SU489775A1 - Composition for temporary protection of semiconductor wafers - Google Patents

Composition for temporary protection of semiconductor wafers

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Publication number
SU489775A1
SU489775A1 SU1941093A SU1941093A SU489775A1 SU 489775 A1 SU489775 A1 SU 489775A1 SU 1941093 A SU1941093 A SU 1941093A SU 1941093 A SU1941093 A SU 1941093A SU 489775 A1 SU489775 A1 SU 489775A1
Authority
SU
USSR - Soviet Union
Prior art keywords
composition
semiconductor wafers
temporary protection
temporary
protection
Prior art date
Application number
SU1941093A
Other languages
Russian (ru)
Inventor
Олег Андреевич Колмаков
Ольга Васильевна Агапитова
Юрий Иванович Николаев
Татьяна Сергеевна Лысенкова
Original Assignee
Предприятие П/Я В-8657
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я В-8657 filed Critical Предприятие П/Я В-8657
Priority to SU1941093A priority Critical patent/SU489775A1/en
Application granted granted Critical
Publication of SU489775A1 publication Critical patent/SU489775A1/en

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

3 Сравнительные данные свойств известного защитного состава и оиисываемого приведены в таблице. Поет,мет изобретени  Состав дл  временной защиты полупроводниковых пластин при резке их на кристаллы, содержащий поливинилацетат и низший спирт. 4 отличающийс  тем, что, с целью сокращени  времени сушки и исключени  набухани  пленки при обработке пластин водными суспензи ми, он дополнительно содержит метакриловую кислоту при следующем соотношении комнонентов, вес. ч.: Поливинилацетат8,7-11,1 Метакрилова  кислота5,4-6,7 Низший спирт100.3 Comparative data of the properties of the known protective composition and that determined are given in the table. Sings, met invention Composition for the temporary protection of semiconductor wafers when cutting them into crystals, containing polyvinyl acetate and lower alcohol. 4 characterized in that, in order to shorten the drying time and prevent the film from swelling when the plates are treated with aqueous suspensions, it additionally contains methacrylic acid in the following ratio of components, weight. h .: Polyvinyl acetate 8,7-11,1 Methacrylic acid 5.4-6.7 Lower alcohol 100.

SU1941093A 1973-06-25 1973-06-25 Composition for temporary protection of semiconductor wafers SU489775A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1941093A SU489775A1 (en) 1973-06-25 1973-06-25 Composition for temporary protection of semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1941093A SU489775A1 (en) 1973-06-25 1973-06-25 Composition for temporary protection of semiconductor wafers

Publications (1)

Publication Number Publication Date
SU489775A1 true SU489775A1 (en) 1975-10-30

Family

ID=20559107

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1941093A SU489775A1 (en) 1973-06-25 1973-06-25 Composition for temporary protection of semiconductor wafers

Country Status (1)

Country Link
SU (1) SU489775A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014164206A1 (en) * 2013-03-09 2014-10-09 John Moore Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014164206A1 (en) * 2013-03-09 2014-10-09 John Moore Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturing

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