and the primary molded body 5 is provided on the other hand. The slit 18a' of the crucible exposes the metal film layer 15 of the conductive film 13 to the outside. The primary molded body 50 is the first molded body 11 , and the secondary molded body 60 is the second molded body 12 . Further, the portion of the slit 18 a can be followed by the circuit sheets 16 ′ and 5 to ensure the metal film layer 5 Power on (refer to Figure 12G). For example, when the flip cover 2, the flip cover 2a, the flip cover 2b, the flip cover 2C, and the flip cover 2d of the insert molding product according to the present embodiment are attached to the conductive film 13 at the time of the mounting of the circuit sheet 16, the in-line molding can be performed ( Before the procedure of Fig. 10A), one of the forming of the under-formed body and the secondary formed body (the program of Fig. 11D), and the forming of 10 (the program of Fig. 12G). In addition, in the 10A to 12G, the conductive film accommodation recess 121 is provided in the movable mold 2'. However, the conductive film accommodation recess 121 may not be provided as the thickness of the conductive film 13 as shown. In the state in which the conductive film 13 is placed on the boundary 1〇a of the first molded body u and the second molded body 12 as in the case of the fourth embodiment, the depth of the concave portion 导电1 of the conductive film storage is set. The thickness of the support film 14 can be made shallower, and the conductive film storage recess 121 itself is useless when the molded film 11 is wrapped in the conductive film 13 as in the fourth embodiment. The 14A to 16G drawings are respectively related to the modification of the first to fourth A to 12G drawings, and 20 is a program diagram showing the manufacture of the flip cover 2 shown in Fig. 3. Figs. 14A to 14F, Figs. 15A to 15G, and 16A to The manufacturing method shown in FIG. 16G can be manufactured by the same procedure corresponding to the 10A to 1F, 11A to 11G, and 12A to 12G, respectively. However, at this time, it is appropriately created. The cavity is formed largely, and the conductive film 3 is made of a small piece protruding from the side of the substantially rectangular body portion 13a of 200927431. 13p is disposed outside the cavity (1) and the die 121 of each of the molds shown in Figs. 10A to 12G (refer to Figs. 14A, 15A, and 16A). Further, as shown in Figs. 10A to 10F and Figs. 14A to 14F. In the manufacturing process of the flip cover 5, the metal film layer 15 of the conductive film 13 may be replaced by the conductive film member 20 of the circuit board 16, and the support film 14 and the metal film may be used as shown in FIGS. 13A and 13B. The conductive film member 2b composed of the layer 15 includes the main body portion 14a which is formed in a rectangular shape, and the strip portion > 14b which protrudes from one side of the main body portion I4a and has a rectangular shape The metal 10 film layer b includes a metal film layer main portion 15c provided on the surface of the main body portion 14a of the support crucible 14 and a circuit pattern portion 15b provided on the surface of the strip portion 14b. The metal film layer main portion i5c is connected to the metal film layer main portion i5c and has the function of being the circuit board 16. As described above, according to the present embodiment, the flip cover 2, the flip cover 2a, and the flip cover 2b of the electric sub-machine can be appropriately formed. , the flip cover 2c, the flip cover 2d are used, and at the same time, since the trees are provided on both surfaces of the conductive film 13 Since the molded body (the first formed β-shaped body 11 and the second molded body 12) can be offset by the resin molded body (the first molded body 11 and the second molded body 12), the warpage accompanying the shrinkage can be prevented and prevented. When the conductive film 13 is used as a capacitance switch or a communication antenna, for example, when the conductive film 13 is used as a capacitance switch or a communication antenna, the positional accuracy and dimensional accuracy of the conductive film 13 are required. As described above, the resin molded body (the first molded body 11 and the second molded body 12) is provided on both surfaces of the conductive film 13, and both of the resin molded bodies (the first molded body 11 and the first molded body) can be provided. (2) The molded body I2) is offset by the warpage of shrinkage and prevents the occurrence of distortion. Therefore, even after the resin is molded, the shape of the circuit formed by the conductive film 13 can be maintained with high precision. It is also suitable as an electrostatic capacitance switch or a communication antenna. In addition, according to the present embodiment, the metal film layer 15 which is provided on the surface of the conductive film 13 and which is fluoroscopic can be exposed to the outside by the slit portion or the like which is an example of the exposed portion of the conductive film layer 5, The circuit board 16 or the like is connected to a portion exposed to the outside by a cutout portion or the like, or the conductive layer itself is extended simultaneously with the support film and exposed to the outside without the circuit board 16, whereby the conductive film layer of the conductive film is made It is used in the same manner as the external circuit, and is used in the same manner as the antenna or the electrostatic capacitor P of the electronic device. At the same time, when used in the electromagnetic wave or the like, the conductive film layer can be electrically discharged to the outside via the circuit board or the conductive film layer itself. Further, the present invention is not limited to the above embodiment, and can be implemented in other various aspects. 15 λ ' can exert the effects of each of them by appropriately combining any of the above-described embodiments or modifications. INDUSTRIAL APPLICABILITY The double-molded internal-drawing molded article and the electronic device using the molded article according to the present invention are used in the electromagnetic wave when the conductive film is double-dued by the (four) insert molding. When shielded, etc., the electrified f can be discharged to the outside. It can be used as a flip cover for a mobile phone or a personal computer. The present invention fully discloses the related preferred embodiments with reference to the accompanying drawings. However, various modifications or corrections are obvious to those skilled in the art, and it should be understood that such deformation or correction is not based on the basis of the present invention. The scope of the invention, which is included in the scope of the appended claims, should be included. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a perspective view showing an external structure of an electronic device in which a double-molded inner 5 molded article according to an embodiment of the present invention is used as a flip cover; FIG. 1B is a view showing the embodiment of the present invention. A perspective view of the appearance of the electronic device used in the above-described dual-molded in-line molded article as the flip cover; © Fig. 2 is a perspective view showing the appearance of the ten flip cover used in the electronic device of Fig. 1A; A cross-sectional view of the flip cover along the line III-III of FIG. 2; - FIG. 4A shows a structure in which one end of the conductive film is covered by the first molded body and the second molded body in the flip cover. An enlarged cross-sectional view of an example; FIG. 4B is an enlarged cross-sectional view showing another example of a structure in which one end of the conductive film is covered by the first molded body and the second molded body 15 in the flip cover; FIG. 4C is shown in FIG. An enlarged cross-sectional view of another example of the structure in which the first molded body and the second molded body are covered with one end of the conductive film in the flip cover; '5A is a related embodiment of the present invention Fig. 5B is a cross-sectional view taken along the line VB-VB of Fig. 5A; Fig. 6A shows another modification of the flip cover shown in Fig. 2; FIG. 6B is a partial perspective view showing another modification of the flip cover shown in FIG. 2, 200927431; and FIG. 7A is a cross-sectional view showing another modification of the flip cover shown in FIG. Fig. 7B is a partial perspective view of the flip cover shown in Fig. 7A; Fig. 8 is a plan view showing the structure of the conductive film used in the flip cover of the foregoing embodiment; Fig. 9A shows the foregoing implementation. An enlarged view of a portion of a metal film layer mesh pattern of the conductive film used in the flip cover of the form; ❹ 10 Fig. 9B shows the conductive film used in the flip cover of the above embodiment. An enlarged view of a portion of another example of the mesh pattern of the metal film layer; - Figure 9C shows the mesh pattern of the metal film layer of the conductive film used in the flip cover of the above embodiment. Another example 15 is an enlarged view of a part of Fig. 9D showing an enlargement of a part of another example of the metal film layer mesh pattern of the conductive film used in the flip cover of the embodiment. Figure 10A is a diagram showing a procedure for manufacturing the aforementioned flip cover shown in Fig. 7A; Fig. 10B is a program diagram showing a procedure following Fig. 10A; and Fig. 10C is a program showing a procedure following Fig. 10B. Fig. 10D is a program diagram showing a procedure following the 10Cth diagram; Fig. 10E is a program diagram showing a procedure following the 10D diagram; 38 200927431 5 Fig. 10F is a program diagram showing a procedure following the 10th diagram; Fig. 11A is a flowchart showing a method of manufacturing a flip cover according to a modification of the above-described flip cover manufacturing method of Figs. 10A to 10F; Fig. 11B is a program diagram showing a procedure subsequent to Fig. 11A; and Fig. 11C is a diagram showing a continuation of Fig. 11B The program diagram of the program; the 11D diagram shows the program diagram of the program following the 11C chart; the 11E diagram shows the program diagram of the program following the 11th diagram; and the 11F diagram shows the procedure of the program following the 11E diagram. Fig. 11G is a program diagram showing the procedure of the 11th Fth; 10th Fig. 12A shows a program diagram for manufacturing the flip cover shown in Figs. 5A, 6A, and 6B, and Fig. 12B is a diagram showing Fig. 12A. Program diagram of the program; Fig. 12C shows the program diagram of the program following Fig. 12B; Fig. 12D shows the program diagram of the program following Fig. 12C; 15 Fig. 12E shows the program of the program following Fig. 12D Fig. 12F is a program diagram showing the procedure of the continuation of Fig. 12E; Fig. 12G is a program diagram showing the procedure of the continuation of Fig. 12F; Fig. 13A is a diagram showing the use of the aforementioned flip cover in the foregoing embodiment. Fig. 13B is a cross-sectional view of the flip cover having the above-described modification of Fig. 13A; Fig. 14A is a view showing the procedure for manufacturing the flip cover shown in Fig. 3; Fig. 14B The program diagram showing the program following the 14A diagram is shown; the 14C diagram is the program diagram showing the procedure following the 14B diagram; 39 200927431 The 14D diagram shows the program diagram of the procedure following the 14Cth diagram; the 14E diagram shows the connection diagram. Program of Figure 14D Fig. 14F is a program diagram showing a procedure subsequent to Fig. 14E; Fig. 15A is a program diagram showing a method for manufacturing a flip cover according to a modification of the above-described clamshell manufacturing method of Figs. 14A to 14F; The program diagram of the program following the 15A diagram is displayed; the 15C diagram shows the program diagram of the program following the 15th diagram; the 15D diagram shows the program diagram of the program following the 15C diagram; and the 15E diagram shows the 15D diagram of the connection. Program diagram of the program; © 10 Figure 15F shows the program diagram of the program following the 15E diagram; Figure 15G shows the program diagram of the program following the 15F diagram; Figure 16A shows the diagrams related to the 14A to 14F diagrams. Flip cover manufacturing method - Flip cover manufacturing method program diagram of the modified example; Fig. 16B is a program diagram showing the program following Fig. 16A; 15 Fig. 16C is a program diagram showing the program following Fig. 16B; Fig. 16D drawing The program diagram of the program following the 16Cth diagram; the 16E diagram shows the program diagram of the program following the 16D diagram; the 16F diagram shows the program diagram of the program following the 16E diagram; the 16G diagram shows the connection pattern 16F Program diagram20 [Description of main component symbols] 1.. Electronic machine 4... Hinge part 2, 2a, 2b, 2c, 2d... Flip cover 5... Display 3.. . Electronic machine body 6... Operation button 3a...surface 10...plate portion 40 200927431

10a...Boundary 11... First molded body 11a: End portion lib, 11c, 12b, 12c... Peripheral portion 12: Second molded body 13: Conductive film 13a, 14a, 15d... Main body portion 13p... small piece portion 14.. support film 14b... band portion 15... metal film layer 15a, 15b... circuit pattern portion 15c... metal film layer body portion 151.. mesh 15j... very thin strips 16.. .. Circuit board 17.. Conductive adhesive 18a, 18b... slit 18d, 18e... drop 18c... blind hole 20, 20b... conductive film member 21. 1 . 1C wafer 50.. - secondary molding 60.. secondary molding 100... first mold 110, 210... fixed mold 111, 221... mold groove 111b... recess for circuit film storage 112, 222... injection gate 120, 220... movable mold 121.. conductive film accommodation recess 123... suction hole 200... second mold 221b... circuit piece storage recess w... bandwidth 41

Claims (1)

200927431 X. Patent Application Range: 1. A double-formed in-line molded article comprising: a conductive film having a transparent support film and a conductive film layer disposed on the surface of the support film; a body formed on one surface of the conductive film and covering the one surface; the second molded body is formed on the other surface of the conductive film and covering the other surface; and the exposed portion of the conductive film layer is caused by The conductive film layer is exposed to the outside from the first 10th body and the second molded body which are in contact with the conductive film layer. 2. The double-molded in-line molded article according to claim 1, wherein the exposed portion of the conductive film layer includes: a cutout portion formed in the formed body 15 in contact with the conductive film layer; and a circuit piece. A portion of the conductive film layer exposed to the outside through the cutout portion is connected to the connection terminal. 3. The double-molded in-line molded article according to claim 1, wherein the conductive film includes a body portion and a rectangular portion that protrudes from one of the one end edges 20 of the body portion, and the first molded body and the aforementioned The second molding system is formed so as to cover the main body portion of the conductive film, and the rectangular portion that is not covered by the first molded body or the second molded body is configured to have the conductive film layer facing the first molded body or The conductive film layer exposed portion exposed to the outside of the second molded body. The double-molded in-line molded article of the third aspect of the invention, wherein the exposed portion of the conductive film layer includes: the rectangular portion; and the circuit piece, and the outer surface of the rectangular portion is exposed to the outside A connection terminal of one of the conductive film layers. 5. The double-molded in-line molded article of the first aspect of the invention, wherein the exposed portion of the conductive film layer is composed of a circuit piece, and the circuit chip is connected to a portion of the conductive film layer of the conductive film. In addition, the first molded body and the second molding system are disposed so as to completely cover the conductive film, and one of the circuit pieces is exposed to the outside of the first molded body and the second molded body. . 6. The double-molded in-line molded article according to claim 1, wherein the support film comprises: a body portion; and a belt portion protruding from one of the end edges of the body portion and provided on the surface In the circuit pattern portion in which the conductive film layer is connected, the first molded body and the second molding system are formed so as to cover the main body portion of the support film, and at least a part of the strip portion is formed toward the first shape. The body or the outside of the second molded body is exposed, and -20 constitutes the exposed portion of the conductive film layer. 7. The double-molded in-line molded article according to the first aspect of the invention, wherein the conductive film layer of the conductive film is composed of a metal film layer, and the metal film layer has a mesh composed of a very thin strip of substantially equal width Eye structure. 8. For the double-formed in-line molded article of claim 7, wherein the bandwidth of the ultra-fine tape of the first 43 200927431 is 30 μm or less. 9. The double-molded in-line molded article according to claim 1, wherein the first molded body and the second molded system are made of a transparent resin. 10. An electronic device comprising a flip cover formed by a double formed in-line molded article according to any one of claims 1 to 9 of the patent application, hingedly joined to be closed and distant from being superimposed on the display The mover between the on states of the aforementioned display. ❹ 44