SG11201704196YA - Monitoring system for deposition and method of operation thereof - Google Patents
Monitoring system for deposition and method of operation thereofInfo
- Publication number
- SG11201704196YA SG11201704196YA SG11201704196YA SG11201704196YA SG11201704196YA SG 11201704196Y A SG11201704196Y A SG 11201704196YA SG 11201704196Y A SG11201704196Y A SG 11201704196YA SG 11201704196Y A SG11201704196Y A SG 11201704196YA SG 11201704196Y A SG11201704196Y A SG 11201704196YA
- Authority
- SG
- Singapore
- Prior art keywords
- deposition
- monitoring system
- monitoring
- Prior art date
Links
- 230000008021 deposition Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000012544 monitoring process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/2855—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by physical means, e.g. sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462094270P | 2014-12-19 | 2014-12-19 | |
US14/839,656 US9870935B2 (en) | 2014-12-19 | 2015-08-28 | Monitoring system for deposition and method of operation thereof |
PCT/US2015/065897 WO2016100394A1 (en) | 2014-12-19 | 2015-12-15 | Monitoring system for deposition and method of operation thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201704196YA true SG11201704196YA (en) | 2017-07-28 |
Family
ID=56127487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201704196YA SG11201704196YA (en) | 2014-12-19 | 2015-12-15 | Monitoring system for deposition and method of operation thereof |
Country Status (8)
Country | Link |
---|---|
US (2) | US9870935B2 (en) |
EP (1) | EP3234983A4 (en) |
JP (1) | JP6793647B2 (en) |
KR (1) | KR102513441B1 (en) |
CN (1) | CN107210188B (en) |
SG (1) | SG11201704196YA (en) |
TW (1) | TWI686845B (en) |
WO (1) | WO2016100394A1 (en) |
Families Citing this family (15)
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JP6597523B2 (en) * | 2016-08-29 | 2019-10-30 | Agc株式会社 | Multilayer substrate and method for manufacturing the same |
US10468149B2 (en) * | 2017-02-03 | 2019-11-05 | Globalfoundries Inc. | Extreme ultraviolet mirrors and masks with improved reflectivity |
US20180286643A1 (en) * | 2017-03-29 | 2018-10-04 | Tokyo Electron Limited | Advanced optical sensor, system, and methodologies for etch processing monitoring |
KR102374206B1 (en) | 2017-12-05 | 2022-03-14 | 삼성전자주식회사 | Method of fabricating semiconductor device |
US10815561B2 (en) * | 2018-03-10 | 2020-10-27 | Applied Materials, Inc. | Method and apparatus for asymmetric selective physical vapor deposition |
US10138539B1 (en) * | 2018-04-03 | 2018-11-27 | Shiping Cheng | Method of managing coating uniformity with an optical thickness monitoring system |
US10950448B2 (en) * | 2018-04-06 | 2021-03-16 | Applied Materials, Inc. | Film quality control in a linear scan physical vapor deposition process |
CN108425105A (en) * | 2018-05-24 | 2018-08-21 | 江苏微导纳米装备科技有限公司 | A kind of atomic layer deposition online monitoring system |
US20200033723A1 (en) * | 2018-07-30 | 2020-01-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor Manufacturing Apparatus and Method Thereof |
US10978278B2 (en) | 2018-07-31 | 2021-04-13 | Tokyo Electron Limited | Normal-incident in-situ process monitor sensor |
US10886155B2 (en) | 2019-01-16 | 2021-01-05 | Applied Materials, Inc. | Optical stack deposition and on-board metrology |
TWI772697B (en) * | 2019-10-23 | 2022-08-01 | 華邦電子股份有限公司 | Method of monitoring semiconductor process |
US11939665B2 (en) * | 2020-03-10 | 2024-03-26 | Tokyo Electron Limted | Film thickness measuring apparatus and film thickness measuring method, and film forming system and film forming method |
US20220165593A1 (en) * | 2020-11-24 | 2022-05-26 | Applied Materials, Inc. | Feedforward control of multi-layer stacks during device fabrication |
CN113862641B (en) * | 2021-08-16 | 2023-09-12 | 江汉大学 | Monitoring system for atomic layer deposition precursor dosage, method and application thereof |
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-
2015
- 2015-08-28 US US14/839,656 patent/US9870935B2/en active Active
- 2015-12-15 CN CN201580068260.5A patent/CN107210188B/en active Active
- 2015-12-15 WO PCT/US2015/065897 patent/WO2016100394A1/en active Application Filing
- 2015-12-15 JP JP2017532791A patent/JP6793647B2/en active Active
- 2015-12-15 KR KR1020177020254A patent/KR102513441B1/en active IP Right Grant
- 2015-12-15 SG SG11201704196YA patent/SG11201704196YA/en unknown
- 2015-12-15 EP EP15870910.5A patent/EP3234983A4/en active Pending
- 2015-12-18 TW TW104142755A patent/TWI686845B/en active
-
2017
- 2017-12-13 US US15/840,215 patent/US10522375B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018503119A (en) | 2018-02-01 |
TW201633374A (en) | 2016-09-16 |
US20180114711A1 (en) | 2018-04-26 |
CN107210188A (en) | 2017-09-26 |
JP6793647B2 (en) | 2020-12-02 |
US9870935B2 (en) | 2018-01-16 |
US20160181134A1 (en) | 2016-06-23 |
TWI686845B (en) | 2020-03-01 |
WO2016100394A1 (en) | 2016-06-23 |
CN107210188B (en) | 2021-04-09 |
EP3234983A4 (en) | 2018-11-14 |
EP3234983A1 (en) | 2017-10-25 |
KR20170097174A (en) | 2017-08-25 |
US10522375B2 (en) | 2019-12-31 |
KR102513441B1 (en) | 2023-03-22 |
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