TH1901006827A - How to solder lasers and kits - Google Patents

Abstract

DEPCT63 A laser soldering method that can prevent burns of baseplates and fragile components. Ambient heat and residuals and so on, namely, the automatic soldering method using the automatic soldering station 40 is assembled with the unit. Laser soldering 1 and Z-axis drive unit 43, which is a unique automatic soldering method, consists of a process that aligns the height of the laser soldering unit 1 with the desired position. D1 irradiation diameter of laser light becomes large predetermined size. than the diameter of the solder droplet S and the process in which the laser beam is irradiated to the solder droplet S and then heated with a temperature at which the solvent component of the flux evaporates and the solder powder does not melt, and the process aligns the height of the laser solder assembly. to match the position D2 irradiation diameter of laser light becomes small predetermined size. than the diameter of the solder droplet S and the process in which a laser is irradiated to the solder droplet S is heated to the temperature at which the solder powder melts. and soldered and that machine set -------------------------------------------------- ---------

Claims (21)

1. DEPCT63 1. An automatic soldering method that uses an automatic soldering station combined with a laser soldering station. and the Z-axis drive unit that drives the laser soldering unit in the up-down direction. which is an automatic soldering method that has specific characteristics The laser soldering kit includes: The main unit that assembles the lower opening, the hole is used for shooting linked to the opening. The bottom and holes are used with light projection linked to the lower opening and An imaging unit that captures the workpiece through the hole is used with such imaging and mirrors. The laser unit is assembled with a single laser light source and The optical fiber that causes the laser light from the laser unit to hit the hole is used to project the light and A mirror that reflects or transmits the laser light and directs the light into the lower opening in conjunction with Reflects or transmits incident light to the lower aperture and directs it to the imaging unit. which includes The first height alignment process aligns the height of the laser soldering station with the The position where the irradiation diameter D1 of the laser becomes the predetermined size. A larger advance diameter of the solder droplet S at the case viewed from above by the machine set. drive the Z-axis and The pre-heating process that transmits the irradiation command signal to the laser assembly. The laser is irradiated on the solder droplet S and then heated to the temperature at which the solder component is made. melting of volatile flux and non-melting solder powder and The second height alignment process aligns the height of the laser soldering station with the The position where the irradiation diameter D2 of the laser becomes the predetermined size. An advance smaller than the diameter of the solder droplet S at the case viewed from above by the machine set. drive the Z-axis and The actual heating process that sends the instruction signal emits laser light with output power. high compared to the process of adding such pre-heating to the laser unit. Shine a laser on the solder droplet S and heat it to a temperature at which the solder powder melts and solder. 2. The automatic soldering method specified in Claim 1 is characterized by the arrangement process. The second straight height aligns the height of the laser soldering station in such a way that the light The laser emitted at such actual heating process is within the region of the electrode pad. 3. The automatic soldering method specified in Claim 2 with a specific characteristic is that drop solder S. is made to a size that does not fall within the boundaries of the electrode pads. 4. One of the automatic soldering methods specified in claims 1 to 3 is characterized as The height alignment process for one such designation determines the projection diameter D1 as such. Within the scope of 1.1 times - 2 times the diameter of the solder droplet S said 5. The automatic soldering method specified in Claim 4 is characterized by the arrangement process. The height of such a second determines the irradiation diameter of D2 such that it is within the scope. of 0.1 times -0.9 times the diameter of the solder droplet S thereof. 6. One of the automatic soldering methods specified in Claims 1 to 5 has a specification that The real heating process combines the process that produces the light output. Such lasers are increasing gradually. 7. The automatic soldering method specified in Claim 6 is characterized by the addition process. The actual heat radiates a laser with a constant power output for a predetermined time. Continuously, the output power of the said laser light is gradually increased. 8. Any of the automatic soldering methods specified in Claims 1 to 7 have a specific specification: Record a certain number of patterns of the diameter of the solder droplet S thereof, matching The projection diameters D1 and D2 correspond to those diameters and output power. of the laser beam and then carry out the process of aligning the height at one of them and the process Align those two heights depending on the selected pattern. 9. Any automatic soldering method specified in claims 1 to 8 with a specification is a kit. The apparatus was assembled in such a way that it was at the focal point at the aforementioned alignment process. 10. The automatic soldering machine unit that combines the laser soldering machine unit and the machine unit. Drive the Z-axis that drives the laser soldering unit in the upper-bottom direction and the control unit that Controls the operation of the laser soldering station and the Z-axis drive unit. which is a set of automatic soldering machines that have specific characteristics The laser soldering kit includes: The main unit that assembles the lower opening, the hole is used for shooting linked to the opening. The bottom and holes are used with light projection linked to the lower opening and An imaging unit that captures the workpiece through the hole is used with such imaging and mirrors. The laser unit is assembled with a single laser light source and The optical fiber that causes the laser light from the laser unit to hit the hole is used to project the light and A reflected mirror or two passes through the laser and directs the light into the lower opening in conjunction with the Reflects or transmits incident light to the lower aperture and directs it to the imaging unit. which the aforementioned control set operates The first height alignment process aligns the height of the laser soldering station with the The position where the irradiation diameter D1 of the laser becomes the predetermined size. A larger advance diameter of the solder droplet S at the case viewed from above by the machine set. drive the Z-axis and The pre-heating process that transmits the irradiation command signal to the laser assembly. The laser is irradiated on the solder droplet S and then heated to the temperature at which the solder component is made. melting of volatile flux and non-melting solder powder and The second height alignment process aligns the height of the laser soldering station with the The position where the irradiation diameter D2 of the laser becomes the predetermined size. An advance smaller than the diameter of the solder droplet S at the case viewed from above by the machine set. drive the Z-axis and The actual heating process that sends the instruction signal emits laser light with output power. high compared to the process of adding such pre-heating to the laser unit. Shine a laser on the solder droplet S and heat it to a temperature at which the solder powder melts and solder. 11. The automatic soldering machine set specified in Claim No. 10 with specifications is that The second height straightening process aligns the height of the laser soldering station in the The manner in which the laser light emitted at such an actual heating process is within the range of electrode pads 12. The automatic soldering kit specified in claim 10 or 11 with specifications is that The height alignment process for one such designation determines the projection diameter D1 as such. Within the scope of 1.1 times - 2 times the diameter of the solder droplet S said 13. The automatic soldering machine set specified in claim 12 with specifications is that The aforementioned second height straightening process determines the aforementioned irradiation diameter D2 as Within the scope of 0.1 times to 0.9 times the diameter of the solder droplet S said 14. Any of the automatic soldering kits specified in claims 10 to 13 that are The specificity is that the actual heating process includes the process that produces the power. The output of such laser light increases gradually. 15. The automatic soldering machine set specified in claim 14 with specifications is that The actual heating process irradiates a laser with a constant power output for a predetermined time. Consecutive advance preparations allow the laser output power to increase gradually. 16. Any of the automatic soldering kits specified in claims 10 to 15 that are Specifically, such imaging holes are perpendicular and laser beams are projected from the opening. The lower part, which is the terminal opening of the bottom of the hole, applies to such photography, and The projection hole is a horizontal hole and the mirror is placed at the intersection of the projection hole. with the aforementioned imaging with the aperture applied to the aforementioned irradiation. 17. Any of the automatic soldering kits specified in claims 10 to 16 that are Specifically, a fiber optic lens is placed between the mirror and the projection hole. And the photographic lens is placed between the mirror and the photographic aperture. 18. The automatic soldering kit specified in claim 17 is characterized by a lens used with Such shooting is a single focus lens and incorporates a positioning mechanism that enables It can be physically positioned relative to the aforementioned main unit of the aforementioned imaging unit. or that the lens used with such an optical fiber is a single focus lens and incorporates an adjustment mechanism. Positions that allow adjusting the position of the lens apply to such shooting. 19. The automatic soldering kit specified in claims 10 to 18, any of the characteristics The specificity is that the imaging unit is assembled in such a way that it meets the focal point in the alignment process. height to match those two 20. Any of the automatic soldering kits specified in claims 10 to 19 that have the characteristics Specifically, it is additionally assembled with a set of ejectors and The parts used to assemble the holder of the said laser soldering unit and the said ejector unit and were Linked to such Z-axis drive unit. 21. The automatic soldering kit specified in claim 20 with the specification is assembled. In addition, with the X-axis drive unit that the Z-axis drive unit is assembled. where the laser soldering unit and the ejector unit move at the same time. The said Z-axis drive set and the said X-axis drive set -------------------------------------------------- --------- ;