SG83769A1 - Method of preparing an integrated circuit package for laser marking - Google Patents
Method of preparing an integrated circuit package for laser markingInfo
- Publication number
- SG83769A1 SG83769A1 SG200000516A SG200000516A SG83769A1 SG 83769 A1 SG83769 A1 SG 83769A1 SG 200000516 A SG200000516 A SG 200000516A SG 200000516 A SG200000516 A SG 200000516A SG 83769 A1 SG83769 A1 SG 83769A1
- Authority
- SG
- Singapore
- Prior art keywords
- preparing
- integrated circuit
- circuit package
- laser marking
- marking
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200000516A SG83769A1 (en) | 2000-02-01 | 2000-02-01 | Method of preparing an integrated circuit package for laser marking |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200000516A SG83769A1 (en) | 2000-02-01 | 2000-02-01 | Method of preparing an integrated circuit package for laser marking |
Publications (1)
Publication Number | Publication Date |
---|---|
SG83769A1 true SG83769A1 (en) | 2001-10-16 |
Family
ID=20430521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200000516A SG83769A1 (en) | 2000-02-01 | 2000-02-01 | Method of preparing an integrated circuit package for laser marking |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG83769A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0199415A2 (en) * | 1985-04-22 | 1986-10-29 | Philips Electronics Uk Limited | Semiconductor device having a laser printable envelope |
US5262470A (en) * | 1990-11-07 | 1993-11-16 | Teijin Limited | Polyester resin composition |
US5985377A (en) * | 1996-01-11 | 1999-11-16 | Micron Technology, Inc. | Laser marking techniques |
-
2000
- 2000-02-01 SG SG200000516A patent/SG83769A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0199415A2 (en) * | 1985-04-22 | 1986-10-29 | Philips Electronics Uk Limited | Semiconductor device having a laser printable envelope |
US5262470A (en) * | 1990-11-07 | 1993-11-16 | Teijin Limited | Polyester resin composition |
US5985377A (en) * | 1996-01-11 | 1999-11-16 | Micron Technology, Inc. | Laser marking techniques |
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