SG11202107874TA - Information processing system, information processing method, program, and substrate processing apparatus - Google Patents
Information processing system, information processing method, program, and substrate processing apparatusInfo
- Publication number
- SG11202107874TA SG11202107874TA SG11202107874TA SG11202107874TA SG11202107874TA SG 11202107874T A SG11202107874T A SG 11202107874TA SG 11202107874T A SG11202107874T A SG 11202107874TA SG 11202107874T A SG11202107874T A SG 11202107874TA SG 11202107874T A SG11202107874T A SG 11202107874TA
- Authority
- SG
- Singapore
- Prior art keywords
- information processing
- program
- substrate
- processing apparatus
- processing system
- Prior art date
Links
- 230000010365 information processing Effects 0.000 title 2
- 238000003672 processing method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
- G06N20/20—Ensemble learning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
- G06F17/15—Correlation function computation including computation of convolution operations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Software Systems (AREA)
- Mathematical Physics (AREA)
- Data Mining & Analysis (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Mathematical Analysis (AREA)
- Pure & Applied Mathematics (AREA)
- Mathematical Optimization (AREA)
- Computational Mathematics (AREA)
- Medical Informatics (AREA)
- Mechanical Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Computational Linguistics (AREA)
- Power Engineering (AREA)
- Biophysics (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Algebra (AREA)
- Databases & Information Systems (AREA)
- General Factory Administration (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Complex Calculations (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019010209A JP7220573B2 (en) | 2019-01-24 | 2019-01-24 | Information processing system, information processing method, program and substrate processing apparatus |
PCT/JP2019/047317 WO2020153001A1 (en) | 2019-01-24 | 2019-12-04 | Information processing system, information processing method, program, and substrate processing device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202107874TA true SG11202107874TA (en) | 2021-08-30 |
Family
ID=71736336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202107874TA SG11202107874TA (en) | 2019-01-24 | 2019-12-04 | Information processing system, information processing method, program, and substrate processing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220093409A1 (en) |
JP (1) | JP7220573B2 (en) |
KR (1) | KR20210118128A (en) |
CN (1) | CN113329845B (en) |
SG (1) | SG11202107874TA (en) |
TW (1) | TW202042963A (en) |
WO (1) | WO2020153001A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020131353A (en) * | 2019-02-19 | 2020-08-31 | パナソニックIpマネジメント株式会社 | Polishing system, learning device, and learning method of learning device |
JP2024503978A (en) * | 2020-12-18 | 2024-01-30 | アプライド マテリアルズ インコーポレイテッド | Adaptable slurry dispensing system |
JPWO2022138272A1 (en) * | 2020-12-25 | 2022-06-30 | ||
JP2022162709A (en) * | 2021-04-13 | 2022-10-25 | 株式会社Screenホールディングス | Substrate processing device, substrate processing system, and data processing method |
KR20240024919A (en) * | 2021-06-22 | 2024-02-26 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing method and polishing device |
WO2023166991A1 (en) * | 2022-03-01 | 2023-09-07 | 株式会社荏原製作所 | Information processing device, inference device, machine learning device, information processing method, inference method, and machine learning method |
KR20230137613A (en) | 2022-03-22 | 2023-10-05 | 사회복지법인 삼성생명공익재단 | Tumor classification method based on learning model using hip x-ray and analysis apparatus |
WO2023230517A1 (en) * | 2022-05-27 | 2023-11-30 | Onto Innovation Inc. | Performance management of semiconductor substrate tools |
JP2024015933A (en) * | 2022-07-25 | 2024-02-06 | 株式会社荏原製作所 | Information processing device, machine learning device, information processing method, and machine learning method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5664066A (en) * | 1992-11-09 | 1997-09-02 | The United States Of America As Represented By The United States Department Of Energy | Intelligent system for automatic feature detection and selection or identification |
US6439964B1 (en) | 1999-10-12 | 2002-08-27 | Applied Materials, Inc. | Method of controlling a polishing machine |
TWI264043B (en) * | 2002-10-01 | 2006-10-11 | Tokyo Electron Ltd | Method and system for analyzing data from a plasma process |
US7001243B1 (en) * | 2003-06-27 | 2006-02-21 | Lam Research Corporation | Neural network control of chemical mechanical planarization |
JP5353443B2 (en) * | 2009-05-25 | 2013-11-27 | 株式会社Jvcケンウッド | Data classifier creation device, data classifier, data classifier creation method, data classification method, data classifier creation program, data classification program |
JP2012074574A (en) * | 2010-09-29 | 2012-04-12 | Hitachi Ltd | Control system for processing apparatus and method for controlling processing apparatus |
US8954184B2 (en) * | 2011-01-19 | 2015-02-10 | Tokyo Electron Limited | Tool performance by linking spectroscopic information with tool operational parameters and material measurement information |
CN104583712B (en) * | 2012-08-15 | 2017-12-01 | 诺威量测设备股份有限公司 | Optical metrology in site measurement |
US10386828B2 (en) * | 2015-12-17 | 2019-08-20 | Lam Research Corporation | Methods and apparatuses for etch profile matching by surface kinetic model optimization |
SG11201902651QA (en) * | 2016-10-18 | 2019-05-30 | Ebara Corp | Substrate processing control system, substrate processing control method, and program |
US10262910B2 (en) * | 2016-12-23 | 2019-04-16 | Lam Research Corporation | Method of feature exaction from time-series of spectra to control endpoint of process |
-
2019
- 2019-01-24 JP JP2019010209A patent/JP7220573B2/en active Active
- 2019-12-03 TW TW108144087A patent/TW202042963A/en unknown
- 2019-12-04 WO PCT/JP2019/047317 patent/WO2020153001A1/en active Application Filing
- 2019-12-04 US US17/425,195 patent/US20220093409A1/en active Pending
- 2019-12-04 CN CN201980090127.8A patent/CN113329845B/en active Active
- 2019-12-04 SG SG11202107874TA patent/SG11202107874TA/en unknown
- 2019-12-04 KR KR1020217026411A patent/KR20210118128A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN113329845A (en) | 2021-08-31 |
JP7220573B2 (en) | 2023-02-10 |
TW202042963A (en) | 2020-12-01 |
WO2020153001A1 (en) | 2020-07-30 |
KR20210118128A (en) | 2021-09-29 |
CN113329845B (en) | 2023-07-25 |
JP2020120004A (en) | 2020-08-06 |
US20220093409A1 (en) | 2022-03-24 |
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