SG11201903421VA - Semiconductor device inspection apparatus and semiconductor device inspection method - Google Patents

Semiconductor device inspection apparatus and semiconductor device inspection method

Info

Publication number
SG11201903421VA
SG11201903421VA SG11201903421VA SG11201903421VA SG11201903421VA SG 11201903421V A SG11201903421V A SG 11201903421VA SG 11201903421V A SG11201903421V A SG 11201903421VA SG 11201903421V A SG11201903421V A SG 11201903421VA SG 11201903421V A SG11201903421V A SG 11201903421VA
Authority
SG
Singapore
Prior art keywords
semiconductor device
device inspection
inspection apparatus
output
stimulation
Prior art date
Application number
SG11201903421VA
Inventor
Toru Matsumoto
Akira Shimase
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of SG11201903421VA publication Critical patent/SG11201903421VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/303—Contactless testing of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing

Abstract

A semiconductor device inspection apparatus is an apparatus for inspecting a semiconductor device which is an object to be inspected based on a result signal which is output in accordance with input of a test pattern signal to the semiconductor device, the apparatus including: an ultrasonic transducer, disposed to face the semiconductor device, which generates ultrasonic waves; a stage for moving a relative position of the semiconductor device and the ultrasonic transducer; a stimulation condition control unit for controlling a condition of stimulation by the 10 ultrasonic waves applied to the semiconductor device; and an analysis unit for generating a measurement image based on the result signal which is output from the semiconductor device. Figure 1 35
SG11201903421VA 2016-11-04 2017-09-20 Semiconductor device inspection apparatus and semiconductor device inspection method SG11201903421VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016216307A JP6927690B2 (en) 2016-11-04 2016-11-04 Semiconductor device inspection equipment and semiconductor device inspection method
PCT/JP2017/033944 WO2018083904A1 (en) 2016-11-04 2017-09-20 Semiconductor device inspection apparatus and semiconductor device inspection method

Publications (1)

Publication Number Publication Date
SG11201903421VA true SG11201903421VA (en) 2019-05-30

Family

ID=62076015

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903421VA SG11201903421VA (en) 2016-11-04 2017-09-20 Semiconductor device inspection apparatus and semiconductor device inspection method

Country Status (8)

Country Link
US (1) US10955458B2 (en)
JP (1) JP6927690B2 (en)
KR (1) KR102328606B1 (en)
CN (1) CN109891255B (en)
DE (1) DE112017005568T5 (en)
SG (1) SG11201903421VA (en)
TW (1) TWI746669B (en)
WO (1) WO2018083904A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6745196B2 (en) * 2016-11-04 2020-08-26 浜松ホトニクス株式会社 Ultrasonic inspection equipment
JP7276744B2 (en) * 2019-02-26 2023-05-18 国立大学法人豊橋技術科学大学 Ultrasonic inspection device and ultrasonic inspection method
TWI776502B (en) * 2021-05-11 2022-09-01 日商新川股份有限公司 Electronic circuit abnormality detection device
KR20230023957A (en) * 2021-08-11 2023-02-20 삼성전자주식회사 Apparatus and method for inspecting semiconductor

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JPH0763732A (en) * 1993-08-31 1995-03-10 Hitachi Constr Mach Co Ltd Method and device for ultrasonic inspection
JP2666772B2 (en) * 1995-05-26 1997-10-22 日本電気株式会社 Inspection method and apparatus for semiconductor integrated circuit wiring system using ultrasonic heating
JPH11304769A (en) * 1998-04-22 1999-11-05 Hitachi Constr Mach Co Ltd Ultrasonic inspection method
JP2008102071A (en) * 2006-10-20 2008-05-01 Matsushita Electric Ind Co Ltd Ultrasonic flaw detecting method and ultrasonic imaging device
US8098362B2 (en) * 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
CN102579082B (en) * 2007-06-04 2014-05-28 柯尼卡美能达株式会社 Ultrasonic diagnosis device and ultrasonic probe for use in ultrasonic diagnosis device
GB0813014D0 (en) * 2008-07-16 2008-08-20 Groveley Detection Ltd Detector and methods of detecting
JP4759597B2 (en) * 2008-07-28 2011-08-31 ルネサスエレクトロニクス株式会社 Failure analysis method and failure analysis apparatus for semiconductor integrated circuit
EP2182352A3 (en) * 2008-10-29 2011-08-03 Hitachi Ltd. Apparatus and method for ultrasonic testing
JP2011053126A (en) * 2009-09-03 2011-03-17 Disco Abrasive Syst Ltd Ultrasonic inspection method and ultrasonic inspection device
EP2428807A3 (en) 2010-09-08 2014-10-29 DCG Systems, Inc. Laser assisted fault localization using two-photon absorption
US9164066B1 (en) * 2012-06-19 2015-10-20 The Boeing Company Laser ultrasound array system
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TWI455223B (en) * 2011-09-22 2014-10-01 Orise Technology Co Ltd Apparatus and method for testing the embedded memory of display panel driving integrated circuit
JP5972581B2 (en) * 2012-01-23 2016-08-17 東芝メディカルシステムズ株式会社 Ultrasonic diagnostic equipment
JP5873773B2 (en) * 2012-07-19 2016-03-01 株式会社日立パワーソリューションズ Measurement frequency variable ultrasonic imaging system
JP2016057187A (en) * 2014-09-10 2016-04-21 株式会社東芝 Analyzer
JP5996687B2 (en) * 2015-02-10 2016-09-21 浜松ホトニクス株式会社 Inspection apparatus and inspection method
JP6380194B2 (en) * 2015-03-27 2018-08-29 コニカミノルタ株式会社 Ultrasonic signal processing apparatus and ultrasonic diagnostic apparatus

Also Published As

Publication number Publication date
DE112017005568T5 (en) 2019-08-29
KR20190079632A (en) 2019-07-05
WO2018083904A1 (en) 2018-05-11
TW201819937A (en) 2018-06-01
KR102328606B1 (en) 2021-11-19
US20190271734A1 (en) 2019-09-05
JP2018072292A (en) 2018-05-10
CN109891255A (en) 2019-06-14
US10955458B2 (en) 2021-03-23
JP6927690B2 (en) 2021-09-01
CN109891255B (en) 2022-09-20
TWI746669B (en) 2021-11-21

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