SG132530A1 - Method and assembly for wafer positioning inspection - Google Patents
Method and assembly for wafer positioning inspectionInfo
- Publication number
- SG132530A1 SG132530A1 SG200507269-9A SG2005072699A SG132530A1 SG 132530 A1 SG132530 A1 SG 132530A1 SG 2005072699 A SG2005072699 A SG 2005072699A SG 132530 A1 SG132530 A1 SG 132530A1
- Authority
- SG
- Singapore
- Prior art keywords
- assembly
- wafer positioning
- positioning inspection
- inspection
- wafer
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200507269-9A SG132530A1 (en) | 2005-11-22 | 2005-11-22 | Method and assembly for wafer positioning inspection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200507269-9A SG132530A1 (en) | 2005-11-22 | 2005-11-22 | Method and assembly for wafer positioning inspection |
Publications (1)
Publication Number | Publication Date |
---|---|
SG132530A1 true SG132530A1 (en) | 2007-06-28 |
Family
ID=38787770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200507269-9A SG132530A1 (en) | 2005-11-22 | 2005-11-22 | Method and assembly for wafer positioning inspection |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG132530A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5393349A (en) * | 1991-08-16 | 1995-02-28 | Tokyo Electron Sagami Kabushiki Kaisha | Semiconductor wafer processing apparatus |
US6085967A (en) * | 1998-12-28 | 2000-07-11 | Eastman Kodak Company | Method of registrably aligning fabricated wafers preceding bonding |
US6237393B1 (en) * | 1999-07-30 | 2001-05-29 | International Business Machines Corporation | Wafer center alignment device and method of wafer alignment |
US6425280B1 (en) * | 1999-07-30 | 2002-07-30 | International Business Machines Corporation | Wafer alignment jig for wafer-handling systems |
-
2005
- 2005-11-22 SG SG200507269-9A patent/SG132530A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5393349A (en) * | 1991-08-16 | 1995-02-28 | Tokyo Electron Sagami Kabushiki Kaisha | Semiconductor wafer processing apparatus |
US6085967A (en) * | 1998-12-28 | 2000-07-11 | Eastman Kodak Company | Method of registrably aligning fabricated wafers preceding bonding |
US6237393B1 (en) * | 1999-07-30 | 2001-05-29 | International Business Machines Corporation | Wafer center alignment device and method of wafer alignment |
US6425280B1 (en) * | 1999-07-30 | 2002-07-30 | International Business Machines Corporation | Wafer alignment jig for wafer-handling systems |
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