200807226 九、發明說明： ' 【發明所屬之技術領域】 本發明係涉及一種散熱模組，尤係涉及一種用於對電 子元件散熱之散熱模組。 【先前技術】 隨著中央處理器（CPU)等發熱電子元件功率之不斷 提升’散熱問題越來越受到人們之重視，在筆記型電腦中 馨 更是如此。 在散熱領域中，目前業界通常採用散熱模組對發熱電 子70件進行散熱，目前大多數筆記型電腦中所使用之散熱 模組般係由風扇、熱管及鰭片組等組成。該熱管一端與 發熱電子元件熱接觸，另一端與該鰭片組連接。該散熱模 組藉由熱官將發熱電子元件產生之熱量傳遞至鰭片 組上， ^利用風扇運轉產生之氣流與鰭片組發生熱交換以將熱量 最終散發_圍魏巾，從而賴對發減子元件散熱之 目的。 上述散熱模組組裝到筆記型電腦上時，需利用螺絲將 |扇之殼鱗元件固定於筆記型電腦之機殼上，其結合程 絲為_ °此外，該散熱模組製造時，需要為製作該風 扇之设座單獨開發模具，而該風扇之殼座之結構較為複 雜使模/、開發費用增加，從而使該散熱模組之生產成本 較高，需加以改進。 【發明内容】 6 200807226 有鐾於此，有必要提供一種具有結合程序簡單且可減 少生產成本之散熱模組。 該散熱模組包括一骨架、設於該骨架上之一離心風扇 及設於該離心風扇之出風口處之一散熱鰭片組，該離心風 扇包括一殼座、設於該殼座上之一蓋板及收容於該殼座與 蓋板所形成之容置空間内之一轉子，其中該殼座與該骨架 為一體成型。 與習知技術相比，由於該散熱模組之離心風扇之殼座 與該月架一體成型製成，組裝時無需利用螺絲將離心風扇 之殼座固定於骨架上，組餘序簡單。該骨架與離心風扇 之设座用一套模具即可成型，無需分別為骨架與離心風扇 之殼座單獨開發模具，可節省模具之設計及製造成本，同 時該離心風扇之殼座與骨架一體成型還減少離心風扇之殼 座這一分離之料件。 【實施方式】 圖1所示為本發明散熱模組之一較佳實施例，其包括 一骨架（Roll Cage) 10、一離心風扇2〇、一散熱鰭片組3〇 及第一熱管40與第二熱管50。 如圖2所不，該骨架10為一設有複數孔、槽及螺絲鎖 固孔之框架。如圖3所示，該骨架1G安裝於—筆記型電腦 之機殼60内，該骨架10為與機殼6〇分離之構件，用於固 定筆記型電腦之内部組件如主板、硬碟等。面對來自外界 之衝擊’該骨架10能夠給主板、硬碟以及其他内部組件以 良妤保護。 200807226 如圖2所示，該離心風扇2〇可設於該骨架ι〇上，該 骨架10對應離心風扇20之位置具有兩相鄰之側邊120、 140，該兩側邊120，140上分別開設有一開口 122、142， 以供離心風扇20向外出風。 該離心風扇20包括一支撐部22、一殼座24、一設於 該殼座24上之蓋板26及一轉子28。該殼座24與骨架10 由具有高導熱性能之金屬材料如鎂合金、鋁合金等藉由壓 _ 鑄之方式一體成型，此外，該殼座24與骨架1〇也可由塑 膠一體射出成型。該支撐部22設於該殼座24之底部，該 蓋板26蓋設於該殼座24上並與該殼座24合圍形成一容置 空間，該轉子28設於該容置空間内。 該殼座24包括一底板242及一侧壁244，該侧壁244 上设有一出風口 246，該出風口 246與骨架10之侧邊120、 140上之開口 122、142相連通。該殼座％之底板施與 侧壁244垂直，其中央部位開設有一圓孔248。該支撐部 ⑩ 22設於該圓孔248内，並藉由螺絲等固定元件（圖未示） 將該支撐部22鎖固至底板242上。該支撐部22上設有複 數開孔以作為離心風扇2〇之第一入風口 220，以供外界空 氣進入離心風扇20之殼座24内。該轉子28設於殼座24 與蓋板26所形成之容置空間内，並固定於該支撐部22上。 該蓋板26蓋設於該殼座24上，其由具有高導熱性能之金 屬，如鋼、鋁等製成。該蓋板26對應該轉子28之部位開 设有第二入風口 260，以供外界空氣進入離心風扇20之殼 座24内。該蓋板26於遠離骨架10之侧邊140之一侧向下 200807226 彎折並水平延伸出一平板262，該平板262上開設有一矩 形之孔洞2料。該平板262對應該孔洞264之四角之位置 分別設有一固定彈片266,所述固定彈片266與該平板262 藉由鉚接、螺接等方式蚊至該平板脱上。利用所述固 定彈片266及複數螺釘（圖未示），可將該平板逾固定 於該骨架1G上，使-設於該平板262下部之發熱電子元件 (圖未示）與設於平板262上部之第一熱管4〇熱連接。 該散熱鰭片組30由複數鰭片310堆疊成弧形，每相鄰 兩鰭片310之間形成-風道32〇。該散熱鰭片组3〇設於離 心風扇20之出風口 246處，其下側面與殼座24之底板242 相貼合。 該第一熱管40呈C形且為扁平狀，其具有一蒸發段 410及一冷凝段420，該蒸發段41〇與設於該平板262下部 之發熱電子元件熱連接，該冷凝段420固設於散熱縛片 組30之上端面。該第二熱管5〇呈s形且也為扁平狀，曰其 >、有與另杳熱電子元件（圖未示）熱連接之一蒸發段51〇 及固設於散熱鰭片組30上端面之一冷凝段52〇。 該散熱模組之離心風扇20之殼座24與該骨架1〇 一體 成型製成，組裝時，該支撐部22藉由螺絲等固定元件固定 於设座24之底板242之底部，該轉子28設於殼座24與蓋 板26合圍形成之容置空間内，並固定於該支撐部22上， 該政熱鰭片組30設於離心風扇2〇之出風口 246處，該蓋 板26蓋設於殼座24上。該第一熱管4〇之蒸發段41〇與一 發熱電子it件熱連接，其冷凝段42G固設於該散熱籍片組 9 200807226 30之上端面，該第二熱管5〇之蒸發段51〇與另一發熱電 子凡件熱連接，其冷凝段520固設於散熱鰭片組30之上端 面〇200807226 IX. Description of the invention: 'Technical field to which the invention pertains>> The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat from an electronic component. [Prior Art] With the continuous improvement of the power of heat-generating electronic components such as a central processing unit (CPU), the problem of heat dissipation has been receiving more and more attention, especially in notebook computers. In the field of heat dissipation, the heat dissipation module is usually used in the industry to dissipate heat-generating electronic components. Currently, the heat-dissipating modules used in most notebook computers are composed of fans, heat pipes and fin sets. One end of the heat pipe is in thermal contact with the heat generating electronic component, and the other end is connected to the fin set. The heat dissipation module transfers heat generated by the heat-generating electronic components to the fin set by the heat officer, and uses the airflow generated by the fan to exchange heat with the fin group to finally dissipate the heat, thereby relieving the hair. The purpose of heat dissipation of the sub-components. When the above-mentioned heat dissipating module is assembled on the notebook computer, it is necessary to fix the shell element of the fan to the casing of the notebook computer by using a screw, and the combined process wire is _ °. In addition, when the heat dissipating module is manufactured, it needs to be The housing of the fan is separately developed, and the structure of the housing of the fan is complicated, so that the cost of the mold/development is increased, so that the production cost of the heat dissipation module is high and needs to be improved. SUMMARY OF THE INVENTION 6 200807226 In view of this, it is necessary to provide a heat dissipation module that has a simple combination process and can reduce production costs. The heat dissipation module includes a skeleton, a centrifugal fan disposed on the skeleton, and a heat dissipation fin set disposed at an air outlet of the centrifugal fan, the centrifugal fan including a housing and one of the housings The cover plate and a rotor housed in the accommodating space formed by the shell seat and the cover plate, wherein the shell seat and the skeleton are integrally formed. Compared with the conventional technology, since the housing of the centrifugal fan of the heat dissipation module is integrally formed with the lunar frame, it is not necessary to fix the housing of the centrifugal fan to the skeleton by using screws, and the order of the group is simple. The frame of the skeleton and the centrifugal fan can be formed by using one set of molds, and the mold is not separately developed for the frame of the skeleton and the centrifugal fan, thereby saving the design and manufacturing cost of the mold, and the shell of the centrifugal fan is integrally formed with the skeleton. The separate material of the housing of the centrifugal fan is also reduced. [Embodiment] FIG. 1 shows a preferred embodiment of a heat dissipation module according to the present invention, which includes a skeleton (Roll Cage) 10, a centrifugal fan 2〇, a heat dissipation fin set 3〇, and a first heat pipe 40 and The second heat pipe 50. As shown in Fig. 2, the frame 10 is a frame provided with a plurality of holes, slots and screw locking holes. As shown in Fig. 3, the skeleton 1G is mounted in a casing 60 of a notebook computer, and the skeleton 10 is a member separate from the casing 6 for fixing internal components of the notebook such as a main board, a hard disk, and the like. Facing the impact from the outside world, the skeleton 10 can protect the motherboard, hard disk and other internal components. 200807226 As shown in FIG. 2, the centrifugal fan 2 can be disposed on the skeleton ι. The frame 10 has two adjacent sides 120 and 140 corresponding to the position of the centrifugal fan 20, and the two sides 120 and 140 respectively An opening 122, 142 is defined for the centrifugal fan 20 to vent outward. The centrifugal fan 20 includes a support portion 22, a housing 24, a cover plate 26 disposed on the housing 24, and a rotor 28. The housing 24 and the bobbin 10 are integrally formed by press-casting from a metal material having high thermal conductivity such as a magnesium alloy, an aluminum alloy, etc. Further, the housing 24 and the bobbin 1 can also be integrally molded by plastic molding. The support portion 22 is disposed at the bottom of the housing. The cover plate 26 is disposed on the housing 24 and defines an accommodation space. The rotor 28 is disposed in the accommodating space. The housing 24 includes a bottom plate 242 and a side wall 244. The side wall 244 defines an air outlet 246 that communicates with the openings 122, 142 of the sides 120, 140 of the frame 10. The bottom plate of the housing is applied perpendicular to the side wall 244, and a circular hole 248 is formed in a central portion thereof. The support portion 10 22 is disposed in the circular hole 248, and the support portion 22 is locked to the bottom plate 242 by a fixing member (not shown) such as a screw. The support portion 22 is provided with a plurality of openings as the first air inlet 220 of the centrifugal fan 2 to allow outside air to enter the housing 24 of the centrifugal fan 20. The rotor 28 is disposed in the accommodating space formed by the housing 24 and the cover 26 and is fixed to the support portion 22. The cover plate 26 is covered on the housing 24 and is made of a metal having high thermal conductivity such as steel, aluminum or the like. The cover plate 26 is provided with a second air inlet 260 corresponding to the portion of the rotor 28 for the outside air to enter the housing 24 of the centrifugal fan 20. The cover plate 26 is bent away from one side of the side edge 140 of the frame 10 downwards 200807226 and horizontally extends a flat plate 262. The flat plate 262 defines a rectangular hole 2 . The fixing plate 266 is respectively disposed at a position corresponding to the four corners of the hole 264, and the fixing elastic piece 266 and the flat plate 262 are detached by screwing or screwing to the plate. The fixing elastic piece 266 and the plurality of screws (not shown) can be fixed on the frame 1G so that the heat-generating electronic component (not shown) disposed on the lower portion of the flat plate 262 is disposed on the upper portion of the flat plate 262. The first heat pipe 4 is thermally connected. The heat dissipation fin group 30 is stacked in an arc shape by a plurality of fins 310, and an air passage 32 is formed between each adjacent two fins 310. The heat dissipation fin group 3 is disposed at the air outlet 246 of the centrifugal fan 20, and the lower side thereof is in contact with the bottom plate 242 of the housing 24. The first heat pipe 40 has a C shape and is flat, and has an evaporation section 410 and a condensation section 420. The evaporation section 41 is thermally connected to a heat generating electronic component disposed at a lower portion of the flat plate 262. The condensation section 420 is fixed. On the upper end surface of the heat dissipation tab group 30. The second heat pipe 5 is s-shaped and is also flat, and has an evaporation section 51〇 thermally connected to another thermal electronic component (not shown) and is fixed on the heat dissipation fin set 30. One of the end faces of the condensation section 52〇. The housing 24 of the centrifugal fan 20 of the heat dissipation module is integrally formed with the frame 1 . When assembled, the support portion 22 is fixed to the bottom of the bottom plate 242 of the seat 24 by a fixing component such as a screw. The rotor 28 The fixing fins 30 are disposed in the accommodating space formed by the housing 24 and the cover plate 26, and are disposed on the support portion 22, and the politic fin group 30 is disposed at the air outlet 246 of the centrifugal fan 2, and the cover 26 is covered. It is arranged on the shell 24 . The evaporation section 41 of the first heat pipe 4 is thermally connected to a heat-generating electronic component, and the condensation section 42G is fixed to the upper end surface of the heat-dissipating group 9 200807226 30. The evaporation section 51 of the second heat pipe 5〇 Thermally connected to another heat-generating electronic component, the condensation section 520 is fixed on the upper end surface of the heat dissipation fin set 30〇
工作時，該第一熱管40及第二熱管50將其吸收之熱 量傳至散熱鰭片組30，再由離心風扇2〇產生之氣流與散 熱鰭片組30之鰭片310發生熱交換，以將熱量散發到周圍 裱境中。其中離心風扇20產生之氣流流經散熱鰭片組3〇 之氣流通道320，再經骨架10之兩相鄰側邊12〇、14〇之 開口 122、142流出。 與驾知散熱模組相比，該散熱模組之離心風扇之殼 座24與該雜1G —體成型製成，組鱗無需棚螺絲將 離心風扇20之殼座24固定於骨架1〇上，節省筆記型電腦 之組裝工序，«程序簡單。另，該骨架1〇與離心風扇 20之殼座24用-套模具即可成型，無需分別為骨架1〇與 離心風扇20之殼座24單獨開發模具，可節省模具之設計 及製造成本，同時該離心風扇2〇與骨架1〇 一體成型^減 少離心風扇20之殼座24這―分離之料件，從崎低生產 成本。 =上所远’本㈣符合發料利要件，纽法提 利申知。惟’以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案婦之人士，錢财㈣精 或變化，皆應涵蓋於以下之帽專利範圍内。 【圖式簡單說明】 圖1係本發明散熱模組之立體組裝示意圖。 200807226 圖2係圖1所示散熱模組之立體分解示意圖。 圖3係圖1所示散熱模組與一機殼之組裝示意圖 【主要元件符號說明】 骨架 10 開α 122、142 支撐部 22 殼座 24 侧壁 244 圓孔 248 第二入風口 260 孔洞 264 轉子 28 鰭片 310 第一熱管 40 冷凝段 420、 520 機殼 60 侧邊 120、140 離心風扇 20 第一入風口 220 底板 242 出風口 246 蓋板 26 平板 262 固定彈片 266 散熱鰭片組 30 風道 320 蒸發段 410、 510 第二熱管 50During operation, the first heat pipe 40 and the second heat pipe 50 transfer the absorbed heat to the heat dissipation fin group 30, and the airflow generated by the centrifugal fan 2〇 exchanges heat with the fins 310 of the heat dissipation fin group 30 to Dissipate heat into the surrounding environment. The airflow generated by the centrifugal fan 20 flows through the airflow passage 320 of the heat dissipation fin group 3, and then flows out through the openings 122, 142 of the two adjacent side edges 12, 14 of the frame 10. Compared with the driving heat-dissipating module, the housing 24 of the centrifugal fan of the heat-dissipating module is integrally formed with the hybrid 1G, and the scale of the centrifugal fan 20 is fixed to the frame 1 without the shed screw. Save the assembly process of the notebook, «the program is simple. In addition, the frame 1 and the housing 24 of the centrifugal fan 20 can be formed by using a sleeve mold, and it is not necessary to separately develop a mold for the frame 1 and the housing 24 of the centrifugal fan 20, thereby saving the design and manufacturing cost of the mold. The centrifugal fan 2 is integrally formed with the skeleton 1 ^ to reduce the separation of the housing 24 of the centrifugal fan 20, which is low in production cost. =上上远' This (4) is in line with the requirements of the issue, Newfatili claims. However, the above description is only a preferred embodiment of the present invention. For those who are familiar with the case, the money (4) fine or change should be covered by the following cap patents. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a three-dimensional assembly of a heat dissipation module of the present invention. 200807226 FIG. 2 is a perspective exploded view of the heat dissipation module shown in FIG. 1. 3 is a schematic view showing the assembly of the heat dissipation module and the casing shown in FIG. 1. [Main component symbol description] Skeleton 10 opening α 122, 142 support portion 22 housing 24 side wall 244 circular hole 248 second air inlet 260 hole 264 rotor 28 Fin 310 First heat pipe 40 Condensation section 420, 520 Case 60 Side 120, 140 Centrifugal fan 20 First air inlet 220 Base plate 242 Air outlet 246 Cover plate 26 Plate 262 Fixed spring 266 Heat sink fin group 30 Air duct 320 Evaporation section 410, 510 second heat pipe 50
1111