SG11201802854PA - Device arrangement - Google Patents

Device arrangement

Info

Publication number
SG11201802854PA
SG11201802854PA SG11201802854PA SG11201802854PA SG11201802854PA SG 11201802854P A SG11201802854P A SG 11201802854PA SG 11201802854P A SG11201802854P A SG 11201802854PA SG 11201802854P A SG11201802854P A SG 11201802854PA SG 11201802854P A SG11201802854P A SG 11201802854PA
Authority
SG
Singapore
Prior art keywords
device arrangement
arrangement
Prior art date
Application number
SG11201802854PA
Inventor
Navab Singh
Jae Wung Lee
Srinivas Merugu
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Publication of SG11201802854PA publication Critical patent/SG11201802854PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0666—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface used as a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/008—MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00039—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0735—Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Micromachines (AREA)
SG11201802854PA 2015-10-14 2016-10-06 Device arrangement SG11201802854PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG10201508506U 2015-10-14
PCT/SG2016/050492 WO2017065691A1 (en) 2015-10-14 2016-10-06 Device arrangement

Publications (1)

Publication Number Publication Date
SG11201802854PA true SG11201802854PA (en) 2018-05-30

Family

ID=58517589

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201802854PA SG11201802854PA (en) 2015-10-14 2016-10-06 Device arrangement

Country Status (3)

Country Link
US (1) US10669152B2 (en)
SG (1) SG11201802854PA (en)
WO (1) WO2017065691A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018152265A1 (en) * 2017-02-14 2018-08-23 Sitime Corporation Mems cavity with non-contaminating seal
US10923525B2 (en) * 2017-07-12 2021-02-16 Meridian Innovation Pte Ltd CMOS cap for MEMS devices
US10199424B1 (en) * 2017-07-19 2019-02-05 Meridian Innovation Pte Ltd Thermoelectric-based infrared detector having a cavity and a MEMS structure defined by BEOL metals lines
US10214415B1 (en) * 2018-03-02 2019-02-26 National Technology & Engineering Solutions Of Sandia, Llc Hybrid CMOS-MEMS devices adapted for high-temperature operation and method for their manufacture
DE102018203812A1 (en) 2018-03-13 2019-09-19 Christian-Albrechts-Universität Zu Kiel FERROELECTRIC MATERIAL, MEMS COMPONENT WITH A FERROELECTRIC MATERIAL, MEMS DEVICE WITH A FIRST MEMS COMPONENT, METHOD FOR PRODUCING A MEMS COMPONENT, AND METHOD FOR PRODUCING A CMOS COMPATIBLE MEMS COMPONENT
US10966683B2 (en) 2018-03-22 2021-04-06 Exo Imaging Inc. Integrated ultrasonic transducers
KR20230116960A (en) 2019-03-25 2023-08-04 엑소 이미징, 인크. Handheld ultrasound imager
CN113666327B (en) * 2021-08-27 2022-04-19 南京声息芯影科技有限公司 SOC (system on chip) PMUT (passive optical network) suitable for high-density system integration, array chip and manufacturing method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057477B2 (en) 2003-12-24 2006-06-06 Intel Corporation Integration of FBAR filter(s) and on-chip inductors
US7248131B2 (en) 2005-03-14 2007-07-24 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Monolithic vertical integration of an acoustic resonator and electronic circuitry
DE102006003718B4 (en) * 2006-01-26 2008-07-17 Atmel Germany Gmbh Micro-electro-mechanical device and manufacturing process for integrated micro-electro-mechanical devices
US8372680B2 (en) * 2006-03-10 2013-02-12 Stc.Unm Three-dimensional, ultrasonic transducer arrays, methods of making ultrasonic transducer arrays, and devices including ultrasonic transducer arrays
WO2007117198A1 (en) 2006-04-07 2007-10-18 Niklaus Consulting Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such
US7580774B2 (en) 2006-05-10 2009-08-25 Honda Motor Co., Ltd. Characterization and classification of pose in low dimension
US8658452B2 (en) * 2008-07-09 2014-02-25 The Royal Institution For The Advancement Of Learning / Mcgill University Low temperature ceramic microelectromechanical structures
US8541850B2 (en) 2008-12-12 2013-09-24 Texas Instruments Incorporated Method and system for forming resonators over CMOS
US9340414B2 (en) 2009-07-07 2016-05-17 MCube Inc. Method and structure of monolithically integrated absolute pressure sensor
US8754529B2 (en) * 2011-03-28 2014-06-17 Miradia, Inc. MEMS device with simplified electrical conducting paths
US8368152B2 (en) 2011-04-18 2013-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS device etch stop
WO2013090980A1 (en) 2011-12-20 2013-06-27 The Silanna Group Pty Ltd Monolithically integrated cmos and acoustic wave device
US9096422B2 (en) 2013-02-15 2015-08-04 Fujifilm Dimatix, Inc. Piezoelectric array employing integrated MEMS switches

Also Published As

Publication number Publication date
US20180312399A1 (en) 2018-11-01
US10669152B2 (en) 2020-06-02
WO2017065691A1 (en) 2017-04-20

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