SG132530A1 - Method and assembly for wafer positioning inspection - Google Patents

Method and assembly for wafer positioning inspection

Info

Publication number
SG132530A1
SG132530A1 SG200507269-9A SG2005072699A SG132530A1 SG 132530 A1 SG132530 A1 SG 132530A1 SG 2005072699 A SG2005072699 A SG 2005072699A SG 132530 A1 SG132530 A1 SG 132530A1
Authority
SG
Singapore
Prior art keywords
assembly
wafer positioning
positioning inspection
inspection
wafer
Prior art date
Application number
SG200507269-9A
Inventor
Singh Raja Salavam Bala
Original Assignee
Systems On Silicon Mfg Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Systems On Silicon Mfg Company filed Critical Systems On Silicon Mfg Company
Priority to SG200507269-9A priority Critical patent/SG132530A1/en
Publication of SG132530A1 publication Critical patent/SG132530A1/en

Links

SG200507269-9A 2005-11-22 2005-11-22 Method and assembly for wafer positioning inspection SG132530A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200507269-9A SG132530A1 (en) 2005-11-22 2005-11-22 Method and assembly for wafer positioning inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200507269-9A SG132530A1 (en) 2005-11-22 2005-11-22 Method and assembly for wafer positioning inspection

Publications (1)

Publication Number Publication Date
SG132530A1 true SG132530A1 (en) 2007-06-28

Family

ID=38787770

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200507269-9A SG132530A1 (en) 2005-11-22 2005-11-22 Method and assembly for wafer positioning inspection

Country Status (1)

Country Link
SG (1) SG132530A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393349A (en) * 1991-08-16 1995-02-28 Tokyo Electron Sagami Kabushiki Kaisha Semiconductor wafer processing apparatus
US6085967A (en) * 1998-12-28 2000-07-11 Eastman Kodak Company Method of registrably aligning fabricated wafers preceding bonding
US6237393B1 (en) * 1999-07-30 2001-05-29 International Business Machines Corporation Wafer center alignment device and method of wafer alignment
US6425280B1 (en) * 1999-07-30 2002-07-30 International Business Machines Corporation Wafer alignment jig for wafer-handling systems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393349A (en) * 1991-08-16 1995-02-28 Tokyo Electron Sagami Kabushiki Kaisha Semiconductor wafer processing apparatus
US6085967A (en) * 1998-12-28 2000-07-11 Eastman Kodak Company Method of registrably aligning fabricated wafers preceding bonding
US6237393B1 (en) * 1999-07-30 2001-05-29 International Business Machines Corporation Wafer center alignment device and method of wafer alignment
US6425280B1 (en) * 1999-07-30 2002-07-30 International Business Machines Corporation Wafer alignment jig for wafer-handling systems

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