SG83769A1 - Method of preparing an integrated circuit package for laser marking - Google Patents

Method of preparing an integrated circuit package for laser marking

Info

Publication number
SG83769A1
SG83769A1 SG200000516A SG200000516A SG83769A1 SG 83769 A1 SG83769 A1 SG 83769A1 SG 200000516 A SG200000516 A SG 200000516A SG 200000516 A SG200000516 A SG 200000516A SG 83769 A1 SG83769 A1 SG 83769A1
Authority
SG
Singapore
Prior art keywords
preparing
integrated circuit
circuit package
laser marking
marking
Prior art date
Application number
SG200000516A
Inventor
Hong Yu Zheng
Gnian Cher Lim
Jian Hong Zhao
Original Assignee
Gintic Inst Of Mfg Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gintic Inst Of Mfg Technology filed Critical Gintic Inst Of Mfg Technology
Priority to SG200000516A priority Critical patent/SG83769A1/en
Publication of SG83769A1 publication Critical patent/SG83769A1/en

Links

SG200000516A 2000-02-01 2000-02-01 Method of preparing an integrated circuit package for laser marking SG83769A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200000516A SG83769A1 (en) 2000-02-01 2000-02-01 Method of preparing an integrated circuit package for laser marking

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200000516A SG83769A1 (en) 2000-02-01 2000-02-01 Method of preparing an integrated circuit package for laser marking

Publications (1)

Publication Number Publication Date
SG83769A1 true SG83769A1 (en) 2001-10-16

Family

ID=20430521

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000516A SG83769A1 (en) 2000-02-01 2000-02-01 Method of preparing an integrated circuit package for laser marking

Country Status (1)

Country Link
SG (1) SG83769A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0199415A2 (en) * 1985-04-22 1986-10-29 Philips Electronics Uk Limited Semiconductor device having a laser printable envelope
US5262470A (en) * 1990-11-07 1993-11-16 Teijin Limited Polyester resin composition
US5985377A (en) * 1996-01-11 1999-11-16 Micron Technology, Inc. Laser marking techniques

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0199415A2 (en) * 1985-04-22 1986-10-29 Philips Electronics Uk Limited Semiconductor device having a laser printable envelope
US5262470A (en) * 1990-11-07 1993-11-16 Teijin Limited Polyester resin composition
US5985377A (en) * 1996-01-11 1999-11-16 Micron Technology, Inc. Laser marking techniques

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