SU1476628A1 - Electronic assembly - Google Patents

Abstract

The invention can be used, in particular, for air cooling of a radio electronic unit (EW). The SEM has a frame 4, on which subunits of electronic equipment are installed, air ducts 7 for cooling air flow, communicating with distribution channel 10, heat sinks 8 connected to heat-loaded elements 5 and profiled bimetals and located between heat-loaded elements 5 and printed circuit boards. EW is economical in operation due to the reduction of energy consumption. 1 il.

Description

The invention relates to electronics, in particular to the technique of air cooling, and can be used in devices for cooling electronic components.

The purpose of the invention is to increase the efficiency of the design by reducing energy consumption for cooling is provided by obtaining a given flow rate of cooling air for cooling.

The drawing shows a radio electronic unit, performances on elements in closed cases, general view.

The electronic unit contains a housing 1, equipped with an inlet 2 and an outlet 3 nozzles for supplying a flow of cooling air, connected to the pressure and exhaust ducts of the cooling system (not shown). A frame 4 is placed in the housing 1, on which subunits of electronic equipment are installed, made of heat-loaded power elements 5 located on printed circuit boards 6, which are load-bearing structures for heat-loaded elements. 5 and forming air ducts 7 for the passage of a flow of cooling air. The heat-loaded elements 5 are rigidly connected (for example, glued) with the heat sinks 8, which are also mounted on the printed circuit boards 6.

The heat sinks 8 may be individual or group, i.e. connect with one or several heat-loaded elements 5. Heat sinks 8 are inseparably connected (for example, pressed in, welded) with profiled guides visors 9 made of thermobimetal.

The air ducts 7 are in communication with the distribution channel 10 for the flow of cooling air through openings 11, to which guide profiled guards 9 are mounted cantileverly fixed at the inlets of the air ducts 7 at different levels, decreasing in the direction of the flow of cooling air.

Heat sinks 8 are located between the heat-loaded elements 5 and the boards 6 and are rigidly connected with them and with guide profiled visors 9 with the possibility of heat

1476628 2nd contact with them. The heat sinks 8 are made in the form of plates of heat-conducting material.

The electronic unit operates as follows.

Through the pipe 2, a flow of cooling air enters the distribution channel 10, which is distributed between the air ducts using 10 guiding profile peaks 7. The heat sinks 8 serve as heat energy accumulators from the heat-loaded elements 5. The heat15 flow is transferred from the heat-loaded elements 5 through the heat sinks to the profiled guides visors 9.

At normal temperature, the profiled canopies are maximally curved. While the aerodynamic resistance of the flow of cooling air at the entrance to the air ducts 7 as much as possible.

With an increase in temperature, the guided profiled visors 9 are gradually straightened in proportion to the overheating of the corresponding visor 9 relative to the normal temperature (shown in dashed lines in the drawing) and capture a greater amount of air.

Thus, the hottest heat-loaded elements 5 receive 35 the largest amount of cooling air. In order to prevent the first peaks in the course of the air flow from blocking the air access to the other air ducts 7, the peaks 9 are made different, namely, the lengths of the peaks .9 increase in the direction of the flow of cooling air through the distribution channel 10, which provides different levels of location peaks in the distribution channel 10, decreasing in. direction of flow of cooling air,

Claims (2)

50 claims 1. Radio-electronic unit containing a housing with a system of air ducts in communication with the distribution. a dividing channel for the cooling air flow, subunits installed in the case in the form of printed circuit boards with heat-loaded elements located in the air ducts of the housing, and heat sinks and cantilever guides mounted on the inputs of the air intake channels of the housing, the console ends of which are located in the distribution channel at different levels, decreasing in the direction of the flow of cooling air, which is due to the fact that, in order to increase the efficiency of the structure by reducing nergozatrat cooling, sunshields profiled guides made of thermostatic bimetals and the heat sink installed between the circuit boards and heat generation ·-conjugated elements are rigidly connected with them and the profiled guides visors, with thermal contact. 2. Block pop. 1, different. the fact that the heats of the subunits are made in the form of plates.