SG11202002003QA - Bonding device and bonding method - Google Patents
Bonding device and bonding methodInfo
- Publication number
- SG11202002003QA SG11202002003QA SG11202002003QA SG11202002003QA SG11202002003QA SG 11202002003Q A SG11202002003Q A SG 11202002003QA SG 11202002003Q A SG11202002003Q A SG 11202002003QA SG 11202002003Q A SG11202002003Q A SG 11202002003QA SG 11202002003Q A SG11202002003Q A SG 11202002003QA
- Authority
- SG
- Singapore
- Prior art keywords
- bonding
- bonding method
- bonding device
- Prior art date
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Classifications
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- H—ELECTRICITY
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
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- H01L2224/83104—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus by applying pressure, e.g. by injection
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/92—Specific sequence of method steps
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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JP2017136296 | 2017-07-12 | ||
PCT/JP2018/026389 WO2019013300A1 (en) | 2017-07-12 | 2018-07-12 | Bonding device and bonding method |
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JP (1) | JP6902292B2 (en) |
KR (1) | KR102398971B1 (en) |
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US11512411B2 (en) * | 2017-11-30 | 2022-11-29 | Shinkawa Ltd. | PTFE sheet and method for mounting die |
JP7287647B2 (en) * | 2019-03-05 | 2023-06-06 | 株式会社新川 | Welding condition evaluation device |
TWI743726B (en) * | 2019-04-15 | 2021-10-21 | 日商新川股份有限公司 | Package device |
JP2021145098A (en) * | 2020-03-13 | 2021-09-24 | キオクシア株式会社 | Semiconductor manufacturing device |
CN114787979A (en) * | 2020-08-05 | 2022-07-22 | 株式会社新川 | Packaging device and packaging method |
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JPH0691153B2 (en) * | 1987-11-28 | 1994-11-14 | 日東電工株式会社 | How to peel off the protective film |
JPH0661307A (en) * | 1992-08-07 | 1994-03-04 | Matsushita Electric Ind Co Ltd | Tab electronic part connecting device |
JP3123263B2 (en) * | 1992-11-17 | 2001-01-09 | 松下電器産業株式会社 | Method for judging pass / fail of adhesion state of conductive film |
US5437960A (en) * | 1993-08-10 | 1995-08-01 | Fuji Photo Film Co., Ltd. | Process for laminating photosensitive layer |
JPH0851294A (en) * | 1994-08-05 | 1996-02-20 | Asahi Koki Kk | Component supply device |
TW310481B (en) * | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
TW303344B (en) * | 1996-07-13 | 1997-04-21 | Somar Corp | The thin film sticking device |
JP2994356B1 (en) * | 1998-09-11 | 1999-12-27 | 山形日本電気株式会社 | Wafer surface protection tape peeling device |
JP2001348015A (en) * | 2000-06-05 | 2001-12-18 | Inax Corp | Method and apparatus for peeling heat transfer paper |
JP4502547B2 (en) * | 2000-08-07 | 2010-07-14 | 日東電工株式会社 | Method and apparatus for removing protective tape of semiconductor wafer |
JP2003007771A (en) * | 2001-06-19 | 2003-01-10 | Sony Corp | Mounting device |
JP4728534B2 (en) * | 2001-09-11 | 2011-07-20 | テイコクテーピングシステム株式会社 | Trimming method and trimming apparatus for silicon wafer protective film |
JP4480926B2 (en) * | 2001-09-11 | 2010-06-16 | テイコクテーピングシステム株式会社 | Method and apparatus for attaching protective film to silicon wafer |
JP4471563B2 (en) * | 2002-10-25 | 2010-06-02 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
JP4494753B2 (en) * | 2003-10-27 | 2010-06-30 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
JP4538242B2 (en) * | 2004-01-23 | 2010-09-08 | 株式会社東芝 | Peeling apparatus and peeling method |
WO2005106937A1 (en) * | 2004-04-28 | 2005-11-10 | Lintec Corporation | Sheet peeling apparatus and peeling method |
JP4326418B2 (en) * | 2004-07-16 | 2009-09-09 | 株式会社東京精密 | Film peeling method and film peeling apparatus |
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JP4841262B2 (en) * | 2006-02-13 | 2011-12-21 | 株式会社東京精密 | Wafer processing equipment |
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JP4964043B2 (en) * | 2007-07-04 | 2012-06-27 | パナソニック株式会社 | Bonding membrane application device |
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JP2009111253A (en) * | 2007-10-31 | 2009-05-21 | Shibaura Mechatronics Corp | Device and method for mounting electronic component |
JP2009253018A (en) * | 2008-04-07 | 2009-10-29 | Shinkawa Ltd | Bonding apparatus and bonding method |
KR101464488B1 (en) * | 2008-04-11 | 2014-11-24 | 린텍 가부시키가이샤 | Sheet-peeling apparatus and peeling method |
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JP2010192615A (en) * | 2009-02-17 | 2010-09-02 | Nec Saitama Ltd | Compression-bonding tool holding mechanism and compression-bonding device |
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JP5381821B2 (en) * | 2010-03-10 | 2014-01-08 | 三菱電機株式会社 | Protective tape peeling method and protective tape peeling apparatus |
JP5750632B2 (en) * | 2010-07-23 | 2015-07-22 | 株式会社タカトリ | Sheet sticking device to substrate |
JP5646899B2 (en) * | 2010-07-26 | 2014-12-24 | 新光電気工業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
JP5612963B2 (en) * | 2010-08-20 | 2014-10-22 | 新光電気工業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
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JP6151601B2 (en) | 2013-08-08 | 2017-06-21 | 東レエンジニアリング株式会社 | Mounting device |
US9676175B2 (en) * | 2014-06-20 | 2017-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus |
JP6815096B2 (en) * | 2015-05-27 | 2021-01-20 | 株式会社半導体エネルギー研究所 | Peeling device |
JP6673794B2 (en) * | 2015-11-12 | 2020-03-25 | 韓美半導体株式会社Hanmisemiconductor Co., Ltd. | Thermocompression bonding equipment |
KR101788021B1 (en) * | 2015-11-12 | 2017-10-23 | 한미반도체 주식회사 | Apparatus of Thermocompression Bonding |
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