SG152909A1 - Stacked die in die bga package - Google Patents
Stacked die in die bga packageInfo
- Publication number
- SG152909A1 SG152909A1 SG200603129-8A SG2006031298A SG152909A1 SG 152909 A1 SG152909 A1 SG 152909A1 SG 2006031298 A SG2006031298 A SG 2006031298A SG 152909 A1 SG152909 A1 SG 152909A1
- Authority
- SG
- Singapore
- Prior art keywords
- die
- stacked
- edge portion
- recessed edge
- bga package
- Prior art date
Links
Landscapes
- Die Bonding (AREA)
Abstract
Stacked die assembly is provided for increasing semiconductor device density with semiconductor dies in stacked arrangement on a substrate. A substrate comprises a surface with terminal pads. A first die comprises a surface with bond pads. A bonding mechanism connects bond pads to terminal pads. A second die comprises a recessed edge portion along perimeter of die. The second die is disposed on the surface of the first die positioned within recessed edge portion. The recessed edge portion has a height for clearance of the first bonding mechanism extending from the bond pads of the first die.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200603129-8A SG152909A1 (en) | 2002-01-09 | 2002-01-09 | Stacked die in die bga package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200603129-8A SG152909A1 (en) | 2002-01-09 | 2002-01-09 | Stacked die in die bga package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG152909A1 true SG152909A1 (en) | 2009-06-29 |
Family
ID=40847803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200603129-8A SG152909A1 (en) | 2002-01-09 | 2002-01-09 | Stacked die in die bga package |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG152909A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3449640A (en) * | 1967-03-24 | 1969-06-10 | Itt | Simplified stacked semiconductor device |
US5837566A (en) * | 1994-06-23 | 1998-11-17 | Cubic Memory, Inc. | Vertical interconnect process for silicon segments |
US6297548B1 (en) * | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
-
2002
- 2002-01-09 SG SG200603129-8A patent/SG152909A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3449640A (en) * | 1967-03-24 | 1969-06-10 | Itt | Simplified stacked semiconductor device |
US5837566A (en) * | 1994-06-23 | 1998-11-17 | Cubic Memory, Inc. | Vertical interconnect process for silicon segments |
US6297548B1 (en) * | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
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