TW200620515A - Method of adhesive strength test - Google Patents

Method of adhesive strength test

Info

Publication number
TW200620515A
TW200620515A TW093138343A TW93138343A TW200620515A TW 200620515 A TW200620515 A TW 200620515A TW 093138343 A TW093138343 A TW 093138343A TW 93138343 A TW93138343 A TW 93138343A TW 200620515 A TW200620515 A TW 200620515A
Authority
TW
Taiwan
Prior art keywords
material layer
adhesive strength
strength test
disposed
test
Prior art date
Application number
TW093138343A
Other languages
Chinese (zh)
Other versions
TWI249219B (en
Inventor
Ching-Fu Horng
Kuang-Lin Lo
Shau-Chuo Wen
Chen-Hsuan Liu
Feng Kao
Jen Kuang Fang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93138343A priority Critical patent/TWI249219B/en
Application granted granted Critical
Publication of TWI249219B publication Critical patent/TWI249219B/en
Publication of TW200620515A publication Critical patent/TW200620515A/en

Links

Landscapes

  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

A method of adhesive strength test is provided. The method is suitable for testing the adhesive strength between a device and a first material layer, wherein a second material layer is disposed on the first material layer, and the device is disposed in the second material layer and connected to the first material layer. First, a part of the second material layer is removed to form a trench, which surrounds the device. Then, a loading test is performed to separate the device and the first material layer. The method of adhesive strength test provides real-time and precision result.
TW93138343A 2004-12-10 2004-12-10 Method of adhesive strength test TWI249219B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93138343A TWI249219B (en) 2004-12-10 2004-12-10 Method of adhesive strength test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93138343A TWI249219B (en) 2004-12-10 2004-12-10 Method of adhesive strength test

Publications (2)

Publication Number Publication Date
TWI249219B TWI249219B (en) 2006-02-11
TW200620515A true TW200620515A (en) 2006-06-16

Family

ID=37429497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93138343A TWI249219B (en) 2004-12-10 2004-12-10 Method of adhesive strength test

Country Status (1)

Country Link
TW (1) TWI249219B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102479733A (en) * 2010-11-26 2012-05-30 财团法人工业技术研究院 Mechanical strength test apparatus, method of manufacturing semiconductor device, and method of testing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102479733A (en) * 2010-11-26 2012-05-30 财团法人工业技术研究院 Mechanical strength test apparatus, method of manufacturing semiconductor device, and method of testing semiconductor device
US8673658B2 (en) 2010-11-26 2014-03-18 Industrial Technology Research Institute Fabricating method of semiconductor device

Also Published As

Publication number Publication date
TWI249219B (en) 2006-02-11

Similar Documents

Publication Publication Date Title
TW200616578A (en) Fluid handling devices
WO2005089253A3 (en) Methods and apparatus for integrated cell handling and measurements
WO2008057897A3 (en) Method and apparatus for providing active compliance in a probe card assembly
EP1756541A4 (en) An apparatus and method for testing flexible packages for defects
MX2007003595A (en) Interferometric modulator with reduced slippage between structures and method of making the interferometric modulator.
TW200802835A (en) Method for metal extension in backside illuminated sensor for wafer level testing
MX2007002825A (en) Ocular device applicator.
AU2003222078A1 (en) Method and apparatus for unifying self-test with scan-test during prototype debug and production test
HK1154288A1 (en) Method for the non-destructive testing of a test object using ultrasound, and apparatus therefor
AU8580501A (en) Method for carrying out a saliva analysis
WO2006066112A3 (en) Using parametric measurement units as a source of power for a device under test
BRPI0719958A2 (en) BONE REMODELING DEVICE
CN1861392B (en) Piece pasting machine
ATE515443T1 (en) DEVICE AND METHOD FOR PACKAGING A COATED HOT-HOT ADHESIVE IN BLOCK FORM
TW200612136A (en) Jig for delivering liquid crystal display plate and method of fabricating liquid crystal display
MXPA03011255A (en) Method of using a simulated skin substrate and method for determining material dryness performance.
TW200833466A (en) Polishing method and polishing apparatus
TW200604539A (en) An electrical measurement apparatus and method thereof in the bonding process
GB0823675D0 (en) Apparatus and method for testing a transducer and/or eletronic circuitry associated with a transducer
TW200620515A (en) Method of adhesive strength test
HK1100762A1 (en) Method of determining the sympathetic tone and system for measurement thereof
AU2003250034A8 (en) Device and method for testing an electrode-membrane unit
DE60331364D1 (en) LETTERS FOR DIAGNOSTIC SAMPLES
TW200642767A (en) Containment structure for an electronic device
WO2008114520A1 (en) Chemical mechanical polishing pad and chemical mechanical polishing method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees