TW200620515A - Method of adhesive strength test - Google Patents
Method of adhesive strength testInfo
- Publication number
- TW200620515A TW200620515A TW093138343A TW93138343A TW200620515A TW 200620515 A TW200620515 A TW 200620515A TW 093138343 A TW093138343 A TW 093138343A TW 93138343 A TW93138343 A TW 93138343A TW 200620515 A TW200620515 A TW 200620515A
- Authority
- TW
- Taiwan
- Prior art keywords
- material layer
- adhesive strength
- strength test
- disposed
- test
- Prior art date
Links
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
A method of adhesive strength test is provided. The method is suitable for testing the adhesive strength between a device and a first material layer, wherein a second material layer is disposed on the first material layer, and the device is disposed in the second material layer and connected to the first material layer. First, a part of the second material layer is removed to form a trench, which surrounds the device. Then, a loading test is performed to separate the device and the first material layer. The method of adhesive strength test provides real-time and precision result.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138343A TWI249219B (en) | 2004-12-10 | 2004-12-10 | Method of adhesive strength test |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138343A TWI249219B (en) | 2004-12-10 | 2004-12-10 | Method of adhesive strength test |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI249219B TWI249219B (en) | 2006-02-11 |
TW200620515A true TW200620515A (en) | 2006-06-16 |
Family
ID=37429497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93138343A TWI249219B (en) | 2004-12-10 | 2004-12-10 | Method of adhesive strength test |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI249219B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102479733A (en) * | 2010-11-26 | 2012-05-30 | 财团法人工业技术研究院 | Mechanical strength test apparatus, method of manufacturing semiconductor device, and method of testing semiconductor device |
-
2004
- 2004-12-10 TW TW93138343A patent/TWI249219B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102479733A (en) * | 2010-11-26 | 2012-05-30 | 财团法人工业技术研究院 | Mechanical strength test apparatus, method of manufacturing semiconductor device, and method of testing semiconductor device |
US8673658B2 (en) | 2010-11-26 | 2014-03-18 | Industrial Technology Research Institute | Fabricating method of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TWI249219B (en) | 2006-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |