200408340 玖、發明說明(1) 【發明所屬之技術領域】 本發明是有關於一種中心式導流散熱裝置，特別是指 一種可將溫度迅速傳輸的中心式導流散熱裝置。 【先前技術】 參閱第一圖，一傳統散溫裝置，是裝設在一位於一基 板11上的發溫源12頂部，該發溫源12可為一中央處理 器（CPU)、積體電路晶片（IC)、模組……等，該散溫裝 置包括一貼附在該發溫源12上的鋁散溫片u，及一吹向 該散溫片13的散熱風扇14,該散溫片13之底部設有一 銅金屬導溫片15 ;藉由銅金屬之較高溫度傳導係數將發 溫源12的表面溫度快速傳遞到該鋁散溫片13之翼片上， 以加大散溫面積方式獲致較佳的散溫效果，但是，上述散 溫效果實際上仍存有下述之缺失： 1 ·雖鋁金屬與銅金屬的溫度係數分別為218與418 其相互搭配的導溫效果仍不夠快，致使該散溫片13與 該發溫源12在溫度傳遞後，形成該發溫源12表面溫度仍 車乂同於政溫片13之溫度不一致情形，即散熱風扇14所吹 的風僅吹達散溫片13的外殼，無法到達發溫源12表面， 俗稱外部散溫之散溫效果不良者。 2 ·值得一提的是，當發溫源12在運作後，其表面 累積的温度會逐漸升高，但i，該傳統散溫裝置之外部散 溫功能無法及時降低該發溫源12之高工作溫度，將會影 曰忒t μ源12的工作穩定度，輕則使裝設發溫源12的電 腦產生田機情形，重則因工作溫度過高而發生損壞狀況。 200408340 玖、發明說明⑵ 【發明内容】 因此，本發明之目的，是在提供一種可將溫度迅速傳 輸的中心式導流散熱裝置。 於是，本發明之中心式導流散熱裝置，是裝設在一發 脈源上，該中心式導流散熱裝置包含一裝設在該發溫源上 的散熱機構，及一裝設在該散熱機構上的風扇機構。該散 熱機構包括一可貼設在該發溫源上的超熱傳導組合體、數 間隔環設在該超熱傳導組合體的翼片，及一環設在該等翼 片之外周側的外殼體，該外殼體具有至少一環設且貫穿在 其底部周側的入風口，該等入風口供導引外部空氣進入該 外殼體内。該風扇機構是可軸向脫離地裝設在該散熱機構 之外殼體的頂部；藉由該超熱傳導組合體將該發溫源之主 要熱源迅速在上傳導散熱手段’並用該風扇機構吸引外部 冷空氣由入風口呈由下往上並經可快速流竄的路徑構造， 集中吹向該超熱傳導組合體的主要散熱手段，以及透過多 數翼片之偌大散熱表面積的輔助疏散餘熱手段，終可獲致 最佳散熱效果者。 【實施方式】 本發明之前述以及其他技術内容、特點與優點，在以 下配合參考圖式之一（數）較佳實施例的詳細說明中，將可 清楚的明白。 在提出詳細說明之前，要注意的是，在以下的敘述中 ’類似之元件，是以相同標號來表示。 參閱第二、五圖，本發明之中心式導流散熱裝置2的 200408340 玫、發明說明⑶ 第一較佳實施例，是裝設在一發溫源3上，該發溫源3可 為一如中央處理器（CPU)、積體電路晶片（IC)、電路模 組···等及其他之發溫源；在本例中該發溫源3為一中央處 理裔；該中心式導流散熱裝置2包含一裝設在該發溫源3 上的政熱機構4、至少一裝设在該散熱機構4内的導溫體 5、一裝設在該散熱機構4之頂端上方的抽風式風扇機構 6 ’及塗覆該等導溫體5之導熱膏7。 參閱第三、四、五圖，該散熱機構4包括一可貼設在 該發溫源3上的超熱傳導組合體40，及數間隔環設在該 超熱傳導組合體40的翼片400。該超熱傳導組合體4〇, 包括一可貼設在該發溫源3上的圓形底盤8 (亦可為方形 或其他幾何形狀）、一垂設在該底盤8之一頂面82上的排 熱單元9,及一供套合於該底盤8之周環的底開口 1〇1與 一頂開口 102的中空外殼體100。 該底盤8，包括可貼設在該發溫源3上的底面81、一 相反於該底面81且朝一中心線向上漸縮彎弧形成的頂面 82，及至少一自其頂面82凹陷形成的底孔犯，在本例中 係形成四個底孔83。 該排熱單元9，具有一垂設在該底盤8之頂面82且 可供上述之翼# 4GG間隔環設在其外周側的散熱柱91， 且上述每兩相互鄰接之翼片4〇〇包覆界定出一通道4〇〇，。 /、男主一對應該底盤8之底孔 該散熱枉 9H ’每一翼片400具有一可抵接於該底盤8之頂面82 的導溫部4(H ’該等導溫部術搭配界定之凹弧狀底部 200408340 玖、發明說明⑷ 間402恰與該底盤8之凸弧狀頂面82相搭接。 該外殼體1〇〇,具有至少一環設且貫穿在其底部周側 的入風口 1 〇3，本例為環設多數入風口丨〇3，及至少二環 口又且貝牙在其頂部周側的卡孔丨，該等入風口 1 供導 引外部冷空氣進入該外殼體1〇〇内，並呈由下往上流竄經 該排熱單元9之通道400,（如第七圖之箭頭所示）；該入 風口 103兼可做為將外殼體1〇〇以扣具（圖未示）予以扣 固定位之卡扣孔。 該導溫體5，是裝設在該底盤8之底孔83與該散熱 柱91之散熱孔911包覆界定出之容置空間11〇内。該導 μ體5可為一超導棒或一熱管，在本例中係採用四根導溫 體5 ;尤當使用超導棒時，更可使該發溫源3之熱能迅速 往上傳導而獲致絕佳的傳熱效果。 該風扇機構6，是可軸向脫離地裝設在該散熱機構4 之外殼體100的頂開口 1〇2，並包括一風扇61、一環設在 該風扇61周側的圓環板62，及三自該圓環板62之底端 緣向下等距凸伸形成的卡栓63，該等卡栓63可脫離地卡 扣在该散熱機構4之外殼體1 〇〇的卡孔1 〇4内。 另外，该底盤8之底孔83與該散熱柱91之散熱孔 911包覆界定出一容置空間u〇，該容置空間11〇内之導 μ杈式手段依材料組構特性概分下列四種··其一，採用常 壓傳導方式’即其内灌滿由多種吸熱或發熱材料元素燒結 研磨混合構成的化合物；其二，為喷塗傳導方式，可在前 述之化a物中混合加入防止氧化元素後，對容置空間^ 〇 200408340 玖、發明說明(5) _予表面喷塗而成；其三’是傳統熱導方式，係在該 容置空間110内抽真空充填下列單一或混合材料··純水、 甲醇、丙酮、氨、氮、納、鐘......等或其他等效材料；其 四，係超熱傳導方式，是選自氫、鐘、納、鉀、鎮、約、 貝......等等，採多種元素燒結研磨混合而成，將容置 空間11(U由真空後再充填前述組成物而得。 值付一提的是，該等翼片400之導溫模式亦可運用前 述之噴塗傳導方式，其係將多種吸熱或發熱材料元素燒結 研磨混合構成的化合物，混合加入防止氧化元素後，對該 等翼片400之周環表面積施予表面喷塗而成。 又，參閱第六圖，本發明更包含一熱電式發電機12〇 ，在本例中為—致冷晶片，該熱電式發電機12G之位置使 其高溫表面121與該散熱機構4之散熱柱91頂端上表面 成熱接觸（接觸面加導熱膏），而熱電式發電機120之低 溫相對表面122則與一散熱片130之底表面132成熱接觸 (接觸面加導熱貧）’且熱電式發電機工經由—對導線 140連接該散熱片13〇上方之風扇機構6的風扇；當散熱 柱91之溫度上升時，位在散熱柱91與該散熱片間之 熱電式發電機120的兩相對表面121、122會產生一溫差 ’该溫差會使該熱電式發電機12〇產生一直流電壓，例如 當溫度達到- 50。(：定值時，該熱電式發電冑12〇所產生 之電壓及電流將使風扇動作，風扇之轉動讓冷氣流吹向散 熱片130使其降溫’致使更多的熱能自散熱柱91被取出 從而降低發溫源3的溫度；以及必要時可將二個或以上之 9 200408340 玖、發明說明⑹ 』 熱電式發電機12〇志姑+ 甲獲一起以增加電壓輸出；故熱電式發 電機120所產生雷< 电月b不但具有上述降溫冷卻功用，且可降 低電細糸統的功率消耗者。 " 一、四、五圖，當發溫源3之溫度上升時（ 譬如中央處理器工作時），藉由位於該底盤8與該排熱單 兀9内的導/皿體5 (本例中係採用超導棒），使該發溫源3 產主要熱祕由中,讀餘91迅速往上傳導與藉其 周U數翼片4〇〇之保大表面積輔助散溫；並用該風扇機 構9吸引外#冷空氣經由入風口 呈由下往上流經所設 計彎弧上揚且可供冷氣流快速流竄的路徑構造，匯集地吹 向该溫度最高的中心散熱柱91與該等翼片侧的主要散 熱手段1透過多數翼片4〇〇之诺大散熱表面積的輔助疏 散餘熱手段，故藉該風扇機構6之迅速抽離自入風口 ι〇3 進入而竄經外殼體_内之熱氣流，而獲致最佳散熱效果 ;值得一提的是，該等翼片400亦可設計為渦輪形狀（圖 未示）’亦可提供氣流一快速流竄的通路。 參閱第七圖，本發明的第二較佳實施例，不同於第一 較佳實施例的地方在於：該底盤8,具有一自該頂面82，凹 陷形成的底槽821，，該排熱單元9,之散熱柱91，具有一對 應該底槽821，的排熱槽912，，該底槽821，與該排熱槽 912’相互界定出一超熱傳導腔體15〇，該超熱傳導腔體 150内採用與前述相同之四種溫度傳導模式手段；此外， 參閱第八圖所示，該底盤8 ’與該排熱單元9，更可採精密 鑄造一體成型。 10 200408340 玖、發明說明⑺ ‘ 參閱第九圖’本發明之中心式導流散熱裝置2,的第 二較佳實施例，其與前例之^同處在於：該底盤8,與該排 熱槽9,之散熱柱91，採用精密鑄造模具一體成型内設超敎 傳導腔體150者；參閱第十、十-圖，本發明之第四較: 實施例’該底盤8，、該排熱單元9,之散熱柱91，與該等翼 片_係用精密鑄造-體成型，並且具有一由該底盤8，、、 該散熱柱91’與該等翼片4〇〇三者内部相互連通所界定出 的中空腔體160,該中空腔體16〇内採用與前述相同之四 種溫度傳導模式手段。 兹將本發明『中心式導流散熱裝置』2、2，的優點分 述如後： 本發明可使發溫源3之溫度上升時迅速擴散到該底盤 8、8’與該排熱單元9、9，上，並用該風扇機構9吸引外部 冷空氣經由人風π 1()3使氣流呈由下往上快速流竄的手段 ，集中吹向該溫度最高之散熱柱91與周環翼片4〇〇的主 要散熱手段，加上透過多數翼片400所構成之偌大散熱表 面積的辅助疏散餘熱手段，終可藉該風扇機構6迅速抽離 流竄經該外殼體100内之熱氣流而獲致最佳散熱效果者， 不同於傳統散溫裝置會發生該發溫源12表面溫度仍恆高 於該散溫片13溫度之不一致情形，相對本發明「中心式 導流散熱裝置」具有迅速達成全面性降溫的使用特性，且 不會影響該發溫源（如CPU)的工作穩定度。 惟，以上所揭露之圖示說明，僅為本案之四實施例而 已’舉凡熟悉本案該項技藝之人仕，其所依據本案精神範 11 200408340 玖、發明說_8) ^ 可所做之等效修飾或變化，皆應涵蓋在以下本案所述之申 清專利範圍内。 【圖式簡單說明】 第一圖是一傳統散溫裝置的一平面設置圖； 第二圖是本發明之中心式導流散熱裝置的第一較佳實 施例的一立體外觀圖； 第二圖是該第一較佳實施例的一立體分解圖； 第四圖是該第一較佳實施例的另一立體分解圖； 弟囷疋忒弟較佳實施例之一未完整的組合剖視圖 ， 第六圖是該第一較佳實施例的一使用示意圖，說明該 散熱機構之散熱柱頂端可依序裝設一熱電式發電機與一散 熱片，及熱電式發電機經由一對導線連接該風扇機構之風 扇； 第七圖是本發明之第二較佳實施例之一未完整的組合 剖視圖，說明該底盤之一底槽與該排熱單元之一排熱槽相 互界定出一超熱傳導腔體； 第八圖是該第二較佳實施例之一未完整的組合剖視圖 ’况明該底盤與該排熱單元更可採精密鑄造一體成型； 第九圖是本發明之笛c & 弟二較佳實施例之一未完整的分解 圖，說明該外殼體可軸向脱雜 π脫離於由該底盤與該排熱單元一 體成型製成的結構體； 第十圖是本發明之第四如 乐四lx佳實施例之一未完整的組合 剖視圖，說明該散熱柱、哕笠習u Λ a β專翼片與底盤係一體成型製成 12 200408340 玖、發明說明(9) 的結構體，並具有一由該散熱柱、該等翼片與底盤内部連 通界定出的中空腔體；及 第十一圖是該第四較佳實施例之一未完整的橫向剖視 圖。 13 200408340 玖、發明說明(10) 【圖式之主要元件代表符號簡單說明】 習用部分： 11 基板 12 發溫源 13 散溫片 14 散熱風扇 15 導溫片 本發明部分： 2 中心式導流散熱裝置 2 ’中心式導流散熱裝置 3 發溫源 4 散熱機構 40 超熱傳導組合體 5 導溫體 500 中空腔體 6 風扇機構 61 風扇 62 圓環體 63 卡栓 7 導熱膏 8 底盤 8， 底盤 81 底面 82 頂面 821’底槽 83 底孔 9 排熱單元 9， 排熱單元 91 散熱柱 91， 散熱柱 911 散熱孔 912’排熱槽 400 翼片 401 導溫部 402 底部空間 400’通道 100 外殼體 101 底開口 102 頂開口 103 入風口 104 卡孔 110 容置空間 120 熱電式發電機 121 表面 122 表面 130 散熱片 132 底表面 140 導線 150 超熱傳導腔體 160中空腔體 14200408340 (1) [Explanation of the invention] [Technical field to which the invention belongs] The present invention relates to a central diversion heat dissipation device, and particularly to a central diversion heat dissipation device capable of rapidly transmitting temperature. [Prior art] Referring to the first figure, a conventional temperature dispersing device is mounted on top of a hair temperature source 12 located on a substrate 11. The hair temperature source 12 may be a central processing unit (CPU) and integrated circuit. Chip (IC), module, etc., the heat dissipation device includes an aluminum heat sink u attached to the hair temperature source 12 and a heat dissipation fan 14 blowing to the heat sink 13 A copper metal temperature guide 15 is provided at the bottom of the sheet 13; the surface temperature of the heat source 12 is quickly transmitted to the wings of the aluminum diffuser sheet 13 by the higher temperature conductivity coefficient of the copper metal to increase the diffused temperature area. The method achieves better dispersion temperature effect, but the above dispersion temperature effect still has the following shortcomings: 1. Although the temperature coefficients of aluminum metal and copper metal are 218 and 418, respectively, the matching temperature-conduction effect is still insufficient. Fast, so that after the temperature transmission of the diffuser sheet 13 and the hair temperature source 12, the surface temperature of the hair temperature source 12 is still inconsistent with the temperature of the political temperature sheet 13, that is, the wind blown by the cooling fan 14 is only The shell of the diffuser temperature sheet 13 cannot reach the surface of the hair temperature source 12, which is commonly referred to as the external diffuser temperature. Poor results. 2 · It is worth mentioning that when the temperature source 12 is in operation, the accumulated temperature on the surface will gradually increase, but i, the external temperature function of the traditional temperature dispersion device cannot reduce the height of the temperature source 12 in time. The working temperature will affect the working stability of the 忒 t μ source 12. On the other hand, the computer equipped with the hair temperature source 12 will produce a field machine condition. On the other hand, the working temperature will be too high to cause damage. 200408340 发明, Description of the invention 发明 [Summary of the invention] Therefore, an object of the present invention is to provide a central diversion heat dissipation device capable of rapidly transmitting temperature. Therefore, the central diversion heat dissipation device of the present invention is installed on a pulse source. The central diversion heat dissipation device includes a heat dissipation mechanism installed on the hair temperature source, and a heat dissipation device installed on the heat source. Fan mechanism on the mechanism. The heat-dissipating mechanism includes a super-heat-conducting assembly capable of being attached to the hair temperature source, a plurality of spaced-apart fins provided on the super-heat-conducting combination, and an outer shell provided on the outer peripheral side of the fins. The outer casing has at least one air inlet which is looped and penetrates the bottom peripheral side thereof, and the air inlets are used to guide external air into the outer shell of the casing. The fan mechanism is axially detachably installed on the top of the outer casing of the heat dissipation mechanism; the main heat source of the heating source is quickly conducted with the heat dissipation means by the super heat conduction combination, and the fan mechanism is used to attract external cooling The air from the air inlet is constructed from the bottom to the top and can flow quickly. The main heat dissipation means focused on the super-heat conduction assembly and the auxiliary evacuation waste heat means through the large heat dissipation surface area of most fins will eventually achieve the most Good heat dissipation effect. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be clearly understood in the following detailed description of one or more preferred embodiments with reference to the accompanying drawings. Before proposing a detailed description, it should be noted that in the following description, similar elements are denoted by the same reference numerals. Referring to the second and fifth figures, the 20040340340 of the central diversion and heat dissipation device 2 of the present invention is described in the first preferred embodiment. It is installed on a hair temperature source 3, which may be a Such as central processing unit (CPU), integrated circuit chip (IC), circuit modules, etc. and other sources of temperature; in this example, the source 3 is a central processing family; the central diversion The heat dissipating device 2 includes a political heat mechanism 4 installed on the heat generating source 3, at least one temperature conducting body 5 installed in the heat dissipating mechanism 4, and a ventilation type installed above the top of the heat dissipating mechanism 4. The fan mechanism 6 ′ and the thermal conductive paste 7 coated with the temperature conducting bodies 5. Referring to the third, fourth, and fifth figures, the heat dissipation mechanism 4 includes a superheat conductive combination 40 that can be attached to the heating source 3, and a plurality of fins 400 provided on the superheat conductive combination 40 in spaced-apart rings. The super-heat-conducting assembly 40 includes a circular chassis 8 (which can also be a square or other geometric shape) that can be attached to the hair temperature source 3, and a vertical chassis 82 that is suspended on a top surface 82 of the chassis 8. The heat exhausting unit 9 and a hollow outer casing 100 for fitting into the bottom opening 101 and the top opening 102 of the peripheral ring of the chassis 8. The chassis 8 includes a bottom surface 81 that can be attached to the hair temperature source 3, a top surface 82 that is opposite to the bottom surface 81 and is formed by a tapered curved upward toward a center line, and at least one recess formed from the top surface 82. In this example, four bottom holes 83 are formed. The heat removal unit 9 has a heat dissipation column 91 which is perpendicularly disposed on the top surface 82 of the chassis 8 and can be provided with the above-mentioned wing # 4GG spacer ring on the outer peripheral side thereof, and each of the two adjacent fins 400 is adjacent to each other. The cladding defines a channel 400. / 、 A pair of male main body should be the bottom hole of the chassis 8 The heat sink 9H 'Each wing 400 has a temperature guide 4 (H' which can be abutted on the top surface 82 of the chassis 8) The concave arc-shaped bottom portion 200408340 发明, description of the invention ⑷ 402 just overlaps with the convex arc-shaped top surface 82 of the chassis 8. The outer casing 100 has at least one ring-shaped air inlet which passes through the peripheral side of the bottom. 1 〇3, in this example, there are a large number of air inlets, and at least two ring openings, and bayonet holes on the top side of the bay. These air inlets 1 are used to guide external cold air into the outer casing. Within 100, and passing through the channel 400 of the heat removal unit 9 from the bottom to the top (as shown by the arrow in the seventh figure); the air inlet 103 can also be used as a buckle for the outer casing 100 (Not shown in the figure) the buckle holes for buckle fixing position. The temperature-conducting body 5 is an accommodating space 11 which is defined by covering the bottom hole 83 of the chassis 8 and the cooling hole 911 of the cooling column 91. The conductive μ body 5 can be a superconducting rod or a heat pipe, in this case four temperature conducting bodies 5 are used; especially when a superconducting rod is used, the hair temperature source 3 can be further The heat energy is quickly conducted upward to obtain an excellent heat transfer effect. The fan mechanism 6 is axially detachably installed at the top opening 10 of the casing 100 outside the heat dissipation mechanism 4 and includes a fan 61 and a ring. A ring plate 62 provided on the peripheral side of the fan 61, and three latches 63 protruding downwardly and equidistantly from the bottom edge of the ring plate 62, and the latches 63 can be detachably latched to the heat sink. The mechanism 4 is outside the card hole 100 of the housing 100. In addition, the bottom hole 83 of the chassis 8 and the heat dissipation hole 911 of the heat dissipation column 91 cover and define an accommodation space u0, and the accommodation space 11 〇 The guiding μ-type means can be divided into the following four types according to the characteristics of the material composition. First, the atmospheric pressure conduction method is used, that is, it is filled with a compound composed of a variety of endothermic or heating material elements sintered and ground. It is a spray-conducting method. After mixing anti-oxidation elements in the aforementioned chemical a, the storage space is ^ 200200408340 玖, invention description (5) _ sprayed on the surface; the third is the traditional thermal The guide method is to vacuum fill the following single or mixed materials in the accommodation space 110. , Methanol, acetone, ammonia, nitrogen, sodium, bell, etc. or other equivalent materials; fourthly, it is a superheat conduction method, which is selected from hydrogen, bell, sodium, potassium, town, about, shellfish. ..... etc., it is made by sintering and grinding a variety of elements, and the accommodating space 11 (U is obtained by filling the foregoing composition after a vacuum. It is worth mentioning that the wing 400 has a temperature guide The mode can also use the aforementioned spraying conduction method, which is a compound formed by sintering and grinding a variety of endothermic or heating material elements, and adding anti-oxidation elements to the surface of the fins 400. Also, referring to the sixth figure, the present invention further includes a thermoelectric generator 12O, in this case-a cooling chip, the thermoelectric generator 12G is positioned such that its high-temperature surface 121 and the heat dissipation mechanism 4 dissipate heat. The top surface of the top of the column 91 is in thermal contact (contact surface plus thermal paste), while the low-temperature opposite surface 122 of the thermoelectric generator 120 is in thermal contact with the bottom surface 132 of a heat sink 130 (contact surface plus thermal conductivity) and the thermoelectric Generators are connected to the heat sink via a pair of wires 140 The fan of the fan mechanism 6 above 130; when the temperature of the heat radiation column 91 rises, a temperature difference will occur between the two opposite surfaces 121 and 122 of the thermoelectric generator 120 between the heat radiation column 91 and the heat sink. The thermoelectric generator 12 is caused to generate a DC voltage, for example, when the temperature reaches -50. (: At a fixed value, the voltage and current generated by the thermoelectric power generator 120 will cause the fan to operate. The rotation of the fan allows the cold air flow to blow to the heat sink 130 to cool it down, causing more heat energy to be taken out of the heat sink 91. Thereby, the temperature of the heating source 3 can be reduced; and two or more 9 200408340 发明, description of the invention 时 can be obtained together if necessary to increase the voltage output of the 12 thermocouple generator + Zhigu + 120; therefore, the thermoelectric generator 120 The generated lightning < electricity month b not only has the above-mentioned function of cooling and cooling, but also can reduce the power consumption of the electricity system. &Quot; Figures 1, 4, and 5 when the temperature of the heating source 3 rises (such as the central processing unit) When working), with the guide / plate body 5 (superconducting rod is used in this example) located in the chassis 8 and the heat exhaust unit 9, the main source of heat produced by the heat source 3 is in reading 91 quickly conducts upwards and uses the large surface area of its U-shaped fins to maintain a large surface area to assist the diffuse temperature; and uses the fan mechanism 9 to attract outside #cold air through the air inlet to flow upward from the bottom through the designed curved arc and can rise The structure of the path for the rapid flow of cold air flow to blow to the The highest temperature of the central cooling column 91 and the main heat dissipation means 1 on the side of these fins are through the auxiliary heat dissipation means of the large heat dissipation surface of the majority of the fins of 400. Therefore, the fan mechanism 6 is used to quickly remove the self-intake port. 〇3 Entering and passing through the hot air flow in the outer shell _ to obtain the best heat dissipation effect; it is worth mentioning that the fins 400 can also be designed in the shape of a turbine (not shown). Referring to the seventh figure, the second preferred embodiment of the present invention is different from the first preferred embodiment in that the chassis 8 has a bottom groove 821 formed from the top surface 82 and recessed, The heat radiation column 91 of the heat exhaust unit 9 has a pair of heat exhaust grooves 912 corresponding to the bottom groove 821, and the bottom groove 821 and the heat exhaust groove 912 'delimit a superheat conduction cavity 15 to each other. The super-heat-conducting cavity 150 adopts the same four temperature-conduction mode means as described above; in addition, referring to FIG. 8, the chassis 8 ′ and the heat-dissipating unit 9 can be integrally formed by precision casting. 10 200408340 玖、 Explanation of the invention ⑺ `` See Figure 9 '' The second preferred embodiment of the center-type flow-guiding and heat-dissipating device 2 of the invention is the same as that of the previous example: the chassis 8 and the heat-dissipating column 91 of the heat sink 9 are integrated in a precision casting mold. A super-conducting conductive cavity 150 is provided; referring to the tenth and tenth drawings, the fourth comparison of the present invention: Embodiment 'the chassis 8, the heat dissipation unit 9, the heat radiation column 91, and the fins_system It is formed by precision casting-body molding, and has a hollow cavity 160 defined by the chassis 8, the heat radiation column 91 'and the fins 400 internally interconnected with each other, and the hollow cavity 160. It adopts the same four temperature conduction mode means as described above. The advantages of the "central diversion heat dissipation device" 2 and 2 of the present invention are described as follows: The present invention can quickly spread the temperature of the heating source 3 when the temperature rises. Go to the chassis 8, 8 'and the heat removal units 9, 9, and use the fan mechanism 9 to attract external cold air through the human wind π 1 () 3 to make the air flow quickly from bottom to top, and focus on blowing The main heat dissipation means of the highest temperature heat dissipation column 91 and the peripheral ring fins 400, plus the majority of the wings The auxiliary heat evacuation means with a large heat dissipation surface area formed by 400 can finally get the best heat dissipation effect by using the fan mechanism 6 to quickly remove the hot air flow flowing through the outer casing 100, which is different from that of a conventional heat dissipation device. The inconsistency between the surface temperature of the temperature source 12 and the temperature of the diffuser sheet 13 is still inconsistent. Compared with the "central flow diversion device" of the present invention, it has the characteristics of quickly achieving comprehensive temperature reduction without affecting the temperature source ( (Such as CPU). However, the illustrations disclosed above are only the fourth embodiment of this case. 'For those who are familiar with the skill of this case, they are based on the spirit of this case 11 200408340 玖, invention theory _8) ^ can do, etc. Modifications or changes shall be covered within the scope of the patent application as described in this case. [Brief description of the drawings] The first figure is a plan view of a conventional heat dissipating device; the second figure is a three-dimensional appearance view of the first preferred embodiment of the central diversion heat dissipation device of the present invention; the second figure It is an exploded perspective view of the first preferred embodiment; FIG. 4 is another perspective exploded view of the first preferred embodiment; Figure 6 is a schematic diagram of the use of the first preferred embodiment, illustrating that a thermoelectric generator and a heat sink can be sequentially installed on the top of the heat dissipation column of the heat dissipation mechanism, and the thermoelectric generator is connected to the fan through a pair of wires. Fan of the mechanism; FIG. 7 is an incomplete combined sectional view of a second preferred embodiment of the present invention, illustrating that a bottom groove of the chassis and a heat exhaust groove of the heat exhaust unit define a super heat conduction cavity with each other The eighth figure is an incomplete combined cross-sectional view of one of the second preferred embodiments. 'It is clear that the chassis and the heat removal unit can be integrated by precision casting. The ninth figure is the flute c & One of the preferred embodiments is incomplete The entire exploded view illustrates that the outer shell can be axially decoupled from the structure formed by integrally forming the chassis and the heat exhaust unit; the tenth figure is the fourth embodiment of the fourth embodiment of the invention. An incomplete combined cross-sectional view showing that the cooling column, the U Λ a β special wing and the chassis are integrally formed into a structure of 12 200408340 玖, Invention Description (9), and has a cooling column, The fins communicate with the hollow cavity defined by the interior of the chassis; and Figure 11 is an incomplete transverse cross-sectional view of one of the fourth preferred embodiments. 13 200408340 发明, description of the invention (10) [Simplified explanation of the main symbols of the drawings] Conventional parts: 11 base plate 12 heating source 13 diffuser 14 cooling fan 15 temperature guide part of the present invention: 2 central diversion heat dissipation Device 2 'Central diversion heat sink 3 Temperature source 4 Cooling mechanism 40 Super-heat conductive assembly 5 Temperature conducting body 500 Hollow cavity 6 Fan mechanism 61 Fan 62 Ring body 63 Clamp 7 Thermal paste 8 Chassis 8, Chassis 81 Bottom surface 82 Top surface 821 'Bottom trough 83 Bottom hole 9 Exhaust heat unit 9, Exhaust unit 91 Radiator post 91, Radiator post 911 Radiator hole 912' Exhaust trough 400 Fin 401 Temperature guide 402 Bottom space 400 'Channel 100 Housing Body 101 Bottom opening 102 Top opening 103 Air inlet 104 Card hole 110 Receiving space 120 Thermoelectric generator 121 Surface 122 Surface 130 Heat sink 132 Bottom surface 140 Conductor 150 Super thermal conduction cavity 160 Hollow cavity 14