SG11202006592VA - Method for manufacturing semiconductor device, film adhesive and adhesive sheet - Google Patents

Method for manufacturing semiconductor device, film adhesive and adhesive sheet

Info

Publication number
SG11202006592VA
SG11202006592VA SG11202006592VA SG11202006592VA SG11202006592VA SG 11202006592V A SG11202006592V A SG 11202006592VA SG 11202006592V A SG11202006592V A SG 11202006592VA SG 11202006592V A SG11202006592V A SG 11202006592VA SG 11202006592V A SG11202006592V A SG 11202006592VA
Authority
SG
Singapore
Prior art keywords
adhesive
semiconductor device
manufacturing semiconductor
adhesive sheet
film
Prior art date
Application number
SG11202006592VA
Inventor
Kenta Kikuchi
Yuki Nakamura
Shintaro Hashimoto
Tomoharu Yamazaki
Daisuke MASUNO
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11202006592VA publication Critical patent/SG11202006592VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG11202006592VA 2018-01-30 2018-01-30 Method for manufacturing semiconductor device, film adhesive and adhesive sheet SG11202006592VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/003027 WO2019150448A1 (en) 2018-01-30 2018-01-30 Method for manufacturing semiconductor device, film adhesive and adhesive sheet

Publications (1)

Publication Number Publication Date
SG11202006592VA true SG11202006592VA (en) 2020-08-28

Family

ID=67479168

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202006592VA SG11202006592VA (en) 2018-01-30 2018-01-30 Method for manufacturing semiconductor device, film adhesive and adhesive sheet

Country Status (6)

Country Link
JP (1) JP7067570B2 (en)
KR (1) KR102429209B1 (en)
CN (1) CN111630640B (en)
SG (1) SG11202006592VA (en)
TW (1) TWI774916B (en)
WO (1) WO2019150448A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021072375A (en) * 2019-10-31 2021-05-06 昭和電工マテリアルズ株式会社 Support tape for substrate transfer, and manufacturing method for electronic apparatus device
WO2022034854A1 (en) * 2020-08-11 2022-02-17 昭和電工マテリアルズ株式会社 Semiconductor device and method for manufacturing same
WO2023181397A1 (en) * 2022-03-25 2023-09-28 株式会社レゾナック Adhesive film for semiconductor, dicing die-bonding film, and method for manufacturing semiconductor device

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5236134B2 (en) 2001-01-26 2013-07-17 日立化成株式会社 Adhesive composition, adhesive member, semiconductor mounting support member, semiconductor device, etc.
JP2005103180A (en) 2003-10-02 2005-04-21 Matsushita Electric Ind Co Ltd Washing machine
JP5380806B2 (en) * 2006-08-31 2014-01-08 日立化成株式会社 Adhesive sheet, integrated sheet, semiconductor device, and method for manufacturing semiconductor device
JP2009046629A (en) * 2007-08-22 2009-03-05 Hitachi Chem Co Ltd Adhesive composition, film adhesive, and semiconductor device using the same
JP5524465B2 (en) 2007-10-24 2014-06-18 日立化成株式会社 Adhesive sheet, semiconductor device using the same, and manufacturing method thereof
JP2010118554A (en) * 2008-11-13 2010-05-27 Nec Electronics Corp Semiconductor device and method of manufacturing the same
US20130011683A1 (en) * 2010-03-24 2013-01-10 Busman Stanley C Optical assembly having a display panel and methods of making and disassembling same
KR20130064043A (en) * 2010-04-13 2013-06-17 세키스이가가쿠 고교가부시키가이샤 Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device
JP5385988B2 (en) * 2010-08-23 2014-01-08 積水化学工業株式会社 Adhesive sheet and semiconductor chip mounting method
US20120064198A1 (en) * 2010-09-15 2012-03-15 3M Innovative Properties Company Labels for produce
JP2012153851A (en) * 2011-01-28 2012-08-16 Hitachi Chemical Co Ltd Semiconductor device and film-shaped adhesive
JP5736899B2 (en) * 2011-03-28 2015-06-17 日立化成株式会社 Film adhesive, adhesive sheet and semiconductor device
JP5834662B2 (en) * 2011-09-13 2015-12-24 日立化成株式会社 Film adhesive, adhesive sheet, semiconductor device and manufacturing method thereof
JP5877087B2 (en) * 2012-02-24 2016-03-02 古河電気工業株式会社 Adhesive film and wafer processing tape
JP6133542B2 (en) * 2012-02-29 2017-05-24 日立化成株式会社 Film adhesive, adhesive sheet and semiconductor device
JP5978725B2 (en) * 2012-04-11 2016-08-24 日立化成株式会社 Manufacturing method of semiconductor device
JP5924145B2 (en) * 2012-06-12 2016-05-25 日立化成株式会社 Film adhesive, adhesive sheet, and method for manufacturing semiconductor device
JP6135202B2 (en) 2013-03-08 2017-05-31 日立化成株式会社 Semiconductor device and manufacturing method of semiconductor device
KR102310226B1 (en) * 2013-12-24 2021-10-08 닛토덴코 가부시키가이샤 Adhesive film, dicing·die bond film, manufacturing method for semiconductor device, and semiconductor device
JP2015122425A (en) 2013-12-24 2015-07-02 日東電工株式会社 Method for manufacturing semiconductor device, semiconductor device, adhesive film for embedding use, and dicing/die-bonding film
JP6337480B2 (en) * 2014-01-27 2018-06-06 Dic株式会社 Adhesive tape, articles and electronic equipment
US9698374B2 (en) * 2014-11-12 2017-07-04 Lg Chem, Ltd. Pressure sensitive adhesive film
JP6662074B2 (en) * 2016-02-05 2020-03-11 日立化成株式会社 Adhesive film
CN109041580A (en) * 2016-03-30 2018-12-18 琳得科株式会社 The manufacturing method of film-like adhesive, sheet for processing semiconductor and semiconductor device
JP6530729B2 (en) * 2016-05-11 2019-06-12 日本特殊陶業株式会社 Method of producing semi-cured adhesive, and method of producing composite

Also Published As

Publication number Publication date
CN111630640A (en) 2020-09-04
WO2019150448A1 (en) 2019-08-08
TW201936863A (en) 2019-09-16
KR102429209B1 (en) 2022-08-03
JP7067570B2 (en) 2022-05-16
CN111630640B (en) 2023-04-28
JPWO2019150448A1 (en) 2021-01-28
TWI774916B (en) 2022-08-21
KR20200112819A (en) 2020-10-05

Similar Documents

Publication Publication Date Title
PT3572478T (en) Adhesive film, and method for manufacturing electronic device
EP3442010A4 (en) Adhesive film for use in semiconductor device manufacturing, and semiconductor device manufacturing method
EP3351605A4 (en) First protective film forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip
EP3742870A4 (en) Flexible substrate, electronic device, and method for manufacturing electronic device
EP3309822A4 (en) Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package
SG11202005787TA (en) Release film-equipped pressure sensitive adhesive sheet and method for manufacturing the same
EP3730567A4 (en) Silicone-based adhesive sheet, multilayer structure including same, and method for producing semiconductor device
EP3832733A4 (en) Semiconductor device and method for manufacturing same
SG11202007053XA (en) Manufacturing method for semiconductor device, and adhesive film
SG11202006592VA (en) Method for manufacturing semiconductor device, film adhesive and adhesive sheet
SG11202109506YA (en) Adhesive agent composition, film-like adhesive agent, adhesive sheet, and semiconductor device manufacturing method
EP3886178A4 (en) Semiconductor device and method for manufacturing semiconductor device
SG11202106221PA (en) Method for evaluating photocurable adhesive, dicing/die attach film, method for manufacturing same, and method for manufacturing semiconductor device
EP3745449A4 (en) Semiconductor device and method for manufacturing semiconductor device
SG11202110162UA (en) Method for manufacturing semiconductor device having dolmen structure, method for manufacturing support piece, and laminated film
SG11202111595PA (en) Adhesive film and method for manufacturing electronic device
SG11202005798WA (en) Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same
SG11202006826WA (en) Adhesive composition, filmy adhesive, adhesive sheet, and production method for semiconductor device
SG11202002552PA (en) Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device
SG11201605819SA (en) Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same
EP3869548A4 (en) Semiconductor device, and method for manufacturing same
EP3742495A4 (en) Semiconductor device and method for manufacturing semiconductor device
SG11202108023SA (en) Filmy adhesive, adhesive sheet, semiconductor device, and method for manufacturing same
SG11202103066SA (en) Film-shaped adhesive, adhesive sheet, semiconductor device, and production method for semiconductor device
SG11202109887QA (en) Production method for semiconductor device, die-bonding film, and dicing/die-bonding integrated adhesive sheet