SG11201608844RA - Systems and methods for carrying singulated device packages - Google Patents

Systems and methods for carrying singulated device packages

Info

Publication number
SG11201608844RA
SG11201608844RA SG11201608844RA SG11201608844RA SG11201608844RA SG 11201608844R A SG11201608844R A SG 11201608844RA SG 11201608844R A SG11201608844R A SG 11201608844RA SG 11201608844R A SG11201608844R A SG 11201608844RA SG 11201608844R A SG11201608844R A SG 11201608844RA
Authority
SG
Singapore
Prior art keywords
systems
carrying
methods
device packages
singulated device
Prior art date
Application number
SG11201608844RA
Inventor
Iii Martin Joseph Gabriel
Jason Hwang
David T Patten
Original Assignee
Cirrus Logic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cirrus Logic Inc filed Critical Cirrus Logic Inc
Publication of SG11201608844RA publication Critical patent/SG11201608844RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/83005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201608844RA 2014-04-22 2015-04-20 Systems and methods for carrying singulated device packages SG11201608844RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461982744P 2014-04-22 2014-04-22
PCT/US2015/026636 WO2015164245A1 (en) 2014-04-22 2015-04-20 Systems and methods for carrying singulated device packages
US14/690,763 US20150303171A1 (en) 2014-04-22 2015-04-20 Systems and methods for carrying singulated device packages

Publications (1)

Publication Number Publication Date
SG11201608844RA true SG11201608844RA (en) 2016-11-29

Family

ID=54322650

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608844RA SG11201608844RA (en) 2014-04-22 2015-04-20 Systems and methods for carrying singulated device packages

Country Status (8)

Country Link
US (1) US20150303171A1 (en)
KR (1) KR20160145604A (en)
CN (1) CN107078087A (en)
IL (1) IL248341A0 (en)
PH (1) PH12016502104A1 (en)
SG (1) SG11201608844RA (en)
TW (1) TW201541534A (en)
WO (1) WO2015164245A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9885748B2 (en) * 2015-06-09 2018-02-06 International Business Machines Corporation Module testing utilizing wafer probe test equipment
US10177021B2 (en) 2016-01-13 2019-01-08 Nxp B.V. Integrated circuits and methods therefor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7179346B2 (en) * 2003-06-03 2007-02-20 Asm Assembly Automation Ltd. Semiconductor apparatus with multiple delivery devices for components
US20040256719A1 (en) * 2003-06-18 2004-12-23 Aptos Corporation MEMS micro-cap wafer level chip scale package
DE10334576B4 (en) * 2003-07-28 2007-04-05 Infineon Technologies Ag Method for producing a semiconductor component with a plastic housing
US7326592B2 (en) * 2005-04-04 2008-02-05 Infineon Technologies Ag Stacked die package
CN101501510A (en) * 2005-09-19 2009-08-05 佛姆法克特股份有限公司 Apparatus and method of testing singulated dies
US7733106B2 (en) * 2005-09-19 2010-06-08 Formfactor, Inc. Apparatus and method of testing singulated dies
US7216062B1 (en) * 2006-06-13 2007-05-08 Sun Microsystem, Inc. Characterizing degradation of components during reliability-evaluation studies
SG147330A1 (en) * 2007-04-19 2008-11-28 Micron Technology Inc Semiconductor workpiece carriers and methods for processing semiconductor workpieces
FR2934082B1 (en) * 2008-07-21 2011-05-27 Commissariat Energie Atomique MULTI-COMPONENT DEVICE INTEGRATED IN A MATRIX
US20110198762A1 (en) * 2010-02-16 2011-08-18 Deca Technologies Inc. Panelized packaging with transferred dielectric
US8711646B2 (en) * 2012-05-08 2014-04-29 Samsung Electronics Co., Ltd. Architecture, system and method for testing resistive type memory
US8890319B2 (en) * 2012-09-12 2014-11-18 Infineon Technologies Ag Chip to package interface

Also Published As

Publication number Publication date
TW201541534A (en) 2015-11-01
CN107078087A (en) 2017-08-18
US20150303171A1 (en) 2015-10-22
IL248341A0 (en) 2016-11-30
PH12016502104A1 (en) 2017-01-16
KR20160145604A (en) 2016-12-20
WO2015164245A1 (en) 2015-10-29

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