SG152909A1 - Stacked die in die bga package - Google Patents

Stacked die in die bga package

Info

Publication number
SG152909A1
SG152909A1 SG200603129-8A SG2006031298A SG152909A1 SG 152909 A1 SG152909 A1 SG 152909A1 SG 2006031298 A SG2006031298 A SG 2006031298A SG 152909 A1 SG152909 A1 SG 152909A1
Authority
SG
Singapore
Prior art keywords
die
stacked
edge portion
recessed edge
bga package
Prior art date
Application number
SG200603129-8A
Inventor
Hock Chuan Tan
Thiam Chye Lim
Victor Cher Khng Tan
Chee Peng Neo
Michael Kian Shing Tan
Beng Chye Chew
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200603129-8A priority Critical patent/SG152909A1/en
Publication of SG152909A1 publication Critical patent/SG152909A1/en

Links

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  • Die Bonding (AREA)

Abstract

Stacked die assembly is provided for increasing semiconductor device density with semiconductor dies in stacked arrangement on a substrate. A substrate comprises a surface with terminal pads. A first die comprises a surface with bond pads. A bonding mechanism connects bond pads to terminal pads. A second die comprises a recessed edge portion along perimeter of die. The second die is disposed on the surface of the first die positioned within recessed edge portion. The recessed edge portion has a height for clearance of the first bonding mechanism extending from the bond pads of the first die.
SG200603129-8A 2002-01-09 2002-01-09 Stacked die in die bga package SG152909A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200603129-8A SG152909A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200603129-8A SG152909A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Publications (1)

Publication Number Publication Date
SG152909A1 true SG152909A1 (en) 2009-06-29

Family

ID=40847803

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200603129-8A SG152909A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package

Country Status (1)

Country Link
SG (1) SG152909A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3449640A (en) * 1967-03-24 1969-06-10 Itt Simplified stacked semiconductor device
US5837566A (en) * 1994-06-23 1998-11-17 Cubic Memory, Inc. Vertical interconnect process for silicon segments
US6297548B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3449640A (en) * 1967-03-24 1969-06-10 Itt Simplified stacked semiconductor device
US5837566A (en) * 1994-06-23 1998-11-17 Cubic Memory, Inc. Vertical interconnect process for silicon segments
US6297548B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications

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