SG11201808637XA - Methods and apparatus for cleaning semiconductor wafers - Google Patents

Methods and apparatus for cleaning semiconductor wafers

Info

Publication number
SG11201808637XA
SG11201808637XA SG11201808637XA SG11201808637XA SG11201808637XA SG 11201808637X A SG11201808637X A SG 11201808637XA SG 11201808637X A SG11201808637X A SG 11201808637XA SG 11201808637X A SG11201808637X A SG 11201808637XA SG 11201808637X A SG11201808637X A SG 11201808637XA
Authority
SG
Singapore
Prior art keywords
methods
semiconductor wafers
cleaning semiconductor
cleaning
wafers
Prior art date
Application number
SG11201808637XA
Inventor
Jun Wang
Hui Wang
Fufa Chen
Fuping Chen
Jian Wang
Xi Wang
Xiaoyan Zhang
Yinuo Jin
Zhaowei Jia
Liangzhi Xie
Xuejun Li
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201808637XA publication Critical patent/SG11201808637XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18—Status alarms
    • G08B21/182—Level alarms, e.g. alarms responsive to variables exceeding a threshold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11201808637XA 2016-04-06 2016-04-06 Methods and apparatus for cleaning semiconductor wafers SG11201808637XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/078510 WO2017173588A1 (en) 2016-04-06 2016-04-06 Methods and apparatus for cleaning semiconductor wafers

Publications (1)

Publication Number Publication Date
SG11201808637XA true SG11201808637XA (en) 2018-10-30

Family

ID=60000853

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808637XA SG11201808637XA (en) 2016-04-06 2016-04-06 Methods and apparatus for cleaning semiconductor wafers

Country Status (6)

Country Link
US (2) US11257667B2 (en)
JP (1) JP6770757B2 (en)
KR (1) KR102548597B1 (en)
CN (1) CN109075103B (en)
SG (1) SG11201808637XA (en)
WO (1) WO2017173588A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11141762B2 (en) 2015-05-15 2021-10-12 Acm Research (Shanghai), Inc. System for cleaning semiconductor wafers
JP6770757B2 (en) 2016-04-06 2020-10-21 エーシーエム リサーチ （シャンハイ） インコーポレーテッド Cleaning method and cleaning equipment for semiconductor wafers
CN111386157B (en) * 2017-11-15 2022-12-27 盛美半导体设备(上海)股份有限公司 Method for cleaning semiconductor wafers
JP7293221B2 (en) * 2017-11-15 2023-06-19 エーシーエム リサーチ （シャンハイ） インコーポレーテッド Semiconductor wafer cleaning system
JP7230037B2 (en) * 2018-01-23 2023-02-28 エーシーエム リサーチ （シャンハイ） インコーポレーテッド SUBSTRATE CLEANING METHOD AND CLEANING APPARATUS
CN113118100B (en) * 2019-12-31 2022-09-06 清华大学 Wafer cleaning device and cleaning method
CN111842380B (en) * 2020-06-22 2021-07-30 徐州鑫晶半导体科技有限公司 Wafer cassette cleaning apparatus and control method of wafer cassette cleaning apparatus

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Also Published As

Publication number Publication date
JP6770757B2 (en) 2020-10-21
US11967497B2 (en) 2024-04-23
US20200335325A1 (en) 2020-10-22
US20220139697A1 (en) 2022-05-05
JP2019514210A (en) 2019-05-30
US11257667B2 (en) 2022-02-22
CN109075103B (en) 2022-06-10
WO2017173588A1 (en) 2017-10-12
CN109075103A (en) 2018-12-21
KR102548597B1 (en) 2023-06-28
KR20180132725A (en) 2018-12-12

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