TW200632548A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200632548A
TW200632548A TW095101865A TW95101865A TW200632548A TW 200632548 A TW200632548 A TW 200632548A TW 095101865 A TW095101865 A TW 095101865A TW 95101865 A TW95101865 A TW 95101865A TW 200632548 A TW200632548 A TW 200632548A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
unsaturated
provides
compound
Prior art date
Application number
TW095101865A
Other languages
Chinese (zh)
Other versions
TWI413856B (en
Inventor
Hyoc-Min Youn
Dong-Min Kim
Byung-Uk Kim
Tae-Hoon Yeo
Sang-Gak Choi
Ui Cheol Jeong
Ki Hyuk Koo
Dong Myung Kim
Joo Pyo Yun
Ho Jin Lee
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200632548A publication Critical patent/TW200632548A/en
Application granted granted Critical
Publication of TWI413856B publication Critical patent/TWI413856B/en

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Liquid Crystal (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

This invention provides a photosensitive resin composition and in particular, it provides a photosensitive resin composition comprising (a) an acryl-based copolymer obtained by copolymerizing (i) an unsaturated carbonic acid, unsaturated carbonic anhydride or mixture thereof, (ii) an epoxy group containing unsaturated compound; (iii) an olefin-based unsaturated compound; and (iv) a silane-based monomer; (b) a 1,2-quinonediazide compound; and (c) a solvent. The photosensitive resin composition according to the invention has not only excellent performances in sensitivity, transmission, insulation, chemistry resistance, flatness, coating and so on but also remarkably improved adhesion especially to inorganic substances so that it is suitable to form interlayer dielectrics during LCD manufacturing process.
TW095101865A 2005-01-27 2006-01-18 Photosensitive resin composition TWI413856B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050007725A KR101068111B1 (en) 2005-01-27 2005-01-27 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
TW200632548A true TW200632548A (en) 2006-09-16
TWI413856B TWI413856B (en) 2013-11-01

Family

ID=36844585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101865A TWI413856B (en) 2005-01-27 2006-01-18 Photosensitive resin composition

Country Status (5)

Country Link
JP (1) JP4669789B2 (en)
KR (1) KR101068111B1 (en)
CN (1) CN1811596A (en)
SG (1) SG124382A1 (en)
TW (1) TWI413856B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7799509B2 (en) * 2005-06-04 2010-09-21 Samsung Electronics Co., Ltd. Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same
KR101506535B1 (en) * 2007-02-28 2015-03-27 제이엔씨 주식회사 Positive photosensitive resin composition
KR100911889B1 (en) 2007-07-16 2009-08-11 한국전기연구원 Photosensitive resin composition with organic~inorganic hybrid and liquid display devices using
JP5187492B2 (en) * 2007-11-22 2013-04-24 Ｊｓｒ株式会社 Curable resin composition, protective film and method for forming protective film
JP5108480B2 (en) * 2007-11-28 2012-12-26 東京応化工業株式会社 Photosensitive resin composition for interlayer insulation film
JP5176768B2 (en) * 2008-08-06 2013-04-03 Ｊｓｒ株式会社 Positive photosensitive insulating resin composition
JP5451048B2 (en) * 2008-12-05 2014-03-26 株式会社ダイセル Copolymer and photosensitive resin composition
JP5411589B2 (en) * 2009-06-11 2014-02-12 株式会社ダイセル Copolymer, resin composition containing the copolymer, and cured product thereof
JP5441542B2 (en) * 2009-07-22 2014-03-12 富士フイルム株式会社 Positive photosensitive resin composition, cured film, interlayer insulating film, organic EL display device, and liquid crystal display device
TW201310166A (en) * 2011-08-31 2013-03-01 Everlight Chem Ind Corp Resin and composition thereof for manufacture insulator layer and over coat
KR101344873B1 (en) * 2011-10-17 2013-12-30 이근수 Copolymer compositions, heat-resistant resin obtained therefrom and manufacturing method thereof
JP5935297B2 (en) * 2011-11-09 2016-06-15 Jnc株式会社 Positive photosensitive composition
JP2013160825A (en) * 2012-02-02 2013-08-19 Sumitomo Chemical Co Ltd Photosensitive resin composition
JP6458236B2 (en) * 2014-09-26 2019-01-30 ナトコ株式会社 Alkali-soluble resin, photosensitive resin composition and use thereof
JP6536067B2 (en) * 2015-02-19 2019-07-03 Jsr株式会社 METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE, RADIATION-SENSITIVE RESIN COMPOSITION, AND LIQUID CRYSTAL DISPLAY DEVICE
JP7063049B2 (en) 2018-03-28 2022-05-09 Jsr株式会社 Radiation-sensitive compositions and their uses

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159441A (en) * 1979-05-31 1980-12-11 Toray Ind Inc Lithographic plate material not requiring wetting water
JPH01126643A (en) * 1987-11-12 1989-05-18 Nippon Zeon Co Ltd Pattern forming material
JPH08320567A (en) * 1995-05-25 1996-12-03 Toyo Ink Mfg Co Ltd Photo soldering resist composition
JP3562599B2 (en) * 1995-08-18 2004-09-08 大日本インキ化学工業株式会社 Photoresist composition
JP3965868B2 (en) * 2000-06-12 2007-08-29 Ｊｓｒ株式会社 Interlayer insulation film and microlens
JP2002116536A (en) * 2000-10-06 2002-04-19 Jsr Corp Radiation sensitive resin composition, its cured body and element
JP4815663B2 (en) * 2000-10-17 2011-11-16 旭硝子株式会社 Curable composition
KR100784672B1 (en) * 2001-08-20 2007-12-12 주식회사 동진쎄미켐 Photosensitive resin composition
KR100809544B1 (en) * 2001-10-24 2008-03-04 주식회사 동진쎄미켐 Photosensitive resin composition comprising quinonediazide sulfate ester compound
JP2003167350A (en) * 2001-12-04 2003-06-13 Toyobo Co Ltd Photoresist composition and method for curing the same
JP2003195499A (en) 2001-12-25 2003-07-09 Tamura Kaken Co Ltd Photosensitive resin composition and printed wiring board
KR100824356B1 (en) * 2002-01-09 2008-04-22 삼성전자주식회사 Photoresist Composition And Method of Manufacturing Pattern Using The Same
JP4483371B2 (en) * 2003-04-07 2010-06-16 東レ株式会社 Photosensitive resin composition
SG135954A1 (en) * 2003-04-07 2007-10-29 Toray Industries Positive-type photosensitive resin composition

Also Published As

Publication number Publication date
KR101068111B1 (en) 2011-09-27
JP2006209112A (en) 2006-08-10
CN1811596A (en) 2006-08-02
TWI413856B (en) 2013-11-01
SG124382A1 (en) 2006-08-30
KR20060087032A (en) 2006-08-02
JP4669789B2 (en) 2011-04-13

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