SG11202004420QA - Photoresist remover compositions - Google Patents

Photoresist remover compositions

Info

Publication number
SG11202004420QA
SG11202004420QA SG11202004420QA SG11202004420QA SG11202004420QA SG 11202004420Q A SG11202004420Q A SG 11202004420QA SG 11202004420Q A SG11202004420Q A SG 11202004420QA SG 11202004420Q A SG11202004420Q A SG 11202004420QA SG 11202004420Q A SG11202004420Q A SG 11202004420QA
Authority
SG
Singapore
Prior art keywords
photoresist remover
remover compositions
compositions
photoresist
remover
Prior art date
Application number
SG11202004420QA
Inventor
Robert Arent
Hengpeng Wu
Guanyang Lin
Original Assignee
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh filed Critical Merck Patent Gmbh
Publication of SG11202004420QA publication Critical patent/SG11202004420QA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02—Anionic compounds
    • C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
    • C11D1/22—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aromatic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C11D1/721—End blocked ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/83—Mixtures of non-ionic with anionic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C11D3/2082—Polycarboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3454—Organic compounds containing sulfur containing sulfone groups, e.g. vinyl sulfones
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/007—Heating the liquid
    • C11D2111/22—
SG11202004420QA 2018-01-25 2019-01-23 Photoresist remover compositions SG11202004420QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862621760P 2018-01-25 2018-01-25
PCT/EP2019/051534 WO2019145312A1 (en) 2018-01-25 2019-01-23 Photoresist remover compositions

Publications (1)

Publication Number Publication Date
SG11202004420QA true SG11202004420QA (en) 2020-06-29

Family

ID=65228539

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004420QA SG11202004420QA (en) 2018-01-25 2019-01-23 Photoresist remover compositions

Country Status (7)

Country Link
US (1) US11365379B2 (en)
EP (1) EP3743773B1 (en)
JP (2) JP7175316B2 (en)
KR (1) KR102448220B1 (en)
CN (1) CN111512239B (en)
SG (1) SG11202004420QA (en)
WO (1) WO2019145312A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201936575A (en) * 2018-01-25 2019-09-16 德商馬克專利公司 Photoresist remover compositions
KR102448220B1 (en) 2018-01-25 2022-09-27 메르크 파텐트 게엠베하 Photoresist Remover Composition

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2455076A1 (en) 1979-04-24 1980-11-21 Rhone Poulenc Ind Photoresist removing compsn. - comprises tetra:hydro:naphthalene and/or cyclohexanone, and organic acid
US4971715A (en) * 1988-11-18 1990-11-20 International Business Machines Corporation Phenolic-free stripping composition and use thereof
US5885901A (en) 1994-08-11 1999-03-23 Texas Instruments Incorporated Rinsing solution after resist stripping process and method for manufacturing semiconductor device
US6323168B1 (en) * 1996-07-03 2001-11-27 Advanced Technology Materials, Inc. Post plasma ashing wafer cleaning formulation
JPH1055993A (en) 1996-08-09 1998-02-24 Hitachi Ltd Semiconductor element manufacturing washing liquid and manufacture of semiconductor element using it
US6231677B1 (en) 1998-02-27 2001-05-15 Kanto Kagaku Kabushiki Kaisha Photoresist stripping liquid composition
KR100538501B1 (en) * 1999-08-16 2005-12-23 신에쓰 가가꾸 고교 가부시끼가이샤 Novel Onium Salts, Photoacid Generators for Resist Compositions, Resist Compositions and Patterning Process
US6486108B1 (en) 2000-05-31 2002-11-26 Micron Technology, Inc. Cleaning composition useful in semiconductor integrated circuit fabrication
US6576394B1 (en) 2000-06-16 2003-06-10 Clariant Finance (Bvi) Limited Negative-acting chemically amplified photoresist composition
US6699825B2 (en) 2001-01-12 2004-03-02 S.C. Johnson & Son, Inc. Acidic hard-surface antimicrobial cleaner
US6551973B1 (en) 2001-10-09 2003-04-22 General Chemical Corporation Stable metal-safe stripper for removing cured negative-tone novolak and acrylic photoresists and post-etch residue
JP3787085B2 (en) 2001-12-04 2006-06-21 関東化学株式会社 Composition for removing photoresist residue
US20040248039A1 (en) * 2003-05-08 2004-12-09 Sounik James R. Photoresist compositions and processes for preparing the same
KR20050120914A (en) * 2004-06-21 2005-12-26 주식회사 동진쎄미켐 Composition for removing a (photo)resist
JP4776191B2 (en) 2004-08-25 2011-09-21 関東化学株式会社 Photoresist residue and polymer residue removal composition, and residue removal method using the same
US7700533B2 (en) * 2005-06-23 2010-04-20 Air Products And Chemicals, Inc. Composition for removal of residue comprising cationic salts and methods using same
US7601482B2 (en) 2006-03-28 2009-10-13 Az Electronic Materials Usa Corp. Negative photoresist compositions
US8288330B2 (en) 2006-05-26 2012-10-16 Air Products And Chemicals, Inc. Composition and method for photoresist removal
JP2010524208A (en) * 2007-03-31 2010-07-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Method for stripping material for wafer reclamation
US20100112728A1 (en) 2007-03-31 2010-05-06 Advanced Technology Materials, Inc. Methods for stripping material for wafer reclamation
US20100183853A1 (en) * 2007-06-12 2010-07-22 Takashi Ihara Stripping agent for resist film on/above conductive polymer, method for stripping resist film, and substrate having patterned conductive polymer
TW200940706A (en) 2007-10-29 2009-10-01 Ekc Technology Inc Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions
CN101883688A (en) * 2007-11-16 2010-11-10 Ekc技术公司 Compositions for removal of metal hard mask etching residues from a semiconductor substrate
JP5195063B2 (en) * 2008-06-19 2013-05-08 東ソー株式会社 Resist stripper
KR20110063845A (en) 2008-10-02 2011-06-14 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Use of surfactant/defoamer mixtures for enhanced metals loading and surface passivation of silicon substrates
US8754021B2 (en) * 2009-02-27 2014-06-17 Advanced Technology Materials, Inc. Non-amine post-CMP composition and method of use
JP5657318B2 (en) * 2010-09-27 2015-01-21 富士フイルム株式会社 Semiconductor substrate cleaning agent, cleaning method using the same, and semiconductor device manufacturing method
JP6014985B2 (en) * 2010-10-01 2016-10-26 三菱化学株式会社 Substrate cleaning solution for semiconductor device and cleaning method
SG10201508015RA (en) 2010-10-06 2015-10-29 Entegris Inc Composition and process for selectively etching metal nitrides
WO2012154498A2 (en) 2011-05-06 2012-11-15 Advanced Technology Materials, Inc. Removal of metal impurities from silicon surfaces for solar cell and semiconductor applications
FR2976290B1 (en) 2011-06-09 2014-08-15 Jerome Daviot COMPOSITION OF SOLUTIONS AND CONDITIONS OF USE FOR THE COMPLETE REMOVAL AND DISSOLUTION OF PHOTO-LITHOGRAPHIC RESINS
US9546321B2 (en) * 2011-12-28 2017-01-17 Advanced Technology Materials, Inc. Compositions and methods for selectively etching titanium nitride
JP2015512971A (en) * 2012-02-15 2015-04-30 インテグリス，インコーポレイテッド Post-CMP removal using composition and method of use
US9090859B2 (en) 2012-03-27 2015-07-28 Sachem, Inc. Quaternary ammonium hydroxides
JP6157081B2 (en) * 2012-09-24 2017-07-05 東京応化工業株式会社 Stripping solution for photolithography and pattern forming method
US9536730B2 (en) * 2012-10-23 2017-01-03 Air Products And Chemicals, Inc. Cleaning formulations
US20160075971A1 (en) * 2013-04-22 2016-03-17 Advanced Technology Materials, Inc. Copper cleaning and protection formulations
CN105683336A (en) * 2013-06-06 2016-06-15 高级技术材料公司 Compositions and methods for selectively etching titanium nitride
CN103336412B (en) * 2013-07-03 2017-02-08 北京科华微电子材料有限公司 Novel photoresist stripper and application technology thereof
US10460954B2 (en) * 2014-06-04 2019-10-29 Entegris, Inc. Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility
US11978622B2 (en) * 2014-06-30 2024-05-07 Entegris, Inc. Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility
KR102247235B1 (en) 2015-01-26 2021-05-03 동우 화인켐 주식회사 Etching composition for a titanium layer
KR102327568B1 (en) * 2015-03-12 2021-11-17 리지필드 액퀴지션 Compositions and methods to promote charge complexed copper protection during polymer stripping with low pKa actuation
JP6808714B2 (en) * 2015-08-03 2021-01-06 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド Cleaning composition
US10319605B2 (en) * 2016-05-10 2019-06-11 Jsr Corporation Semiconductor treatment composition and treatment method
WO2018067763A1 (en) * 2016-10-06 2018-04-12 Fujifilm Electronic Materials U.S.A., Inc. Cleaning formulations for removing residues on semiconductor substrates
JP2020508369A (en) * 2017-02-10 2020-03-19 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド Formulation for cleaning
WO2018175222A1 (en) * 2017-03-24 2018-09-27 Fujifilm Electronic Materials U.S.A., Inc. Cleaning compositions for removing residues on semiconductor substrates
KR102448220B1 (en) 2018-01-25 2022-09-27 메르크 파텐트 게엠베하 Photoresist Remover Composition

Also Published As

Publication number Publication date
KR20200110429A (en) 2020-09-23
KR102448220B1 (en) 2022-09-27
CN111512239A (en) 2020-08-07
US20210115362A1 (en) 2021-04-22
JP7175316B2 (en) 2022-11-18
JP2022191267A (en) 2022-12-27
TW201934736A (en) 2019-09-01
WO2019145312A1 (en) 2019-08-01
US11365379B2 (en) 2022-06-21
JP2021511419A (en) 2021-05-06
EP3743773A1 (en) 2020-12-02
CN111512239B (en) 2024-05-03
EP3743773B1 (en) 2022-04-06

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