TW200635840A - Methods and apparatus for enhanced operation of substrate carrier handlers - Google Patents

Methods and apparatus for enhanced operation of substrate carrier handlers

Info

Publication number
TW200635840A
TW200635840A TW095103794A TW95103794A TW200635840A TW 200635840 A TW200635840 A TW 200635840A TW 095103794 A TW095103794 A TW 095103794A TW 95103794 A TW95103794 A TW 95103794A TW 200635840 A TW200635840 A TW 200635840A
Authority
TW
Taiwan
Prior art keywords
tool
methods
substrate carrier
enhanced operation
carrier handlers
Prior art date
Application number
TW095103794A
Other languages
Chinese (zh)
Other versions
TWI350812B (en
Inventor
Michael Teferra
Amitabh Puri
Eric Englhardt
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/067,302 external-priority patent/US20050209721A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200635840A publication Critical patent/TW200635840A/en
Application granted granted Critical
Publication of TWI350812B publication Critical patent/TWI350812B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

Systems, tools, and methods are provided in which a first signal is transmitted from a tool to a Fab indicating that all substrates to be processed have been removed from a specific carrier and that the specific carrier may be temporarily unloaded from a loadport of the tool. A second signal is transmitted from the tool to the Fab indicating that the specific carrier may be returned to the tool. While the carrier is unloaded from the tool, other carriers may be loaded on the vacated loadport. Numerous other features and aspects of the invention are disclosed.
TW095103794A 2005-01-28 2006-02-03 Methods and apparatus for enhanced operation of substrate carrier handlers TWI350812B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64883805P 2005-01-28 2005-01-28
US11/067,302 US20050209721A1 (en) 2003-11-06 2005-02-25 Methods and apparatus for enhanced operation of substrate carrier handlers

Publications (2)

Publication Number Publication Date
TW200635840A true TW200635840A (en) 2006-10-16
TWI350812B TWI350812B (en) 2011-10-21

Family

ID=36657280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103794A TWI350812B (en) 2005-01-28 2006-02-03 Methods and apparatus for enhanced operation of substrate carrier handlers

Country Status (4)

Country Link
KR (1) KR101079487B1 (en)
CN (1) CN101273312B (en)
TW (1) TWI350812B (en)
WO (1) WO2006081519A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI695805B (en) * 2019-08-14 2020-06-11 力晶積成電子製造股份有限公司 Lot carrying system and lot carrying method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
JP2010115723A (en) * 2008-11-11 2010-05-27 Seiko Epson Corp Robot and robot system
JP5440518B2 (en) * 2011-01-20 2014-03-12 パナソニック株式会社 Component mounting apparatus and model switching method in component mounting apparatus
US9576834B2 (en) * 2015-03-16 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Stocker and method for dispatching wafer carrier in stocker
CN106909129B (en) * 2017-02-23 2019-10-18 惠科股份有限公司 A kind of method and system of management of shifting products
CN115332128A (en) * 2022-10-14 2022-11-11 西安奕斯伟材料科技有限公司 Wafer carrier management system and method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63234511A (en) * 1987-03-24 1988-09-29 Nec Kyushu Ltd Semiconductor substrate treatment device
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
JPH06132696A (en) * 1992-10-20 1994-05-13 Tokico Ltd Substrate carrier
DE69623788T2 (en) * 1996-12-24 2003-08-07 Datasensor Spa Manufacturing process for an object
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
KR100278600B1 (en) * 1998-01-14 2001-01-15 윤종용 state management method of equipment unit for management system of a semiconductor process equipment
KR100410991B1 (en) * 2001-02-22 2003-12-18 삼성전자주식회사 Loadport for semiconductor processing apparatus
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
JP3911624B2 (en) * 2001-11-30 2007-05-09 東京エレクトロン株式会社 Processing system
US6716651B2 (en) * 2002-04-25 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for identifying a wafer cassette
JP2004296506A (en) 2003-03-25 2004-10-21 Dainippon Screen Mfg Co Ltd Substrate processing method and equipment
CH696829A5 (en) * 2003-07-11 2007-12-14 Tec Sem Ag Feeder for wafer processing.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI695805B (en) * 2019-08-14 2020-06-11 力晶積成電子製造股份有限公司 Lot carrying system and lot carrying method

Also Published As

Publication number Publication date
CN101273312A (en) 2008-09-24
WO2006081519A3 (en) 2007-02-01
KR101079487B1 (en) 2011-11-03
KR20070097299A (en) 2007-10-04
TWI350812B (en) 2011-10-21
CN101273312B (en) 2012-07-04
WO2006081519A2 (en) 2006-08-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees