TW200707469A - Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components - Google Patents
Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic componentsInfo
- Publication number
- TW200707469A TW200707469A TW095117585A TW95117585A TW200707469A TW 200707469 A TW200707469 A TW 200707469A TW 095117585 A TW095117585 A TW 095117585A TW 95117585 A TW95117585 A TW 95117585A TW 200707469 A TW200707469 A TW 200707469A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrically conducting
- powder
- ceramic electronic
- laminated ceramic
- production
- Prior art date
Links
- 239000000843 powder Substances 0.000 title abstract 7
- 239000000919 ceramic Substances 0.000 title abstract 3
- 150000002894 organic compounds Chemical class 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 229910052717 sulfur Inorganic materials 0.000 abstract 2
- 239000011593 sulfur Substances 0.000 abstract 2
- 239000011230 binding agent Substances 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 abstract 1
- 230000032798 delamination Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Non-Insulated Conductors (AREA)
Abstract
According to the invention, an organic binder constituting an electrically conducting paste is protected from rapid decomposition caused by the action of metal powder as a catalyst in the degreasing step, whereby a sintered ceramic constituting a baked laminated ceramic electronic component is protected from structural failures such as cracking and delamination. An electrically conducting powder (11) to be contained in electrically conducting pastes which has a structure constituted of a metal powder (12) and a coat of an organic compound (13) formed on the surface of the powder (12), wherein the compound (13) is an organic compound which has three or more carbon atoms and contains sulfur in the molecule and the sulfur is covalently bonded to the metal constituting the powder (12), with the proportion of the compound (13) being 50ppm by weight or above in terms of S based on the metal powder (12).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005200551 | 2005-07-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200707469A true TW200707469A (en) | 2007-02-16 |
TWI368232B TWI368232B (en) | 2012-07-11 |
Family
ID=37636916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095117585A TW200707469A (en) | 2005-07-08 | 2006-05-18 | Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2007007518A1 (en) |
TW (1) | TW200707469A (en) |
WO (1) | WO2007007518A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102266939A (en) * | 2010-06-01 | 2011-12-07 | 株式会社村田制作所 | Metal powder and manufacturing method thereof, and conductive paste using metal powder and laminated ceramic electronic component using conductive paste |
TWI400721B (en) * | 2007-03-19 | 2013-07-01 | Asahi Glass Co Ltd | The manufacturing method of the conductor |
TWI505293B (en) * | 2012-02-08 | 2015-10-21 | Jx Nippon Mining & Metals Corp | The treated copper powder |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009022436A1 (en) * | 2007-08-16 | 2009-02-19 | Kazufumi Ogawa | Conductive paste and method for manufacturing the same, wiring using the conductive paste and method for manufacturing the same |
JP5067312B2 (en) * | 2008-08-18 | 2012-11-07 | 住友金属鉱山株式会社 | Nickel powder and its manufacturing method |
GB0917988D0 (en) * | 2009-10-14 | 2009-12-02 | Johnson Matthey Plc | Method |
JP5718167B2 (en) * | 2011-06-13 | 2015-05-13 | 日本特殊陶業株式会社 | Electronic components |
JP5966370B2 (en) * | 2012-01-16 | 2016-08-10 | 株式会社村田製作所 | Metal powder, manufacturing method thereof, conductive paste, and electronic component |
JP6083295B2 (en) * | 2013-03-29 | 2017-02-22 | 住友金属鉱山株式会社 | Method for producing nickel powder |
JP2016115448A (en) * | 2014-12-11 | 2016-06-23 | 株式会社村田製作所 | Conductive paste and ceramic electronic component |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133165A (en) * | 2001-10-25 | 2003-05-09 | Matsushita Electric Ind Co Ltd | Laminated ceramic electronic component and its manufacturing method |
JP4168773B2 (en) * | 2003-02-12 | 2008-10-22 | 住友金属鉱山株式会社 | Method for producing nickel powder with excellent sinterability |
JP4252349B2 (en) * | 2003-04-11 | 2009-04-08 | 石原産業株式会社 | Copper powder, method for producing the same, copper paste using the copper powder, copper paint, electrode |
JP4149353B2 (en) * | 2003-10-28 | 2008-09-10 | 三井金属鉱業株式会社 | Two-layer coated metal powder, method for producing the two-layer coated metal powder, and conductive paste using the two-layer coated metal powder |
CN1968773B (en) * | 2004-06-16 | 2011-08-03 | 东邦钛株式会社 | Nickel powder and manufacturing method thereof |
-
2006
- 2006-05-18 TW TW095117585A patent/TW200707469A/en unknown
- 2006-06-20 WO PCT/JP2006/312303 patent/WO2007007518A1/en active Application Filing
- 2006-06-20 JP JP2007524554A patent/JPWO2007007518A1/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400721B (en) * | 2007-03-19 | 2013-07-01 | Asahi Glass Co Ltd | The manufacturing method of the conductor |
CN102266939A (en) * | 2010-06-01 | 2011-12-07 | 株式会社村田制作所 | Metal powder and manufacturing method thereof, and conductive paste using metal powder and laminated ceramic electronic component using conductive paste |
TWI505293B (en) * | 2012-02-08 | 2015-10-21 | Jx Nippon Mining & Metals Corp | The treated copper powder |
Also Published As
Publication number | Publication date |
---|---|
WO2007007518A1 (en) | 2007-01-18 |
TWI368232B (en) | 2012-07-11 |
JPWO2007007518A1 (en) | 2009-01-29 |
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