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Application filed by Energenius IncfiledCriticalEnergenius Inc
Priority to TW094131528ApriorityCriticalpatent/TW200712243A/en
Publication of TW200712243ApublicationCriticalpatent/TW200712243A/en
Thin film ferroelectric structures having a top thin film layer prepared from a precursor solution containing a polymeric hetercyclic amide, such as polyvinylpyrrolidone. The polymeric heterocyclic amide improves top contact adhesion.
TW094131528A2005-09-132005-09-13Ferroelectric thin film composites with improved top contact adhesion and devices containing the same
TW200712243A
(en)