200821805 九、發明說明： 【發明所屬之技術領域】 本發明涉及平面顯示器、電腦、大功率雷射二極體或電源供應器等發熱設 備的散熱裝置，具體提供一種高效無風扇散熱裝置，屬於國際專利分類 G06F1/20「數據處理設備的冷卻方法」、H01L23/34「半導體或其它固態器 件零邰件的冷卻裝置、通風裝置」技術領域。 【先前技術】 現今平面顯示器、電腦、大功率雷射二極體或電源供應器等設備逐年提高 了使用功率。但大功率所產生的熱量未適當排除時，容易因過熱而降低性 能或損壞裝置。以大型平面顯示器的發光模組爲例，該發光二極體平行排 列於平面面板及反射底板之間，隨著平面顯示器的面板逐漸增大，發光二 極體的數量也不斷提升，在大功率運作下累積大量熱能，溫度不斷上升的 發光體亮度會隨著產生色溫變化與光度降低，因此若熱量無法有效傳導至 外界時，就會造成平面顯示面板的溫度差異過大，嚴重影響顯示效果與顯 示器性能。 現有技術中一般顯不器或電腦等設備的散熱方式，種類較多，大部分使用 散熱風扇加速其熱對流，再從外殻體鰭片狀散熱面將熱量釋放出來。因此 有不同結構的散熱設計，以滿足背光模組或中央處理器的散熱需求，例 如：US 2006132699、JP2006222254 及 KR2005003751 等專利中公開的內 容。然而，上述專利皆會有散熱風扇高速轉動而產生大噪音的缺點。 【發明内容】 針對上述現有技術中的不足，本發明的目的，在於提供一種設備胃 顯不挤或電腦寺不需使用風扇’可達到空氣流動順暢散熱良好的高效無風 5 200821805 扇散熱裝置。 本發明的目的是通過以下技術方案實現的。 一種高效無風扇散熱裝置，包括前集熱體、集熱通道、氣流通道腔體及後 散熱單元體。該裝置的組合是由平面顯示器發光模組、電腦中央處理器或 其他發熱兀件緊密連接前集熱體，刖集熱體另一端連接集熱通道，集熱通 道後端連接後散熱單兀體。後散熱單兀體置於氣流通道腔體內的下方，後 散熱單元體包括後散熱板和鰭狀散熱片，鰭狀散熱片均勻排佈於後散熱板 上。該氣流通道，爲前集熱體與後散熱單元體之間的隔熱層所包圍形成上 下開口的腔體空間。集熱通道除前後開口以連結前集熱體及後散熱單元體 外，皆由隔熱材料層塡滿，使後段散熱單元體被隔離於上下開口的氣流通 道下方，使熱流只經由前段集熱體與後段散熱單元體間的集熱通道所傳 導。 應用於電腦中央處理器散熱的情況，是由設在電路基板上的中央處理器及 其他發熱元件如顯卡連接集熱管一端’集熱管的另一端再與前集熱體前端 連接，則集熱體的後端與集熱通道連接，集熱通道連接其餘的設置及連接 方式同上段說明。 各單元詳細描述如下：發熱元件連接的集熱管，由高導熱金屬材料或金屬 熱管製作，其形狀可爲條狀體或管狀體。前集熱體由高導熱金屬材料或鑽 石鍍膜金屬製作，其形狀可爲板狀體。集熱通道可由致冷晶片(Thernio-. electric chip)、鑽石層、鑽石鍍膜金屬、碳化矽或金屬等高導熱材料製成。 集熱通道的尺寸大小可依實際熱排放量調整。隔熱層腔體是由隔熱材料製 成，置於前集熱體與後散熱板的之間，及包圍氣流通道形成上下開口方 型、扁平管狀或圓管型的腔體空間。後散熱單元體上的鰭狀散熱片爲上下 平行排列的鰭狀散熱片，其組成可用鋁或銅材料製成。後散熱板的面積可 依排熱需求不同進行調整。 因此本發明的設計，可不使用風扇、無噪音的情況下，排放多餘熱量，避 6 200821805 免精密設備因過熱而降低性能或損壞的散熱裝置。 【實施方式】 有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之 較佳實施例的詳細說明中，將可清楚的呈現。 實施例1:本發明結構應用於平面顯示器散熱的情況。 以平面顯示器發光背光模組11的散熱爲例，本發明結構可在不使用風扇 牛下，使背光模組11在穩定溫度的狀態下工作。 參見圖1、圖2及圖4，該散熱裝置設於一平面顯示器背光模組n的後方， / 散熱模組包括前段集熱體21、隔熱層腔體3含隔熱層3〗及隔熱背板32、 集熱通道4、上下開口氣流通道6、後散熱單元體5含後散熱板51與鰭狀 散熱片52。 具體的散熱方式：平面顯示器背光模組11背面與前段集熱體21用散熱膏 貼合固定。在前集熱體21的另一面上用散熱膏貼合集熱通道4的前端面， 在集熱通道4的另一端上用散熱膏貼合固定於後散熱板51。前段集熱體 21與後段散熱單元體5中間，除集熱通道4外皆使用隔熱層31塡滿隔開。 另外，後散熱單元體的兩側面與背面也由隔熱背板32組成，其目的是使 ( 後散熱單元體被隔離在上下開口氣流通道6內，熱流只經由集熱通道4控 制通過。該集熱通道4使用致冷晶片吸引前段集熱體21的熱量，同時將 熱量排往後段散熱板51與鰭狀散熱片52 〇 上述排放的熱量使後散熱板51及鰭狀散熱片52的溫度提高。因鰭狀散熱 片52置於有上下開口氣流通道6的內部下方，氣體經鰭片52加熱後膨脹， 形成熱氣流快速上升，由頂部開口 62排出。同時產生一定的真空度，吸 引下部冷空氣由進氣口 61進入通道內。冷空氣經由上下平行排列的鰭片 52再加熱排放，使氣體自動循環流動’因而達到了排出熱量的目的。 實施例2:本發明結構應用於電腦中央處理器及其他發熱元件散熱的情 7 200821805 況。 本發明在不使用風扇條件下，可使中央處理器及其他發熱元件在穩定溫度 的狀態下工作。參見圖3，散熱裝置包含有：前集熱管22、前集熱體21、 隔熱層腔體3含隔熱層31及隔熱背板32、集熱通道4、上下開口氣流通 道ό、後散熱單元體5含後散熱板51與鰭狀散熱片52 〇 散熱的步驟如下：中央處理器12的發熱背面與前集熱熱管22用散熱膏貼 合固定，在前集熱熱管22的另一端面上用散熱膏貼合集熱通道4的前端 面，在集熱通道4的另一端上用散熱膏貼合固定於後散熱板51。後段散熱 單元體前，除集熱通道4外均使用隔熱層31隔開。由隔熱層腔體3組成 的上下開口氣流通道6，其目的是使後散熱單元體被隔離在內。熱流只經 由集熱通道4控制，該集熱通道4使用致冷晶片吸收前集熱熱管22的熱 量。因而前集熱熱管22的熱量可快速排往後散熱板51與鰭狀散熱片52， 使後散熱板51及鰭狀散熱片52的溫度提高。由於散熱鰭片52置於有上 下開口氣流通道ό的內部下方，氣體經鰭狀散熱片52的加熱後膨脹，形 成熱氣流快速上升，由頂部的開口 62排出。同時’產生一定的真空度， 吸引下部冷空氣由進氣口 61進入上下開口氣流通道6內’冷空氣經由上 下平行排列的鰭片52再加熱排放，因此氣體自動循環流動達到排除熱量 之目地。 綜上所述，本發明的散熱結構及散熱方式的小結如下：平面顯示器、電腦 或工業設備發熱體等與前集熱體用散熱膏接合固定，在前集熱體的另一面 上用散熱膏接合固定於集熱通道前端面。在集熱通道的另一端面用散熱膏 接合固定於後散熱板，前集熱體的熱量由集熱通道排往後散熱板與鰭片， 熱量使後散熱板及接觸鰭片的溫度提高。因該散熱鰭片置於有上下開口氣 流通道內下方，氣體經鰭狀散熱片加熱後澎漲形成熱氣流上升由頂部排氣 開口排出，同時吸引下部冷空氣由進氣口進入，達到氣體自行流動排除熱 量之目地。 8 200821805 惟以上所述者，僅爲本發明之較佳實施例而已，當不能以此限定本發明實 施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等 效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 【圖式簡單說明】 01爲本發明散熱裝置的分解組裝示意圖。 圖2爲平面顯示器散熱裝置的橫向剖面圖。 0 3爲電腦散熱裝置的橫向剖面圖。 1 圖4爲散熱裝置的俯視剖面圖。 圖5爲上下開口氣流通道型式的舉例圖。 【主要元件符號說明】 圖中符號說明： # 平面顯示器發光模組，12-中央處理器，13-電路基板，14_基座；21·前 u 集熱體，22-集熱管，3-隔熱層腔體，31-隔熱層，32_氣流通道背板，4_ 集熱通道’ 5、後散熱單元體，51-後散熱板，52-鰭狀散熱片，6-上下 開口氣流通道，61-氣流進氣口，62-氣流排氣口，63_方型上下開口氣流 通道，64.管型上下開口氣流通道，65.平管狀上下開口氣流通道， 74幾箱外殼。 9200821805 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device for a heat generating device such as a flat panel display, a computer, a high power laser diode or a power supply, and specifically provides an efficient fanless heat sink device, belonging to the international Patent Classification G06F1/20 "Cooling Method for Data Processing Equipment", H01L23/34 "Cooling Device and Ventilation Device for Semiconductor or Other Solid-State Device Parts" Technical Field. [Prior Art] Devices such as flat panel displays, computers, high-power laser diodes, or power supplies have increased power consumption year by year. However, when the heat generated by high power is not properly removed, it is easy to reduce performance or damage the device due to overheating. Taking a light-emitting module of a large flat-panel display as an example, the light-emitting diodes are arranged in parallel between the flat panel and the reflective bottom plate. As the panel of the flat-panel display is gradually increased, the number of the light-emitting diodes is continuously increased, and the power is high. Accumulating a large amount of heat energy under operation, the brightness of the illuminating body with increasing temperature will change with the color temperature and the luminosity. Therefore, if the heat cannot be effectively transmitted to the outside world, the temperature difference of the flat display panel will be too large, which will seriously affect the display effect and the display. performance. In the prior art, there are many types of heat dissipation methods such as a display device or a computer, and most of them use a heat dissipation fan to accelerate the heat convection, and then release heat from the fin-shaped heat dissipation surface of the outer casing. Therefore, there are different structures of heat dissipation design to meet the heat dissipation requirements of the backlight module or the central processing unit, such as those disclosed in patents such as US 2006132699, JP2006222254 and KR2005003751. However, the above patents all have the disadvantage that the cooling fan rotates at a high speed to generate a large noise. SUMMARY OF THE INVENTION In view of the above deficiencies in the prior art, an object of the present invention is to provide an efficient and windless device that can achieve a smooth airflow and a good heat dissipation without using a fan. The object of the present invention is achieved by the following technical solutions. An efficient fanless heat sink includes a front heat collector, a heat collecting passage, an air flow passage cavity, and a rear heat radiating unit body. The combination of the device is closely connected to the front heat collecting body by the flat display lighting module, the computer central processing unit or other heating elements, and the other end of the heat collecting body is connected to the heat collecting channel, and the rear end of the heat collecting channel is connected with the heat radiating single body. . The rear heat dissipation unit body is disposed below the air passage passage cavity, and the rear heat dissipation unit body includes a rear heat dissipation plate and a fin heat sink, and the fin heat dissipation fins are evenly arranged on the rear heat dissipation plate. The air flow passage is surrounded by a heat insulating layer between the front heat collecting body and the rear heat radiating unit body to form a cavity space of the upper and lower openings. In addition to the front and rear openings for connecting the front heat collecting body and the rear heat radiating unit, the heat collecting passage is filled with the heat insulating material layer, so that the rear heat radiating unit body is isolated under the air flow passage of the upper and lower openings, so that the heat flow only passes through the front stage heat collecting body. Conducted by the heat collecting channel between the rear heat dissipating unit body. The heat dissipation applied to the central processing unit of the computer is performed by a central processing unit disposed on the circuit substrate and other heating elements such as a graphics card connecting one end of the heat collecting tube to the other end of the heat collecting tube and then connected to the front end of the front heat collecting body. The rear end is connected to the heat collecting channel, and the remaining settings and connection manners of the heat collecting channel are the same as those in the above paragraph. Each unit is described in detail as follows: The heat collecting tubes to which the heat generating elements are connected are made of a highly thermally conductive metal material or a metal heat pipe, and may be in the form of a strip or a tubular body. The front heat collector is made of a highly thermally conductive metal material or a diamond coated metal, and its shape may be a plate-like body. The heat collecting channel can be made of a high thermal conductive material such as a Therio-. electric chip, a diamond layer, a diamond coated metal, a tantalum carbide or a metal. The size of the heat collecting channel can be adjusted according to the actual heat discharge. The heat insulating layer cavity is made of a heat insulating material, and is disposed between the front heat collecting body and the rear heat radiating plate, and surrounds the air flow passage to form a cavity space of an upper and lower opening shape, a flat tubular shape or a round pipe type. The fin fins on the rear heat dissipating unit body are fin fins arranged in parallel above and below, and the composition thereof may be made of aluminum or copper material. The area of the rear heat sink can be adjusted according to the heat demand. Therefore, the design of the present invention can discharge excess heat without using a fan and without noise, and avoids the heat dissipation device which is reduced in performance or damage due to overheating of the precision equipment. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Embodiment 1: The structure of the present invention is applied to the case of heat dissipation of a flat panel display. Taking the heat dissipation of the flat panel display illumination backlight module 11 as an example, the structure of the present invention can operate the backlight module 11 under a stable temperature without using a fan. Referring to FIG. 1 , FIG. 2 and FIG. 4 , the heat dissipating device is disposed behind a flat display backlight module n , and the heat dissipating module comprises a front heat collecting body 21 and a heat insulating layer cavity 3 including a heat insulating layer 3 and a partition. The heat backing plate 32, the heat collecting passage 4, the upper and lower open air flow passages 6, and the rear heat radiating unit body 5 include a rear heat radiating plate 51 and a fin fins 52. The specific heat dissipation method is as follows: the back surface of the flat display backlight module 11 and the front heat collecting body 21 are fixed and fixed by a heat dissipation paste. The front end surface of the heat collecting passage 4 is bonded to the other surface of the front heat collecting body 21 with a heat-dissipating paste, and is fixed to the rear heat radiating plate 51 by heat-dissipating paste on the other end of the heat collecting passage 4. The front stage heat collecting body 21 and the rear stage heat radiating unit body 5 are separated from each other by the heat insulating layer 31 except for the heat collecting passage 4. In addition, the two side faces and the back face of the rear heat dissipating unit body are also composed of the heat insulating back plate 32, and the purpose thereof is to make (the rear heat radiating unit body is isolated in the upper and lower open air flow passages 6, and the heat flow is controlled only through the heat collecting passage 4). The heat collecting passage 4 uses the cooling fin to attract the heat of the front stage heat collecting body 21, and simultaneously discharges the heat to the rear stage heat radiating plate 51 and the fin fins 52. The heat discharged therefrom causes the temperature of the rear heat radiating plate 51 and the fin fins 52. The fin fins 52 are placed under the inside of the upper and lower open air passages 6, and the gas is heated by the fins 52 to expand, and the hot airflow is rapidly increased, and is discharged from the top opening 62. At the same time, a certain degree of vacuum is generated to attract the lower portion. The cold air enters the passage through the air inlet 61. The cold air is reheated and discharged through the fins 52 arranged in parallel above and below, so that the gas is automatically circulated and flowing, thus achieving the purpose of discharging heat. Embodiment 2: The structure of the present invention is applied to the center of the computer The heat dissipation of the processor and other heating elements is 7200821805. The invention can stabilize the central processing unit and other heating elements without using a fan. Referring to FIG. 3, the heat dissipating device comprises: a front heat collecting tube 22, a front heat collecting body 21, a heat insulating layer cavity 3, a heat insulating layer 31, an insulating backing plate 32, a heat collecting channel 4, and upper and lower openings. The airflow passage ό and the rear heat dissipation unit body 5 include the rear heat dissipation plate 51 and the fin heat dissipation fins 52. The heat dissipation step is as follows: the heat generating back surface of the central processing unit 12 and the front heat collecting heat pipe 22 are fixed and fixed by the heat dissipation paste, and the heat is collected in front. The other end surface of the heat pipe 22 is bonded to the front end surface of the heat collecting passage 4 by a heat dissipating paste, and is fixed to the rear heat dissipating plate 51 by a heat dissipating paste on the other end of the heat collecting passage 4. In addition to the heat collecting passage in front of the heat dissipating unit body in the rear stage 4, the outer portions are separated by a heat insulating layer 31. The upper and lower open air flow channels 6 composed of the heat insulating layer cavity 3 are designed to isolate the rear heat radiating unit body. The heat flow is controlled only by the heat collecting channel 4, the set The heat transfer channel 4 uses the heat-dissipating wafer to absorb the heat of the front heat collecting heat pipe 22. Therefore, the heat of the front heat collecting heat pipe 22 can be quickly discharged to the rear heat radiating plate 51 and the fin-shaped heat sink 52, so that the rear heat radiating plate 51 and the fin-shaped heat sink 52 are provided. The temperature is increased. Since the heat dissipation fins 52 are placed in the upper and lower openings, the airflow is passed. Below the inside of the crucible, the gas expands after heating by the fin fins 52, and the hot airflow rises rapidly, and is discharged from the opening 62 at the top. At the same time, 'a certain degree of vacuum is generated, and the lower cold air is attracted to the upper and lower openings by the air inlet 61. The cold air in the air flow passage 6 is reheated and discharged through the fins 52 arranged in parallel above and below, so that the gas automatically circulates and flows to achieve the purpose of eliminating heat. In summary, the heat dissipation structure and the heat dissipation method of the present invention are summarized as follows: a flat display, The heating element of the computer or industrial equipment is fixed and fixed with the heat sink of the front heat collector, and is fixed to the front end surface of the heat collecting channel by the heat sink paste on the other side of the front heat collecting body. The heat radiating paste is used on the other end surface of the heat collecting passage. The joint is fixed to the rear heat sink, and the heat of the front heat collector is discharged from the heat collecting passage to the rear heat sink and the fin, and the heat increases the temperature of the rear heat sink and the contact fin. Because the heat dissipating fins are placed in the upper and lower open airflow passages, the gas is heated by the fin fins to form a hot air flow, which is discharged from the top exhaust opening, and attracts the lower cold air to enter the air inlet to reach the gas itself. Flow to remove heat. 8 200821805 The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change of the patent application scope and the description of the invention is Modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS 01 is a schematic exploded view of the heat sink of the present invention. 2 is a transverse cross-sectional view of a heat sink of a flat panel display. 0 3 is a transverse sectional view of the computer heat sink. 1 Figure 4 is a top cross-sectional view of the heat sink. Fig. 5 is a view showing an example of an upper and lower open air flow passage pattern. [Description of main component symbols] Symbols in the figure: # Flat panel display module, 12-CPU, 13-circuit board, 14_ base; 21· front u collector, 22-collector, 3-block Thermal layer cavity, 31-insulation layer, 32_ airflow channel backplane, 4_ collector channel '5, rear heat sink unit, 51- rear heat sink, 52-fin fins, 6-upper and lower open airflow channels, 61-air inlet, 62-air outlet, 63_ square upper and lower open air passage, 64. tubular upper and lower open air passage, 65. flat tubular upper and lower open air passage, 74 case outer casing. 9