TW200522173A - Nanoimprint method with uniform pressurization and method for protecting mold thereof - Google Patents

Abstract

The present invention relates to a nanoimprint method with uniform pressurization and a method for protecting a mold thereof. The invented method is applied on a nanoimprint device with uniform pressurization, and comprises: setting a power source of the nanoimprint device at a position control mode in order to drive an external mask to advance, and enabling the external mask to drive a first carrying unit loaded with an imprint mold to advance towards a second carrying unit loaded with a moldable material layer; switching the power source to a pressure control mode when the imprint mold contacts the moldable material layer; enabling the power source to apply a pressure on the external mask so that the pressure transmits from the external mask to the imprint mold and the moldable material layer; enabling the power source to maintain at a pressure maintenance mode when the pressure reaches a predetermined value; maintaining the pressure maintenance mode for a specified period of time, and then enabling the power source to drive the external mask to advance in a reverse direction so that the imprint mold and the moldable material layer separate from each other and a mold release step is completed, thereby achieving an accurate control of speed, pressure and location with multiple stages, an uniform imprint control and an imprint depth control.

Description

200522173 V. Description of the invention α). [Technical field to which the invention belongs] The present invention relates to a method for uniformly pressing a nano transfer film and a method for protecting a mold thereof, and particularly to a nano transfer device suitable for evenly pressing a film and capable of improving the transfer speed. Nano press transfer method with uniform pressure for print forming quality and its mold protection method. [Previous technology] In the traditional semiconductor manufacturing process, the lithography process mostly uses optical lithography technology, and uses this technology to form the required conductive traces (T race) on the wafer or substrate. The method is subject to the g system of the diffraction limit of the light source. Therefore, when the processing line width is less than 100 nm, it is difficult to use optical lithography to achieve the limit of the development of the line line width. Therefore, it has been developed in recent years. Nanoprint Lithography (NIL) can break through this line width limit, and has the characteristics of high lithography resolution, fast manufacturing speed and low production cost, which has become the most popular today. Lithographic processing technology. Because this technology has nano-level precision, the quality control of the transfer process is bound to be stricter than the general hot stamping (Hot Embos sing) process. However, from the foregoing operation process, it can be seen that In the process of nanometer transfer, if the pressure applied by the transfer is uneven, as shown in Fig. 7A, the rotation and depth will be different, and the mold 2 2 and the nano structure 2 3 will be partially twisted and deformed. As shown in Figure B, when the parallelism between the mold 2 2 and the substrate 31 is not good, the nano-structure 2 3 in the transfer area will appear inclined, which will greatly reduce the transfer quality. Damage to the nano-structure 23 during demolding; therefore, in summary, the transfer force unevenness and parallelism of the transfer process

17692 Industrial Research Institute.ptd Page 4 200522173 V. Description of Invention (2) Good is obviously a major problem in forming quality control and a major limitation in mass production, and most of these problems are due to transfer The design and control caused by the equipment obviously need to be solved by the improvement of the transfer equipment and its control method. FIG. 8 is a fluid pressure transfer lithography device proposed in U.S. Patent No. 6, 4 8 2, 7 4 2 which is a mold 7 2 and a substrate 7 3 coated with a formable material layer after sealing , Placed in a closed chamber 74, and heated to a predetermined forming temperature, filled with fluid to apply pressure to the mold 72 to perform nanostructure transfer molding; this design requires advance The stacking and sealing of the mold 7 2 and the substrate 7 3, and the sealing state must be released after the transfer molding can be performed, which not only increases the cost of pre- and post-processing, but also prolongs the molding cycle and causes control procedures. Incoherent, it is difficult to achieve smooth and precise transfer control. FIG. 9 is a nano transfer device and method proposed in PCT Patent No. WO 1 4 2 8 5 8 which is equipped with a pressure chamber 8 2 and controls the fluid to enter and exit the pressure chamber 8 2 The pressure cavity 8 3 causes the mold 8 1 to move or move away from the substrate 8 5 due to the deformation of the elastic film 8 4 to complete the transfer or demolding action; however, if the mold 8 L is not placed in the elastic film in this method The center of 8 4, when the fluid is poured into the pressure cavity 8 3, the elastic film 8 4 around the mold 8 1 will have an asymmetric expansion to cause offset, and this process needs at least two upper and lower Independent power source, its synchronization and interference of power source can easily cause instability in control. In summary, it is known that the existing transfer equipment and control methods are often caused by poor parallelism between the mold and the nanostructure, or due to careless transfer pressure control.

17692 Industrial Research Institute.ptd Page 5 200522173 V. Description of the invention (3) Distorted from or formed with a bad broken mold impression into a collision that can affect the impact and cause damage. The structure is made of nanometer, nanometer and nanometer, and the mold with step mold is printed with the normal method. Mi Ming Nai ’s life pressure is reduced by using the same equipment as the printing equipment, and it ’s so low that it ’s lowered. This is also the case, because the quality of the product has indeed risen, it has been raised, and the broken structure and degree of rice have been broken. The pressure stamp of the power tool is not to be avoided, and the control system is uniform and fine. The method of transfer and the method of protecting the depth are guaranteed. The question of research and development is urgently needed. In order to protect the transfer control system, make sure that it is accurate and that the method can be printed for the transfer of Timi ’s impressed sentence, and that it is evenly distributed. Dufa · Square pressure rotation, Miduan speed pressing section, Shi Duoyun, can transfer the quality seeds of uniform needles, print them for rotation, and upgrade them at the speed of the eye-control system. The period of the week can be lowered g-nn one-supply and supply. The protection of the law in the law is to protect the appearance of the law, and the law of the law is incomplete. The protection of the mold can be protected by 7K. The seed is provided with a mold for its improvement and the print in the France is turned one meter away. The method provided by the law-promoting care center has a copy of the mold, and the law and the law of the other party and Mi Shunai before the pressure is equal, and because of this, the first one is transferred to the mold of the set. Mi Yinai transfers the ballast Shi Chengyun to use the package system to install the package, the printing method transfers Mi Yinai transfers the Mi Shi Naiyun, all uses the transmission, the covering force to the outer printing into the hood The order is set in the foreign element, and the order is driven by the first order and the single-layer laminated fixed material used in the order is set to apply uniformly and uniformly to the order. Load path

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17692 ITRI.ptd Page 6 200522173 V. Description of the invention (4) The force source, and the steps of the method include: setting the power source to a position control mode to drive the cover feed and make the cover drive The first bearing unit is fed toward the second bearing unit; when the transfer mold on the first bearing unit is in contact with the formable material layer on the second bearing unit, the power source is switched to a pressure control mode; The power source is pressed to the outer cover, so that the pressure is transmitted from the outer cover to the transfer mold and the formable material layer through the uniform pressure unit; when the pressure reaches a predetermined value, the power source is made to Maintaining a pressure-holding state; and after maintaining the pressure-holding state for a predetermined time, causing the power source to drive the cover to feed in reverse to separate the transfer mold from the formable material layer to complete the demolding step. The invention further provides a mold protection method for uniform pressure nano transfer to avoid mold damage. The method is applied to a uniform pressure nano transfer device. The uniform pressure nano transfer device includes A first load-bearing unit carrying a transfer mold, an outer cover which is non-stationarily connected to the first load-bearing unit, a second load-bearing unit for carrying a layer of a formable material, and is connected to a transfer path of a transfer force A uniform pressure applying unit, a power source for driving the cover feed, and at least one pressure sensing element, and the step of the protection method comprises: setting the dynamic source to a position control mode to drive the cover feed, And making the cover drive the first bearing unit to feed toward the second bearing unit, and the pressure between the first bearing unit and the transfer mold can be detected by the pressure sensing element in real time; the pressure sensing element is judged Whether the detected pressure value is greater than a predetermined value; when the pressure value is greater than a predetermined value, the power source is stopped from feeding; and the power source is reversely fed and returned to the starting position to protect the rotation Printing mold.

17692 ITRI.ptd Page 7 200522173 V. Description of the invention (5) The aforementioned power source system is designed to feed at multi-stage speed, and when the power source is set to the position control mode, it is set to the uniform application. The position control element of the pressure nano transfer device determines its multi-stage speed switching point, and when the power source is set to the pressure control mode, it is determined by the pressure sensing element provided in the uniform pressure nano transfer device. Multi-stage speed switching point; In addition, the pressure sensing element can also be used to detect the imprint depth between the transfer mold and the formable material layer, and to detect the separation between the transfer mold and the formable material layer. Therefore, in summary, by designing the position control element and the pressure sensing element φ, it is possible to cooperate with the control method of the present invention to perform accurate multi-stage speed, pressure, and position control, thereby exerting uniform imprinting and The effect of deep control, to achieve the ideal transfer quality and protect the mold from damage, fully solve the problems of conventional technology. [Embodiment] The following is a description of specific embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. The uniform pressure nano transfer method and the mold protection method proposed by the present invention are applicable to a special uniform pressure nano transfer device. The detailed structure of the uniform pressure nano transfer device 1 will be described first. A preferred embodiment of the structural configuration is shown in FIG. 1 and includes a cover 10, a first bearing

17692 ITRI.ptd Page 8 200522173 V. Description of the invention (6) Unit 20, second load unit 30, uniform pressure unit 40, power source 50, position control element 55, and a The pressure sensing element 60 on the outer cover 10, wherein the outer cover 10 is hollow and has an opening to define an accommodating space 12, and at least one group of inward extensions is formed around the opening. The first flange portion 1 1 (Flange), and the first bearing unit 20 is connected to one side of the cover 10 to form at least one group extending outward relative to the first flange portion 11. The second flange portion 21, so that the first bearing unit 20 can be connected to the first flange portion 11 by the second flange portion 21 instead of fixedly, and make the second convex portion The edge portion 21 is always located in the accommodating space 12 of the outer cover 10, so that the first load-bearing unit 20 does not fall outside the outer cover 10 and can generate a free relative movement with it, so that the outer cover 1 When Q is driven by a power source 50, it can drive the first bearing unit 20—and move. A transfer mold 22 is carried on one side of the first supporting unit 20 with respect to the second flange portion 21, and a nanostructure 2 3 for transferring is formed on the mold 22, and The surface of the second supporting unit 30 opposite to the transfer mold 22 carries a substrate 31, and the surface of the substrate 31 is coated with a formable material layer 32 such as a polymer. In order to make the formable material layer 32 face the die for ip 22, the nano structure 23 can be transferred during the transfer process, and the first load-bearing unit 20 and the second load-bearing unit 30 can be transferred. All are equipped with a temperature control element (not shown) to raise and lower the temperature as needed during the transfer process. In addition, the uniform pressure applying unit 40 is arranged on the first bearing unit 20 as shown in the figure, and It is located in the accommodating space 12, that is, on the transfer force transmission path of the first load-bearing unit 20 side during the transfer process. The uniform pressure unit 40 includes an elastic material sealing outer film 40 a. Instead of inside

1 7692 Industrial Research Institute. Ptd Page 9 200522173 V. Description of the invention (7). The filled fluid 4 0 b is based on the properties that the fluid 4 0 b in the closed outer membrane 40 a has the same pressure at each point. The effect of uniform force transmission can also maintain the parallelism between the mold 22 and the substrate 31. The power source 50 is composed of an electric motor 61, a transmission belt 6, a belt pulley set 63, and a screw 64, and is arranged on the side of the cover 10 to drive the cover 10 to the second load. The unit 30 moves, and the first bearing unit 20 is driven by the contact between the first flange portion 1 and the second flange portion 21, so that the transfer on the first bearing unit 20 is transferred. The mold 22 is moved to contact the substrate 31 on the second supporting unit 30 to perform transfer, and the pressure sensing element # is used to detect the force of the transfer mold 22 in real time; in addition, the The position control element 55 is a position switch, which can be selected from conventional control switches such as limit switches, photoelectric switches or proximity switches. Therefore, the uniform pressure nano transfer method of the present invention uses the aforementioned uniform pressure nano transfer device 1 and, as shown in the flow chart in FIG. 2, feed, emboss, and demold are performed separately. In the step, the cover 10 is driven by the power source 50, the transfer mold 22 is brought into contact with the moldable material layer 32 on the substrate 31, and the pressure is pressed by the power source 50. Printing, holding pressure, and even complete the transfer and reverse feed and demold, and in the foregoing process, the position control element 55 and the pressure control element 60 determine the switching speed of the power source 50 feed speed. The characteristics and detailed control flow of this method are shown in the flow chart in Fig. 3. First, start the transfer operation in step S 1 0 1, and then set the power source 50 to position control in step S 1 0 2. Mode, and driving the cover 10 at a speed of V1, and using the aforementioned first flange portion 11 and second flange portion 21 to make the

17692 ITRI.ptd Page 10 200522173 V. Description of the invention (8) The outer cover 10 drives the first bearing unit 20 and the uniform pressure unit 40 to feed toward the second bearing unit 30; secondly, As the decision block of step S 1 Q 3, it is judged whether the cover 10 is fed to touch the position switch 55. If it is "YES", then the speed of the power source 50 is switched and a smaller speed V is changed. 2 Continuous feed, this stage is shown in step S 104, according to actual needs or device differences, it is designed to have multiple stages of speed switching to perform a multi-stage speed control; then, as in step S 105 Block, using the pressure sensing element 60 to detect whether the transfer mold 22 has been fed to contact the formable material layer 32, and if yes, the power source 50 is caused to be in a position control mode Immediately switch to pressure control mode (at this time, the cover 10 will be separated from the first load-bearing unit 20), and then switch the speed to feed and imprint at a lower speed VX and pressure P 1 to make the pressure Passed from the cover 10 to the transfer mold 22 through the uniform pressing unit 40.俾 transfer the nano-structure 2 3 on the transfer mold 22 to the moldable material layer 3 2, and thereby avoid switching between the transfer mold 22 and the moldable material layer 32 The impact caused by the contact speed is too fast, and because the embossing depth of the nanometer transfer is only between tens to hundreds of nanometers, at this time, the feed speed of the power source 50 is nearly zero. Step S 107: It is determined whether the gradual transfer pressure gradually applied by the power source 50 has reached a predetermined value. If the result is "Yes", it means that the imprint has been completed, and at this time the power source 50 will Stop driving and enter the pressure holding stage of step S 108, stay at the predetermined value pressure for a period of time, maintain the integrity of its pattern transfer, and reduce the temperature with the temperature control element in the second bearing unit 30 The temperature of the substrate 31 and the moldable material layer 32 are cooled; the decision block of step S109 determines whether the holding time has reached a predetermined time.

17692 ITRI.p.td Page 11 200522173 V. Description of the invention (9) is "Yes", then the power source 50 is switched to the position control mode and restarted to drive the cover as in step S 1 1 0 1 0 reverse feed for demolding (at this time, the cover 10 is first reverse fed to contact the first load unit 20), and in consideration of the imprint quality, it is still close to zero The mold is fed at a speed until step S 1 1 1. The pressure sensing element 60 detects that the transfer mold 2 2 is separated from the formable material layer 3 2, and the speed of the power source 50 is switched to Higher speed, as in steps S 1 12 to S 1 1 4, continue to rise back to the transfer starting position, where step S 11 2 is also the same as step S 1 0 4 and can be designed according to actual needs or device differences With multiple speed switching, this completes the control process of the average φ pressure nano transfer method of the present invention. In addition, the multi-stage speed switching control performed in the foregoing step S 104 can be further described with reference to the flowchart in FIG. 4, which first causes the power source 50 to feed at the speed V2 as shown in step S1 041. Then, it is determined in step S 1 0 4 2 whether the housing 10 has been fed until the position switch 5 5 is touched. If YES, the speed is switched so that the power source 50 is fed at the speed V η. If it is "No", it will continue to feed at the speed V 2; the present invention can be designed with this flow, and it can be designed as a speed feed control that can be switched in multiple stages as needed, and can be designed to cooperate with various devices and adjust appropriately Speed of the empty stroke in the transfer process to shorten the stroke cycle time. _ Furthermore, the present invention also proposes a mold protection method for uniformly pressing the nanometer transfer to prevent the mold 22 from being damaged due to excessive pressure during the feeding or transfer process, which is also the same as step S 1 0 In step 4, the operation is as shown in the flow chart in FIG. 5. First, as in step S 1 0 4 a, the cover 10 is driven by the power source 50 and then, as in step S 1 0 4 b, the pressure is sensed. Test element 60 detects the first bearing

17692 ITRI.ptd Page 12 200522173 V. Description of the invention (10) Are the pressures on the load cell 20 and the transfer mold 22 abnormally greater than a predetermined value? The predetermined value is set in advance to avoid the rotation. The upper limit value of the pressure of the printing die 2 2 under pressure. If the result is "Yes", stop the power feed of the power source 50 as in step S 1 0 4 c; and then perform step S 1 0 4 d. , Make the power source 50 reverse feed and return to the starting position, in order to use a detection mechanism to protect the effect of the transfer mold 22 2, and finally stop the imprinting process as step S 1 0 4 e . The above-mentioned uniform sentence pressure nano transfer method can be further illustrated with the transfer stroke position, speed, pressure and time relationship diagram shown in FIG. 6, which can be matched with the aforementioned third diagram The flow chart in the figure can more clearly see the design and features of the present invention. In Figure 6, position L 1 is the starting position of the transfer, L 2 is the cover 1 0 and the position switch 5 5 and L 3 are touched. Indicates that the transfer mold 22 is in contact with the moldable material layer 3 2, L 4 indicates the start of embossing, L 5 indicates the end of embossing and the holding step, L 6 indicates the end of the holding step, and L 7 indicates the start of the demolding step , L 8 indicates that the transfer mold 22 is separated from the moldable material layer 32. Therefore, from the position L 1, the pressure sensing element 60 detects a downward initial value of _.P 1, and the electric motor 6 1 drives the pulley group 6 3 to make one end of the screw 6 4 The outer cover 10 is fed down at a speed V 1; at position L 2, the outer cover 10 has been fed to touch the position switch 5 5. At this time, the power source 50 0 will switch to a smaller speed V 2 and continue. Feeding downwards, the process is also as described above (Figure 5). If the pressure value detected by the pressure sensing element 60 is far greater than P1, the electric motor 61 will immediately stop driving and make the cover 10 Return to the starting position to protect the mold 2 2; then, at position L 3, when the transfer is used

17692 ITRI. Ptd Page 13 200522173 V. Description of the invention (11). The mold 22 is in contact with the formable material layer 32. At this time, the outer cover 10 will be separated from the first load-bearing unit 20 and continue to The speed V 2 is fed downward, and the pressure of the transfer mold 22 2 will be rapidly increased to P 2 at the moment of contact; then, at the position L 4, the continuous downward feeding of the outer cover 10 will contact the uniform pressure. The unit 40 applies pressure, and the pressure is uniformly transmitted to the transfer mold 22 through the uniform pressure unit 40, and embossing is started. At this time, the speed of the power source 50 will be switched again. Reduce the speed V 3 to near zero to avoid the impact caused by the rapid contact between the transfer mold 22 and the formable material layer 32. At the same time, the detected pressure will change from a downward pull force to an upward push force And gradually increase with the feeding speed and pressure of the power source # until the pressure rises to a predetermined holding pressure value P 3, the imprinting operation is completed, and the holding phase of the position L 5 is entered. Between the position L 5 and the position L 6, the holding pressure action is performed to maintain the integrity of the pattern transfer. At this time, the pressure will be maintained at the holding pressure P 3 and the feed rate will be maintained at zero (V 4) without driving. The length of this stage depends on the preset holding pressure time. When the holding pressure time is reached, that is, it enters the position L 6, the power source 50 will re-drive the housing 10 to reverse feed, and because the housing 1 at this time 0 is not in contact with the first load-bearing unitary 2 0, so it is first fed in reverse at a speed V 2 to position L 7, the first flange portion 11 of the cover 10 and the first load When the second flange portion 21 of the boxer 20 is in contact, the square drives the first load-bearing unit 20 to demold, and switches the speed to a speed V3 which is close to zero to maintain the pressure during the demolding process. The quality of the printed product, and the pressure value will decrease rapidly from the holding pressure P 3 to the beginning of the release P 4 and the completion of the release P 5; and when the release is completed, that is, the transfer mold 22 and the Forming material layer 3 2 formally separated

17692 ITRI.ptd Page 14 200522173 V. Description of the invention (12) When the position is L 8, the pressure will quickly drop to P at the moment of separation and the power source 5 0 will switch to a faster speed V 1 to Quickly drive the cover 10 to rise and return to the transfer start position L 1 to complete all control processes. Therefore, to sum up, the uniform pressure nano transfer method and the mold protection method disclosed in the present invention use the position switch and pressure sensing element to perform accurate multi-stage speed, pressure, and position. Control, so as to exert the effects of uniform imprint and depth control, to achieve the ideal transfer quality, at the same time, the compound has the advantages of reducing the stroke cycle time and protecting the mold from damage. The above examples are merely illustrative to illustrate the principle of the present invention and its effects, and are not intended to limit the present invention. Anyone skilled in the art can modify and change the above embodiments, such as changing the number, position, or shape of the recessed area, without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application mentioned later.

17692 Institute of Industry and Technology.ptd Page 15 200522173 Brief description of the drawings [Simplified description of the drawings] Figure 1 is a schematic diagram of the uniform pressure applying device used in the present invention; Figure 2 is the uniform pressure nano transfer of the present invention Method operation flowchart; Figure 3 is a detailed control flowchart of the uniform pressure nano transfer method shown in Figure 2; Figure 4 is a multi-stage speed switching of the uniform pressure nano transfer method of the present invention Flow chart; FIG. 5 is a φ flow chart of the method for protecting a uniformly-pressed nanometer transfer mold according to the present invention; and FIG. 6 is a transfer stroke position, speed, Diagram of the relationship between pressure and time; Figures 7 A and 7 B are schematic diagrams of examples of the conventional problems of nano transfer technology; Figure 8 is the nano transfer of US Patent No. 6, 4 8 2, 7 4 2 And FIG. 9 is a schematic diagram of a nano transfer device of PCT Patent No. WOO 1 4 2 8 5 8. P Uniform pressure application device 10 Outer cover 11 First convex edge portion 12 Receiving space 20 First-bearing σσ early element 21 Second convex edge portion 22 Mould 23 Nano structure 30 First-first bearing early element 31 Base plate

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Claims (1)

200522173 VI. Application Patent Scope 1. A uniform pressure nano transfer method is applied to a uniform pressure nano transfer device, wherein the uniform pressure nano transfer device includes A load-bearing unit, followed by a uniform pressure-applying unit on the first load-bearing unit, non-fixedly connected to the first load-bearing unit and enclosing the outer cover of the first load-bearing unit and the equal pressure-applying unit to drive the feeding of the cover It consists of a power source and a second load-bearing unit to support the layer of formable material. The steps of the nanometer transfer method for controlling the uniform pressure of the device include feeding, stamping, and demolding stages: the power source Set to position control mode to drive the cover to feed, and make the cover drive the first load unit to feed towards the second load unit; when the transfer mold on the first load unit and the fixed second load When the formable material layer on the unit is in contact, the power source is switched to the pressure control mode; the power source is pressed to the outer cover, and the pressure is transmitted to the transfer mold and the Shape material layer; holding pressure, when the pressure reaches a predetermined value, to make the power source maintain a pressure value for a set time, and after completing the pressure holding state, make the power source drive the housing reverse feed •俾 Separate the transfer mold from the formable material layer to achieve demolding and complete the entire transfer process. 2. The uniform pressure nano transfer method as described in item 1 of the scope of patent application, wherein the power source is fed at a multi-stage speed to drive the cover and apply pressure. 17692 ITRI.ptd Page 18 200522173 VI. Application for patent scope 3. The method of uniform pressure nano transfer as described in item 1 of the scope of patent application, wherein the transfer mold and the formable material are implemented at interchangeable positions . 4. The method of uniform pressure nano transfer as described in item 2 of the scope of the patent application, wherein when the power source is set to the position control mode, the position control of the nano pressure transfer device set in the uniform pressure is performed. The component determines its multi-stage speed switching point. 5. The uniform pressure nano transfer method as described in item 4 of the scope of patent application, wherein the position control element may be one of a limit switch, a photoelectric switch, a proximity switch, and any element having a position discrimination function. 6. The uniform pressure nano transfer method as described in item 2 of the scope of the patent application, wherein when the power source is set to the pressure control mode, the pressure sensing provided in the uniform pressure nano transfer device is used. The component determines its multi-stage speed switching point. 7. The method of uniform pressure nano transfer as described in item 6 of the scope of patent application, wherein the pressure sensing element can be used to detect a change in transfer pressure to discriminate between the transfer mold and the formable material layer The imprint depth. 8. The method of uniform pressure nano transfer as described in item 6 of the scope of patent application, wherein the pressure. Sensing element can be used to detect a change in transfer pressure to discriminate the transfer mold from a formable material. Separation between layers. 9. The uniform pressure nano transfer method according to item 1 of the scope of the patent application, wherein when the transfer mold is in contact with the formable material layer, the cover is separated from the first bearing unit. 1 〇. The uniform pressure nano transfer method as described in item 1 of the scope of patent application, wherein the power source may be a hydraulic drive system, a pneumatic drive system, 17692 Industrial Research Institute. Ptd Page 19 200522173 6. Scope of patent application One of the ball screw with servo motor, linear motor, and any power configuration with linear drive function. 11. The uniform pressure applying nano transfer method as described in item 1 of the scope of patent application, wherein the uniform pressure applying unit comprises a sealable elastic film and a fluid covered by the elastic film. 1 2. The uniform pressure nano transfer method as described in item 1 of the scope of the patent application, wherein the first load bearing unit and the second load bearing unit are provided with a temperature control element, and a transfer mold and a transfer mold may be provided in a timely manner. The forming material layer performs functions such as temperature rise and fall. _. A mold protection method for uniform pressure nano transfer is applied to a uniform pressure nano transfer device, wherein the uniform pressure nano transfer device includes a first load bearing a transfer mold. A unit, a uniform pressure applying unit next to the first load bearing unit, a non-fixed connection with the first load bearing unit and enveloping the first load bearing unit and the uniform pressure applying unit outer cover, and a power source for driving the outer cover feed ; And a second load-bearing unit for carrying a layer of formable material, the steps of protecting and controlling the device include: setting the moving source to a position control mode ^ to drive the feeding of the cover, and causing the cover to drive The first load bearing unit feeds toward the second load bearing unit; when the transfer mold on the first load bearing unit contacts the formable material layer on the fixed second load bearing unit, the power source is switched to pressure Control mode to determine whether the pressure value detected by the pressure sensing element is greater than a predetermined value, and when the pressure value is greater than a predetermined value, 17692 ITRI.ptd Page 20 200522173 VI. Patent Application Range The power source stops feeding; and the power source is reversely fed and returned to the starting position to protect the transfer mold. 14. The mold protection method as described in item 13 of the scope of patent application, wherein the pressure sensing element is transmitted by the force of the cover and the uniform pressure unit to detect the first load unit and the transfer in real time. Pressure between molds 0 17692 ITRI.ptd Page 21